Fault monitoring and early warning method and system for rock core sample fretsaw cutting device

Abstract

The invention relates to the technical field of rock core sample processing, and discloses a fault monitoring and early warning method and system for a rock core sample fretsaw cutting device, and the method comprises the steps: collecting device parameters at a collection time point, and collecting sample finished product parameters after sample processing is completed; the rotating balance degree is obtained according to the movement speed of the rotating platform, the cutting uniformity is obtained according to the transverse movement speed and the vertical movement speed of the carborundum line, and the operation stability of the device is obtained according to the rotating balance degree and the cutting uniformity; the diameter of the finished product is compared with a preset diameter, whether the cutting integrity is adjusted or not is judged according to the cutting uniformity, and a final value of the cutting integrity is obtained; and according to the device operation stability and the cutting integrity final value, obtaining a device comprehensive evaluation value, according to the device comprehensive evaluation value, determining whether to perform early warning, and according to the device comprehensive evaluation value, performing graded early warning. According to the invention, comprehensive and reliable fault monitoring and early warning of the rock core sample fretsaw cutting device are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of core sample processing, in particular to a fault monitoring and early warning method and system for a core sample wire saw cutting device. BACKGROUND

[0002] In the field of core sample processing, fault monitoring and early warning of the core sample wire saw cutting device has always been a key link to ensure production efficiency and sample quality. The traditional fault monitoring method of the core sample wire saw cutting device has certain limitations.

[0003] On the one hand, most monitoring methods cannot comprehensively and accurately obtain key information of equipment operation and sample processing. In the past, it may only focus on the collection of part of the parameters, such as only paying attention to individual running parameters of the device, while ignoring the finished product parameters closely related to the sample quality, such as finished product diameter and finished product uniformity, which makes the evaluation of the whole cutting process not comprehensive enough, and cannot timely find the potential factors that may affect the sample quality. On the other hand, there is a lack of scientificity in the time interval setting of data collection. The traditional method may not continuously track the running state of the device in a stable time period, resulting in that the obtained data lacks regularity and reliability, and it is difficult to accurately reflect the real running state of the device, which brings difficulties to subsequent analysis and fault judgment.

[0004] Therefore, it is necessary to provide a fault monitoring and early warning method and system for a core sample wire saw cutting device to solve the limitations of the prior art in fault monitoring and early warning of the core sample wire saw cutting device. SUMMARY

[0005] In view of this, the present application provides a fault monitoring and early warning method and system for a core sample wire saw cutting device, aiming to solve the limitations of the prior art in fault monitoring and early warning of the core sample wire saw cutting device.

[0006] On the one hand, the present application provides a fault monitoring and early warning method for a core sample wire saw cutting device, comprising: setting a plurality of collection time points, collecting device parameters at the collection time points, and collecting sample finished product parameters after sample processing is completed; wherein the interval time of adjacent collection time points is the same, the device parameters include rotating platform movement speed, diamond wire horizontal movement speed and diamond wire vertical movement speed, and the sample finished product parameters include finished product diameter and finished product uniformity; obtaining rotating balance degree according to the rotating platform movement speed, obtaining cutting uniformity according to the diamond wire horizontal movement speed and the diamond wire vertical movement speed, and obtaining device running stability according to the rotating balance degree and the cutting uniformity; The diameter of the finished product is compared with the preset diameter to determine whether there is a deviation in the diameter of the finished product and to obtain the cutting integrity. Based on the cutting uniformity, it is determined whether the cutting integrity should be adjusted. If it is determined that it should be adjusted, the cutting integrity is adjusted according to the cutting uniformity to obtain the final value of cutting integrity. The device's overall evaluation value is obtained based on the device's operational stability and the final value of the cutting integrity. A warning is then issued based on the overall evaluation value. If a warning is issued, a graded warning is issued based on the overall evaluation value.

[0007] Furthermore, obtaining the rotational balance based on the rotational platform's motion speed includes: Set a speed range. If the rotational platform speeds collected at each acquisition time point are all within the specified speed range, then the rotational balance is 1. If there are rotating platform speeds outside the specified speed range at any given time point, then the number of rotating platform speeds within the specified speed range is obtained and recorded as the qualified number. The ratio of the qualified number to the number at the time point is calculated, and this ratio is used as the rotational balance.

[0008] Furthermore, when obtaining the cutting uniformity based on the transverse and vertical movement speeds of the diamond wire, the process includes: Calculate the lateral velocity variance of the transverse movement velocity of the diamond wire, and calculate the vertical velocity variance of the vertical movement velocity of the diamond wire. Then, calculate the cutting uniformity using the following formula: Cutting uniformity = 1 - (lateral velocity variance + vertical velocity variance) / 2.

[0009] Furthermore, when obtaining the device's operational stability based on the rotational uniformity and cutting uniformity, the following steps are included: Set a first sum and a second sum, and calculate the sum of the uniformity of rotational balance and cutting uniformity; wherein the first sum is greater than the second sum, and the first sum is less than 2; If the uniformity sum is 2, then the device's operational stability is 1; If the sum of the uniformity values ​​is greater than the first sum value and less than 2, then the device's operational stability is the first stability. If the sum of the uniformity values ​​is less than or equal to the first sum and greater than or equal to the second sum, then the operating stability of the device is the second stability. If the sum of the uniformity values ​​is less than the second sum value, then the operating stability of the device is the third stability. Among them, 1 > first stability > second stability > third stability.

[0010] Furthermore, when comparing the finished product diameter with the preset diameter to determine whether there is a deviation in the finished product diameter, the following steps are included: The diameter of the finished product includes the diameters at both ends and the diameter at the middle of the sample product; Determine whether there is a deviation between the diameters at both ends and the diameter at the middle and the preset diameter, respectively.

[0011] Furthermore, obtaining the cut integrity includes: Set a deviation threshold. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all less than the deviation threshold, then the cut integrity is 1. If the deviation between the diameters at both ends and the diameter at the middle part and the preset diameter is greater than the deviation threshold, then the cut integrity is the first integrity. If there are two deviations between the diameters at both ends and the diameter at the middle and the preset diameter that are greater than the deviation threshold, then the cut integrity is the second integrity. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all greater than the deviation threshold, then the cut integrity is 0. Among them, 1 > first completeness > second completeness > 0.

[0012] Furthermore, when determining whether to adjust the cut integrity based on the cut uniformity, the following steps are included: Check whether there are defects on the outer surface of the finished sample. If defects are found, it is determined that the cut integrity needs to be adjusted. If there are no defects on the outer surface of the finished sample, it is determined that there is no need to adjust the cutting integrity, and the cutting integrity is directly used as the final value of cutting integrity.

[0013] Furthermore, when adjusting the cutting integrity based on the cutting uniformity to obtain the final value of cutting integrity, the process includes: Obtain the defect area, calculate the area ratio of the defect area to the surface area of ​​the finished sample, and determine the adjustment coefficient based on the area ratio to adjust the cutting integrity. The area ratio is inversely proportional to the adjustment coefficient, the adjustment coefficient ranges from [0, 1], and the final value of the cut integrity is the product of the cut integrity and the adjustment coefficient.

[0014] Furthermore, the step of obtaining a comprehensive evaluation value for the device based on its operational stability and the final value of the cutting integrity, and determining whether to issue a warning based on the comprehensive evaluation value, includes the following when issuing a graded warning based on the comprehensive evaluation value: The comprehensive evaluation value of the device is the weighted sum of the final values ​​of device operating stability and cutting integrity; if the comprehensive evaluation value of the device is greater than or equal to the preset evaluation value, it is determined that no warning will be issued; otherwise, it is determined that a warning needs to be issued. A first evaluation value is set, which is less than the first evaluation value. If the overall evaluation value of the device is less than the first evaluation value but greater than or equal to the first evaluation value, a first-level warning is issued. If the overall evaluation value of the device is less than the first evaluation value, a second-level warning is issued.

[0015] Compared with existing technologies, the advantages of this invention are as follows: First, by setting several acquisition time points to collect device parameters and sample finished product parameters, key information on equipment operation and sample processing can be obtained comprehensively and accurately. The identical intervals between adjacent acquisition time points facilitate continuous tracking of the device's operating status within a stable time period, providing a regular and reliable data foundation for subsequent analysis. The acquisition of device parameters such as the rotational platform speed and the lateral and vertical movement speeds of the diamond wire accurately reflects the dynamic characteristics of the device during operation; while the acquisition of sample finished product parameters such as the finished product diameter and uniformity are directly related to the sample's quality. Second, further analysis using this acquired data, such as obtaining rotational balance based on the rotational platform speed and cutting uniformity based on the lateral and vertical movement speeds of the diamond wire, and thus obtaining the device's operational stability, delves into the device's operating status hidden behind the data. By quantifying these indicators, the stability of the device during the cutting process can be more clearly understood, potential instability factors can be identified in advance, and a strong basis for preventing malfunctions can be provided. Furthermore, the finished product diameter is compared with the preset diameter to determine if there is any deviation and to obtain the cutting integrity. The cutting integrity is then adjusted based on the cutting uniformity to obtain a final value, effectively combining the relationship between sample quality and the cutting process. This not only directly determines whether the sample meets the standard but also comprehensively and meticulously evaluates the cutting effect by adjusting the cutting integrity, providing multiple safeguards for sample quality control. Finally, a comprehensive evaluation value for the device is obtained based on the device's operational stability and the final value of the cutting integrity. This value is used to determine whether to issue an early warning and to implement tiered early warnings, achieving comprehensive and scientific monitoring of device malfunctions. Early warnings can be issued promptly when potential malfunctions occur, and tiered warnings allow operators to quickly understand the severity of the malfunction, enabling targeted measures to be taken. This effectively avoids production stoppages and sample scrapping caused by malfunctions, improving production efficiency and ensuring sample quality.

[0016] On the other hand, this application also provides a fault monitoring and early warning system for a core sample wire saw cutting device, including: The acquisition module is used to set several acquisition time points, acquire device parameters at the acquisition time points, and acquire sample finished product parameters after sample processing; wherein, the interval between adjacent acquisition time points is the same, the device parameters include the rotation speed of the rotating platform, the lateral movement speed of the diamond wire and the vertical movement speed of the diamond wire, and the sample finished product parameters include the finished product diameter and the finished product uniformity. The device stability evaluation module is used to obtain the rotational uniformity based on the rotational platform's movement speed, the cutting uniformity based on the transverse and vertical movement speeds of the diamond wire, and the device's operational stability based on the rotational uniformity and cutting uniformity. The sample cutting evaluation module is used to compare the diameter of the finished product with the preset diameter to determine whether there is a deviation in the diameter of the finished product and to obtain the cutting integrity. Based on the cutting uniformity, it is determined whether the cutting integrity should be adjusted. If it is determined that adjustment is needed, the cutting integrity is adjusted based on the cutting uniformity to obtain the final value of cutting integrity. The early warning module is used to obtain a comprehensive evaluation value of the device based on the device's operational stability and the final value of the cutting integrity, and to determine whether to issue an early warning based on the comprehensive evaluation value of the device. If an early warning is determined, a graded early warning is issued based on the comprehensive evaluation value of the device.

[0017] It is understood that the fault monitoring and early warning method and system for the core sample wire saw cutting device provided in this application have the same beneficial effects, and will not be described in detail here. Attached Figure Description

[0018] Various other advantages and benefits of this application will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A flowchart of a fault monitoring and early warning method for a core sample wire saw cutting device provided in an embodiment of the present invention; Figure 2 A functional block diagram of a fault monitoring and early warning system for a core sample wire saw cutting device provided in an embodiment of the present invention. Detailed Implementation

[0019] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specified, embodiments and features in the embodiments of the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] Specifically, this invention is based on the fault monitoring of the core sample wire saw cutting device with application number 201811436383.1.

[0021] In some embodiments of this application, see Figure 1 As shown, this embodiment provides a fault monitoring and early warning method for a core sample wire saw cutting device, including the following steps: S100. Set several collection time points, collect device parameters at the collection time points, and collect sample finished product parameters after sample processing is completed; wherein, the interval time between adjacent collection time points is the same, the device parameters include the rotation speed of the rotating platform, the lateral movement speed of the diamond wire and the vertical movement speed of the diamond wire, and the sample finished product parameters include the finished product diameter and the finished product uniformity. S200. The rotational balance is obtained based on the rotational platform's movement speed; the cutting uniformity is obtained based on the transverse and vertical movement speeds of the diamond wire; and the device's operational stability is obtained based on the rotational balance and cutting uniformity. S300. Compare the finished product diameter with the preset diameter to determine if there is a deviation in the finished product diameter and obtain the cutting integrity. Determine whether to adjust the cutting integrity based on the cutting uniformity. If it is determined to be adjusted, adjust the cutting integrity based on the cutting uniformity to obtain the final value of the cutting integrity. S400. Obtain a comprehensive evaluation value for the device based on the device's operational stability and the final value of the cutting integrity. Determine whether to issue a warning based on the comprehensive evaluation value. If a warning is issued, then issue a graded warning based on the comprehensive evaluation value.

[0022] Understandably, firstly, by setting several data collection points to acquire device parameters and sample parameters, key information on equipment operation and sample processing can be obtained comprehensively and accurately. The consistent intervals between adjacent data collection points facilitate continuous tracking of the device's operating status within a stable time period, providing a regular and reliable data foundation for subsequent analysis. Data collection on device parameters such as the rotational platform speed and the lateral and vertical movement speeds of the diamond wire accurately reflects the dynamic characteristics of the device during operation; while data collection on sample parameters such as finished product diameter and uniformity directly relates to sample quality. Secondly, further analysis using this collected data, such as obtaining rotational balance based on the rotational platform speed and cutting uniformity based on the lateral and vertical movement speeds of the diamond wire, allows for the assessment of device operational stability. This series of operations delves into the device's operational status hidden behind the data. Quantifying these indicators provides a clearer understanding of the device's stability during the cutting process, enabling the early detection of potential instability factors and providing a strong basis for malfunction prevention. Furthermore, the finished product diameter is compared with the preset diameter to determine if there is any deviation and to obtain the cutting integrity. The cutting integrity is then adjusted based on the cutting uniformity to obtain a final value, effectively combining the relationship between sample quality and the cutting process. This not only directly determines whether the sample meets the standard but also comprehensively and meticulously evaluates the cutting effect by adjusting the cutting integrity, providing multiple safeguards for sample quality control. Finally, a comprehensive evaluation value for the device is obtained based on the device's operational stability and the final value of the cutting integrity. This value is used to determine whether to issue an early warning and to implement tiered early warnings, achieving comprehensive and scientific monitoring of device malfunctions. Early warnings can be issued promptly when potential malfunctions occur, and tiered warnings allow operators to quickly understand the severity of the malfunction, enabling targeted measures to be taken. This effectively avoids production stoppages and sample scrapping caused by malfunctions, improving production efficiency and ensuring sample quality.

[0023] In some embodiments of this application, obtaining the rotational balance based on the rotational platform's motion speed includes: Set a speed range. If the rotational platform speeds collected at each acquisition time point are all within the specified speed range, then the rotational balance is 1. If there are rotating platform speeds outside the specified speed range at any given time point, then the number of rotating platform speeds within the specified speed range is obtained and recorded as the qualified number. The ratio of the qualified number to the number at the time point is calculated, and this ratio is used as the rotational balance.

[0024] In some embodiments of this application, obtaining the cutting uniformity based on the transverse and vertical movement speeds of the diamond wire includes: Calculate the lateral velocity variance of the transverse movement velocity of the diamond wire, and calculate the vertical velocity variance of the vertical movement velocity of the diamond wire. Then, calculate the cutting uniformity using the following formula: Cutting uniformity = 1 - (lateral velocity variance + vertical velocity variance) / 2.

[0025] In some embodiments of this application, obtaining the device's operational stability based on the rotational uniformity and cutting uniformity includes: Set a first sum and a second sum, and calculate the sum of the uniformity of rotational balance and cutting uniformity; wherein the first sum is greater than the second sum, and the first sum is less than 2; If the uniformity sum is 2, then the device's operational stability is 1; If the sum of the uniformity values ​​is greater than the first sum value and less than 2, then the device's operational stability is the first stability. If the sum of the uniformity values ​​is less than or equal to the first sum and greater than or equal to the second sum, then the operating stability of the device is the second stability. If the sum of the uniformity values ​​is less than the second sum value, then the operating stability of the device is the third stability. Among them, 1 > first stability > second stability > third stability.

[0026] Understandably, firstly, in calculating rotational balance, a speed range is set to determine the rotational balance. If the rotational platform speeds collected at each time point are all within this range, the rotational balance is 1. If there are speeds outside this range, the ratio of the number of qualified speeds to the number of speeds collected at each time point is used as the rotational balance. This accurately reflects the balance of the rotational platform's speed, helping operators quickly understand whether the platform is operating stably. A rotational balance of 1 indicates that the platform's speed at each time point is within the ideal range, and its operation is extremely stable. Furthermore, when calculating the rotational balance using a ratio, the degree of deviation in platform operation can be measured more precisely, providing clear data support for adjustments and optimizations.

[0027] Secondly, by calculating the lateral velocity variance of the diamond wire's lateral movement speed and the vertical velocity variance of its vertical movement speed, the cutting uniformity comprehensively considers the velocity changes of the diamond wire in two key directions, enabling accurate assessment of the uniformity during the cutting process. Variance reflects the degree of data dispersion; in this way, fluctuations in the diamond wire's velocity during lateral or vertical movement can be detected promptly. A higher cutting uniformity value indicates a more stable and uniform cutting process, which helps improve the quality of the cut products and reduce the defect rate.

[0028] Finally, to determine the operational stability of the device, a first and a second sum value are set, and the sum values ​​of the uniformity of rotational balance and cutting uniformity are calculated. This graded determination method can comprehensively and meticulously evaluate the overall operational stability of the device. When the sum value of uniformity is 2, that is, when both rotational balance and cutting uniformity have reached their optimal state, the operational stability of the device is 1, indicating that the device is in an excellent operating state.

[0029] In some embodiments of this application, the step of comparing the finished product diameter with a preset diameter to determine whether there is a deviation in the finished product diameter includes: The diameter of the finished product includes the diameters at both ends and the diameter at the middle of the sample product; Determine whether there is a deviation between the diameters at both ends and the diameter at the middle and the preset diameter, respectively.

[0030] In some embodiments of this application, obtaining the cut integrity includes: Set a deviation threshold. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all less than the deviation threshold, then the cut integrity is 1. If the deviation between the diameters at both ends and the diameter at the middle part and the preset diameter is greater than the deviation threshold, then the cut integrity is the first integrity. If there are two deviations between the diameters at both ends and the diameter at the middle and the preset diameter that are greater than the deviation threshold, then the cut integrity is the second integrity. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all greater than the deviation threshold, then the cut integrity is 0. Among them, 1 > first completeness > second completeness > 0.

[0031] In some embodiments of this application, determining whether to adjust the cut integrity based on the cut uniformity includes: Check whether there are defects on the outer surface of the finished sample. If defects are found, it is determined that the cut integrity needs to be adjusted. If there are no defects on the outer surface of the finished sample, it is determined that there is no need to adjust the cutting integrity, and the cutting integrity is directly used as the final value of cutting integrity.

[0032] In some embodiments of this application, adjusting the cut integrity based on the cut uniformity to obtain a final cut integrity value includes: Obtain the defect area, calculate the area ratio of the defect area to the surface area of ​​the finished sample, and determine the adjustment coefficient based on the area ratio to adjust the cutting integrity. The area ratio is inversely proportional to the adjustment coefficient, the adjustment coefficient ranges from [0, 1], and the final value of the cut integrity is the product of the cut integrity and the adjustment coefficient.

[0033] Understandably, the method for detecting the diameter of the finished product is extremely detailed, subdividing it into the diameters at both ends and the middle of the sample, and determining whether there are deviations between each and the preset diameter. This refined detection method allows for a more comprehensive and accurate control over the diameter of the finished product, timely detection of potential diameter deviations, and avoids overlooking local anomalies by focusing only on the overall diameter, thus providing stronger assurance for product quality. By setting deviation thresholds, corresponding cutting integrity values ​​are given based on different deviation situations, making the assessment of cutting integrity more quantitative and scientific. This helps to unify the evaluation criteria for production quality, providing clear and accurate judgment criteria for both real-time detection on the production line and subsequent quality traceability, making it easier for staff to understand the product cutting situation and take targeted improvement measures. Adjustments are made based on whether there are defects on the outer surface of the sample finished product, fully considering various situations that may occur in actual production. If defects are found on the outer surface, the cutting integrity is adjusted, making the final cutting integrity value more closely reflect the actual quality of the product and ensuring the authenticity of the product quality assessment. Furthermore, the method of adjusting the cutting integrity based on the proportion of defect area further demonstrates its precision. The setting that the area ratio is inversely proportional to the adjustment coefficient can reasonably adjust the cutting integrity according to the severity of defects, making the calculation of the final value of cutting integrity more scientific and reasonable, and better reflecting the actual quality of the product.

[0034] In some embodiments of this application, the step of obtaining a comprehensive evaluation value of the device based on the device's operational stability and the final value of the cutting integrity, determining whether to issue a warning based on the comprehensive evaluation value, and if a warning is issued, then performing a graded warning based on the comprehensive evaluation value includes: The comprehensive evaluation value of the device is the weighted sum of the final values ​​of device operating stability and cutting integrity; if the comprehensive evaluation value of the device is greater than or equal to the preset evaluation value, it is determined that no warning will be issued; otherwise, it is determined that a warning needs to be issued. A first evaluation value is set, which is less than the first evaluation value. If the overall evaluation value of the device is less than the first evaluation value but greater than or equal to the first evaluation value, a first-level warning is issued. If the overall evaluation value of the device is less than the first evaluation value, a second-level warning is issued.

[0035] Understandably, by weighting and summing the final values ​​of equipment operational stability and cutting integrity to obtain a comprehensive evaluation value, the overall condition of the equipment can be fully and objectively reflected. Specifically, the preset evaluation value is set manually. Using the preset evaluation value as the boundary for determining whether to issue an alert provides a clear and unambiguous standard for the alert mechanism. A first evaluation value lower than the initial evaluation value is set to further refine the alert levels. A Level 1 alert is issued when the comprehensive evaluation value is lower than the initial evaluation value but greater than or equal to the first evaluation value; a Level 2 alert is issued when it is lower than the first evaluation value. This tiered alert system allows relevant personnel to take timely and appropriate measures based on different degrees of severity, enabling more precise and targeted handling of potential equipment problems, effectively ensuring stable equipment operation, reducing production risks caused by equipment problems, and improving overall production efficiency and quality.

[0036] On the other hand, see Figure 2 As shown, this application also provides a fault monitoring and early warning system for a core sample wire saw cutting device, used to apply the above-mentioned fault monitoring and early warning method for the core sample wire saw cutting device, including: The acquisition module is used to set several acquisition time points, acquire device parameters at the acquisition time points, and acquire sample finished product parameters after sample processing; wherein, the interval between adjacent acquisition time points is the same, the device parameters include the rotation speed of the rotating platform, the lateral movement speed of the diamond wire and the vertical movement speed of the diamond wire, and the sample finished product parameters include the finished product diameter and the finished product uniformity. The device stability evaluation module is used to obtain the rotational uniformity based on the rotational platform's movement speed, the cutting uniformity based on the transverse and vertical movement speeds of the diamond wire, and the device's operational stability based on the rotational uniformity and cutting uniformity. The sample cutting evaluation module is used to compare the diameter of the finished product with the preset diameter to determine whether there is a deviation in the diameter of the finished product and to obtain the cutting integrity. Based on the cutting uniformity, it is determined whether the cutting integrity should be adjusted. If it is determined that adjustment is needed, the cutting integrity is adjusted based on the cutting uniformity to obtain the final value of cutting integrity. The early warning module is used to obtain a comprehensive evaluation value of the device based on the device's operational stability and the final value of the cutting integrity, and to determine whether to issue an early warning based on the comprehensive evaluation value of the device. If an early warning is determined, a graded early warning is issued based on the comprehensive evaluation value of the device.

[0037] Understandably, the data acquisition module collects device parameters and sample finished product parameters at multiple time points, providing a rich data foundation for subsequent analysis and facilitating a comprehensive understanding of device operation and sample processing. The device stability assessment module analyzes the rotational speed of the rotating platform and diamond wire to determine rotational uniformity and cutting uniformity, thereby evaluating device operational stability and identifying potential instability factors in advance, ensuring a smooth cutting process. The sample cutting assessment module compares the finished product diameter with the preset diameter and adjusts the cutting integrity based on cutting uniformity, ensuring sample cutting quality and improving the finished product qualification rate. The early warning module obtains a comprehensive evaluation value based on the device operational stability and the final value of cutting integrity, and issues graded warnings. This allows operators to promptly grasp the device status, take appropriate measures according to the warning level, prevent the escalation of faults, reduce maintenance costs, improve production efficiency, and ensure the smooth progress of core sample cutting.

[0038] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program goods. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program goods embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0039] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program goods according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0040] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0041] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A method for fault monitoring and early warning of a wire saw cutting device for rock core samples, characterized in that, include: Several data collection time points are set up. Device parameters are collected at the data collection time points, and sample finished product parameters are collected after sample processing is completed. The time interval between adjacent data collection time points is the same. The device parameters include the rotation speed of the rotating platform, the lateral speed of the diamond wire, and the vertical speed of the diamond wire. The sample finished product parameters include the finished product diameter and the finished product uniformity. The rotational balance is obtained based on the rotational platform's movement speed; the cutting uniformity is obtained based on the transverse and vertical movement speeds of the diamond wire; and the device's operational stability is obtained based on the rotational balance and cutting uniformity. The diameter of the finished product is compared with the preset diameter to determine whether there is a deviation in the diameter of the finished product and to obtain the cutting integrity. Based on the cutting uniformity, it is determined whether the cutting integrity should be adjusted. If it is determined that it should be adjusted, the cutting integrity is adjusted according to the cutting uniformity to obtain the final value of cutting integrity. The device's overall evaluation value is obtained based on the device's operational stability and the final value of the cutting integrity. A warning is then issued based on the overall evaluation value. If a warning is issued, a graded warning is issued based on the overall evaluation value.

2. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, The process of obtaining the rotational balance based on the rotational platform's motion speed includes: Set a speed range. If the rotational platform speeds collected at each acquisition time point are all within the specified speed range, then the rotational balance is 1. If there are rotating platform speeds outside the specified speed range at any given time point, then the number of rotating platform speeds within the specified speed range is obtained and recorded as the qualified number. The ratio of the qualified number to the number at the time point is calculated, and this ratio is used as the rotational balance.

3. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, The process of obtaining cutting uniformity based on the transverse and vertical movement speeds of the diamond wire includes: Calculate the lateral velocity variance of the transverse movement velocity of the diamond wire, and calculate the vertical velocity variance of the vertical movement velocity of the diamond wire. Then, calculate the cutting uniformity using the following formula: Cutting uniformity = 1 - (lateral velocity variance + vertical velocity variance) / 2.

4. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, When obtaining the device's operational stability based on the rotational uniformity and cutting uniformity, the following steps are included: Set a first sum and a second sum, and calculate the sum of the uniformity of rotational balance and cutting uniformity; wherein the first sum is greater than the second sum, and the first sum is less than 2; If the uniformity sum is 2, then the device's operational stability is 1; If the sum of the uniformity values ​​is greater than the first sum value and less than 2, then the device's operational stability is the first stability. If the sum of the uniformity values ​​is less than or equal to the first sum and greater than or equal to the second sum, then the operating stability of the device is the second stability. If the sum of the uniformity values ​​is less than the second sum value, then the operating stability of the device is the third stability. Among them, 1 > first stability > second stability > third stability.

5. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, When comparing the finished product diameter with a preset diameter to determine whether there is a deviation in the finished product diameter, the following steps are included: The diameter of the finished product includes the diameters at both ends and the diameter at the middle of the sample product; Determine whether there is a deviation between the diameters at both ends and the diameter at the middle and the preset diameter, respectively.

6. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 5, characterized in that, When obtaining the cut integrity, the following are included: Set a deviation threshold. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all less than the deviation threshold, then the cut integrity is 1. If the deviation between the diameters at both ends and the diameter at the middle part and the preset diameter is greater than the deviation threshold, then the cut integrity is the first integrity. If there are two deviations between the diameters at both ends and the diameter at the middle and the preset diameter that are greater than the deviation threshold, then the cut integrity is the second integrity. If the deviation values ​​between the diameters at both ends and the diameter at the middle part and the preset diameter are all greater than the deviation threshold, then the cut integrity is 0. Among them, 1 > first completeness > second completeness > 0.

7. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, When determining whether to adjust the cut integrity based on the cut uniformity, the following steps are included: Check whether there are defects on the outer surface of the finished sample. If defects are found, it is determined that the cut integrity needs to be adjusted. If there are no defects on the outer surface of the finished sample, it is determined that there is no need to adjust the cutting integrity, and the cutting integrity is directly used as the final value of cutting integrity.

8. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 7, characterized in that, When adjusting the cutting integrity based on the cutting uniformity to obtain the final value of cutting integrity, the following steps are included: Obtain the defect area, calculate the area ratio of the defect area to the surface area of ​​the finished sample, and determine the adjustment coefficient based on the area ratio to adjust the cutting integrity. The area ratio is inversely proportional to the adjustment coefficient, the adjustment coefficient ranges from [0, 1], and the final value of the cut integrity is the product of the cut integrity and the adjustment coefficient.

9. The fault monitoring and early warning method for the core sample wire saw cutting device according to claim 1, characterized in that, The process involves obtaining a comprehensive evaluation value for the device based on its operational stability and the final value of the cutting integrity. Then, based on this comprehensive evaluation value, a warning is issued. If a warning is issued, a tiered warning system is implemented based on the comprehensive evaluation value, including: The comprehensive evaluation value of the device is the weighted sum of the final values ​​of device operating stability and cutting integrity; if the comprehensive evaluation value of the device is greater than or equal to the preset evaluation value, it is determined that no warning will be issued; otherwise, it is determined that a warning needs to be issued. A first evaluation value is set, which is less than the first evaluation value. If the overall evaluation value of the device is less than the first evaluation value but greater than or equal to the first evaluation value, a first-level warning is issued. If the overall evaluation value of the device is less than the first evaluation value, a second-level warning is issued.

10. A fault monitoring and early warning system for a core sample wire saw cutting device, used to apply the fault monitoring and early warning method for the core sample wire saw cutting device as described in any one of claims 1-9, characterized in that, include: The acquisition module is used to set several acquisition time points, acquire device parameters at the acquisition time points, and acquire sample finished product parameters after sample processing; wherein, the interval between adjacent acquisition time points is the same, the device parameters include the rotation speed of the rotating platform, the lateral movement speed of the diamond wire and the vertical movement speed of the diamond wire, and the sample finished product parameters include the finished product diameter and the finished product uniformity. The device stability evaluation module is used to obtain the rotational uniformity based on the rotational platform's movement speed, the cutting uniformity based on the transverse and vertical movement speeds of the diamond wire, and the device's operational stability based on the rotational uniformity and cutting uniformity. The sample cutting evaluation module is used to compare the diameter of the finished product with the preset diameter to determine whether there is a deviation in the diameter of the finished product and to obtain the cutting integrity. Based on the cutting uniformity, it is determined whether the cutting integrity should be adjusted. If it is determined that adjustment is needed, the cutting integrity is adjusted based on the cutting uniformity to obtain the final value of cutting integrity. The early warning module is used to obtain a comprehensive evaluation value of the device based on the device's operational stability and the final value of the cutting integrity, and to determine whether to issue an early warning based on the comprehensive evaluation value of the device. If an early warning is determined, a graded early warning is issued based on the comprehensive evaluation value of the device.

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