Air guiding device for high-performance server

Abstract

The application discloses a kind of high-performance server's air guide device, comprising: cabinet, the top of cabinet is equipped with machine cover by screw, the inside of the cabinet is provided with circuit board, a plurality of electrical components are provided on the circuit board, controller panel and back panel are connected on the circuit board, a plurality of temperature sensors are provided on the circuit board;Multiple sets of negative pressure air guide mechanism are installed in the bottom of machine cover, and the same cooling cavity is connected to multiple sets of negative pressure air guide mechanism, the cooling cavity is installed in the bottom of machine cover, multiple sets of fans are provided in the cooling cavity, and multiple sets of fans are one-to-one corresponding with multiple sets of negative pressure air guide mechanism.The device combines venturi negative pressure suction principle with adaptive air duct adjustment technology based on memory metal, effectively solves the two technical bottlenecks of heat dead zone removal and dynamic heat load adaptation in traditional server air cooling, by constructing a multi-level collaborative intelligent cooling system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server air guide and heat dissipation, in particular to an air guide device for high-performance servers. BACKGROUND

[0002] Servers generate a large amount of heat during operation. Common heat dissipation methods include liquid cooling and air cooling. Air-cooled servers have good heat dissipation effect and are easy to maintain, so they account for a large share of the market.

[0003] In the field of heat dissipation for high-performance servers, existing technologies mainly rely on the following mainstream solutions:

[0004] Forced air cooling system: This is the most common technology. By arranging multiple high-speed axial flow fans in the case, a directional air flow is formed to blow cold air through the heat dissipation fins on the surface of heat-generating components (such as CPUs and memories), thereby removing heat. Its effect depends on the continuous improvement of fan quantity, wind pressure and air volume.

[0005] Heat pipe heat conduction technology: commonly used for high-power chips such as CPUs. Through the phase change cycle of the working medium in the vacuum pipe, the heat generated by the chip is efficiently conducted to a larger heat dissipation fin array away from the chip, and then the heat on the fins is blown away by the fan.

[0006] Liquid cooling technology: For extremely high-power data center servers, liquid cooling solutions are used, including cold plate type (liquid flows directly through the cold plate attached to the chip) and immersion type (the entire server is immersed in insulating coolant), with much higher heat dissipation efficiency than air cooling.

[0007] Although the existing air cooling technology is widely used, it has inherent defects: first, there are "dead zones" in the air flow, such as areas under the chip that are difficult to cover with the main air duct, causing heat accumulation; second, uneven cooling, fixed air ducts cannot intelligently adapt to the dynamic heat load of different components, leading to local overheating or excessive cooling, and low energy efficiency. SUMMARY

[0008] To overcome the shortcomings of the prior art, the present application provides an air guide device for high-performance servers. The prior art has "dead zones" in the air flow, such as areas under the chip that are difficult to cover with the main air duct, causing heat accumulation; uneven cooling, fixed air ducts cannot intelligently adapt to the dynamic heat load of different components, leading to local overheating or excessive cooling, and low energy efficiency.

[0009] To solve the above technical problems, the present application provides the following technical solutions:

[0010] An air guide device for high-performance servers, comprising:

[0011] The shell is provided with a circuit board in the inside, a plurality of electrical elements are arranged on the circuit board, a controller panel and a rear panel are connected to the circuit board, and a plurality of temperature sensors are arranged on the circuit board.

[0012] A plurality of negative pressure air guide mechanisms are arranged on the bottom of the cover, and a same cooling cavity is connected to the plurality of negative pressure air guide mechanisms.

[0013] A plurality of air guide and blowing mechanisms are fixedly connected to the plurality of negative pressure air guide mechanisms.

[0014] A plurality of heat conduction structures are arranged on the inner wall of the bottom of the shell and correspond to the plurality of air guide and blowing mechanisms.

[0015] Preferably, a plurality of air inlet holes are arranged on the outer side of the shell and correspond to the cooling cavity.

[0016] Preferably, a plurality of memory metal air outlet pipes are embedded in the outer side of the shell, the memory metal air outlet pipes are normally curved structures, can send the airflow in the shell upwards for recycling, if the temperature is too high, the memory metal air outlet pipes are heated to be straightened, and the hot air is discharged by the memory metal air outlet pipes, the memory metal air outlet pipes are made of nickel-titanium alloy thermal shape memory material.

[0017] Preferably, a plurality of semiconductor refrigerators are embedded in the top of the cover, the refrigeration surfaces of the plurality of semiconductor refrigerators are located in the inside of the cooling cavity and in front of the fans, the heat dissipation surfaces of the plurality of semiconductor refrigerators are located on the top of the cover, a plurality of air holes are arranged on the side of the cooling cavity, and the negative pressure air guide mechanism is connected to the cooling cavity through the air holes.

[0018] Preferably, the negative pressure air guide mechanism comprises three Venturi units, the three Venturi units are arranged in series, the Venturi unit comprises a converging section, a throat and a diffuser section, the converging section, the throat and the diffuser section are fixedly connected in sequence, two negative pressure pipes are connected to the bottom side of the throat, the two negative pressure pipes are made of flexible material, the Venturi units are connected in series, the diffuser section of each unit is fixed to the converging section of the next unit through a flange and a sealing ring, the airflow is smooth, and the negative pressure pipe of the throat is made of silica gel hose.

[0019] Preferably, a plurality of fixed plates are fixedly arranged on the bottom of the cover, an arc-shaped socket is arranged on each of the plurality of fixed plates, and the throat is fixed to the bottom of the cover through the arc-shaped socket.

[0020] Preferably, the air guide and blowing mechanism comprises a bend pipe, the bend pipe is fixedly communicated with the negative pressure air guide mechanism, the bend pipe is a curved structure, a flexible hose is communicated with the tail end of the bend pipe, and a duckbill blowing nozzle is communicated with the flexible hose.

[0021] Preferably, the bottom side of the bend pipe is fixedly communicated with a flexible hose, the inner side of the flexible hose is fixedly communicated with a memory metal spring, the top end of the memory metal spring is fixedly connected with the bottom side of the duckbill blowing nozzle, and the bottom side of the support member is provided with a heat conduction groove, which is located below the memory metal spring.

[0022] Preferably, the heat conduction structure comprises a heat conduction cavity, the heat conduction cavity is fixedly installed on the bottom inner wall of the shell and located below the circuit board, a plurality of heat dissipation fins are fixedly arranged on the top of the heat conduction cavity, a plurality of conduction cores are arranged in the heat dissipation fins, a heat conduction strip is fixedly arranged in the heat conduction cavity, the plurality of conduction cores are connected with the heat conduction strip, a heat conduction core is connected with the heat conduction strip, a support cylinder is fixedly installed on the top of the heat conduction cavity and matched with the heat conduction groove, and the heat conduction core is located in the support cylinder.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] The Venturi tube group of the negative pressure air guide mechanism is used to generate local negative pressure at the throat by Bernoulli's principle, form passive and strong suction force, accurately and efficiently suck out hot air in the airflow stagnation area such as the bottom of the circuit board chip and the gap between high-density elements which cannot be reached by traditional air cooling, and fundamentally solve the industry problem of "dead zone" overheating. Compared with the traditional method of simply increasing fan pressure or air volume, the present application realizes the transformation of the cooling mode from "blowing" to "suction and blowing", which is an innovation in cooling principle, and the heat dissipation efficiency is significantly improved.

[0025] The coupling design of the memory metal spring and the heat conduction structure realizes passive and self-adaptive adjustment of the outlet angle. When the local element temperature rises, the system can automatically switch the cooling air flow from the "long-distance scattering" mode to the "short-distance focusing" mode, realize the on-demand distribution of cooling resources, effectively prevent local overheating, and ensure the temperature uniformity of the whole system. Without additional sensors and controller driving, the response is rapid and the structure is reliable, which solves the problem that the fixed air duct cannot adapt to the dynamic heat load change.

[0026] The present application can automatically select heat recovery or direct discharge mode according to the exhaust temperature through the design of the memory metal exhaust pipe. At low load, part of the low-temperature exhaust gas is recovered to reduce the refrigeration energy consumption; at high load, the high-temperature exhaust gas is directly discharged to prevent heat reflux. The energy recovery concept is combined with intelligent temperature control materials to realize energy-saving operation under the premise of ensuring the heat dissipation effect, which meets the current green computing and data center "double carbon" target requirements.

[0027] The present application is not a single technology stack, but an organic integration of active refrigeration, Venturi effect, adaptive directional air supply and intelligent heat discharge into a complete system, with complementary advantages of cooling technologies at each level, and synergistic enhancement. A system-level heat dissipation solution is provided, which breaks through the performance bottleneck of single cooling technology and better meets the growing heat management needs of future high-performance servers.

[0028] The present application combines the Venturi negative pressure suction principle with the adaptive air duct adjustment technology based on memory metal, effectively solving the two technical bottlenecks of heat dead zone removal and dynamic heat load adaptation in traditional server air cooling. By constructing a multi-level collaborative intelligent cooling system, the device can significantly improve the heat dissipation efficiency, operation stability and reliability of the server without significantly increasing energy consumption. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a front view structural diagram of the present application;

[0030] Figure 2 It is a bottom view structural diagram of the present application;

[0031] Figure 3 It is a structural diagram of the present application with the case and the cover separated;

[0032] Figure 4 It is a bottom view structural diagram of the present application with the case and the cover separated;

[0033] Figure 5 It is a structural diagram of the present application with the cover, cooling cavity, negative pressure air guide mechanism, air guide blowing mechanism, heat conduction structure and related parts;

[0034] Figure 6 It is a bottom view structural diagram of the present application with the cover, cooling cavity, negative pressure air guide mechanism, air guide blowing mechanism, heat conduction structure and related parts;

[0035] Figure 7 It is a structural diagram of the present application with the cover, air guide blowing mechanism, heat conduction structure and related parts;

[0036] Figure 8 It is a bottom view structural diagram of the present application with the cover, air guide blowing mechanism, heat conduction structure and related parts;

[0037] Figure 9 The structure schematic diagram of the negative pressure air guide mechanism and the air guide blowing mechanism of the application is shown in the figure.

[0038] Figure 10 The structure schematic diagram of the negative pressure air guide mechanism and the air guide blowing mechanism of the application is shown in the figure.

[0039] Figure 11 The perspective structure schematic diagram of the machine cover, the cooling cavity, the fixed plate and the related parts thereof is shown in the figure.

[0040] Figure 12 The structure schematic diagram of the heat conduction structure is shown in the figure.

[0041] Figure 13 The structure schematic diagram of the heat conduction structure is shown in the figure.

[0042] Wherein: 1, the machine shell; 11, the air inlet hole; 12, the controller panel; 13, the circuit board; 14, the temperature sensor; 15, the back panel; 2, the machine cover; 21, the fixed plate; 22, the arc-shaped bayonet; 3, the memory metal air outlet pipe; 4, the semiconductor refrigerator; 5, the cooling cavity; 51, the air hole; 6, the negative pressure air guide mechanism; 60, the Venturi unit; 601, the converging section; 602, the throat; 603, the diverging section; 604, the negative pressure pipe; 7, the air guide blowing mechanism; 71, the elbow pipe; 72, the flexible hose; 73, the duckbill blowing mouth; 74, the support; 741, the heat conduction groove; 75, the memory metal spring; 8, the fan; 9, the heat conduction structure; 91, the heat conduction cavity; 92, the heat dissipation fin; 93, the support cylinder; 94, the heat conduction core; 95, the heat conduction strip; 96, the conduction core. DETAILED DESCRIPTION

[0043] In order to make the technical means, creative features, purposes and effects of the application easy to understand, the following specific embodiments are further described. The following embodiments are only preferred embodiments of the application, not all. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application. The experimental methods in the following embodiments are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified. EMBODIMENT

[0044] As Figures 1-13As shown, this invention provides an airflow device for a high-performance server, including a housing 1, multiple sets of negative pressure airflow mechanisms 6, multiple sets of airflow blowing mechanisms 7, and multiple sets of heat-conducting structures 9. A cover 2 is screwed onto the top of the housing 1. A circuit board 13 is disposed inside the housing 1, and multiple electrical components are mounted on the circuit board 13. A controller panel 12 and a rear panel 15 are connected to the circuit board 13. Multiple temperature sensors 14 are mounted on the circuit board 13. The multiple sets of negative pressure airflow mechanisms 6 are all installed at the bottom of the cover 2, and the same... A cooling chamber 5 is installed at the bottom of the cover 2. Multiple sets of fans 8 are installed in the cooling chamber 5. The multiple sets of fans 8 are arranged one-to-one with multiple sets of negative pressure air guiding mechanisms 6. Multiple sets of air guiding and blowing mechanisms 7 are fixedly connected to the multiple sets of negative pressure air guiding mechanisms 6. Multiple sets of heat conduction structures 9 are all arranged on the bottom inner wall of the casing 1, and are arranged one-to-one with the multiple sets of air guiding and blowing mechanisms 7. Multiple air inlets 11 are opened on the outer side of the casing 1, and the multiple air inlets 11 are arranged corresponding to the cooling chamber 5. There are at least 3 sets of multiple sets of negative pressure air guiding mechanisms 6, multiple sets of air guiding and blowing mechanisms 7, and multiple sets of fans 8.

[0045] Specifically, housing 1 and cover 2 provide structural support and a sealed environment to protect internal components. The cover facilitates maintenance access. The housing is made of aluminum alloy, 2-4mm thick, with an anodized surface; the cover is made of stamped steel plate, 2-3mm thick, and secured with M4 screws. Anti-vibration pads are added to the bottom of housing 1 to reduce vibration; an EMI shielding layer is attached to the inside of the cover to prevent electromagnetic interference.

[0046] Temperature sensor 14 uses a DS18B20 digital sensor with an accuracy of ±0.5°C, and is installed near each chip with a sampling frequency of 1Hz.

[0047] The controller panel 12 uses an ARM Cortex-M4 microprocessor and supports the Modbus communication protocol; the rear panel includes a gigabit Ethernet port and a USB 3.0 interface. The controller panel 12 integrates an LCD display to show the temperature curve and cooling status in real time.

[0048] like Figures 1-3 As shown, in this embodiment, multiple shape memory metal exhaust pipes 3 are embedded in the outer side of the casing 1. Under normal circumstances, the multiple shape memory metal exhaust pipes 3 have a curved structure, which can transmit the airflow inside the casing 1 upward for recycling. If the temperature is too high, the shape memory metal exhaust pipes 3 will straighten due to heat and discharge the hot air themselves.

[0049] Specifically, the shape memory metal exhaust pipe 3 is made of nickel-titanium alloy thermal shape memory material, with a transition temperature set at 40°C. At low temperatures (<40°C), it remains bent, and the airflow is guided to the vicinity of the top of the cover, where additional portion is recovered through auxiliary return holes designed on the cover; at high temperatures (≥40°C), it straightens and discharges horizontally to avoid hot air recirculation.

[0050] In this embodiment, another embodiment can also increase the guide baffle on the top of the cover 2, guide the airflow in the bending state to the air inlet hole direction, enhance the cold air recovery efficiency.

[0051] As shown in Figures 1-5 In this embodiment, the top of the cover 2 is embedded with a plurality of semiconductor refrigerators 4, the refrigeration surface of the plurality of semiconductor refrigerators 4 is located inside the cooling cavity 5 and in front of the fan 8, and the heat dissipation surface of the plurality of semiconductor refrigerators 4 is located on the top of the cover 2. A plurality of air holes 51 are formed on the side of the cooling cavity 5, and the negative pressure air guide mechanism 6 is connected with the cooling cavity 5 through the air holes 51. The semiconductor refrigerator 4 actively cools, and the cooling cavity 5 concentrates the cooling of the inhaled air.

[0052] Specifically, the semiconductor refrigerator 4 is model TEC1-12706, the maximum refrigeration power is 60W, and the working voltage is 12V DC; the cooling cavity is processed by aluminum profile, the volume is 0.5L, and the inner wall is plated with nickel to enhance heat conduction.

[0053] More specifically, the heat dissipation surface of the semiconductor refrigerator 4 can be connected with copper heat dissipation fins and equipped with a small fan for forced air cooling.

[0054] As shown in Figures 8-10 In this embodiment, the negative pressure air guide mechanism 6 includes three groups of Venturi units 60, which are arranged in series. The Venturi unit 60 includes a converging section 601, a throat section 602 and a diffuser section 603, which are fixedly connected in sequence. The bottom side of the throat section 602 is connected with two negative pressure pipes 604, both of which are made of flexible material.

[0055] Specifically, the Venturi units are connected in series, the diffuser section 603 of each unit is fixed with the converging section 601 of the next unit through flanges and sealing rings to ensure smooth airflow, and the negative pressure pipe 604 of the throat section 602 is made of silica gel hose.

[0056] As shown in Figure 11 In this embodiment, the bottom of the cover 2 is fixedly installed with a plurality of fixed plates 21, and the arc-shaped sockets 22 are formed on the plurality of fixed plates 21. The throat section 602 is fixed on the bottom of the cover 2 through the arc-shaped sockets 22.

[0057] Specifically, the Venturi unit 60 is formed by ABS plastic injection molding, and the negative pressure is generated in the throat by the Venturi effect to suck the hot air in the dead zone.

[0058] More specifically, the Venturi units are connected in series, and each unit is independently fixed on the fixed plate 21. The fixed plate is made of stainless steel, and the radius of the arc-shaped socket 22 matches the outer diameter of the Venturi tube.

[0059] As Figures 7-10 shown in the embodiment, the air guide and blowing mechanism 7 includes a bend pipe 71, which is in fixed communication with the negative pressure air guide mechanism 6. The bend pipe 71 is a curved structure, and a flexible hose 72 is in communication with the tail end of the bend pipe 71. A duckbill blowpipe 73 is in communication with the flexible hose 72. The duckbill blowpipe 73 is inclined. A flexible hose 72 is fixedly connected to the bottom side of the bend pipe 71. A memory metal spring 75 is fixedly connected to the inner side of the flexible hose 72. The top end of the memory metal spring 75 is fixedly connected to the bottom side of the duckbill blowpipe 73. The bottom side of the support 74 is provided with a heat conduction groove 741, which is located below the memory metal spring 75.

[0060] Specifically, the memory metal spring is made of copper-zinc-aluminum memory alloy, and the transition temperature is 35°C. When the temperature is <35°C, the spring is in an elongated state, keeping the duckbill blowpipe 73 inclined upward. When the temperature is ≥35°C, the spring is shortened, pulling the duckbill blowpipe to incline downward. This ensures targeted cooling of close-range components.

[0061] Further, the air guide and blowing mechanism 7 guides the cooling air flow to the circuit board and automatically adjusts the blowing angle through the memory metal spring 75.

[0062] Specifically, the bend pipe 71 is made of PVC material, the flexible hose 72 is a corrugated silicone tube, and the initial inclination angle of the duckbill blowpipe 73 outlet is 45°. For long distances, the duckbill blowpipe 73 is a flat-seam or circular air pipe for concentrating air flow.

[0063] More specifically, the support 74 is made of aluminum, and the heat conduction groove 741 has a depth of 5mm and is in close contact with the heat conduction core 94.

[0064] As Figure 12 , Figure 13 shown in the embodiment, the heat conduction structure 9 includes a heat conduction cavity 91, which is fixedly installed on the inner wall of the bottom of the casing 1 and located below the circuit board 13. A plurality of heat dissipation fins 92 are fixedly arranged on the top of the heat conduction cavity 91. A plurality of conduction cores 96 are arranged in the heat dissipation fins 92. A heat conduction strip 95 is fixedly arranged in the heat conduction cavity 91. The plurality of conduction cores 96 are connected to the heat conduction strip 95. The heat conduction strip 95 is connected to the heat conduction core 94. The heat conduction cavity 91 is fixedly installed with a support cylinder 93 which is matched with the heat conduction groove 741. The heat conduction core 94 is located in the inside of the support cylinder 93.

[0065] Specifically, the heat dissipation fins 92 are connected to the heat conduction strip 95 by welding. The heat conduction strip 95 is made of copper, and the heat conduction coefficient is 385 W / mK. The heat conduction core 94 is directly embedded in the support cylinder 93 and in contact with the heat conduction groove 741, ensuring that the heat is quickly transferred to the memory metal spring. The support cylinder 93 is made of ceramic material, which is insulating and heat-resistant.

[0066] Working mode: when in use, the power supply and the controller panel 12 are turned on, the multiple sets of temperature sensors 14, the multiple sets of semiconductor refrigerators 4, and the multiple sets of fans 8 are connected with the controller panel 12, the temperature of the circuit board 13 is monitored through the multiple sets of temperature sensors 14, the fan 8 works to suck the air outside through the air inlet hole 11 into the inside of the cooling cavity 5, the multiple semiconductor refrigerators 4 refrigerate the inside of the cooling cavity 5 to form a cold cavity, the cooled air enters the negative pressure air guide mechanism 6, flows through the multiple sets of Venturi units 60, first enters the converging section 601, then passes through the throat section 602, and finally passes through the diffusing section 603 to enter the next stage, when the cooling airflow flows through the Venturi unit 60, according to Bernoulli's principle, the flow rate is the largest and the static pressure is the lowest at the throat section 602, thereby generating a local negative pressure area at the throat section, which is sucked through the negative pressure pipe 604 to form a passive suction force, forcibly sucking out the stagnant hot air accumulated at the bottom of the chip and other dead zones, the sucked hot air is instantly sucked into the throat section 602 of the Venturi tube and mixed with the high-speed main airflow and carried away, since the temperature of the main airflow is relatively low, this process also accelerates heat exchange, the design of the multiple sets of Venturi units 60 can suck a large range of electrical elements on the circuit board 13, the airflow enters the inside of the elbow pipe 71, is turned through the elbow pipe 71, and then is sprayed through the flexible hose 72 and the duckbill blow nozzle 73 to blow and cool the circuit board 13, the duckbill blow nozzle 73 initially blows air to the distant elements; if the near-distance elements are overheated, the heat is conducted to the memory metal spring 75 through the heat conduction structure 9, is absorbed by the heat dissipation fin 92, is conducted to the heat conduction bar 95 through the conduction core 96, and then is conducted to the heat conduction groove 741 through the heat conduction core 94, so that the memory metal spring 75 is heated to shrink and deform, the memory metal spring 75 shrinks to pull the duckbill blow nozzle 73 to tilt downward, which can blow and cool the near-distance electrical elements on the circuit board 13, until the temperature is cooled down, the memory metal spring 75 cools down to restore the initial state, and the duckbill blow nozzle 73 resets to continue blowing and cooling the distant electrical elements;

[0067] The discharged gas is discharged through the multiple memory metal gas outlet pipes 3, if the temperature of the discharged gas is relatively low, the gas is conducted upward through the multiple memory metal gas outlet pipes 3, and the air suction through the air inlet hole 11 can be partially recycled, if the temperature of the discharged gas is relatively high, the multiple sets of memory metal gas outlet pipes 3 will deform to be in a horizontal state, and a large amount of high-temperature gas can be discharged;

[0068] The temperature of the circuit board 13 is monitored and fed back by the multiple sets of temperature sensors 14, and the multiple sets of semiconductor refrigerators 4 and the multiple sets of fans 8 are power-adjusted by the controller panel 12 to improve or reduce the air-cooling effect. The controller panel 12 integrates the transition temperature parameters of the memory metal element, and the behavior is predicted in the control algorithm. For example, when the temperature approaches 35°C, the fan power is increased in advance to delay the change of the duck-bill blowing angle, thereby improving the response efficiency. Embodiments

[0069] The embodiment is further optimized on the basis of the first embodiment, and the same parts as the foregoing technical solutions will not be described here. To better achieve the present application, the following setting is particularly adopted: In the embodiment, the recovery effect of the memory metal air outlet pipe 3 depends on external airflow, which may be unstable. A set of backflow fan is optionally added on the top of the cover 2. When the memory metal air outlet pipe is bent, the backflow fan runs at low speed to direct part of the exhaust airflow to the air inlet hole 11; when the air outlet pipe is straightened, the backflow fan is turned off. At the same time, the controller panel 12 optimizes the backflow strategy according to the data of the temperature sensor 14.

[0070] Although the embodiments of the present application have been shown and described, it is understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-performance server air guiding device, characterized in that: Include: The shell (1), the top of the shell (1) is provided with a machine cover (2) by screwing, the inside of the shell (1) is provided with a circuit board (13), a plurality of electrical elements are provided on the circuit board (13), a controller panel (12) and a back panel (15) are connected on the circuit board (13), a plurality of temperature sensors (14) are provided on the circuit board (13); A plurality of negative pressure air guide mechanisms (6) are installed at the bottom of the machine cover (2), a cooling cavity (5) is connected to the plurality of negative pressure air guide mechanisms (6), the cooling cavity (5) is installed at the bottom of the machine cover (2), a plurality of fans (8) are provided in the cooling cavity (5), and the plurality of fans (8) are correspondingly provided with the plurality of negative pressure air guide mechanisms (6); A plurality of air guide blowing mechanisms (7) are correspondingly fixedly connected with the plurality of negative pressure air guide mechanisms (6); A plurality of heat conduction structures (9) are provided on the inner wall of the bottom of the shell (1) and correspondingly provided with the plurality of air guide blowing mechanisms (7); The negative pressure air guide mechanism (6) comprises three groups of Venturi units (60), and the three groups of Venturi units (60) are connected in series, the Venturi unit (60) comprises a converging section (601), a throat (602) and a diffuser section (603), the converging section (601), the throat (602) and the diffuser section (603) are fixedly and sequentially connected, the bottom side of the throat (602) is connected with two negative pressure pipes (604), and the two negative pressure pipes (604) are made of flexible material; the air guide blowing mechanism (7) comprises a bent pipe (71) and a supporting piece (74), the bent pipe (71) is fixedly connected with the negative pressure air guide mechanism (6), the bent pipe (71) is a curved structure, the tail end of the bent pipe (71) is connected with a flexible hose (72), the flexible hose (72) is connected with a duckbill blowing nozzle (73), and the duckbill blowing nozzle (73) is inclined.

2. The air guide device of the high-performance server according to claim 1, wherein: A plurality of air inlet holes (11) are formed in the outer side of the shell (1) and correspondingly provided with the cooling cavity (5).

3. The air guide device of the high-performance server according to claim 1, wherein: A plurality of memory metal air outlet pipes (3) are embedded in the outer side of the shell (1) and are curved structures.

4. The air guide device of the high-performance server according to claim 3, wherein: A plurality of semiconductor refrigerators (4) are embedded in the top of the machine cover (2), the refrigerating surfaces of the plurality of semiconductor refrigerators (4) are located in the inside of the cooling cavity (5) and in front of the fans (8), and the heat dissipation surfaces of the plurality of semiconductor refrigerators (4) are located on the top of the machine cover (2).

5. The air guide device of the high-performance server according to claim 1, wherein: A plurality of fixed plates (21) are fixedly installed at the bottom of the machine cover (2), arc-shaped sockets (22) are formed in the plurality of fixed plates (21), and the throat (602) is fixedly arranged at the bottom of the machine cover (2) through the arc-shaped sockets (22).

6. The air guiding device of a high-performance server according to claim 1, characterized in that: The bottom side of the elbow pipe (71) is fixedly connected with a flexible hose (72), the inner side of the flexible hose (72) is fixedly connected with a memory metal spring (75), the top end of the memory metal spring (75) is fixedly connected with the bottom side of the duckbill mouth (73), the bottom side of the support (74) is provided with a heat conduction groove (741), and the heat conduction groove (741) is located below the memory metal spring (75).

7. The air guiding device of a high-performance server according to claim 6, characterized in that: The heat conduction structure (9) comprises a heat conduction cavity (91), the heat conduction cavity (91) is fixedly installed on the bottom inner wall of the shell (1) and located below the circuit board (13), a plurality of heat dissipation fins (92) are fixedly arranged on the top of the heat conduction cavity (91), the inside of each heat dissipation fin (92) is provided with a conduction core (96), the inside of the heat conduction cavity (91) is fixedly provided with a heat conduction strip (95), each conduction core (96) is connected with the heat conduction strip (95), the heat conduction strip (95) is connected with a heat conduction core (94), the heat conduction cavity (91) is fixedly installed with a support cylinder (93) on the top and matched with the heat conduction groove (741), and the heat conduction core (94) is located in the inside of the support cylinder (93).

8. The air guiding device of a high-performance server according to claim 7, characterized in that: The side of the cooling cavity (5) is provided with a plurality of groups of air holes (51), and the negative pressure air guiding mechanism (6) is connected with the cooling cavity (5) through the air holes (51).

Images