Electrical connector, signal transmission device and dilution refrigerator

Abstract

The application provides an electric connector, a signal transmission device and a dilution refrigerator, and relates to the technical field of quantum computing. The electric connector comprises: a heat sink shell having a containing space penetrating in an insertion direction, and being suitable for being mounted on a cold plate of a dilution refrigerator of a superconducting quantum computer; a heat conduction component mounted in the containing space and comprising a plurality of parallel and spaced heat conduction insulating sheets; and a plurality of electric connection components respectively mounted in two adjacent heat conduction insulating sheets and configured to electrically connect a plurality of terminals of two plugs inserted into the containing space in opposite directions and transmit heat of the terminals to the cold plate through the heat conduction insulating sheets and the heat sink shell, so that the cold plate can sufficiently cool the plurality of terminals of the two plugs.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of quantum computing, and more particularly, to an electrical connector, a signal transmission device, and a dilution refrigerator. BACKGROUND

[0002] A dilution refrigerator is an important component of a superconducting quantum computer. A quantum computing chip is located in a low-temperature region of the order of mK (milli-Kelvin) at the bottom of the dilution refrigerator. The quantum computing chip needs to be in a vacuum and extremely low-temperature working environment to achieve ideal performance. The quantum computing chip, the cold plate of the dilution refrigerator, and the control and test part at room temperature are all connected by signal transmission cables. The signal transmission cables are also arranged in a vacuum and extremely low-temperature environment. The signal transmission cables are connected to the quantum computing chip from the outside to the inside of the quantum computer in an extremely low-temperature environment. The external environment is at room temperature, which will transfer heat from the external environment to the inside of the dilution refrigerator through heat conduction. In the case of current passing through the signal transmission cable, the resistance will cause heat to be generated in the signal transmission cable itself.

[0003] At present, the signal transmission cable is cooled by passing through the cold plate of the dilution refrigerator. However, the contact area between the signal transmission cable and the cold plate is small, and the cooling effect is not ideal. Moreover, a single signal transmission cable is composed of multiple parts. Each detachable plug-in interface is a contact point. The existing single signal transmission cable has as many as 48 contact points. The contact resistance at the plug-in interface will seriously affect signal transmission and increase signal transmission loss. SUMMARY

[0004] To solve at least one of the technical problems in the prior art, embodiments of the present application provide an electrical connector, a signal transmission device, and a dilution refrigerator. The cold plate can sufficiently cool the multiple terminals of the two plugs.

[0005] The present application provides an electrical connector, comprising: a heat sink shell having a receiving space passing through in the insertion direction, suitable for being mounted on the cold plate of the dilution refrigerator of a superconducting quantum computer; a heat conduction assembly installed in the receiving space, comprising a plurality of parallel and spaced heat-conducting insulating sheets; a plurality of electrical connection assemblies, respectively installed in two adjacent heat-conducting insulating sheets, configured to electrically connect a plurality of terminals of two plugs inserted into the receiving space in opposite directions, and transfer heat of the terminals to the cold plate through the heat-conducting insulating sheets and the heat sink shell.

[0006] Optionally, each of the above-mentioned electrical connection assemblies comprises a support housing having a U-shaped cross section, the support housing being mounted between two adjacent above-mentioned thermally conductive and insulating sheets and configured to receive terminals of the above-mentioned plugs; a first thermally conductive block disposed within the support housing and configured to electrically connect to the terminals of two plugs and transmit heat of the terminals to the thermally conductive and insulating sheets through the support housing; and a resilient sheet disposed between the first thermally conductive block and a bottom of the support housing to allow the first thermally conductive block to conform to the terminals when the terminals are inserted into the support housing.

[0007] Optionally, each of the above-mentioned support housings is provided with limiting sheets at both ends thereof, the limiting sheets being configured to limit the first thermally conductive block and the resilient sheet between two support arms of the support housing.

[0008] Optionally, the first thermally conductive block has a groove configured to absorb deformation of the first thermally conductive block due to temperature change.

[0009] Optionally, the above-mentioned thermally conductive assembly further comprises a plurality of limiting members respectively disposed between two adjacent above-mentioned thermally conductive and insulating sheets to define a spacing between the two adjacent thermally conductive and insulating sheets.

[0010] Another aspect of the present application provides a signal transmission device comprising the above-mentioned electrical connector; two transmission assemblies, each of the transmission assemblies comprising a connection line and a plug connected to an end of the connection line, two plugs being inserted into the electrical connector in opposite directions so that a plurality of conductive lines belonging to two groups of connection lines are electrically connected respectively.

[0011] Optionally, each of the above-mentioned connection lines further comprises two first shielding layers stacked on each other; and a plurality of second shielding layers spaced apart in parallel between the two first shielding layers, each of the conductive lines being arranged in a space defined by two adjacent second shielding layers and two first shielding layers.

[0012] Optionally, the first shielding layers and the second shielding layers are made of superconducting material and are configured to enter a superconducting state in response to an external environment being lowered to a superconducting transition temperature to shield an external magnetic field.

[0013] Optionally, each of the above-mentioned plugs comprises a support assembly comprising a base and support portions extending in parallel from the base and arranged in a spaced apart manner, portions of the connection lines extending out of the second shielding layers being attached to side surfaces of the support portions facing the first thermally conductive blocks of the above-mentioned electrical connection assemblies to form terminals; and a second thermally conductive block configured to couple end portions of the connection lines to the base through first connecting members and connected to the heat sink housing through second connecting members to transfer heat of the connection lines to the heat sink housing.

[0014] In another aspect of the present application, an embodiment of a dilution refrigerator is provided, comprising: a plurality of cold stages; a quantum computing chip disposed below the plurality of cold stages; a plurality of signal transmission devices, wherein electrical connectors of the plurality of signal transmission devices are respectively mounted on the cold stages, and wherein the plurality of signal transmission devices are configured to transmit signals between the plurality of cold stages and the quantum computing chip and to transfer heat from the signal transmission devices to the cold stages via the electrical connectors.

[0015] According to an embodiment of the present application, an electrical connector, a signal transmission device, and a dilution refrigerator are provided, wherein the heat sink housing has a receiving space through in the insertion direction, is adapted to be mounted on a cold stage of a dilution refrigerator of a superconducting quantum computer, and the heat conducting assembly is mounted in the receiving space and comprises a plurality of heat conducting insulation sheets arranged in parallel and spaced apart, and a plurality of electrical connection assemblies are respectively mounted in two adjacent heat conducting insulation sheets and are configured to respectively electrically connect a plurality of terminals of two plugs inserted into the receiving space in opposite directions and to transfer heat of the terminals to the cold stage via the heat conducting insulation sheets and the heat sink housing, so that the cold stage can sufficiently cool the plurality of terminals of the two plugs while the electrical connector electrically connects the two plugs. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a partial perspective view of a dilution refrigerator according to an embodiment of the present application;

[0017] Figure 2 is a partial perspective view of a dilution refrigerator according to an embodiment of the present application; Figure 1 is a partial enlarged view of A in FIG. 1;

[0018] Figure 3 is a perspective view of an electrical connector according to an embodiment of the present application;

[0019] Figure 4 is a perspective view of a heat sink housing according to an embodiment of the present application;

[0020] Figure 5 is a perspective view of a heat conducting assembly according to an embodiment of the present application;

[0021] Figure 6 is a perspective view of an electrical connection assembly according to an embodiment of the present application;

[0022] Figure 7 is a side view of an electrical connection assembly according to an embodiment of the present application;

[0023] Figure 8 is a cross-sectional view in the D-D direction; Figure 7

[0024] Figure 9 ​is a perspective view of a signal transmission device according to an embodiment of the present application;

[0025] Figure 10 is Figure 9 is a partial enlarged view at B in the figure;

[0026] Figure 11 is a side view of a signal transmission device according to an embodiment of the present application;

[0027] Figure 12 is Figure 11 is a sectional view in the F-F direction;

[0028] Figure 13 is Figure 12 is a partial enlarged view at C in the figure;

[0029] Figure 14 is a partial enlarged view of a connecting line according to an embodiment of the present application;

[0030] Figure 15 is a sectional view of a connecting line according to an embodiment of the present application;

[0031] Figure 16 is Figure 9 is a partial enlarged view at E in the figure;

[0032] Figure 17 is Figure 16 is a partial enlarged view at G in the figure.

[0033] In the figures, the meanings of the reference numerals are as follows:

[0034] 1. cold plate;

[0035] 2. heat sink housing;

[0036] 21. main body;

[0037] 22. mounting portion;

[0038] 23. mounting ear;

[0039] 24. first through hole;

[0040] 25. second through hole;

[0041] 26. third through hole;

[0042] 3. connecting line;

[0043] 32. first shielding layer;

[0044] 33. second shielding layer;

[0045] 34. wire;

[0046] 341. wire core;

[0047] 342、insulating layer

[0048] 31、plug

[0049] 310、terminal

[0050] 4、second heat-conducting block

[0051] 5、support assembly

[0052] 51、base

[0053] 52、support portion

[0054] 6、heat-conducting insulating sheet

[0055] 7、limiting member

[0056] 8、first heat-conducting block

[0057] 9、elastic member

[0058] 10、support housing

[0059] 100、bend

[0060] 101、limiting sheet

[0061] 11、heat-conducting assembly

[0062] 110、fourth through hole

[0063] 12、electrical connection assembly

[0064] 13、screw

[0065] 14、first connecting member

[0066] 15、second connecting member DETAILED DESCRIPTION

[0067] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. It should be understood, however, that the description which follows is merely illustrative and is not intended to limit the scope of the present application. In the following detailed description of embodiments of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that one or more embodiments of the present application can be practiced without these specific details. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring aspects of the present application.

[0068] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "comprises" or "comprising" and variations thereof, such as "comprising," "comprises" and "comprising," will be understood to mean that the item includes the feature, step, or component, but not excluding the presence of one or more other features, steps, components, or additional items.

[0069] All terms used herein, including technical and scientific terms, have the meanings commonly understood by one of ordinary skill in the art unless otherwise defined herein. It should be noted that the terms used herein are defined as having meanings that are consistent with the context of the specification in which the terms are used and should not be interpreted in an overly idealized or overly formal way.

[0070] In the case of using expressions similar to "at least one of A, B, and C, etc.", it should generally be interpreted to include at least one of each item, unless otherwise specifically stated in the context (for example, "a system having at least one of A, B, and C" should be interpreted to include a system having at least one of A, a system having at least one of B, a system having at least one of C, a system having at least one of A and B, a system having at least one of A and C, a system having at least one of B and C, and / or a system having at least one of A, B, and C, etc.). In the case of using expressions similar to "at least one of A, B, or C, etc.", it should generally be interpreted to include at least one of each item, unless otherwise specifically stated in the context (for example, "a system having at least one of A, B, or C" should be interpreted to include a system having at least one of A, a system having at least one of B, a system having at least one of C, a system having at least one of A and B, a system having at least one of A and C, a system having at least one of B and C, and / or a system having at least one of A, B, and C, etc.).

[0071] The temperature of the cold plate of the dilution refrigerator of the superconducting quantum computer is generally 40mK or 50mK, and the working temperature of the quantum computing chip at the bottom layer of the dilution refrigerator is generally 10mK. The signal transmission cable connected between the multi-stage cold plate and the quantum computing chip transmits signals, and there is a problem of heat transfer from the high-temperature region to the low-temperature region. Although the signal transmission cable is cooled by passing through the cold plate of the dilution refrigerator, the contact area between the signal transmission cable and the cold plate is small, and the cooling effect is not ideal.

[0072] Figure 1 is a partial perspective view of a dilution refrigerator according to an embodiment of the present application, Figure 2 is Figure 1 is a partial enlarged view at A in FIG. Figure 3 is a perspective view of an electrical connector according to an embodiment of the present application, Figure 4 is a perspective view of a heat sink housing according to an embodiment of the present application, Figure 5 is a perspective view of a heat conduction assembly according to an embodiment of the present application.

[0073] An electrical connector according to an embodiment of the present application is provided as follows, Figures 1 to 5As shown in the drawings, the electrical connector comprises a heat sink housing 2, a heat conducting assembly 11 and a plurality of electrical connecting assemblies 12. The heat sink housing 2 has a receiving space through in the insertion direction, which is adapted to be mounted on the cold plate 1 of the dilution refrigerator of the superconducting quantum computer. The heat conducting assembly 11 is mounted in the receiving space and comprises a plurality of heat conducting insulation sheets 6 arranged in parallel and spaced apart. The plurality of electrical connecting assemblies 12 are respectively mounted in two adjacent heat conducting insulation sheets 6 and are configured to respectively electrically connect a plurality of terminals of two plugs 31 (see Figure 9 and Figure 16 , Figure 9 and Figure 16 below) inserted into the receiving space in opposite directions, and to transfer the heat of the terminals through the heat conducting insulation sheets 6 and the heat sink housing 2 to the cold plate 1.

[0074] According to an embodiment of the present application, as Figures 2-5 and Figure 10 shown in the drawings (described in detail below), the heat sink housing 2 comprises a main body 21, a mounting portion 22 and two mounting lugs 23. The main body 21 has a receiving space through in the insertion direction of the plug 31, and a plurality of first through holes 24 are formed on the side wall of the main body 21, and the heat conducting assembly 11 is mounted in the receiving space by means of bolts passing through the plurality of first through holes 24. The main body 21 extends to both sides along the insertion direction to form two mounting portions 22, and a second through hole 25 is formed on each mounting portion 22 to facilitate the connection of the two plugs 31 inserted into the receiving space to the mounting portion 22 by means of bolts. The main body 21 extends to both sides along the length direction to form two mounting lugs 23, and a third through hole 26 is formed on each mounting lug 23, and the main body 21 is mounted on the cold plate 1 of the dilution refrigerator of the superconducting quantum computer by means of bolts passing through the third through holes 26 of the two mounting lugs 23.

[0075] According to an embodiment of the present application, a plurality of weight reduction holes are further formed on the main body 21 to meet the design requirement of light weight mounted on the cold plate 1 of the dilution refrigerator.

[0076] According to an embodiment of the present application, the material of the heat sink housing 2 is oxygen-free copper, and the heat conducting assembly 11 is made of sapphire glass sheet, and the material of the sapphire glass sheet is single crystal aluminum oxide.

[0077] According to an embodiment of the present application, as Figure 2 , Figure 3 , Figure 5As shown, the heat-conducting assembly 11 includes a plurality of parallel and spaced heat-conducting insulating sheets 6, a gap is formed between two adjacent heat-conducting insulating sheets 6, so that a plurality of terminals of two plugs 31 are inserted in opposite directions, the heat-conducting insulating sheets 6 electrically insulate two adjacent terminals, the heat-conducting insulating sheets 6 are made of sapphire glass sheets, which have much better heat-conducting performance than ordinary insulating materials at low temperatures, and have better heat-conducting performance while ensuring insulation. A plurality of electrical connection assemblies 12 are respectively installed in the gaps between two adjacent heat-conducting insulating sheets 6, respectively electrically connecting a plurality of terminals of two plugs 31 inserted in opposite directions in the accommodation space, and transmitting heat of the terminals to the cold plate 1 through the heat-conducting insulating sheets 6 and the heat sink shell 2, so that the cold plate 1 can fully cool a plurality of terminals of two plugs 31 through the heat-conducting insulating sheets 6 and the heat sink shell 2.

[0078] According to an embodiment of the present application, a plurality of fourth through holes 110 are formed in the positions of the plurality of first through holes 24 corresponding to the side wall of the main body 21 on each heat-conducting insulating sheet 6, so as to be installed in the accommodation space by screws, and the material of the screws can be selected as oxygen-free copper.

[0079] Figure 6 is a perspective view of an electrical connection assembly according to an embodiment of the present application, Figure 7 is a side view of an electrical connection assembly according to an embodiment of the present application, Figure 8 is Figure 7 is a sectional view in the direction of D-D.

[0080] According to an embodiment of the present application, as shown in Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8 , each electrical connection assembly 12 includes a support shell 10, a first heat-conducting block 8 and an elastic sheet 9. The support shell 10 is formed by bending and folding a single piece of material and has a U-shaped cross section. The support shell 10 is installed between two adjacent heat-conducting insulating sheets 6 and is configured to receive terminals of the plugs 31. The first heat-conducting block 8 is disposed in the support shell 10 and is configured to electrically connect the terminals of the two plugs 31 to achieve electrical connection between the two terminals and transmit heat of the terminals to the heat-conducting insulating sheets 6 through the support shell 10. The elastic sheet 9 is disposed between the first heat-conducting block 8 and the bottom of the support shell 10, so that the first heat-conducting block 8 adheres to the terminals when the terminals are inserted into the support shell 10, achieving good electrical contact between the first heat-conducting block 8 and the terminals.

[0081] According to an embodiment of the present application, the support shell 10 has a U-shaped cross section, the support shell 10 is installed in the gap between two adjacent heat-conducting insulating sheets 6, and a gap is also formed between the two support arms of the support shell 10 and is configured to receive terminals of two plugs 31 inserted in opposite directions in the accommodation space.

[0082] According to the embodiment of the present application, the material of the support shell 10 is niobium-titanium alloy, which can shield electromagnetic interference from the external environment.

[0083] According to the embodiment of the present application, the material of the first heat-conducting block 8 is oxygen-free copper, which is electrically connected with the terminals of the two plugs 31 and transmits the heat of the terminals to the heat-conducting insulating sheet 6 through the support shell 10, and then to the heat sink shell 2 through the heat-conducting insulating sheet 6, and finally to the cold plate 1, so as to cool the terminals of the cold plate 1. Affected by the temperature change of the external environment, the terminals of the two plugs 31 will expand or shrink if they are electrically connected by direct contact, the shape and size of the terminals of the two plugs 31 will become smaller and break, which will affect the use. Therefore, the terminals of the two plugs 31 are electrically connected through the first heat-conducting block 8, and the first heat-conducting block 8 realizes the electrical connection of the terminals of the two plugs 31. At this time, the terminals of the two plugs 31 only have two contact points with the first heat-conducting block 8, which reduces the contact resistance and improves the quality of signal transmission and reduces the loss of signal transmission.

[0084] According to the embodiment of the present application, the elastic sheet 9 is in a wave shape, and the elastic sheet 9 is configured to press the first heat-conducting block 8 against the terminals and make the first heat-conducting block 8 fit the terminals when the terminals are inserted into the gap between the two support arms of the support shell 10, so that the surface of the first heat-conducting block 8 is in full contact with the terminals of the two plugs 31, which ensures better electrical connection and fully transmits the heat of the terminals to the support shell 10 through the first heat-conducting block 8.

[0085] According to the embodiment of the present application, as shown in Figure 7 and Figure 8 , the bottom of the U-shaped support shell 10 is provided with a limiting sheet 101 at both ends in the insertion direction (the upper and lower ends in Figure 7 , which is configured to limit the first heat-conducting block 8 and the elastic sheet 9 between the two support arms of the support shell 10.

[0086] According to the embodiment of the present application, the limiting sheet 101 provided at both ends of the bottom of each support shell 10 can limit the first heat-conducting block 8 and the elastic sheet 9 from moving out of the upper end or the upper end of the support shell 10.

[0087] According to the embodiment of the present application, as shown in Figure 3 , Figure 6 and Figure 7 , the two support arms of each support shell 10 are provided with a limiting sheet 101 at both ends in the insertion direction (the upper and lower ends in Figure 7The upper and lower ends of the support shell 10 are provided with outwardly curved bending portions 100, for example, the bending portions 100 are arc-shaped, and the bending portions 100 are configured to abut against (or hang on) the upper edge and / or the lower edge of one of the two heat-conductive insulation sheets 6 in the insertion direction and the lower edge and / or the upper edge of the other heat-conductive insulation sheet 6 in the state that the support shell 10 is installed between the two adjacent heat-conductive insulation sheets 6.

[0088] According to the embodiment of the present application, by providing the bending portions 100 at the two ends of each support shell 10 in the insertion direction, the support shell 10 can be limited between the two adjacent heat-conductive insulation sheets 6, and the movement of the support shell 10 relative to the heat-conductive insulation sheets 6 in the insertion direction can be prevented during the process of inserting the terminals of the two plugs 31 between the two support arms of the support shell 10. In addition, since the bending portions 100 are arc-shaped, the terminals of the two plugs 31 can be guided to be initially inserted between the two support arms of the support shell 10, and an elastic clamping force is applied to the plugs 31.

[0089] According to the embodiment of the present application, as shown in Figure 8 , the first heat-conductive block 8 has a recess, which is configured to absorb the deformation of the first heat-conductive block 8 due to temperature changes.

[0090] According to the embodiment of the present application, the recess can provide space for the first heat-conductive block 8 to expand or contract in response to temperature changes in the external environment.

[0091] According to the embodiment of the present application, as shown in Figure 5 , the heat-conductive assembly 11 further includes a plurality of limiting members 7, which are respectively arranged between the two adjacent heat-conductive insulation sheets 6 to limit the spacing between the two adjacent heat-conductive insulation sheets 6.

[0092] According to the embodiment of the present application, the plurality of limiting members 7 are respectively arranged between the two adjacent heat-conductive insulation sheets 6, and a plurality of fifth through holes are provided on each limiting member 7 at positions corresponding to the fourth through holes 110 provided on each heat-conductive insulation sheet 6, to allow the screws to pass through. By tightening the screws, the elastic sheet 9 provides a pre-tightening force to the first heat-conductive block 8, and under the elastic action of the elastic sheet 9, the first heat-conductive block 8 is tightly attached to the terminals of the two plugs 31, thereby maintaining good contact even in a low-temperature environment.

[0093] According to the embodiment of the present application, the plurality of limiting members 7 are made of sapphire glass sheets, and the material of the sapphire glass sheets is single-crystal aluminum oxide.

[0094] Figure 9 is a perspective view of a signal transmission device according to an embodiment of the present application, Figure 10 is Figure 9 is a partial enlarged view of B in Figure 11is a side view of a signal transmission device according to an embodiment of the present application, Figure 12 is Figure 11 is a sectional view in the F-F direction, Figure 13 is Figure 12 is a partial enlarged view at C in the middle.

[0095] According to an embodiment of another aspect of the present application, a signal transmission device is provided, as shown in Figure 9 、 Figure 11 and Figure 12 The signal transmission device comprises an electrical connector and two transmission assemblies. Each of the two transmission assemblies comprises a connecting wire 3 and a plug 31 connected to the end of the connecting wire 3. As shown in Figure 10 , the two plugs 31 are inserted into the electrical connector in opposite directions respectively, so that the multiple conductive wires belonging to the two groups of connecting wires 3 are electrically connected respectively.

[0096] According to an embodiment of the present application, as shown in Figure 4 、 Figure 5 and Figure 10 , the screw 13 passes through the first through hole 24 on the side wall of the heat sink shell 2, the fourth through hole 110 of the multiple heat-conducting insulation sheets 6 and the fifth through hole of the multiple limiting members 7, and installs the heat-conducting assembly 11 in the accommodation space.

[0097] According to an embodiment of the present application, as shown in Figures 2 to 8 , when the terminals of the two plugs 31 are inserted into the gap between the two support arms of the support shell 10, the first heat-conducting block 8 is electrically connected to the terminals of the two plugs 31, and the path for conduction between the terminals of the two plugs 31 is shown by the arrows in Figure 13 At this time, the terminals of the two plugs 31 only have two contact points with the first heat-conducting block 8, which reduces the contact resistance, improves the quality of signal transmission, and reduces the loss of signal transmission. Under the elastic action of the elastic sheet 9, the first heat-conducting block 8 tightly abuts against the terminals of the two plugs 31. The first heat-conducting block 8 transmits the heat of the terminals to the heat-conducting insulation sheets 6 through the support shell 10, and then transmits the heat to the heat sink shell 2 through the heat-conducting insulation sheets 6, and finally transmits the heat to the cold plate 1. The cold plate 1 can fully cool the multiple terminals of the two plugs 31.

[0098] According to an embodiment of the present application, the connecting wire 3 in the transmission assembly is the largest heat leakage source of the low-temperature platform. The heat leakage sources mainly include conduction heat leakage, Joule heat, radiation heat leakage and contact heat leakage. Among them, the conduction heat leakage is the heat conduction of the connecting wire material, the conduction heat leakage is the main heat leakage source, the Joule heat is generated when the current passes through the connecting wire 3, the radiation heat leakage is the heat radiation of the surface of the connecting wire 3, and the contact heat leakage is the thermal resistance of the contact surface between the connecting wire 3 and the cold plate 1 and the quantum computing chip.

[0099] Figure 14is a partial enlarged view of the connecting line according to an embodiment of the present application.

[0100] According to an embodiment of the present application, in order to solve the problem of conduction heat leakage, as shown in Figure 12 and Figure 14 Each group of connecting lines 3 further comprises two first shielding layers 32 and a plurality of second shielding layers 33 stacked with each other, according to an embodiment of the present application. The plurality of second shielding layers 33 are arranged in parallel and spaced between the two first shielding layers 32, and each wire 34 is arranged in the space defined by the two first shielding layers 32 and the two adjacent second shielding layers 33.

[0101] According to an embodiment of the present application, when the two first shielding layers 32 and the plurality of second shielding layers 33 are in a superconducting state, the thermal conductivity of the two first shielding layers 32 and the plurality of second shielding layers 33 is significantly reduced compared with the non-superconducting state, which reduces the overall heat leakage, and the connecting line 3 is simple to manufacture and has high reliability.

[0102] According to an embodiment of the present application, the first shielding layer 32 and the second shielding layer 33 are both made of superconducting material and are configured to enter a superconducting state in response to the external environment being reduced to a superconducting transition temperature, so as to shield the external magnetic field.

[0103] According to an embodiment of the present application, when the external environment is reduced to the superconducting transition temperature, the first shielding layer 32 and the second shielding layer 33 enter the superconducting state and have complete diamagnetism, so as to completely shield the external magnetic field interference.

[0104] According to an embodiment of the present application, the superconducting material is any one of niobium, lead, tin, and niobium-titanium alloy.

[0105] According to an embodiment of the present application, some substances have a sudden transition of resistivity to zero and complete diamagnetism when the temperature is lower than a certain value (Tc), which is called a superconducting state, and such substances are called superconducting materials, and Tc is called the transition temperature of the superconducting material. Different superconducting materials have different transition temperatures. For example, the superconducting transition temperature of niobium (Nb) is 9.25 Kelvin (K), that is, -263.9 degrees Celsius (℃), the superconducting transition temperature of lead (Pb) is 7.193 K, and the superconducting transition temperature of niobium-titanium alloy (Nb-Ti) is 9.5 K.

[0106] According to an embodiment of the present application, the superconducting material is preferably a niobium-titanium alloy, which is suitable for the extremely low-temperature environment of the dilution refrigerator, stable in performance and durable. Moreover, the niobium-titanium alloy has high mechanical strength, good deformation resistance and stress resistance, and can effectively shield electromagnetic interference, ensuring the accuracy of signal transmission between the multi-stage cold plate 1 and the quantum computing chip. The first shielding layer 32 and the second shielding layer 33 are both made of the niobium-titanium alloy, which can provide uniform electromagnetic shielding effect. At the same time, the niobium-titanium alloy has low thermal conductivity, reducing the heat conduction of the connecting line 3 and the heat leakage, which can significantly improve the overall performance of the superconducting quantum computer. Under the premise of reducing heat leakage, the same refrigeration power of the original refrigeration platform can install a larger power quantum computing system.

[0107] Figure 15 is a cross-sectional view of a connecting line according to an embodiment of the present application.

[0108] According to an embodiment of the present application, as shown in Figure 15 , the first shielding layer 32 located below each wire 34, the second shielding layer 33 located on both sides of each wire 34, and the first shielding layer 32 located above each wire 34 form a shielding space, and the plurality of shielding spaces shield the plurality of wires 34 from external magnetic fields.

[0109] According to an embodiment of the present application, as shown in Figure 12 and Figure 15 , the plurality of second shielding layers 33 are arranged in parallel on the first shielding layer 32, the plurality of wires 34 are arranged between adjacent two of the plurality of second shielding layers 33, and the plurality of shielding spaces shield the plurality of wires 34 from external magnetic fields. Each wire 34 is independently shielded to ensure uniform shielding effect and effectively reduce electromagnetic interference. Moreover, the plurality of wires 34, which are independently shielded and arranged in parallel, are connected between the multi-stage cold plate 1 and the quantum computing chip, which can effectively control the thermal contraction from the high-temperature region to the low-temperature region, reduce stress concentration, and also reduce the generation of hot spots, ensuring uniform distribution of current in each wire 34, avoiding local overheating or destruction of the superconducting state, and improving the durability of the connecting line 3.

[0110] According to an embodiment of the present application, as shown in Figure 15 , each wire 34 includes a wire core 341 and an insulating layer 342. The insulating layer 342 covers the outer side of the wire core 341, so that the wire core 341 is electrically insulated from the two first shielding layers 32 and the two adjacent second shielding layers 33.

[0111] According to the embodiment of the present application, the wire core 341 is electrically insulated from the two first shielding layers 32 and the two adjacent second shielding layers 33 by the insulating layer 342, which can effectively prevent electrical short circuit, ensure the safety of signal transmission, and reduce signal interference and crosstalk, thereby maintaining the accuracy of signal transmission. In addition, the insulating layer 342 can improve corrosion resistance and maintain chemical stability in the extremely low-temperature environment of the dilution refrigerator, thereby ensuring the long-term reliability of the connecting wire 3.

[0112] According to the embodiment of the present application, the wire core 341 is made of any one of constantan alloy, copper-nickel alloy and copper-chromium alloy.

[0113] According to the embodiment of the present application, the constantan alloy contains 55% copper and 45% nickel, the copper-nickel alloy contains 90% copper and 10% nickel, or 70% copper and 30% nickel, and the copper-chromium alloy contains 98.8% copper and 1.2% chromium, or 99.5% copper and 0.5% chromium.

[0114] According to the embodiment of the present application, the wire core 341 is preferably made of constantan alloy, which has stable resistivity and low thermal conductivity. The lower the thermal conductivity, the weaker the ability to conduct heat. The thermal conductivity of constantan alloy is about 20-30 W / (m·K). If the wire core 341 is made of constantan alloy, the heat loss can be effectively reduced when the signal is transmitted between the multi-stage cold plate 1 and the quantum computing chip, that is, the heat transfer from the high-temperature region to the low-temperature region is reduced, so that the temperature of the low-temperature region is maintained at 10 mK.

[0115] According to the embodiment of the present application, the insulating layer 342 is made of any one of polyurethane, polyimide, polyester imide and polyurethane imide.

[0116] According to the embodiment of the present application, polyurethane has the advantage of good high-frequency resistance, polyimide has the advantages of high temperature resistance and high mechanical strength, and polyurethane imide has good heat resistance and excellent welding performance.

[0117] According to the embodiment of the present application, the insulating layer 342 can also be made of polyester and polyamide.

[0118] According to the embodiment of the present application, as shown in Figure 12 , Figure 14 and Figure 15 , the gap between each wire core 341 and the two adjacent second shielding layers 33 is controlled, and the gap is filled with the insulating layer 342 during the manufacturing process of the connecting wire 3. Figure 14 The first shielding layer 32 and the insulating layer 342 of the wire core 34 are not shown in

[0119] According to the embodiment of the present application, the thickness of the two first shielding layers 32 and each second shielding layer 33 ranges from 0.04 mm to 0.06 mm.

[0120] According to an embodiment of the present application, the thickness of the two first shielding layers 32 and each second shielding layer 33 can be any value in 0.04mm, 0.042mm, 0.044mm, 0.046mm, 0.048mm, 0.05mm, 0.052mm, 0.054mm, 0.056mm, 0.058mm and 0.06mm, etc.

[0121] According to an embodiment of the present application, the thickness of the two first shielding layers 32 and each second shielding layer 33 is preferably 0.05mm.

[0122] According to an embodiment of the present application, each wire 34 is configured in a sheet shape, and the thickness of each wire 34 ranges from 0.04mm to 0.06mm.

[0123] According to an embodiment of the present application, the thickness of each wire 34 can be any value in 0.04mm, 0.042mm, 0.044mm, 0.046mm, 0.048mm, 0.05mm, 0.052mm, 0.054mm, 0.056mm, 0.058mm and 0.06mm, etc.

[0124] According to an embodiment of the present application, the thickness of each wire 34 is preferably 0.05mm.

[0125] According to an embodiment of the present application, each wire 34 is configured in a sheet shape, which can ensure that the first shielding layer 32 located below each wire 34, the second shielding layer 33 located on both sides of each wire 34 and the first shielding layer 32 located above each wire 34 uniformly cover the wire, so that the electromagnetic shielding is more uniform and the shielding effect is better, reducing the interference of electromagnetic signals. Moreover, the parallel arrangement of the sheet-shaped wires 34 enhances the mechanical stability of the wires 34, reduces the deformation and stress caused by temperature changes, and the sheet-shaped wires 34 have better anti-vibration performance, which is suitable for high-precision quantum computing environment. The sheet-shaped wires 34 can reduce the generation of hot spots, ensure the uniform distribution of current in the wires 34, and avoid local overheating or superconducting state destruction. At the same time, the parallel arrangement of the sheet-shaped wires 34 connected between the multi-stage cold plate 1 and the quantum computing chip can effectively control the thermal contraction from the high-temperature region to the low-temperature region, and the sheet structure can better disperse thermal stress and improve the durability of the connecting line 3.

[0126] Figure 16 is a partial enlarged view of E in Figure 9 , showing the plug. Figure 16 Figure 17 is a partial enlarged view of G in Figure 16 , showing the terminal. Figure 17

[0127] ​​According to an embodiment of the present application, as shown in Figures 2 to 17 each plug 31 comprises a support assembly 5 and a second heat-conducting block 4. The support assembly 5 comprises a base 51 and support portions 52 extending parallel to the base 51 and arranged at intervals, and the portions of the connecting wire 3 extending out of the second shielding layer 33 are attached to the side of the support portions 52 facing the first heat-conducting block 8 of the electrical connection assembly 12 to form a terminal 310. The second heat-conducting block 8 is configured to connect the end of the connecting wire 3 to the base 51 through a first connecting member 14 (e.g., a bolt) and to the heat sink housing 2 through a second connecting member 15 (e.g., a bolt) to transfer the heat of the connecting wire 3 to the heat sink housing 2.

[0128] According to an embodiment of the present application, the material of the support assembly 5 is carbon fiber plastic, and the portions of the connecting wire 3 extending out of the second shielding layer 33 are attached to the side of the support portions 52 facing the first heat-conducting block 8 of the electrical connection assembly 12 to form the terminal 310, so as to be inserted into the gap formed between the two support arms of the support housing 10.

[0129] According to an embodiment of the present application, as shown in Figures 14 to 17 the portions of the connecting wire 34 extending out of the second shielding layer 33 can not be cut off near the first shielding layer 32 on the side of the support portions 52.

[0130] According to an embodiment of the present application, the material of the second heat-conducting block 4 is oxygen-free copper, as shown in Figures 2 to 12 the second heat-conducting block 4 connects the end of the connecting wire 3 to the base 51 through the first connecting member 14 and to the heat sink housing 2 through the second connecting member 15 passing through the second through hole 25 of the mounting portion 22 to transfer the heat of the connecting wire 3 to the heat sink housing 2 and then to the cold plate 1.

[0131] According to an embodiment of another aspect of the present application, a dilution refrigerator is provided, as shown in Figure 1 and Figure 2 The dilution refrigerator comprises multiple-stage cold plates 1, a quantum computing chip, and multiple sets of signal transmission devices. The quantum computing chip is arranged below the multiple-stage cold plates 1. The electrical connectors of the signal transmission devices are respectively mounted on the cold plates 1 to realize signal transmission between the multiple-stage cold plates 1 and the quantum computing chip through the signal transmission devices and to transfer the heat of the connecting wires 3 of the signal transmission devices to the cold plates 1 through the electrical connectors.

[0132] According to an embodiment of the present application, as shown in Figure 1 and Figure 14 The multiple sets of signal transmission devices are arranged along the circumference of each stage of the cold plates 1, and the multiple signal transmission devices in each set of signal transmission devices are arranged in parallel. The connecting wires 3 of the signal transmission devices have a high density, and each single connecting wire 34 has a small number of contact points with the electrical connectors, thereby improving the quality of signal transmission.

[0133] According to the embodiments of the present application, the electrical signals between the multi-stage cold plate 1 and the quantum computing chip include control signals, read signals, synchronization signals, calibration signals, monitoring signals, and error correction signals, and the signal transmission between the multi-stage cold plate 1 and the quantum computing chip ensures the normal operation and accurate control of the quantum computing chip. The control signal is a microwave pulse signal for manipulating the state of the quantum bit or a gate signal for controlling the operation of the quantum logic gate. The read signal is a quantum state read signal for reading the state of the quantum bit or a feedback signal generated by reading the result. The synchronization signal is a clock signal for synchronizing the operation of each component in the quantum computing chip or a trigger signal for triggering the measurement process. The calibration signal is a signal for calibrating the frequency of the quantum bit and the coupling strength or a debugging signal for debugging and optimizing the performance of the quantum computing chip. The monitoring signal is a signal for monitoring the temperature of the quantum computing chip or a magnetic field monitoring signal for monitoring the magnetic field around the quantum computing chip. The error correction signal is an error detection signal for detecting errors in the quantum computing process or an error correction signal for correcting detected errors to ensure the accuracy of the calculation result.

[0134] It will be understood by those skilled in the art that features recited in the various embodiments and / or claims of the present application can be combined or integrated in various combinations or arrangements, even if such combinations or arrangements are not expressly disclosed in the present application. In particular, features recited in the various embodiments and / or claims of the present application can be combined and / or integrated in various combinations and / or arrangements without departing from the spirit and teachings of the present application. All such combinations and / or integrations are within the scope of the present application.

[0135] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only the directions of the drawings and are not intended to limit the scope of protection of the present application. Throughout the drawings, the same elements are represented by the same or similar reference numerals. When the conventional structure or configuration may cause confusion in understanding the present application, it will be omitted, and the shape and size of the components in the drawings do not reflect the actual size and ratio, but only illustrate the content of the embodiments of the present application.

[0136] Unless otherwise known as the opposite meaning, the numerical parameters in the specification and the appended claims are approximate values, which can be changed according to the desired characteristics obtained by the content of the present application. Specifically, all the numbers used in the specification and claims to express the content of the composition, reaction conditions, etc. should be understood as being modified by the term "about" in all cases. Generally, it means that it includes a variation of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, ±0.5% in some embodiments from the specified number.

[0137] The use of ordinal numbers such as "first", "second", "third" and the like in the description and claims is used to modify a respective element and does not imply any order or sequence of the elements, or of the steps of the methods, but is merely used to distinguish between two or more elements or steps of the method having the same name.

[0138] Furthermore, the order of the steps of the above-described methods is not limited to the one set forth above but can be changed or rearranged as desired. Also, the above-described embodiments can be used in combination with each other or with other embodiments, based on design and reliability considerations, i.e. features of different embodiments can be freely combined with each other.

[0139] The embodiments of the present application have been described above. However, these embodiments are merely for the purpose of illustration and are not intended to limit the scope of the present application. Although each embodiment has been described above, this does not mean that measures in each embodiment cannot be used advantageously in combination. The scope of the present application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present application, and such substitutions and modifications are intended to fall within the scope of the present application.

Claims

1. An electrical connector, characterized by, The heat sink housing has a receiving space through which a cold plate of a dilution refrigerator of a superconducting quantum computer is inserted, and the heat conducting assembly is installed in the receiving space. The heat conducting assembly includes a plurality of heat conducting insulation sheets arranged in parallel. The plurality of electrical connection assemblies are configured to electrically connect terminals of two plugs inserted into the receiving space in opposite directions, respectively, and transfer heat of the terminals to the cold plate through the heat conducting insulation sheets and the heat sink housing. Each of the electrical connection assemblies includes a support housing having a U-shaped cross section, which is installed between two adjacent heat conducting insulation sheets and configured to receive the terminals of the plugs. A first heat conducting block is disposed in the support housing and configured to electrically connect the terminals of the two plugs and transfer heat of the terminals to the heat conducting insulation sheets through the support housing. An elastic sheet is disposed between the first heat conducting block and a bottom of the support housing to make the first heat conducting block fit the terminals when the terminals are inserted into the support housing. Each of the support housings has two ends provided with limiting sheets bent toward two support arms of the support housing, which are configured to limit the first heat conducting block and the elastic sheet between the two support arms.

2. The electrical connector of claim 1, wherein, The first heat conducting block has a groove configured to absorb deformation of the first heat conducting block due to temperature change.

3. The electrical connector of claim 1, wherein, The heat conducting assembly further includes a plurality of limiting members respectively disposed between two adjacent heat conducting insulation sheets to limit a distance between the two adjacent heat conducting insulation sheets.

4. The electrical connector of any of claims 1-3, wherein, The electrical connector includes: The electrical connector according to any one of claims 1-4; 5. A signal transmission device, characterized by comprising: Two transmission assemblies, each of which includes a connection line and a plug connected to an end of the connection line, and two plugs of the two transmission assemblies are inserted into the electrical connector in opposite directions, respectively, so that a plurality of conductive wires belonging to two groups of the connection lines are electrically connected, respectively. Each of the connection lines further includes: Two first shielding layers stacked with each other; 6. The signal transmission device of claim 5, wherein, A plurality of second shielding layers arranged in parallel between the two first shielding layers, and each of the conductive wires is arranged in a space defined by two adjacent second shielding layers and two first shielding layers. The first shielding layers and the second shielding layers are made of superconducting material and are configured to enter a superconducting state in response to an external environment being lowered to a superconducting transition temperature to shield an external magnetic field. Each of the plugs includes:

7. The signal transmission device of claim 6, wherein, A support assembly including a base and a support portion extending from the base in parallel and arranged in parallel, and a portion of the connection line extending out of the second shielding layer is attached to a side of the support portion facing the first heat conducting block of the electrical connection assembly to form a terminal; 8. The signal transmission device of claim 6, wherein, A second heat conducting block configured to connect an end of the connection line to the base through a first connecting member and to the heat sink housing through a second connecting member to transfer heat of the connection line to the heat sink housing. The cold plate includes: A plurality of stages of cold plates; 9. A dilution refrigerator, characterized by, A quantum computing chip disposed below the plurality of stages of cold plates; ​ ​ A plurality of signal transmission devices according to any one of claims 5-8, an electrical connector of the signal transmission device is respectively mounted on the cold plate to realize signal transmission between the cold plate and the quantum computing chip through the signal transmission device, and heat of a connecting line of the signal transmission device is transmitted to the cold plate through the electrical connector.

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