Device and method for supporting SOP type three-dimensional module board-level test

Abstract

The invention belongs to the field of semiconductor nondestructive testing, and relates to a board-level testing device and method supporting SOP type three-dimensional modules. The device comprises gaskets, the gaskets are arranged on the two sides of the SOP module, an adapter plate is arranged above the gaskets, a plurality of probes matched with the leading-out ends of the SOP module are fixed on the adapter plate, and a plurality of test points are arranged on the adapter plate. The whole testing device is pi-shaped, the probe is connected with the inflection point of the leading-out end of the module, no three-proofing paint is arranged at the inflection point, and the three-proofing coating of the whole board cannot be damaged. Through the design of the top layer adapter plate, signals at the leading-out ends of the closely arranged modules are fanned out to test points at the periphery of the substrate in an equal-length manner, so that the device can be adapted to various instruments for test and analysis. When the device is used for testing the board-level three-dimensional module, the analysis means are greatly enriched, the module is ensured to be subjected to a non-damage test in a user board-level verification stage, various working states of the module are truly and accurately reflected, and the test cost is reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor non-destructive testing, and relates to a device and method for supporting SOP-type three-dimensional module board-level testing. Background Technology

[0002] SOP-type 3D modules are one of the most widely used general-purpose module packages in the industry, with a very broad application prospect. The reliability of almost all SOP modules on the market is based on the performance of individual modules on professional testing machines and overall board-level testing verification. To prevent electronic and electrical equipment from being corroded by humidity, heat, mold, salt spray, and corrosive gases during use, which could ultimately affect product quality, 3D modules must be coated with conformal coating before leaving the factory. Furthermore, after the SOP module is soldered onto the entire PCB substrate, it is coated with conformal coating again, and the protective layer must not be damaged by any means afterwards. Therefore, if a module fails during board-level testing, it is difficult to perform non-destructive testing on the individual module soldered to the substrate. Moreover, according to QJ 2940B-2016 "Technical Requirements for Repair and Modification of Printed Circuit Board Assemblies for Aerospace Use," "any defective solder joint should not be reworked more than three times," meaning that repeatedly disassembling and resoldering faulty SOP modules is not permitted. Therefore, it is necessary to explore a simple, convenient, and harmless testing device for individual board-level modules to verify module performance and provide reliable application assurance for subsequent product applications. Summary of the Invention

[0003] The purpose of this invention is to provide a device and method for testing SOP-type three-dimensional modular boards, so as to solve the technical problem that it is difficult to perform non-destructive testing on a single module soldered on a substrate in the prior art.

[0004] To achieve the above objectives, the present invention employs the following technical solution: In a first aspect, this application discloses a board-level testing device for supporting SOP-type three-dimensional modules, including a gasket, the gaskets being disposed on both sides of the SOP module, an adapter plate being disposed above the gaskets, a plurality of probes adapted to the leads of the SOP module being fixed on the adapter plate, and a plurality of test points being disposed on the adapter plate.

[0005] Preferably, the gasket is a bare plate, which is bonded between the PCB substrate and the adapter plate by an adhesive.

[0006] Preferably, there is a gap between the gasket and the SOP module, and the gasket support adapter plate does not contact the upper surface of the SOP module.

[0007] Preferably, the probe is an "L-shaped" probe, with one end soldered to the adapter board and the other end in contact with the lead-out terminal of the SOP module.

[0008] Preferably, the adapter board has a plurality of metal vias, the metal vias being adapted to the arrangement of the leads of the SOP module, and the probe passes through the metal vias and is fixed on the adapter board.

[0009] Preferably, the test points are evenly and circumferentially arranged on the adapter plate.

[0010] Preferably, a conductive screw is fitted onto the test point.

[0011] Secondly, this application discloses a testing method supporting SOP-type three-dimensional modular board level, including: Place the gaskets on both sides of the SOP module and place the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe contacts the lead-out terminal of the SOP module; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0012] Preferably, the gasket is a bare plate, which is adhered between the PCB substrate and the adapter plate by an adhesive, then the method includes: Attach the gaskets to both sides of the SOP module and attach the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe contacts the lead-out terminal of the SOP module; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0013] Preferably, the probe is an "L-shaped" probe, then the method includes: Place the gaskets on both sides of the SOP module and place the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe makes contact with the inflection point of the SOP module lead-out terminal; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0014] Compared with the prior art, the present invention has the following beneficial effects: This invention discloses a board-level testing device supporting SOP-type three-dimensional modules. The device is π-shaped, with the probe connecting to the inflection point of the module's lead-out end. No conformal coating is applied at this point, thus preserving the overall conformal coating of the board. Through the design of the top-layer adapter board, the signals from the closely arranged module leads are fanned out at equal length to test points around the perimeter of the substrate, making it compatible with various instruments for testing and analysis. Using this device for board-level three-dimensional module testing greatly enriches analytical methods, ensuring non-destructive testing of modules during the user board-level verification phase. It accurately reflects various operational states of the module, reduces testing costs, and has wide applications in aerospace, missiles, launch vehicles, and telemetry and control, with a very broad application prospect and market potential, possessing significant strategic and social benefits. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the testing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the board-level layout according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the wiring layout of the adapter board according to an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating the practical application of the testing device according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the interior of the hidden pad of the testing device according to an embodiment of the present invention.

[0017] Wherein: 1-pad; 2-probe; 3-adapter board; 4-test point; 5-SOP module; 6-PCB substrate; 7-SOP module lead-out terminal. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0024] The present invention will now be described in further detail with reference to the accompanying drawings: See Figure 1 Generally, SOP-type 3D modules require individual module reliability verification, and a conformal coating is applied to the module surface at the factory to provide moisture, mildew, and salt spray protection. Subsequently, based on the user's application environment, schematic design, and layout design, the SOP module is soldered onto the system-level substrate. A conformal coating is then applied to the circuit board to form a protective film, isolating the system board from harsh environments, protecting the circuitry from corrosion, enhancing safety, and ensuring the system board's lifespan.

[0025] To address the aforementioned problems in the prior art, namely the difficulty of performing board-level non-destructive verification on a single module, this invention provides a board-level testing device and method for SOP-type three-dimensional modules. The testing device comprises a gasket 1 and an adapter plate 3 arranged in a "π" shape. The device uses a three-dimensional structural model, connecting the output signal content of the SOP-type three-dimensional module to test points 4 on the adapter plate 3 via probe contact. Gaskets 1 are symmetrically arranged on both sides of the SOP module 5, with the adapter plate 3 covering the gaskets 1. Probes 2 are fixed to the adapter plate 3 and make corresponding contact with the output terminals 7 of the SOP module. Test points 4 are distributed on the surface of the adapter plate 3.

[0026] In this design, gasket 1 refers to the support structure located on both sides of the module, which can be implemented using a uniformly thick insulating board to form a physical isolation space between the adapter board 3 and the SOP module 5. Adapter board 3 refers to the circuit board that carries the test components, which can be implemented using a multilayer printed circuit board with conductive lines on its surface connecting to the test points. Probe 2 refers to the elastic element that achieves electrical contact, which can be implemented using a gold-plated spring pin, maintaining reliable contact with the lead-out end through elastic deformation. Test point 4 refers to the signal input interface, which can be implemented using gold-plated pads for connecting external test equipment.

[0027] Specifically, gaskets are symmetrically arranged on both sides of the module to form a support platform, and an adapter plate covers the gaskets to form a suspended structure. The probe array is arranged according to the three-dimensional distribution of the module's leads, with each probe tip making point contact with its corresponding lead. The test points form an electrical path with the probes through internal wiring on the adapter plate. When external testing equipment is connected to the test points, the signal is transmitted to the module's leads through the probes, completing the functional test. This structure avoids contact between the adapter plate and the module surface through physical isolation, and the elastic contact characteristics of the probes ensure the reliability of the electrical connection.

[0028] Compared to existing technologies, traditional testing methods require direct contact with the module surface or disassembly for inspection, posing a risk of damage to the protective layer and solder joints. This solution achieves non-destructive contact testing through a combination of a three-dimensional support structure and an adapter board. The point contact between the probe and the lead-out end avoids scratching the protective layer, and the gap space formed by the gasket eliminates the impact of mechanical stress on the module body. The adapter board serves as an independent test interface carrier, allowing the testing process to proceed without altering the original circuit structure. Through the above technical solution, this application achieves non-destructive testing of a single SOP module in its soldered state, with the probe contact method maintaining the integrity of the conformal coating. The physical isolation design between the adapter board and the module body prevents mechanical damage during testing, and the standardized layout of test points improves testing efficiency. This device is reusable and does not alter the original module structure, meeting the stringent reliability requirements of electronic components in the aerospace field.

[0029] See Figure 2 The present application discloses a board-level testing device for supporting SOP type three-dimensional solid module, including a gasket 1, the gasket 1 is disposed on both sides of the SOP module 5, an adapter plate 3 is disposed above the gasket 1, a plurality of probes 2 adapted to the lead-out end 7 of the SOP module are fixed on the adapter plate 3, and a plurality of test points 4 are disposed on the adapter plate 3.

[0030] In some embodiments, the gasket 1 is a smooth plate, which is bonded between the PCB substrate 6 and the adapter plate 3 by an adhesive. A smooth plate refers to a plate with a smooth surface and no mechanical fixing structure; specifically, it can be made of glass fiber reinforced epoxy resin, whose flat surface can eliminate localized stress concentration caused by traditional mechanical fixing. The adhesive is a colloidal material with flexible adhesion properties; specifically, it can be silicone or acrylic adhesive, which buffers the mechanical impact during assembly through elastic deformation.

[0031] In some embodiments, a gap is provided between the gasket 1 and the SOP module 5, and the gasket 1 supports the adapter plate 3 without contacting the upper surface of the SOP module 5. The gap refers to the physical distance formed between the gasket and the SOP module, which can be achieved by adjusting the thickness or shape of the gasket. For example, the gasket can be designed with a raised structure or support columns of different heights can be used to maintain a certain space between the gasket and the module surface.

[0032] In some embodiments, the probe 2 is an "L-shaped" probe, with one end soldered to the adapter plate 3 and the other end in contact with the SOP module lead-out terminal 7. By probing this point with the bottom of the "L-shaped" probe, the signal content of the SOP module lead-out terminal can be connected to the top of the probe.

[0033] In some embodiments, the adapter plate 3 has a plurality of metal vias, the metal vias being adapted to the arrangement of the SOP module leads 7, and the probe 2 passing through the metal vias and fixed on the adapter plate 3. The positions of the metal vias and the spatial distribution of the SOP module leads form a one-to-one correspondence, and the vertical positioning of the probe is achieved through geometric matching.

[0034] In some embodiments, the test points 4 are evenly and circumferentially arranged on the adapter plate 3.

[0035] In some embodiments, a conductive screw is fitted onto the test point 4. This facilitates clamping and testing, and allows for non-destructive module testing with various testing instruments.

[0036] In some embodiments, the testing device mainly includes a gasket, probes, an adapter board, and test points. The gasket is a smooth board of a certain thickness, adhered to the PCB substrate surface around the SOP module using adhesive. Its main function is to support the adapter board and provide space around the SOP module to prevent contact with the module body and avoid wear of the conformal coating. Its thickness is greater than 3mm more than the sum of the module soldering height and the module body thickness. The probes are L-shaped probes, soldered to the adapter board. Due to the unique lead-out structure of the SOP module, a bend at the bottom of the module's lead-out point is not coated with conformal coating. By testing this point with the bottom of the L-shaped probe, the signal content of the SOP module's lead-out point can be connected to the top of the probe. The adapter board is designed according to the specific dimensions of the SOP module, with a central metal via position set according to the module's lead-out arrangement, and probes are soldered thereto, achieving electrical connection between the vertical probes and the horizontal adapter board. By designing the layout, signals at the metal via locations are led out at equal lengths, and the relatively dense SOP module leads are evenly distributed around the adapter board, which is beneficial for module testing. The test points are designed according to the test instrument probes, such as exposed metal pads and metal drill holes on the adapter board, which can be fitted with conductive screws for easy clamping and testing. This allows for non-destructive module testing with various test instruments.

[0037] like Figure 2 and Figure 4 As shown, the testing device includes a gasket 1, a probe 2, an adapter plate 3, and test points 4. The gasket 1 is bonded to the adapter plate 3 and the system board with adhesive. The adapter plate 3 is erected around the module, with some space reserved to protect the module's conformal coating. The probe 2 is soldered to the adapter plate 3 through metal through-holes, achieving electrical connection between the probe and the adapter plate. The test points 4 are evenly distributed around the adapter plate 3, such as... Figure 3 As shown, due to the varying distances between test points at different locations, the traces on the adapter board 3 must be routed with equal lengths to achieve equal-length signal fan-out. Spacers are adhered to the PCB substrates on both sides of the SOP module, and the spacing between the adapter board and the module's upper surface is controlled by adjusting the spacer thickness. The adapter board is fixed to the top of the spacers with adhesive, forming a suspended support structure. After the probe passes through the metal vias of the adapter board, its L-shaped end makes elastic contact with the module's side lead-out end, establishing an electrical connection. After the testing device is connected to the test points on the adapter board via conductive screws, it directly acquires module signals through the probes without damaging the conformal coating or disassembling the module. This process achieves board-level testing through a non-contact structure, avoiding damage to the protective layer caused by traditional soldering tests.

[0038] This application also discloses a testing method supporting SOP-type three-dimensional modular board level, including: Place the gaskets on both sides of the SOP module and place the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe contacts the lead-out terminal of the SOP module; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0039] In some embodiments, the gasket is a bare plate, which is adhered between the PCB substrate and the adapter plate by an adhesive. The method includes: Attach the gaskets to both sides of the SOP module and attach the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe contacts the lead-out terminal of the SOP module; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0040] In some embodiments, where the probe is an "L-shaped" probe, the method includes: Place the gaskets on both sides of the SOP module and place the adapter plate above the gaskets; Fix the probe on the adapter board so that the probe makes contact with the inflection point of the SOP module lead-out terminal; The testing device is connected to the test points to perform non-destructive testing at the SOP type three-dimensional module board level.

[0041] like Figure 5 As shown, non-destructive testing of a single module typically involves placing the module inside a testing device, connecting it to the main control unit via an additional testing structure, and performing electrical testing. However, to ensure the reliability of components used in aerospace applications, modules already soldered during the user board-level application verification phase cannot be disassembled, their surface conformal coating cannot be damaged, and the protective layer at the leads cannot be punctured. Therefore, to protect the conformal coating on the surface of the SOP-type 3D module, an "L-shaped" probe is used to puncture the lead-out terminal at the bottom bend of the SOP module. This allows the signal content from the SOP module's lead-out terminal to be transferred to the test point, where various testing instruments are used for non-destructive testing and analysis of the module system at the board level.

[0042] This method is simple, fast, efficient, stable, and has a simple structure. The device can effectively solve the problem that a single module cannot be verified without damage at the board level, enriches the testing methods, improves the efficiency of troubleshooting, and has important strategic significance and social benefits.

[0043] In summary, this invention discloses a board-level testing device supporting SOP-type three-dimensional modules. The device is π-shaped, with the probes connecting to the inflection points of the module leads. No conformal coating is applied at these points, thus preserving the overall conformal coating of the board. Through the design of the top-layer adapter board, the signals from the closely arranged module leads are fanned out at equal length to test points around the perimeter of the substrate, making it compatible with various instruments for testing and analysis. Using this device for board-level three-dimensional module testing greatly enriches analytical methods, ensures non-destructive testing of modules during the user board-level verification phase, accurately reflects various operational states of the module, reduces testing costs, and has wide applications in aerospace, missiles, launch vehicles, and telemetry and control. It has a very broad application prospect and market potential, and possesses significant strategic and social benefits.

[0044] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A device for testing SOP-type three-dimensional modular boards, characterized in that, Includes a gasket (1), which is set on both sides of the SOP module (5). An adapter plate (3) is set above the gasket (1). Several probes (2) that are compatible with the leads (7) of the SOP module are fixed on the adapter plate (3). Several test points (4) are set on the adapter plate (3).

2. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, The gasket (1) is a bare plate, which is bonded to the PCB substrate (6) and the adapter plate (3) by an adhesive.

3. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, There is a gap between the gasket (1) and the SOP module (5), and the gasket (1) supports the adapter plate (3) and has no contact with the upper surface of the SOP module (5).

4. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, The probe (2) is an "L-shaped" probe, with one end soldered to the adapter plate (3) and the other end in contact with the lead-out end (7) of the SOP module.

5. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, The adapter plate (3) has several metal vias, which are matched with the arrangement of the SOP module lead-out end (7). The probe (2) passes through the metal vias and is fixed on the adapter plate (3).

6. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, The test points (4) are evenly and circumferentially arranged on the adapter plate (3).

7. The device for supporting SOP-type three-dimensional module board-level testing according to claim 1, characterized in that, The test point (4) is equipped with a conductive screw.

8. A test method based on the SOP-type three-dimensional module board-level test device according to any one of claims 1 to 7, characterized in that, include: Place the gaskets (1) on both sides of the SOP module (5) and place the adapter plate (3) above the gaskets (1). Fix the probe (2) on the adapter plate (3) so that the probe (2) is in contact with the lead-out end (7) of the SOP module; The testing device is connected to the test point (4) to perform non-destructive testing of the SOP type three-dimensional module board level.

9. A method for supporting SOP-type three-dimensional module board-level testing according to claim 8, characterized in that, The gasket (1) is a bare plate, which is adhered between the PCB substrate (6) and the adapter plate (3) by adhesive. The method includes: Attach the gasket (1) to both sides of the SOP module (5) and attach the adapter plate (3) above the gasket (1). Fix the probe (2) on the adapter plate (3) so that the probe (2) is in contact with the lead-out end (7) of the SOP module; The testing device is connected to the test point (4) to perform non-destructive testing of the SOP type three-dimensional module board level.

10. A method for supporting SOP-type three-dimensional module board-level testing according to claim 8, characterized in that, If the probe (2) is an "L-shaped" probe, then the method includes: Place the gaskets (1) on both sides of the SOP module (5) and place the adapter plate (3) above the gaskets (1). Fix the probe (2) on the adapter plate (3) so that the probe (2) is in contact with the inflection point of the SOP module lead-out terminal (7); The testing device is connected to the test point (4) to perform non-destructive testing of the SOP type three-dimensional module board level.

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