Electronic device including support structure of printed circuit board

Abstract

According to one embodiment of the present invention, an electronic device comprises: a first printed circuit board; and a second printed circuit board facing the first printed circuit board and disposed on the first printed circuit board. The electronic device includes a first support member disposed on a first surface of the first printed circuit board. The electronic device includes a second support member disposed on a second surface of the second printed circuit board facing the first printed circuit board, the second support member configured to come into contact with the first support member by an external force applied to the electronic device. The electronic device includes an interposer located between the first printed circuit board and the second printed circuit board, the interposer surrounding a region between the first surface and the second surface.

Description

Technical Field

[0001] This disclosure relates to electronic devices including a support structure for supporting a printed circuit board. Background Technology

[0002] Small electronic devices, such as smartphones and tablet PCs, may include printed circuit boards (PCBs) on which electronic components of the device are mounted to enable the various functions of the device. To reduce damage to the electronic components from external shocks, the electronic device may include a support structure that supports the printed circuit board.

[0003] The above information is provided as relevant technical information to aid in understanding this disclosure. No claim or decision is made regarding whether any of the above information can be applied as technically relevant to this disclosure. Summary of the Invention

[0004] Technical solution An electronic device according to an embodiment may include a first printed circuit board. The electronic device may include a second printed circuit board disposed on the first printed circuit board. The electronic device may include a first support member disposed on a first surface of the first printed circuit board facing the second printed circuit board. The electronic device may include a second support member disposed on a second surface of the second printed circuit board facing the first printed circuit board, the second support member being spaced apart from the first support member and configured to contact the first support member based on an external force applied to the electronic device. The electronic device may include an inner insert located between the first and second printed circuit boards, the inner insert surrounding the space between the first and second surfaces.

[0005] An electronic device according to an embodiment may include a first printed circuit board. The electronic device may include a second printed circuit board facing the first printed circuit board, the second printed circuit board being disposed above the first printed circuit board. The electronic device may include a first support member disposed on a first surface of the first printed circuit board facing the second printed circuit board. The electronic device may include a second support member disposed on a second surface of the second printed circuit board facing the first printed circuit board, the second support member facing the first support member and spaced apart from the first support member to be contactable with the first support member. The electronic device may include a first set of electronic components disposed on the first surface and a second set of electronic components disposed on the second surface. The electronic device may include an inner insert located between the first printed circuit board and the second printed circuit board, the inner insert surrounding the space between the first surface and the second surface. The sum of the length of the first support member extending from the first surface toward the second surface and the length of the second support member extending from the second surface toward the first surface may be greater than the sum of the length of one electronic component in the first set of electronic components extending from the first surface toward the second surface and the length of another electronic component in the second set of electronic components facing at least a portion of the first electronic component extending from the second surface toward the first surface. Attached Figure Description

[0006] Figure 1 This is a block diagram of an electronic device in a network environment according to an embodiment.

[0007] Figure 2 This is a diagram illustrating an electronic device according to an embodiment.

[0008] Figure 3 This is an exploded perspective view of an electronic device according to an embodiment.

[0009] Figure 4a This is a partial exploded perspective view of an exemplary electronic device.

[0010] Figure 4b This is a partial cross-sectional view of an exemplary electronic device.

[0011] Figure 5a A portion of an exemplary electronic device in a first state is shown.

[0012] Figure 5b A portion of an exemplary electronic device in its second state is shown.

[0013] Figure 6a , Figure 6b and Figure 6c This is a partial cross-sectional view of an exemplary electronic device.

[0014] Figure 7 This is a partial cross-sectional view of an exemplary electronic device.

[0015] Figure 8a A portion of an exemplary electronic device in which multiple support members are provided is shown.

[0016] Figure 8b It is a circuit diagram used to detect abnormal states of electronic devices.

[0017] Figure 9a and Figure 9b This is a flowchart illustrating the operation of a processor in an exemplary electronic device.

[0018] Figure 10 This is a flowchart illustrating the operation of a processor in an exemplary electronic device. Detailed Implementation

[0019] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement these embodiments. However, the present disclosure may be implemented in several different forms and is not limited to the embodiments described herein. In the description of the drawings, the same or similar reference numerals may be used for the same or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0020] Figure 1 This is a block diagram illustrating an electronic device (101) in a network environment (100) according to various embodiments.

[0021] refer to Figure 1In the network environment (100), the electronic device (101) can communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to an embodiment, the electronic device (101) can communicate with the electronic device (104) via the server (108). According to an embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), a sound output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a user identification module (196), or an antenna module (197). In some embodiments, at least one component (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added to the electronic device (101). In some embodiments, some components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be implemented as a single component (e.g., display module (160)). In some embodiments, the processor (120) may correspond to at least one processor (e.g., two or more processors).

[0022] The processor (120) can run, for example, software (e.g., program (140)) to control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120), and can perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor (120) can store commands or data received from another component (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the result data in non-volatile memory (134). According to an embodiment, the processor (120) can include a main processor (121) (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor (123) (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor or communication processor (CP)) that is operationally independent of or combined with the main processor (121). For example, when the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be adapted to consume less power than the main processor (121) or to be dedicated to a specific function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part of the main processor (121).

[0023] When the main processor (121) is inactive (e.g., in sleep) state, the auxiliary processor (123) (rather than the main processor (121) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)), or when the main processor (121) is active (e.g., running an application), the auxiliary processor (123) may work with the main processor (121) to control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)). According to embodiments, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as another component (e.g., a camera module (180) or communication module (190) functionally associated with the auxiliary processor (123). As part of the AI ​​model, the auxiliary processor (123) (e.g., a neural processing unit) may include a hardware structure dedicated to processing specified AI models, according to an embodiment. AI models can be generated through machine learning. For example, such learning may be performed via an electronic device (101) where the AI ​​is executed or via a separate server (e.g., server (108)). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The AI ​​model may include multiple layers of artificial neural networks. The artificial neural networks may be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more of these. Alternatively, the AI ​​model may also include software structures in addition to hardware structures.

[0024] The memory (130) may store various data used by at least one component of the electronic device (101), such as a processor (120) or a sensor module (176) (e.g., a processor (120) or a sensor module (176)). The various data may include, for example, software (e.g., a program (140)) and input or output data for commands associated with it. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) can be stored as software in memory (130), and the program (140) may include, for example, an operating system (OS) (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data from outside the electronic device (101) (e.g., from a user) that will be used by other components of the electronic device (101) (e.g., the processor (120)). The input module (150) may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0027] The sound output module (155) can output sound signals to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to the outside of the electronic device (101), for example, to a user. The display module (160) may include, for example, a display, a holographic device, or a projector, and a control circuitry system for controlling one of these devices. According to an embodiment, the display module (160) may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by a touch.

[0029] The audio module (170) can convert sound into electrical signals and vice versa. According to an embodiment, the audio module (170) can obtain sound via the input module (150) or output sound via the sound output module (155) or via headphones of an external electronic device (e.g., electronic device (102)) that is directly (e.g., wired) or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the environmental state outside the electronic device (101) (e.g., the user's state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more specific protocols used to enable direct (e.g., wired) or wireless connection between the electronic device (101) and an external electronic device (e.g., electronic device (102)). According to embodiments, the interface (177) may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0032] The connection end (178) may include a connector, through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to an embodiment, the connection end (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The tactile module (179) can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module (179) may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0034] The camera module (180) can capture still or moving images. According to an embodiment, the camera module (180) may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0035] The power management module (188) can manage the power supply to the electronic device (101). According to an embodiment, the power management module (188) can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0036] The battery (189) can power at least one component of the electronic device (101). According to an embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell.

[0037] The communication module (190) can support the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and perform communication via the established communication channel. The communication module (190) may include one or more communication processors capable of operating independently of the processor (120) (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to an embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separated from each other (e.g., multiple chips). The wireless communication module (192) can identify and verify the electronic device (101) in the communication network (e.g., the first network (198) or the second network (199)) using user information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the user identification module (196).

[0038] The wireless communication module (192) can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module (192) can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. The wireless communication module (192) can support various technologies used to ensure performance on high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module (192) can support various requirements specified in electronic devices (101), external electronic devices (e.g., electronic devices (104)), or network systems (e.g., a second network (199)). According to an embodiment, the wireless communication module (192) may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0039] Antenna module (197) can transmit or receive signals or power to or from the outside of electronic device (101) (e.g., external electronic device). According to an embodiment, antenna module (197) may include an antenna comprising a radiating element formed of conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module (197) may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network (198) or a second network (199)) can be selected from the multiple antennas by, for example, communication module (190) (e.g., wireless communication module (192)). Signals or power can then be transmitted or received between communication module (190) and external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module (197).

[0040] According to various embodiments, the antenna module (197) can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0041] At least some of the aforementioned components can be interconnected via a peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)) and can communicatively transmit signals (e.g., commands or data) between them.

[0042] According to an embodiment, commands or data can be sent or received between the electronic device (101) and the external electronic device (104) via a server (108) connected to a second network (199). Each of the electronic devices (102) or (104) can be a device of the same type as the electronic device (101) or a device of a different type. According to an embodiment, all or some of the operations to be performed on the electronic device (101) can be performed on one or more of the external electronic device (102), external electronic device 104, or server (108). For example, if the electronic device (101) is required to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or the electronic device (101) may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the performance to the electronic device (101). The electronic device (101) may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. The electronic device (101) may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device (104) or the server (108) may be included in a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0043] Figure 2 This is a diagram illustrating an electronic device according to an embodiment.

[0044] refer to Figure 2The electronic device (101) according to the embodiment may include a housing (210) forming the exterior of the electronic device (101). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding the space between the front surface (200A) and the rear surface (200B). According to the embodiment, the housing (210) may refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0045] The electronic device (101) according to an embodiment may include a substantially transparent front panel (202). According to an embodiment, the front panel (202) may form at least a portion of the front surface (200A). According to an embodiment, the front panel (202) may include, for example, a glass plate or a polymer plate including various coatings, but the embodiments of this disclosure are not limited thereto.

[0046] The electronic device (101) according to an embodiment may include a substantially opaque back panel (211). According to an embodiment, the back panel (211) may form at least a portion of the back surface (200B). According to an embodiment, the back panel (211) may be formed from coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0047] The electronic device (101) according to an embodiment may include a side structure (or side member) (218). According to an embodiment, the side structure (218) may be coupled to a front panel (202) and / or a rear panel (211) to form at least a portion of a side surface (200C) of the electronic device (101). For example, the side structure (218) may form all of the side surface (200C) of the electronic device (101). As another example, the side structure (218) may form the side surface (200C) of the electronic device (101) together with the front panel (202) and / or the rear panel (211).

[0048] According to an embodiment, where the side surface (200C) of the electronic device (101) is partially formed by a front plate (202) and / or a rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that curves and extends seamlessly from its periphery toward the rear plate (211) and / or the front plate (202). The extended regions of the front plate (202) and / or the rear plate (211) may be located, for example, at both ends of the long side of the electronic device (101), but embodiments of this disclosure are not limited to the examples described above.

[0049] According to embodiments, the side structure (218) may comprise metal or polymer. According to embodiments, the back panel (211) and the side structure (218) may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum), but embodiments of this disclosure are not limited thereto. For example, the back panel (211) and the side structure (218) may be formed in separate configurations and / or may comprise different materials.

[0050] According to an embodiment, the electronic device (101) may include at least one of a display (201), an audio module (203, 204, and 207), a sensor module, a camera module (205, 212, and 213), a key input device (217), a light-emitting device, and / or a connector hole (208). According to another embodiment, the electronic device (101) may omit at least one of these components (e.g., a key input device (217) or a light-emitting device), or may include another component.

[0051] According to an embodiment, the display (201) can be visually exposed through a large portion of the front panel (202). For example, at least a portion of the display (201) can be seen through the front panel (202) forming the front surface (200A). According to an embodiment, the display (201) can be disposed on a second surface of the front panel (202).

[0052] According to an embodiment, the appearance of the display (201) can be formed to be substantially the same as the appearance of the front panel (202) adjacent to the display (201). According to an embodiment, in order to increase the area of ​​the display (201) that is visually exposed, the distance between the exterior of the display (201) and the exterior of the front panel (202) can be formed to be approximately the same.

[0053] According to an embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). According to an embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when viewed from the front, the screen display area (201A) is shown to be spaced apart from the outside of the front surface (200A) and located inside the front surface (200A), but the embodiments of this disclosure are not limited thereto. In another embodiment, when viewed from the front, at least a portion of the periphery of the screen display area (201A) may substantially coincide with the periphery of the front surface (200A) (or the front panel (202)).

[0054] According to an embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, "the screen display area (201A) includes the sensing area (201B)" can be understood to mean that at least a portion of the sensing area (201B) may overlap with the screen display area (201A). For example, like other areas of the screen display area (201A), the sensing area (201B) may refer to an area where visual information can be displayed by the display (201) and where the user's biometric information (e.g., fingerprint) can be acquired. In another embodiment, the sensing area (201B) may be formed in a key input device (217).

[0055] According to an embodiment, the display (201) may include an area therein where a first camera module (205) is located. According to an embodiment, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be at least partially disposed in the opening to face the front surface (200A). In this case, the screen display area (201A) may surround at least a portion of the periphery of the opening. According to an embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be disposed below the display (201) to overlap with the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through this area, and additionally, the first camera module (205) can obtain an image through this area of ​​the display (201) corresponding to the direction facing the front surface (200A).

[0056] According to an embodiment, the display (201) may be connected to or located adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity of a touch (e.g., pressure), and / or a digital converter for detecting magnetic field type styluses.

[0057] According to an embodiment, the audio module (203, 204 and 207) may include a microphone hole (203 and 204) and a speaker hole (207).

[0058] According to an embodiment, the microphone holes (203 and 204) may include a first microphone hole (203) formed in a portion of the side surface (200C) and a second microphone hole (204) formed in a portion of the rear surface (200B). A microphone for acquiring external sound may be disposed inside the microphone holes (203 and 204). The microphone may include multiple microphones to detect the direction of sound.

[0059] According to an embodiment, a second microphone hole (204) formed in a portion of the rear surface (200B) can be positioned adjacent to the camera modules (205, 212, and 213). For example, the second microphone hole (204) can acquire sound based on the operation of the camera modules (205, 212, and 213). However, embodiments of this disclosure are not limited thereto.

[0060] According to an embodiment, the speaker hole (207) may include an external speaker hole (207) and a receiver hole for making a call. The external speaker hole (207) may be formed on a portion of the side surface (200C) of the electronic device (101). According to an embodiment, the external speaker hole (207) may be implemented as a single hole together with a microphone hole (203). According to an embodiment, the receiver hole for making a call may be formed on another portion of the side surface (200C). For example, the receiver hole for making a call may be formed on the opposite side of the external speaker hole (207) on the side surface (200C). For example, refer to Figure 2 As shown in the diagram, an external speaker hole (207) may be formed on a side surface (200C) corresponding to the lower end of the electronic device (101), and a receiver hole for calling may be formed on a side surface (200C) corresponding to the upper end of the electronic device (101). However, embodiments of this disclosure are not limited thereto, and according to embodiments, the receiver hole for calling may be formed at a location other than the side surface (200C). For example, the receiver hole for calling may be formed by a space spaced between the front panel (202) (or the display (201)) and the side bezel structure (218).

[0061] According to an embodiment, the electronic device (101) may include at least one speaker configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calling.

[0062] According to an embodiment, the sensor module can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device (101). For example, the sensor module may include at least one of a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyroscope sensor, pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, and lighting sensor.

[0063] According to an embodiment, the camera modules (205, 212 and 213) may include a first camera module (205) configured to face the front surface (200A) of the electronic device (101), a second camera module (212) configured to face the rear surface (200B), and a flash (213).

[0064] According to an embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0065] According to an embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors and / or image signal processors.

[0066] According to an embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to an embodiment, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (101).

[0067] According to an embodiment, the key input device (217) (for example, Figure 1 The input module (150) may be disposed on the side surface (200C) of the electronic device (101). According to an embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) not included may be implemented on the display (201) in another form such as soft keys.

[0068] According to an embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) to accommodate a connector of an external device. A connection end electrically connected to the connector of the external device may be disposed in the connector hole (208). The electronic device (101) according to an embodiment may include an interface module for processing electrical signals transmitted and received through the connection end.

[0069] According to an embodiment, the electronic device (101) may include a light-emitting device. For example, the light-emitting device may be disposed on the front surface (200A) of the housing (210). The light-emitting device may provide status information of the electronic device (101) in the form of light. In another embodiment, the light-emitting device may provide a light source when the first camera module (205) is operating. For example, the light-emitting device may include an LED, an IR LED, and / or a xenon lamp.

[0070] Figure 3 This is an exploded perspective view of an electronic device according to an embodiment.

[0071] In the following text, overlapping descriptions of components that have the same reference numerals as those described above will be omitted.

[0072] refer to Figure 3The electronic device (101) according to the embodiment may include a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270).

[0073] According to an embodiment, the frame structure (240) may include the exterior forming the electronic device (101) (e.g., Figure 2 The frame structure (240) comprises a sidewall (241) of the side surface (200C) and a support portion (243) extending inwardly from the sidewall (241). According to an embodiment, the frame structure (240) may be disposed between the display (201) and the rear panel (211). According to an embodiment, the sidewall (241) of the frame structure (240) may surround the space between the rear panel (211) and the front panel (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the sidewall (241) within this space.

[0074] According to an embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on a surface of the frame structure (240) facing one direction (e.g., the +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). As another example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a rear camera (212) may be disposed on another surface of the frame structure (240) facing the opposite direction (e.g., the -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the rear camera (212) may be mounted on a recess defined by the sidewall (241) and / or the support portion (243) of the frame structure (240).

[0075] According to an embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) can be connected to the frame structure (240), respectively. For example, the first printed circuit board (250) and the second printed circuit board (252) can be fixedly disposed in the frame structure (240) by means of connecting members such as screws. For example, the battery (270) can be fixedly disposed on the frame structure (240) by means of adhesive members (e.g., double-sided tape). However, the embodiments of this disclosure are not limited to the examples described above.

[0076] According to an embodiment, a cover plate (260) may be disposed between the first printed circuit board (250) and the rear plate (211). According to an embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on the surface of the first printed circuit board (250) facing the –z direction.

[0077] According to an embodiment, the cover plate (260) may overlap at least partially with respect to the first printed circuit board (250) relative to the z-axis. According to an embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). In this way, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent the connectors attached to the first printed circuit board (250) from separation.

[0078] According to an embodiment, the cover plate (260) can be fixedly mounted on the first printed circuit board (250) by means of a connecting member (e.g., screws), or can be connected to the frame structure (240) together with the first printed circuit board (250) by means of a connecting member.

[0079] According to an embodiment, the display (201) may be disposed between the frame structure (240) and the front panel (202). For example, the front panel (202) may be disposed on one side of the display (201) (e.g., in the +z direction), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0080] According to an embodiment, the front panel (202) can be attached to the display (201). For example, the front panel (202) and the display (201) can be bonded to each other by means of an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) between them.

[0081] According to an embodiment, the front panel (202) may be coupled to the frame structure (240). For example, when viewed in the z-axis direction, the front panel (202) may include an external portion extending outside the display (201) and may be bonded to the frame structure (240) by an adhesive member (e.g., double-sided tape) disposed between the external portion of the front panel (202) and the frame structure (240) (e.g., sidewall (241)). However, embodiments of this disclosure are not limited to the examples described above.

[0082] According to an embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor (e.g., Figure 1 The processor (120) and memory (e.g., Figure 1 The memory (130) and / or interface (e.g., Figure 1The interface (177) may include, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processing unit, or a communication processor, or more thereof. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0083] According to an embodiment, the battery (270) can supply power to at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed on a plane substantially the same as the first printed circuit board (250) and / or the second printed circuit board (252).

[0084] The electronic device (101) according to the embodiment may include an antenna module (e.g., Figure 1 The antenna module (197) is provided. According to an embodiment, the antenna module may be disposed between the rear panel (211) and the battery (270). The antenna module may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device, or wirelessly send and receive power to and from an external device.

[0085] According to an embodiment, the front camera (205) may be disposed in at least a portion of the frame structure (240) (e.g., the support portion (243)) such that the lens can receive external light through a portion of the front panel (202) (e.g., the camera area (237)).

[0086] According to an embodiment, the rear camera (212) may be disposed between the frame structure (240) and the rear panel (211). According to an embodiment, the rear camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). According to an embodiment, the rear camera (212) may be configured such that the lens may receive external light through the camera area (284) of the rear panel (211) of the electronics (101).

[0087] According to an embodiment, the camera region (284) may be formed on the surface of the rear plate (211) (e.g., Figure 2The camera region (284) is formed on the rear surface (200B). According to an embodiment, the camera region (284) may be formed to be at least partially transparent, allowing external light to be incident on the lens of the rear camera (212). According to an embodiment, at least a portion of the camera region (284) may protrude from the surface of the rear panel (211) to a predetermined height. However, embodiments of the present disclosure are not limited thereto, and in another embodiment, the camera region (284) may be formed to be substantially the same plane as the surface of the rear panel (211).

[0088] According to an embodiment, the housing of the electronic device (101) (e.g., Figure 2 The housing (210) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front panel (202), frame structure (240) and / or rear panel (211) forming the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0089] Figure 4a This is a partial exploded perspective view of an exemplary electronic device. Figure 4b This is a partial cross-sectional view of the exemplary electronic device.

[0090] refer to Figure 4a and Figure 4b The electronic device (101) may include a first printed circuit board (410) (e.g., Figure 3 The first printed circuit board (250) and the second printed circuit board (420) (e.g., Figure 3 The second printed circuit board (252).

[0091] According to an embodiment, the second printed circuit board (420) may face the first printed circuit board (410). The second printed circuit board (420) may be disposed on the first printed circuit board (410). In this disclosure, it should be understood that when an element is referred to as being "on" another element, it may be directly on the other element, or there may be an intermediate element between them. For example, in this disclosure, "B disposed on A" may mean "B disposed above A". For example, in this disclosure, "B disposed on A" may mean "B disposed below A". For example, in this disclosure, "B disposed on A" may mean "B facing away from A". For example, "the second printed circuit board (420) disposed on the first printed circuit board (410)" may mean "the second printed circuit board (420) in contact with the first printed circuit board (410)". For example, "the second printed circuit board (420) disposed on the first printed circuit board (410)" may mean "the second printed circuit board (420) facing away from the first printed circuit board (410)". The structure in which the second printed circuit board (420) is disposed on the first printed circuit board (410) can be referred to as a PCB stack, but examples of the structure are not limited to those described above.

[0092] For example, the second printed circuit board (420) may be spaced apart from the first printed circuit board (410). At least a portion of the second printed circuit board (420) may face the first printed circuit board (410). For example, when viewed from above, at least a portion of the second printed circuit board (420) may overlap the first printed circuit board (410). For example, multiple electronic components may be mounted on the first printed circuit board (410) and the second printed circuit board (420) respectively. At least a portion of the electronic components mounted on the first printed circuit board (410) (i.e., one or more electronic components) may face at least a portion of the electronic components mounted on the second printed circuit board (420). Since at least a portion of the first printed circuit board (410) is spaced apart from the second printed circuit board (420), the electronic components disposed on the first printed circuit board (410) may be spaced apart from the electronic components disposed on the second printed circuit board (420).

[0093] According to an embodiment, the first printed circuit board (410) may include a first surface (411) facing the second printed circuit board (420) and a third surface (412) opposite to the first surface (411). The second printed circuit board (420) may include a second surface (421) facing the first printed circuit board (410) and a fourth surface (422) opposite to the second surface (421). For example, the first surface (411) and the second surface (421) may face each other. For example, the first surface (411) may face away from the second surface (421). For example, the first surface (411) may be the surface of the first printed circuit board (410) closest to the second printed circuit board (420). For example, the second surface (421) may be the surface of the second printed circuit board (420) closest to the first printed circuit board (410). For example, the third surface (412) may be the surface of the first printed circuit board (410) furthest from the second printed circuit board (420). For example, the fourth surface (422) can be the surface furthest from the first printed circuit board (410) of all the surfaces of the second printed circuit board (420).

[0094] According to an embodiment, the electronic device (101) may further include a first set of electronic components (450) disposed on a first surface (411) of a first printed circuit board (410) and a second set of electronic components (460) disposed on a second surface (421) of a second printed circuit board (420). For example, at least a portion of the first set of electronic components (450) can be connected via the first printed circuit board (410) to a power management module of the electronic device (101) (e.g., Figure 1 The power management module (188) and / or battery (189) are powered. For example, at least a portion of the second set of electronic components (460) can be powered from the power management module (188) and / or battery (189) via the second printed circuit board (420). For example, since the first surface (411) faces the second surface (421), at least a portion of the first set of electronic components (450) mounted on the first surface (411) can face at least a portion of the second set of electronic components (460) mounted on the second surface (421). For example, since the first surface (411) is spaced apart from the second surface (421), each of the first set of electronic components (450) mounted on the first surface (411) can be spaced apart from the second set of electronic components (460) mounted on the second surface (421).

[0095] In some embodiments, the electronic device (101) may include a first set of electronic components (450) and a second set of electronic components (460), but embodiments of this disclosure are not limited thereto. The electronic device (101) may also include a third set of electronic components located on a third surface (412) of the first printed circuit board (410) and / or a fourth surface (422) of the second printed circuit board (420). Figure 5a The third group of electronic components (470) may be spaced apart from the first group of electronic components (450) and the second group of electronic components (460). Furthermore, terms such as “first group” and “second group” may be used simply to distinguish corresponding components from other components and do not therefore limit the corresponding components on the other side (e.g., the number of corresponding components). For example, the first group of electronic components (450) may include one or more electronic components disposed on the first surface (411). For example, the second group of electronic components (460) may include one or more electronic components disposed on the second surface (421).

[0096] According to an embodiment, the electronic device (101) may further include a third set of electronic components (470) disposed on at least a portion of a third surface (412) of the first printed circuit board (410) opposite to the first surface (411) and a fourth surface (422) of the second printed circuit board (420) opposite to the second surface (421). The first support member (510) and the second support member (520) may be disposed at positions corresponding to at least a portion of the third set of electronic components (470).

[0097] For example, when the first printed circuit board (410) is viewed from above (e.g., when viewed in the -z direction), at least a portion of the third set of electronic components (470) may at least partially overlap with the first support member (510). For example, at least a portion of the third set of electronic components (470) may be arranged on substantially the same axis as the first support member (510) based on the x-axis and y-axis. For example, when the second printed circuit board (420) is viewed from above (e.g., when viewed in the +z direction), at least a portion of the third set of electronic components (470) may at least partially overlap with the second support member (520). For example, at least a portion of the third set of electronic components (470) may be arranged on substantially the same axis as the second support member (520) based on the x-axis and y-axis. For example, the electronic device (101) may include a support region (530) that is relatively susceptible to external impact. At least a portion of the third set of electronic components (470) may be disposed on the support region (530). The first support member (510) and the second support member (520) may be located at positions corresponding to at least a portion of a third set of electronic components (470) disposed in the support region (530). At least a portion of the third set of electronic components (470) disposed in the support region (530) may have a maximum height based on the z-axis among electronic components disposed outside the space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the internal component (430). At least a portion of the third set of electronic components (470) may be part of the external structure of the electronic device (101) (e.g., Figure 2 When the rear panel (211) is deformed by external impact, the electronic components are relatively susceptible to external impact. By placing the first support member (510) and the second support member (520) at positions corresponding to the relatively fragile electronic components, the failure of the electronic components around the first support member (510) and the second support member (520) due to external impact can be reduced.

[0098] According to an embodiment, the electronic device (101) may further include an inner insert (430) located between a first printed circuit board (410) and a second printed circuit board (420), the inner insert (430) surrounding the space between a first surface (411) of the first printed circuit board (410) and a second surface (421) of the second printed circuit board (420). For example, the inner insert (430) may separate the first printed circuit board (410) from the second printed circuit board (420). For example, the inner insert (430) may contact the first surface (411) and the second surface (421). For example, the inner insert (430) may surround a first set of electronic components (450) disposed on the first surface (411) and a second set of electronic components (460) disposed on the second surface (421). The electronic device (101) can provide space for the first set of electronic components (450) and the second set of electronic components (460) by including an inner plug (430) and reduce the contact between the first set of electronic components (450) and the second set of electronic components (460).

[0099] According to an embodiment, a structure in which electronic components (e.g., a first group of electronic components (450), a second group of electronic components (460), and a third group of electronic components (470)) are respectively disposed on a first surface (411), a second surface (421), a third surface (412), and a fourth surface (422) can be referred to as a four-sided mounting structure of a printed circuit board. In the four-sided mounting structure, since the first surface (411) and the second surface (421) face each other, at least a portion of the first group of electronic components (450) and at least a portion of the second group of electronic components (460) can come into contact due to external impact. The electronic device (101) may include a structure for reducing faults in at least some of the first group of electronic components (450) and / or at least some of the second group of electronic components (460) by bringing at least a portion of the first group of electronic components (450) into contact with at least a portion of the second group of electronic components (460). The structure for reducing faults will be described below. Figure 5a And then described.

[0100] exist Figure 2 and Figure 3 In this context, the electronic device (101) can correspond to Figure 2 and Figure 3 The device in question has a bar shape, but the shape of the electronic device (101) is not limited to a bar shape.

[0101] For example, the electronic device (101) may include a first housing and a second housing movable relative to the first housing. The electronic device (101) may include a flexible display (e.g., Figure 2The flexible display (201) includes a deformable region of a second housing that moves relative to a first housing. The flexible display can provide a variety of user experiences by including a region of the second housing, at least a portion of which moves relative to the first housing, that is rolled into or exposed outside the first housing. The electronic device (101) including the flexible display having a deformable region of the second housing that moves relative to the first housing can include structures for reducing malfunctions of at least some of the first set of electronic components (450) and / or at least some of the second set of electronic components (460) by bringing at least a portion of the first set of electronic components (450) into contact with at least a portion of the second set of electronic components (460).

[0102] For example, the electronic device (101) may include a first housing, a second housing, and a hinge structure rotatably connecting the first housing and the second housing. The electronic device may include a flexible display having a deformable region disposed on the hinge structure and extending from the first housing across the hinge structure to the second housing. The electronic device (101) may provide various user experiences to a user by including the hinge structure rotatably connecting the first housing and the second housing. The electronic device (101) including a flexible display having a deformable region disposed on the hinge structure may include a structure for reducing the failure of at least some of the first set of electronic components (450) and / or at least some of the second set of electronic components (460) by bringing at least some of the first set of electronic components (450) into contact with each other.

[0103] The electronic device (101) according to the above embodiment can increase the space in the electronic device (101) for electronic components mounted on the first printed circuit board (410) and / or the second printed circuit board (420) by including a first printed circuit board (410) and a second printed circuit board (420) disposed on the first printed circuit board (410).

[0104] Figure 5a A portion of an exemplary electronic device in a first state is shown. Figure 5b A portion of an exemplary electronic device in its second state is shown.

[0105] refer to Figure 5a and Figure 5bThe electronic device (101) may include a first printed circuit board (410) and a second printed circuit board (420) facing and spaced apart from the first printed circuit board (410). The electronic device (101) may also include an insert (430) between the first printed circuit board (410) and the second printed circuit board (420), the insert (430) surrounding the space between a first surface (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second surface (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may also include a first set of electronic components (450) disposed on the first surface (411) and a second set of electronic components (460) disposed on the second surface (421).

[0106] In the following text, will be omitted Figure 4a and Figure 4b The overlapping descriptions of the configurations described in the document.

[0107] refer to Figure 5a and Figure 5b The electronic device (101) may include a first support member (510) disposed on a first surface (411) of the first printed circuit board (410) facing the second printed circuit board (420). The electronic device (101) may include a second support member (520) disposed on the second printed circuit board (420) and facing the first support member (510). The second support member (520) may be configured to contact the first support member (510) for example by an external force.

[0108] For example, a first support member (510) and a second support member (520) may be disposed in a space surrounded by a first surface (411), a second surface (421), and an inner insert (430). The first support member (510) may be disposed on the second support member (520) in this space. For example, the first support member (510) may face away from the second support member (520). For example, the first support member (510) may be attached to the first surface (411) facing the second support member (520). The second support member (520) may be attached to the second surface (421) facing the first support member (510).

[0109] The first state of the electronic device (101) may be a state in which the first support member (510) and the second support member (520) are spaced apart. For example, the first state may be a state in which the first support member (510) and the second support member (520) face away from each other. For example, the first state may be a state in which there is a gap between the electronic device (101) and the first support member (510) and the second support member (520).

[0110] For example, the electronic device (101) may include a support region (530) in which a first support member (510) and a second support member (520) are disposed. The support region (530) may include a portion of a first printed circuit board (410) connected to the first support member (510) and a portion of a second printed circuit board (420) connected to the second support member (520). A first state may be a state in which the support region (530) is not damaged. A first state may be a state in which the portions of the first printed circuit board (410) included in the support region (530) and / or the portions of the second printed circuit board (420) included in the support region (530) are not deformed. A first state may be a state in which the portions of the first printed circuit board (410) included in the support region (530) are not bent toward the second printed circuit board (420). A first state may be a state in which the portions of the second printed circuit board (420) included in the support region (530) are not bent toward the first printed circuit board (410). However, embodiments of this disclosure are not limited thereto, and the first state may include multiple states in which the first support member (510) and the second support member (520) are not in contact.

[0111] The second state of the electronic device (101) may be a state in which the first support member (510) is in contact with the second support member (520). For example, the second state may be a state in which the first support member (510) is connected to the second support member (520). For example, the second state may be a state in which there is no gap between the electronic device (101) and the first support member (510) and the second support member (520).

[0112] For example, the second state may be a state in which at least a portion of the support region (530) where the first support member (510) and the second support member (520) are disposed is damaged. For example, the second state may be a state in which the first support member (510) contacts the second support member (520) by deforming a portion of the first printed circuit board (410) included in the support region (530) and / or a portion of the second printed circuit board (420) included in the support region (530). For example, the second state may be a state in which at least a portion of the first printed circuit board (410) included in the support region (530) bends toward the second printed circuit board (420). For example, the second state may be a state in which at least a portion of the second printed circuit board (420) included in the support region (530) bends toward the first printed circuit board (410). However, embodiments of this disclosure are not limited thereto. For example, the second state may include multiple states in which the first support member (510) contacts the second support member (520) by deforming at least a portion of the support region (530).

[0113] For example, the first support member (510) and the second support member (520) may face each other. When the electronic device (101) changes from the first state to the second state, at least a portion of the support region (530) may deform due to an external impact. For example, a portion of the first printed circuit board (410) included in the support region (530) may be bent toward the second printed circuit board (420). By bending this portion of the first printed circuit board (410), the first support member (510) may move toward the second support member (520). For example, a portion of the second printed circuit board (420) included in the support region (530) may be bent toward the first printed circuit board (410). By bending this portion of the second printed circuit board (420), the second support member (520) may move toward the first support member (510). Since the first support member (510) and the second support member (520) are arranged to face each other, the second support member (520) can be configured to contact the first support member (510) in the event of deformation of at least a portion of the support region (530). For example, in a second state, the first support member (510) can support the second support member (520). The first support member (510) can reduce damage to the second printed circuit board (420) due to external impact by supporting the second support member (520). For example, in a second state, the second support member (520) can support the first support member (510). The second support member (520) can reduce damage to the first printed circuit board (410) due to external impact by supporting the first support member (510).

[0114] According to an embodiment, when the first surface (411) of the first printed circuit board (410) is viewed from above, the first support member (510) may overlap with the second support member (520). For example, the first support member (510) may be disposed at a position corresponding to the second support member (520) in the space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the internal component (430). For example, the surface of the first support member (510) facing the second printed circuit board (420) may face the surface of the second support member (520) facing the first printed circuit board (410). In a second state in the electronic device (101) where the first support member (510) is in contact with the second support member (520), the surface of the first support member (510) facing the second printed circuit board (420) may overlap with the surface of the second support member (520) facing the first printed circuit board (410). When the first surface (411) of the first printed circuit board (410) is viewed from above, the first support member (510) can reduce damage to the first printed circuit board (410) and / or the second printed circuit board (420) in the second state by overlapping with the second support member (520).

[0115] According to an embodiment, the length d1 of the first support member (510) extending from the first surface (411) toward the second surface (421) can be greater than the length of each electronic component in the first group of electronic components (450) extending from the first surface (411) toward the second surface (421). The length d2 of the second support member (520) extending from the second surface (421) toward the first surface (411) can be greater than the length of each electronic component in the second group of electronic components (460) extending from the second surface (421) toward the first surface (411).

[0116] For example, the length d1 of the first support member (510) extending from the first surface (411) toward the second surface (421) can be greater than the maximum length of the first set of electronic components (450) extending from the first surface (411) toward the second surface (421). The length d2 of the second support member (520) extending from the second surface (421) toward the first surface (411) can be greater than the maximum length of the second set of electronic components (460) extending from the second surface (421) toward the first surface (411). For example, the gap between the first support member (510) and the second support member (520) can be smaller than the gap between the first set of electronic components (450) and the second set of electronic components (460). Since the length d1 of the first support member (510) is greater than the length of each electronic component in the first group of electronic components (450), and the length d2 of the second support member (520) is greater than the length of each electronic component in the second group of electronic components (460), the electronic device (101) can reduce the failure of the first group of electronic components (450) and / or the second group of electronic components (460) caused by contact between the first group of electronic components (450) and the second group of electronic components (460).

[0117] According to an embodiment, when changing from a first state in which the first support member (510) and the second support member (520) of the electronic device (101) are spaced apart to a second state in which the first support member (510) and the second support member (520) of the electronic device (101) are in contact, the first group of electronic components (450) can be spaced apart from the second group of electronic components (460). For example, since the length d1 of the first support member (510) is greater than the maximum length of the first group of electronic components (450), and the length d2 of the second support member (520) is greater than the maximum length of the second group of electronic components (460), the first group of electronic components (450) can be spaced apart from the second group of electronic components (460) in the second state. For example, since in the second state, the first support member (510) supports the second surface (421) via the second support member (520), and the second support member (520) supports the first surface (411) via the first support member (510), the first set of electronic components (450) can be spaced apart from the second set of electronic components (460). The electronic device (101) may include a first support member (510) and a second support member (520) to prevent contact between the first set of electronic components (450) and the second set of electronic components (460). Therefore, the electronic device (101) can reduce malfunctions of the first set of electronic components (450) and / or the second set of electronic components (460) caused by contact between the first set of electronic components (450) and the second set of electronic components (460).

[0118] In some embodiments, the electronic device (101) may include a first support member (510) and a second support member (520), but embodiments of this disclosure are not limited thereto. The electronic device (101) may include a plurality of support regions (e.g., support regions (530)) that are relatively susceptible to deformation from external impacts. The electronic device (101) may include groups of support members disposed on each of the plurality of support regions and paired with each other (e.g., Figure 8a The support member assembly (810)). The arrangement of multiple support members in each of the multiple support areas will be discussed below. Figure 8a And then described.

[0119] According to an embodiment, the first support member (510) may include a first electrode (511). The second support member (520) may include a second electrode (521) configured to contact the first electrode (511). For example, the first electrode (511) may form at least a portion of the first support member (510). The first electrode (511) may be exposed outside the first support member (510). The second electrode (521) may form at least a portion of the second support member (520). The second electrode (521) may be exposed outside the second support member (520), and therefore the second electrode (521) may be configured to contact the first electrode (511) of the first support member (510). For example, at least a portion of the second electrode (521) may face at least a portion of the first electrode (511), and therefore that portion of the second electrode (521) may be configured to contact the first electrode (511). For example, in a first state in which the first support member (510) and the second support member (520) of the electronic device (101) are spaced apart, the second electrode (521) may be spaced apart from the first electrode (511). In a second state in which the first support member (510) and the second support member (520) of the electronic device (101) are in contact, the second electrode (521) may be in contact with at least a portion of the first electrode (511).

[0120] For example, a first electrode (511) may be electrically connected to a first printed circuit board (410). A second electrode (521) may be electrically connected to a second printed circuit board (420). The first electrode (511) may provide a conductive path for current from the first printed circuit board (410) to the second printed circuit board (420) by contacting the second electrode (521). The electronic device (101) may be configured to identify a second state in which the first support member (510) is in contact with the second support member (520) by means of current. The identification of the contact between the first support member (510) and the second support member (520) will be discussed below. Figure 8a And then described.

[0121] According to an embodiment, a first support member (510) including a first electrode (511) and / or a second support member (520) including a second electrode (521) may be referred to as an electronic component including at least one of a dummy cap and a capacitor. By including at least one of a dummy cap or a capacitor, the first support member (510) and the second support member (520) can simplify the process in which the first support member (510) and the second support member (520) are respectively disposed on a first printed circuit board (410) and a second printed circuit board (420), and reduce the failure of electronic components around the first support member (510) and the second support member (520).

[0122] According to an embodiment, a first electrode (511) may extend in a first direction within a first support member (510). A second electrode (521) may extend in a second support member (520) in a second direction different from the first direction. According to an embodiment, the first direction in which the first electrode (511) extends may be perpendicular to the second direction in which the second electrode (521) extends. For example, the first electrode (511) may extend in the first support member (510) in a direction parallel to the +x or -x direction. The second electrode (521) may extend in the second support member (520) in a direction parallel to the +y or -y direction. However, embodiments of this disclosure are not limited thereto. Since the direction in which the first electrode (511) extends is different from the direction in which the second electrode (521) extends, the electronic device (101) can reduce the contact area between the first electrode (511) and the second electrode (521). The electronic device (101) can reduce damage to the first electrode (511) and the second electrode (521) by reducing the contact area between the first electrode (511) and the second electrode (521). According to an embodiment, the first electrode (511) may be disposed at both ends of the first support member (510). The second electrode (521) may be disposed at both ends of the second support member (520) such that it extends in a direction perpendicular to the direction in which the first electrode (511) extends. For example, the first electrode (511) may extend in a direction parallel to the long axis of the first support member (510). The second electrode (521) may extend in a direction parallel to the short axis of the second support member (520) that overlaps with the first support member (510). However, embodiments of this disclosure are not limited thereto.

[0123] According to an embodiment, each of the first support member (510) and the second support member (520) may be deformable. For example, the first support member (510) may come into contact with the second support member (520) by deforming the first printed circuit board (410) and / or the second printed circuit board (420) in the support region (530). The first support member (510) may be deformable by the second support member (520). The second support member (520) may be deformable by the first support member (510). For example, the first support member (510) and the second support member (520) may include, but are not limited to, rubber. Because the first support member (510) and the second support member (520) are deformable, the electronic device (101) may reduce damage to the first printed circuit board (410) and / or the second printed circuit board (420) due to contact between the first support member (510) and the second support member (520). For example, the contact between the first support member (510) and the second support member (520) can be caused by external force or external impact.

[0124] The electronic device (101) according to the above embodiment can reduce damage to the first printed circuit board (410) and the second printed circuit board (420) by including a first support member (510) and a second support member (520) facing the first support member (510) and configured to contact the first support member (510). The first support member (510) and the second support member (520) can reduce contact between the first set of electronic components (450) disposed on the first surface (411) and the second set of electronic components (460) disposed on the second surface (421) by being configured to contact each other. The first support member (510) and the second support member (520) can provide various user experiences to the user of the electronic device (101) by including a first electrode (511) and a second electrode (521) respectively.

[0125] Figure 6a , Figure 6b and Figure 6c This is a partial cross-sectional view of an exemplary electronic device.

[0126] refer to Figure 6a , Figure 6b and Figure 6cThe electronic device (101) may include a first printed circuit board (410) and a second printed circuit board (420) facing and spaced apart from the first printed circuit board (410). The electronic device (101) may also include an insert (430) located between the first printed circuit board (410) and the second printed circuit board (420), the insert (430) surrounding the space between a first surface (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second surface (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may also include a first set of electronic components (450) disposed on the first surface (411) and a second set of electronic components (460) disposed on the second surface (421).

[0127] refer to Figure 6a The electronic device (101) may include a support member (610) located between the first printed circuit board (410) and the second printed circuit board (420). For example, with Figure 5a and Figure 5b In contrast, the first supporting member can be omitted (e.g., Figure 5a The first support member (510) and the second support member (e.g., Figure 5a One of the second support members (520). For example, the length d3 of the support member (610) extending from the first surface (411) to the second surface (421) may be greater than the sum of the maximum lengths of the electronic components included in the first group of electronic components (450) and the maximum lengths of the electronic components included in the second group of electronic components (460). For example, when the first printed circuit board (410) and / or the second printed circuit board (420) are deformed by external impact, the support member (610) may come into contact with the first printed circuit board (410) and the second printed circuit board (420). The support member (610) may reduce the contact between the first group of electronic components (450) and the second group of electronic components (460) by being configured to support the first printed circuit board (410) and the second printed circuit board (420).

[0128] refer to Figure 6b and Figure 6c The electronic device (101) may include a first support member (510) disposed on a first surface (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second support member (520) disposed on a second surface (421) of the second printed circuit board (420) facing the first printed circuit board (410).

[0129] refer to Figure 6bA portion of the first support member (510) may face a portion of the second support member (520). The remaining portion of the first support member (510) may face the second surface (421) of the second printed circuit board (420). The remaining portion of the second support member (520) may face the first surface (411) of the first printed circuit board (410). Since a portion of the first support member (510) faces a portion of the second support member (520), in the event of deformation of the first printed circuit board (410) and / or the second printed circuit board (420), the portion of the first support member (510) may come into contact with a portion of the second support member (520). According to an embodiment, the first support member (510) may include a first electrode (e.g., on the portion facing the second support member (520)). Figure 5a The first electrode (511). The second support member (520) may include a second electrode configured to contact the first electrode (511) on the portion facing the first support member (510). Figure 5a The second electrode (521). However, embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include a first support member (510) and a second support member (520) configured to partially contact and pair with each other.

[0130] refer to Figure 6c The size s1 of the first support member (510) may differ from the size s2 of the second support member (520). For example, when viewed from above, the area where the first support member (510) is disposed may include the area where the second support member (520) is disposed. For example, when viewed from above, a portion of the first support member (510) may overlap with the second support member (520). For example, a portion of the first support member (510) may face the second support member (520). According to an embodiment, the first support member (510) may include a first electrode (511) on the portion facing the second support member (520). The second support member (520) may include a second electrode (521) configured to contact the first electrode (511). However, not limited thereto, in some embodiments, the electronic device (101) may include first support members (510) and second support members (520) of different sizes that are paired with each other. The first support member (510) and the second support member (520) can be configured to contact each other.

[0131] According to the above embodiments, the electronic device (101) can be made of at least one support member (e.g., spaced apart from each other by a first group of electronic components (450) and a second group of electronic components (460). Figure 6a Supporting components (610) Figure 6b and Figure 6c The first support member (510) and the second support member (520) are used to reduce the contact between the first set of electronic components (450) on the first surface (411) and the second set of electronic components (460) on the second surface (421).

[0132] Figure 7 This is a partial cross-sectional view of an exemplary electronic device.

[0133] refer to Figure 7 The electronic device (101) may include a first printed circuit board (410) and a second printed circuit board (420) facing and spaced apart from the first printed circuit board (410). The electronic device (101) may also include an internal insert (430) located between a first surface (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second surface (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may also include a first set of electronic components (450) disposed on the first surface (411) and a second set of electronic components (460) disposed on the second surface (421).

[0134] According to an embodiment, the electronic device (101) may further include a third printed circuit board (710) disposed between the first printed circuit board (410) and the second printed circuit board (420) and spaced apart from the first support member (510) and the second support member (520). The electronic device (101) may also include a fourth set of electronic components (740) mounted on the third printed circuit board (710). For example, a portion of the fourth set of electronic components (740) may face a first surface (411) of the first printed circuit board (410). The remaining portion of the fourth set of electronic components (740) may face a second surface (421) of the second printed circuit board (420). The first support member (510) and the second support member (520) may be configured to contact each other (e.g., when an external force is applied). Therefore, the first support member (510) and the second support member (520) can keep the fourth set of electronic components (740) spaced apart from the first set of electronic components (450) on the first surface (411) and / or the second set of electronic components (460) on the second surface (421).

[0135] In embodiments, the electronic device (101) may include a third printed circuit board (710) located between the first printed circuit board (410) and the second printed circuit board (420), but embodiments of this disclosure are not limited thereto. For example, the electronic device (101) may also include a fourth printed circuit board (720) disposed between the first printed circuit board (410) and the second printed circuit board (420) and spaced apart from the third printed circuit board (710). The electronic device (101) may also include a fifth set of electronic components (750) mounted on the fourth printed circuit board (720). The electronic device (101) may include internal inserts (431, 432, 433 and 434) for the electronic components (e.g., the first set of electronic components (450), the second set of electronic components (460), the fourth set of electronic components (740) and the fifth set of electronic components (750)) located between the first printed circuit board (410) and the second printed circuit board (420). The first support member (510) and the second support member (520) can be configured to contact each other (e.g., when an external force is applied). Thus, the first support member (510) and the second support member (520) can be configured to contact each other to space the fifth set of electronic components (750) from the first set of electronic components (450) on the first surface (411) and / or the second set of electronic components (460) on the second surface (421). However, not limited thereto, the electronic device (101) may include the first support member (510) and the second support member (520), which are configured to keep multiple electronic components disposed on each of a plurality of printed circuit boards between the first printed circuit board (410) and the second printed circuit board (420) separated (or distanced from each other).

[0136] According to an embodiment, the electronic device (101) may include a first support member (510) disposed on a first surface (411) of a first printed circuit board (410) and a second support member (520) facing the first support member (510) and disposed on a second surface (421) of a second printed circuit board (420) facing the first surface (411), but the embodiments of this disclosure are not limited thereto. Figure 7As shown, the electronic device (101) may include a plurality of printed circuit boards in which electronic components are arranged facing each other. The electronic device (101) may include a plurality of support members having a first support member (510) and a second support member (520) to reduce malfunctions of the electronic components caused by contact between the facing electronic components due to external impacts. For example, the electronic device (101) may include support members disposed between a first printed circuit board (410) and a third printed circuit board (710) and at least partially facing each other to reduce contact between a first group of electronic components (450) and a fourth group of electronic components (740). For example, the electronic device (101) may include support members disposed between a first printed circuit board (410) and a fourth printed circuit board (720) and at least partially facing each other to reduce contact between a first group of electronic components (450) and a fifth group of electronic components (750). For example, the electronic device (101) may include support members disposed between the second printed circuit board (420) and the third printed circuit board (710) and at least partially facing each other to reduce contact between the second group of electronic components (460) and the fourth group of electronic components (740). For example, the electronic device (101) may include support members disposed between the second printed circuit board (420) and the fourth printed circuit board (720) and at least partially facing each other to reduce contact between the second group of electronic components (460) and the fifth group of electronic components (750). However, it is not limited thereto. It should be noted that the electronic device (101) may include support members for spaced out the electronic components facing each other, and the number and arrangement of the support members are not limited.

[0137] According to an embodiment, the electronic device (101) may further include a third set of electronic components (470) disposed on a third surface (412) of the first printed circuit board (410) and / or a fourth surface (422) of the second printed circuit board (420). The third set of electronic components (470) may be disposed on the third surface (412) and / or the fourth surface (422) outside the space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the internal component (430). To protect the third set of electronic components (470) disposed outside the space from external impacts, the electronic device (101) may further include at least one shield (760) covering at least a portion of the third set of electronic components (470). The electronic device (101) may reduce damage to the electronic components surrounding the first printed circuit board (410) and the second printed circuit board (420) from external impacts by including a first support member (510) and a second support member (520) inside the space and at least one shield (760) outside the space.

[0138] According to the above embodiments, the electronic device (101) can reduce the failure of electronic components in the electronic device (101) by including electronic components (e.g., a fourth group of electronic components (740) and a fifth group of electronic components (750)) mounted on at least one printed circuit board (e.g., a third printed circuit board (710) and a fourth printed circuit board (720)) between a first printed circuit board (410) and a second printed circuit board (420), and support members (e.g., a first support member (510) and a second support member (520)) configured to separate each of the electronic components mounted on the first surface (411) and the second surface (421) (e.g., a first group of electronic components (450) and a second group of electronic components (460)).

[0139] Figure 8a A portion of an exemplary electronic device is shown, which is provided with multiple support members. Figure 8b It is a circuit diagram used to detect abnormal states of electronic devices.

[0140] refer to Figure 8a and Figure 8b The electronic device (101) may include a first printed circuit board (e.g., Figure 4a The first printed circuit board (410) and the second printed circuit board (e.g., facing the first printed circuit board (410) and spaced apart from the first printed circuit board (410) Figure 4a The electronic device (101) may also include an inner insert (430) located between the first printed circuit board (410) and the second printed circuit board (420), the inner insert (430) surrounding a first surface of the first printed circuit board (410) facing the second printed circuit board (420) (e.g., Figure 4a The first surface (411) of the second printed circuit board (420) facing the second surface of the first printed circuit board (410) (e.g., Figure 4a The space between the second surface (421). The electronic device (101) may also include a first set of electronic components (e.g., disposed on the first surface (411)). Figure 4b The first set of electronic components (450) and the second set of electronic components (e.g., disposed on the second surface (421) Figure 4b The second set of electronic components (460).

[0141] refer to Figure 8aThe electronic device (101) may include a group of support members (810). For example, the group of support members (810) may include a first group of support members (811), a second group of support members (812), and a third group of support members (813). For example, each of the first group of support members (811), the second group of support members (812), and the third group of support members (813) may include two support members paired with each other (e.g., Figure 5a The first support member (510) and the second support member (520). For example, the electronic device (101) may include a first support region (821) in which the first set of support members (811) are disposed, a second support region (822) in which the second set of support members (812) are disposed, and a third support region (823) in which the third set of support members (813) are disposed. Each support region (821, 822 and 823) may include a portion of the first printed circuit board (410) and a portion of the second printed circuit board (420).

[0142] For example, in the event that a portion of the first printed circuit board (410) included in at least a portion of the support regions (821, 822, and 823) and / or a portion of the second printed circuit board (420) included in at least a portion of the support regions (821, 822, and 823) is damaged, two support members included in at least a portion of the support regions (821, 822, and 823) and paired with each other can come into contact with each other. The two paired support members can each include electrodes (e.g., Figure 5a The first electrode (511) and Figure 5b The second electrode (521). The electronic device (101) can be configured to identify the degree of damage in at least a portion of the support regions (821, 822 and 823) in which the two paired support members are disposed by contact of electrodes disposed on each of the two paired support members.

[0143] refer to Figure 8b The electronic device (101) may include a processor (120), at least one damage detection circuit (830), an analog-to-digital conversion (ADC) port (840), and a VDD (850).

[0144] At least one damage detection circuit (830) may be included in the first printed circuit board (410). The at least one damage detection circuit (830) may be connected to electrodes respectively disposed in support regions (821, 822, and 823) on the first printed circuit board (410). Electrodes disposed in support regions (821, 822, and 823) on the second printed circuit board (420) may be connected to the ground terminal of the electronic device (101). For example, at least one damage detection circuit (830) may include a first damage detection circuit (831), a second damage detection circuit (832), and a third damage detection circuit (833). The first damage detection circuit (831) may be connected to electrodes disposed in a first support region (821) on the first printed circuit board (410). The second damage detection circuit (832) may be connected to electrodes disposed in a second support region (822) on the first printed circuit board (410). The third damage detection circuit (833) may be connected to electrodes disposed in a third support region (823) on the first printed circuit board (410).

[0145] An ADC port (840) can be connected to at least one damage detection circuit (830). The ADC port (840) can be configured to detect voltage changes in at least a portion of the damage detection circuit (830). For example, the voltage of a first damage detection circuit 831 connected to at least some electrodes can change as electrodes paired with each other in a first support region 821 are contacted. For example, refer to... Figure 5a The current flowing through the first electrode (511) can vary as the first electrode (511) comes into contact with the second electrode (521). Due to the change in the current flowing through the first electrode (511), the voltage of at least one damage detection circuit (830) connected to the first electrode (511) can be changed. The ADC port (840) can be configured to measure whether and / or the degree of damage to the support areas (821, 822, and 823) on which the support member groups (810) are respectively provided by detecting the voltage change of at least one damage detection circuit (830) connected to the ADC port (840).

[0146] VDD (850) can be connected to at least one damage detection circuit (830). VDD (850) can be configured to provide a drive voltage to at least one damage detection circuit (830). For example, VDD (850) can provide a drive voltage to at least one damage detection circuit (830) through the potential difference caused by each resistor (861, 862 and 863).

[0147] The processor (120) can be configured to identify the degree of damage in the support areas (821, 822 and 823) including the first printed circuit board (410) and / or the second printed circuit board (420) via at least one damage detection circuit (830) and ADC port (840).

[0148] In embodiments, the electronic device (101) may include a first support region (821), a second support region (822), and a third support region (823), but embodiments of this disclosure are not limited thereto. The electronic device (101) may include multiple support regions in which the first printed circuit board (410) and / or the second printed circuit board (420) are relatively vulnerable to damage. The electronic device (101) may reduce damage to the electronic device (101) by being configured to identify at least a damaged portion of the multiple support regions through at least one damage detection circuit (830) and an ADC port (840).

[0149] According to the above embodiments, since the first printed circuit board (410) and / or the second printed circuit board (420) respectively include support member groups (810) paired with relatively fragile support areas (821, 822 and 823), the electronic device (101) can reduce damage to the first printed circuit board (410) and the second printed circuit board (420).

[0150] Figure 9a and Figure 9b This is a flowchart illustrating the operation of a processor in an exemplary electronic device.

[0151] Figure 9a and Figure 9b The operation can be performed by Figure 5a and Figure 5b The electronic device (101) performs the operation. The electronic device (101) may also include a processor (e.g., Figure 1 The processor (120)).

[0152] According to the example, the processor (120) can be configured to pass through the first electrode (e.g., Figure 5a The first electrode (511) and the second electrode (e.g., Figure 5a The second electrode (521) is used to identify the first support member (e.g., Figure 5a The first support member (510) and the second support member (e.g., Figure 5a The first electrode (511) may contact the second electrode (521) when the first support member (510) contacts the second support member (520). The processor (120) may be configured to communicate via an ADC port (e.g., Figure 8bThe ADC port (840) detects the voltage change generated by the contact between the first electrode (511) and the second electrode (521) to identify the contact between the first support member (510) and the second support member (520).

[0153] In operation 901, the processor (120) can be configured to supply power to at least one electronic component surrounding the first support member (510) and the second support member (520). For example, the processor (120) can be configured to supply power to a first group of electronic components (e.g., Figure 5a The processor (120) can supply power to at least some electronic components around the first support member (510) in the first group of electronic components (450). For example, the processor (120) can be configured to supply power to the second group of electronic components (e.g., Figure 5a At least some of the electronic components around the second support member (520) in the second group of electronic components (460) are powered.

[0154] In operation 903, the processor (120) can be configured to identify whether the first support member (510) and the second support member (520) are in contact via a first electrode (511) and a second electrode (521). For example, the processor (120) can detect whether the first support member (510) and the second support member (520) are in contact via at least one damage detection circuit (e.g., Figure 8b At least one damage detection circuit (830) and an ADC port (840) are used to detect voltage changes caused by contact between the first electrode (511) and the second electrode (521). The processor (120) can be configured to identify whether the first support member (510) and the second support member (520) are in contact by voltage changes.

[0155] refer to Figure 9a In operation 905, in response to contact between the first support member (510) and the second support member (520) identified by contact between the first electrode (511) and the second electrode (521), the processor (120) can bypass power supply to at least one electronic component surrounding the first support member (510) and the second support member (520). For example, the first support member (510) may come into contact with the second support member (520) due to an external impact. The processor (120) can reduce the failure of at least one electronic component by bypassing power supply to at least one electronic component surrounding the first support member (510) and the second support member (520) based on the identification of contact between the first support member (510) and the second support member (520).

[0156] refer to Figure 9bIn operation 907, the processor (120) can be configured to identify the contact time (e.g., "t") between the first support member (510) and the second support member (520). For example, when the first electrode (511) contacts the second electrode (521), the processor (120) can identify the time of voltage change via the ADC port (840).

[0157] In operation 909, the processor (120) can be configured to identify whether the contact time (e.g., "t") between the first support member (510) and the second support member (520) is less than a reference time t1. For example, when the first electrode (511) contacts the second electrode (521), the processor (120) can identify via the ADC port (840) whether the voltage change time is less than the reference time t1.

[0158] In operation 911, in response to identifying that the contact time (e.g., "t") between the first support member (510) and the second support member (520) is less than a reference time t1, the processor (120) can be configured to bypass supplying power to at least one electronic component around the first support member (510) and the second support member (520). For example, the first support member (510) and the second support member (520) may temporarily come into contact due to an external impact. When the contact time (e.g., "t") between the first support member (510) and the second support member (520) is less than the reference time t1, the processor (120) can bypass supplying power to at least one electronic component around the first support member (510) and the second support member (520). When the first support member (510) and the second support member (520) are spaced apart, the processor (120) can be configured to supply power to at least one electronic component.

[0159] In operation 913, in response to identifying a contact time (e.g., "t") greater than or equal to a reference time t1, the processor (120) can be configured to cut off power supply to at least one electronic component surrounding the first support member (510) and the second support member (520). For example, at least a portion of the first printed circuit board (410) and / or the second printed circuit board (420) may undergo plastic deformation due to an external impact. Due to the plastic deformation of the first printed circuit board (410) and / or the second printed circuit board (420), the first support member (510) and the second support member (520) may come into contact for a contact time t greater than or equal to the reference time t1. In the case where the first support member (510) and the second support member (520) have a contact time t greater than or equal to the reference time t1, the processor (120) can reduce damage to the electronic device (101) caused by at least one electronic component by being configured to cut off power supply to at least one electronic component surrounding the first support member (510) and the second support member (520).

[0160] The processor (120) of the electronic device (101) according to the above embodiment can reduce the failure of at least one electronic component around the first support member (510) and the second support member (520) by being configured to identify the contact between the first support member (510) and the second support member (520). The processor (120) can reduce the damage to the electronic device (101) caused by at least one electronic component and / or at least one electronic component by being configured to identify the contact time between the first support member (510) and the second support member (520).

[0161] Figure 10 This is a flowchart illustrating the operation of a processor in an exemplary electronic device.

[0162] Figure 10 The operation can be performed by Figure 5a and Figure 5b The electronic device (101) performs the operation. The electronic device (101) may also include a processor (e.g., Figure 1 The processor (120)). Figure 10 Operation 1003 can respectively correspond to Figure 9a and Figure 9b Operation 903. According to an embodiment, the electronic device (101) may also include a display (e.g., Figure 2 The display (201) can be configured to provide visual information to the user.

[0163] In operation 1001, the processor (120) can be configured to supply power to the electronic device (101). For example, the processor (120) can supply power via a power management module (e.g., Figure 1 The power management module (188) and / or the battery (e.g., via electronic device (101)) Figure 1 The battery (189) supplies power to the electronic device (101).

[0164] In operation 1005, in response to identifying the first support member (e.g., Figure 5a The first support member (510) and the second support member (e.g., Figure 5a The processor (120) can be configured to contact the second support member (520) with the first printed circuit board (e.g., Figure 4a The first printed circuit board (410) or the second printed circuit board (e.g., Figure 4a The data related to the second printed circuit board (420) is stored in the electronic device (101). For example, the processor (120) can store information related to damage to the first printed circuit board (410) and / or the second printed circuit board (420) in the electronic device (101) via the contact time (e.g., "t") between the first support member (510) and the second support member (520). For example, the processor (120) can store information related to damage to the first printed circuit board (410) and / or the second printed circuit board (420) via the first electrode (e.g., Figure 5a The first electrode (511) and the second electrode (e.g., Figure 5a The amount of voltage change identified by the contact between the second electrode (521) and the second printed circuit board (420) will store information related to damage to the first printed circuit board (410) and / or the second printed circuit board (420) in the electronic device (101). For example, in response to identifying the contact between the first support member (510) and the second support member (520), the processor (120) can store data related to the first printed circuit board (410) or the second printed circuit board (420) in the memory of the electronic device (101). Figure 1 The information is stored in the memory (130), but embodiments of this disclosure are not limited thereto. For example, the processor (120) may be configured to store information in a server (e.g., Figure 1 The server (108) and / or another electronic device (e.g., Figure 1 In electronic devices (102) and electronic devices (104). For example, electronic device (101) can provide a damage history of electronic device (101) based on stored data related to the first printed circuit board (410) or the second printed circuit board (420).

[0165] In operation 1007, the processor (120) may be configured to identify whether data associated with the first printed circuit board (410) or the second printed circuit board (420) is greater than a reference value (e.g., "a"). For example, the processor (120) may identify whether data associated with damage to the first printed circuit board (410) and / or the second printed circuit board (420) is greater than a reference value (e.g., "a") by the amount of voltage change determined via the contact between the first electrode (511) and the second electrode (521). The processor (120) may be configured to store data in the electronic device (101) based on the data being less than or equal to the reference value (e.g., "a").

[0166] In operation 1009, based on data related to the first printed circuit board (410) or the second printed circuit board (420) being greater than a reference value (e.g., "a"), the processor (120) can be configured to display on the display (201) that at least a portion of the first printed circuit board (410) and the second printed circuit board (420) is damaged. For example, at least some of the data related to the damage to the first printed circuit board (410) or the second printed circuit board (420) may be greater than a reference value (e.g., "a"). Based on at least some of the data being greater than the reference value (e.g., "a"), the processor (120) can notify the user via the display (201) that at least a portion of the first printed circuit board (410) and the second printed circuit board (420) is damaged. However, not limited thereto, based on at least some of the data being greater than the reference value (e.g., "a"), the processor (120) can also notify the user via the sound output module (e.g., Figure 1 The sound output module (155) and / or speaker module notify the user that at least a portion of the first printed circuit board (410) or the second printed circuit board (420) is damaged.

[0167] The electronic device (101) according to the above embodiments can provide various user experiences to the user of the electronic device (101) by being configured to store data related to the first printed circuit board (410) and the second printed circuit board (420). The processor (120) of the electronic device (101) can reduce damage to the electronic device (101) by being configured to display on the display (201) that at least some of the first printed circuit board (410) and the second printed circuit board (420) are damaged.

[0168] The electronic device according to the above embodiments (e.g., Figure 1 The electronic device (101) may include a first printed circuit board (e.g., Figure 4a The first printed circuit board (410)). The electronic device may include a second printed circuit board facing the first printed circuit board and disposed on the first printed circuit board (e.g., Figure 4aThe second printed circuit board (420). The electronic device may include a first surface disposed on the first printed circuit board facing the second printed circuit board (e.g., Figure 4a The first support member on the first surface (411) (e.g., Figure 5a The first support member (510)). The electronic device may include a second surface disposed on the second printed circuit board facing the first printed circuit board (e.g., Figure 4a The second support member on the second surface (421) (e.g., Figure 5a The second support member (520) faces the first support member and is spaced apart from the first support member so as to be contactable with the first support member. The electronic device may include an internal component (e.g., located between the first and second printed circuit boards) Figure 4a The inner insert (430) surrounds the space between the first surface and the second surface. According to the above embodiment, the electronic device can reduce damage to the first and second printed circuit boards by including a first support member and a second support member. The above embodiment can have various effects including the effects described above.

[0169] According to an embodiment, when the first surface is viewed from above, the first support member can at least partially overlap with the second support member. According to the above embodiment, the overlap of the first support member with the second support member can reduce damage to the first and second printed circuit boards. The above embodiments can have various effects including those described above.

[0170] The electronic device according to an embodiment may further include a first set of electronic components disposed on the first surface (e.g., ...). Figure 4b The first set of electronic components (450) and the second set of electronic components disposed on the second surface (e.g., Figure 4b The second set of electronic components (460). The length of the first support member extending from the first surface toward the second surface (e.g., Figure 5a The length d1 of the second support member can be greater than the length of each electronic component in the first group of electronic components extending from the first surface toward the second surface. Figure 5a The length d2 can be greater than the length of each electronic component in the second group of electronic components extending from the second surface toward the first surface. According to the above embodiment, since the length of the first support member is greater than the length of each electronic component in the first group of electronic components, and the length of the second support member is greater than the length of each electronic component in the second group of electronic components, the electronic device can reduce the contact between the first group of electronic components and the second group of electronic components.

[0171] According to an embodiment, when the electronic device changes from a first state in which the first support member and the second support member are spaced apart to a second state in which the first support member and the second support member are in contact with each other, the first group of electronic components can be spaced apart from the second group of electronic components. According to the above embodiment, the electronic device can separate the first group of electronic components and the second group of electronic components by including the first support member and the second support member.

[0172] The electronic device according to the embodiment may further include a second surface disposed on the first printed circuit board opposite to the first surface (e.g., Figure 4a The second surface (421) and the fourth surface of the second printed circuit board opposite to the second surface (e.g., Figure 4a The third group of electronic components (e.g., on at least some surfaces of the fourth surface (422)) Figure 4a The third group of electronic components (470). The first support member and the second support member can be disposed at positions corresponding to at least some of the electronic components in the third group of electronic components. According to the above embodiment, the electronic device can reduce the failure of electronic components around the first support member and the second support member by including the first support member and the second support member disposed at positions corresponding to at least some of the electronic components in the third group of electronic components.

[0173] According to an embodiment, the first support member may include a first electrode (e.g., Figure 5a The first electrode (511). The second support member may include a second electrode configured to contact the first electrode (e.g., Figure 5a The second electrode (521). According to the above embodiment, the electronic device can be configured to identify the contact between the first support member and the second support member by including the first electrode and the second electrode.

[0174] According to an embodiment, a first electrode may extend in a first support member in a first direction. A second electrode may extend in a second support member in a second direction different from the first direction. According to the above embodiment, by extending the first electrode in a direction different from the direction in which the second electrode extends, damage to both the first and second electrodes due to contact with the second electrode can be reduced.

[0175] According to an embodiment, each of the first support member and the second support member can be deformable. According to the above embodiment, the deformability of each of the first support member and the second support member can reduce damage to the first and second printed circuit boards.

[0176] According to an embodiment, the dimensions of the first support member (e.g., Figure 6c The dimension s1) can be different from the dimension of the second support member (e.g., Figure 6c (size s2). According to the above embodiment, since the size of the first support member is different from the size of the second support member, the electronic device can reduce damage to the first and second printed circuit boards.

[0177] The electronic device according to the embodiment may further include a third printed circuit board disposed between the first printed circuit board and the second printed circuit board and spaced apart from the first support member and the second support member (e.g., Figure 7 The third printed circuit board (710)). According to the above embodiment, the electronic device can provide additional space for electronic components in the electronic device by further including the third printed circuit board.

[0178] The electronic device according to the embodiments may further include a processor (e.g., ...). Figure 1 The processor (120) can be configured to identify contact between the first and second support members. The first support member may include a first electrode. The second support member may include a second electrode configured to contact the first electrode. The processor can be configured to identify contact between the first and second support members. According to the above embodiments, the processor can provide various user experiences to the user of the electronic device by being configured to identify contact between the first and second support members.

[0179] According to an embodiment, when the first support member and the second support member are spaced apart, the processor can be configured to supply power to at least one electronic component surrounding the first and second support members. In response to identifying a contact between the first and second support members via a contact between the first and second electrodes, the processor can be configured to bypass or cut off power supply to the at least one electronic component. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to identify the contact between the first and second support members.

[0180] According to an embodiment, the processor can be configured to identify the contact time between a first support member and a second support member by means of the contact between a first electrode and a second electrode. In response to identifying a contact time less than a reference time, the processor can be configured to bypass power supply to at least one electronic component surrounding the first and second support members. In response to identifying a contact time greater than or equal to the reference time, the processor can be configured to cut off power supply to at least one electronic component. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to identify the contact between the first and second support members.

[0181] The electronic device according to an embodiment may further include a processor. The processor may be configured to identify contact between a first support member and a second support member. In response to identifying contact between the first support member and the second support member, the processor may be configured to store data associated with the first or second printed circuit board in the electronic device. According to the above embodiments, the processor can provide various user experiences to the user of the electronic device by being configured to identify contact between the first and second support members.

[0182] According to an embodiment, the processor can be configured to provide a user with information indicating that at least some of the first and second printed circuit boards are damaged, based on at least some data. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to identify contact between the first support member and the second support member.

[0183] The electronic device according to an embodiment may include a first printed circuit board. The electronic device may include a second printed circuit board facing the first printed circuit board and disposed on the first printed circuit board. The electronic device may include a first support member disposed on a first surface of the first printed circuit board facing the second printed circuit board. The electronic device may include a second support member disposed on a second surface of the second printed circuit board facing the first printed circuit board, the second support member facing the first support member and spaced apart from the first support member to be contactable with the first support member. The electronic device may include a first set of electronic components disposed on the first surface and a second set of electronic components disposed on the second surface. The electronic device may include an inner insert located between the first and second printed circuit boards, the inner insert surrounding the space between the first and second surfaces. The sum of the length of the first support member extending from the first surface toward the second surface and the length of the second support member extending from the second surface toward the first surface may be greater than the sum of the length of one electronic component in the first set extending from the first surface toward the second surface and the length of at least some of the other electronic components in the second set facing the first electronic component extending from the second surface toward the first surface. According to the above embodiments, the electronic device can reduce damage to the first and second printed circuit boards by including a first support member and a second support member.

[0184] According to an embodiment, the length of the first support member extending from the first surface toward the second surface can be greater than the length of each electronic component in the first group of electronic components extending from the first surface toward the second surface. Similarly, the length of the second support member extending from the second surface toward the first surface can be greater than the length of each electronic component in the second group of electronic components extending from the second surface toward the first surface. According to the above embodiment, since the length of the first support member is greater than the length of each electronic component in the first group of electronic components, and the length of the second support member is greater than the length of each electronic component in the second group of electronic components, the electronic device can reduce the contact between the first group of electronic components and the second group of electronic components.

[0185] The electronic device according to an embodiment may further include a processor. A first support member may include a first electrode. A second support member may include a second electrode configured to contact the first electrode. The processor may be configured to identify contact between the first support member and the second support member through the contact between the first electrode and the second electrode. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to identify the contact between the first support member and the second support member.

[0186] According to an embodiment, when the first support member and the second support member are spaced apart, the processor can be configured to supply power to at least one electronic component surrounding the first and second support members. In response to a contact between the first and second support members identified by a contact between the first and second electrodes, the processor can be configured to bypass or cut off power supply to the at least one electronic component. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to recognize the contact between the first and second support members.

[0187] According to an embodiment, the processor can be configured to identify the contact time between a first support member and a second support member by means of the contact between a first electrode and a second electrode. In response to identifying a contact time less than a reference time, the processor can be configured to bypass power supply to at least one electronic component surrounding the first and second support members. In response to identifying a contact time greater than or equal to the reference time, the processor can be configured to cut off power supply to at least one electronic component. According to the above embodiment, the processor can provide various user experiences to the user of the electronic device by being configured to identify the contact between the first and second support members.

[0188] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0189] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, the same reference numerals may be used to refer to the same or related elements. It will be understood that the singular form of a noun corresponding to a term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase in the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “connected to another element (e.g., a second element)” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0190] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit system." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0191] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0192] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0193] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101), the electronic device (101) comprising: First printed circuit board (250; 410); A second printed circuit board (252; 420) faces the first printed circuit board (250; 410) and is disposed above the first printed circuit board (250; 410); A first support member (510) is disposed on a first surface (411) of the first printed circuit board (250; 410); A second support member (520) is disposed on a second surface (421) of the second printed circuit board (252; 420) facing the first printed circuit board (250; 410), the second support member (520) being spaced apart from the first support member (510) and configured to contact the first support member (510) based on an external force applied to the electronic device (101); as well as An inner plug-in (430) is located between the first printed circuit board (250; 410) and the second printed circuit board (252; 420), surrounding the space between the first surface (411) and the second surface (421).

2. The electronic device (101) according to claim 1, wherein, When viewed from above, the first support member (510) and the second support member (520) partially overlap.

3. The electronic device (101) according to claim 1 or 2, wherein the electronic device (101) further comprises: The first set of electronic components (450) is disposed on the first surface (411); as well as The second set of electronic components (460) is disposed on the second surface (421). The first support member (510) and the first set of electronic components (450) extend from the first surface (411) toward the second surface (421). The second support member (520) and the second set of electronic components (460) extend from the second surface (421) toward the first surface (411). Wherein, the length (d1) of the first support member (510) is greater than the length of each electronic component in the first group of electronic components (450), and The length (d2) of the second support member (520) is greater than the length of each electronic component in the second group of electronic components (460).

4. The electronic device (101) according to claim 3, wherein, When the electronic device (101) changes from a first state in which the first support member (510) and the second support member (520) are spaced apart to a second state in which the first support member (510) and the second support member (520) are in contact with each other, the first set of electronic components (450) and the second set of electronic components (460) are spaced apart.

5. The electronic device (101) according to any one of claims 1 to 4, wherein the electronic device (101) further comprises a third set of electronic components (470) disposed on at least some of the surfaces of a third surface (412) of the first printed circuit board (250; 410) opposite to the first surface (411) and a fourth surface (422) of the second printed circuit board (252; 420) opposite to the second surface (421), and in, The first support member (510) and the second support member (520) are disposed at positions corresponding to at least some of the electronic components in the third group of electronic components (470).

6. The electronic device (101) according to any one of claims 1 to 5, wherein, The first support member (510) includes a first electrode (511), and The second support member (520) includes a second electrode (521) configured to contact the first electrode (511).

7. The electronic device (101) according to claim 6, wherein, The first electrode (511) extends in a first direction within the first support member (510). The second electrode (521) extends in the second support member (520) in a second direction different from the first direction.

8. The electronic device (101) according to any one of claims 1 to 7, wherein, Each of the first support member (510) and the second support member (520) is deformable.

9. The electronic device (101) according to any one of claims 1 to 8, wherein, The size (s1) of the first support member (510) is different from the size (s2) of the second support member (520).

10. The electronic device (101) according to any one of claims 1 to 9, the electronic device (101) further comprising a third printed circuit board (710) disposed between the first printed circuit board (250; 410) and the second printed circuit board (252; 420), and spaced apart from the first support member (510) and the second support member (520).

11. The electronic device (101) according to any one of claims 1 to 10, wherein the electronic device (101) further comprises: At least one processor (120); as well as Memory (130), the memory (130) comprising one or more storage media storing instructions, The first support member (510) includes a first electrode (511). The second support member (520) includes a second electrode (521) configured to contact the first electrode (511). When the instruction is executed alone or together by the at least one processor (120), the electronic device (101) identifies that the first support member (510) and the second support member (520) are in contact with each other based on the contact between the first electrode (511) and the second electrode (521).

12. The electronic device (101) according to claim 11, wherein, When the instructions are executed alone or together by the at least one processor (120), the electronic device (101) is also affected: When the first support member (510) is spaced apart from the second support member (520), power is supplied to at least one electronic component around the first support member (510) and the second support member (520); as well as In response to the contact between the first support member (510) and the second support member (520) identified by the contact between the first electrode (511) and the second electrode (521), power supply to the at least one electronic component is bypassed or cut off.

13. The electronic device (101) according to claim 12, wherein, When the instructions are executed alone or together by the at least one processor (120), the electronic device (101) is also affected: The contact time between the first support member (510) and the second support member (520) is identified by the contact between the first electrode (511) and the second electrode (521); In response to the detection that the contact time is less than a reference time, power is bypassed to at least one electronic component around the first support member (510) and the second support member (520); as well as In response to identifying that the contact time is equal to or greater than the reference time, power supply to the at least one electronic component is cut off.

14. The electronic device (101) according to any one of claims 1 to 13, wherein the electronic device (101) further comprises: At least one processor (120); as well as The memory (130) includes one or more storage media storing instructions that, when executed alone or together by the at least one processor (120), cause the electronic device (101) to: Identify the contact between the first support member (510) and the second support member (520); as well as In response to the identification of contact between the first support member (510) and the second support member (520), data related to the first printed circuit board (250; 410) or the second printed circuit board (252; 420) is stored in the electronic device (101).

15. The electronic device (101) according to claim 14, wherein, When the instructions are executed individually or together by the at least one processor (120), the electronic device (101) also provides the user with information indicating that at least a portion of the first printed circuit board (250; 410) and the second printed circuit board (252; 420) is damaged, based on at least some of the data.

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