Efficient continuous electroplating device for plating zinc and nickel on surface of copper foil

Abstract

The invention relates to the technical field of copper foil processing, in particular to an efficient continuous electroplating device for plating zinc and nickel on the surface of a copper foil, which comprises an electroplating mechanism, and a feeding mechanism and a winding mechanism are respectively arranged on two sides of the electroplating mechanism; the electroplating mechanism comprises an electroplating tank, and the electroplating tank is circularly communicated with a circulating assembly and used for maintaining circulating flow of electrolyte in the electroplating tank; the feeding mechanism comprises a pretreatment assembly, and copper foil to be treated is treated by the pretreatment assembly and then fed into the electroplating pool to be electroplated. And the winding mechanism comprises a post-processing assembly, and the electroplated copper foil is wound after being processed by the post-processing assembly. According to the invention, continuous electroplating of the copper foil is realized, the production efficiency is improved, and the production cost is reduced; meanwhile, the uniformity and consistency of the electroplating process are ensured through circulation control of the electrolyte, and the electroplating quality is improved; and the copper foil is comprehensively treated before and after electroplating, so that the quality and the performance of the copper foil are further improved.

Description

Technical Field

[0001] This invention relates to the field of copper foil processing technology, and in particular to a high-efficiency continuous electroplating apparatus for zinc-nickel plating on the surface of copper foil. Background Technology

[0002] Zinc-nickel plating on copper foil is a common surface treatment technology. By depositing a nickel plating layer on the surface of copper foil, the corrosion resistance and wear resistance of the copper foil are improved, the surface quality of the copper foil is enhanced, and the performance of the copper foil is significantly improved to meet the needs of different application scenarios.

[0003] The process of electroplating zinc and nickel onto copper foil is based on the principle of electrolysis, which uses direct current to reduce and deposit nickel ions on the surface of copper foil (cathode) to form a coating. Existing zinc-nickel electroplating mainly includes continuous electroplating and intermittent electroplating. Intermittent electroplating is suitable for small-batch, customized production, with simple equipment and flexible adjustments, but it is inefficient and costly, making it inconvenient for industrial production. Continuous electroplating, on the other hand, is the preferred choice for industrial mass production, suitable for scenarios with high requirements for efficiency and consistency, and is suitable for industrial production. However, existing continuous electroplating equipment lacks control over the electrolyte during the electroplating process, resulting in insufficient electrolyte fluidity. The internal composition of the electrolyte changes with the operation of the electrolyte, affecting the uniformity and consistency of the electroplated layer on the copper foil surface, and ultimately impacting the quality of the copper foil.

[0004] Therefore, the present invention discloses a high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil surfaces, so as to solve the problems existing in the prior art.

[0006] To achieve the above objectives, the present invention provides the following solution: The present invention provides a high-efficiency continuous electroplating device for zinc-nickel plating on the surface of copper foil, including an electroplating mechanism for continuous electroplating, wherein a feeding mechanism for conveying copper foil and a winding mechanism for winding up the electroplated copper foil are respectively provided on both sides of the electroplating mechanism.

[0007] The electroplating mechanism includes an electroplating tank. The feeding mechanism continuously feeds copper foil into the electroplating tank for electroplating. The electroplated copper foil is then wound up by the winding mechanism. The electroplating tank is circulated with a circulation component to maintain the circulation of electrolyte in the electroplating tank.

[0008] The feeding mechanism includes a pre-treatment component, and the copper foil to be processed is fed into the electroplating bath after being processed by the pre-treatment component.

[0009] The winding mechanism includes a post-processing component, through which the electroplated copper foil is processed before being wound up.

[0010] Preferably, the electroplating mechanism includes a protective box fixed on the ground, with an inlet and an outlet on each side of the protective box. A second guiding module for guiding the copper foil is provided in the inlet and the outlet. The electroplating tank and the circulation component are respectively arranged in the protective box.

[0011] Preferably, the protective box is equipped with a control module for automatic control of the equipment. The control module is electrically connected to the electroplating tank and the circulation component, and the control module is electrically connected to a control panel located outside the protective box.

[0012] Preferably, the electroplating tank is provided with an electrolytic positive electrode and an electrolytic negative electrode for electrolysis, the electrolytic positive electrode and the electrolytic negative electrode being immersed in the electrolyte; the electrolytic negative electrode is in sliding contact with and electrically connected to the copper foil.

[0013] Preferably, the bottom of the electroplating tank is provided with an outlet that communicates with the inlet of the circulation component. The outlet is provided with a longitudinally arranged fixed plate and a sliding plate. A plurality of drain pipes for discharging electrolyte are fixedly connected to the sliding plate. The sidewall of the drain pipe is sealed and slides with a one-way hole on the fixed plate. When the sliding plate slides down, the inlet hole on the drain pipe communicates with the inner cavity of the electroplating tank.

[0014] Preferably, a control rod is fixedly connected to the sliding plate, the control rod passes through the fixed plate and is slidably connected to the fixed plate; a lifting rod is fixedly connected to the top end of the control rod, and a buoyancy plate is fixedly connected between the two ends of the lifting rod, the buoyancy plate floating on the surface of the electrolyte.

[0015] Preferably, the pretreatment component includes a treatment pool, in which a cleaning module and a first guiding module are provided. The cleaning module and the first guiding module are respectively located below the surface of the treatment liquid in the treatment pool. The copper foil to be treated enters the treatment liquid under the guidance of the first guiding module, and the surface of the copper foil is cleaned with the assistance of the cleaning module.

[0016] Preferably, the pretreatment assembly further includes a pretreatment cylinder fixed to the side wall of the protective box, the pretreatment cylinder being disposed corresponding to the feed inlet; a first rinsing assembly is disposed inside the pretreatment cylinder, the copper foil treated with the treatment liquid enters the pretreatment cylinder, and the first rinsing assembly cleans the treatment liquid on the surface of the copper foil.

[0017] Preferably, the cleaning module includes a plurality of cleaning shafts rotatably connected in the processing pool, the plurality of cleaning shafts rotating in the same direction and opposite to the forward direction of the copper foil; a plurality of cleaning rods are fixedly connected to the outer wall of the cleaning shafts, and the cleaning rods slide in contact with the surface of the copper foil.

[0018] Preferably, the post-processing assembly includes a post-processing cylinder fixed to the side wall of the protective box, and the post-processing cylinder is arranged corresponding to the discharge port; the post-processing cylinder is provided with a cleaning chamber and a drying chamber, and the electroplated copper foil passes through the cleaning chamber and the drying chamber in sequence to clean and dry the copper foil.

[0019] Compared with the prior art, the present invention has the following advantages and technical effects: The present invention discloses a high-efficiency continuous electroplating device for zinc-nickel plating on the surface of copper foil. Through the cooperation of an electroplating mechanism, a feeding mechanism, and a winding mechanism, continuous electroplating of the copper foil surface is achieved, improving production efficiency. The electroplating mechanism includes an electroplating tank, which is circulated with a circulation component to maintain the circulating flow of the electrolyte in the electroplating tank, ensuring the uniformity and stability of the electrolyte composition during the electroplating process, improving electroplating efficiency, and ensuring the uniformity and consistency of the electroplating process, thereby improving electroplating quality. The feeding mechanism is located on the inlet side of the electroplating mechanism and is used to continuously feed copper foil into the electroplating tank for electroplating. The pretreatment component is used to pre-treat the copper foil to be treated, such as cleaning and activation, to remove oil, impurities, etc. from the surface of the copper foil, thereby improving electroplating quality. The winding mechanism is located on the outlet side of the electroplating mechanism and is used to wind up the electroplated copper foil. The post-treatment component performs post-treatment on the electroplated copper foil, such as cleaning and drying, to ensure the quality and performance of the copper foil.

[0020] This invention enables continuous electroplating of copper foil, improving production efficiency and reducing production costs. At the same time, the circulation control of the electrolyte ensures the uniformity and consistency of the electroplating process, improving the electroplating quality. Comprehensive treatment is performed on the copper foil before and after electroplating, further improving the quality and performance of the copper foil. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0022] Figure 1 This is an axial view of the efficient continuous electroplating apparatus for zinc-nickel plating on copper foil surfaces according to the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the high-efficiency continuous electroplating device for zinc-nickel plating on copper foil surface according to the present invention;

[0024] Figure 3 For the present invention Figure 2 A magnified view of part A in the image;

[0025] Figure 4 For the present invention Figure 2A magnified view of part B in the image;

[0026] Figure 5 This is a schematic diagram of the control lever of the present invention;

[0027] In the diagram: 1. Electroplating mechanism; 2. Feeding mechanism; 3. Winding mechanism; 4. Copper foil; 11. Protective box; 12. Inlet; 13. Outlet; 14. Second guide module; 15. Electroplating tank; 16. Guide roller; 17. Control module; 18. Control panel; 19. Power supply module; 110. Electrolytic positive electrode; 111. Electrolytic negative electrode; 112. Conductive contact wheel; 113. Outlet; 114. Return outlet; 115. Outlet pipe; 116. Return pipe; 117. Storage tank; 118. Circulating pump; 119. Dosing tank; 120. Mixing tank; 121. Detection module; 122. Fixing plate; 123. Sliding plate; 124. Drain pipe; 125. Drainage... 126. Liquid chamber; 127. Liquid inlet; 128. One-way hole; 129. Control rod; 130. Lifting rod; 131. Connecting rod; 132. Buoyancy plate; 23. Feeding coil; 24. Processing tank; 25. First guide module; 26. Cleaning module; 27. Cleaning shaft; 28. Cleaning rod; 29. ​​Pre-processing cylinder; 20. First rinsing chamber; 20. First rinsing head; 210. First water inlet pipe; 211. First water outlet pipe; 212. Guide slope; 31. Post-processing cylinder; 32. Isolation plate; 33. Second rinsing chamber; 34. Second rinsing head; 35. Second water inlet pipe; 36. Second water outlet pipe; 37. Drying air inlet; 38. Drying air outlet; 39. Reel. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Reference Figures 1 to 5 As shown, this embodiment provides a high-efficiency continuous electroplating device for zinc-nickel plating on the surface of copper foil, including an electroplating mechanism 1 for continuous electroplating, and a feeding mechanism 2 for conveying copper foil 4 and a winding mechanism 3 for winding up the electroplated copper foil 4 on both sides of the electroplating mechanism 1.

[0031] The electroplating mechanism 1 includes an electroplating tank 15. The feeding mechanism 2 continuously feeds copper foil 4 into the electroplating tank 15 for electroplating. The electroplated copper foil 4 is then wound up by the winding mechanism 3. The electroplating tank 15 is circulated with a circulation component to maintain the circulation of electrolyte in the electroplating tank 15.

[0032] The feeding mechanism 2 includes a pre-treatment component. The copper foil 4 to be treated is fed into the electroplating tank 15 for electroplating after being processed by the pre-treatment component.

[0033] The winding mechanism 3 includes a post-processing component, and the electroplated copper foil 4 is wound up after being processed by the post-processing component.

[0034] This invention discloses a high-efficiency continuous electroplating apparatus for zinc-nickel plating on the surface of copper foil. Through the cooperation of an electroplating mechanism 1, a feeding mechanism 2, and a winding mechanism 3, continuous electroplating of the copper foil 4 is achieved, improving production efficiency. The electroplating mechanism 1 includes an electroplating tank 15, which is circulated with a circulation component to maintain the circulating flow of the electrolyte in the electroplating tank 15, ensuring the uniformity and stability of the electrolyte composition during the electroplating process, improving electroplating efficiency, and ensuring the uniformity and consistency of the electroplating process, thereby improving electroplating quality. The feeding mechanism 2 is located on the inlet side of the electroplating mechanism 1 and is used to continuously feed the copper foil 4 into the electroplating tank 15 for electroplating. The pretreatment component is used to pre-treat the copper foil 4, such as cleaning and activation, to remove oil, impurities, etc., from the surface of the copper foil 4 to improve electroplating quality. The winding mechanism 3 is located on the outlet side of the electroplating mechanism 1 and is used to wind up the electroplated copper foil 4. The post-treatment component performs post-treatment on the electroplated copper foil 4, such as cleaning and drying, to ensure the quality and performance of the copper foil 4. This invention enables continuous electroplating of copper foil 4, improving production efficiency and reducing production costs; at the same time, the circulation control of the electrolyte ensures the uniformity and consistency of the electroplating process, improving the electroplating quality; comprehensive treatment is carried out on copper foil 4 before and after electroplating, further improving the quality and performance of copper foil 4.

[0035] During operation, the copper foil 4 to be processed is processed by the pre-processing component of the feeding mechanism 2 and then continuously fed into the electroplating tank 15. Zinc and nickel plating is completed in the electrolyte circulation environment maintained by the circulation component. After electroplating, the copper foil 4 is processed by the post-processing component of the winding mechanism 3 and then wound up by the winding mechanism 3, realizing efficient and continuous production of zinc and nickel plating on the surface of the copper foil 4, and improving electroplating efficiency and stability.

[0036] Further optimizing the design, the electroplating mechanism 1 includes a protective box 11 fixed to the ground. The protective box 11 has an inlet 12 and an outlet 13 on its two sides. A second guiding module 14 for guiding the copper foil 4 is installed inside the inlet 12 and outlet 13. The electroplating tank 15 and the circulation assembly are respectively installed inside the protective box 11. The protective box 11 provides a closed protective space for the electroplating process, reducing external interference. The inlet 12 and outlet 13 are respectively located on both sides of the protective box 11 for the entry and exit of the copper foil 4. Both the inlet 12 and outlet 13 are equipped with a second guiding module 14 to limit and guide the copper foil 4 entering and exiting the protective box 11, ensuring a stable conveying path for the copper foil 4 and improving the continuity and reliability of the electroplating process.

[0037] In one embodiment of the present invention, the second guide module 14 includes two correspondingly arranged rotating rollers, and the copper foil 4 passes between the two rotating rollers to achieve positioning and guidance.

[0038] To further optimize the design, a control module 17 for automatic equipment control is installed inside the protective box 11. The control module 17 is electrically connected to the electroplating tank 15 and the circulation components, and also electrically connected to a control panel 18 located outside the protective box 11. Operators input commands through the control panel 18. Upon receiving the commands, the control module 17 automatically adjusts the electrolysis parameters of the electroplating tank 15, such as current and time, and the operating status of the circulation components, such as the electrolyte circulation speed. This achieves automated equipment control, reduces human error, improves the accuracy and convenience of parameter adjustment, and further ensures the stability of electroplating quality.

[0039] In one embodiment of the present invention, a power supply module 19 is provided inside the protective box 11 for supplying power to the equipment; the power supply device connects to a stable mains power when it is working, and also has an emergency power storage function, which can be used in case of temporary power failure.

[0040] Further optimizing the design, the electroplating tank 15 is equipped with an electrolytic positive electrode 110 and an electrolytic negative electrode 111 for electrolysis. Both the positive and negative electrodes are immersed in the electrolyte. The negative electrode 111 slides in contact with and is electrically connected to the copper foil 4. During operation, both the positive and negative electrodes 110 and 111 are immersed in the electrolyte, forming a stable electroplating circuit. The negative electrode 111 slides in contact with and is electrically connected to the copper foil 4 via a conductive contact wheel 112. After the copper foil 4 enters the electroplating tank 15, it slides in contact with the negative electrode 111 to form a conductive circuit. An electrolytic environment is formed between the positive and negative electrodes through the electrolyte, causing an electrolytic reaction of zinc and nickel plating to occur on the surface of the copper foil 4. This ensures that the copper foil 4 remains conductive during continuous transport, guaranteeing a stable and continuous electrolytic reaction and improving the uniformity of the plating layer.

[0041] In one embodiment of the present invention, a plurality of guide rollers 16 are provided in the electroplating tank 15 for guiding the copper foil 4 to pass stably through the electroplating tank 15.

[0042] In a further optimized design, the bottom of the electroplating tank 15 is provided with an outlet 113 that communicates with the inlet of the circulation component. Inside the outlet 113, there are longitudinally arranged fixed plates 122 and sliding plates 123. Several drain pipes 124 for discharging electrolyte are fixedly connected to the sliding plate 123. The side wall of the drain pipe 124 is sealed and slides with the one-way hole 127 on the fixed plate 122. When the sliding plate 123 slides upward, the inlet hole 126 on the drain pipe 124 communicates with the inner cavity of the electroplating tank 15. The outlet 113 is located at the bottom of the electroplating tank 15 and is connected to the inlet of the circulation component. The electrolyte enters the circulation component from the outlet 113, and after circulation and adjustment of ion content by the circulation component, it flows back from the return port 114 above the liquid surface of the electroplating tank 15 to achieve circulation. When the circulation conditions are not met, the inlet hole 126 at the top of the drain pipe 124 is located in the one-way hole 127 of the fixed plate 122, and the discharge of electrolyte is interrupted. As the circulation component pumps electrolyte into the electroplating tank 15, the liquid level of the electrolyte rises, and the liquid level drives the sliding plate 123 to rise. The inlet hole 126 on the drain pipe 124 moves upward and disengages from the one-way hole 127. The drain chamber 125 is connected to the inner cavity of the electroplating tank 15, and the electrolyte flows from the drain pipe 124 into the circulation component for circulation. The circulation path of the electrolyte is precisely controlled to avoid backflow, ensure circulation efficiency, and maintain a stable electrolyte concentration in the electroplating tank 15.

[0043] In a further optimized design, a control rod 128 is fixedly connected to the sliding plate 123. The control rod 128 passes through the fixed plate 122 and is slidably connected to the fixed plate 122. A lifting rod 129 is fixedly connected to the top of the control rod 128. A buoyancy plate 131 is fixedly connected between the two ends of the lifting rod 129. The buoyancy plate 131 floats on the surface of the electrolyte. A control rod 128 fixed to a sliding plate 123 passes through a fixed plate 122 and slides with the fixed plate 122. A horizontally arranged lifting rod 129 is fixed to the top of the control rod 128. Both ends of the lifting rod 129 are connected to a buoyancy plate 131 via a connecting rod 130. The buoyancy plate 131 floats on the surface of the electrolyte. When the electrolyte level changes, the buoyancy plate 131 rises and falls with the liquid level. The lifting rod 129 drives the control rod 128 and the sliding plate 123 to rise and fall synchronously: when the liquid level rises, the sliding plate 123 slides upward, the inlet hole 126 of the drain pipe 124 opens, and the electrolyte is discharged; when the liquid level falls, the sliding plate 123 slides downward, the inlet hole 126 closes, reducing the discharge. No additional power is required. The discharge volume is adaptively adjusted according to the electrolyte level, maintaining the stability of the liquid level in the electroplating tank 15 and ensuring a consistent electrolytic reaction environment.

[0044] In one embodiment of the present invention, a plurality of inlet holes 126 are longitudinally arranged on the drain pipe 124, and the drain speed can be controlled according to the degree of lifting and lowering of the sliding plate 123 to ensure the balance of electrolyte in the electroplating tank 15.

[0045] In one embodiment of the present invention, the circulation component includes a storage tank 117, which is connected to an outlet 113 via a return port 114. The storage tank 117 stores electrolyte of a standard concentration to replenish the electrolyte consumed in the electroplating tank 15. The storage tank 117 is connected to a circulation pump 118, which serves as the power source for electrolyte circulation. The pump sends the electrolyte back to the electroplating tank 15 from the return port 114 via a return pipe 116, thereby realizing electrolyte circulation.

[0046] In one embodiment of the present invention, a detection module 121 is provided on the infusion tube for detecting the ion concentration of the outflowing electrolyte, so as to facilitate the adjustment of the electrolyte concentration.

[0047] In one embodiment of the present invention, a mixing tank 120 is provided on the return pipe 116, and the mixing tank 120 is connected to a dosing tank 119. When the concentration of the circulating electrolyte is detected to be less than the standard concentration, a high concentration of electrolyte is added to the mixing tank 120 through the dosing tank 119 and mixed in the mixing tank 120 before being returned to maintain the concentration stability of the electrolyte in the electroplating tank 15 and improve the electroplating quality.

[0048] Further optimizing the scheme, the pretreatment component includes a treatment tank 22, within which a cleaning module 24 and a first guiding module 23 are installed. The cleaning module 24 and the first guiding module 23 are located below the surface of the treatment liquid in the treatment tank 22. A loading roll 21 provides copper foil, which is then guided into the treatment liquid via the first guiding module 23, and its surface is cleaned by the cleaning module 24. The pretreatment component is used to treat the surface of the fed copper foil 4, removing residual copper shavings, grease, and other impurities. It mainly includes the treatment tank 22, where the first guiding module 23 is located below the surface of the treatment liquid. This guide module 23 guides the copper foil 4 through the treatment liquid, removing impurities from its surface and preventing them from affecting the adhesion of the plating layer. This facilitates subsequent electroplating and improves electroplating quality. The first processing module is also located below the surface of the treatment liquid, primarily assisting the treatment liquid in treating the surface of the copper foil 4 and ensuring the cleaning quality of the copper foil 4.

[0049] To further optimize the solution, the pretreatment assembly also includes a pretreatment cylinder 27 fixed to the side wall of the protective box 11, which is correspondingly arranged with the feed inlet 12. A first rinsing assembly is installed inside the pretreatment cylinder 27. The copper foil 4, after being treated with the treatment solution, enters the pretreatment cylinder 27, and the first rinsing assembly cleans the surface of the copper foil 4 of the treatment solution. The treated copper foil 4 then enters the pretreatment cylinder 27, which is equipped with a first rinsing chamber 28 surrounding the copper foil 4. Several first rinsing heads 29 are arranged on the side of the first rinsing chamber 28 facing the copper foil 4. A first water inlet pipe 210 injects clean water into the first rinsing chamber 28, which, after being processed by the first rinsing heads 29, forms a high-pressure water mist to clean the surface of the copper foil 4, removing any residual treatment solution and preventing it from affecting the subsequent electroplating process. This ensures improved purity of the electrolyte and enhances the electroplating quality of the copper foil 4.

[0050] In one embodiment of the present invention, the bottom end of the pretreatment cylinder 27 is provided with a guide slope 212, and the lowest end of the guide slope 212 is connected to a first water outlet pipe 211 for discharging the clean water after cleaning the copper foil 4. After treatment, the water is recycled again to avoid wasting water resources.

[0051] Further optimizing the solution, the cleaning module 24 includes several cleaning shafts 25 rotatably connected in the treatment tank 22. These cleaning shafts 25 rotate in the same direction but opposite to the forward direction of the copper foil 4. Several cleaning rods 26 are fixed to the outer wall of each cleaning shaft 25, and these rods 26 slide in contact with the surface of the copper foil 4. The cleaning module 24 includes several cleaning shafts 25 rotating in the same direction, with the rotation direction of the cleaning shafts 25 opposite to the forward direction of the copper foil 4. The cleaning shafts 25 are arranged on the upper and lower sides of the copper foil 4 and are respectively connected to several cleaning rods 26. When the cleaning shafts 25 rotate, the cleaning rods 26 agitate the treatment solution, preventing the concentration of the treatment solution from decreasing due to prolonged contact with the copper foil 4 and affecting the cleaning effect. Simultaneously, the rotation direction of the cleaning shafts 25 is opposite to the forward direction of the copper foil 4, enhancing the relative speed between the treatment solution and the surface of the copper foil 4 through reverse friction, thereby improving the cleaning effect, efficiency, and cleanliness, and providing a higher quality substrate for subsequent electroplating.

[0052] Further optimizing the solution, the post-processing component includes a post-processing cylinder 31 fixed to the side wall of the protective box 11, with the post-processing cylinder 31 corresponding to the discharge port 13. The post-processing cylinder 31 contains a cleaning chamber and a drying chamber. The electroplated copper foil 4 passes through the cleaning chamber and drying chamber sequentially for cleaning and drying. The electroplated copper foil 4 first enters the cleaning chamber to remove residual electrolyte from its surface, preventing electrolyte residue from corroding the copper foil 4 or the plating layer. After cleaning, it enters the drying chamber to dry the moisture, and finally is wound up by the winding mechanism 3 to prevent the copper foil 4 from becoming damp and oxidized after winding, thus improving the storage stability and quality of the finished copper foil 4.

[0053] In one embodiment of the invention, a partition plate 32 is provided inside the post-processing cylinder 31 to divide the inner cavity of the post-processing cylinder 31 into a rinsing chamber and a drying chamber, which are used to clean and dry the copper foil 4, respectively.

[0054] In one embodiment of the present invention, a second rinsing chamber 33 is provided in the cleaning chamber surrounding the copper foil 4. A plurality of inclined second rinsing heads 34 are provided on the side of the second rinsing chamber 33 facing the copper foil 4. Water is pumped into the second rinsing chamber 33 by the second water inlet pipe 35, and then atomized into high-pressure water mist through the second rinsing heads 34 to rinse the surface of the copper foil 4, cleaning the surface of the copper foil 4. The cleaned water is discharged from the second water outlet pipe 36 and recycled after treatment, reducing water waste.

[0055] In one embodiment of the present invention, a drying air inlet 37 is provided at the top of the drying chamber and a drying air outlet 38 is provided at the bottom of the drying chamber. The drying air inlet 37 injects dry, high-temperature air into the drying chamber to dry the copper foil 4, and then discharges it through the drying air outlet 38. After the dried copper foil 4 is discharged from the drying chamber, it is wound up by a take-up roll 39.

[0056] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0057] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil, characterized in that: It includes an electroplating mechanism (1) for continuous electroplating, and a feeding mechanism (2) for conveying copper foil (4) and a winding mechanism (3) for winding the electroplated copper foil (4) are respectively provided on both sides of the electroplating mechanism (1). The electroplating mechanism (1) includes an electroplating tank (15). The feeding mechanism (2) continuously feeds copper foil (4) into the electroplating tank (15) for electroplating. The electroplated copper foil (4) is wound up by the winding mechanism (3). The electroplating tank (15) is circulated with a circulation component to maintain the circulation of electrolyte in the electroplating tank (15). The feeding mechanism (2) includes a pre-treatment component. The copper foil (4) to be processed is fed into the electroplating tank (15) after being processed by the pre-treatment component for electroplating. The winding mechanism (3) includes a post-processing component, and the electroplated copper foil (4) is wound up after being processed by the post-processing component.

2. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 1, characterized in that: The electroplating mechanism (1) includes a protective box (11) fixed on the ground. The protective box (11) has an inlet (12) and an outlet (13) on its two sides respectively. The inlet (12) and the outlet (13) are provided with a second guide module (14) for guiding the copper foil (4). The electroplating tank (15) and the circulation component are respectively arranged in the protective box (11).

3. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 2, characterized in that: The protective box (11) is equipped with a control module (17) for automatic control of the equipment. The control module (17) is electrically connected to the electroplating tank (15) and the circulation component. The control module (17) is also electrically connected to the control panel (18) located outside the protective box (11).

4. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 1, characterized in that: The electroplating tank (15) is provided with an electrolytic positive electrode (110) and an electrolytic negative electrode (111) for electrolysis. The electrolytic positive electrode (110) and the electrolytic negative electrode (111) are respectively immersed in the electrolyte. The electrolytic negative electrode (111) is in sliding contact with the copper foil (4) and electrically connected.

5. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 4, characterized in that: The bottom end of the electroplating tank (15) is provided with an outlet (113) that communicates with the inlet of the circulation component. The outlet (113) is provided with a longitudinally arranged fixed plate (122) and a sliding plate (123). Several drain pipes (124) for discharging electrolyte are fixedly connected to the sliding plate (123). The side wall of the drain pipe (124) is sealed and slides with the one-way hole (127) on the fixed plate (122). When the sliding plate (123) slides upward, the inlet hole (126) on the drain pipe (124) communicates with the inner cavity of the electroplating tank (15).

6. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 5, characterized in that: A control rod (128) is fixedly connected to the sliding plate (123). The control rod (128) passes through the fixed plate (122) and is slidably connected to the fixed plate (122). A lifting rod (129) is fixedly connected to the top of the control rod (128). A buoyancy plate (131) is fixedly connected between the two ends of the lifting rod (129). The buoyancy plate (131) floats on the surface of the electrolyte.

7. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 2, characterized in that: The pretreatment component includes a treatment pool (22), in which a cleaning module (24) and a first guide module (23) are provided. The cleaning module (24) and the first guide module (23) are respectively located below the liquid surface of the treatment liquid in the treatment pool (22). The copper foil (4) to be treated enters the treatment liquid under the guidance of the first guide module (23), and the cleaning module (24) assists in cleaning the surface of the copper foil (4).

8. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 7, characterized in that: The pretreatment assembly also includes a pretreatment cylinder (27) fixed to the side wall of the protective box (11), the pretreatment cylinder (27) being arranged corresponding to the feed inlet (12); a first rinsing assembly is provided inside the pretreatment cylinder (27), the copper foil (4) treated with the treatment liquid enters the pretreatment cylinder (27), and the first rinsing assembly cleans the treatment liquid on the surface of the copper foil (4).

9. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 7, characterized in that: The cleaning module (24) includes several cleaning shafts (25) rotatably connected in the treatment pool (22). The cleaning shafts (25) rotate in the same direction and are opposite to the forward direction of the copper foil (4). Several cleaning rods (26) are fixed to the outer wall of the cleaning shafts (25), and the cleaning rods (26) slide in contact with the surface of the copper foil (4).

10. The high-efficiency continuous electroplating apparatus for zinc-nickel plating on copper foil according to claim 2, characterized in that: The post-processing assembly includes a post-processing cylinder (31) fixed to the side wall of the protective box (11), and the post-processing cylinder (31) is correspondingly arranged with the discharge port (13); the post-processing cylinder (31) is provided with a cleaning chamber and a drying chamber, and the electroplated copper foil (4) passes through the cleaning chamber and the drying chamber in sequence to clean and dry the copper foil (4).

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