An electrical connection and power module

Abstract

The application relates to the technical field of chip packaging, in particular to an electric connecting piece and a power module, wherein the electric connecting piece comprises a connecting main body, one side of the connecting main body is bent downward to form one or more than one first connecting pin, and the other side of the connecting main body is bent downward to form a plurality of second connecting pins. Each first connecting pin is used for connecting with a circuit carrier used in cooperation with the electric connecting piece. Each second connecting pin is used for connecting with a chip used in cooperation with the electric connecting piece. Since the plurality of second connecting pins are symmetrically arranged about the center line of the connecting main body, not only the efficient parallel connection of the plurality of chips is realized, but also the current paths of the plurality of chips are effectively balanced, and the current sharing performance is improved. A through groove is formed on each second connecting pin. Plastic melt can flow through the through groove to the lower side of the second connecting pin, not only the connecting strength of the second connecting pin and plastic sealing material is increased, but also the possibility of the occurrence of plastic sealing layering is reduced.

Description

Technical Field

[0001] This application relates to the technical field of chip packaging, and in particular to an electrical connector and a power module. Background Technology

[0002] When packaging power modules with multiple chips, the chips are first connected in parallel using leads or copper sheets, and then the chips and leads / copper sheets are molded together. However, relying on leads for electrical connections results in a cluttered layout and poor connection reliability. Therefore, there is a growing trend towards using copper sheets for electrical connections.

[0003] The existing copper sheet has a first connection pin and a second connection pin formed on it. The first connection pin is used to connect to the substrate. The second connection pin is used to connect to the chip. This improves the reliability and conductivity of the connection.

[0004] The existing technical solutions mentioned above have the following drawbacks: when using copper sheets to achieve electrical connection, the current path balance is poor, resulting in uneven distribution of parasitic parameters, generating additional switching losses and electromagnetic interference at high frequencies, which restricts the electrical performance and reliability of the power module. Summary of the Invention

[0005] In order to improve current sharing performance, make parasitic parameters more uniform, and improve the electrical performance and reliability of power modules, this application provides an electrical connector and a power module.

[0006] The primary objective of this application is to provide an electrical connector, employing the following technical solution:

[0007] An electrical connector, comprising:

[0008] The connecting body has one or more first connecting pins bent on one side and multiple second connecting pins bent on the other side; the multiple second connecting pins are symmetrically arranged about the center line of the connecting body; each second connecting pin has a through groove; each first connecting pin is used to connect with a circuit carrier used with a mating electrical connector; each second connecting pin is used to connect with a chip used with a mating electrical connector.

[0009] By adopting the above technical solution, the symmetrical arrangement of multiple second connection pins about the center line of the connection body not only achieves efficient parallel connection of multiple chips, but also effectively balances the current paths of multiple chips, improving current sharing performance. This results in a relatively uniform distribution of parasitic parameters, reduces switching losses and electromagnetic interference at high frequencies, and is beneficial to improving the electrical performance and reliability of the power module. A through-groove is formed on each second connection pin. The molten plastic can flow through the through-groove to the bottom of the second connection pin, ensuring the fluidity and filling properties of the molding compound. This not only increases the connection strength between the second connection pin and the molding compound, but also helps reduce the possibility of molding delamination. Simultaneously, during the curing process of the molding compound, the through-groove helps release stress on the second connection pin, further reducing the possibility of molding delamination.

[0010] This application is further configured such that: a plurality of guide strips are formed in the middle of the connecting body; the plurality of guide strips are symmetrically arranged about the center line of the connecting body; and each pair of adjacent second connecting pins shares one guide strip.

[0011] By adopting the above technical solutions, the flow sharing performance can be further improved.

[0012] This application is further configured such that: each second connection pin has a plurality of through slots formed thereon; the plurality of through slots are arranged in parallel pairs.

[0013] By adopting the above technical solutions, the anti-delamination performance of plastic sealant can be further improved.

[0014] This application is further configured such that the extension direction of each through slot is the same as the extension direction of the corresponding second connection pin.

[0015] By adopting the above technical solution, good anti-delamination performance of plastic sealant is ensured.

[0016] This application further specifies that the ratio of the length of each through slot to the length of the corresponding second connecting pin is equal to or greater than 4 / 5.

[0017] By adopting the above technical solution, good anti-delamination performance of plastic sealant is ensured.

[0018] This application is further configured such that each second connection pin has one or more bends.

[0019] By adopting the above technical solution, the anti-delamination performance of plastic sealant has been effectively improved.

[0020] This application further specifies that a through hole is formed in the middle of the connecting body.

[0021] By adopting the above technical solution, not only is the connection strength between the connecting body and the molding compound increased, but the possibility of molding delamination is also reduced. Furthermore, during the molding compound curing process, the connecting body helps release stress, further reducing the likelihood of molding delamination.

[0022] This application further includes:

[0023] A buffer structure is installed inside the through hole.

[0024] By adopting the above technical solution, the buffer structure is used to absorb the stress generated during the molding process, further reducing the possibility of delamination of the molding.

[0025] This application further specifies that the buffer structure includes:

[0026] The capsule is installed inside the through hole;

[0027] There are multiple rigid node rings arranged in multiple rows and columns within the capsule; each rigid node ring is connected to multiple flexible connecting strips, and each flexible connecting strip is located on the tangent of the rigid node ring;

[0028] Flexible filler, used to fill between multiple flexible connecting strips;

[0029] Rigid packing is used to fill each rigid node ring.

[0030] By adopting the above technical solution, the local density can be increased to absorb the stress generated during the molding process.

[0031] The second objective of this application is to provide a power module, which adopts the following technical solution:

[0032] A power module includes a circuit carrier, multiple chips, and electrical connectors; the multiple chips are mounted side-by-side in pairs on the circuit carrier; each first connection pin of the connection body is connected to the circuit carrier; each second connection pin of the connection body is connected to the corresponding chip.

[0033] In summary, the beneficial technical effects of this application are as follows:

[0034] 1. Due to the symmetrical arrangement of multiple second connection pins about the centerline of the connection body, not only is efficient parallel connection of multiple chips achieved, but the current paths of multiple chips are also effectively balanced, improving current sharing performance. This results in a relatively uniform distribution of parasitic parameters, reducing switching losses and electromagnetic interference at high frequencies, which is beneficial to improving the electrical performance and reliability of the power module. A through-groove is formed on each second connection pin. The molten plastic can flow through the through-groove to the bottom of the second connection pin, ensuring the fluidity and filling properties of the molding compound. This not only increases the connection strength between the second connection pin and the molding compound, but also helps reduce the possibility of molding delamination. Simultaneously, during the curing process of the molding compound, the through-groove helps release stress on the second connection pin, further reducing the possibility of molding delamination.

[0035] 2. The extension direction of each through-slot is the same as the extension direction of the corresponding second connection pin, and the ratio of the length of each through-slot to the length of the corresponding second connection pin is equal to or greater than 4 / 5, so as to ensure better anti-delamination performance of plastic sealant;

[0036] 3. A through hole is formed in the middle of the connecting body, which not only increases the connection strength between the connecting body and the molding compound, but also helps to reduce the possibility of molding delamination.

[0037] 4. Install a buffer structure inside the through hole. The buffer structure can absorb the stress generated during the molding process, further reducing the possibility of delamination of the molding. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the structure of the first embodiment of the electrical connector;

[0039] Figure 2 This is a structural schematic diagram of the second embodiment of the electrical connector;

[0040] Figure 3 This is a structural schematic diagram of the third embodiment of the electrical connector;

[0041] Figure 4 This is a structural schematic diagram of the fourth embodiment of the electrical connector;

[0042] Figure 5 yes Figure 4 A schematic diagram of the internal structure of the buffer structure in the electrical connector shown;

[0043] Figure 6 This is a structural schematic diagram of the fifth embodiment of the electrical connector;

[0044] Figure 7 This is a structural schematic diagram of the sixth embodiment of the electrical connector;

[0045] Figure 8This is a structural schematic diagram of the seventh embodiment of the electrical connector;

[0046] Figure 9 This is a structural schematic diagram of the eighth embodiment of the electrical connector;

[0047] Figure 10 This is a structural schematic diagram of one embodiment of the power module.

[0048] Reference numerals: 110, connecting body; 111, first connecting pin; 1111, mounting hole; 112, second connecting pin; 1121, through groove; 1122, bending part; 113, center line; 114, guide strip; 115, through hole; 120, buffer structure; 121, capsule; 122, rigid node ring; 123, flexible connecting strip; 124, flexible filler; 125, rigid filler; 200, circuit carrier; 300, chip. Detailed Implementation

[0049] The following is in conjunction with the appendix Figure 1-10 This application will be described in further detail.

[0050] Reference Figure 1This application discloses an electrical connector, including a connector body 110. One side of the connector body 110 is bent downward to form one or more first connector pins 111, and the other side is bent downward to form a plurality of second connector pins 112. It should be noted that the bottom surface of each first connector pin 111 and the bottom surface of each second connector pin 112 should be lower than the bottom surface of the connector body 110 in the vertical direction. Each first connector pin 111 is used to connect to a circuit carrier 200 used with the electrical connector. Each second connector pin 112 is used to connect to a chip 300 used with the electrical connector. Signals or currents are conducted from each chip 300 through the corresponding second connector pin 112, the connector body 110, and the first connector pin 111 to the circuit carrier 200 (substrate). Because the plurality of second connector pins 112 are symmetrically arranged about the center line 113 of the connector body 110, not only is efficient parallel connection of the plurality of chips 300 achieved, but the current paths of the plurality of chips 300 are also effectively balanced, improving current sharing performance. This design ensures a relatively uniform distribution of parasitic parameters (parasitic capacitance and inductance), reducing switching losses and electromagnetic interference at high frequencies, thus improving the electrical performance and reliability of the power module. A through-groove 1121 is formed on each second connection pin 112. The molten plastic can flow through the through-groove 1121 to the underside of the second connection pin 112, ensuring the fluidity and filling properties of the molding compound. This not only increases the connection strength between the second connection pin 112 and the molding compound but also helps reduce the possibility of delamination. Simultaneously, during the curing process of the molding compound, the through-groove 1121 helps release stress on the second connection pin 112, further reducing the possibility of delamination. Overall, this improves the reliability of the power module from both physical connection and electrical performance perspectives.

[0051] Preferably, there is one first connection pin 111 and three second connection pins 112.

[0052] Preferably, the electrical connectors are manufactured using a one-piece molding process, which results in higher production efficiency.

[0053] Preferably, the electrical connector is made of copper, copper alloy, or copper-containing composite material, and has conductivity and heat dissipation properties suitable for the 300 chip package structure.

[0054] Preferably, the second connection pin 112 is connected to the chip 300 by silver sintering, copper sintering or solder welding.

[0055] Preferably, each first connection pin 111 has a mounting hole 1111 for connection with the circuit carrier 200. The mounting hole 1111 can be a round hole, a semi-circular hole, or an oblong hole.

[0056] Reference Figure 1 and Figure 2Multiple current-guiding strips 114 are formed in the middle of the connecting body 110. The multiple current-guiding strips 114 are symmetrically arranged about the center line 113 of the connecting body 110. The adjacent ends of every two adjacent second connection pins 112 are connected to the same current-guiding strip 114 to share a single current-guiding strip 114. This further improves current-sharing performance. It should be noted that there can be two, three, four, or more current-guiding strips 114, capable of conducting current and signals.

[0057] Reference Figure 3 Multiple through slots 1121 are formed on each of the second connection pins 112. The multiple through slots 1121 are arranged in pairs in parallel. In this way, the anti-delamination performance can be further improved.

[0058] Preferably, two, three or more through slots 1121 may be formed on each second connection pin 112.

[0059] Reference Figure 1 and Figure 2 The extension direction of each through-slot 1121 is the same as the extension direction of the corresponding second connection pin 112. Furthermore, the ratio of the length of each through-slot 1121 to the length of the corresponding second connection pin 112 is equal to or greater than 4 / 5 to ensure good anti-delamination performance.

[0060] Reference Figure 1 and Figure 2 Each second connection pin 112 has one or more bends 1122. The middle portion of each second connection pin 112 can be bent away from the circuit carrier 200 to form a bend 1122 at the middle of each second connection pin 112. Alternatively, the ends of each second connection pin 112 can be bent away from the circuit carrier 200 to form bends 1122 at the ends of each second connection pin 112. The bends 1122 facilitate stress relief, thereby improving anti-delamination performance.

[0061] Preferably, each second connection pin 112 may have one, two or more bends 1122. Each bend 1122 is in the form of a broken line or an arc.

[0062] Reference Figure 1 and Figure 2 A through hole 115 is formed in the middle of the connecting body 110. The molten plastic can flow through the through hole 115 to the bottom of the connecting body 110, ensuring the fluidity and filling properties of the molding compound. This not only increases the connection strength between the connecting body 110 and the molding compound but also helps reduce the possibility of delamination. Simultaneously, during the curing process of the molding compound, the connecting body 110 helps release stress, further reducing the possibility of delamination.

[0063] In the first embodiment, as Figure 1 As shown, the three second connection pins 112 are aligned on the same straight line to make the through hole 115 relatively small.

[0064] In the second embodiment, as Figure 2 As shown, the second connection pin 112 in the middle is not on the same straight line as the second connection pins 112 on both sides, so that the through hole 115 is larger and the anti-delamination performance is further improved.

[0065] Preferably, the number of through holes 115 can be one or more, and the shape can be circular, square, elliptical or polygonal, and they are not connected to the through groove 1121.

[0066] In the fourth embodiment, reference is made to... Figure 4 and Figure 5 The electrical connector also includes a buffer structure 120. The buffer structure 120 is installed within the through-hole 115 to absorb stress generated during the molding process, further reducing the possibility of delamination. Specifically, the buffer structure 120 includes a capsule 121, rigid node rings 122, flexible connecting strips 123, flexible filler 124, and rigid filler 125. The capsule 121 is fixedly installed within the through-hole 115. Multiple rigid node rings 122 are arranged in multiple rows and columns within the capsule 121. Each rigid node ring 122 is connected to multiple flexible connecting strips 123, and each flexible connecting strip 123 is located on the tangent of the rigid node ring 122. Flexible filler 124 fills the spaces between the multiple flexible connecting strips 123. Rigid filler 125 fills each rigid node ring 122.

[0067] In the fifth embodiment, reference is made to... Figure 6 The electrical connector includes two connecting bodies 110 and three second connecting pins 112. The two connecting bodies 110 are arranged side by side. Each connecting body 110 has a first connecting pin 111 formed at one end. The three second connecting pins 112 are on the same straight line. The adjacent ends of every two adjacent second connecting pins 112 are respectively connected to the other end of one connecting body 110. Each connecting body 110 has a through hole 115. Each second connecting pin 112 has a through groove 1121.

[0068] In the sixth embodiment, reference is made to... Figure 7 The electrical connector includes a connecting body 110. The middle of the connecting body 110 is bent to form a first connecting pin 111, and the opposite sides are bent to form three second connecting pins 112. Each second connecting pin 112 has a through groove 1121 formed thereon.

[0069] In the seventh embodiment, reference is made to... Figure 8The electrical connector includes a connector body 110. One side of the connector body 110 is bent to form a first connector pin 111, and the opposite ends are bent to form second connector pins 112. Each second connector pin 112 has a through groove 1121 formed thereon.

[0070] In the eighth embodiment, refer to Figure 9 The electrical connector includes a connecting body 110. The middle portion of the connecting body 110 is bent to form two second connecting pins 112, and the opposite ends are bent to form first connecting pins 111. Four through holes 115 are formed on the connecting body 110. Each second connecting pin 112 has a through groove 1121.

[0071] The implementation principle of this embodiment is as follows: Because multiple second connection pins 112 are symmetrically arranged about the center line 113 of the connection body 110, not only is efficient parallel connection of multiple chips 300 achieved, but the current paths of the multiple chips 300 are also effectively balanced, improving current sharing performance, reducing the junction temperature and aging risk of the chip 300, and enhancing thermal stability. Compared to the form of electrical connection relying on leads, the current carrying capacity is stronger, the connection reliability is higher, and solder joint failure is avoided. A through-groove 1121 is formed on each second connection pin 112, reducing the possibility of plastic encapsulation delamination. The overall layout is more compact, which also reduces the risk of plastic encapsulation delamination. The overall layout is also more symmetrical, reducing impedance and avoiding uneven parasitic parameters.

[0072] Reference Figure 10This application also discloses a power module, including a circuit carrier 200, multiple chips 300, and the aforementioned electrical connectors. The multiple chips 300 are mounted side-by-side on the circuit carrier 200 in pairs. Each first connection pin 111 of the connection body 110 is connected to the circuit carrier 200. Each second connection pin 112 of the connection body 110 is connected to the corresponding chip 300. Signals or currents are conducted from each chip 300 through the corresponding second connection pin 112, the connection body 110, and the first connection pin 111 to the circuit carrier 200. Because the multiple second connection pins 112 are symmetrically arranged about the center line 113 of the connection body 110, not only is efficient parallel connection of the multiple chips 300 achieved, but the current paths of the multiple chips 300 are also effectively balanced, improving current sharing performance. This results in a relatively uniform distribution of parasitic parameters, reduces switching losses and electromagnetic interference at high frequencies, and is beneficial to improving the electrical performance and reliability of the power module. A through-slot 1121 is formed on each second connection pin 112. The molten plastic can flow through the through-groove 1121 to reach below the second connection pin 112, ensuring the fluidity and filling properties of the molding compound. This not only increases the connection strength between the second connection pin 112 and the molding compound but also helps reduce the possibility of delamination. Simultaneously, during the curing process of the molding compound, the through-groove 1121 helps release stress on the second connection pin 112, further reducing the likelihood of delamination. Overall, this improves the reliability of the power module from both physical connection and electrical performance perspectives.

[0073] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made to the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention. This application discloses an electrical connector and a loading / unloading device.

Claims

1. An electrical connector, characterized in that, include: The connecting body (110) has one or more first connecting pins (111) bent on one side and multiple second connecting pins (112) bent on the other side; the multiple second connecting pins (112) are symmetrically arranged about the center line (113) of the connecting body (110); each second connecting pin (112) has a through groove (1121); each first connecting pin (111) is used to connect with a circuit carrier (200) used with an electrical connector; each second connecting pin (112) is used to connect with a chip (300) used with an electrical connector; a through hole (115) is formed in the middle of the connecting body (110); The electrical connector also includes: A buffer structure (120) is installed inside the through hole (115); The buffer structure (120) includes: The capsule (121) is installed inside the through hole (115); There are multiple rigid node rings (122) arranged in multiple rows and columns inside the capsule (121); each rigid node ring (122) is connected to multiple flexible connecting strips (123), and each flexible connecting strip (123) is located on the tangent of the rigid node ring (122); Flexible filler (124) is filled between the plurality of the flexible connecting strips (123); Rigid filler (125) is filled in each of the rigid node rings (122).

2. The electrical connector according to claim 1, characterized in that, A plurality of guide strips (114) are formed in the middle of the connecting body (110); the plurality of guide strips (114) are symmetrically arranged about the center line (113) of the connecting body (110); each pair of adjacent second connecting pins (112) shares one guide strip (114).

3. The electrical connector according to claim 1, characterized in that, Each of the second connection pins (112) has a plurality of through slots (1121) formed thereon; the plurality of through slots (1121) are arranged in parallel pairs.

4. The electrical connector according to claim 3, characterized in that, The extension direction of each of the through slots (1121) is the same as the extension direction of the corresponding second connection pin (112).

5. The electrical connector according to claim 4, characterized in that, The ratio of the length of each through slot (1121) to the length of the corresponding second connection pin (112) is equal to or greater than 4 / 5.

6. The electrical connector according to claim 1, characterized in that, Each of the second connection pins (112) has one or more bends (1122).

7. A power module, characterized in that, The device includes a circuit carrier (200), a plurality of chips (300), and an electrical connector as described in any one of claims 1 to 6; the plurality of chips (300) are mounted side by side on the circuit carrier (200); each of the first connection pins (111) of the connection body (110) is connected to the circuit carrier (200); and each of the second connection pins (112) of the connection body (110) is connected to the corresponding chip (300).

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