Method, apparatus, device and medium for selecting optical element polishing abrasive

Abstract

The application discloses a kind of polishing abrasive selection method, device, equipment and medium of optical element, it is related to optical element processing field, comprising: based on the characteristics of optical element substrate material, preliminary screening is carried out to candidate polishing abrasive library;Atomic level interface model between polishing abrasive and optical element substrate is constructed;The contact state and interface reaction behavior of polishing abrasive atomic cluster and optical element substrate atomic cluster in polishing scene are simulated using the model, obtain the bonding characteristics and binding energy variation data of polishing abrasive atomic cluster and optical element substrate atomic cluster, to carry out quantitative ordering to the interface reaction activity of polishing abrasive atomic cluster and optical element substrate atomic cluster, generate polishing abrasive priority list.This can significantly improve the screening efficiency of polishing abrasive, shorten the material development cycle, reduce experimental cost, in-depth analysis of the interface interaction mechanism between polishing abrasive and optical element, provide theoretical basis for the discovery and optimization of new polishing abrasive.

Description

Technical Field

[0001] This invention relates to the field of optical element processing, and in particular to a method, apparatus, equipment and medium for selecting polishing abrasives for optical elements. Background Technology

[0002] With the continuous development of high-performance optical systems, the surface precision requirements for optical components are becoming increasingly stringent, especially in terms of surface roughness. Obtaining optical component surfaces with ultra-low roughness and high surface accuracy has become one of the core technological bottlenecks for improving optical system performance. The formation process of optical component surface quality is closely related to the polishing process and the selection of polishing abrasives used.

[0003] Commonly used ultra-smooth surface processing techniques primarily rely on contact polishing, which improves surface shape through the relative sliding between the polishing tool and the workpiece surface. The removal mechanism falls under the category of chemical mechanical polishing. The abrasives used in ultra-smooth polishing liquids for optical components are often selected based on processing experience: repeated polishing experiments are conducted using the controlled variable method to compare the material removal rate and post-polishing surface quality of different abrasives under the same process conditions. However, this method requires extensive process experiments, resulting in lengthy abrasive selection cycles, low efficiency, and difficulty in scientifically evaluating the interfacial reactivity of the abrasives and its impact on the final polishing effect. Summary of the Invention

[0004] The purpose of this invention is to provide a method, apparatus, equipment and medium for selecting polishing abrasives for optical components, which can significantly improve the screening efficiency of polishing abrasives, shorten the material development cycle, reduce costs, and conduct in-depth analysis of interfacial chemical interactions between materials, thus promoting mechanism research.

[0005] To address the aforementioned technical problems, this invention provides a method for selecting polishing abrasives for optical components, comprising:

[0006] Based on the characteristics of the substrate material of optical components, a preliminary screening of the candidate polishing abrasive library was conducted.

[0007] Based on the initially selected polishing abrasives, an atomic-level interface model between the polishing abrasives and the optical component substrate was constructed.

[0008] The atomic-level interface model was used to simulate the contact state and interface reaction behavior of polishing abrasive atom clusters and optical element substrate atom clusters in a polishing scenario, and to obtain the bonding characteristics and binding energy change data of polishing abrasive atom clusters and optical element substrate atom clusters.

[0009] Based on the obtained bonding characteristics and binding energy change data, the interfacial reactivity of polishing abrasive atomic clusters and optical element substrate atomic clusters is quantified and ranked to generate a priority list of polishing abrasives.

[0010] In a first aspect, in the above-mentioned method for selecting polishing abrasives for optical elements provided by the present invention, an atomic-level interface model between the polishing abrasive and the optical element substrate is constructed based on the initially selected polishing abrasive, including:

[0011] Based on the chemical composition of the initially screened polishing abrasives, representative atomic clusters are generated, and a polishing abrasive atomic cluster model is constructed based on the representative atomic clusters.

[0012] Simulate the microstructure of the substrate surface of optical components and construct an atomic cluster model of the substrate surface of optical components;

[0013] Based on the constructed atomic cluster model of the polishing abrasive and the atomic cluster model of the optical element substrate surface, an atomic-level interface model between the polishing abrasive and the optical element substrate is formed.

[0014] On the other hand, in the above-mentioned method for selecting polishing abrasives for optical components provided by the present invention, the atomic-level interface model is used to simulate the contact state and interface reaction behavior of the polishing abrasive atom clusters and the optical component substrate atom clusters in the polishing scenario, and to obtain the bonding characteristics and bonding energy change data of the polishing abrasive atom clusters and the optical component substrate atom clusters, including:

[0015] In the atomic-level interface model, the electron density distribution, interatomic forces and energy changes at the interface between the polishing abrasive atom cluster and the optical element substrate atom cluster are processed by density functional theory to simulate the contact configuration of the polishing abrasive atom cluster and the optical element substrate atom cluster in the polishing scenario, and restore the spatial arrangement and interaction state of the interface atoms.

[0016] By tracing the electron transfer paths and bonding changes during the reaction process using density functional theory, the interfacial reaction behavior between polishing abrasive atomic clusters and optical component substrate atomic clusters in a polishing scenario is simulated.

[0017] Quantum chemical methods were used to obtain the bonding characteristics and binding energy changes of polishing abrasive clusters and optical element substrate clusters.

[0018] On the other hand, in the above-mentioned method for selecting polishing abrasives for optical elements provided by the present invention, the interfacial reactivity of the polishing abrasive atomic clusters and the optical element substrate atomic clusters is quantitatively ranked based on the obtained bonding characteristics and bonding energy change data, including:

[0019] Based on the obtained bonding characteristics and binding energy change data, calculate the binding energy of the reaction;

[0020] Based on the sign and magnitude of the binding energy of the reaction, the interfacial reaction activity between the polishing abrasive atomic clusters and the optical element substrate atomic clusters is determined.

[0021] The determined interfacial reactivity is quantified and ranked, and based on the quantification and ranking results, the initially screened polishing abrasives are prioritized to generate a priority list of polishing abrasives.

[0022] On the other hand, in the above-mentioned method for selecting polishing abrasives for optical elements provided by the present invention, the interfacial reaction activity between the polishing abrasive atomic clusters and the optical element substrate atomic clusters is determined based on the sign and magnitude of the binding energy of the reaction, including:

[0023] When the binding energy of the reaction is negative, it is determined that energy needs to be released when the polishing abrasive atomic clusters and the optical element substrate atomic clusters combine to form a composite system. The reaction has a spontaneous tendency, and the larger the absolute value of the binding energy of the reaction, the more energy is released and the higher the interfacial reactivity.

[0024] When the binding energy of a reaction is positive, it indicates that the reaction requires the absorption of external energy to start. The larger the absolute value of the binding energy, the more energy is absorbed and the lower the interfacial reactivity.

[0025] On the other hand, the method for selecting polishing abrasives for optical elements provided by the present invention further includes:

[0026] Based on the prioritization list of polishing abrasives, a polishing experiment plan is generated;

[0027] Among them, experimental numbers were assigned, and the type of abrasive corresponding to each group of experiments was determined;

[0028] Set uniform processing parameters and convert the processing parameters into instruction codes that can control the polishing equipment;

[0029] Generate an experimental record template; the experimental record template includes the indicators to be measured and the data entry format.

[0030] On the other hand, the method for selecting polishing abrasives for optical elements provided by the present invention further includes:

[0031] Collect polishing experiment results; the polishing experiment results include material removal rate and surface roughness value;

[0032] The polishing experiment results were compared with the simulation results;

[0033] If the deviation between the polishing experiment results and the simulation results exceeds a preset threshold, the parameters of the atomic-level interface model are adjusted or the experimental conditions are corrected until the consistency between the polishing experiment results and the simulation results meets the set requirements, and the optimal polishing abrasive scheme after verification is output.

[0034] To address the aforementioned technical problems, the present invention also provides a device for selecting polishing abrasives for optical elements, comprising:

[0035] The abrasive screening module is used to perform preliminary screening of the candidate polishing abrasive library based on the characteristics of the optical component substrate material;

[0036] The model building module is used to construct an atomic-level interface model between the polishing abrasive and the optical component substrate based on the initially selected polishing abrasive.

[0037] The simulation module is used to simulate the contact state and interface reaction behavior of polishing abrasive atom clusters and optical element substrate atom clusters in the polishing scene using the atomic-level interface model, and to obtain the bonding characteristics and binding energy change data of polishing abrasive atom clusters and optical element substrate atom clusters.

[0038] The quantization and sorting module is used to quantify and sort the interfacial reactivity of polishing abrasive atomic clusters and optical element substrate atomic clusters based on the acquired bonding characteristics and binding energy change data, and generate a priority list of polishing abrasives.

[0039] To address the aforementioned technical problems, the present invention also provides an electronic device, comprising:

[0040] Memory, used to store computer programs;

[0041] A processor is used to execute the computer program to implement the steps of the above-described method for selecting polishing abrasives for optical elements.

[0042] To address the aforementioned technical problems, the present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-described method for selecting polishing abrasives for optical elements.

[0043] The beneficial effects of this invention are as follows: The method for selecting polishing abrasives for optical components provided by this invention first performs preliminary screening of a candidate polishing abrasive library based on the characteristics of the optical component substrate material. Then, based on the preliminarily screened polishing abrasives, an atomic-level interface model between the polishing abrasive and the optical component substrate is constructed. The atomic-level interface model simulates the contact state and interface reaction behavior of the abrasive and substrate atomic clusters in the polishing scenario, and obtains bonding characteristics and binding energy change data. It can theoretically complete the quantitative ranking of interface reaction activity and generate a priority list of polishing abrasives without relying on a large number of preliminary experiments. This not only significantly improves the screening efficiency of polishing abrasives, reduces the number of blind experiments, reduces experimental costs and human intervention, but also effectively shortens the abrasive development cycle. Secondly, by simulating the microscopic reaction process in the polishing scenario, this method deeply analyzes the interface interaction mechanism between the abrasive and the optical component substrate. It can accurately and quantitatively analyze the interface interaction strength and reaction trend of different abrasives and substrates, and predict the polishing performance of the abrasive before the experiment. This provides a solid theoretical basis for the discovery and optimization of new polishing abrasives, promotes the in-depth research on the chemical interaction mechanism of the polishing interface, and ultimately helps the systematic development of new high-performance polishing abrasives.

[0044] In addition, the present invention also provides a corresponding optical element polishing abrasive selection device, electronic device and computer-readable storage medium for the optical element polishing abrasive selection method, which have the same or corresponding technical features as the optical element polishing abrasive selection method mentioned above, and have the same effect. Attached Figure Description

[0045] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 A flowchart illustrating the method for selecting polishing abrasives for optical components provided in an embodiment of the present invention;

[0047] Figure 2 This is a schematic diagram illustrating the effect of cerium oxide polishing abrasives of different valence states on the micro-interface of fused silica optical elements, as provided in an embodiment of the present invention.

[0048] Figure 3 A schematic diagram showing the quantum chemical calculation results of two systems provided in the embodiments of the present invention;

[0049] Figure 4 A schematic diagram showing the content of cerium elements in different valence states in two cerium oxide polishing abrasives provided in the embodiments of the present invention;

[0050] Figure 5This is a schematic diagram illustrating the material removal rate and surface roughness of the same fused silica optical element surface using two different polishing abrasives provided in an embodiment of the present invention.

[0051] Figure 6 This is a schematic diagram illustrating the effect of different polishing abrasives on the micro-interface of nickel-phosphorus alloy optical elements according to embodiments of the present invention;

[0052] Figure 7 A schematic diagram showing the quantum chemical calculation results of three interaction systems provided in the embodiments of the present invention;

[0053] Figure 8 This is a schematic diagram illustrating the material removal rate and surface roughness of the same nickel-phosphorus alloy optical element surface using three different polishing abrasives provided in this embodiment of the invention.

[0054] Figure 9 A schematic diagram of the structure of the optical element polishing abrasive selection device provided in an embodiment of the present invention. Detailed Implementation

[0055] With the development of high-performance optical systems, the requirements for the surface precision of optical components are becoming increasingly stringent, especially in terms of surface roughness. Optical components are required to achieve ultra-smooth surfaces (RMS < 1 nm), or even sub-nanometer (e.g., 0.5 nm) or picometer (< 100 pm) RMS roughness. Optical components with ultra-smooth surfaces are widely used in high-power lasers, deep ultraviolet lithography, optical fibers, aerospace camera windows, catadioptric optical systems, and other high-precision fields. Their surface quality directly affects the imaging quality, beam transmission efficiency, focusing ability, and power handling capacity of the system, becoming a key factor determining the overall performance of the optical system. Obtaining optical component surfaces with ultra-low roughness and high surface accuracy has become one of the core technological bottlenecks for improving the performance of optical systems. The formation process of optical component surface quality is closely related to the polishing process and the selection of polishing abrasives. How to achieve high-efficiency, low-damage, and low-roughness surface processing has become a key issue in ultra-smooth optical manufacturing technology. Commonly used ultra-smooth surface processing technologies mainly include Computer Controlled Optical Surfacing (CCOS), Magnetorheological Finishing (MRF), CNC small-head polishing, and Ion Beam Figuring (IBF). Except for Ion Beam Figuring, the other three methods are all contact polishing methods, improving the surface shape through the relative sliding of the polishing tool and the workpiece surface, and their removal mechanisms all fall under the category of Chemical Mechanical Polishing (CMP).

[0056] Chemical mechanical polishing (CMP) is an ultra-precision machining technique that combines chemical reactions with mechanical friction, widely used for global planarization, surface quality improvement, and local defect repair. The substrate to be polished is fixed on a machine tool carrier, and the polishing pad is fixed on a polishing disc. Pressure is applied to bring the polishing pad into contact with the substrate surface, while polishing fluid is continuously supplied to the contact interface. By adjusting the rotational speed and pressure of the polishing disc at different positions, ultra-precision removal and planarization of the substrate surface are achieved. The mechanism of CMP is complex, involving both mechanical cutting and friction between the abrasive grains and the substrate, as well as interfacial chemical reactions. The synergistic effect of these two processes is key to achieving ultra-smooth surface quality. However, current ultra-smooth polishing fluids for optical components rely heavily on processing experience for abrasive selection. Polishing experiments are repeatedly conducted using the controlled variable method to compare the material removal rate and post-polishing surface quality of different abrasives under the same conditions. However, this method requires extensive process experiments, has a long cycle for obtaining the optimal polishing abrasive, lacks systematic theoretical guidance, and makes it difficult to scientifically evaluate the interfacial reactivity of the abrasive and its impact on the final polishing effect. This limits the development efficiency of high-performance polishing fluids and fails to meet the demands of rapid and high-precision manufacturing of new optical components. To address this technical problem, the present invention provides a method for selecting polishing abrasives for optical elements.

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0058] It should be noted that, in the description of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., used in this invention are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0059] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] The specific application environment architecture or specific hardware architecture on which the method for selecting polishing abrasives for optical components depends is described here.

[0061] The embodiments of the present invention provide a method for selecting polishing abrasives for optical components. The method is described in detail below, in conjunction with the execution flow of the method for selecting polishing abrasives for optical components. Figure 1 A flowchart of the method for selecting polishing abrasives for optical elements provided in the embodiments of the present invention is shown below. Figure 1 As shown, the method includes:

[0062] S101. Based on the characteristics of the substrate material of optical components, a preliminary screening of the candidate polishing abrasive library is conducted.

[0063] It should be noted that this invention can preliminarily screen the candidate polishing abrasive library based on the characteristics of the optical element substrate material (such as hardness, chemical stability, crystal structure, etc.) to pre-select suitable polishing abrasives applicable to optical elements made of specific materials. By eliminating types that are severely mismatched with the substrate characteristics, abrasives that meet the specific substrate requirements in terms of hardness compatibility and chemical compatibility are initially locked from the library. This avoids redundant calculations in subsequent steps and lays the foundation for accurate screening.

[0064] S102. Based on the initially selected polishing abrasives, construct an atomic-level interface model between the polishing abrasives and the optical element substrate.

[0065] In practice, constructing an atomic-level interface model based on the initially selected polishing abrasives is a key link in shifting from macroscopic abrasive screening to microscopic interaction analysis. It takes abrasives that meet the compatibility criteria as the object, and restores the spatial arrangement and atomic composition ratio of abrasive atomic clusters and substrate atomic clusters according to the actual polishing scenario. It transforms the abstract abrasive-substrate interaction into a quantifiable and calculable microscopic model, providing a concrete computational carrier for subsequent simulation of contact states and analysis of interface reaction behavior.

[0066] S103. Using an atomic-level interface model, simulate the contact state and interface reaction behavior of polishing abrasive atom clusters and optical element substrate atom clusters in a polishing scenario, and obtain the bonding characteristics and bonding energy change data of polishing abrasive atom clusters and optical element substrate atom clusters.

[0067] It should be noted that the atomic-level interface model constructed in step S102 is used to simulate the contact state and interface reaction behavior between the abrasive and the substrate atomic cluster. This is to restore the microscopic effects (such as interatomic spacing and stress state) in the polishing scenario through the atomic-level interface model. It can not only intuitively present the spatial configuration when the two are in contact, but also capture key information such as bonding type, bond energy change and binding energy increase and decrease through calculation. It transforms the abstract interface effect into quantifiable bonding characteristics and energy data, providing a core basis for subsequent determination of reaction activity and screening of abrasives.

[0068] S104. Based on the obtained bonding characteristics and binding energy change data, the interfacial reactivity of the polishing abrasive atom clusters and the optical element substrate atom clusters is quantified and ranked to generate a priority list of polishing abrasives.

[0069] In practice, the interface reactivity is quantified and sorted based on the bonding characteristics and binding energy change data obtained in step S103, and an abrasive priority list is generated. The reactivity of suitable abrasives can be ordered by quantitative indicators such as bonding strength, positive and negative binding energy, and magnitude. The abstract microscopic action data is transformed into intuitive abrasive priorities, and the selection direction of the optimal abrasive is determined.

[0070] In the above-mentioned method for selecting polishing abrasives for optical components provided in this invention embodiment, a preliminary screening of the candidate polishing abrasive library is first performed based on the characteristics of the optical component substrate material. Then, based on the preliminarily screened polishing abrasives, an atomic-level interface model between the polishing abrasive and the optical component substrate is constructed. The atomic-level interface model simulates the contact state and interface reaction behavior of the abrasive and substrate atomic clusters in the polishing scenario, and obtains bonding characteristics and binding energy change data. Without relying on a large number of preliminary experiments, the method can theoretically complete the quantitative ranking of interface reaction activity and generate a priority list of polishing abrasives. This not only significantly improves the screening efficiency of polishing abrasives, reduces the number of blind experiments, lowers experimental costs and human intervention, but also effectively shortens the abrasive development cycle. Secondly, by simulating the microscopic reaction process in the polishing scenario, this method deeply analyzes the interface interaction mechanism between the abrasive and the optical component substrate. It can accurately and quantitatively analyze the interface interaction strength and reaction trend of different abrasives and substrates, and predict the polishing performance of the abrasive before the experiment. This provides a solid theoretical basis for the discovery and optimization of new polishing abrasives, promotes the in-depth research on the chemical interaction mechanism of the polishing interface, and ultimately helps the systematic development of new high-performance polishing abrasives.

[0071] Furthermore, in a specific implementation, in the above-mentioned method for selecting polishing abrasives for optical elements provided in the embodiments of the present invention, step S102 constructs an atomic-level interface model between the polishing abrasive and the optical element substrate based on the initially selected polishing abrasive. Specifically, this may include: generating representative atomic clusters based on the chemical composition of the initially selected polishing abrasive; constructing a polishing abrasive atomic cluster model based on the representative atomic clusters; simulating the microstructure of the surface of the optical element substrate to construct an atomic cluster model of the optical element substrate surface; and forming an atomic-level interface model between the polishing abrasive and the optical element substrate based on the constructed polishing abrasive atomic cluster model and the optical element substrate surface atomic cluster model.

[0072] In practice, this invention can generate representative atomic clusters based on the chemical composition of the initially screened abrasives and construct a polishing abrasive atomic cluster model. Then, it can simulate the microstructure of the substrate surface to construct an optical element substrate surface atomic cluster model. Finally, the two are coupled to form an interface model, which not only ensures the accurate reproduction of the microscopic features (such as composition and structure) of the abrasive and the substrate, but also provides an accurate microscopic calculation carrier for subsequent simulation of contact state and reaction behavior.

[0073] Furthermore, in a specific implementation, in the above-mentioned method for selecting polishing abrasives for optical elements provided in the embodiments of the present invention, step S103 uses an atomic-level interface model to simulate the contact state and interface reaction behavior of the polishing abrasive atom clusters and the optical element substrate atom clusters in the polishing scenario, and obtains the bonding characteristics and binding energy change data of the polishing abrasive atom clusters and the optical element substrate atom clusters. Specifically, it may include: in the atomic-level interface model, processing the electron density distribution, interatomic forces and energy changes at the interface between the polishing abrasive atom clusters and the optical element substrate atom clusters using density functional theory (DFT), simulating the contact configuration of the polishing abrasive atom clusters and the optical element substrate atom clusters in the polishing scenario, and restoring the spatial arrangement and interaction state of the interface atoms; tracking the electron transfer path and bonding changes during the reaction process using density functional theory, simulating the interface reaction behavior of the polishing abrasive atom clusters and the optical element substrate atom clusters in the polishing scenario; and using quantum chemical methods to obtain the bonding characteristics and binding energy change data of the polishing abrasive atom clusters and the optical element substrate atom clusters.

[0074] In practice, density functional theory describes the properties of multi-electron systems using electron density, thereby simplifying complex calculations and being used to study the electronic structure, bonding characteristics, and energy changes of molecules, atomic clusters, etc. This invention uses density functional theory as its core calculation method. First, within a pre-constructed atomic-level interface model, appropriate basis sets are used to handle interface electron density, atomic forces, and energy changes, simulating the contact configuration and spatial interaction state between the abrasive and the substrate atomic clusters. Simultaneously, electron transfer and bonding changes are tracked to reconstruct interface reaction behavior. Finally, quantum chemical methods are used to accurately obtain bonding characteristics and binding energy change data, providing reliable microscopic quantitative evidence for subsequent reactivity analysis.

[0075] Furthermore, in a specific implementation, in the above-mentioned method for selecting polishing abrasives for optical elements provided in the embodiments of the present invention, step S104 quantifies and sorts the interfacial reactivity of the polishing abrasive atomic clusters and the optical element substrate atomic clusters based on the obtained bonding characteristics and binding energy change data. Specifically, it may include: calculating the binding energy of the reaction based on the obtained bonding characteristics and binding energy change data; determining the interfacial reactivity of the polishing abrasive atomic clusters and the optical element substrate atomic clusters based on the sign and magnitude of the binding energy of the reaction; quantifying and sorting the determined interfacial reactivity; and, based on the quantification and sorting results, prioritizing the initially screened polishing abrasives to generate a priority list of polishing abrasives.

[0076] In practice, this invention can first calculate the reaction binding energy based on bonding characteristics and energy change data, then determine the interfacial reaction activity by the positive or negative (judging the spontaneous trend of the reaction) and magnitude (quantifying the reaction intensity) of the reaction binding energy, and finally associate the activity quantification and sorting with the initially screened abrasives to generate a priority list, transforming the microscopic calculation data into an intuitive abrasive screening basis, ensuring the practicality and accuracy of the screening results.

[0077] Furthermore, in specific implementation, in the above steps, based on the sign and magnitude of the binding energy of the reaction, the interfacial reactivity of the polishing abrasive atomic clusters and the optical element substrate atomic clusters is determined. Specifically, this may include: when the binding energy of the reaction is negative, it is determined that energy needs to be released when the polishing abrasive atomic clusters and the optical element substrate atomic clusters combine to form a composite system, the reaction has a spontaneous tendency, and the larger the absolute value of the binding energy of the reaction, the more energy is released, and the higher the interfacial reactivity; when the binding energy of the reaction is positive, it is determined that the reaction needs to absorb external energy to start, and the larger the absolute value of the binding energy of the reaction, the more energy is absorbed, and the lower the interfacial reactivity.

[0078] In practice, this invention can first be implemented through bonding analysis and calculation of binding energy changes. ,in, The binding energy of the reaction, The optimized energy for the reaction products. , The energies were optimized separately for the abrasive and the substrate atomic clusters. Then, based on... The sign and absolute value of the value determine the reactivity: when When the value is negative, the reaction releases energy, the system is more stable, the abrasive and the substrate atomic clusters are easier to combine, and the larger the absolute value, the higher the activity; when When the value is positive, the reaction requires energy absorption and the product is unstable. The two are difficult to combine, and the larger the absolute value, the lower the activity. Finally, this rule is used to determine the interfacial reaction activity and bonding characteristics, providing a basis for screening abrasive components and types that are suitable for the surface chemical action and polishing requirements of optical components.

[0079] Furthermore, in specific implementation, the above-mentioned method for selecting polishing abrasives for optical components provided in the embodiments of the present invention may further include: generating a polishing experiment plan based on a priority list of polishing abrasives; wherein, an experiment number is assigned, and the abrasive type corresponding to each group of experiments is determined; uniform processing parameters are set, and the processing parameters are converted into instruction codes that can control the polishing equipment; an experiment record template is generated; the experiment record template includes the indicators to be measured and the data entry format.

[0080] In implementation, after generating a priority list of polishing abrasives, this invention can generate a polishing experiment plan to conduct the polishing experiment: first, the experimental object is determined by assigning an experiment number and corresponding abrasive type; then, uniform processing parameters are set and converted into instruction codes executable by the equipment to ensure experimental consistency. For example, consistent processing conditions (such as time, pressure, speed, etc.) are set, and an experimental record template containing the measured indicators and data entry format is generated to standardize data collection, forming a complete polishing experiment plan. Afterwards, candidate materials can be used to conduct time-limited polishing experiments to minimize interference from other variables.

[0081] Furthermore, in specific implementation, the method for selecting polishing abrasives for optical components provided in the embodiments of the present invention may further include: collecting polishing experiment results; the polishing experiment results include material removal rate and surface roughness value; comparing the polishing experiment results with the simulation results; if the deviation between the polishing experiment results and the simulation results exceeds a preset threshold, adjusting the parameters of the atomic-level interface model or correcting the experimental conditions until the consistency between the polishing experiment results and the simulation results meets the set requirements, and outputting the verified optimal polishing abrasive scheme.

[0082] In practice, this invention can experimentally verify and iteratively optimize the abrasive screening results: first, key results such as material removal rate and surface roughness value in the experiment are collected and compared with the previous simulation results to confirm the consistency of the prediction; if the deviation exceeds the preset threshold, iterative improvement is made by adjusting the atomic-level interface model parameters or correcting the experimental conditions until the consistency between the two reaches the standard, and finally the optimal polishing abrasive scheme verified by experiments is output to ensure that the screening results have both theoretical support and practical feasibility.

[0083] The following uses two application scenarios as examples to illustrate the method for selecting polishing abrasives for optical elements provided by this invention.

[0084] The first application scenario is applicable to the selection and performance comparison of cerium oxide polishing abrasives with different valence states in the ultra-smooth polishing of fused silica optical components. The specific implementation process is as follows:

[0085] First, we constructed interface reaction models for two different valence states of cerium oxide polishing abrasives and fused silica optical elements, corresponding to the microscopic interaction systems of trivalent and tetravalent cerium oxides, respectively. Figure 2 This diagram illustrates the interaction between cerium oxide polishing abrasives of different valence states and the microscopic interfaces of fused silica optical elements, as provided in embodiments of the present invention. The left image shows an interface model between trivalent cerium polishing abrasive and a fused silica optical substrate, while the right image shows an interface model between tetravalent cerium polishing abrasive and the same substrate. This model is used to simulate atomic-level contact and reaction behavior between materials.

[0086] Then, the simulation conditions were set to match the actual polishing environment, i.e., the interfacial reaction process under normal temperature and pressure. A suitable quantum chemical calculation software platform was selected, and a reasonable time scale was set to conduct quantum chemical calculations to simulate the interactions and changes in atomic behavior between the interfaces.

[0087] Next, the calculation results were analyzed and compared. Figure 3 This diagram illustrates the quantum chemical calculation results of two systems provided in this embodiment of the invention. The left diagram shows the trivalent cerium system exhibiting silicon atom detachment from the fused silica substrate surface during simulation, indicating that this system possesses effective atom removal capabilities. In contrast, the right diagram shows no silicon atom detachment in the tetravalent cerium system, with the interface primarily characterized by close contact and limited chemical reactions. The comparison reveals that trivalent cerium oxide significantly outperforms tetravalent cerium oxide in terms of interfacial activity and atom removal capability, predicting stronger removal efficiency and surface shaping ability in actual polishing processes.

[0088] Finally, to verify the accuracy and engineering applicability of the above calculation results, a comparative polishing experiment was conducted. In the experiment, two types of cerium oxide polishing abrasives from the same manufacturer and batch were selected. and ). Figure 4 This is a schematic diagram showing the content of cerium in different valence states of two cerium oxide polishing abrasives provided in the embodiments of the present invention, as shown below. Figure 4 As shown, the two abrasives have different trivalent cerium contents. The two abrasives were used to polish fused silica optical elements of the same batch and with the same surface morphology under the same process conditions (same time, pressure, speed, etc.). Figure 5 This is a schematic diagram illustrating the material removal rate and surface roughness after polishing of the same fused silica optical element using two different polishing abrasives provided in an embodiment of the present invention. Figure 5 As shown, (Higher trivalent cerium content) is superior to [other methods] in terms of material removal efficiency and surface quality improvement. This verifies the accuracy of the quantum chemical simulation results and the effectiveness of the screening method of this invention.

[0089] The second application scenario is suitable for evaluating and comparing the interfacial activity and polishing performance of different polishing abrasives in the ultra-smooth machining process of nickel-phosphorus alloy optical components. The specific implementation process is as follows:

[0090] First, an interfacial reaction model was constructed between three polishing abrasives (silicon dioxide, diamond, and cerium oxide) and nickel-phosphorus alloy optical elements to simulate the contact and interaction process between the materials and the substrate at the atomic scale. Figure 6 This is a schematic diagram illustrating the effects of different polishing abrasives on the micro-interfaces of nickel-phosphorus alloy optical elements, as provided in embodiments of the present invention. Figure 6 As shown, the first image is the interface model of cerium oxide polishing abrasive and nickel-phosphorus alloy optical substrate, the second image is the interface model of diamond polishing abrasive, and the third image is the interface model of silicon dioxide polishing abrasive.

[0091] Then, the simulation conditions were set to match the actual polishing environment, i.e., the interfacial reaction process under normal temperature and pressure. A suitable quantum chemical calculation software platform was selected, and a reasonable time scale was set to conduct quantum chemical calculations to simulate the interactions and changes in atomic behavior between the interfaces.

[0092] Then, the quantum chemical calculation results were obtained. Figure 7 A schematic diagram of the quantum chemical calculation results of three interaction systems provided in the embodiments of the present invention, as shown below. Figure 7 The figure shows the change in total energy before and after quantum chemical calculations when three polishing abrasives are applied to the surface of the same nickel-phosphorus alloy optical element. Under pre-equilibrium conditions: the silica system releases the most energy during the interfacial reaction, exhibiting extremely high chemical reactivity; the diamond system is second, possessing some interfacial activity; and the cerium oxide system releases the least energy, indicating relatively weak interfacial reactivity. These results suggest that silica has the greatest advantage in terms of interfacial chemical interaction strength and atom removal potential, followed by diamond, with cerium oxide being the weakest. It can be predicted that in actual polishing processes, the order of advantage among the three in terms of material removal efficiency and surface shaping ability will be: silica > diamond > cerium oxide.

[0093] Finally, to verify the reliability of the simulation results and the feasibility of their engineering applications, corresponding polishing experiments were conducted. In the experiments, three polishing abrasives consistent with the simulation system were selected to ensure similar particle size, purity, and dispersion properties. These abrasives were used to polish nickel-phosphorus alloy optical components of the same batch and initial surface shape under the same time, pressure, and speed conditions. After polishing, the material removal rate and surface roughness of each sample were measured. Figure 8 The diagram illustrates the material removal rate and surface roughness after polishing of the same nickel-phosphorus alloy optical element using three different polishing abrasives provided in this embodiment of the invention. Figure 8 As shown, silica polishing abrasives exhibit the highest removal rate and the lowest surface roughness, followed by diamond, while cerium oxide performs the worst.

[0094] The experimental results are consistent with the trends predicted by quantum chemical simulations, further verifying the scientific validity, accuracy, and practicality of the method of the present invention in the selection of polishing abrasives.

[0095] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0096] Embodiments of the present invention also provide a device for selecting polishing abrasives for optical elements. Figure 9 This is a schematic diagram of a device for selecting polishing abrasives for optical elements provided in an embodiment of the present invention. This embodiment is based on a functional module perspective, such as… Figure 9 As shown, the device includes:

[0097] The abrasive screening module 10 is used to perform preliminary screening of the candidate polishing abrasive library based on the characteristics of the optical element substrate material.

[0098] Model building module 11 is used to build an atomic-level interface model between the polishing abrasive and the optical component substrate based on the initially selected polishing abrasive.

[0099] The simulation module 12 is used to simulate the contact state and interface reaction behavior of polishing abrasive atom clusters and optical element substrate atom clusters in the polishing scene using an atomic-level interface model, and to obtain the bonding characteristics and binding energy change data of polishing abrasive atom clusters and optical element substrate atom clusters.

[0100] The quantization and sorting module 13 is used to quantify and sort the interfacial reactivity of polishing abrasive atomic clusters and optical element substrate atomic clusters based on the acquired bonding characteristics and binding energy change data, and generate a priority list of polishing abrasives.

[0101] In the optical element polishing abrasive selection device provided in the embodiments of the present invention, the interaction of the above four modules can theoretically complete the quantitative ranking of interface reactivity and generate a priority list of polishing abrasives without relying on a large number of preliminary experiments. This significantly improves the screening efficiency of polishing abrasives, reduces the number of blind experiments, lowers experimental costs and human intervention, and effectively shortens the abrasive development cycle. Furthermore, by simulating the microscopic reaction process in the polishing scenario, the interfacial interaction mechanism between the abrasive and the optical element substrate is analyzed in depth. The interfacial interaction strength and reaction trend of different abrasives and substrates are accurately and quantitatively analyzed. The polishing performance of the abrasive can be predicted before the experiment. This provides a solid theoretical basis for the discovery and optimization of new polishing abrasives, promotes the in-depth research on the chemical action mechanism of the polishing interface, and ultimately helps the systematic development of new high-performance polishing abrasives.

[0102] Since the embodiments of the optical element polishing abrasive selection device section correspond to the embodiments of the optical element polishing abrasive selection method section, the description of the features in the embodiment corresponding to the optical element polishing abrasive selection device can be found in the relevant description of the embodiment corresponding to the optical element polishing abrasive selection method, and will not be repeated here. Furthermore, it has the same beneficial effects as the optical element polishing abrasive selection method mentioned above.

[0103] Furthermore, in a specific implementation, the optical element polishing abrasive selection device provided in the embodiments of the present invention may further include: a scheme generation module, used to generate a polishing experiment scheme according to a polishing abrasive priority list; wherein, an experiment number is assigned, and the abrasive type corresponding to each group of experiments is determined; uniform processing parameters are set, and the processing parameters are converted into instruction codes that can control the polishing equipment; an experiment record template is generated; the experiment record template includes the indicators to be measured and the data entry format.

[0104] Furthermore, in a specific implementation, the optical element polishing abrasive selection device provided in the embodiments of the present invention may further include: a result verification module, used to collect polishing experiment results; the polishing experiment results include material removal rate and surface roughness value; the polishing experiment results are compared with the simulation results; if the deviation between the polishing experiment results and the simulation results exceeds a preset threshold, the parameters of the atomic-level interface model are adjusted or the experimental conditions are corrected until the consistency between the polishing experiment results and the simulation results meets the set requirements, and the verified optimal polishing abrasive scheme is output.

[0105] Embodiments of the present invention also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above embodiments of the method for selecting polishing abrasives for optical elements.

[0106] Embodiments of the present invention also provide a computer-readable storage medium storing a computer program configured to execute the steps in any of the above embodiments of the method for selecting polishing abrasives for optical elements.

[0107] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0108] Embodiments of the present invention also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in the above embodiments of the method for selecting polishing abrasives for optical elements.

[0109] Embodiments of the present invention also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above embodiments of the method for selecting polishing abrasives for optical elements.

[0110] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0111] The present invention has provided a detailed description of the method, apparatus, equipment, and medium for selecting polishing abrasives for optical elements. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of these embodiments are only intended to aid in understanding the method and core ideas of the invention. It should be noted that those skilled in the art can make various improvements and modifications to the invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A method for selecting polishing abrasives for optical components, characterized in that, The method comprises the following steps: preliminary screening of candidate polishing abrasives based on the characteristics of the optical element substrate material; generating a representative atomic cluster according to the chemical composition of the polishing abrasive screened preliminarily, and constructing a polishing abrasive atomic cluster model based on the representative atomic cluster; simulating the microstructure of the optical element substrate surface to construct an optical element substrate surface atomic cluster model; forming an atomic-level interface model between the polishing abrasive and the optical element substrate based on the polishing abrasive atomic cluster model and the optical element substrate surface atomic cluster model constructed; in the atomic-level interface model, processing the electron density distribution, interatomic force and energy change at the interface between the polishing abrasive atomic cluster and the optical element substrate atomic cluster by density functional theory, simulating the contact configuration of the polishing abrasive atomic cluster and the optical element substrate atomic cluster in the polishing scene, and restoring the spatial arrangement and interaction state of the interface atoms; tracking the electron transfer path and bond change in the reaction process by density functional theory to simulate the interface reaction behavior of the polishing abrasive atomic cluster and the optical element substrate atomic cluster in the polishing scene; obtaining the bond characteristics and binding energy change data of the polishing abrasive atomic cluster and the optical element substrate atomic cluster by quantum chemical method; calculating the reaction binding energy according to the obtained bond characteristics and binding energy change data; determining the interface reaction activity of the polishing abrasive atomic cluster and the optical element substrate atomic cluster based on the positive and negative and size of the reaction binding energy; quantitative sorting of the determined interface reaction activity, and priority sorting of the polishing abrasives screened preliminarily based on the quantitative sorting result to generate a polishing abrasive priority list; collecting polishing experiment results; the polishing experiment results include material removal rate and surface roughness value; comparing the polishing experiment results with the simulation results; if the deviation between the polishing experiment results and the simulation results exceeds the preset threshold, adjusting the parameters of the atomic-level interface model or modifying the experimental conditions until the consistency of the polishing experiment results and the simulation results meets the set requirement, and outputting the verified optimal polishing abrasive scheme.

2. The method for selecting polishing abrasives for optical elements according to claim 1, characterized in that, determining the interface reaction activity of the polishing abrasive atomic cluster and the optical element substrate atomic cluster based on the positive and negative and size of the reaction binding energy, comprising: when the reaction binding energy is negative, it is determined that energy needs to be released when the polishing abrasive atomic cluster and the optical element substrate atomic cluster combine to form a composite system, the reaction has a tendency to proceed spontaneously, and the larger the absolute value of the reaction binding energy, the more energy is released, and the higher the interface reaction activity; when the reaction binding energy is positive, it is determined that the reaction needs to absorb external energy to start, and the larger the absolute value of the reaction binding energy, the more energy is absorbed, and the lower the interface reaction activity.

3. The method of claim 1, wherein the polishing abrasive is selected from the group consisting of: The method further comprises the following steps: ​ generating a polishing experiment scheme according to the polishing abrasive priority list; wherein, assigning an experimental number to determine the abrasive type corresponding to each group of experiments; setting uniform processing parameters and converting the processing parameters into instruction codes for controlling the polishing equipment; generating an experimental record template; the experimental record template contains the indicators to be measured and the data entry format.

4. An apparatus for selecting a polishing abrasive for an optical element, characterized by The method comprises the following steps: The abrasive screening module is used for preliminarily screening the candidate polishing abrasive library based on the characteristics of the optical element substrate material; The model construction module is used for generating a representative atomic cluster according to the chemical composition of the preliminarily screened polishing abrasive, and constructing a polishing abrasive atomic cluster model based on the representative atomic cluster; The microstructure of the optical element substrate surface is simulated, and an optical element substrate surface atomic cluster model is constructed; Based on the constructed polishing abrasive atomic cluster model and the optical element substrate surface atomic cluster model, an atomic-level interface model between the polishing abrasive and the optical element substrate is formed; The simulation calculation module is used for processing the electron density distribution, interatomic force and energy change at the interface between the polishing abrasive atomic cluster and the optical element substrate atomic cluster in the atomic-level interface model through the density functional theory, simulating the contact configuration of the polishing abrasive atomic cluster and the optical element substrate atomic cluster in the polishing scene, and restoring the spatial arrangement and interaction state of the interface atoms; The transfer path of the electron and the change of the bonding in the reaction process are tracked through the density functional theory, the interface reaction behavior of the polishing abrasive atomic cluster and the optical element substrate atomic cluster in the polishing scene is simulated, and the bonding characteristics and the binding energy change data of the polishing abrasive atomic cluster and the optical element substrate atomic cluster are obtained through the quantum chemistry method; The quantitative sorting module is used for calculating the reaction binding energy according to the obtained bonding characteristics and binding energy change data, determining the interface reaction activity of the polishing abrasive atomic cluster and the optical element substrate atomic cluster based on the positive and negative and size of the reaction binding energy, quantitatively sorting the determined interface reaction activity, and generating a polishing abrasive priority list according to the priority sorting of the preliminarily screened polishing abrasive based on the quantitative sorting result. The result verification module is used for collecting polishing experiment results; the polishing experiment results include material removal rate and surface roughness value; The polishing experiment results are compared with the simulation results; if the deviation between the polishing experiment results and the simulation results exceeds a preset threshold, the parameters of the atomic-level interface model or the experimental conditions are adjusted until the consistency of the polishing experiment results and the simulation results meets the set requirement, and an optimal polishing abrasive scheme verified is output.

5. An electronic device, comprising: It comprises: A memory for storing a computer program; A processor for executing the computer program to realize the steps of the optical element polishing abrasive selection method according to any one of claims 1 to 3.

6. A computer-readable storage medium, characterized in that, The computer program is stored on the computer readable storage medium, and the processor executes the computer program to realize the steps of the optical element polishing abrasive selection method according to any one of claims 1 to 3.

Images