Power supply device

Abstract

The invention provides a power supply device. The power supply device comprises a shell, a circuit board module, heat-conducting glue, a heat-conducting plate and a plurality of ventilation pipes. The circuit board module is arranged in the shell. And the heat-conducting glue is arranged below the circuit board module and is filled at the bottom of the shell. The heat-conducting plate is arranged below the circuit board module and is embedded in the heat-conducting glue. The plurality of ventilation pipes are contacted with the heat-conducting plate and are embedded in the heat-conducting glue, and two ends of each ventilation pipe are respectively provided with an opening.

Description

TECHNICAL FIELD

[0001] The present application relates to a power supply device, and more particularly to a power supply device with enhanced heat dissipation configuration. BACKGROUND

[0002] The current power supply unit employs a heat dissipation method of designing vents on both sides of the housing of the power supply unit to introduce air flow from one side to take away the heat generated by the internal components of the power supply unit and to discharge the housing from the other side, thereby cooling the power supply unit. However, this heat dissipation method only aims at cooling the internal components, without considering the heat dissipation of the exposed pins of the through-hole package components inserted into the circuit board.

[0003] In view of the above, how to solve the above problems is the direction that the practitioners in the field strive to develop. SUMMARY

[0004] According to an aspect of the present application, a power supply device is provided. The power supply device includes a housing, a circuit board module, a thermal conductive glue, a thermal conductive plate, and a plurality of ventilation pipes. The circuit board module is disposed in the housing. The thermal conductive glue is disposed under the circuit board module and fills the bottom of the housing. The thermal conductive plate is disposed under the circuit board module and is embedded in the thermal conductive glue. The plurality of ventilation pipes are in contact with the thermal conductive plate and are embedded in the thermal conductive glue. Each of the ventilation pipes has an opening at each end.

[0005] The above summary is not intended to represent all aspects of the present application, but rather is intended to provide some examples of some novel aspects and features of the present application. For a more complete understanding of the present application, its objects, features, and advantages, reference is made to the detailed description of the preferred embodiments along with the accompanying drawings, wherein: BRIEF DESCRIPTION OF DRAWINGS

[0006] In the drawings:

[0007] Figure 1 A perspective view of a power supply device according to an embodiment of the present application;

[0008] Figure 2 A front view of a power supply device according to an embodiment of the present application;

[0009] Figure 3 A side view of a power supply device according to an embodiment of the present application;

[0010] Figures 4A-4FThis is a schematic diagram of the manufacturing process stages of a power supply device according to an embodiment of the present invention;

[0011] In the attached figures, the following labels are used:

[0012] 100: Power supply device;

[0013] 110: Shell;

[0014] 110B: Bottom wall;

[0015] 110E1: Air inlet;

[0016] 110E2: Air outlet;

[0017] 110F: Anterior wall;

[0018] 110R: Rear wall;

[0019] 110T: Top wall;

[0020] 120: Circuit board module;

[0021] 121: Circuit board;

[0022] 122: Electronic components;

[0023] 122P: Pin;

[0024] 130: Thermal conductive adhesive;

[0025] 140: Heat-conducting plate;

[0026] 150: Ventilation duct;

[0027] 160: Fan module;

[0028] D1, D2: Distance;

[0029] J1, J2: Jig;

[0030] L 121 ,L 130 :length;

[0031] OP: Opening. Detailed Implementation

[0032] The embodiments of the present invention will be described in detail below, with reference to the accompanying drawings. In addition to these detailed descriptions, the present invention can be widely implemented in other embodiments, and any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of the present invention and are subject to the following patent claims.

[0033] In the description of this invention, many specific details are provided to give the reader a more complete understanding of the invention; however, the invention may still be practiced with some or all of these specific details omitted. Furthermore, well-known common steps or elements are not described in the details to avoid creating unnecessary limitations on the invention. Identical or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only and do not represent the actual size or number of elements unless otherwise specified.

[0034] Please refer to Figures 1-3 , Figure 1 This is a perspective view of a power supply device 100 according to an embodiment of the present invention. Figure 2 This is a front view schematic diagram of the power supply device 100, and Figure 3 This is a side view of the power supply device 100.

[0035] The power supply unit 100 is, for example, a power supply unit (PSU) used in a computing server, with a power supply wattage of up to 3.2kW, thus requiring corresponding heat dissipation measures. The power supply unit 100 may include a housing 110, a circuit board module 120, thermally conductive adhesive 130, a heat-conducting plate 140, and multiple ventilation ducts 150. The housing 110 is not completely enclosed; it may have air inlets and outlets (i.e., air inlet 110E1 and air outlet 110E2 as shown in Figures 4A-4F) on its front and rear sides to facilitate heat dissipation of its internal components through convection. The circuit board module 120, thermally conductive adhesive 130, heat-conducting plate 140, and ventilation ducts 150 are all disposed within the housing 110. The thermally conductive adhesive 130 is disposed below the circuit board module 120 and fills the bottom of the housing 110. For example, the thermally conductive adhesive 130 may be a silicone potting compound, epoxy resin potting compound, or polyurethane potting compound. A heat-conducting plate 140 is disposed below the circuit board module 120 and embedded in thermally conductive adhesive 130. For example, the heat-conducting plate 140 may be made of a metal material, such as an aluminum sheet, but is not limited thereto, to provide better thermal conductivity. A plurality of ventilation ducts 150 are in contact with the heat-conducting plate 140 and embedded in the thermally conductive adhesive 130. Specifically, each ventilation duct 150 has openings OP at both ends to allow airflow within it and to carry away heat. For example, the ventilation duct 150 may be an aluminum duct or a ceramic duct to provide better thermal conductivity.

[0036] The power supply unit 100 may further include a fan module 160. The fan module 160 is disposed within the housing 110. The fan module 160 is configured to be located in front of a plurality of ventilation ducts 150, i.e., adjacent to the air inlet 110E1 of the power supply unit 100. Forced convection is achieved through the fan module 160 to cool the electronic components on the circuit board module 120, and the heat is dissipated through the air outlet of the power supply unit 100. For example, the circuit board module 120 may include a circuit board 121 and at least one electronic component 122, with thermally conductive adhesive 130 disposed beneath the circuit board 121, and the electronic component 122 mounted to the circuit board 121 via through-hole mounting. Specifically, the electronic component 122 is a dual in-line package (DIP) component. The pins 122P of the electronic component 122 inserted into the circuit board 121 are embedded in the thermally conductive adhesive 130.

[0037] It should be understood that the circuit board 121 of the circuit board module 120 can house multiple dual in-line package (DIP) components, such as electronic components 122, and the pins of these DIP components can be embedded in thermally conductive adhesive 130. In this way, the thermally conductive adhesive 130 can absorb the heat emitted by the DIP components on the circuit board 121 by contacting these pins, and then transfer the heat to the ventilation duct 150 embedded therein. Furthermore, the heat-conducting plate 140 embedded in the thermally conductive adhesive 130 can also absorb the heat from the thermally conductive adhesive 130 and then transfer the heat to the ventilation duct 150 it contacts. Then, the airflow generated by the fan module 160 can pass through the ventilation duct 150 through the opening OP to carry away the heat transferred to the ventilation duct 150 by the thermally conductive adhesive 130 and the heat-conducting plate 140. This achieves enhanced heat dissipation for the pins of the DIP components.

[0038] In this embodiment, the ventilation pipe 150 is disposed above the heat-conducting plate 140, that is, on the upper surface of the heat-conducting plate 140. Further, in this embodiment, the ventilation pipes 150 are spaced apart on the heat-conducting plate 140. In other possible embodiments, the ventilation pipes 150 may also be disposed below the heat-conducting plate 140, that is, on the lower surface of the heat-conducting plate 140, as long as the configuration condition of the ventilation pipes 150 contacting the heat-conducting plate 140 is met. In this embodiment, there is a distance D1 between the ventilation pipe 150 and the circuit board 121 to avoid interference between the ventilation pipe 150 and the pins of the dual in-line package (DIP) components. In this embodiment, the ventilation pipe 150 is a straight pipe with a square opening OP. However, it is not limited to this; in other possible embodiments, the ventilation pipe 150 may also be a curved pipe with a circular opening OP.

[0039] In this embodiment, a distance D2 is provided between the heat-conducting plate 140 and the bottom wall 110B of the housing 110, so that the heat-conducting plate 140 is covered with thermally conductive adhesive 130 on both the top and bottom, thereby increasing the effect of the heat-conducting plate 140 in absorbing the heat from the thermally conductive adhesive 130. In this embodiment, as... Figure 3 As shown in the side view, the thermally conductive adhesive 130 maintains a space between itself and the front wall 110F and the rear wall 110R of the housing 110, meaning the thermally conductive adhesive 130 does not completely fill the bottom of the housing 110, thus preserving space for the air intake and exhaust of the power supply device 100. Furthermore, in this embodiment, as shown... Figure 3 As shown in the side view, the length L of the circuit board 121 121 Length L greater than 130mm of thermal conductive adhesive 130 The section of the circuit board 121 that protrudes from the front of the thermally conductive adhesive 130 provides a mounting location for the fan module 160.

[0040] Please refer to Figures 4A-4F This is a schematic diagram of the manufacturing process of the power supply device 100. The following is in conjunction with... Figures 4A-4F Explain the configuration of the power supply device 100.

[0041] First, such as Figure 4A As shown, the top wall 110T of the housing 110 can be removed first, and two fixtures J1 can be placed inside the housing 110. These two fixtures J1 are respectively positioned adjacent to the air inlet 110E1 and air outlet 110E2 of the housing 110. Then, thermally conductive adhesive 130 is poured in, filling the area defined by the housing 110 and the two fixtures J1. Next, as... Figures 4B-4C As shown, another fixture J2 can be placed on top of the thermally conductive adhesive 130 to fix the height of the thermally conductive adhesive 130. Then, as... Figure 4D As shown, take out the jig J2 and place the heat-conducting plate 140 and multiple ventilation pipes 150 on the heat-conducting adhesive 130. In this embodiment, the heat-conducting plate 140 is placed first, and then the ventilation pipes 150 are positioned on the heat-conducting plate 140. Next, as... Figure 4E As shown, the thermally conductive adhesive 130 is poured in again until it completely covers the heat-conducting plate 140 and the ventilation pipe 150, so that the heat-conducting plate 140 and the ventilation pipe 150 are embedded in the thermally conductive adhesive 130. Due to the presence of the two fixtures J1, it is ensured that the thermally conductive adhesive 130 will not enter the front and rear openings OP of the ventilation pipe 150, thus maintaining unobstructed airflow in the ventilation pipe 150. Then, as... Figure 4F As shown, remove the second fixture J1 and place it onto the thermally conductive adhesive 130 on the circuit board module 120. Then, install the fan module 160 into the housing 110. Finally, reassemble the top wall 110T of the housing 110, resulting in the desired appearance. Figure 1 The power supply device 100 shown is in its finished product state.

[0042] Based on the above description, this invention proposes a novel power supply device that, through the use of thermally conductive adhesive and the embedded heat-conducting plate and ventilation duct, further combines with a fan module to provide forced convection, thereby enhancing heat dissipation for the pins of through-hole electronic components. Thus, compared to conventional heat dissipation configurations, this invention can further improve the heat dissipation efficiency of the power supply device and effectively reduce the temperature of electronic components.

[0043] In summary, although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A power supply device, characterized in that, include: A shell; A circuit board module is housed within the housing; A thermally conductive adhesive is applied to the circuit board module and fills the bottom of the housing; A heat-conducting plate is disposed on the circuit board module and embedded in the thermally conductive adhesive; as well as Multiple ventilation ducts are in contact with the heat-conducting plate and embedded in the heat-conducting adhesive, wherein each ventilation duct has an opening at both ends.

2. The power supply device as described in claim 1, characterized in that, Including: A fan module is disposed within the housing and located in front of the ventilation ducts.

3. The power supply device as described in claim 1, characterized in that, These ventilation ducts are spaced apart on the heat-conducting plate.

4. The power supply device as described in claim 1, characterized in that, These ventilation ducts are spaced apart below the heat-conducting plate.

5. The power supply device as described in claim 1, characterized in that, The circuit board module includes a circuit board, and the ventilation ducts are spaced apart from the circuit board.

6. The power supply device as described in claim 1, characterized in that, There is a distance between the heat-conducting plate and the bottom wall of the housing.

7. The power supply device as claimed in claim 1, characterized in that, The thermally conductive adhesive maintains a space between itself and a front wall and a rear wall of the housing.

8. The power supply device as described in claim 1, characterized in that, The circuit board module includes a circuit board, and the thermally conductive adhesive is disposed under the circuit board. In a side view, the length of the circuit board is greater than the length of the thermally conductive adhesive.

9. The power supply device as claimed in claim 1, characterized in that, The circuit board module includes an electronic component and a circuit board. The electronic component is mounted on the circuit board via through-hole mounting, and the pins of the electronic component that are inserted into the circuit board are embedded in the thermally conductive adhesive.

10. The power supply device as claimed in claim 9, characterized in that, The thermally conductive adhesive is configured to absorb the heat emitted by the electronic component by contacting the pins of the electronic component and then transfer it to the ventilation ducts.

11. The power supply device as claimed in claim 10, characterized in that, The heat-conducting plate is configured to absorb the heat from the thermally conductive adhesive and then transfer it to the ventilation ducts.

12. The power supply device as claimed in claim 1, characterized in that, The thermally conductive adhesive is selected from silicone grease potting compound, epoxy resin potting compound, or polyurethane potting compound.

13. The power supply device as claimed in claim 1, characterized in that, The heat-conducting plate is made of metal.

14. The power supply device as claimed in claim 1, characterized in that, The housing has an air inlet and an air outlet, which are respectively located on the front and rear sides of the housing.

15. The power supply device as claimed in claim 14, characterized in that, Including: A fan module is located near the air inlet.

16. The power supply device as described in claim 2 or 15, characterized in that, The fan module is configured to generate airflow through the openings and ventilation ducts to carry away heat from the ventilation ducts.

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