Design method of novel modularized flat plate type control unit

Abstract

The invention relates to a structural design of a hardware control unit, in particular to a design method of a novel modular flat plate type control unit, which adopts a structure of a plurality of mutually independent control daughter boards and a single control backboard, and is characterized in that the backboard is provided with a plurality of board-to-board connectors for plugging the control daughter boards; each control daughter board is provided with a board-to-board connector connected with the backboard. A power supply and a wire-to-board connector are also integrated on the back plate; the power supply supplies power to each control daughter board through the board-to-board connector, and each board-to-board connector realizes communication among the control daughter boards through an internal circuit; and the line-to-board connector provides a signal channel for each control daughter board. According to the invention, the advantages of simplicity, small volume, light weight and low cost of a traditional flat plate type structure and the advantages of modularization, high expansibility and easy replaceability of a case type structure are combined. The control unit can be integrated with a converter power module, and is suitable for the fields of multiphase motor control, new energy inverter grid connection, industrial frequency conversion and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the structural design of a hardware control unit, specifically a new modular flat panel control unit design method. BACKGROUND

[0002] Hardware control units are crucial in modern technology and are widely used in energy storage grid connection, rail transit, and new energy vehicle fields. In energy storage grid connection, hardware control units manage battery charging and discharging, enabling efficient energy conversion and stable power supply, and optimizing grid operation through real-time monitoring. In the field of rail transit, control units are used for train automatic control and scheduling to ensure safe operation and manage communication between trains, while also having fault diagnosis functions to improve operational efficiency and safety. In new energy vehicles, control units are responsible for battery management, power system control, and energy recovery, improving vehicle performance and range through precise control of motors and batteries, increasing energy efficiency, and promoting the popularization of new energy vehicles. These applications demonstrate the importance of hardware control units in improving system performance, energy efficiency, and safety.

[0003] Existing technology one is based on a chassis control unit, which uses modular design to connect multiple hardware boards with different functions to the backplane through slots, and uses bus protocols to realize data communication between boards. Independent power modules provide power to each board through power lines and connectors. However, this technology has the following disadvantages: (1) Chassis control units are large and heavy.

[0004] (2) Since the chassis is usually a custom part, it is produced by CNC machining, which has relatively high production costs and is expensive.

[0005] (3) Hardware boards are inserted into the control unit through slots, which are usually fixed on the chassis shell. Once the slot is deformed or damaged, the board cannot be easily inserted or removed.

[0006] Existing technology two is based on a flat panel control unit, where a single hardware board can meet multiple control requirements. The board is divided into different functional blocks internally, and internal data communication is achieved through bus protocols. The power module is integrated into the board, and each functional block is powered through internal wiring and copper foil. However, this technology has the following disadvantages: (1) The board has single functions and is difficult to expand.

[0007] (2) The hardware structure is fixed and cannot be replaced or upgraded.

[0008] (3) Failure of a certain hardware module may cause the entire board to malfunction. SUMMARY

[0009] The application provides a design method of a novel modular flat plate type control unit.

[0010] The application adopts the following technical scheme: a design method of a novel modular flat plate type control unit, the modular flat plate type control unit adopts a plurality of mutually independent control sub-plates and a single control back plate structure, a plurality of plate-to-plate connectors for plugging the control sub-plates are arranged on the back plate, and a plate-to-plate connector connected with the back plate is arranged on each control sub-plate; a power supply and a wire-to-plate connector are further integrated on the back plate; the power supply realizes power supply for each control sub-plate through the plate-to-plate connector, and each plate-to-plate connector realizes communication between each control sub-plate through an internal circuit; and the wire-to-plate connector provides a signal path for the control unit (main control plate).

[0011] The application designs a novel modular flat plate type control unit, which combines the advantages of simplicity, light volume and weight and low cost of a traditional flat plate type structure and the advantages of modularity, high expansibility and easy replaceability of a case type structure.

[0012] Further, the control sub-plate comprises a main control plate, a DIO digital input and output plate and an analog sampling plate.

[0013] Further, the main control plate comprises a main control chip, a communication module, a storage chip, a power conversion chip, a level conversion chip and a plate-to-plate connector; the main control chip is used for realizing analog / digital conversion function and digital signal processing function, the level conversion chip is used for outputting PWM pulse control, the power conversion chip is used for converting the voltage input on the back plate into a common voltage of the main control chip, the communication module is used for realizing communication of various bus protocols, and the storage chip is used for realizing data storage function.

[0014] Further, the DIO digital input and output plate comprises a level conversion chip, a direction control chip, a signal isolator, a shaping and level converter, an overvoltage protector and a plate-to-plate connector; the DIO digital input and output plate is used for converting an external high-voltage level signal into a low-voltage signal acceptable by the main control plate as an operation instruction, or improving the voltage of a level signal emitted by a chip to improve external output power, so as to control a high-voltage device.

[0015] Further, the function of the analog sampling plate is to filter and condition a voltage, current or temperature analog signal measured by a sensor, and convert the voltage, current or temperature analog signal into a voltage signal acceptable by an analog-to-digital converter on the main control plate, so as to be used for inverter closed-loop control and over-temperature protection.

[0016] Further, the master control chip is DSP28335; the host computer instruction is transmitted through the line-to-board connector, is converted through the communication module and is transmitted to the DSP28335, the master control chip loads the program and the parameter in the storage chip; the external analog signal is conditioned through the analog sampling board, is transmitted to the master control board through the board-to-board connector, the ADC analog-digital converter in the DSP28335 converts it into digital quantity, enters the program and carries out system closed loop control; the PWM voltage pulse generated by the DSP28335 operation is boosted, is shaped, is damped through the level conversion chip, is transmitted to the line-to-board connector through the board-to-board connector and the backplane, and triggers the switching tube; the DSP transmits the collected analog information and the running state back to the host computer through the communication module and the line-to-board connector; the communication module adopts the transceiver for compatible I2C, CAN, SCI communication.

[0017] Further, the shaping level converter in the DIO digital input and output board adopts the Schmidt trigger, shapes the signal, eliminates the dithering and the ringing, improves the slope of the rising and falling edges of the signal and reduces the voltage amplitude to within the voltage withstand range of the DSP port; the DIO digital input and output board utilizes the direction control chip to automatically identify the signal flow direction, realizes the bidirectional flow of the digital signal; when used for digital input, the external high-voltage digital signal is limited in amplitude through the voltage protector and is isolated through the signal isolator and then is transmitted to the inside of the DIO digital input and output board; the signal is transmitted to the backplane through the board-to-board connector and is transmitted to the master control board.

[0018] Further, the analog sampling board is divided into two categories, one is used for AC and DC voltage and current sensor sampling signal conditioning, and the other is used for temperature signal sampling of thermal resistance; For AC and DC voltage and current sensor sampling signal sampling, the analog sampling board includes resistance sampling, resistance-capacitance filtering, operational amplifier, bias network and board-to-board connector; the voltage and current signals output by the sensor are first divided by the sampling resistor, the high-frequency signal interference is suppressed by using resistance-capacitance filtering, then the signal is conditioned by using the operational amplifier, the input impedance of the signal source is improved and the output impedance is reduced; the bias network provides DC bias for the AC signal to realize AC sampling; when collecting DC signals, the bias network is shielded by changing the resistance connection mode; For temperature signal sampling of thermal resistance, the analog sampling board includes a bridge connected with the thermal resistance, an operational amplifier, resistance-capacitance filtering and a board-to-board connector; when the resistance value changes due to temperature change, the voltage across the bridge will change linearly; the voltage is processed and filtered by the operational amplifier and is transmitted to the master control board through the board-to-board connector, for monitoring the temperature of the motor and the power module.

[0019] The beneficial effects brought by the technical scheme of the application are: The application combines the advantages of flat plate type and cabinet type control units, is small in size, and has a volume about half of that of the cabinet type control unit when realizing similar functions, and is lower in cost, and high cost of opening mold of the cabinet is avoided. Internal modular design is adopted, and the board can be flexibly changed according to different projects. When high computing power and multi-channel sampling are required, the demand can be realized by replacing the main control board and the sampling board, without replacing the backboard. The voltage and current sampling board is designed in a general type, and only needs to change the bias network to realize AC and DC voltage signal sampling. One DIO board can realize digital input and output. If a sub-board is damaged, the board can be replaced to continue to use, and the whole control unit is not disabled due to a single fault, and the hardware cost is saved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Overall schematic diagram of the control unit.

[0021] Figure 2 Schematic diagram of the main control board.

[0022] Figure 3 Schematic diagram of the DIO board.

[0023] Figure 4 Schematic diagram of the voltage and current sampling board.

[0024] Figure 5 Schematic diagram of the thermal resistance temperature sampling board. DETAILED DESCRIPTION

[0025] The modular flat plate type control unit of the application is a structure of multiple control sub-boards + a single control backboard, each sub-board is independent of each other, and is connected to the backboard through a board-to-board connector. The overall structure is as shown in Figure 1 .

[0026] According to different functions, the sub-boards can be divided into a main control board, a DIO digital input and output board, and an analog sampling board, and a power supply and an external interface (wire-to-board connector) are integrated on the backboard.

[0027] The main control board is the core of the control unit, and contains components such as a main control chip, a communication module, a storage chip, a power conversion chip, a level conversion chip and a board-to-board connector. Its functions include analog / digital conversion, digital signal processing, PWM pulse control, multi-bus protocol communication and data storage.

[0028] The DIO board is composed of a level conversion chip, an isolator, a Schmidt trigger, an overvoltage protector and a board-to-board connector. Its role is to convert external high-voltage level signals into low-voltage signals acceptable by the main control chip as operation instructions, or to raise the voltage of the level signals emitted by the chip to improve the output power to the outside, so as to control high-voltage devices such as contactors and relays.

[0029] The analog quantity sampling board is composed of operational amplifier, sampling resistor and board-to-board connector, etc. Its function is to filter and condition the analog signals such as voltage, current or temperature measured by the sensor, and convert them into voltage signals acceptable by the analog-digital converter on the main control board, for use in the closed-loop control of the converter and over-temperature protection.

[0030] The backboard is the carrier of all the sub-boards, and can supply power to each sub-board and provide signal paths.

[0031] The structure of the main control board is shown in the embodiment Figure 2 The backboard provides 5V DC power for the main control board through the pin header, and 3.3V and 1.9V DC power is obtained by voltage reduction through the linear voltage regulator, for powering the DSP and other chips. The instructions from the host computer are transmitted through the wire-to-board connector, and are converted by the communication module and transmitted to the DSP, to control the chip to load the program and parameters in the storage chip. The external analog signals are conditioned by the sampling board, transmitted to the main control board through the wire-to-board connector of the backboard, converted into digital signals by the ADC module in the DSP, and entered into the program for closed-loop control of the system. The PWM voltage pulses generated by the DSP operation are boosted, shaped and de-bounced by the level conversion chip, transmitted to the wire-to-board connector through the board-to-board connector and the backboard, and trigger the switching tube. Finally, the collected analog information and operating status of the DSP are transmitted back to the host computer through the communication module and the connector.

[0032] The structure of the DIO board is shown in Figure 3 The board uses a direction control chip to automatically identify the signal flow direction, to realize the bidirectional flow of digital signals. When used for digital input, the external high-voltage digital signal is limited in amplitude by the protection circuit, and is isolated by the signal isolator before being transmitted to the inside of the control board. The Schmitt trigger shapes the signal, eliminates jitter and ringing, improves the rising and falling edge slopes, and reduces the voltage amplitude. Finally, the signal is transmitted to the backboard through the pin header (board-to-board connector), and to the main control board.

[0033] The analog quantity sampling board is divided into two categories, one for AC / DC voltage and current sensor sampling signal conditioning, and the other for PT100 and other thermal resistance temperature signal sampling. The outputs of these two types of boards are both 3V voltage signals, and the chip power supply ranges are consistent, so the same board-to-board connector is used on the backboard, and different boards can be plugged in according to different measurement requirements.

[0034] For voltage and current signal sampling, the structure of the board is shown in Figure 4The voltage current signal outputted by the sensor is first divided by a sampling resistor, and high frequency signal interference is suppressed by a resistance-capacitance filter. Subsequently, the signal is conditioned using a precision operational amplifier, which increases the input impedance of the signal source and reduces the output impedance. The bias network is composed of series and parallel resistors, which can provide DC bias for AC signals to achieve AC sampling. When collecting DC signals, the resistance connection mode can be changed to shield the bias network.

[0035] The temperature signal sampling board structure based on a thermal resistance is as shown in Figure 5 The thermal resistance is connected to the board card as part of the bridge. When the temperature changes, the resistance value changes, and the voltage across the bridge changes linearly. After the voltage is processed and filtered by the operational amplifier, it is transmitted to the main control board through the pin header (board-to-board connector) for monitoring the temperature of the motor and power module.

[0036] The backplane serves as the carrier of all independent sub-boards, providing signal paths and power supply for the main control board, DIO board, and analog board. The whole board is powered by 9V to 36V DC, and the power is converted by multiple power modules, which integrate short circuit, overvoltage, and undervoltage protection. The external interface (wire-to-board connector) is integrated on the backplane, which can realize mainstream communication modes such as CAN, 485, and 232, and contains multiple external pulse interfaces, supporting two-level and three-level control strategies.

[0037] Technical features of the present application: (1) Mechanical-electrical collaborative design of modular pluggable architecture The modular pluggable architecture is adopted, and the backplane and control sub-board are connected through high-density board-to-board connectors to realize power and data bus integrated interconnection. This architecture integrates redundant power supply circuits and differential signal transmission channels, and ensures the reliability of plugging through mechanical-electrical linkage design. It can quickly implement function module replacement and function reuse according to application scenarios, build an expandable control system with fault tolerance mechanism, and significantly improve the flexibility of hardware configuration and the level of system redundancy.

[0038] (2) Minimum system design of high-integration core control board The main control system adopts a 32-bit embedded processor architecture, integrates a hardware floating point unit (FPU), and can efficiently execute complex control algorithms. The built-in 12-bit high-precision ADC module realizes analog signal digitization processing; the level conversion circuit is configured synchronously, compatible with CAN, RS232, RS485 and other standard communication protocols. The control program and running data are stored in the external FLASH memory, and high-speed data interaction is realized through the bus expansion interface. Through core device selection and function module optimization, this board card builds a minimum control system with complete peripheral interfaces, meeting the technical requirements of modern converters for real-time control, accurate sampling, and reliable communication.

[0039] (3) Automatic flow control type digital panel card circuit design Based on the principle of differential signal detection, an intelligent flow direction discrimination circuit is designed. Through the real-time comparison of the potential difference between the input signal and the reference voltage by a high-speed comparator (direction control chip), the logic level high-low signal is output to drive the MOS switch to realize path switching. A digital signal bidirectional transmission channel with adaptive adjustment capability is built to realize intelligent flow direction management of I / O ports.

[0040] (4) Multi-modal signal conditioning circuit and standardized mechanical-electrical interface collaborative design By designing operational amplifier circuit and resistance divider network, the output of voltage, current and temperature signals is conditioned and standardized to 0V-3.3V standard range. At the same time, the interface definition of the sampling board and backplane connector is standardized, and finally the generalization integration of voltage, current and temperature acquisition modules is realized.

[0041] (5) AC / DC mixed signal conditioning circuit design Based on the programmable bias network architecture, an intelligent bias control system is designed. The variable bias topology is constructed by using operational amplifier, electronic switch and dynamic resistance array. Through the intelligent switching of digital logic circuit, the configuration mode of series and parallel connection is realized, the precise enablement and dynamic adjustment of DC bias voltage are realized, the intelligent sensing interface supporting AC / DC mixed signal sampling is constructed, and the flexible adaptation demand of AC / DC multi-modal voltage and current detection is met.

Claims

1. A design method for a novel modular flat-panel control unit, characterized in that: The modular flat-panel control unit adopts a structure of multiple independent control sub-boards and a single control backplane. The backplane is equipped with multiple board-to-board connectors for plugging into the control sub-boards, and each control sub-board is equipped with a board-to-board connector that connects to the backplane. The backplane also integrates a power supply and a wire-to-board connector. The power supply provides power to each control sub-board through the board-to-board connectors, and the board-to-board connectors enable communication between the control sub-boards through internal circuits. The wire-to-board connectors provide signal paths for the control unit to the outside world.

2. The design method of a novel modular flat-panel control unit as described in claim 1, characterized in that, The control subboard includes a main control board, a DIO digital input / output board, and an analog sampling board.

3. The design method of a novel modular flat-panel control unit as described in claim 2, characterized in that, The main control board includes a main control chip, a communication module, a storage chip, a power conversion chip, a level conversion chip, and a board-to-board connector. The main control chip is used to implement analog-to-digital conversion and digital signal processing functions. The level conversion chip is used to output PWM pulse control. The power conversion chip is used to convert the voltage input on the backplane into the voltage commonly used by the main control chip. The communication module is used to implement communication using multiple bus protocols. The storage chip is used to implement data storage functions.

4. The design method of a novel modular flat-panel control unit as described in claim 2, characterized in that, The DIO (Digital Input / Output) board includes a level conversion chip, a direction control chip, a signal isolator, a shaping and level converter, an overvoltage protector, and a board-to-board connector. Its function is to convert external high-voltage level signals into low-voltage signals acceptable to the main control board as operating instructions, or to increase the voltage of the level signal emitted by the chip to increase the external output power, thereby controlling high-voltage equipment.

5. The design method of a novel modular flat-panel control unit as described in claim 2, characterized in that, The analog sampling board filters and conditions the analog voltage, current, or temperature signals measured by the sensors, converting them into voltage signals acceptable to the analog-to-digital converter on the main control board for converter closed-loop control and over-temperature protection.

6. The design method of a novel modular flat-panel control unit as described in claim 3, characterized in that, The main control chip is a DSP28335. Commands from the host computer are transmitted via a line-to-board connector, converted by the communication module, and then sent to the DSP28335. The main control chip loads the program and parameters stored in its memory chip. External analog signals are conditioned by an analog sampling board and transmitted to the main control board via a board-to-board connector. The DSP28335's internal ADC converts these signals into digital signals, which are then used in the program for closed-loop system control. The PWM voltage pulses generated by the DSP28335 are boosted, shaped, and debounced by a level conversion chip and transmitted to the line-to-board connector via the board-to-board connector and backplane, triggering the switching transistors. The DSP transmits the collected analog information and operating status back to the host computer via the communication module and the line-to-board connector. The communication module uses a transceiver compatible with I2C, CAN, and SCI communication.

7. The design method of a novel modular flat-panel control unit as described in claim 4, characterized in that, The shaping and level shifting functions in the DIO (Digital Input / Output) board employ Schmitt triggers to shape signals, eliminate jitter and ringing, improve the slope of the signal rise and fall edges, and reduce the voltage amplitude to within the withstand voltage range of the DSP port. The DIO board utilizes a direction control chip to automatically identify the signal flow direction, enabling bidirectional flow of digital signals. When used for digital input, external high-voltage digital signals are limited by a voltage protector and isolated by a signal isolator before being transmitted to the DIO board. The signal is then transmitted to the backplane and the main control board via a board-to-board connector.

8. The design method of a novel modular flat-panel control unit as described in claim 5, characterized in that, Analog sampling boards are divided into two main categories: one is used for conditioning sampling signals from AC / DC voltage and current sensors, and the other is used for sampling temperature signals from resistance temperature detectors (RTDs). For sampling AC / DC voltage and current sensor signals, the analog sampling board includes resistor sampling, RC filtering, operational amplifier, bias network, and board-to-board connectors. The voltage and current signals output by the sensor are first divided by the sampling resistor, and RC filtering is used to suppress high-frequency signal interference. Subsequently, the operational amplifier is used to condition the signal, increasing the input impedance of the signal source and reducing the output impedance. The bias network provides DC bias for AC signals to enable AC sampling; when acquiring DC signals, the bias network is shielded by changing the resistor connection method. For sampling the temperature signal of the RTD, the analog sampling board includes a bridge circuit connected to the RTD, an operational amplifier, an RC filter, and a board-to-board connector. When the temperature changes and the resistance value changes, the voltage across the bridge circuit changes linearly. After being processed and filtered by the operational amplifier, this voltage is transmitted to the main control board through the board-to-board connector to monitor the temperature of the motor and power module.

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