Wafer clamping device of cleaning equipment and wafer processing equipment

Abstract

The invention provides a wafer clamping device of cleaning equipment and wafer processing equipment, and belongs to the field of chemical mechanical grinding, the wafer clamping device comprises a driving part, a positioning part and a plurality of clamping parts, the driving part comprises a driving fluted disc capable of rotating around the axis of the driving fluted disc; the clamping parts are uniformly arranged around the axis of the driving fluted disc and comprise rotating shafts, clamping heads and driving gears, the clamping heads are eccentrically and fixedly arranged at the top ends of the rotating shafts, and the gears are meshed and matched with the periphery of the driving fluted disc; the positioning part comprises a first positioning disc, a second positioning disc, an elastic part and a driving lever, the first positioning disc and the second positioning disc are coaxial with the driving fluted disc, the driving lever can be inserted in the vertical direction and drive the driving fluted disc to rotate around the axis of the driving fluted disc, and the elastic part is configured to have pretightening force enabling the driving fluted disc to resist driving of the first positioning disc. Compared with the prior art, the wafer clamping device solves the technical problem that an existing wafer clamping device cannot control rotation of a wafer due to blowing of liquid and gas in the wafer cleaning process.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of wafer clamping device of cleaning equipment, more particularly, it relates to a wafer clamping device of cleaning equipment, and further relates to a wafer processing equipment. BACKGROUND

[0002] In the process of semiconductor devices, complex processing of wafers is needed to make various circuit element structures, form IC products with specific electrical functions, such as etching, ion implantation, electroplating, and cleaning of wafers, or testing of wafers after the wafer processing. In the semiconductor wafer manufacturing process, the chemical mechanical polishing (CMP) equipment as the core processing equipment undertakes the key task of wafer global planarization. Specifically, the core process of chemical mechanical polishing (CMP) realizes wafer surface planarization through chemical and mechanical action. First, the polishing liquid containing nanoparticles and chemical reagents is sprayed from the equipment inlet to the surface of the rotating polishing pad. The polishing head stably presses the wafer on the polishing pad, and both rotate at different speeds, so that the wafer surface is in full contact with the polishing liquid through pressure and friction. In this process, the chemical composition of the polishing liquid softens the wafer surface layer material, and the nanoparticles on the polishing pad are gradually removed under the action of mechanical friction, finally realizing an atomic smooth surface.

[0003] Among them, in the process of processing the wafer, the position stability of the wafer is particularly important, which directly restricts the quality of the wafer obtained. The chuck used in the related equipment at present is mainly divided into four types: 1. Bernoulli chuck, which uses high-speed gas flow on the wafer surface to absorb the wafer on the bottom disc; 2. Some chucks use centrifugal force to drive the clamping jaw to clamp the wafer; 3. Some use magnets to loosen or clamp the wafer; 4. Some use vacuum chuck to adsorb the wafer.

[0004] However, the above-mentioned methods have the following disadvantages in the specific application process. First, when the Bernoulli chuck is used, impurities may be mixed in the high-speed gas flow, in addition, the gas flow may affect the gas flow of the wafer adjacent part, which may cause vortex of chemical liquid (acid, alkali and organic liquid) vapor gas on the wafer surface, affecting the wafer surface cleanliness. In the process of clamping the wafer by centrifugal force, the clamping force of the wafer will decrease or change when the rotation speed is low or changes, which may cause the wafer to fly out; the disadvantages of using magnets to loosen or clamp the wafer: there is a risk of wafer cutting magnetic induction line, the part processing difficulty is large, and the structure is complex; as for the vacuum chuck: the chuck may contaminate the back of the wafer, and the vacuum adsorption effect will be affected if the back is dried by cleaning chemical liquid or gas.

[0005] Briefly speaking, the existing chuck cannot continuously clamp the wafer while controlling the rotation of the wafer during the wafer processing process due to the spraying of chemical liquid, cleaning gas and cleaning liquid, and the structure is complex, which cannot meet the processing requirements of the wafer. SUMMARY

[0006] The present application aims to provide a wafer clamping device of a cleaning equipment to solve the technical problem that the existing wafer clamping device cannot control the rotation of the wafer during the wafer cleaning process due to the spraying of liquid and gas.

[0007] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is to provide a wafer clamping device of a cleaning equipment, comprising:

[0008] a driving part comprising a driving gear plate capable of rotating around its axis;

[0009] a plurality of clamping parts, each of the clamping parts is uniformly arranged around the axis of the driving gear plate, the clamping part comprises a rotating shaft, a clamping head and a driving gear, the clamping head is fixedly arranged at the top end of the rotating shaft and deviates from the axis of the rotating shaft, the axis of the rotating shaft is parallel to the axis of the driving gear plate, the driving gear is coaxially arranged at the bottom end of the rotating shaft, and the driving gear is matched with the outer periphery of the driving gear plate, and a clamping area capable of adjusting the clamping range is formed between each clamping head;

[0010] a positioning part comprising a first positioning disc, a second positioning disc, an elastic member and a lever, the first positioning disc and the second positioning disc are coaxial with the driving gear plate, the first positioning disc is arranged below the driving gear plate, the second positioning disc is arranged above the driving gear plate, the lever extends in the upward and downward directions, the lever moves upward through the first positioning disc and is inserted into the driving gear plate, and the lever can move around the axis of the first positioning disc to rotate the driving gear plate, or the lever moves downward to relatively rotate the driving gear plate and the first positioning disc under the action of the elastic member;

[0011] the elastic member connects the driving gear plate and the first positioning disc and is configured to have a pre-tightening force to resist the driving of the first positioning disc by the driving gear plate;

[0012] the second positioning disc is provided with a plurality of mounting through holes uniformly arranged around its axis, each rotating shaft is rotationally matched with each mounting through hole, the clamping head is located above the second positioning disc, and the driving gear is located below the second positioning disc.

[0013] Further, the elastic member comprises a tension spring, a first positioning shaft and a second positioning shaft, the drive gear disc is provided with a containing through groove, and the first positioning shaft, the second positioning shaft and the tension spring are located in the containing through groove; the first positioning shaft is arranged on the lower side of the second positioning disc; the second positioning shaft is connected with the drive gear disc; the two ends of the tension spring are connected with the first positioning shaft and the second positioning shaft respectively; and the tension spring is configured to have a pre-tightening force for making the first positioning shaft and the second positioning shaft close to each other.

[0014] Further, the clamping head comprises a clamping head body and a cap, the clamping head body is arranged on the top of the cap, and the cap is fixedly connected to the top end of the rotating shaft.

[0015] Further, the top of the cap is provided with a plurality of positioning holes for fixing the clamping head body, and the positioning holes are adapted to be inserted into the clamping head body.

[0016] Further, the upper side of the second positioning disc is integrally connected with a leakage-proof cylinder, the leakage-proof cylinder is coaxially arranged on the outer periphery of the top of the mounting through hole, and each cap is coaxially arranged on the top of each leakage-proof cylinder.

[0017] Further, the positioning part further comprises a plurality of needles for supporting the wafer, and each needle is arranged on the upper side of the second positioning disc.

[0018] Further, the positioning part further comprises an electrostatic discharge strip arranged on the upper side of the second positioning disc, the needle is a conductor, and the electrostatic discharge strip is connected with at least one needle.

[0019] Further, the upper side of the first positioning disc is provided with a plurality of positioning bearings, the positioning bearings are uniformly arranged around the axis of the first positioning disc, the drive gear disc is provided with a positioning ring coaxial with the drive gear disc, and the outer periphery of each positioning bearing is in rolling contact with the inner surface of the positioning ring.

[0020] The lower side of the second positioning disc is provided with a limiting shaft, the outer periphery of the drive gear disc is provided with a limiting groove, the depth direction of the limiting groove is parallel to the axis of the drive gear disc, the limiting groove is an arc-shaped groove coaxial with the drive gear disc, and the limiting shaft is inserted into the limiting groove and can move along the length direction of the limiting groove.

[0021] Further, the upper side of the first positioning disc is provided with a supporting ring, the supporting ring is coaxial with the first positioning disc, and each drive gear is rotatably arranged on the supporting ring.

[0022] Compared with the prior art, the wafer clamping device of the cleaning equipment has the following beneficial effects:

[0023] Firstly, when the driving gear is rotated, all the rotating shafts are synchronously driven to rotate by the meshing of the outer periphery of the driving gear and the driving gear of each clamping part, and the eccentrically arranged clamping head is synchronously rotated; when the lever is inserted into the driving gear, the driving gear can be rotated by the movement of the lever, and at this time, the clamping head rotates and clamps at the predetermined position of the wafer edge; when it is necessary to release or adapt to the position of the wafer (such as a wafer or a wafer slightly uneven), the pre-tightening force of the elastic member allows the driving gear to overcome the locking of the first positioning disc (temporarily separated by the lever), so that the driving gear is deflected relative to the first / second positioning disc, and all the clamping heads are synchronously rotated, and the clamping part can be synchronously rotated as a whole to clamp the wafer for cleaning, and can be rotated back under the action of the elastic member, so that the wafer is stably, synchronously and flexibly clamped, so that the wafer can be reliably clamped during high-speed rotation and cleaning, and the position change of the wafer can be automatically adapted or a buffer can be provided to avoid rigid impact and damage to the wafer, thereby solving the technical problems of unstable clamping, easy damage to the wafer or inability to automatically adjust the wafer in a traditional clamping device in a high-speed, strong airflow cleaning environment, and the second positioning disc can form a value when the clamping part and the driving part below are formed, preventing the driving gear and the driving gear from being polluted by the grinding liquid and the cleaning liquid.

[0024] Another object of the present application is to provide a wafer processing equipment comprising the wafer clamping device of the cleaning equipment described above.

[0025] Compared with the prior art, the wafer processing equipment in the present application has all the advantages of the wafer clamping device of the cleaning equipment described above, which will not be repeated here. In addition, by providing the wafer clamping device of the cleaning equipment described above, in the process of wafer cleaning or other processes requiring high-speed rotation, the stable, synchronous, flexible, self-adaptive, anti-pollution, anti-static and precise positioning clamping function provided by the clamping device can be used to achieve safe, reliable and non-destructive clamping of the wafer under harsh process conditions (high speed, strong airflow, chemical liquid environment), thereby improving the overall operation stability, process yield and wafer safety of the equipment, and solving the technical problems of wafer damage, pollution, static damage or poor process effect caused by unreliable clamping of the wafer processing equipment during high-speed cleaning and other processes. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating any creative labor. In the drawings:

[0027] Figure 1 The side view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown schematically.

[0028] Figure 2 A schematic view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown in the figure below;

[0029] Figure 3 A schematic view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown in the figure below; Figure 2 An enlarged view of the part A shown in the figure above;

[0030] Figure 4 A schematic view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown in the figure below; Figure 3 A sectional view of the part B-B shown in the figure above;

[0031] Figure 5 A schematic view of the connection relationship between the first positioning disc and the driving gear disc of the wafer clamping device provided by the present application is shown in the figure below;

[0032] Figure 6 A schematic view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown in the figure below; Figure 5 A sectional view of the part A-A shown in the figure above;

[0033] Figure 7 A schematic view of the internal structure of the wafer clamping device of the cleaning equipment provided by the present application is shown in the figure below.

[0034] In the figure:

[0035] 1, driving part; 11, driving gear disc; 111, accommodating groove; 112, positioning ring; 113, limiting groove;

[0036] 2, clamping part; 21, rotating shaft; 22, clamping head; 221, clamping head body; 222, cap; 23, driving gear;

[0037] 3, positioning part; 31, first positioning disc; 311, positioning bearing; 312, support ring; 32, second positioning disc; 321, leakage-proof cylinder; 322, limiting shaft; 323, electrostatic lead-out strip; 33, elastic member; 331, tension spring; 332, first positioning shaft; 333, second positioning shaft; 34, lever; 35, ejector pin. DETAILED DESCRIPTION

[0038] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0039] In the description of the present application, it should be noted that if terms indicating orientation or position relationship such as "upper", "lower", "inner", "back" and the like appear, they are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation on the present application that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation.

[0040] In addition, in the description of the present application, unless otherwise explicitly defined, the terms "mounting", "connecting", "connection", "connected", should be understood in a broad sense. For example, the connection can be a fixed connection, or a detachable connection, or an integral connection; can be a mechanical connection, or an electrical connection; can be a direct connection, or an indirect connection via an intermediate medium, or a communication inside two elements. Those skilled in the art can understand the specific meanings of the above terms in the present application in connection with the specific circumstances.

[0041] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects clearer, the present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and not used to limit the present application.

[0042] Please refer to Figures 1 to 6 , now the wafer clamping device of the cleaning equipment provided by the present application will be described. The wafer clamping device of the cleaning equipment comprises a driving part 1, a positioning part 3 and a plurality of clamping parts 2, wherein the driving part 1 comprises a driving gear 11 capable of rotating around its own axis; each clamping part 2 is uniformly arranged around the axis of the driving gear 11, the clamping part 2 comprises a rotating shaft 21, a clamping head 22 and a driving gear 23, the clamping head 22 is fixedly arranged at the top end of the rotating shaft 21 and deviates from the axis of the rotating shaft 21, the axis of the rotating shaft 21 is parallel to the axis of the driving gear 11, the driving gear 23 is coaxially arranged at the bottom end of the rotating shaft 21, and the driving gear 23 is matched with the outer periphery of the driving gear 11, and the clamping area capable of adjusting the clamping range is formed between each clamping head 22; the positioning part 3 comprises a first positioning disc 31, a second positioning disc 32, an elastic member 33 and a lever 34, the first positioning disc 31 and the second positioning disc 32 are coaxial with the driving gear 11, the first positioning disc 31 is arranged below the driving gear 11, the second positioning disc 32 is arranged above the driving gear 11, the lever 34 extends in the up-down direction, the lever 34 moves upwards to pass through the first positioning disc 31 and is inserted into the driving gear 11, and the lever 34 can move around the axis of the first positioning disc 31 to drive the driving gear 11 to rotate, or the lever 34 moves downwards to drive the driving gear 11 and the first positioning disc 31 to rotate relative to each other under the action of the elastic member 33; the elastic member 33 connects the driving gear 11 and the first positioning disc 31 and is configured to have a pre-tightening force to drive the driving gear 11 to resist the first positioning disc 31; the second positioning disc 32 is provided with a plurality of mounting through holes uniformly arranged around its own axis, each rotating shaft 21 is rotationally matched with each mounting through hole, the clamping head 22 is located above the second positioning disc 32, and the driving gear 23 is located below the second positioning disc 32.

[0043] In the above embodiment, when the driving gear disc 11 rotates, all the rotating shafts 21 can be synchronously driven to rotate by the engagement of the outer periphery of the driving gear disc 11 with the driving gear 23 of each clamping part 2, and the eccentrically arranged clamping head 22 is synchronously rotated. Based on the above structure, when the wafer needs to be placed in the clamping space, the lever 34 is inserted into the driving gear disc 11, and the driving gear disc 11 is driven to rotate against the elastic force of the elastic member by the movement of the lever 34. At this time, the clamping head 22 is rotated to a suitable angle at the predetermined position of the wafer edge. When the wafer needs to be released or adapted to the wafer position (such as a wafer slightly uneven), the lever 34 is moved downward, the locking between the driving gear disc 11 and the lever 34 is released, the pre-tightening force of the elastic member 33 drives the driving gear disc 11 to rotate relative to the first positioning disc 31, and then the driving gear disc 11 is deflected by a small angle relative to the first positioning disc 31 and the second positioning disc 32, thereby driving all the clamping heads 22 to synchronously rotate (open or adjust the clamping force). The above cooperation process realizes that the clamping part 2 can be synchronously rotated as a whole to clamp the wafer for cleaning, and can be rotated back under the action of the elastic member 33, thereby realizing stable, synchronous and flexible clamping of the wafer, achieving reliable clamping of the wafer in the high-speed rotating cleaning process, and automatically adapting to the position change of the wafer or providing a buffer to avoid rigid impact damage to the wafer. The technical effects are achieved, which is beneficial to solve the technical problems of unstable clamping, easy damage to the wafer or inability to automatically adjust the wafer in a traditional clamping device in a high-speed and strong airflow cleaning environment.

[0044] The above embodiment has another implementation, that is, the pre-tightening force of the elastic member 33 is used to drive the clamping heads 22 to move away from each other. Under the premise that the lever 34 does not drive the driving gear disc 11 to rotate, the clamping heads 22 are in an open state. When the clamping heads 22 need to be driven to clamp, the lever 34 drives the driving gear disc 11 to rotate, and then the driving gear disc 11 drives the clamping heads 22 to move close to each other. When the wafer needs to be taken out or adjusted, the lever 34 is moved downward to release the driving of the driving gear disc 11, and then the tension spring 331 drives the driving gear disc 11 to rotate in the opposite direction to release the clamping head 22. The technical effects of fast taking and fast releasing, accurate and controllable positioning are achieved.

[0045] As to how to drive the lever 34 to move, a horizontal cylinder can be used to drive the lever 34 to move around the axis of the driving gear disc 11, and an up-down telescopic cylinder can be used to drive the horizontal cylinder and the lever 34 to move up and down, so that the driving gear disc 11 is driven to rotate by the movement of the lever 34.

[0046] In some preferred embodiments, the elastic member 33 comprises a tension spring 331, a first positioning shaft 332 and a second positioning shaft 333, the driving gear plate 11 is provided with an accommodating groove 111 for accommodating the tension spring 331, the accommodating groove 111 is an arc-shaped groove coaxial with the driving gear plate 11, and the first positioning shaft 332 and the second positioning shaft 333 are both located in the accommodating groove 111, the first positioning shaft 332 is arranged on the lower side of the second positioning plate 32, the second positioning shaft 333 is connected with the driving gear plate 11, and the axes of the first positioning shaft 332 and the second positioning shaft 333 are both parallel to the axis of the driving gear plate 11, the two ends of the tension spring 331 are connected with the first positioning shaft 332 and the second positioning shaft 333 respectively, and the tension spring 331 is configured to have a pre-tightening force for making the first positioning shaft 332 and the second positioning shaft 333 close to each other.

[0047] Specifically, when the driving gear plate 11 has a relative rotation trend with respect to the second positioning plate 32 (and the fixed first positioning plate 31), the tension spring 331 is stretched, and the pre-tightening force for making the first and second positioning shafts close to each other generated by the tension spring 331 is the force resisting the relative rotation of the driving gear plate 11, and the pre-tightening force of the elastic member 33 (tension spring 331) is directly applied between the driving gear plate 11 and the second positioning plate 32 (representing the positioning part body) during the assembly process, realizing the compact and integrated installation of the elastic member 33 (tension spring 331), the space-efficient use of the elastic return function and the direct and clear force transmission path, achieving the technical effects of simplifying the structure, improving the rigidity and response speed of the device, and ensuring the stability and reliability of the pre-tightening force, thereby solving the technical problems of complex installation of the elastic element, large occupied space, low force transmission efficiency, and possible delay or instability of the clamping action.

[0048] In some preferred embodiments, the clamping head 22 comprises a clamping head body 221 and a cap 222, the clamping head body 221 is arranged on top of the cap 222, and the cap 222 is fixedly connected to the top end of the rotating shaft 21. The clamping head body 221 is designed separately from the cap 222, and the cap 222 is fixedly connected to the top end of the rotating shaft 21. The cooperation process realizes the modularization of the connection structure of the clamping head body 221 and the rotating shaft 21, realizes the independent replacement of the clamping head body 221 according to the wafer specifications or the wear condition, and does not need to replace the entire rotating shaft 21 or cap 222, thereby achieving the technical effects of reducing the maintenance cost, improving the convenience and flexibility of component replacement. Furthermore, in order to enhance the application range of the clamping head 22 in the application to wafers of different specifications, in some preferred embodiments, a plurality of positioning holes for fixing the clamping head 22 are arranged on the top of the cap 222, the positioning holes are adapted to the clamping head 22 in a plug-in manner, and the cooperation process realizes the quick and accurate installation and positioning of the clamping head body 221 and the cap 222, realizes the accuracy and consistency of the installation position (eccentricity) of the clamping head body 221, and simplifies the installation and disassembly operation, thereby achieving the technical effects of improving the clamping precision, ensuring the synchronism of the plurality of clamping heads 22, facilitating the maintenance, and facilitating the adjustment of the spacing of the clamping heads 22, so as to solve the technical problems of uneven clamping force or wafer eccentricity caused by inaccurate installation and positioning of the clamping head 22.

[0049] In some preferred embodiments, the upper side of the second positioning disc 32 is integrally connected with a plurality of leakage prevention cylinders 321, each of the leakage prevention cylinders 321 is coaxial with each of the mounting through holes, the leakage prevention cylinders 321 are coaxially arranged on the outer periphery of the positioning hole, and each of the caps 222 is coaxially arranged on the top of each of the leakage prevention cylinders 321. The sealing structure is formed between the cap 222 and the leakage prevention cylinder 321, effectively blocks the cleaning liquid, water vapor or particulate matter from penetrating along the rotating shaft 21 downward into the meshing area of the driving gear 23 and the driving gear disc 11 and the bearings and other precision components below, significantly improves the sealing performance of the device, prevents the key transmission components from being corroded or contaminated to cause jamming failure, and solves the technical problems of mechanical transmission component wear, corrosion and reliability reduction caused by the invasion of liquid and pollutants in the cleaning environment.

[0050] In addition to the above feasible embodiments, in some preferred embodiments, the positioning part 3 further comprises a plurality of top pins 35 for supporting the wafer, each of the top pins 35 is arranged on the upper side of the second positioning disc 32, so that when the wafer is clamped and lifted by the clamping part 2 or placed on the device, the top pin 35 first or simultaneously contacts the lower surface of the wafer to provide support, provides auxiliary support in the non-clamping state (such as the wafer up / down process), protects the back surface of the wafer from being scratched, and improves the stability of the wafer transmission and placement process.

[0051] In some preferred embodiments, please refer to Figure 7The positioning part 3 further comprises an electrostatic discharge strip 323 arranged on the upper side of the second positioning disc 32, and the material of the ejector pin 35 is set as a conductor. The electrostatic discharge strip 323 is connected with at least one ejector pin 35, the material of the ejector pin 35 is set as a conductor, and the electrostatic discharge strip 323 is connected with at least one ejector pin 35. When the wafer (especially the wafer that may be charged after friction or process treatment) is placed on the conductor ejector pin 35 or clamped, the electrostatic charge on the wafer is safely and quickly discharged to the ground through the conductor ejector pin 35 and the electrostatic discharge strip 323, so that the accumulated electrostatic charge on the wafer surface is effectively eliminated, and the technical effects of preventing electrostatic discharge (ESD) from damaging the precision circuit on the wafer and avoiding electrostatic force from adsorbing dust to contaminate the wafer are achieved.

[0052] In some preferred embodiments, the upper side of the first positioning disc 31 is provided with a plurality of positioning bearings 311, and each positioning bearing 311 is uniformly arranged around the axis of the first positioning disc 31. Corresponding to each positioning bearing 311, the drive gear disc 11 is provided with a positioning ring 112 coaxial with the drive gear disc 11, and the outer periphery of each positioning bearing 311 is in rolling contact with the inner surface of the positioning ring 112. The lower side of the second positioning disc 32 is provided with a limiting shaft 322, and corresponding to the limiting shaft 322, the outer periphery of the drive gear disc 11 is provided with a limiting groove 113. The groove depth of the limiting groove 113 extends along the axis of the drive gear disc 11, and the major axis of the limiting groove 113 is a circular arc shape coaxial with the drive gear disc 11. The limiting shaft 322 is inserted into the limiting groove 113 and can move along the length direction of the limiting groove 113.

[0053] Compared with the prior art, in the specific implementation process of the embodiment, the positioning bearing 311 on the upper side of the first positioning disc 31 is in rolling contact with the inner surface of the positioning ring 112 of the drive gear disc 11, which provides radial support and accurate positioning when the drive gear disc 11 rotates relative to the first positioning disc 31. The limiting shaft 322 on the lower side of the second positioning disc 32 is inserted into the circular arc limiting groove 113 on the outer periphery of the drive gear disc 11. During the fitting process, when the drive gear disc 11 rotates relative to the second positioning disc 32 under the action of the elastic member 33, the limiting shaft 322 slides along the circular arc track in the limiting groove 113, which strictly limits the angle range of relative rotation (i.e. the opening and closing range of the clamping head 22) and accurately restricts the maximum allowed relative displacement between the drive gear disc 11 and the second positioning disc 32 (i.e. the main body of the clamping part 2 and the positioning part 3), thereby achieving the technical effects of ensuring that the clamping action is performed within a safe and controllable range and preventing overloading or excessive deflection from causing damage to the mechanism or clamping failure. This is beneficial to solve the technical problem that the lack of effective stroke limiting of the flexible clamping mechanism may cause damage to the components or accidental falling of the wafer. In addition, the positioning bearing 311 also ensures the rotational concentricity and bearing capacity.

[0054] In some preferred embodiments, the upper side of the first positioning disc 31 is provided with a support ring 312 coaxial with the first positioning disc 31, and each drive gear 23 is rotatably arranged on the support ring 312. The coaxial support ring 312 is arranged on the upper side of the first positioning disc 31, and all the drive gears 23 of the clamping parts 2 are rotatably arranged on the support ring 312, thereby providing stable support points for the drive gears 23, ensuring that the multiple drive gears 23 remain in the correct meshing position with the drive gear disc 11 during rotation, sharing the gear meshing force, and reducing the deformation of the rotating shaft 21. In this way, the rigidity and stability of the entire gear transmission system are improved, the meshing precision and service life of the gear set are ensured, and the technical problems of poor meshing, increased vibration, or rapid wear of the multiple dispersed gears under high-speed rotation due to insufficient support are solved.

[0055] In summary, in the wafer clamping device of the cleaning equipment, the drive gear disc 11 drives all the drive gears 23 of the clamping parts 2 to rotate, thereby driving the eccentric clamping heads 22 to rotate synchronously and achieving synchronous clamping of the wafer; the positioning part 3 provides stable support and guidance; the drive gear disc 11 is driven to rotate when the lever 34 is inserted; and the elastic member 33 (such as a tension spring 331) provides a pre-tightening force, allowing the drive gear disc 11 to rotate back when needed (such as when the wafer position needs to be adjusted) by lowering the lever 34, thereby driving all the clamping heads 22 to move synchronously, achieving stable, synchronous, and flexible self-adaptive clamping in a high-speed rotating cleaning environment, and effectively solving the problem of wafer loosening or damage under high-speed rotation and strong airflow in traditional clamping. In addition, the tension spring 331 is integrated in the groove of the drive gear disc 11, and the positioning shaft connects the second positioning disc 32 and the drive gear disc 11, thereby achieving compact structure, direct and efficient force transmission; the clamping head body 221 is separated from the cap 222 and is inserted through the positioning hole of the cap 222, thereby facilitating replacement and accurate positioning; the leakage prevention cylinder 321 is coaxially arranged outside the mounting through hole and is covered by the cap 222, thereby forming a labyrinth seal and effectively preventing cleaning liquid from entering the precision transmission components; the dowel pin 35 supports the back of the wafer to prevent scratching; the conductor dowel pin 35 is connected to the static electricity discharge strip 323 to quickly discharge the static electricity of the wafer and prevent ESD (electrostatic discharge) damage and pollution; the positioning bearing 311 cooperates with the positioning ring 112 to ensure concentricity and bearing capacity; the limiting shaft 322 slides in the limiting groove 113 to accurately restrict the rotation range of the clamping head 22 and prevent overload; and the support ring 312 provides concentric and stable support for all the drive gears 23, thereby improving the rigidity of the system. Ultimately, the device integrates stable clamping, self-adaptive fine adjustment, efficient sealing, static protection, accurate limiting, and robust support, thereby significantly improving the safety, reliability, and process yield of the wafer during the harsh cleaning process, and solving the key technical problems of unstable clamping, wafer damage, pollution invasion, and static hazards in high-speed cleaning.

[0056] Based on the same inventive concept, the application further provides a wafer processing equipment, which comprises the wafer clamping device of the cleaning equipment.

[0057] Compared with the prior art, the wafer processing equipment has all the advantages of the wafer clamping device of the cleaning equipment, which will not be repeated here. In addition, by arranging the wafer clamping device of the cleaning equipment, in the wafer cleaning or other process steps requiring high-speed rotation, the stable, synchronous, flexible, self-adaptive, anti-pollution, anti-static and accurate limiting clamping function provided by the clamping device can be used to realize safe, reliable and non-destructive clamping of the wafer under harsh process conditions (high speed, strong airflow, chemical liquid environment), thereby improving the overall operation stability, process yield and wafer safety of the equipment, and solving the technical problems of wafer breakage, pollution, static damage or poor process effect caused by unreliable clamping of the wafer processing equipment in high-speed cleaning and other links.

[0058] The above only describes the preferred embodiments of the application and is not intended to limit the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A wafer chucking device for cleaning an apparatus, characterized by, The utility model relates to a kind of driving device, including: Driving part (1), including the driving gear (11) that can rotate around its axis; Multiple clamping parts (2), each described clamping part (2) is uniformly arranged around the axis of the driving gear (11), the clamping part (2) includes rotating shaft (21), clamping head (22) and driving gear (23), the clamping head (22) is fixed on the top end of the rotating shaft (21) and deviates from the axis of the rotating shaft (21), the axis of the rotating shaft (21) is parallel with the axis of the driving gear (11), the driving gear (23) is coaxially arranged at the bottom end of the rotating shaft (21), and the driving gear (23) is engaged with the outer periphery of the driving gear (11) Suitable adaptation, each described clamping head (22) forms the clamping area that can adjust clamping range between each other; Positioning part (3), including first positioning disc (31), second positioning disc (32), elastic member (33) and lever (34), the first positioning disc (31) and the second positioning disc (32) are coaxial with the driving gear (11), the first positioning disc (31) is arranged below the driving gear (11), the second positioning disc (32) is arranged above the driving gear (11), the lever (34) extends in up-down direction, the lever (34) is moved upwards and passes through the first positioning disc (31) and is inserted into the driving gear (11), and the lever (34) can be moved around the axis of the first positioning disc (31), to make the driving gear (11) rotate, or the lever (34) is moved downwards, to make the driving gear (11) and the first positioning disc (31) relatively rotate under the action of elastic member (33); The elastic member (33) is connected with the driving gear (11) and the first positioning disc (31), and is configured to have the pre-tightening force that the driving gear (11) resists the drive of the first positioning disc (31); The second positioning disc (32) is provided with a plurality of mounting through holes uniformly arranged around its axis, each rotating shaft (21) is rotatably connected with each mounting through hole, the clamping head (22) is located above the second positioning disc (32), and the driving gear (23) is located below the second positioning disc (32).

2. The wafer chucking apparatus of claim 1, wherein, The elastic member (33) includes tension spring (331), first positioning shaft (332) and second positioning shaft (333), the driving gear (11) is provided with accommodating through slot (111), and the first positioning shaft (332), the second positioning shaft (333) and the tension spring (331) are located in the accommodating through slot (111), the first positioning shaft (332) is arranged on the lower side of the second positioning disc (32), the second positioning shaft (333) is connected with the driving gear (11), and the two ends of the tension spring (331) are connected with the first positioning shaft (332) and the second positioning shaft (333) respectively, and the tension spring (331) is configured to have the pre-tightening force that the first positioning shaft (332) and the second positioning shaft (333) are close to.

3. The wafer chucking apparatus of claim 1, wherein the plurality of pins are arranged in a circular pattern. The clamping head (22) comprises a collet body (221) and a cap (222), the collet body (221) is arranged on top of the cap (222), and the cap (222) is fixedly connected to the top end of the rotating shaft (21).

4. The wafer chucking apparatus of claim 3, wherein the plurality of pins are arranged in a circular pattern. The top of the cap (222) is provided with a plurality of positioning holes for fixing the collet body (221), and the positioning holes are adapted to be inserted into the collet body (221).

5. The wafer chucking apparatus of claim 4, wherein the plurality of pins are arranged in a circular pattern. The upper side of the second positioning disc (32) is integrally connected with a leakage prevention cylinder (321), the leakage prevention cylinder (321) is coaxially arranged on the outer periphery of the top of the mounting through hole, and each cap (222) is coaxially arranged on the top of each leakage prevention cylinder (321).

6. The wafer chucking apparatus of claim 1, wherein The positioning part (3) further comprises a plurality of top pins (35) for supporting the wafer, and each top pin (35) is arranged on the upper side of the second positioning disc (32).

7. The wafer chucking apparatus of claim 6, wherein the plurality of pins are arranged in a circular pattern. The positioning part (3) further comprises an electrostatic discharge strip (323) arranged on the upper side of the second positioning disc (32), the top pin (35) is a conductor, and the electrostatic discharge strip (323) is connected with at least one top pin (35).

8. The wafer chucking apparatus of claim 1, wherein the plurality of pins are arranged in a circular pattern. The upper side of the first positioning disc (31) is provided with a plurality of positioning bearings (311), each positioning bearing (311) is uniformly arranged around the axis of the first positioning disc (31), the drive gear disc (11) is provided with a positioning ring (112) coaxial with itself, and the outer periphery of each positioning bearing (311) is in rolling contact with the inner surface of the positioning ring (112). The lower side of the second positioning disc (32) is provided with a limiting shaft (322), the outer periphery of the drive gear disc (11) is provided with a limiting groove (113), the depth direction of the limiting groove (113) is parallel to the axis of the drive gear disc (11), the limiting groove (113) is an arc-shaped groove coaxial with the drive gear disc (11), and the limiting shaft (322) is inserted into the limiting groove (113) and can move along the length direction of the limiting groove (113).

9. The wafer chucking apparatus of claim 8, wherein the plurality of pins are arranged in a circular pattern. The upper side of the first positioning disc (31) is provided with a support ring (312), the support ring (312) is coaxial with the first positioning disc (31), and each drive gear (23) is rotatably arranged on the support ring (312).

10. A wafer processing apparatus characterized by comprising: A wafer clamping device comprising the cleaning equipment according to any one of claims 1 to 9.

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