Direct-cooling distributed micro-positive pressure server cabinet and cooling method, device and medium thereof

Abstract

The application discloses a direct-cooling distributed micro-positive-pressure server cabinet and a cooling method, equipment and medium thereof, and relates to the technical field of server heat dissipation. The method comprises the following steps: providing low-dew-point dry compressed air to the inside of the server cabinet from an air inlet, making the dry compressed air discharged from an air outlet after passing through the server cabinet, and keeping the inside of the server cabinet in a preset micro-positive-pressure state; providing cooling required refrigerant from a refrigerant inlet, and providing the refrigerant to corresponding each direct-cooling plate heat exchanger through a refrigerant proportional distribution valve and a pipeline; the direct-cooling plate heat exchanger is provided with a refrigerant inlet and outlet, the real-time temperature of the refrigerant outlet of each direct-cooling plate heat exchanger is acquired through a temperature sensor, the opening degree of each refrigerant passage of the refrigerant proportional valve is adjusted, and the backflow refrigerant after passing through the direct-cooling plate heat exchanger is transported to the outside of the server cabinet for cooling through the pipeline. The method can achieve the purpose of high efficiency and energy saving, and keep the inside of the server cabinet clean and dry.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and in particular to a direct-cooling distributed micro-positive pressure server cabinet and its cooling method, equipment and medium. Background Technology

[0002] Traditionally, server racks have used air cooling methods. However, due to the increasing demand for higher processing power from artificial intelligence and other data-intensive applications, energy consumption has increased, leading to increased heat generation. Traditional methods cannot move enough air to provide sufficient cooling, so direct chip cooling solutions must be adopted.

[0003] As industries increasingly demand higher computing power, the power consumption of individual servers within server racks is rising. Typically, each U device consumes between 200-400W, and a fully configured 42U rack can reach 20-30kW. For example, a single NVIDIA H100 GPU can have a peak power consumption of up to 700W. For a 6kW rack, its power distribution capability determines the total power consumption of the servers it can support. Assuming an average power consumption of 3500W for each eight-GPU server (considering potential peak power consumption during actual operation), a 6kW rack can theoretically support a maximum of two such servers. However, in practical applications, the cooling system's capabilities must also be considered. High-power GPU servers generate significant heat during operation. If the cooling system cannot effectively dissipate this heat, the server temperature will become excessively high, affecting its stability and lifespan. Therefore, further improvements to the rack's cooling capacity are necessary. Summary of the Invention

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a direct-cooled distributed micro-positive pressure server rack and its cooling method, equipment, and medium, which can improve the heat dissipation capacity of the server rack and maintain a dry and clean environment inside the server rack.

[0005] According to an embodiment of the present invention, a cooling method for a direct-cooled distributed micro-positive pressure server rack includes a fully enclosed server rack. The server rack has a refrigerant inlet and internally houses a distribution valve, multiple heating elements, and multiple direct-cooling plate heat exchangers. Each direct-cooling plate heat exchanger corresponds one-to-one with a heating element, and each heating element is in contact with its corresponding direct-cooling plate heat exchanger. The distribution valve is connected to the refrigerant inlet of the server rack, and the outlet of the distribution valve is connected to the inlet of the corresponding direct-cooling plate heat exchanger via multiple refrigerant proportional valves. The outlet of the direct-cooling plate heat exchanger outputs refrigerant to the outside for cooling via a manifold. The server rack has an air inlet and an air outlet, and each heating element is equipped with a temperature sensor. The method includes:

[0006] Dry compressed air is supplied to the inside of the server rack through the air inlet via the pressure reducing air inlet valve, and the dry compressed air is discharged from the air outlet after passing through the server rack, so that the inside of the server rack is always kept in a preset slightly positive pressure state.

[0007] The refrigerant inlet receives externally cooled refrigerant, and the distribution valve body supplies the refrigerant to the corresponding direct-cooling plate heat exchanger through the refrigerant proportional valve to cool the heating device.

[0008] The real-time temperature of each heating element is obtained through the temperature sensor, and the opening degree of each refrigerant proportional valve is adjusted according to the real-time temperature of the heating element.

[0009] The refrigerant, after passing through the direct-cooling plate heat exchanger, is transported to the outside through the manifold for cooling.

[0010] According to some embodiments of the present invention, a dew point meter is further provided inside the server rack, a pressure-reducing intake valve is provided at the air inlet, and an exhaust valve is provided at the air outlet; the provision of dry compressed air from the air inlet to the inside of the server rack, so that the dry compressed air passes through the server rack and is discharged from the air outlet, thereby maintaining a preset slightly positive pressure state inside the server rack, includes:

[0011] The real-time humidity inside the server rack is detected using the dew point meter.

[0012] When the real-time humidity does not meet the standard, the pressure reducing air intake valve and the exhaust valve are opened to provide dry compressed air into the server rack from the air intake port, so that the dry compressed air passes through the server rack and is discharged from the air outlet.

[0013] When the real-time humidity inside the server rack meets the standard, the pressure-reducing intake valve and the exhaust valve are closed to maintain a preset slightly positive pressure inside the server rack.

[0014] According to some embodiments of the present invention, a thermometer is further provided inside the server rack; after closing the pressure-reducing inlet valve and the exhaust valve when the real-time humidity inside the server rack reaches the standard, so as to maintain a preset slightly positive pressure state inside the server rack, the method further includes:

[0015] The ambient temperature inside the server rack is detected using the thermometer.

[0016] When the ambient temperature exceeds the preset value, the pressure reducing air intake valve and the exhaust valve are opened to provide dry compressed air into the server rack from the air intake port, so that the dry compressed air flows out from the air outlet after passing through the server rack.

[0017] Alternatively, when the ambient temperature exceeds a preset value, the flow rate of the refrigerant can be increased.

[0018] According to some embodiments of the present invention, after providing dry compressed air from the air inlet to the inside of the server rack, and allowing the dry compressed air to flow out from the air outlet after passing through the server rack, thereby maintaining a preset slightly positive pressure state inside the server rack, the method further includes:

[0019] The dew point temperature inside the server rack is detected using the dew point meter.

[0020] Based on the dew point temperature and the inlet temperature of the refrigerant, the dew point temperature of the dry compressed air is adjusted so that the dew point temperature inside the server rack is lower than the inlet temperature of the refrigerant.

[0021] According to some embodiments of the present invention, the air inlet is connected to a gas supply device via a connecting pipe and the pressure-reducing air inlet valve; the provision of dry compressed air from the air inlet to the inside of the server rack, such that the dry compressed air flows out from the air outlet after passing through the server rack, thereby maintaining a preset slightly positive pressure state inside the server rack, includes:

[0022] The air is pressurized, cooled, dried, and filtered by the gas supply device to obtain dry compressed air;

[0023] After the dry compressed air is depressurized through the connecting air pipe, it is injected into the server rack, and then discharged from the air outlet after passing through the server rack.

[0024] According to some embodiments of the present invention, a human-machine interface and a controller are also provided in the server rack. The human-machine interface is electrically connected to the controller, and the controller is electrically connected to the distribution valve body and the temperature sensor.

[0025] On the other hand, the direct-cooled distributed micro-positive pressure server rack according to embodiments of the present invention is used to implement the cooling method of the direct-cooled distributed micro-positive pressure server rack as described in the above-mentioned embodiments.

[0026] On the other hand, an electronic device according to an embodiment of the present invention includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enable the at least one control processor to perform the cooling method of the direct-cooled distributed micro positive pressure server rack as described in the above-described embodiments.

[0027] On the other hand, according to an embodiment of the present invention, a computer storage medium stores computer-executable instructions for causing a computer to perform the cooling method of the direct-cooled distributed micro positive pressure server cabinet as described above.

[0028] The direct-cooled distributed micro-positive pressure server rack and its cooling method, equipment and medium according to embodiments of the present invention have at least the following beneficial effects: by using a low-temperature refrigerant cooling method, the temperature difference between the heat-generating components and the direct-cooling plate heat exchanger is increased to improve heat dissipation efficiency and ensure that the heat-generating components operate at normal operating temperatures; by adjusting the opening of the refrigerant proportional valve through temperature feedback from each heat-generating component, the purpose of high efficiency and energy saving is achieved; the server rack adopts a fully enclosed structure, which isolates the air inside the rack from the outside air, and dry compressed air is input into the rack, which is under micro-positive pressure. The low-temperature components inside the rack do not produce condensation, effectively avoiding dust, condensation and frost contamination of internal circuits and preventing the risk of short circuits.

[0029] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0031] Figure 1 This is a schematic diagram of the structure of a direct-cooled distributed micro-positive pressure server rack according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the structure of a direct-cooling plate heat exchanger according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram illustrating the flow direction of dry compressed air according to an embodiment of the present invention;

[0034] Figure 4 This is a flowchart illustrating the steps of a cooling method for a direct-cooling distributed micro-positive pressure server rack according to an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram illustrating the specific process of the cooling method for a direct-cooling distributed micro-positive pressure server rack according to an embodiment of the present invention. Detailed Implementation

[0036] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0037] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0038] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0039] Existing server racks commonly use two cooling methods: air cooling and liquid cooling.

[0040] 1. Air cooling is the most common heat dissipation method in server racks, mainly achieved through cooling fans and heat sinks. However, the noise of the fans and the risk of sudden failure are undeniable drawbacks, and the heat dissipation efficiency and capacity of air cooling are relatively low, making it unable to effectively dissipate heat from high-power loads.

[0041] 2. Liquid cooling is a more efficient heat dissipation method, especially suitable for ultra-high density and high-power devices. Liquid cooling is further divided into two types:

[0042] a. Immersion liquid cooling: The equipment is completely immersed in insulating coolant. A single-phase immersion solution is achieved using media such as 3M fluorinated liquid. It can support heat dissipation of high power density servers and reduce the PUE (Power Usage Effectiveness Ratio) to below 1.05. However, the coolant has the risk of volatilization and pollution, and the structure is complex, which is not conducive to maintenance and repair.

[0043] b. Direct water cooling (DWC) technology: There is a risk that the air temperature around the heat source will drop below the dew point, leading to condensation; if the temperature difference between the heat source and the coolant is not large, it is difficult to achieve efficient cooling.

[0044] To address this, this application proposes a direct-cooled distributed micro-positive pressure server rack and its cooling method, equipment, and medium. By using a low-temperature refrigerant cooling method, the temperature difference between the heat-generating components and the direct-cooling plate heat exchanger is increased to improve heat dissipation efficiency and ensure that the heat-generating components operate at normal operating temperatures. Temperature feedback from each heat-generating component is used to adjust the opening of the refrigerant proportional valve, achieving high efficiency and energy saving. The server rack adopts a fully enclosed structure, isolating the air inside the rack from the outside air. Dry compressed air is introduced into the rack, maintaining a micro-positive pressure inside. This prevents condensation on low-temperature components inside the rack, effectively avoiding dust, condensation, and frost contamination of internal wiring and preventing the risk of short circuits.

[0045] The following reference Figures 1 to 5 This paper elaborates on the direct-cooled distributed micro-positive pressure server cabinet and its cooling method, equipment and medium according to embodiments of the present invention.

[0046] On the one hand, embodiments of this application propose a direct-cooled distributed micro-positive pressure server rack, such as... Figure 1 and Figure 2 As shown, it includes a server rack 100. Inside the server rack 100, there is a distribution valve body 200, multiple heating elements 1000, and multiple direct-cooling plate heat exchangers 300. The heating elements 1000 and the direct-cooling plate heat exchangers 300 are in one-to-one correspondence. Each heating element 1000 is in contact with the corresponding direct-cooling plate heat exchanger 300. The inlet of the distribution valve body 200 is fed with cooled refrigerant. The outlet of the distribution valve body 200 is connected to the inlet of the corresponding direct-cooling plate heat exchanger 300 through multiple refrigerant proportional valves 210. The outlet of the direct-cooling plate heat exchanger 300 is fed with refrigerant that has been heated by the working process. The server rack 100 is provided with an air inlet 120 and an air outlet 130. Each heating element 1000 is provided with a temperature sensor (not shown in the figure).

[0047] It should be noted that the server rack 100 can house multiple servers, each generating a significant amount of heat during operation. In this embodiment, the chips inside the server rack 100 that generate heat during operation are referred to as heat-generating devices 1000. To efficiently dissipate heat from the heat-generating devices 1000, in this example, each heat-generating device 1000 is equipped with a direct-cooling plate heat exchanger 300. For example... Figure 2 As shown, the direct-cooling plate heat exchanger 300 has a refrigerant inlet 310 and a refrigerant outlet 320. The direct-cooling plate heat exchanger 300 receives refrigerant 1100 through the refrigerant inlet 310 and then discharges the refrigerant 1100 from the refrigerant outlet 320. Through the circulation of the refrigerant 1100, heat is carried away from the heating element 1000, thus dissipating heat from the heating element 1000. Figure 1 As shown, in this example, refrigerant 1100 is supplied through an external cooling device. The external cooling device sends the refrigerant 1100 through pipes to a distribution valve body 200. The distribution valve body 200 has multiple refrigerant proportional valves 210. The distribution valve body 200 distributes the refrigerant 1100 to each direct-cooling plate heat exchanger 300 through the multiple refrigerant proportional valves 210. After passing through the direct-cooling plate heat exchanger 300, the refrigerant 1100 returns to the external cooling device through the refrigerant outlet 320, realizing the circulation of the refrigerant 1100. A temperature sensor is provided on each heating element 1000 to detect the real-time temperature of each heating element 1000. This allows the opening degree of the refrigerant proportional valve 210 to be adjusted according to the real-time temperature of each heating element 1000, thereby achieving efficient heat dissipation for the heating element 1000.

[0048] like Figure 1 As shown, in this example, the server rack 100 is provided with an air inlet 120 and an air outlet 130. The air inlet 120 is connected to a gas supply device (not shown), and the air outlet 130 is connected to the inlet of the gas supply device. The gas supply device is used to provide dry compressed air to the inside of the server rack 100. After generating dry compressed air, the gas supply device sends the dry compressed air into the server rack 100 through the air inlet 120 and then discharges it from the air outlet 130. The flow direction of the dry compressed air is as follows: Figure 3As shown, when the gas supply device provides dry compressed air to the server rack 100, it can expel the original air inside the server rack 100, keeping the inside of the server rack 100 dry and preventing moisture in the air from affecting the components inside the server rack 100. Simultaneously, in some embodiments of this application, a pressure-reducing intake valve 110 is provided at the air inlet 120, and an exhaust valve 140 is provided at the air outlet 130. When dry compressed air needs to be introduced into the server rack 100, the pressure-reducing intake valve 110 and the exhaust valve 140 are opened, allowing dry compressed air to enter the server rack 100. At this time, the server rack 100 maintains a slightly positive pressure state, preventing high-humidity external gases from entering the server rack 100. When the humidity inside the server rack 100 meets the requirements, the pressure-reducing intake valve 110 and the exhaust valve 140 are closed. At this time, the server rack 100 is in a fully enclosed state, ensuring that the components inside the server rack 100 operate in a dry and clean environment. It should be noted that the micro-positive pressure state of server rack 100 is 200-500Pa, which meets the requirements of GB / T 36066-2025 "Technical Requirements and Applications for Testing Cleanrooms and Related Controlled Environments".

[0049] It should be noted that, in some embodiments of this application, the gas supply device pressurizes, cools, dries, and filters the air to produce clean, dry compressed air. This clean, dry compressed air is then depressurized to a gauge pressure of 300-500 Pa via a connecting pipe and a pressure-reducing inlet valve 110 before being injected into the server rack 100, ensuring that the equipment within the server rack 100 operates in a dry and clean environment. The gas supply device compresses the air, raising its temperature and pressure, then cools the heated and pressurized gas to restore it to room temperature. The gas is then dried using an adsorbent and filtered through a filter to obtain clean, dry compressed air. After depressurizing the clean, dry compressed air, it can be introduced into the server rack 100.

[0050] It should be noted that the dew point temperature of the dry compressed air supplied by the gas supply device into the server rack 100 is lower than the inlet temperature of the refrigerant 1100. This effectively prevents condensation of the dry compressed air, thus preventing dust, condensation, and frost contamination of the internal wiring of the server rack 100 and preventing the risk of short circuits.

[0051] Furthermore, such as Figure 1As shown, in some embodiments of this application, a dew point meter 600 is also installed inside the server rack 100. The dew point meter 600 can detect the dew point parameters and humidity inside the server rack 100. Before the server inside the server rack 100 is powered on, the server rack 100 is started first, and then the humidity inside the server rack 100 is obtained through the dew point meter 600. If the humidity does not meet the conditions for starting the refrigerant circulation, the pressure reducing inlet valve 110 and the exhaust valve 140 are opened to allow dry compressed air that has been purified to quickly fill the server rack 100. When the humidity inside the server rack 100 reaches the standard, the pressure reducing inlet valve 110 and the exhaust valve 140 are closed. Then, the server is powered on, and refrigerant 1100 is supplied to the distribution valve body 200 through external cooling equipment. The distribution valve body 200 then supplies refrigerant 1100 to the corresponding direct-cooling plate heat exchanger 300 through the refrigerant proportional valve 210 to cool the heat-generating device 1000. At the same time, during the operation of the server, temperature and humidity signals are continuously collected. The opening degree of each refrigerant proportional valve 210 is controlled by temperature sampling. When the temperature rises to the upper limit of the standard value, the valve of the refrigerant proportional valve 210 is opened wider. When the temperature falls below the lower limit of the standard value, the valve of the refrigerant proportional valve 210 is closed narrower. If the temperature exceeds the standard range, a temperature alarm is issued. At the same time, the status of the distribution valve body 200 is monitored, and an alarm is issued for the distribution valve body 200 if any abnormality occurs. If the humidity reaches the maximum standard during operation, the pressure-reducing intake valve 110 and exhaust valve 140 are opened to continue supplying dry compressed air into the server rack 100. Once the humidity in the server rack 100 returns to the standard, the pressure-reducing intake valve 110 and exhaust valve 140 are closed to ensure that the server rack 100 is always maintained within the normal humidity range. If the humidity exceeds the specified range, a humidity alarm is issued. By monitoring the temperature and humidity environment of key points (such as the surface of the direct-cooling plate heat exchanger 300) within the server rack 100 in real time, the dew point and flow rate of the dry air supplied to the server rack 100 are dynamically adjusted to ensure that the air dew point temperature at any location within the server rack 100 is always lower than the lowest possible surface temperature at that location, and a stable micro-positive pressure (200-500 Pa) is provided for this purpose.

[0052] Furthermore, such as Figure 1As shown in some embodiments of this application, a thermometer 500 and a temperature sensor on the heating element 1000 are also provided inside the server rack 100 to detect the temperature of the corresponding heating element 1000. The opening degree of the corresponding refrigerant proportional valve 210 is adjusted by the temperature of the heating element 1000. The thermometer 500 is used to detect the overall temperature inside the server rack 100. When the thermometer 500 detects that the temperature inside the server rack 100 is high, it is necessary to increase the flow rate of the cooled refrigerant. At the same time, the pressure reducing inlet valve 110 and the exhaust valve 140 can be opened to increase the flow rate of dry compressed air. The dry compressed air assists the refrigerant 1100 in carrying away heat and quickly cooling the inside of the server rack 100.

[0053] Furthermore, such as Figure 1 As shown, in some embodiments of this application, a manifold 900 is also provided inside the server rack 100. The inlet of the manifold 900 is connected to the outlet of each direct-cooling plate heat exchanger 300, and the outlet of the manifold 900 is connected to the inlet of an external cooling device. Specifically, the cooled refrigerant 1100 is sent to the distribution valve body 200. The distribution valve body 200 distributes the refrigerant 1100 proportionally to the refrigerant inlet 310 of each direct-cooling plate heat exchanger 300 according to the distribution ratio valve 210. After the refrigerant 1100 carries away the heat from each heat-generating device 1000, it flows out from the refrigerant outlet 320 of the direct-cooling plate heat exchanger 300 to the manifold 900, and then returns from the manifold 900 to the external cooling device, realizing the circulation of the refrigerant 1100 and cyclically carrying away the heat from the heat-generating devices 1000.

[0054] Furthermore, such as Figure 1 As shown, in some embodiments of this application, a human-machine interface 700 and a controller 800 are also provided inside the server rack 100. The human-machine interface 700 is electrically connected to the controller 800, and the controller 800 is electrically connected to the distribution valve body 200, temperature sensor, dew point meter 600, thermometer 500, external cooling equipment, pressure reducing inlet valve 110, and exhaust valve 140. In this example, the controller 800 can use a common processor such as an MCU to acquire temperature signals sent by the temperature sensor and thermometer 500, as well as dew point parameter signals and humidity signals sent by the dew point meter 600. Based on the temperature signals, dew point parameter signals, and humidity signals, the controller controls the working status of various parts of the external cooling equipment, pressure reducing inlet valve 110, exhaust valve 140, and distribution valve body 200, thereby maintaining the environment inside the server rack 200 within the set temperature and dew point parameter range. The human-machine interface 700 facilitates user settings for the operation of the server rack 200, making environmental parameter settings more user-friendly and the operating status of each part more clearly displayed.

[0055] The working principle of the direct-cooled distributed micro-positive pressure server rack according to the embodiments of this application is as follows:

[0056] Drying and purification process: After being pressurized, cooled, dried and filtered by the gas supply device, the air is injected into the server rack 100 after being depressurized by the connecting air pipe and the pressure reducing inlet valve 110, so that the equipment in the server rack 100 can operate in a dry and clean environment.

[0057] Slight positive pressure maintenance: The server rack 100 adopts a fully enclosed structure, with dry and clean air that has been depressurized introduced from below. By adjusting the opening of the exhaust valve 140 at the top, the pressure inside the server rack 100 is maintained at a slight positive pressure of 200-500Pa, preventing high humidity gas from outside from entering the server rack 100.

[0058] Intelligent environmental maintenance: The temperature and dew point of the air outlet 130 of the server rack 100 are sampled and recorded and fed back to the controller 800. Through real-time calculation, the environment inside the rack is kept within the set temperature and dew point parameters.

[0059] Direct cooling heat exchange: After the refrigerant 1100 is cooled to the set temperature by the external cooling equipment, it is transported to the direct cooling plate heat exchanger 300 attached to each heat-generating device 1000 through the distribution valve body 200. After absorbing heat, it returns to the external cooling equipment to continuously circulate heat absorption and cooling of the heat-generating device 1000.

[0060] like Figure 5 As shown, the system performs the following logic control on the signals collected by the temperature sensor, thermometer 500, and dew point meter 600 through the controller 800:

[0061] Before powering on the server, server rack 100 must be started first. The humidity inside server rack 100 is checked. If the humidity does not meet the conditions for starting refrigerant circulation, the pressure reducing inlet valve 110 and exhaust valve 140 are opened to quickly fill server rack 100 with purified, dry compressed air. Once the humidity inside server rack 100 reaches the standard, the pressure reducing inlet valve 110 and exhaust valve 140 are closed. During server startup and operation, temperature and humidity signals are continuously collected. Temperature sampling is used to control the size of refrigerant proportional valve 210. When the temperature of the heating element 1000 rises to the upper limit of the standard value, the refrigerant proportional valve 210 is increased; when the temperature falls below the lower limit of the standard value, the refrigerant proportional valve 210 is decreased. If the temperature exceeds the standard range, a temperature alarm is issued. The status of distribution valve 200 is monitored, and an alarm for the distribution valve is issued if any abnormality occurs. If the humidity exceeds the maximum standard value during operation, open the pressure-reducing intake valve 110 and the exhaust valve 140. Once the humidity inside the server rack 100 returns to the standard, close the pressure-reducing intake valve 110 and the exhaust valve 140 to ensure that the server rack 100 always maintains a normal humidity range. If the humidity exceeds the specified range, a humidity alarm will be issued.

[0062] According to the embodiments of this application, the direct-cooled distributed micro-positive pressure server cabinet increases the temperature difference between the heat-generating device 1000 and the direct-cooled plate heat exchanger 300 by using a low-temperature refrigerant cooling method to improve heat dissipation efficiency and ensure that the heat-generating device 1000 operates at normal operating temperature. The cooling power is adjusted by the refrigerant outlet temperature feedback to achieve high efficiency and energy saving. The server cabinet 100 adopts a fully enclosed structure with a micro-positive pressure inside, which meets the requirements of GB / T 36066-2025 "Technical Requirements and Applications for Testing Cleanrooms and Related Controlled Environments". The gas supply device inputs dry and clean air below the refrigerant inlet temperature dew point into the cabinet, which can effectively avoid dust, condensation, and frost contamination of internal circuits and prevent the risk of short circuits. By monitoring the temperature and humidity of key points within the server rack 100 (such as the surface of the direct-cooling plate heat exchanger 300) in real time, the dew point and flow rate of the dry air supplied to the server rack 100 are dynamically adjusted to ensure that the air dew point temperature at any location within the rack is always lower than the lowest possible surface temperature at that location, and a stable micro-positive pressure (200-500 Pa) is provided for this purpose. Based on data feedback from the monitoring system, and in coordination with the dry air system, the refrigerant inlet temperature and circulation flow rate are dynamically adjusted to maximize the surface temperature of the cold plate and minimize the temperature difference with the air while meeting heat dissipation requirements. This reduces the dew point requirement for the dry air, achieving energy savings while preventing excessively high refrigerant temperatures that could reduce heat dissipation. By monitoring the outlet temperature and dew point, the dry air system and refrigerant system are dynamically coordinated to maintain the rack exhaust temperature within a preset range.

[0063] The direct-cooled distributed micro-positive pressure server rack of this application embodiment adopts micro-positive pressure direct cooling technology. Utilizing the direct contact between the heated chips and the direct-cooling plate heat exchanger cooled by the low-temperature refrigerant, it enables the components inside the rack to operate normally and efficiently at suitable operating temperatures, while maintaining a dry working environment. The chips inside the rack employ direct-cooling plate heat exchangers, resulting in a large heat exchange temperature difference, which increases the heat dissipation effect of the chips within the rack, significantly reducing the chip operating temperature and maintaining the chips' high-efficiency computing power. It allows for high-density installation of service units within the rack, effectively improving the rack's utilization efficiency. The use of more efficient cooling technology reduces power consumption and enables the data center to run higher-power loads.

[0064] On the other hand, such as Figure 4 As shown, based on the direct-cooled distributed micro-positive pressure server rack of the above embodiments, this application proposes a cooling method for a direct-cooled distributed micro-positive pressure server rack, which includes the following steps:

[0065] Step S100: Dry compressed air is supplied to the inside of the server rack 100 through the air inlet 120 via the pressure reducing air inlet valve 110, and the dry compressed air is discharged from the air outlet 130 after passing through the server rack 100, so that the inside of the server rack 100 is maintained in a preset slightly positive pressure state.

[0066] Step S200: Receive the externally cooled refrigerant through the refrigerant inlet, and supply the refrigerant 1100 to the corresponding direct-cooling plate heat exchanger 300 through the refrigerant proportional valve 210 to cool the heating device 1000.

[0067] Step S300: Obtain the real-time temperature of each heating element 1000 through the temperature sensor, and adjust the opening degree of each refrigerant proportional valve 210 according to the real-time temperature of the heating element 1000.

[0068] Step S400: The refrigerant 1100 after passing through the direct-cooling plate heat exchanger 300 is transported to the external cooling equipment through the manifold 900.

[0069] Specifically, by supplying dry compressed air into the server rack 100, the existing air inside the server rack 100 can be expelled, keeping the interior of the server rack 100 dry and preventing moisture in the air from affecting the components inside. Simultaneously, it maintains a slightly positive pressure inside the server rack 100, with a pressure of approximately 200-500 Pa, meeting the requirements of GB / T 36066-2025 "Technical Requirements and Applications for Testing Cleanrooms and Related Controlled Environments," ensuring that the server rack 100 operates in a dry and clean environment and guaranteeing the normal operation of all equipment. The direction of dry compressed air transmission within the server rack 100 is as follows: Figure 3 As shown. Figure 2As shown, the direct-cooling plate heat exchanger 300 has a refrigerant inlet 310 and a refrigerant outlet 320. The direct-cooling plate heat exchanger 300 receives refrigerant 1100 through the refrigerant inlet 310 and then discharges the refrigerant 1100 from the refrigerant outlet 320. Through the circulation of the refrigerant 1100, heat is carried away from the heating element 1000, thus dissipating heat from the heating element 1000. Figure 1 As shown, in this example, refrigerant 1100 is supplied through an external cooling device. The external cooling device sends the refrigerant 1100 through pipes to a distribution valve body 200. The distribution valve body 200 has multiple refrigerant proportional valves 210. The distribution valve body 200 distributes the refrigerant 1100 to each direct-cooled plate heat exchanger 300 through the multiple refrigerant proportional valves 210. After passing through the direct-cooled plate heat exchanger 300, the refrigerant 1100 returns to the external cooling device through the refrigerant outlet 320, realizing the circulation of the refrigerant 1100. The temperature sensor on the heating element 1000 detects the temperature of the heating element 1000 in real time and adjusts the opening of the refrigerant proportional valve 210 according to the temperature of each heating element 1000, thereby controlling the refrigerant flow to each heating element 1000.

[0070] Furthermore, step S100 above includes the following three steps:

[0071] Step S110: Detect the real-time humidity inside the server rack 100 using a dew point meter 600;

[0072] Step S120: When the real-time humidity does not meet the standard, open the pressure reducing inlet valve 110 and the exhaust valve 140 to provide dry compressed air into the server rack 100 from the inlet 120, so that the dry compressed air is discharged from the outlet 130 after passing through the server rack 100.

[0073] Step S130: When the real-time humidity inside the server rack meets the standard, close the pressure reducing inlet valve 110 and the exhaust valve 140 to maintain a preset slightly positive pressure inside the server rack 100.

[0074] Specifically, before powering on the server inside the server rack 100, the server rack 100 must first be started to check the humidity inside the server rack 100. If the humidity does not meet the conditions for starting the refrigerant circulation, the pressure reducing inlet valve 110 and the exhaust valve 140 are opened to allow dry compressed air that has been purified to quickly fill the server rack 100. Once the humidity inside the server rack 100 reaches the standard, the pressure reducing inlet valve 110 and the exhaust valve 140 are closed to maintain a preset slightly positive pressure inside the server rack 100.

[0075] Furthermore, in some embodiments of this application, during the operation of the server rack 100, the cooling method of the direct-cooled distributed micro-positive pressure server rack further includes the following steps:

[0076] The ambient temperature inside server rack 100 was measured using thermometer 500.

[0077] When the ambient temperature exceeds the preset value, the pressure reducing intake valve 110 and the exhaust valve 140 are opened, and dry compressed air is supplied to the inside of the server rack 100 from the intake port 120, so that the dry compressed air flows out from the exhaust port 130 after passing through the server rack 100.

[0078] Alternatively, when the ambient temperature exceeds the preset value, increase the flow rate of the cooled refrigerant 1100.

[0079] Specifically, thermometer 500 is used to detect the overall temperature inside server rack 100. When thermometer 500 detects that the temperature inside server rack 100 is high, it is necessary to increase the flow rate of the cooled refrigerant. At the same time, pressure reducing inlet valve 110 and exhaust valve 140 can be opened to increase the flow rate of dry compressed air. The dry compressed air assists the refrigerant 1100 in carrying away heat and quickly cooling the inside of server rack 100.

[0080] Furthermore, in some embodiments of this application, step S100 described above includes:

[0081] Dry compressed air is obtained by pressurizing, cooling, drying and filtering air through a gas supply device;

[0082] After the dry compressed air is depressurized by connecting the air pipe, it is injected into the server rack 100, and the dry compressed air is discharged from the air outlet after passing through the server rack 100.

[0083] Specifically, the gas supply device pressurizes, cools, dries, and filters the air to produce clean, dry compressed air. This clean, dry compressed air is then injected into the server rack 100 after being depressurized via a connecting pipe and a pressure-reducing inlet valve 110, ensuring that the equipment inside the server rack 100 operates in a dry and clean environment. The gas supply device compresses the air, raising its temperature and pressure, then cools the heated and pressurized air to restore it to room temperature. The air is then dried using an adsorbent and filtered through a filter to obtain clean, high-pressure, dry compressed air. This clean, high-pressure, dry compressed air is then depressurized before being introduced into the server rack 100.

[0084] Furthermore, in some embodiments of this application, the cooling method for the direct-cooled distributed micro positive pressure server rack of this application embodiment further includes the following steps:

[0085] The dew point temperature inside server rack 100 was measured using a dew point meter 600.

[0086] Based on the dew point temperature and the inlet temperature of refrigerant 1100, the dew point temperature of the dry compressed air is adjusted so that the dew point temperature inside the server rack 100 is lower than the inlet temperature of refrigerant 1100.

[0087] By ensuring that the dew point temperature of the dry compressed air input into the server rack 100 is lower than the inlet temperature of the refrigerant 1100, condensation of the dry compressed air can be effectively avoided, preventing dust, condensation, and frost contamination of the internal wiring of the server rack 100 and preventing the risk of short circuits.

[0088] According to the cooling method of the direct-cooled distributed micro-positive pressure server rack in the embodiments of this application, the system uses the controller 800 to process the signals collected by the temperature sensor, thermometer 500 and dew point meter 600 as follows: Figure 5 The logic control shown:

[0089] Before powering on the server, server rack 100 must be started first. The humidity inside server rack 100 is checked. If the humidity does not meet the conditions for starting refrigerant circulation, the pressure reducing inlet valve 110 and exhaust valve 140 are opened to quickly fill server rack 100 with purified, dry compressed air. Once the humidity inside server rack 100 reaches the standard, the pressure reducing inlet valve 110 and exhaust valve 140 are closed. During server startup and operation, temperature and humidity signals are continuously collected. Temperature sampling is used to control the size of refrigerant proportional valve 210. When the temperature of the heating element 1000 rises to the upper limit of the standard value, the refrigerant proportional valve 210 is increased; when the temperature falls below the lower limit of the standard value, the refrigerant proportional valve 210 is decreased. If the temperature exceeds the standard range, a temperature alarm is issued. The status of distribution valve 200 is monitored, and an alarm for the distribution valve is issued if any abnormality occurs. If the humidity exceeds the maximum standard value during operation, open the pressure-reducing intake valve 110 and the exhaust valve 140. Once the humidity inside the server rack 100 returns to the standard, close the pressure-reducing intake valve 110 and the exhaust valve 140 to ensure that the server rack 100 always maintains a normal humidity range. If the humidity exceeds the specified range, a humidity alarm will be issued.

[0090] According to the cooling method of the direct-cooled distributed micro-positive pressure server cabinet in this application embodiment, the heat dissipation efficiency is improved by increasing the temperature difference between the heat-generating device 1000 and the direct-cooled plate heat exchanger 300 through low-temperature refrigerant cooling, ensuring that the heat-generating device 1000 operates at normal operating temperature. The cooling power is adjusted by refrigerant outlet temperature feedback to achieve high efficiency and energy saving. The server cabinet 100 adopts a fully enclosed structure with micro-positive pressure inside, which meets the requirements of GB / T 36066-2025 "Technical Requirements and Applications for Testing Cleanrooms and Related Controlled Environments". The gas supply device inputs dry and clean air below the dew point of the refrigerant inlet temperature into the cabinet, which can effectively avoid dust, condensation, and frost contamination of internal circuits and prevent the risk of short circuits. By monitoring the temperature and humidity of key points within the server rack 100 (such as the surface of the direct-cooling plate heat exchanger 300) in real time, the dew point and flow rate of the dry air supplied to the server rack 100 are dynamically adjusted to ensure that the air dew point temperature at any location within the rack is always lower than the lowest possible surface temperature at that location, and a stable micro-positive pressure (200-500 Pa) is provided for this purpose. Based on data feedback from the monitoring system, and in coordination with the dry air system, the refrigerant inlet temperature and circulation flow rate are dynamically adjusted to maximize the surface temperature of the cold plate and minimize the temperature difference with the air while meeting heat dissipation requirements. This reduces the dew point requirement for the dry air, achieving energy savings while preventing excessively high refrigerant temperatures that could reduce heat dissipation. By monitoring the outlet temperature and dew point, the dry air system and refrigerant system are dynamically coordinated to maintain the rack exhaust temperature within a preset range.

[0091] On the other hand, embodiments of this application also propose an electronic device, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enables the at least one control processor to perform the cooling method of the direct-cooled distributed micro positive pressure server cabinet as described in the above-described embodiments.

[0092] On the other hand, embodiments of this application also propose a computer storage medium storing computer-executable instructions for causing a computer to execute the cooling method of the direct-cooled distributed micro positive pressure server cabinet described in the above-mentioned embodiments.

[0093] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Furthermore, while various exemplary embodiments and architectures have been described according to embodiments of this disclosure, those skilled in the art will recognize that many other modifications to the exemplary embodiments and architectures described herein are also within the scope of this disclosure.

[0094] The foregoing description, with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments, has described certain aspects of this disclosure. It should be understood that one or more blocks in the block diagrams and flowcharts, as well as combinations of blocks in the block diagrams and flowcharts, can be implemented by executing computer-executable program instructions, respectively. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not all need to be executed. Furthermore, additional components and / or operations beyond those shown in the blocks in the block diagrams and flowcharts may exist in some embodiments.

[0095] Therefore, blocks in block diagrams and flowcharts support combinations of means for performing a specified function, combinations of elements or steps for performing a specified function, and program instruction means for performing a specified function. It should also be understood that each block in a block diagram and flowchart, and combinations of blocks in block diagrams and flowcharts, can be implemented by a dedicated hardware computer system or a combination of dedicated hardware and computer instructions that performs a specific function, element, or step.

[0096] The program modules, applications, etc., described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0097] Software components can be coded using any of a variety of programming languages. An exemplary programming language could be a low-level programming language, such as assembly language associated with a specific hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language could be a higher-level programming language that is portable across multiple architectures. Software components including higher-level programming languages ​​may need to be converted into an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages ​​include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, a software component containing instructions from one of the above-described programming language examples can be executed directly by the operating system or other software components without first being converted into another form.

[0098] Software components can be stored as files or other data storage structures. Software components of similar type or related function can be stored together in a specific directory, folder, or library. Software components can be static (e.g., pre-defined or fixed) or dynamic (e.g., created or modified at runtime).

[0099] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A cooling method for a direct-cooled distributed micro-positive pressure server rack, characterized in that: The direct-cooled distributed micro-positive pressure server rack includes a fully enclosed server rack. The server rack has a refrigerant inlet and internally houses a distribution valve, multiple heating elements, and multiple direct-cooled plate heat exchangers. Each direct-cooled plate heat exchanger corresponds one-to-one with a heating element, and each heating element is in contact with its corresponding direct-cooled plate heat exchanger. The distribution valve is connected to the refrigerant inlet of the server rack. The outlet of the distribution valve is connected to the inlet of the corresponding direct-cooled plate heat exchanger via multiple refrigerant proportional valves. The outlet of the direct-cooled plate heat exchanger outputs refrigerant to the outside for cooling via a manifold. The server rack has an air inlet and an air outlet. Each heating element is equipped with a temperature sensor. The method includes: Dry compressed air is supplied to the inside of the server rack through the air inlet via the pressure reducing air inlet valve, and the dry compressed air is discharged from the air outlet after passing through the server rack, so that the inside of the server rack is always kept in a preset slightly positive pressure state. The refrigerant inlet receives externally cooled refrigerant, and the distribution valve body supplies the refrigerant to the corresponding direct-cooling plate heat exchanger through the refrigerant proportional valve to cool the heating device. The real-time temperature of each heating element is obtained through the temperature sensor, and the opening degree of each refrigerant proportional valve is adjusted according to the real-time temperature of the heating element. The refrigerant after passing through the direct-cooling plate heat exchanger is transported to the outside through the manifold for cooling. The server rack is also equipped with a dew point meter, and an exhaust valve is installed at the air outlet. Dry compressed air is supplied to the server rack from the air inlet via a pressure-reducing inlet valve, and then discharged from the air outlet after passing through the server rack, maintaining a preset slightly positive pressure state inside the server rack, including: The real-time humidity inside the server rack is detected using the dew point meter. When the real-time humidity does not meet the standard, the pressure reducing air intake valve and the exhaust valve are opened to provide dry compressed air into the server rack from the air intake port, so that the dry compressed air passes through the server rack and is discharged from the air outlet. When the real-time humidity inside the server rack meets the standard, the pressure-reducing intake valve and the exhaust valve are closed to maintain a preset slightly positive pressure inside the server rack. After supplying dry compressed air to the server rack through the air inlet via the pressure-reducing air inlet valve, and then discharging the dry compressed air through the air outlet after passing through the server rack, thereby maintaining a preset slightly positive pressure state inside the server rack, the system further includes: The dew point temperature inside the server rack is detected using the dew point meter. Based on the dew point temperature and the inlet temperature of the refrigerant, the dew point temperature of the dry compressed air is adjusted so that the dew point temperature inside the server rack is lower than the inlet temperature of the refrigerant.

2. The cooling method for a direct-cooled distributed micro-positive pressure server rack according to claim 1, characterized in that, The server rack is also equipped with a thermometer; after closing the pressure-reducing intake valve and the exhaust valve when the real-time humidity inside the server rack reaches the standard, maintaining a preset slightly positive pressure state inside the server rack, the method further includes: The ambient temperature inside the server rack is detected using the thermometer. When the ambient temperature exceeds the preset value, the pressure reducing air intake valve and the exhaust valve are opened to provide dry compressed air into the server rack from the air intake port, so that the dry compressed air flows out from the air outlet after passing through the server rack. Alternatively, when the ambient temperature exceeds a preset value, the flow rate of the refrigerant can be increased.

3. The cooling method for a direct-cooled distributed micro-positive pressure server rack according to claim 1, characterized in that, The air inlet is connected to the gas supply device via a connecting pipe and the pressure-reducing air inlet valve; the supply of dry compressed air from the air inlet to the inside of the server rack, so that the dry compressed air flows out from the air outlet after passing through the server rack, maintains a preset slightly positive pressure state inside the server rack, including: The air is pressurized, cooled, dried, and filtered by the gas supply device to obtain dry compressed air; After the dry compressed air is depressurized through the connecting air pipe, it is injected into the server rack, and then discharged from the air outlet after passing through the server rack.

4. The cooling method for a direct-cooled distributed micro-positive pressure server rack according to claim 1, characterized in that, The server rack is also equipped with a human-machine interface and a controller. The human-machine interface is electrically connected to the controller, and the controller is electrically connected to the distribution valve and the temperature sensor.

5. A direct-cooled distributed micro-positive pressure server rack, characterized in that, A cooling method for implementing a direct-cooled distributed micro-positive pressure server rack as described in any one of claims 1-4.

6. An electronic device, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enable the at least one control processor to perform the cooling method of the direct-cooled distributed micro positive pressure server rack as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the cooling method for a direct-cooled distributed micro-positive pressure server rack as described in any one of claims 1 to 4.

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