Optical module emission assembly with heat dissipation structure

Abstract

The invention discloses an optical module transmitting assembly with a heat dissipation structure, which comprises a PCB (Printed Circuit Board), a transmitting end substrate and a heat dissipation structure, the PCB is provided with a mounting notch, and the upper end surface of the transmitting end substrate is attached to the lower end surface of the PCB; the laser chip is connected with the corresponding wiring terminal on the PCB through a gold bonding wire; the signal input end of the thermistor is in communication connection with the laser chip; the thermoelectric refrigerating unit is located in the installation notch, the lower end face of the thermoelectric refrigerating unit makes contact with the transmitting end substrate, and the thermoelectric refrigerating unit is in communication connection with the signal output end of the thermistor; the lens is located at the laser output end of the laser chip; the optical isolator is located at the output end of the lens; the optical fiber array is located at the output end of the optical isolator, the optical fiber array is attached to the output end of the optical isolator, and a plurality of optical fibers are connected to the optical fiber array. On the premise of a compact structure, good heat dissipation performance is achieved, and meanwhile the optical performance is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical module heat dissipation, especially to an optical module emission assembly with heat dissipation structure. BACKGROUND

[0002] The optical module is composed of optoelectronic devices, functional circuits and optical interfaces, etc. The optoelectronic devices include transmitting and receiving parts. In simple terms, the function of the optical module is to convert optical signals into electrical signals, and vice versa.

[0003] In the prior art, the patent document with the application number CN202210657424.X discloses an optical module emission assembly with heat dissipation structure, which comprises an external heat dissipation frame, a water cooling mechanism, a cleaning mechanism and a translation mechanism. The water cooling mechanism, the cleaning mechanism and the translation mechanism are arranged inside the external heat dissipation frame. The heat dissipation pipe in the water cooling mechanism is arranged above the optical module mainboard chip, and is used in cooperation with the heat dissipation fan in the heat dissipation frame to enhance the efficiency of heat dissipation. The upper and lower cleaning roller brushes in the cleaning mechanism clean the surface of the heat dissipation pipe and the chip at the same time, which can improve the efficiency of heat exchange. The cleaning frame in the cleaning mechanism moves along the trajectory of the sinusoidal curve in the curved track, which can improve the utilization rate of the upper and lower cleaning roller brushes. The translation mechanism drives the cleaning mechanism to translate, so that the upper and lower cleaning roller brushes can clean the surface of the heat dissipation pipe and the chip in different directions.

[0004] The existing optical module heat dissipation structure has a large volume and a complex structure, which needs to occupy additional space and limits the development of high-density integration of optical modules, which conflicts with the trend of miniaturization of communication equipment. Therefore, it is necessary to improve such a structure to overcome the above-mentioned defects. SUMMARY

[0005] The purpose of the present application is to provide an optical module emission assembly with heat dissipation structure, which can solve the problem of the existing optical module heat dissipation structure, which has a large volume and a complex structure, and needs to occupy additional space.

[0006] The above technical purpose of the present application is achieved by the following technical scheme:

[0007] An optical module emission assembly with heat dissipation structure comprises a PCB board, an installation gap is formed in the PCB board, the installation gap is arranged along the height direction of the PCB board and penetrates through the PCB board, and the optical module emission assembly further comprises,

[0008] A transmitting end substrate is arranged below the PCB board, the upper end surface of the transmitting end substrate is attached to the lower end surface of the PCB board, and the transmitting end substrate is used to improve the heat dissipation performance of the emission assembly.

[0009] A laser chip is connected with a corresponding terminal on the PCB by a gold wire, and a laser diode is integrated on the laser chip for providing laser output;

[0010] A thermistor is communicatively connected with the laser chip, and the thermistor is used for acquiring the working temperature of the laser chip in real time;

[0011] A thermoelectric refrigerator is located in the mounting gap, and the lower end surface of the thermoelectric refrigerator is in contact with the emission end substrate; the thermoelectric refrigerator is communicatively connected with the signal output end of the thermistor, and the thermoelectric refrigerator is used for adjusting the working temperature of the laser chip according to the temperature information fed back by the thermistor;

[0012] A lens is located on the laser output end of the laser chip, and the lens is used for focusing the laser emitted by the laser chip;

[0013] An optical isolator is located on the output end of the lens, and the optical isolator allows the laser beam focused by the lens to pass through; the optical isolator is used for realizing the forward transmission of the laser signal while suppressing the reverse light;

[0014] An optical fiber array is located on the output end of the optical isolator, and the optical fiber array is attached to the output end of the optical isolator; a plurality of optical fibers are connected to the optical fiber array; the optical fiber array realizes the parallel transmission of multiple optical signals by arranging the plurality of optical fibers side by side.

[0015] Further, the emission end substrate is provided with an upwardly protruding mounting portion which is matched with the mounting gap on the PCB; the emission end substrate is clamped with the PCB through the cooperation of the mounting portion and the mounting gap, and is fixed by adhesive.

[0016] Further, the surface of the optical isolator is plated with an anti-reflection film for reducing reflected light, and the optical isolator is arranged at an angle with the laser diode.

[0017] Further, the optical isolator is arranged at an angle with the laser diode.

[0018] Further, the positioning base is located in the mounting gap, the lower end surface of the positioning base is attached to the emission end substrate, the positioning base has a mounting space, and the optical isolator and the optical fiber array are mounted on the positioning base.

[0019] Further, the positioning base is provided with a V-shaped groove, and the optical fiber is arranged in the V-shaped groove.

[0020] The further arrangement of the present application is that the protective cover is provided with a positioning groove matched with the positioning base, the protective cover is installed on the PCB and the transmitting end base plate through the cooperation of the positioning groove and the positioning base, and is fixed by glue.

[0021] The further arrangement of the present application is that the transmitting end base is a component made of metal with good heat conductivity.

[0022] In summary, the present application has the following advantages:

[0023] 1. Efficient heat dissipation structure: the transmitting end base plate is made of metal with good heat conductivity, which can quickly spread the heat generated by the optical module during operation to the entire surface and dissipate to the external air, and the thermoelectric refrigerator accurately controls the working temperature of the laser chip according to the temperature information fed back by the thermistor, realizes accurate temperature control, and further improves the heat dissipation efficiency.

[0024] 2. Superior optical performance: the optical isolator surface is coated with an anti-reflection film to reduce reflected light and protect the laser diode, and the optical isolator and the laser diode are arranged at a certain angle, which can protect the laser diode and will not increase the loss of optical coupling. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic diagram of the present application.

[0026] Figure 2 is a partial structural schematic diagram of the protective cover.

[0027] Numerical reference: PCB 100, transmitting end base plate 101, gold wire 102, laser chip 103, thermistor 104, lens 105, thermoelectric refrigerator 106, optical isolator 107, optical fiber array 108, optical fiber 109, protective cover 200. DETAILED DESCRIPTION

[0028] In order to make the technical means, creative features, purposes and effects of the present application easy to understand, the present application is further described below in combination with the drawings and specific embodiments.

[0029] As shown in Figure 1 The present application provides a light module transmitting assembly with a heat dissipation structure, which comprises a PCB 100, and the PCB 100 is provided with an installation gap, the installation gap is arranged along the height direction of the PCB 100 and penetrates through the PCB 100;

[0030] The transmitting end substrate 101 is located below the PCB 100, and the upper end surface of the transmitting end substrate 101 is attached to the lower end of the PCB 100. Preferably, the transmitting end substrate 101 is made of metal with good heat conduction performance, for example, the transmitting end substrate 101 is made of copper. The metal transmitting end substrate 101 quickly spreads the heat generated during the operation of the optical module to the entire surface and dissipates to the external air.

[0031] The transmitting end substrate 101 can be provided with an upwardly protruding mounting portion matched with the mounting gap. The transmitting end substrate is clamped with the PCB 100 through the mounting portion matched with the mounting gap. The contact surface between the transmitting end substrate 101 and the PCB 100 is fixed by glue. The glue can be epoxy resin glue. The heat is transmitted to the transmitting end substrate 101 through the mounting portion and then dissipated to the outside. The optical module emitting assembly is attached to the transmitting end substrate 101. The heat can be dissipated to the outside through the transmitting end substrate 101, thereby improving the heat dissipation performance of the optical module and the working stability of the optical module.

[0032] Compared with the prior art, the heat dissipation structure is designed according to the characteristics of miniaturization and high density of the optical module. While ensuring the compact structure of the optical module, good heat dissipation effect can still be achieved.

[0033] The laser chip 103 (LD COC) is connected to the corresponding terminal on the PCB 100 through the gold wire 102. The laser chip 103 is integrated with a laser diode, which is used to provide laser output.

[0034] The thermistor 104 is communicatively connected to the laser chip 103. The thermistor 104 is used to obtain the working temperature of the laser chip 103 in real time and send the temperature value to the thermoelectric cooler 106.

[0035] The lens 105 is located on the laser output end of the laser chip 103. The lens 105 is used to focus the laser emitted by the laser chip 103 and couple the laser beam to the optical isolator 107, and finally into the optical fiber.

[0036] A thermoelectric cooler 106 (TEC) is located in the mounting gap, the lower end surface of the thermoelectric cooler 106 is in contact with the emission end substrate 101, the thermoelectric cooler 106 is in communication connection with the signal output end of the thermistor 104, and a temperature threshold value is set in the thermoelectric cooler 106. When the temperature collected by the thermistor 104 exceeds the set value, the thermoelectric cooler 106 cools, so that the temperature of the laser chip 103 decreases to the set value; when the temperature collected by the thermistor 104 is lower than the set value, the thermoelectric cooler 106 heats, so that the temperature of the laser chip 103 increases to the set value; according to the temperature information fed back by the thermistor 104, the working temperature of the laser chip 103 is adjusted to realize precise temperature control and further improve the heat dissipation efficiency.

[0037] An optical isolator 107 is located on the output end of the lens 105, one end of the optical isolator 107 is attached to the end of the optical fiber array 108, and the optical isolator 107 allows the laser beam focused by the lens 105 to pass to the optical fiber. The optical isolator 107 also blocks reflected light to protect the laser diode as a light source.

[0038] The surface of the optical isolator 107 is coated with an anti-reflection film, which is used to reduce reflected light and protect the laser diode. The optical isolator 107 and the laser diode are arranged at an angle, and the angle between the optical isolator 107 and the laser diode is greater than 0° and less than or equal to 16°. Preferably, the isolator and the laser diode are arranged at an angle of 12-14°. In this angle range, the laser diode as a light source can be protected, and the optical coupling loss will not be increased.

[0039] The optical isolator 107 includes a polarizer, two polarizers are symmetrically arranged, and a mounting space is left between the two polarizers. The polarizer is used to limit the polarization direction of light to ensure that only light meeting a specific polarization direction can pass through. A Faraday rotator is located between the two polarizers, and the Faraday rotator is used to rotate the polarization plane of light. A half-wave plate is located between the optical isolator 107 and the optical fiber array 108, and the half-wave plate is used to isolate the light signal returned from the second optical fiber to the first optical fiber.

[0040] An optical fiber array 108 is located on the output end of the optical isolator 107, and the optical fiber array 108 is attached to the output end of the optical isolator 107. The compact structure of the optical fiber array 108 can integrate more optical fibers 109 in a limited space, improving the integration of the optical module emission assembly. A plurality of optical fibers 109 are connected to the optical fiber array 108, and the optical fibers 109 are used to conduct laser signals to the signal output end of the optical module.

[0041] The positioning base is located in the mounting gap, the lower end surface of the positioning base is attached to the transmitting end substrate 101, the positioning base has a mounting space thereon, the optical isolator 107 and the optical fiber array 108 are mounted on the positioning base, and the positioning base is used for fixing and supporting the optical isolator 107 and the optical fiber array 108, so that they can work stably; the V-shaped groove is formed in the positioning base, and the optical fiber is obliquely arranged in the V-shaped groove, and the oblique angle of the optical fiber is greater than 0° and less than or equal to 16°, and in this embodiment, the optical fiber is obliquely arranged in the V-shaped groove by 8°.

[0042] As shown in Figure 2 The protection cover 200 is provided with a positioning groove matched with the positioning base, and the protection cover 200 is mounted on the PCB 100 and the transmitting end substrate 101 through the positioning groove matched with the positioning base, and the contact surface of the protection cover 200 and the PCB 100 and the transmitting end substrate 101 is bonded by glue, and the protection cover 200 is used for protecting the transmitting assembly from pollution and physical damage.

[0043] The assembly process of the application is as follows: the transmitting end substrate 101 is clamped with the mounting gap of the PCB 100 through the mounting part, and is fixed by glue bonding, the elements such as the laser chip 103, the thermistor 104, the lens 105 and the thermoelectric cooler 106 are mounted on the transmitting end substrate 101 and the PCB 100, and the circuit is connected, the optical elements such as the optical isolator 107 and the optical fiber array 108 are mounted on the positioning base, and the positioning base is mounted in the mounting gap, and finally the protection cover 200 is mounted, and is matched with the positioning base through the positioning groove, and is fixed by glue bonding.

[0044] In use, the laser chip 103 generates laser output when working, the lens 105 focuses the laser, and the optical isolator 107 allows the laser to pass and blocks the reflected light. The thermistor 104 obtains the working temperature of the laser chip 103 in real time and sends it to the thermoelectric cooler 106, and the thermoelectric cooler 106 adjusts the cooling or heating according to the temperature information to keep the laser chip 103 working in the set temperature range, and in this process, the heat is transferred to the transmitting end substrate 101 and dissipated outward through the substrate.

[0045] As described above, compared with the existing sealed TOSA design, the scheme proposed in the application realizes good heat dissipation performance under the premise of compact structure through the design of heat dissipation structure, optimization of optical performance and compactness of the whole structure, while ensuring the optical performance, which not only meets the needs of miniaturization and high density of optical modules, but also improves the reliability and service life of the optical modules.

[0046] In the description of the application, it should be noted that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship commonly understood by those skilled in the art, only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, the terms "first", "second", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the application, it should be noted that unless otherwise specified and limited, the terms "provided", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances. In this paper, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, in addition to containing the listed elements, but also containing other elements not explicitly listed.

[0047] The basic principles, main features and advantages of the application are shown and described above. Those skilled in the art should understand that the application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the application, and various changes and improvements can be made without departing from the spirit and scope of the application, and these changes and improvements all fall within the scope of the claimed application. The scope of protection of the application is defined by the appended claims and their equivalents.

Claims

1. A light module emitting assembly with heat dissipation structure, comprising a PCB board, characterized in that, The PCB is provided with a mounting gap, the mounting gap is arranged along the height direction of the PCB and penetrates the PCB, further comprising, The transmitting end substrate is located below the PCB, and the upper end surface of the transmitting end substrate is attached to the lower end surface of the PCB; The laser chip is connected to the corresponding terminal on the PCB by gold wire; The thermistor is communicatively connected to the laser chip, and is used to obtain the working temperature of the laser chip in real time; The thermoelectric cooler is located in the mounting gap, the lower end surface of the thermoelectric cooler is in contact with the transmitting end substrate, the thermoelectric cooler is communicatively connected to the signal output end of the thermistor, and the thermoelectric cooler is used to adjust the working temperature of the laser chip according to the temperature information fed back by the thermistor; The lens is located on the laser output end of the laser chip, and the lens is used to focus the laser emitted by the laser chip; The optical isolator is located on the output end of the lens, and the optical isolator is arranged at an angle between the laser chip; The optical fiber array is located on the output end of the optical isolator, the optical fiber array is attached to the output end of the optical isolator, and a plurality of optical fibers are connected to the optical fiber array.

2. The optical module emitting assembly with heat dissipation structure according to claim 1, characterized in that, The transmitting end substrate is provided with an upwardly protruding mounting portion, the mounting portion is matched with the mounting gap on the PCB, the transmitting end substrate is clamped with the PCB through the cooperation of the mounting portion and the mounting gap, and is fixed by adhesive.

3. The optical module emitting assembly with heat dissipation structure according to claim 1, characterized in that, The surface of the optical isolator is coated with an anti-reflective film for reducing reflected light, and the optical isolator is arranged at an angle with the laser chip.

4. The optical module emitting assembly with heat dissipation structure according to claim 3, characterized in that, The optical isolator is arranged at an angle with the laser diode.

5. The optical module transmitting assembly with heat dissipation structure according to claim 1, characterized in that, Further comprising a positioning base, the positioning base is located in the mounting gap, the lower end surface of the positioning base is attached to the transmitting end substrate, the positioning base has a mounting space thereon, and the optical isolator and the optical fiber array are mounted on the positioning base.

6. The optical module transmitting assembly with heat dissipation structure according to claim 1, characterized in that, The positioning base is provided with a V-shaped groove, and the optical fiber is arranged in the V-shaped groove.

7. The optical module transmitting assembly with heat dissipation structure according to claim 1, characterized in that, Further comprising a protective cover, the protective cover is provided with a positioning groove, the positioning groove is matched with the positioning base, the protective cover is matched with the positioning base through the positioning groove and is mounted on the PCB and the transmitting end substrate, and is fixed by adhesive.

8. The optical module transmitting assembly with heat dissipation structure according to claim 1, wherein, The transmitting end substrate is a metal member with good thermal conductivity.

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