High-throughput laser sectioning apparatus and methods for rice breeding
By using high-throughput laser slicing equipment and methods, non-contact cutting with robotic arms and lasers has been achieved, solving the problems of incomplete cutting and genotype contamination in rice breeding. This has enabled high-precision and contamination-free seed cutting and improved the automation level of breeding.
CN121026697BActive Publication Date: 2026-06-09ZHEJIANG UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG UNIV
- Filing Date
- 2025-08-12
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing rice breeding equipment suffers from problems such as incomplete cutting, inter-seed infection, and genotype contamination, especially for corn seeds and hulled seed samples, which are not cut cleanly and lack automation.
Method used
High-throughput laser slicing equipment is used to perform non-contact cutting using a robotic arm, an end-effector suction nozzle, a vision camera, and a laser. Combined with a robot multi-node operating system and key point algorithms, seed pose recognition and precise cutting are achieved.
Benefits of technology
It achieves high-precision, pollution-free seed cutting, avoids seed posture deviation and gene contamination, and improves the automation level of the breeding process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121026697B_ABST
Abstract
The application discloses a high-throughput laser sectioning device and method for rice breeding. The device comprises an axial rotation driving motor and an end negative pressure suction nozzle mounted at the end of a mechanical arm; a supply module comprising a seed disc and a first vision camera, the seed disc is arranged within the working range of the mechanical arm, and the first vision camera is used for identifying the pose of rice seeds in the seed disc; a vibrating rice seed metering device is used for supplementing rice seeds to the seed disc; a clamping and collecting module comprising a seed clamping position, a parent collecting tube and a sample collecting tube, the seed clamping position and the parent collecting tube are both arranged within the working range of the mechanical arm, and the inlet of the sample collecting tube is located on one side below the seed clamping position; a laser is used for cutting rice seeds on the seed clamping position by using a laser beam; and a second vision camera is used for adjusting the laser cutting path of the laser. The application effectively improves the working quality and efficiency of the device, and avoids invalid sampling, low-quality sampling and the like.
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