Temperature measurement assembly, wearable device and temperature measurement method

Abstract

The invention discloses a temperature measurement assembly, wearable equipment and a temperature measurement method. The temperature measurement assembly comprises a first device and a second device, the first device and the second device are arranged in a spaced mode in the first direction, a heat conduction piece extending in the first direction and connected with the first device and the second device and a heat insulation layer surrounding the heat conduction piece are arranged between the first device and the second device, and the first direction is perpendicular to the skin surface layer of a person to be tested; the first device comprises a thermal conductivity sensor and a first temperature sensor; the first temperature sensor is used for measuring the temperature of the skin surface; the second device includes a second temperature sensor. The temperature measuring assembly can accurately measure the temperature of the position, with the preset thickness from the skin surface layer, of a to-be-measured person through the temperature collected by the first temperature sensor, the heat conductivity of the second temperature sensor and the heat conduction piece and the heat conductivity, with the preset thickness from the skin surface layer, of the to-be-measured person.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature measurement, and in particular to a temperature measurement assembly, a wearable device and a temperature measurement method. BACKGROUND

[0002] With the development of electronic technology, the means of body temperature testing has become increasingly diversified. At present, the body temperature of a person can be detected by contacting a temperature measurement assembly with the surface layer of the skin of the person. However, the existing temperature measurement assembly is not accurate when measuring the body temperature of a person. SUMMARY

[0003] The present application provides a temperature measurement assembly, a wearable device and a temperature measurement method capable of improving the accuracy of temperature measurement.

[0004] In a first aspect, the present application provides a temperature measurement assembly, comprising a first device and a second device; the first device and the second device are arranged at intervals along a first direction, and a heat conduction member extending along the first direction and connected with the first device and the second device and a thermal insulation layer surrounding the heat conduction member are arranged between the first device and the second device, the first direction being perpendicular to the surface layer of the skin of a person to be measured; the first device comprises a thermal conductivity sensor and a first temperature sensor, and the first temperature sensor is used to measure the temperature of the surface layer of the skin; the second device comprises a second temperature sensor.

[0005] In this solution, the thermal conductivity sensor collects the thermal conductivity of the person to be measured, and the temperature collected by the first temperature sensor, the thermal conductivity of the second temperature sensor and the heat conduction member and the thermal conductivity of the person to be measured at a preset thickness from the surface layer of the skin can accurately measure the temperature of the person to be measured at a preset thickness from the surface layer of the skin. In the process of temperature measurement of the temperature measurement assembly, heat is transferred from the person to be measured at a preset thickness from the surface layer of the skin to the first temperature sensor and the second temperature sensor, and the thermal insulation layer can constrain the heat in the heat conduction member to diffuse towards the periphery of the thermoelectric element, so that the heat is transferred in the heat conduction member in the first direction, which can reduce the interference of the ambient temperature on the heat transfer of the heat conduction member and improve the accuracy of temperature measurement of the temperature measurement assembly.

[0006] In combination with the first aspect, in a possible implementation manner, the temperature measurement assembly further comprises a protective cover for thermal insulation, and the protective cover is arranged on the side of the second device away from the first device. The protective cover can constrain the diffusion of heat transferred by the heat conduction member to the second temperature sensor, can reduce the interference of the ambient temperature on the heat transfer of the heat conduction member, and can improve the accuracy of temperature measurement of the temperature measurement assembly.

[0007] In conjunction with the first aspect, in one possible implementation, the thermal conductivity of the heat-conducting element is greater than that of the material used in the insulation layer. This difference in thermal conductivity between the heat-conducting element and the insulation element allows heat to be preferentially transferred along a first direction, while the insulation element restricts heat diffusion from the circumferential direction of the heat-conducting element, which is beneficial for improving the temperature measurement accuracy of the temperature sensing component.

[0008] In conjunction with the first aspect, in one possible implementation, the thermal conductivity of the insulation layer is less than or equal to 0.1 W / m·K. The lower the thermal conductivity of the insulation layer, the better it is for confining the heat from the heat-conducting component to diffuse along its periphery, thus improving the temperature measurement accuracy of the temperature-sensing assembly.

[0009] In conjunction with the first aspect, in one possible implementation, the thermal conductivity of the heat-conducting element is between 0.1 W / m·K and 1 W / m·K. If the thermal conductivity of the heat-conducting element is too low, for example less than 0.1 W / m·K, it is difficult for the heat-conducting element to effectively transfer heat along the first direction, which impairs the temperature measurement accuracy of the temperature measuring component. If the thermal conductivity of the heat-conducting element is too high, the temperature measured by the first temperature sensor and the temperature measured by the second temperature sensor may not be significantly different, and the temperature measuring component cannot accurately calculate the temperature at a predetermined thickness from the skin surface of the subject.

[0010] In conjunction with the first aspect, in one possible implementation, the thermally conductive element comprises at least one of polydimethylsiloxane, silicone rubber, electronically thermally conductive potting compound, imide, polyethylene, phenolic resin, and polyurethane.

[0011] In conjunction with the first aspect, in one possible implementation, the insulation layer comprises at least one of general-purpose polystyrene, expanded polystyrene, thermal insulation cotton, expanded polyurethane foam, expanded polyvinyl chloride foam, expanded polyethylene foam, expanded phenolic resin, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel.

[0012] In conjunction with the first aspect, in one possible implementation, the first device further includes a first circuit board, on which the thermal conductivity sensor and the first temperature sensor are disposed.

[0013] In conjunction with the first aspect, in one possible implementation, the projection of the thermal conductivity sensor in the first direction does not overlap with the projection of the first temperature sensor in the first direction. When the thermoelectric sensor measures the thermoelectricity of the subject, the thermal conductivity sensor generates heat and transfers heat to the subject in the first direction. If the projections of the first temperature sensor and the thermal conductivity sensor in the first direction overlap, the first temperature sensor will interfere with the heat transfer of the thermoelectric sensor in the first direction, which is detrimental to the accurate measurement of the thermal conductivity of the subject by the thermoelectric sensor.

[0014] In conjunction with the first aspect, in one possible implementation, there are multiple first temperature sensors surrounding the thermal conductivity sensor. The area where the thermal conductivity sensor is located is the area where the multiple first temperature sensors measure temperature. The thermal conductivity sensor transfers heat to the subject, and the thermal conductivity of the subject is measured. When the first temperature sensor measures the temperature of the subject's skin surface, the subject transfers heat to the area surrounded by the multiple first temperature sensors, making the area where the thermal conductivity sensor is located and the area surrounded by the multiple first temperature sensors the same area, which can effectively reduce the temperature measurement error of the temperature measuring component.

[0015] In conjunction with the first aspect, in one possible implementation, the second device further includes a second circuit board, and there are multiple second temperature sensors disposed on the second circuit board and arranged in a circle. During temperature measurement, the heat from the subject is transferred along the first direction to the multiple second temperature sensors. The multiple second temperature sensors arranged in a circle can more uniformly collect the temperature of the heat-conducting components within the area surrounded by the multiple second temperature sensors, thereby reducing the random errors of the temperature measurement component.

[0016] In conjunction with the first aspect, in one possible implementation, along the first direction, the projections of the plurality of first temperature sensors overlap with the projections of the plurality of second temperature sensors.

[0017] In conjunction with the first aspect, in one possible implementation, the temperature sensing component further includes a contact surface that contacts the skin surface, the contact surface being made of sapphire. Sapphire improves the tactile feel of the temperature sensing component, has good thermal conductivity, and exhibits high heat dissipation performance, which can reduce the temperature measurement error of the temperature sensing component.

[0018] In conjunction with the first aspect, in one possible implementation, the temperature measuring component further includes a processor for acquiring information from the thermal conductivity sensor, the first temperature sensor, and the second temperature sensor. The processor is capable of calculating the temperature at a predetermined thickness from the skin surface of the subject based on the information acquired by the thermal conductivity sensor, the first temperature sensor, and the second temperature sensor.

[0019] Secondly, this application also provides a wearable device, which includes a temperature measuring component as described in the first aspect.

[0020] Thirdly, this application provides a temperature measurement method, which is applied to the temperature measurement component as described in the first aspect, the temperature measurement method comprising:

[0021] The thermal conductivity of the subject is collected by a thermal conductivity sensor, and the first temperature of the skin surface is collected by the first temperature sensor.

[0022] The second temperature of the end of the heat-conducting component away from the first device is collected by a second temperature sensor.

[0023] The processor obtains the temperature of the set thickness of the test subject based on the first temperature, the second temperature, the thermal conductivity of the test subject, and the thermal conductivity of the thermally conductive component.

[0024] In conjunction with the third aspect, in one possible implementation, the thermal conductivity sensor is used to generate electrothermal energy and transfer the electrothermal energy to the skin surface, wherein acquiring the thermal conductivity of the subject through the thermal conductivity sensor includes:

[0025] The temperature change of the subject's skin surface over a set time period is obtained through the first temperature sensor;

[0026] The processor obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor, and the projected area of ​​the thermal conductivity sensor on the skin surface.

[0027] In conjunction with the third aspect, in one possible implementation, the electrothermal parameters of the thermal conductivity sensor include voltage and current, and the step of obtaining the thermal conductivity of the subject by the processor based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor, and the projected area of ​​the thermal conductivity sensor on the skin surface includes:

[0028] The processor obtains the heat flow based on the voltage, the current, and the projected area on the skin surface by the thermal conductivity sensor;

[0029] The processor obtains the thermal resistance of the test subject based on the temperature change value and the heat flow.

[0030] The processor obtains the slope of the subject based on the square root of the thermal resistance and the set time.

[0031] The processor obtains the thermal conductivity of the subject based on the linear relationship between the subject's slope and the subject's thermal conductivity.

[0032] In this scheme, the linear relationship between the slope of the test subject and the thermal conductivity of the test subject is obtained by fitting the coordinates of the slope-thermal conductivity of various skin-resistant materials. Using this method to obtain the thermal conductivity of the test subject can greatly reduce the amount of computation of the processor, improve the response speed of the processor, and at the same time, it also allows the temperature measuring component to have a wider range of application scenarios. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0034] Figure 1 This is a schematic diagram of the structure of a watch provided in one embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the structure of a temperature measuring component provided in one embodiment of this application;

[0036] Figure 3 An exploded view of a temperature measuring component provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure of a temperature measuring device provided in one embodiment of this application;

[0038] Figure 5 A schematic flowchart of a temperature measurement method provided in an embodiment of this application;

[0039] Figure 6 A coordinate graph showing the time-temperature variation values ​​of various skin-like materials provided in one embodiment of this application;

[0040] Figure 7 A graph showing the time square root versus thermal resistance of various skin-like materials provided in an embodiment of this application;

[0041] Figure 8 This is a coordinate graph of the thermal conductivity-slope of various skin-like materials provided in an embodiment of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 100. Temperature measuring component; 110. First device; 111. First circuit board; 112. First temperature sensor; 113. Thermal conductivity sensor; 120. Second device; 121. Second circuit board; 122. Second temperature sensor; 130. Thermal conductive component; 140. Insulation layer; 150. Protective cover; 160. Processor; 161. Control board; 162. Data acquisition board; 170. Contact surface; 180. Signal transmission cable; 200. Surface body. Detailed Implementation

[0044] With the development of electronic technology, body temperature testing methods have become increasingly diversified, giving rise to various techniques such as infrared thermometry, thermocouple thermometry, and resistance thermometry. Testing sites have also expanded from the mouth, armpit, and rectum to include the esophagus, tympanic membrane, ear canal, and nasal cavity. Currently, for accurate measurement of the deep temperature of a specific organ (such as the heart or brain), a relatively effective method is to insert a sensitive element into the organ for minimally invasive measurement. However, clinically speaking, invasive measurements cause pain, bleeding, and increase the risk of infection for patients. For some organs, such as the heart and brain, even minimal damage is unacceptable. If temperature measuring devices are used to measure body temperature through skin contact, the measurement error will be relatively large due to factors such as environmental temperature differences, skin blood flow, and water content, making it impossible to accurately measure the core body temperature.

[0045] In view of this, this application provides a temperature measuring component, a wearable device, and a temperature measuring method. The temperature measuring component comes into contact with human skin and can accurately measure the core temperature of the human body.

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0047] This application discloses a wearable device, which includes a temperature measuring component and a body for fixing the temperature measuring component. It should be noted that the temperature measuring component protrudes from the body. When measuring human body temperature, the temperature measuring component can directly contact the surface of the skin of the person being measured to measure their body temperature.

[0048] In the embodiments provided in this application, the wearable device can be a watch, headphones, etc., and this application does not impose specific restrictions on the specific product type of the wearable device.

[0049] Please see Figure 1 For ease of understanding, let's take a watch as an example of a wearable device. The watch includes a watch body 200 and a temperature measuring component 100. The temperature measuring component 100 is fixed in the watch body 200. A portion of the temperature measuring component 100 protrudes from the watch body 200, and the portion of the temperature measuring component 100 that protrudes from the watch body 200 can contact the surface of the skin of the person being tested.

[0050] Please see Figure 2 and Figure 3 The temperature measuring component 100 includes a first device 110 and a second device 120; the first device 110 and the second device 120 are spaced apart along a first direction, and a heat-conducting element 130 extending along the first direction and connected to the first device 110 and the second device 120 and an insulation layer 140 surrounding the heat-conducting element 130 are disposed between the first device 110 and the second device 120, the first direction being perpendicular to the skin surface of the subject;

[0051] The first device 110 includes a thermal conductivity sensor 113 and a first temperature sensor 112, the first temperature sensor 112 being used to measure the temperature of the skin surface.

[0052] The second device 120 includes a second temperature sensor 122.

[0053] In the embodiments provided in this application, thermal conductivity sensor 113 is used to measure the thermal conductivity of the skin surface, and second temperature sensor 122 is used to measure the temperature of the end of heat-conducting element 130 away from the first device 110.

[0054] In the embodiments provided in this application, the thermal conductivity of the subject can be measured by the thermal conductivity sensor 113, the first temperature of the subject's skin surface can be measured by the first temperature sensor 112, and the second temperature of the end of the conductive element away from the first device 110 can be measured by the second temperature sensor 122.

[0055] When the temperature measuring component 100 measures the third temperature of the human body at a preset thickness from the skin surface, the human body's heat is transferred to the first temperature sensor 112 through the skin, and the human body's heat is also transferred to the second temperature sensor 122 through the skin and the heat-conducting component 130.

[0056] The thermal conductivity of the heat-conducting component 130 is known. The material of the heat-conducting component 130 determines its thermal conductivity. The thickness of the heat-conducting component 130 is known. The heat-conducting component 130 transfers heat along its thickness direction. The cross-sectional area of ​​the heat-conducting component 130 along its thickness direction is known. The thermal resistance of the heat-conducting component 130 can be calculated based on its thickness, cross-sectional area along its thickness direction, and thermal conductivity.

[0057] The thermal conductivity of the subject is acquired by thermal conductivity sensor 113, and the thermal resistance of the subject can be calculated based on the preset thickness of the subject's skin surface and the area of ​​the subject's surface that transfers heat. The area of ​​the subject's surface that transfers heat includes the area acquired by the first temperature sensor 112.

[0058] In one possible implementation, the temperature sensing component 100 may include a processor 160, which may be integrated into the first device 110 or the second device 120. The processor 160 is used to acquire information collected by the thermal conductivity sensor 113, the first temperature sensor 112, and the second temperature sensor 122. The information collected by the thermal conductivity sensor 113, the first temperature sensor 112, and the second temperature sensor 122 may include the thermal conductivity of the subject, a first temperature, and a second temperature.

[0059] The processor 160 can calculate the thermal resistance of the heat-conducting element 130 based on its thickness, cross-sectional area along the thickness direction, and thermal conductivity. The processor 160 can also calculate the thermal resistance at a predetermined thickness from the skin surface of the test subject based on the area of ​​heat transfer on the test subject's surface. The processor 160 can calculate a third temperature based on a first temperature, a second temperature, the thermal resistance at the predetermined thickness from the skin surface of the test subject, and the thermal resistance of the heat-conducting element 130. Understandably, in this application, the processor 160 obtains the thermal conductivity, the first temperature, and the second temperature of the test subject. The processor 160 can calculate the third temperature based on the thermal conductivity, the first temperature, the second temperature, the thermal conductivity of the heat-conducting element 130, the cross-sectional area along the thickness direction of the heat-conducting element 130, and the area collected by the first temperature sensor 112.

[0060] In another possible implementation, please see Figure 4 The temperature measuring component 100 is used in the temperature measuring device, which also includes a processor 160. The processor 160 is disposed outside the temperature measuring component 100 and is electrically connected to the first temperature sensor 112, the second temperature sensor 122, and the thermal conductivity sensor 113. The processor 160 can acquire the information collected by the first temperature sensor 112, the second temperature sensor 122, and the thermal conductivity sensor 113. The processor 160 can calculate the thermal resistance of the thermal conductive element 130 based on the thickness of the thermal conductive element 130, the cross-sectional area of ​​the thermal conductive element 130 along the thickness direction, and the thermal conductivity of the thermal conductive element 130. The processor 160 can also calculate the thermal resistance at a distance of a preset thickness from the skin surface of the subject and the area of ​​heat transfer on the surface of the subject. The processor 160 can calculate a third temperature based on the first temperature, the second temperature, the thermal resistance at a distance of a preset thickness from the subject, and the thermal resistance of the thermal conductive element 130. Understandably, in this application, the processor 160 obtains the thermal conductivity, first temperature, and second temperature of the subject. The processor 160 can calculate the third temperature based on the thermal conductivity, first temperature, second temperature, thermal conductivity of the heat-conducting element 130, cross-sectional area of ​​the heat-conducting element 130 along the thickness direction, and area of ​​the region collected by the first temperature sensor 112.

[0061] In the embodiments provided in this application, the processor 160 includes a control board 161 and a data acquisition board 162. The control board 161 and the data acquisition board 162 are electrically connected to the first temperature sensor 112 via a signal transmission cable 180. The control board 161 and the data acquisition board 162 are also electrically connected to the thermal conductivity sensor 113 via a signal transmission cable 180. The control board 161 and the data acquisition board 162 are also electrically connected to the thermal conductivity sensor 113 via a signal transmission cable 180.

[0062] In the embodiments provided in this application, the acquisition board 162 integrates a switch matrix, a current source module and a voltage acquisition module. The switch matrix can control the opening and closing of the first temperature sensor 112, the second temperature sensor 122 and the thermal conductivity sensor 113.

[0063] The current source module can power the thermal conductivity sensor 113, for example, by providing a precision current of 50mA, and the voltage acquisition module acquires the real-time voltage of the thermal conductivity sensor 113.

[0064] In the embodiments provided in this application, after obtaining the thermal conductivity of the subject, the temperature measuring component 100 can obtain a third temperature at a preset thickness of the subject's skin surface based on the first temperature, the second temperature, the thermal conductivity of the heat-conducting element 130, and the thermal conductivity of the subject.

[0065] During the process of heat transfer from the subject at a predetermined thickness away from the skin surface to the second sensor, the heat flux density of the heat-conducting component 130 is equal to the heat flux density of the subject's skin tissue. The specific formula for calculating the third temperature is as follows:

[0066]

[0067] The result of the transformation is:

[0068]

[0069] Among them, T core The third temperature, T bottom The first temperature, T top For the second temperature, R tissue To determine the thermal resistance of the subject at a distance from the subject, R is the preset thermal resistance of the subject. partition The thermal resistance of the heat-conducting component 130.

[0070] The processor 160 can calculate the thermal resistance of the heat-conducting element 130 based on its thickness, cross-sectional area along the thickness direction, and thermal conductivity. The processor 160 can also calculate the thermal resistance at a predetermined thickness from the skin surface of the test subject based on the predetermined thickness of the test subject and the area of ​​heat transfer on the test subject's surface. The processor 160 can calculate a third temperature based on a first temperature, a second temperature, the thermal resistance at the predetermined thickness from the skin surface of the test subject, and the thermal resistance of the heat-conducting element 130. Understandably, in this application, the processor 160 obtains the thermal conductivity, the first temperature, and the second temperature of the test subject. The processor 160 can calculate the third temperature T based on the thermal conductivity, the first temperature, the second temperature, the thermal conductivity of the heat-conducting element 130, the cross-sectional area along the thickness direction of the heat-conducting element 130, and the area collected by the first temperature sensor 112. core .

[0071] In the embodiments provided in this application, see also Figure 3 The insulation layer 140 surrounds the heat-conducting element 130. The insulation layer 140 can constrain heat diffusion from the outer periphery of the heat-conducting element 130, ensuring that heat is transferred in a first direction during heat transfer on the heat-conducting element 130. This reduces the measurement error of the second temperature sensor 122 and also reduces the influence of ambient temperature on the temperature measuring component 100, improving the accuracy of temperature measurement and ensuring the repeatability of the temperature measurement results. It should be noted that the temperature measurement results of the temperature measuring component 100 are repeatable because the temperature measuring component 100 is less affected by the measurement environment or other factors. Repeated measurements using the temperature measuring component 100 will not show significant deviations.

[0072] In the embodiments provided in this application, the thermal conductivity of the heat-conducting element 130 is greater than that of the insulation layer 140. The difference in thermal conductivity between the heat-conducting element 130 and the insulation element allows heat to be preferentially transferred along the first direction, while the insulation element can constrain the circumferential diffusion of heat from the heat-conducting element 130, which is beneficial to improving the temperature measurement accuracy of the temperature measuring component 100.

[0073] The thermal conductivity of the insulation layer 140 is less than or equal to 0.1 W / m·K, and the thermal conductivity of the heat-conducting component 130 is between 0.1 W / m·K and 1 W / m·K.

[0074] The thermal conductive component 130 can be made of any thermally conductive insulating material with a thermal conductivity between 0.1 W / m·K and 1 W / m·K. The material of the thermal conductive component 130 may include at least one of polydimethylsiloxane, silicone rubber, electronic thermally conductive potting compound, imide, polyethylene, phenolic resin, and polyurethane. It is understood that the material of the thermal conductive component 130 may be one or a combination of polydimethylsiloxane, silicone rubber, electronic thermally conductive potting compound, imide, polyethylene, phenolic resin, and polyurethane.

[0075] The thickness of the heat-conducting element 130 along the first direction can be between 2mm and 4mm. If the heat-conducting element 130 is too thick (greater than 4mm), the heat transfer time in the heat-conducting element 130 will be longer, and the response time of the second temperature sensor 122 will be longer, thus increasing the response time of the temperature measuring component 100 during temperature measurement. At the same time, the heat loss in the heat-conducting element 130 will be more severe, reducing the sensitivity of the second temperature sensor 122, and thus reducing the sensitivity of the temperature measuring component 100 during temperature measurement. If the heat-conducting element 130 is too thin (less than 2mm), the heat loss during the transfer in the heat-conducting element 130 will be too low, the difference between the first temperature measured by the first temperature sensor 112 and the second temperature measured by the second temperature sensor 122 will be small, and the temperature measuring component 100 will find it difficult to accurately calculate the third temperature of the subject.

[0076] The insulation layer 140 comprises at least one of general-purpose polystyrene, expanded polystyrene foam, insulation cotton, expanded polyurethane foam, expanded polyvinyl chloride foam, expanded polyethylene foam, expanded phenolic resin foam, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel. It is understood that the insulation layer 140 may be one or more combinations of general-purpose polystyrene, expanded polystyrene foam, insulation cotton, expanded polyurethane foam, expanded polyvinyl chloride foam, expanded polyethylene foam, expanded phenolic resin foam, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel.

[0077] The thickness of the insulation layer 140 along the first direction is greater than or equal to the thickness of the heat-conducting element 130 along the first direction, thus enabling the insulation layer 140 to better confine the heat of the heat-conducting element 130 from its periphery. In one possible implementation, through holes are formed in the insulation layer 140 along its thickness direction, and thermally conductive insulating material is poured into the through holes to form the heat-conducting element 130. Therefore, the thickness of the insulation layer 140 along the first direction determines the thickness of the heat-conducting element 130 along the first direction, and the dimension of the insulation layer 140 along the first direction is 2mm-4mm.

[0078] In the embodiments provided in this application, the temperature measuring component 100 further includes a protective cover 150, which is disposed on the side of the second device 120 facing away from the first device 110.

[0079] The material of the protective cover 150 can be the same as that of the insulation layer 140. The material of the protective cover 150 may include at least one of general-purpose polystyrene, expanded polystyrene foam, insulation cotton, expanded polyurethane foam, expanded polyvinyl chloride foam, expanded polyethylene foam, expanded phenolic resin foam, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel. It is understood that the protective cover 150 may be one or more combinations of general-purpose polystyrene, expanded polystyrene foam, insulation cotton, expanded polyurethane foam, expanded polyvinyl chloride foam, expanded polyethylene foam, expanded phenolic resin foam, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel.

[0080] The greater the thickness of the protective cover 150 along the first direction, the better. The thickness of the protective cover 150 along the first direction is generally greater than 2mm. Since the space occupied by the protective cover 150 in the temperature measuring component 100 needs to be considered, the thickness of the protective cover 150 along the first direction can be set according to the size of the temperature measuring component 100.

[0081] In the embodiments provided in this application, the temperature measuring component 100 further includes a contact surface 170, which is used to contact the skin surface of the subject being tested, and the material of the contact surface 170 can be sapphire.

[0082] A higher thermal conductivity of the contact surface 170 is more beneficial to improving the accuracy of the first temperature sensor 112, which in turn improves the accuracy of the temperature measuring component 100 in measuring the third temperature. The thermal conductivity of the contact surface 170 is greater than or equal to 30 W / (m·K).

[0083] The larger the area of ​​the contact surface 170, the larger the contact area between the contact surface 170 and the subject, the better the accuracy of the first temperature sensor 112 is, and thus the accuracy of the temperature measuring component 100 is improved. Taking a circular contact surface 170 as an example, the smaller the diameter of the contact surface 170 (≥20mm) and the thinner the contact surface 170, the less heat is lost on the contact surface 170, which is more conducive to improving the accuracy of the first temperature sensor 112 in measuring temperature, and thus the accuracy of the temperature measuring component 100 is improved.

[0084] In the embodiments provided in this application, the first device 110 further includes a first circuit board 111, and a thermal conductivity sensor 113 and a first temperature sensor 112 are disposed on the first circuit board 111. The thermal conductivity sensor 113 is disposed between the first circuit board 111 and the insulation layer 140, and the side of the thermal conductivity sensor 113 away from the first circuit board 111 is in direct contact with the insulation layer 140.

[0085] The thermal conductivity sensor 113 is electrically connected to the first circuit board 111. The first circuit board 111 may use polyimide as a substrate. In a first direction, the thermal conductivity sensor 113 and the first temperature sensor 112 may be disposed on the same side of the first circuit board 111, or they may be disposed on opposite sides of the first circuit board 111 along the first direction.

[0086] In the embodiments provided in this application, there are multiple first temperature sensors 112, and the projections of the multiple first temperature sensors 112 along a first direction can surround the thermal conductivity sensor 113. The multiple first temperature sensors 112 can be arranged to form a circular region, and the temperature measured by the multiple first temperature sensors 112 is the temperature of the circular region formed by the multiple first temperature sensors 112. The first temperature is the average value of the temperatures measured by the multiple first temperature sensors 112.

[0087] In the embodiments provided in this application, the second device 120 further includes a second circuit board 121, and a second temperature sensor 122 is disposed on the second circuit board 121, with the second temperature sensor 122 surrounding a ring. The second circuit board 121 may be made of a polyimide substrate.

[0088] The projection of the area surrounded by the multiple second temperature sensors 122 along the first direction overlaps with the area surrounded by the multiple first temperature sensors 112. The second temperature is the average of the temperatures measured by the multiple second temperature sensors.

[0089] Multiple second temperature sensors 122 correspond one-to-one with multiple first temperature sensors 112, and the projection of the second temperature sensor 122 along the first direction overlaps with the projection of the corresponding first temperature sensor 112 along the first direction.

[0090] The number of first temperature sensors 112 can be 3, 4, 5, 6, 7, 8 or more, and this application does not impose a specific limit on the number of first temperature sensors 112.

[0091] Accordingly, the number of second temperature sensors 122 can be 3, 4, 5, 6, 7, 8 or more, and this application does not impose a specific limitation on the number of second temperature sensors 122. The number of first temperature sensors and second temperature sensors corresponds to each other.

[0092] In the embodiments provided in this application, the opening and closing of the plurality of first temperature sensors 112 and the plurality of second temperature sensors 122 are controlled by a switch matrix.

[0093] Please see Figure 5 This application also provides a temperature measurement method, which includes:

[0094] S101, the thermal conductivity of the subject is collected by a thermal conductivity sensor, and the first temperature of the skin surface is collected by a first temperature sensor;

[0095] S102, the second temperature of the end of the heat-conducting component away from the first device is collected by the second temperature sensor;

[0096] S103, the processor obtains the temperature of the set thickness of the subject based on the first temperature, the second temperature, the thermal conductivity of the subject and the thermal conductivity of the heat-conducting component.

[0097] Thermal conductivity sensor 113 is used to generate and transfer electrothermal energy to the skin surface. The thermal conductivity of the subject is acquired by thermal conductivity sensor 113, including:

[0098] The temperature change of the subject's skin surface over a set time is obtained by the first temperature sensor 112;

[0099] The processor 160 obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor 113, and the projected area of ​​the thermal conductivity sensor 113 on the skin surface.

[0100] The electrothermal parameters of the thermal conductivity sensor 113 include voltage and current. The processor 160 obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor 113, and the projected area of ​​the thermal conductivity sensor 113 on the skin surface.

[0101] Heat flow is obtained by processor 160 based on the projected area of ​​voltage, current and thermal conductivity sensor 113 on the skin surface;

[0102] The thermal resistance of the test subject is obtained by the processor 160 based on the temperature change value and heat flow.

[0103] The slope of the subject is obtained by the processor 160 based on the square root of the thermal resistance and the set time.

[0104] The thermal conductivity of the subject is obtained by the processor 160 based on the linear relationship between the slope of the subject and the thermal conductivity of the subject.

[0105] The linear relationship between the slope of the test subject and the thermal conductivity of the test subject is obtained by fitting the coordinates of thermal conductivity-slope of various skin-resistant materials. Using this method to obtain the thermal conductivity of the test subject can greatly reduce the computational load of the processor 160 and improve the response speed of the processor 160. At the same time, it also allows the temperature measuring component 100 to have a wider range of application scenarios.

[0106] The thermal conductivity sensor 113 can be a copper disk formed by closely packed double helices. When measuring the thermal conductivity of the subject, the thermal conductivity sensor 113 is supplied with a constant current. Due to the Joule heating effect, the area where the thermal conductivity sensor 113 is located in the first circuit board 111 forms a heating zone. The first temperature sensor 112 measures the change of the heating zone over time.

[0107] In the embodiments provided in this application, when the thermal conductivity sensor 113 is heated, the insulation layer 140 can confine the heat in the heating area, allowing the heat in the heating area to be transferred to the skin surface of the subject along the first direction. The formula for the change in temperature in the heating area with heating time τ is as follows:

[0108]

[0109] The result of the transformation is:

[0110]

[0111] Where ΔT is the temperature change in the heating zone, and τ is the heating time. Let q be the heat absorption coefficient of the test subject. c (τ) represents the heat flux density in the heating zone. c is the material density of the test subject. p The specific heat at constant pressure of the material being tested.

[0112] U τ I is the voltage of thermal conductivity sensor 113 after heating for time t, I is the current flowing through thermal conductivity sensor 113, and r is the radius of the heating area.

[0113] In the embodiments provided in this application, for the temperature change value ΔT, the thermal conductivity sensor 113 is powered on using a power supply module. Generally, the last voltage point U in the first second after the thermal conductivity sensor 113 is powered on (17 sampling points per second) is taken. τ The voltage is used as a reference voltage for temperature rise calculation. Specifically, the voltage of the thermal conductivity sensor 113 is periodically collected by the voltage acquisition module. All the voltage rise data collected within 60 seconds are converted into temperature rise data and then averaged every 17 points to obtain 60 temperature rise data points.

[0114] ΔT(0, τ) can be calculated using the principle of resistance temperature measurement, when the current passing through thermal conductivity sensor 113 is constant:

[0115] R τ =R0×(1+α×ΔT)

[0116] We can obtain:

[0117] U τ =U0×(1+α×ΔT)

[0118] Furthermore, we can obtain:

[0119]

[0120] Among them, R τ Let R0 be the resistance of thermal conductivity sensor 113 after heating for time t, R0 be the resistance of the conductivity sensor at the start of heating, α be a constant, and ΔT be the temperature change of thermal conductivity sensor 113 after heating for time t. τ Ut is the voltage of thermal conductivity sensor 113 after heating for time t, and U0 is the voltage of conductivity sensor at the start of heating.

[0121] It should be noted that, To determine the thermal resistance of the subject by transferring heat from the heating zone to the test subject within time τ, it is understood that the thermal conductivity sensor 113 generates a Joule heating effect after being energized. The temperature change value of the heating zone is measured by the first temperature sensor 112. Based on the temperature change value ΔT of the heating zone and the heat flux density generated by the Joule heating effect after the conductivity sensor is energized, the thermal resistance of the test subject can be determined. and The relationship is linear, meaning it depends on the thermal resistance of the test subject. and The slope of the subject can be determined.

[0122] Due to the thermal resistance of the test subject and Since the relationship is linear, it can be deduced that the thermal resistance of using skin-like materials... and It is also a linear relationship.

[0123] Please see details. Figure 6 and Figure 7 , Figure 6 This is a coordinate graph showing the time-temperature changes of various skin-like materials provided in one embodiment of this application. Figure 7 This is a time square root-thermal resistance coordinate graph of various skin-like materials provided in an embodiment of this application. The various skin-like materials are polydimethylsiloxane (PDMS), polyamide resin (PA), polyimide (PI), and high-density polyethylene (HDPE).

[0124] Since the heat absorption coefficient, material density, thermal conductivity, and specific heat at isobaric pressure of various skin-like materials are known, the thermal resistance of the skin-like materials can be determined. and The slope.

[0125]

[0126] in, The heat absorption coefficient of the skin-like material, To mimic the density of skin-like materials, c meas For skin-like materials, the specific heat at constant pressure is λ meas This refers to the thermal conductivity of the skin-like material. It allows us to determine the thermal conductivity of each skin-like material and the coordinates of the slope of the skin-like material.

[0127] Specifically, various skin-like materials include, but are not limited to, polydimethylsiloxane (PDMS), polyamide resin (PA66), polyimide (PI), and high-density polyethylene (HDPE). To determine the thermal conductivity-slope coordinates of PDMS, PA66, polyimide, and HDPE, please refer to [link to relevant documentation]. Figure 8 , Figure 8This application provides a coordinate graph of the thermal conductivity-slope of various skin-like materials according to an embodiment. Based on the coordinates of the thermal conductivity-slope of various skin-like materials, the offline relationship between the slope of the skin-like material and the slope of the anti-skin material can be determined:

[0128] slope=-0.000171501λ meas +0.000212299

[0129] By applying the slope of the skin-like material and the linear relationship between the slope of the skin-like material to the temperature measuring component 100, the thermal conductivity of the subject can be obtained.

[0130] slope=-0.000171501λ+0.000212299

[0131] λ=(slope-0.000212299) / (-0.000171501)

[0132] In the embodiments provided in this application, after obtaining the thermal conductivity of the subject, the temperature measuring component 100 can obtain a third temperature at a preset thickness of the subject's skin surface based on the first temperature, the second temperature, the thermal conductivity of the heat-conducting element 130, and the thermal conductivity of the subject.

[0133] In the embodiments provided in this application, the processor 160 can calculate the third temperature based on the first temperature, the second temperature, the thermal resistance of the subject, and the thermal resistance of the heat-conducting component 130.

[0134] During the process of heat transfer from the subject at a predetermined thickness away from the skin surface to the second sensor, the heat transferred by the heat-conducting component 130 is equal to the heat transferred by the subject's skin tissue. The specific formula for calculating the third temperature is as follows:

[0135]

[0136] The result of the transformation is:

[0137]

[0138] Among them, T core The third temperature, T bottom The first temperature, T top For the second temperature, R tissue To determine the thermal resistance of the subject at a distance from the subject, R is the preset thermal resistance of the subject. partition The thermal resistance of the heat-conducting component 130.

[0139] The processor 160 can calculate the thermal resistance of the heat-conducting element 130 based on its thickness, cross-sectional area along the thickness direction, and thermal conductivity. The processor 160 can also calculate the thermal resistance at a predetermined thickness from the skin surface of the test subject based on the predetermined thickness of the test subject and the area of ​​heat transfer on the test subject's surface. The processor 160 can calculate a third temperature based on a first temperature, a second temperature, the thermal resistance at the predetermined thickness from the skin surface of the test subject, and the thermal resistance of the heat-conducting element 130. Understandably, in this application, the processor 160 obtains the thermal conductivity, the first temperature, and the second temperature of the test subject. The processor 160 can calculate the third temperature T based on the thermal conductivity, the first temperature, the second temperature, the thermal conductivity of the heat-conducting element 130, the cross-sectional area along the thickness direction of the heat-conducting element 130, and the area collected by the first temperature sensor 112. core .

[0140] The terms "first," "second," "third," "fourth," and various numerical designations used herein are merely for descriptive convenience and are not intended to limit the scope of this application.

[0141] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0142] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A temperature measuring component, characterized in that, The temperature measuring component includes a first device and a second device; the first device and the second device are spaced apart along a first direction, and a heat-conducting element extending along the first direction and connected to the first device and the second device and an insulating layer surrounding the heat-conducting element are disposed between the first device and the second device, the first direction being perpendicular to the skin surface of the subject. The first device includes a thermal conductivity sensor and a first temperature sensor, the first temperature sensor being used to measure the temperature of the skin surface layer; The second device includes a second temperature sensor.

2. The temperature measuring component as described in claim 1, characterized in that, The temperature measuring assembly also includes a protective cover for heat insulation, which is located on the side of the second device facing away from the first device.

3. The temperature measuring component as described in any one of claims 1-2, characterized in that, The thermal conductivity of the insulation layer is less than or equal to 0.1 W / m·K.

4. The temperature measuring component as described in any one of claims 1-3, characterized in that, The thermal conductivity of the heat-conducting element is between 0.1 W / m·K and 1 W / m·K.

5. The temperature measuring component as described in any one of claims 1-4, characterized in that, The thermally conductive component includes at least one of polydimethylsiloxane, silicone rubber, electronic thermally conductive potting compound, imide, polyethylene, phenolic resin, and polyurethane.

6. The temperature measuring component according to any one of claims 1-5, characterized in that, The insulation layer includes at least one of general-purpose polystyrene, expanded polystyrene, thermal insulation cotton, expanded polyurethane, expanded polyvinyl chloride, expanded polyethylene, expanded phenolic resin, rock wool felt, glass wool felt, aluminum silicate wool felt, and aerogel.

7. The temperature measuring component according to any one of claims 1-6, characterized in that, The first device further includes a first circuit board, on which the thermal conductivity sensor and the first temperature sensor are disposed.

8. The temperature measuring component according to any one of claims 1-7, characterized in that, The projection of the thermal conductivity sensor in the first direction does not overlap with the projection of the first temperature sensor in the first direction.

9. The temperature measuring component according to any one of claims 1-8, characterized in that, The number of first temperature sensors is multiple, and the multiple first temperature sensors surround the thermal conductivity sensor.

10. The temperature measuring component as described in claim 9, characterized in that, The second device also includes a second circuit board, and there are multiple second temperature sensors, which are disposed on the second circuit board and arranged in a circle.

11. The temperature measuring component as described in claim 10, characterized in that, Along the first direction, the projections of the plurality of first temperature sensors overlap with the projections of the plurality of second temperature sensors.

12. The temperature measuring component as described in claim 1, characterized in that, The temperature measuring component also includes a contact surface that contacts the skin surface, and the contact surface is made of sapphire.

13. The temperature measuring component according to any one of claims 1-12, characterized in that, It also includes a processor for acquiring information collected by the thermal conductivity sensor, the first temperature sensor, and the second temperature sensor.

14. A wearable device, characterized in that, Includes the temperature measuring component as described in any one of claims 1-13.

15. A temperature measurement method, characterized in that, The temperature measurement method is applied to the temperature measurement component as described in any one of claims 1-13, and the temperature measurement method includes: The thermal conductivity of the subject is collected by a thermal conductivity sensor, and the first temperature of the skin surface is collected by the first temperature sensor. The second temperature of the end of the heat-conducting component away from the first device is collected by a second temperature sensor. The processor obtains the temperature of the set thickness of the test subject based on the first temperature, the second temperature, the thermal conductivity of the test subject, and the thermal conductivity of the thermally conductive component.

16. The temperature measurement method as described in claim 15, characterized in that, The thermal conductivity sensor is used to generate electrothermal energy and transfer it to the skin surface. The step of acquiring the thermal conductivity of the subject through the thermal conductivity sensor includes: The temperature change of the subject's skin surface over a set time period is obtained through the first temperature sensor; The processor obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor, and the projected area of ​​the thermal conductivity sensor on the skin surface.

17. The temperature measurement method as described in claim 16, characterized in that, The electrothermal parameters of the thermal conductivity sensor include voltage and current. The process of obtaining the thermal conductivity of the subject by the processor based on the temperature change value, the electrothermal parameters of the thermal conductivity sensor, and the projected area of ​​the thermal conductivity sensor on the skin surface includes: The processor obtains the heat flow based on the voltage, the current, and the projected area on the skin surface by the thermal conductivity sensor; The processor obtains the thermal resistance of the test subject based on the temperature change value and the heat flow. The processor obtains the slope of the subject based on the square root of the thermal resistance and the set time. The processor obtains the thermal conductivity of the subject based on the linear relationship between the subject's slope and the subject's thermal conductivity.

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