Silicon optical module

Abstract

The invention discloses a silicon optical module, which comprises a PCB (Printed Circuit Board) and a substrate, the PCB is provided with an open slot, the open slot penetrates through the PCB, the substrate is provided with an embedding part, and the substrate is matched with the open slot through the embedding part; a PIC chip, wherein the PIC chip is arranged in the open slot of the PCB; the optical fiber array is arranged on the substrate, one end of the optical fiber array is connected with the PIC chip, and the other end of the optical fiber array is connected with an optical fiber; the heat conducting plate is installed on the substrate, the bottom face of the heat conducting plate is attached to the substrate, and a laser light source is installed on the heat conducting plate; the focusing lens is mounted on the substrate and is positioned at the output end of the laser light source; the isolator assembly is installed on the substrate and located at the output end of the focusing lens; one end of the glass block is in contact with the PIC chip, and the other end of the glass block is in contact with the isolator assembly. By optimizing the structure of the optical isolator and combining with the glass block, the loss of light in the transmission process is reduced, and the optical coupling efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a silicon photonics module. Background Technology

[0002] With the rapid development of optical communication technology, optical fiber media are widely used to achieve high-speed data transmission. Among these components, optical modules are the core devices of optical fiber communication systems. Their working principle involves converting laser signals into electrical signals and vice versa. Silicon photonics (SiP) features low power consumption and high integration; its large-scale commercialization can significantly reduce the cost of integrated circuits. Using PIC chips to implement photoelectric conversion has become a mainstream solution for high-speed optical modules.

[0003] In the prior art, patent application CN202110264669.1 discloses a novel silicon photonics module, comprising: multiple laser components disposed on a circuit board assembly for emitting lasers of various wavelengths; a PIC chip disposed on the circuit board assembly and connected to the laser components for receiving and modulating the lasers to generate multiple modulated laser signals; a wave combiner disposed on the circuit board assembly and connected to the PIC chip and the laser components for combining the multiple modulated laser signals to generate a single combined laser signal and outputting it to the novel silicon photonics module; and a wave divider disposed on the circuit board assembly for receiving the new laser signals. The silicon photonics module receives a single external laser signal with multiple wavelengths multiplexed from the outside and performs wavelength division processing to generate multiple wavelength-divided laser signals, which are then output. A photodetector assembly, mounted on the circuit board assembly and connected to the wavelength division assembly, receives the multiple wavelength-divided laser signals, performs photoelectric conversion, generates corresponding external electrical signals, and inputs them into the circuit board assembly. The wavelength division assembly includes: a wavelength division interface for receiving multiple wavelength-multiplexed external laser signals from the novel silicon photonics module; a wavelength division connecting fiber connected to the wavelength division interface for transmitting the external laser signals; and a wavelength division chip connected to the wavelength division connecting fiber for performing wavelength division processing on the external laser signals to generate multiple wavelength-divided laser signals and input them into the circuit board assembly.

[0004] Existing silicon photonics modules suffer from a large overall size due to their non-compact structure. Furthermore, key components such as optical isolators within these modules may employ a loosely designed structure, resulting in a long overall length, significant signal loss during transmission, reduced optical coupling efficiency, and increased manufacturing complexity. Therefore, it is necessary to improve this structure to overcome these shortcomings. Summary of the Invention

[0005] The purpose of this invention is to provide a silicon optical module that solves the problems of existing silicon optical modules having insufficiently compact structures, high optical signal loss during transmission, reduced optical coupling efficiency, and complex manufacturing processes.

[0006] The above-mentioned technical objective of this invention has been achieved by the following technical solutions:

[0007] A silicon photonics module includes a PCB board with a slot that penetrates the PCB board, and further includes...

[0008] A substrate having a fitting portion, wherein the substrate is positioned with a PCB board by the fitting portion engaging with a slot;

[0009] A PIC chip is disposed in a slot on a PCB board, and the bottom surface of the PIC chip is in contact with the substrate.

[0010] An optical fiber array is disposed on a substrate, one end of which is connected to a PIC chip, and the other end of which is connected to an optical fiber.

[0011] A heat-conducting plate is mounted on a substrate, with its bottom surface in contact with the substrate. A laser light source is mounted on the heat-conducting plate. The heat-conducting plate is used to rapidly conduct the heat generated by the laser light source to the substrate, thereby ensuring the stable operation of the laser light source.

[0012] A focusing lens is mounted on a substrate and located at the output end of a laser source. The focusing lens is used to focus the light beam emitted by the laser source.

[0013] An isolator assembly, which is mounted on a substrate and located at the output end of a focusing lens, isolator assembly is capable of preventing reflected light from returning to the light source;

[0014] A glass block, one end of which contacts the PIC chip and the other end of which contacts the isolator assembly, is used to improve optical coupling efficiency.

[0015] A further feature of the present invention is that the substrate is made of metal, the upper end of the substrate is in contact with the lower end of the PCB board, and epoxy resin adhesive is applied to the contact surface between the substrate and the PCB board.

[0016] A further configuration of the present invention is that the fitting portion is a protruding structure on the substrate, one end of the fitting portion is connected to the substrate, the other end of the fitting portion extends outward from the substrate, and the fitting portion matches the slot.

[0017] A further provision of the present invention is that the devices on the PCB board and the substrate are interconnected by gold wire bonding.

[0018] A further feature of the present invention is that the optical fiber array is bonded to the substrate with adhesive, and the optical fiber array has multiple optical fiber interfaces. The multiple optical fiber interfaces on the optical fiber array support multi-channel transmission, enabling the optical communication system to process multiple optical signals simultaneously.

[0019] A further feature of the present invention is that the heat-conducting plate is a ceramic heat-conducting plate, and a thermistor is installed on the heat-conducting plate to obtain the temperature of the heat-conducting plate.

[0020] A further configuration of the present invention is that the isolator assembly includes,

[0021] A magnet platform is disposed on a substrate, the bottom surface of the magnet platform is in contact with the upper surface of the substrate, and the magnet platform is used to provide a magnetic field for the Faraday rotator.

[0022] Polarizer 1 and polarizer 2 are symmetrically arranged on the magnet platform, with an installation space between them. Polarizer 1 and polarizer 2 are used to limit the polarization direction of light.

[0023] A Faraday rotator is disposed on a magnet platform and located between polarizer one and polarizer two. One end of the Faraday rotator is in contact with polarizer one, and the other end of the Faraday rotator is in contact with polarizer two. The Faraday rotator is used to rotate the polarization plane of light.

[0024] A half-wave plate is disposed on a magnet platform and located between a glass block and a second polarizer. One end of the half-wave plate is in contact with the glass block, and the other end is in contact with the second polarizer. The half-wave plate is used in conjunction with a Faraday rotator, which rotates the polarization plane of light. The half-wave plate is used to further adjust the polarization direction after rotation.

[0025] A further feature of the present invention is that the first polarizer, the second polarizer, the Faraday rotator, and the half-wave plate are bonded together with epoxy resin adhesive to ensure that the optical interfaces between the polarizer, the Faraday rotator, and the half-wave plate are tightly fitted, thereby reducing scattering and loss of light during transmission.

[0026] A further feature of the present invention is that a refractive index matching liquid is coated on the contact surface between the glass block and the PIC chip. The refractive index matching liquid can fill the tiny gap between the glass block and the PIC chip, making the transmission of the laser signal between the two smoother. By matching the refractive indices of the two, the reflection loss of the laser signal at the interface is reduced, and the transmission efficiency of the laser signal is improved.

[0027] In summary, the present invention has the following beneficial effects:

[0028] 1. High-efficiency heat dissipation: The tight bonding between the substrate, heat-conducting plate and PCB board forms a high-efficiency heat dissipation structure. This design can quickly dissipate the heat generated by components such as PIC chips and distribute it to a larger heat dissipation area, ensuring the working stability of the silicon photonics module.

[0029] 2. Improve optical coupling transmission efficiency: The fiber array and the waveguide end face of the PIC chip are directly coupled, which improves the coupling efficiency. Furthermore, by optimizing the structure of the optical isolator and combining it with the setting of glass blocks, the loss of light during transmission is reduced, which effectively improves the optical coupling efficiency.

[0030] 3. Integration and Modularization: The emitting and receiving light components are integrated on the same PCB board, and the layout is optimized, making the entire silicon photonics module more compact and modular. This helps to improve production efficiency and simplify the installation and maintenance process. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the present invention.

[0032] Figure 2 This is a schematic diagram of the assembly structure of the PCB board and the substrate.

[0033] Numerical labels: PCB board 100, substrate 110, PIC chip 201, fiber array 202, focusing lens 203, laser source 204, heat-conducting plate 205, thermistor 206, optical fiber 207, magnet platform 210, glass block 220, polarizer one 230, Faraday rotator 231, polarizer two 232, half-wave plate 233. Detailed Implementation

[0034] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below with reference to the figures and specific embodiments.

[0035] like Figures 1 to 2 As shown, the silicon photonics module proposed in this invention includes a PCB board 100. The PCB board 100 is used to provide installation space to fix the silicon photonics module. The PCB board 100 allows for high-density installation and fixing of the silicon photonics module in a limited space, realizing the miniaturization and weight reduction of the device. The PCB board 100 is provided with a slot that runs through the upper and lower ends of the PCB board 100.

[0036] The substrate 110 has a fitting portion, one end of which is connected to the substrate 110, and the other end of which extends outward from the substrate 110. The substrate 110 is positioned with the PCB board 100 by the fitting portion cooperating with the slot. The top surface of the substrate 110 is in contact with the bottom surface of the PCB board 100. The substrate 110 is used to conduct heat generated by the silicon photonics module outward, improve heat dissipation efficiency, and reduce the size and space occupied by the PCB board 100.

[0037] Preferably, the substrate 110 is made of metal, and epoxy resin adhesive is applied to the contact surface between the substrate 110 and the PCB board 100 to improve the connection stability between the substrate 110 and the PCB board 100. The devices on the PCB board 100 and the substrate 110 are connected to each other by gold wire bonding. The PCB board 100 and the substrate 110 together form a support platform.

[0038] The PIC chip 201 is disposed in a slot in the PCB board 100. The bottom surface of the PIC chip 201 is in contact with the substrate 110. The heat generated by the PIC chip 201 during operation can be dissipated to the outside through the substrate 110. The PIC chip 201 has a light emitting end, which is used to convert electrical signals into laser signals.

[0039] The PIC chip 201 has an optical receiver. At the receiver, a photodetector (e.g., a photodiode) in the PIC chip 201 can convert the received laser signal into an electrical signal. After amplification and processing, these electrical signals are output in the form of a waveguide endface. The output laser signal is coupled to a multi-channel parallel fiber array 202 of a free-space optical device. The coupling efficiency is improved through direct coupling between the PIC waveguide endface and the endface of the parallel fiber array 202.

[0040] In some embodiments, the fiber optic array 202 is mounted on the PIC chip 201 using epoxy resin adhesive. In other embodiments, the fiber optic array 202 is bonded to the substrate 110 and fixed using epoxy resin adhesive. Preferably, the fiber optic array 202 is mounted on the mating portion of the substrate 110, with the substrate 110 serving as a heat dissipation carrier to dissipate the heat generated by the fiber optic array 202. One end of the fiber optic array 202 is coupled to the PIC chip 201, and a refractive index matching liquid is applied to the contact surface between the fiber optic array 202 and the PIC chip 201. The other end of the fiber optic array 202 is connected to multiple optical fibers 207, each of which can independently transmit laser signals. By transmitting multiple laser signals in parallel, the fiber optic array 202 improves the transmission efficiency of optical communication.

[0041] A heat-conducting plate 205 is mounted on the mating portion of the substrate 110. The bottom surface of the heat-conducting plate 205 is in contact with the mating portion of the substrate 110. The heat-conducting plate 205 has mounting space and is used to cooperate with the substrate 110 to transfer heat outward. Preferably, the heat-conducting plate 205 is a ceramic heat-conducting plate. The PCB board 100, the substrate 110, and the heat-conducting plate 205 are tightly fitted together to form a highly efficient heat dissipation structure, which can quickly conduct heat generated by components such as the PIC chip 201 and distribute it to a larger heat dissipation area, thereby improving heat dissipation efficiency and ensuring the working stability of the silicon photonics module.

[0042] Laser source 204 is used to emit laser signals. Laser source 204 is mounted on heat conduction plate 205. The heat generated by laser source 204 can be transferred to substrate 110 through heat conduction plate 205 and dissipated to the outside. In this embodiment, there are two laser sources 204. If there are many input channels on PIC chip 201, the number of laser sources 204 can be adjusted accordingly.

[0043] A focusing lens 203 is mounted on the fitting portion of the substrate 110 and is used to focus the light beam.

[0044] Preferably, a single focusing lens 203 is used to couple the laser into the PIC. Multiple focusing lenses 203 would increase the difficulty of alignment, as each focusing lens 203 needs to be precisely aligned to ensure the correct transmission of the beam. Furthermore, the beam would suffer losses as it passes through each focusing lens 203. In contrast, a single focusing lens 203 reduces losses, as the beam only needs to pass through the lens once to complete focusing and coupling. A single focusing lens 203 makes the entire coupling section more compact and reduces the space occupied.

[0045] Thermistor 206, preferably, is mounted on heat-conducting plate 205. Thermistor 206 is used to obtain the temperature of heat-conducting plate 205, thereby monitoring the working status of laser source 204.

[0046] A glass block 220 is disposed on one end of the magnet platform 210 near and in contact with the PIC chip 201, and the other end of the glass block 220 is in contact with the half-wave plate 233. The glass block 220 is used to reduce light reflection on the surface of the PIC chip 201, reduce light loss, and thus improve the transmission efficiency of the laser signal. By setting the glass block 220, the coupling input process of the laser signal can be optimized, and the overall optical coupling efficiency can be improved. A refractive index matching liquid is coated on the contact surface between the glass block 220 and the PIC chip 201. The refractive index matching liquid can fill the tiny gap between the glass block 220 and the PIC chip 201, making the transmission of the laser signal between the two smoother. By matching the refractive indices of the two, the reflection loss of the laser signal at the interface can be significantly reduced, thereby improving the transmission efficiency of the laser signal.

[0047] During installation, the glass block 220 is brought into close contact with the PIC chip 201. A refractive index matching liquid is applied to the contact surface between the glass block 220 and the PIC chip 201, and testing is conducted to ensure optimal optical coupling. Existing silicon photonics modules lack the glass block 220, which increases light reflection on the surface of the PIC chip 201, increases light loss, and reduces coupling efficiency. To compensate for the reduction in light loss and coupling efficiency, additional optical components (such as setting multiple focusing lenses 203) or adjustments to the layout are required, which leads to an increase in the overall size of the silicon photonics module.

[0048] The magnet platform 210 is disposed on the mating part of the substrate 110. The bottom surface of the magnet platform 210 is in contact with the upper end surface of the mating part of the substrate 110. The magnet platform 210 is used to provide a magnetic field for the Faraday rotator 231. Both the upper and lower end surfaces of the magnet platform 210 are planar.

[0049] Polarizer 1 230 and polarizer 232 are symmetrically arranged on magnet platform 210. There is an installation space between polarizer 1 230 and polarizer 232. Polarizer 1 230 and polarizer 232 are used to limit the polarization direction of light to ensure that light that conforms to a specific polarization direction can pass through.

[0050] Faraday rotator 231 is disposed on magnet platform 210 and located between polarizer 1 230 and polarizer 232. One end of Faraday rotator 231 is in contact with polarizer 1 230 and the other end of Faraday rotator 231 is in contact with polarizer 232. Faraday rotator 231 is used to rotate the polarization plane of light under the action of a magnetic field.

[0051] A half-wave plate 233 is disposed on the magnet platform 210 and is located between the glass block 220 and the second polarizer 232. One end of the half-wave plate 233 is in contact with the glass block 220, and the other end of the half-wave plate 233 is in contact with the second polarizer 232. The half-wave plate 233 is used to change the polarization direction of the incident light so that the polarization direction of the light is consistent with the transmission direction of the second polarizer 232. The light after being rotated by the Faraday rotator 231 can pass through the second polarizer 232, while the light propagating in the opposite direction is isolated due to the mismatch of polarization directions, thus realizing unidirectional transmission of light.

[0052] Polarizer 1 230, polarizer 232, Faraday rotator 231, and half-wave plate 233 are bonded together with epoxy resin adhesive to form an optical isolator. By integrating key components such as polarizer 1 230, polarizer 232, Faraday rotator 231, and half-wave plate 233 onto the magnet platform 210, the structure of the optical isolator is more compact. Compared with a loosely structured optical isolator, the overall length is reduced, which helps to reduce light loss during transmission, effectively improves optical coupling efficiency, and is beneficial to manufacturing.

[0053] The usage process and principle of this invention are as follows: The laser source 204 emits a laser signal. After the laser signal is focused by the focusing lens 203, it passes through the optical isolator and the glass block 220 and enters the receiving end of the PIC chip 201. At the optical receiving end of the PIC chip 201, the photodetector converts the received laser signal into an electrical signal. After amplification and processing, the electrical signal is output in the form of a waveguide end face. The output laser signal is directly coupled to the end face of the parallel fiber array 202 through the PIC waveguide end face. The coupled laser signal is transmitted in parallel in the fiber array 202.

[0054] In summary, this application integrates the emitting and receiving optical components onto the same PCB board 100 through a more compact structural design and optimizes the layout of the emitting and receiving optical components. While ensuring optical coupling transmission efficiency and heat dissipation efficiency, it reduces the size of the entire silicon photonics module, thereby improving production efficiency.

[0055] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connect" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0056] Any descriptions not covered in the above specific embodiments of the present invention are known technologies in the field and can be implemented with reference to such known technologies.

[0057] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A silicon photonics module, comprising a PCB board, wherein the PCB board has a slot, the slot being disposed through the PCB board, characterized in that, It also includes, A substrate having a fitting portion, wherein the substrate is positioned with a PCB board by the fitting portion engaging with a slot; A PIC chip is disposed in a slot on a PCB board, and the bottom surface of the PIC chip is in contact with the substrate. An optical fiber array is disposed on a substrate, one end of which is connected to a PIC chip, and the other end of which is connected to an optical fiber. A heat-conducting plate is mounted on a substrate, with its bottom surface in contact with the substrate, and a laser light source is mounted on the heat-conducting plate. A focusing lens is mounted on a substrate and located at the output end of a laser source. The focusing lens is used to focus the light beam emitted by the laser source. An isolator assembly, which is mounted on a substrate and located at the output end of a focusing lens; A glass block, one end of which contacts the PIC chip, and the other end of which contacts the isolator assembly.

2. A silicon photonics module according to claim 1, characterized in that, The substrate is made of metal, and the upper surface of the substrate is in contact with the lower surface of the PCB board. Epoxy resin adhesive is applied to the contact surface between the substrate and the PCB board.

3. A silicon photonics module according to claim 1, characterized in that, The fitting part is a protruding structure on the substrate. One end of the fitting part is connected to the substrate, and the other end of the fitting part extends outward from the substrate. The fitting part matches the slot.

4. A silicon photonics module according to claim 1, characterized in that, The components and substrate on the PCB are interconnected by gold wire bonding.

5. A silicon photonics module according to claim 1, characterized in that, The fiber array is bonded to the substrate with adhesive, and the fiber array has multiple fiber interfaces.

6. A silicon photonics module according to claim 1, characterized in that, The heat-conducting plate is made of ceramic and a thermistor is installed on it to obtain the temperature of the heat-conducting plate.

7. A silicon photonics module according to claim 1, characterized in that, The isolator assembly includes, A magnet platform is disposed on a substrate, the bottom surface of the magnet platform is in contact with the upper surface of the substrate, and the magnet platform is used to provide a magnetic field for the Faraday rotator. Polarizer 1 and polarizer 2 are symmetrically arranged on the magnet platform, with an installation space left between polarizer 1 and polarizer 2; A Faraday rotator is disposed on a magnet platform and located between polarizer one and polarizer two. One end of the Faraday rotator is in contact with polarizer one, and the other end of the Faraday rotator is in contact with polarizer two. A half-wave plate is disposed on a magnet platform and is located between a glass block and a second polarizer. One end of the half-wave plate is in contact with the glass block, and the other end of the half-wave plate is in contact with the second polarizer.

8. A silicon photonics module according to claim 7, characterized in that, The polarizer one, polarizer two, Faraday rotator and half-wave plate are bonded together with epoxy resin adhesive.

9. A silicon photonics module according to claim 1, characterized in that, The contact surface between the glass block and the PIC chip is coated with a refractive index matching liquid.

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