Backlight module and preparation method thereof
By designing a staggered splicing and double bonding structure for the lamp board and diffuser plate in the backlight module, the optical interference problem in the splicing seam area of the display screen is solved, achieving more uniform display and higher luminous efficiency.
Patent Information
- Application Number
- CN202511249029.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2025-11-18
AI Technical Summary
In large-size ultra-thin displays, the splicing seam area of the glass diffuser plate of the backlight module forms obvious bright lines or dark bands due to optical interference and abrupt changes in refractive index, affecting the uniformity of the display.
The design employs a staggered joint design between the lamp plate structure and the diffuser plate structure, and uses an adhesive structure to bond the diffuser plate to the reflective layer and adjacent diffuser plate units. This includes a first adhesive part and a second adhesive part, which are respectively set between the diffuser plate and the reflective layer and between adjacent diffuser plate units. By utilizing the complementary properties of different adhesive materials, the isolation of the optical interference area and the seamless transmission of light are achieved.
It improves the display uniformity and luminous efficiency of the screen, reduces light leakage and brightness loss, and enhances the overall brightness and stability of the backlight module.
Smart Images
Figure CN120977206A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of display screen splicing, in particular to a backlight module and a preparation method thereof. BACKGROUND
[0002] In order to achieve thinning of the backlight module, a glass diffusion plate can be used to replace the traditional plastic diffusion plate in the current large-size ultra-thin display screen. However, due to the processing size of the glass substrate, a large-size screen needs to be spliced by multiple pieces.
[0003] In the conventional technology, the backlight lamp plate and the glass diffusion plate are often spliced in the same seam alignment mode, which causes obvious bright lines or dark bands in the splicing seam area due to optical interference and refractive index mutation, seriously affecting the display uniformity. SUMMARY
[0004] Therefore, it is necessary to provide a backlight module and a preparation method thereof capable of improving display uniformity in view of the above technical problems.
[0005] In a first aspect, the present application provides a backlight module, comprising:
[0006] a lamp plate structure comprising a plurality of lamp plate units arranged along a first direction;
[0007] a reflection layer arranged on one side surface of the lamp plate structure along a second direction; the first direction intersects the second direction; and the reflection layer is provided with an opening at a predetermined position on the surface thereof;
[0008] a diffusion plate structure comprising a plurality of diffusion plate units arranged along the first direction; the diffusion plate structure is located on a side of the reflection layer away from the lamp plate structure; and the splicing seam between two adjacent lamp plate units is located opposite to the splicing seam between two adjacent diffusion plate units.
[0009] a bonding structure comprising a first bonding part and a second bonding part; the first bonding part is arranged between the diffusion plate structure and the reflection layer and located at the opening on the surface of the reflection layer; and the second bonding part is arranged between two adjacent diffusion plate units and located on a side of the first bonding part away from the reflection layer.
[0010] In one of the embodiments, the length of the first bonding part along the first direction exceeds the length of the second bonding part along the first direction.
[0011] In one of the embodiments, the first bonding part comprises a first sub-component and second sub-components located on both sides of the first sub-component; the first sub-component is located between the second bonding part and the reflection layer, and the length of the first sub-component along the first direction exceeds the length of the second bonding part along the first direction.
[0012] In one of the embodiments, the reflecting layer comprises a plurality of reflecting components arranged along a first direction, and the number of the reflecting components is the same as the number of the light plate units; one end of the reflecting component is provided with an extension component; the extension component is overlapped on one side surface of the corresponding light plate unit, and when the light plate unit is spliced with the adjacent light plate unit, the extension component covers the splicing joint between the corresponding two light plate units.
[0013] In one of the embodiments, the first bonding part is used for bonding the diffusion plate structure and the reflecting layer; the second bonding part is used for bonding the adjacent two diffusion plate units; the material of the first bonding part is different from the material of the second bonding part.
[0014] In one of the embodiments, the second sub-component is used for bonding the diffusion plate structure and the reflecting layer; the first sub-component is used for filling the gap between the two second sub-components; the second bonding part is used for bonding the adjacent two diffusion plate units; the material of the first sub-component is the same as the material of the second bonding part, and the material of the first sub-component is different from the material of the second sub-component.
[0015] In a second aspect, the application further provides a preparation method of the backlight module, comprising:
[0016] Splicing a plurality of light plate units along a first direction to form a light plate structure;
[0017] Splicing a plurality of diffusion plate units along a first direction to form a diffusion plate structure;
[0018] Forming a reflecting layer on the surface hole of the light plate structure;
[0019] Forming a first bonding part on the surface of the reflecting layer;
[0020] Assembling the diffusion plate structure and the light plate structure in position, so that the splicing joint between the adjacent two diffusion plate units is opposite to the first bonding part; the diffusion plate structure is located on the side of the reflecting layer away from the light plate structure, and the splicing joint between the adjacent two diffusion plate units is opposite to the splicing joint between the adjacent two light plate units in dislocation;
[0021] Forming a second bonding part between the adjacent two diffusion plate units.
[0022] In one of the embodiments, forming the first bonding part on the surface hole of the reflecting layer comprises:
[0023] Forming the first bonding part on the surface hole of the reflecting layer by the first adhesive.
[0024] In one of the embodiments, forming the second bonding part between the adjacent two diffusion plate units comprises:
[0025] Forming the second bonding part between the adjacent two diffusion plate units by the second adhesive.
[0026] In one of the embodiments, the first bonding part comprises a first sub-part and second sub-parts located on both sides of the first sub-part; the method further comprises:
[0027] The second sub-parts are formed by the first adhesive at both ends of the opening on the surface of the reflective layer, and the first sub-part is formed by the second adhesive between the two second sub-parts.
[0028] In the backlight module and the preparation method thereof, the backlight module comprises a lamp plate structure, a reflective layer, a diffusion plate structure, and a bonding structure. The diffusion plate structure is located on the side of the reflective layer away from the lamp plate structure, and the splicing seam between adjacent two lamp plate units is opposite to the splicing seam between adjacent two diffusion plate units. The bonding structure comprises a first bonding part and a second bonding part. The first bonding part is arranged between the diffusion plate structure and the reflective layer, and the second bonding part is arranged between adjacent two diffusion plate units and located on the side of the first bonding part away from the reflective layer. Compared with the related art which splices the lamp plate structure and the diffusion plate structure in the same seam, the technical solution of the present application can physically isolate the lamp plate seam and the diffusion plate seam, disperse the optical interference area, improve the display uniformity, and thus improve the light emitting efficiency of the backlight module. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0030] Figure 1 A side structure schematic diagram of the backlight module provided in an embodiment;
[0031] Figure 2 A top structure schematic diagram of the lamp plate structure provided in an embodiment;
[0032] Figure 3 A top structure schematic diagram of the diffusion plate structure provided in an embodiment;
[0033] Figure 4 A side structure schematic diagram of the backlight module provided in another embodiment;
[0034] Figure 5 A flowchart of the preparation method of the light emitting structure provided in an embodiment.
[0035] Explanation of reference signs:
[0036] OX - first direction, OY - second direction, 100 - lamp plate structure, 110 - lamp plate unit, 200 - reflecting layer, 210 - reflecting part, 220 - extending part, 300 - diffusion plate structure, 310 - diffusion plate unit, 400 - bonding structure, 410 - first bonding part, 411 - first sub part, 412 - second sub part, 420 - second bonding part. DETAILED DESCRIPTION
[0037] For the purposes of this application, reference will be made to the accompanying drawings in which embodiments of the application are illustrated. The application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0039] It should be understood that when an element or layer is referred to as being "on" or "adjacent" or "connected" or "coupled" to another element or layer, it can be directly on or adjacent to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly adjacent" or "directly connected" or "directly coupled" to another element or layer, there are no intervening elements or layers present. It will be appreciated that, although terms such as first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section; for example, a first dopant type could be termed a second dopant type, and similarly, a second dopant type could be termed a first dopant type; a first dopant type and a second dopant type are different dopant types, for example, a first dopant type could be P-type and a second dopant type could be N-type, or a first dopant type could be N-type and a second dopant type could be P-type.
[0040] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is inverted, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The devices can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0041] As used herein, the singular form "a", "an" and "the" include plural references unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and / or "comprising", or "includes" and / or "including" when used herein, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
[0042] Embodiments of the application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the application. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments of the application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.
[0043] It should be noted that the first direction mentioned in the embodiments of the present application can be a vertical direction, and the second direction can be a horizontal direction; or the first direction can be a horizontal direction, and the second direction can be a vertical direction. For the convenience of description of the backlight module provided in the present application, in the embodiments of the present application, the OX direction in the formula (1) is taken as the first direction, and the OY direction in the formula (1) is taken as the second direction. Figure 1 Figure 1
[0044] In one embodiment, as shown in the formula (2), the present application provides a backlight module, comprising: a lamp plate structure 100, a reflection layer 200, a diffusion plate structure 300 and a bonding structure 400. Figure 1
[0045] The top view structure of the lamp plate structure 100 is as shown in the formula (3). Figure 2 As shown. Among them, the lamp plate structure 100 includes a plurality of lamp plate units 110 arranged along the first direction OX. The light source such as LED is usually integrated on the lamp plate unit 110, which is the light source of the backlight module. A plurality of lamp plate units 110 are spliced to adapt to different display requirements.
[0046] The reflection layer 200 is arranged on one side surface of the lamp plate structure 100 along the second direction OY, and the surface of the reflection layer 200 is provided with an opening at a predetermined position. The reflection layer 200 is arranged on one side surface of the lamp plate structure 100, that is, the light emitting side surface of the lamp plate. After the lamp plate emits light, the light first contacts the reflection layer. The reflection layer 200 extends along the second direction OY, and the first direction OX intersects the second direction OY. That is, the reflection layer 200 can cover the entire surface of the lamp plate structure 100, which is used to reflect the light emitted by the lamp plate. The light that may otherwise leak to the side or back of the lamp plate is reflected back to the light emitting direction (towards the diffusion plate), reducing light loss and improving overall brightness.
[0047] The top view structure of the diffusion plate structure is as shown. Figure 3 Among them, the diffusion plate structure 300 includes a plurality of diffusion plate units 310 arranged along the first direction OX. Among them, the diffusion plate structure 300 is located on the side away from the lamp plate structure 100 of the reflection layer 200, and the splicing seams between adjacent two lamp plate units 110 and the splicing seams between adjacent two diffusion plate units 310 are offset opposite to each other. The diffusion plate structure 300 is composed of a plurality of diffusion plate units 310 arranged along the first direction OX, which is consistent with the arrangement direction of the lamp plate structure 100, so as to facilitate the cooperation of the light source distribution of the lamp plate.
[0048] The splicing seams of the adjacent two lamp plate units 110 and the splicing seams of the adjacent two diffusion plate units 310 are offset opposite to each other (that is, not coincident). Because there may be uneven light distribution at the splicing seam (for example, the light source density is low at the splicing seam of the lamp plate unit, and the light transmittance may be different at the splicing seam of the diffusion plate unit), if the splicing seams of the two are aligned, it will cause the light at this position to be darker or appear obvious dark lines. By offsetting opposite to each other, the splicing seam of the lamp plate is covered by the body of the diffusion plate unit, and the splicing seam of the diffusion plate is covered by the body of the lamp plate unit, which mutually blocks the gap defects, avoids the light output to appear uneven light and dark, and ensures the uniformity of the backlight.
[0049] The bonding structure 400 comprises a first bonding part 410 and a second bonding part 420. The first bonding part 410 is arranged between the diffusion plate structure 300 and the reflective layer 200 and located at the opening on the surface of the reflective layer 200. The second bonding part 420 is arranged between two adjacent diffusion plate units 310 and located on the side of the first bonding part 410 away from the reflective layer 200. The first bonding part 410 is located between the diffusion plate structure 300 and the reflective layer 200, penetrates the opening on the surface of the reflective layer 200 and contacts the lamp plate structure 100, so as to bond the diffusion plate structure 300 on the lamp plate structure 100 and fix the relative position of the two, avoiding light leakage or position deviation due to loosening. The second bonding part 420 is located between two adjacent diffusion plate units 310 and on the side of the first bonding part 410 away from the reflective layer 200, that is, at the splicing joint of the diffusion plate unit 310 and on the upper surface of the diffusion plate structure 300, closer to the light exit side than the first bonding part. The second bonding part 420 bonds the adjacent diffusion plate units 310, strengthens the stability of the splicing joint, seals the splicing joint and further prevents light from leaking out of the gap of the diffusion plate, thereby ensuring the uniformity of light exit.
[0050] In the embodiment of the present application, compared with the traditional method of splicing the lamp plate structure and the diffusion plate structure, the diffusion plate structure 300 is located on the side of the reflective layer 200 away from the lamp plate structure 100, and the splicing joints between two adjacent lamp plate units 110 and the splicing joints between two adjacent diffusion plate units 310 are opposite to each other, so that the lamp plate splicing joint and the diffusion plate splicing joint can be physically isolated, the optical interference area can be dispersed, the display uniformity can be improved, and the luminous efficiency of the backlight module can be improved. In addition, the bonding structure 400 comprises the first bonding part 410 and the second bonding part 420. The first bonding part 410 is arranged between the diffusion plate structure 300 and the reflective layer 200, and the second bonding part 420 is arranged between two adjacent diffusion plate units 310 and located on the side of the first bonding part 410 away from the reflective layer 200. The complementary characteristics of the double bonding parts realize function coordination, further reduce light leakage and brightness loss, and improve the luminous efficiency of the backlight module.
[0051] In one embodiment, please refer to Figure 1 The length of the first bonding part 410 along the first direction OX exceeds the length of the second bonding part 420 along the first direction OX.
[0052] The first bonding part 410 is located between the diffusion plate structure 300 and the reflective layer 200, bonds and fixes the diffusion plate structure 300 and the reflective layer 200, and then indirectly fixes the lamp plate structure 100, and needs to cover a sufficient range to ensure the flatness and stability of the diffusion plate as a whole.
[0053] The second bonding part 420 is only located at the joint between two adjacent diffusion plate units 310, and is on the side of the first bonding part 410 away from the reflective layer 200. The second bonding part 420 functions to seal the joint of the diffusion plate units and to strengthen the structural connection at the joint, which is equivalent to local joint bonding. The second bonding part 420 needs to be accurately matched with the joint position to avoid excessive coverage affecting the light conduction.
[0054] In the embodiment, the first bonding part 410 has a wider coverage range than the second bonding part 420 in the joint direction along the first direction OX of the diffusion plate units 310. The first bonding part 410 can form a wide bonding surface between the diffusion plate structure 300 and the reflective layer 200, ensuring that there is no gap between the diffusion plate structure 300 and the reflective layer 200, thereby ensuring the high efficiency of the reflective layer 200 in reflecting light.
[0055] In one embodiment, as shown in FIG. 4, the first bonding part 410 includes a first sub-component 411 and a second sub-component 412 located on both sides of the first sub-component 411. Figure 4 The first sub-component 411 is located between the second bonding part 420 and the reflective layer 200, and the length of the first sub-component 411 along the first direction OX is longer than the length of the second bonding part 420 along the first direction OX.
[0056] In this embodiment, the first bonding part 410 is divided into the first sub-component 411 and the second sub-component 412. The first sub-component 411 is located in the middle region of the entire first bonding part 410 and is between the second bonding part 420 and the reflective layer 200. The length of the first sub-component 411 along the first direction OX is longer than the length of the second bonding part 420 along the first direction OX. The second sub-component 412 is located on both sides of the first sub-component 411 and, together with the first sub-component, forms the complete first bonding part 410, covering the area between the diffusion plate structure 300 and the reflective layer 200.
[0057] In this embodiment, the first sub-component 411 is located directly below the second bonding part 420 and has a length that is longer than the second bonding part 420. Since the joint of the diffusion plate unit 310 is a structural weak point and an optically sensitive area, the first sub-component 411 forms a wide support band under the joint by having a longer length, thereby strengthening the bonding strength between the diffusion plate joint and the reflective layer and preventing the joint from being raised due to uneven stress. At the same time, the first sub-component 411 is located close to the reflective layer, which can help to block light from leaking out of the gap under the joint.
[0058] In the embodiment, by dividing the first bonding part 410 into the first sub-component 411 and the second sub-component 412, the second sub-component 412 can form a rigid leak-proof barrier under the joint of the diffusion plate unit 310, and the first sub-component 411 can fill the gap between the second sub-component 412, thereby further ensuring that the reflective layer 200 and the diffusion plate structure 300 are tightly bonded and preventing light leakage.
[0059] In one embodiment, please continue to refer toFigure 1 The reflection layer 200 comprises a plurality of reflection components 210 arranged along the first direction OX, and the number of the reflection components 210 is the same as the number of the lamp plate units 110; one end of the reflection component 210 is provided with an extension component 220; the extension component 220 is overlapped on one side surface of the corresponding lamp plate unit 110, and when the lamp plate unit 110 is spliced with the adjacent lamp plate unit 110, the extension component 220 covers the splicing seam between the two lamp plate units 110.
[0060] The reflection layer 200 is composed of a plurality of reflection components 210 arranged along the first direction OX, and the number of the reflection components 210 is exactly the same as the number of the lamp plate units 110, which ensures that each lamp plate unit 110 is covered by the corresponding reflection component 210 from above, and the basic reflection function is matched. One end of each reflection component 210 is provided with an extension component 220, which extends outward from the edge of the reflection component 210 and is overlapped on one side surface of the corresponding lamp plate unit 110, that is, it is in contact with the surface of the lamp plate unit 110 and covers part of the area. When two adjacent lamp plate units 110 are spliced, the extension component 220 of the reflection component 210 covers the splicing seam between the two lamp plate units 110, reduces light loss, and further improves light utilization.
[0061] In one embodiment, please continue to refer to Figure 1 The first bonding part 410 is used for bonding the diffusion plate structure 300 and the reflection layer 200; the second bonding part 420 is used for bonding two adjacent diffusion plate units 310; the material of the first bonding part 410 is different from the material of the second bonding part 420.
[0062] The first bonding part 410 is located between the diffusion plate structure 300 and the reflection layer 200, and is used for integrally bonding and fixing the two. Generally, high thixotropic barrier glue is used. This glue is paste-like (high thixotropy) at room temperature, and its shape is stable and not easy to flow. After dispensing, it can quickly form a glue layer with a certain thickness and strength. The first bonding part 410 needs to tightly bond the large-area diffusion plate structure 300 and the reflection layer 200, and needs to prevent the glue of the second bonding part 420 from penetrating in the direction of the lamp plate. The high thixotropy makes the shape stable after dispensing, and can form a continuous isolation layer, which not only ensures the firm bonding of the diffusion plate structure 300 and the reflection layer 200, but also blocks the downward leakage of the optical glue, realizing the dual functions of fixing and blocking.
[0063] The second bonding part 420 is only used at the joint of the two adjacent diffusion plate units 310 to fill the gap and bond the units, and generally uses self-leveling optical glue which has low viscosity and good flowability, can automatically fill the fine gap under the action of capillary effect and gravity, and has excellent optical performance. The gap at the joint of the diffusion plate is generally less than 0.3 mm, and it is required to ensure that the light has no obvious loss when crossing the joint. The low viscosity of the self-leveling optical glue can completely fill the fine gap, and the refractive index close to that of glass ensures that the light does not be obviously refracted or reflected when passing through the joint, realizes seamless conduction, and avoids dark lines or light spots at the joint.
[0064] In one embodiment, please refer to Figure 4 , the second sub-component is used to bond the diffusion plate structure and the reflective layer; the first sub-component is used to fill the gap between the two second sub-components; the second bonding part is used to bond the two adjacent diffusion plate units; the material of the first sub-component is the same as that of the second bonding part, and the material of the first sub-component is different from that of the second sub-component.
[0065] The second sub-component 412 is located on both sides of the first bonding part 410 and directly bears the bonding and fixing function of the diffusion plate structure 300 and the reflective layer 200, and uses high thixotropic barrier glue.
[0066] The first sub-component 411 is located at the gap between the two second sub-components 412 (i.e. directly below the diffusion plate joint, close to the reflective layer side), and uses self-leveling optical glue which is the same as the material of the second bonding part 420, to fill the gap between the two second sub-components 412 and form material continuity in the vertical direction with the second bonding part 420 above.
[0067] The second bonding part 420 is located at the joint of the two adjacent diffusion plate units 310 and also uses self-leveling optical glue, which is responsible for filling the fine gap of the diffusion plate joint and bonding the units to ensure the light conduction across the joint.
[0068] In one embodiment, the present application also provides a preparation method for preparing the backlight module provided in any of the above embodiments, as shown in Figure 5 , comprising steps S502-S512.
[0069] S502, splicing a plurality of lamp plate units in a first direction to form a lamp plate structure.
[0070] Please refer to Figure 2A plurality of independent lamp panel units 110 are spliced along a preset first direction OX to form a complete lamp panel structure 100. During splicing, the flatness between the lamp panel units needs to be ensured to reduce light leakage caused by excessively large gaps; if the lamp panel unit has a circuit, the circuit connection at the splicing position also needs to be ensured. Through multi-unit splicing, large-size display requirements are adapted, and a foundation is laid for subsequent staggered design with the diffusion plate.
[0071] S504, splicing a plurality of diffusion plate units in a first direction to form a diffusion plate structure.
[0072] Please refer to Figure 3 A plurality of glass diffusion plate units 310 are spliced along the same first direction OX as the lamp panel units 110 to form a complete diffusion plate structure 300. During splicing, the splicing gap width between the diffusion plate units 310 (usually ≤0.15 mm) is controlled to provide conditions for subsequent optical adhesive filling, while ensuring that the surface of the diffusion plate is clean to avoid impurities affecting light diffusion.
[0073] S506, forming a reflective layer on the surface of the lamp panel structure.
[0074] Please refer to Figure 1 A reflective layer 200 (such as a high-reflectivity reflective paper or a metal plating layer) is covered on the light-emitting side surface of the lamp panel structure 100 (i.e., the surface first contacted after the light source emits light). The reflective layer 200 is closely attached to the surface of the lamp panel structure 100 to reflect the light emitted by the lamp panel towards the diffusion plate, reduce light leakage towards the back or side of the lamp panel, and improve light utilization.
[0075] S508, forming a first bonding part at the hole on the surface of the reflective layer.
[0076] Please continue to refer to Figure 1 A first bonding part 410 is coated on the surface of the reflective layer 200 away from the lamp panel structure 100. The form of the first bonding part 410 can be divided into an integral structure or a sub-component according to the design. The first bonding part 410 passes through the hole on the surface of the reflective layer 200 and contacts the lamp panel structure 100 to provide a basic bonding force for the connection between the diffusion plate structure 300 and the lamp panel structure 100, and to build a leakage prevention barrier to prevent the glue of the second bonding part 420 from penetrating towards the lamp panel.
[0077] S510, assembling the diffusion plate structure and the lamp panel structure in a staggered manner so that the splicing gap between the two adjacent diffusion plate units is opposite to the first bonding part; the diffusion plate structure is located on the side of the reflective layer away from the lamp panel structure, and the splicing gap between the two adjacent diffusion plate units is opposite to the splicing gap between the two adjacent lamp panel units.
[0078] Please continue to refer to Figure 1The diffusion plate structure 300 is placed on the side of the reflective layer 200 away from the lamp plate structure 100, and precise alignment is achieved through positioning tools to ensure two key position relationships. Among them, the diffusion plate splicing seam is opposite to the first bonding part 410, that is, the splicing seam of the diffusion plate unit 310 is directly below the first bonding part 410, which facilitates the formation of the vertical cooperation of the second bonding part 420 and the first bonding part 410. The diffusion plate splicing seam is opposite to the lamp plate splicing seam, and the two do not overlap in the plane, and the spatial distance is usually ≥20mm, which is used for physical isolation of the interference area.
[0079] S512, forming a second bonding part between the adjacent two diffusion plate units.
[0080] Please continue to refer to Figure 1 The second bonding part 420 is injected into the splicing seam of the diffusion plate unit 310, and the low viscosity characteristics and capillary effect are used to automatically fill the gap, realize seamless light transmission across the unit, and bond the adjacent diffusion plate units 310, thereby enhancing the structural stability.
[0081] In the embodiment of the present application, compared with the traditional method of splicing the lamp plate structure and the diffusion plate structure in the same seam, the diffusion plate structure 300 in the present application is located on the side of the reflective layer 200 away from the lamp plate structure 100, and the splicing seam between the adjacent two lamp plate units 110 is opposite to the splicing seam between the adjacent two diffusion plate units 310. The lamp plate joint and the diffusion plate joint can be physically isolated, the optical interference area is dispersed, the display uniformity is improved, and the luminous efficiency of the backlight module is improved. In addition, the bonding structure 400 in the present application includes a first bonding part 410 and a second bonding part 420; wherein the first bonding part 410 is arranged between the diffusion plate structure 300 and the reflective layer 200, and the second bonding part 420 is arranged between the adjacent two diffusion plate units 310 and located on the side of the first bonding part 410 away from the reflective layer 200. The complementary characteristics of the double bonding parts realize function coordination, further reduce light leakage and brightness loss, and improve the luminous efficiency of the backlight module.
[0082] Further, the first bonding part is formed at the hole on the surface of the reflective layer, comprising: forming the first bonding part at the hole on the surface of the reflective layer through the first adhesive.
[0083] Please continue to refer to Figure 1, the first bonding part 410 is formed on the surface of the lamp plate structure 100, penetrates the opening of the reflection layer 200, and directly connects the reflection layer 200 and the diffusion plate structure 300. The target position is an area preset according to the splicing requirement of the diffusion plate structure 300, for example, an area below the splicing joint of adjacent diffusion plate units 310, which reserves space for the cooperation of the second bonding part 420 and the first bonding part 410. The first adhesive is a high thixotropy barrier adhesive, which is paste-like at room temperature, has high thixotropy, flows under external force, quickly solidifies after standing, can be accurately coated on the target position without random diffusion, forms a rigid structure after thermal curing, can build a stable bonding base and a leakage prevention barrier on the surface of the reflection layer, and prevents the optical adhesive of the second bonding part from leaking downward to the lamp plate.
[0084] Further, the second bonding part is formed between the adjacent two diffusion plate units, including: between the adjacent two diffusion plate units, the second bonding part is formed by the second adhesive.
[0085] Please continue to refer to Figure 1 The second bonding part 420 is formed between the adjacent two diffusion plate units 310, that is, at the splicing joint of the diffusion plate structure 300. The second adhesive is a self-leveling optical adhesive, which has the characteristics of low viscosity and high fluidity, can fill the fine gap of 0.3 mm or less between the diffusion plate units by means of capillary effect and gravity, and ensure that the gap is filled without dead angle. The difference between the refractive index of the second adhesive and the refractive index of the glass diffusion plate substrate is less than or equal to 0.02, which can eliminate the refractive index jump when the light crosses the interface, and avoid the abnormal brightness caused by scattering or reflection. The high-strength adhesive layer is formed by stepwise temperature curing, which ensures that the interfacial bonding strength is more than 5 MPa, and avoids the residual bubbles.
[0086] Further, the first bonding part includes a first sub-component and second sub-components located on both sides of the first sub-component; the method further includes: at both ends of the opening on the surface of the reflection layer, the second sub-components are formed by the first adhesive, and the first sub-component is formed by the second adhesive between the two second sub-components.
[0087] Please continue to refer to Figure 4 At the target position on the surface of the reflection layer 200, the first adhesive is coated to form the second sub-components on both sides. The high thixotropy barrier adhesive is paste-like at room temperature, has strong thixotropy, can accurately control the coating range, and forms a stable adhesive strip. This feature ensures that the second sub-component 412 can firmly bond the edge area of the diffusion plate and the reflection layer 200, and also serves as a dam to limit the flow range of the subsequent adhesive. The two second sub-components 412 are distributed on both sides of the diffusion plate joint, and cover the main contact area of the diffusion plate structure 300 and the reflection layer 200 as a whole, ensuring the basic bonding strength.
[0088] The second glue is injected into the gap between the two second sub-components 412 to form the first sub-component 411. The self-leveling optical glue has low viscosity and good flowability, and can fill the fine gap between the second sub-components by capillary effect. The first sub-component 411 and the second bonding part 420 at the joint of the upper diffusion plate form a vertical material continuum, eliminating light reflection or scattering caused by the interface of different glues. In actual application, the first sub-component 411 can be formed simultaneously with the second bonding part 420 by injecting the second glue at the joint of the diffusion plate to fill the joint of the diffusion plate and the gap between the second sub-components 412.
[0089] It should be understood that although the steps in the above flowcharts are shown in sequence, these steps are not necessarily executed in sequence. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, at least part of the steps in the figures can include multiple steps or stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps.
[0090] In the description of the present specification, the description of the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.
[0091] The technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features of the above-described embodiments are not described, but as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present specification.
[0092] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.
Claims
1. A backlight module, characterized in that, The application relates to a light panel structure, comprising: a light panel structure comprising a plurality of light panel units arranged along a first direction; a reflection layer arranged on one side surface of the light panel structure along a second direction; the first direction intersects the second direction; the reflection layer is provided with an opening at a preset position on the surface thereof; a diffusion plate structure comprising a plurality of diffusion plate units arranged along the first direction; the diffusion plate structure is located on the side of the reflection layer away from the light panel structure; the joint seams between two adjacent light panel units are located opposite to the joint seams between two adjacent diffusion plate units; a bonding structure comprising a first bonding part and a second bonding part; the first bonding part is arranged between the diffusion plate structure and the reflection layer and is located at the opening on the surface of the reflection layer; the second bonding part is arranged between two adjacent diffusion plate units and is located on the side of the first bonding part away from the reflection layer.
2. The backlight module of claim 1, wherein, The length of the first bonding part along the first direction exceeds the length of the second bonding part along the first direction.
3. The backlight module of claim 1, wherein, The first bonding part comprises a first subpart and second subparts located on both sides of the first subpart; the first subpart is located between the second bonding part and the reflection layer, and the length of the first subpart along the first direction exceeds the length of the second bonding part along the first direction.
4. The backlight module of claim 1, wherein, The reflection layer comprises a plurality of reflection parts arranged along the first direction, and the number of the reflection parts is the same as that of the light panel units; one end of the reflection part is provided with an extension part; the extension part is overlapped on one side surface of the corresponding light panel unit, and when the light panel unit is jointed with an adjacent light panel unit, the extension part covers the joint seam between the two light panel units.
5. The backlight module of claim 2, wherein, The first bonding part is used for bonding the diffusion plate structure and the reflection layer; the second bonding part is used for bonding two adjacent diffusion plate units; the material of the first bonding part is different from that of the second bonding part.
6. The backlight module of claim 3, wherein, The second subpart is used for bonding the diffusion plate structure and the reflection layer; the first subpart is used for filling the gap between two second subparts; the second bonding part is used for bonding two adjacent diffusion plate units; the material of the first subpart is the same as that of the second bonding part, and the material of the first subpart is different from that of the second subpart.
7. A method for manufacturing a backlight module, characterized in that, The method comprises: jointing a plurality of light panel units along a first direction to form a light panel structure; jointing a plurality of diffusion plate units along the first direction to form a diffusion plate structure; forming a reflection layer on the surface of the light panel structure; forming a first bonding part at the opening on the surface of the reflection layer; assembling the diffusion plate structure and the light panel structure in position so that the joint seam between two adjacent diffusion plate units is opposite to the first bonding part; the diffusion plate structure is located on the side of the reflection layer away from the light panel structure, and the joint seam between two adjacent diffusion plate units is located opposite to the joint seam between two adjacent light panel units; forming a second bonding part between two adjacent diffusion plate units.
8. The method of claim 7, wherein, The method comprises: forming a first bonding part at the opening on the surface of the reflection layer by using a first adhesive.
9. The method of claim 7, wherein, The method comprises: A second adhesive portion is formed between two adjacent diffuser plate units using a second colloid.
10. The method of claim 7, wherein, The first adhesive portion includes a first sub-component and second sub-components located on both sides of the first sub-component; the method further includes: At both ends of the opening on the surface of the reflective layer, a second sub-component is formed by a first colloid, and a first sub-component is formed between the two second sub-components by a second colloid.