High and low temperature test environment control device

Abstract

The invention discloses a high and low temperature test environment control device, which comprises a furnace body, a heating assembly and a refrigeration assembly, and is characterized in that the heating part of the heating assembly is positioned in the outer wall of the furnace body, and the refrigeration assembly is arranged close to the outer side of the outer wall of the furnace body; the refrigeration assembly is mainly composed of a semiconductor refrigeration sheet, a cold end heat conduction copper sheet and a hot end water cooling copper block. A refrigeration assembly support is arranged, a refrigeration assembly is limited by the refrigeration assembly support, the refrigeration assembly and the refrigeration assembly support are in sliding connection, a plurality of reset springs are arranged between a hot end water cooling copper block and the refrigeration assembly support, a plurality of spring holes are formed in a cold end heat conduction copper sheet, and shape memory alloy springs are installed in the spring holes. And the cold-end heat-conducting copper sheet has two working states of clinging to the outer wall of the furnace body and separating from the outer wall of the furnace body. According to the invention, the semiconductor refrigeration technology can be applied to the high and low temperature test environment control device, and the structure of the invention can be realized in a micro space.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of environmental simulation and testing, and particularly relates to an environmental control device for high and low temperature environmental simulation and characteristic testing of equipment, devices and materials. BACKGROUND

[0002] In many fields such as aerospace, military industry, electrical equipment and automobile, the working environment temperature of equipment and devices has a significant impact on their performance and failure rate, among which the failure caused by high and low temperature environmental changes accounts for the largest proportion. Therefore, the high and low temperature test environmental control device, as a key device for simulating the extreme environment of products, is indispensable in product design, improvement, identification and testing, etc. It can preliminarily determine the performance of products and find defects in time.

[0003] For example, in the temperature resistance characteristic test of various types of batteries, it is necessary to detect whether the performance of the battery decreases significantly at a specific temperature range (such as <-30℃), and whether there are safety hazards such as explosion within a certain temperature range; for commonly used chips, it is necessary to determine whether the performance will fail or even burn out and damage when the temperature exceeds a certain range (such as >80℃), and the influence of the change of the amplification factor of the built-in amplifier with temperature on signal processing, these tests all depend on the corresponding high and low temperature test environmental control device.

[0004] In addition, in the field of material characteristic research, the high and low temperature test environmental control device is also crucial. For example, in the temperature characteristic research of resistive materials (such as manganese-copper materials as sampling resistors), it is necessary to detect the current and voltage while controlling the temperature to explore the resistance-temperature characteristic, and the required temperature range for such research is usually -40~120℃; in the phase transition temperature research of materials such as NiTi shape memory alloy, it is necessary to detect displacement and resistance while controlling temperature to study the strain displacement-temperature characteristic and resistance-temperature characteristic, and the required temperature range can reach -40~180℃, or even wider.

[0005] At present, the commonly used temperature control devices on the market mainly include: 1. Devices represented by NiCr resistance wire heating furnace and silicon-carbon rod heating furnace, which can realize temperature control in the range of room temperature to 1600℃. However, the cooling rate is limited, usually adopting furnace cooling method, and due to the large size of the furnace and the wide temperature control range, the highest temperature control precision can only be controlled at >±1℃, and it is impossible to realize low temperature negative temperature range control below room temperature.

[0006] 2. A temperature control method combining a NiCr resistance wire heating furnace and compressor refrigeration is employed. The oil is heated by the resistance wire, and the refrigerant is compressed to lower its temperature. The evaporator temperature is controlled at different times via a valve body to achieve heating and cooling, achieving a temperature control range of -60~120℃. However, this method has a complex structure, and the oil and refrigerant used are prone to environmental pollution. Furthermore, the overall structure, including the compressor, fan, oil pipes, radiator, and condenser, is bulky, generates vibration and noise during operation, and is costly. If resistance or displacement testing is required, auxiliary electrodes are needed, making it difficult to conveniently implement these functions.

[0007] Semiconductor cooling chips, due to their advantages such as no need for refrigerants, continuous operation, no pollution sources, no rotating or sliding parts, no vibration or noise during operation, long lifespan, and easy installation, can be used for temperature control. For example, Chinese invention application CN119283364A discloses a bidirectional temperature uniformity control platform and a bio-3D printer, in which a semiconductor cooling chip and an electric heating film are arranged on the back side of a temperature uniformity plate, and a water-cooled plate is arranged in the receiving cavity, on the side of the semiconductor cooling chip away from the working support plate. By setting up the semiconductor cooling chip and the electric heating film, bidirectional temperature control can be achieved. However, as can be seen from the background technology, this solution, when applied to a bio-3D printer, has a temperature control range of -10 to 60°C. However, when introduced into the test environment control device of this application, the required temperature control range is -40 to 180°C.

[0008] Due to the limitations of its internal structure, the temperature of a thermoelectric cooler typically cannot exceed 120°C. Directly heating it to above 120°C using a similar electric heating film would affect the lifespan of the thermoelectric cooler. Therefore, those skilled in the art would conclude that it is difficult to use thermoelectric coolers to meet testing requirements across a wide temperature range.

[0009] Therefore, developing a wide-range high and low temperature testing environment control device that can achieve precise temperature control from low to high temperatures and has the characteristics of being integrated, pollution-free, and noise-free is key to meeting the needs of materials for wide temperature range, high-precision temperature control, and related property research. Summary of the Invention

[0010] The purpose of this invention is to provide a high and low temperature testing environment control device to solve the problems of existing temperature control devices, such as limited temperature control range, insufficient accuracy, environmental pollution, vibration and noise, complex structure, high cost, and difficulty in conveniently implementing additional testing functions. Specifically, the present application aims to achieve -40~180℃ and wider range of test environment temperature control, meet the aerospace, military, electrical equipment, automotive and other fields of product temperature resistance characteristic test, and the temperature characteristics and phase transition temperature of resistive materials, NiTi shape memory alloy and other materials in the wide temperature range demand; at the same time, ensure higher temperature control accuracy, achieve the effect of precise temperature control; in addition, the device should have an integrated structure, without using oil, refrigerant and other materials that can pollute the environment, no vibration, no noise when working, more environmentally friendly and easy to install; and, can be easily integrated current, voltage, displacement, resistance and other material characteristics detection function, without the aid of additional auxiliary equipment, meet the temperature related characteristics research needs, so as to provide better, efficient high and low temperature test environment control solution for the product testing and material research in related fields.

[0011] To achieve the above-mentioned purposes of the present application, the technical solution adopted by the present application is: a high and low temperature test environment control device, comprising a furnace body, at least one heating assembly, at least one refrigeration assembly, the furnace body has an outer wall, the outer wall surrounds the inner cavity formed by the outer wall to form a test cavity for accommodating samples, the heating part of the heating assembly is located inside the outer wall of the furnace body, and the refrigeration assembly is arranged adjacent to the outside of the outer wall of the furnace body; the refrigeration assembly is mainly composed of a semiconductor refrigeration sheet, a cold end heat conduction copper sheet and a hot end water-cooled copper block; a refrigeration assembly support is provided, the refrigeration assembly is limited by the refrigeration assembly support and the two constitute a sliding connection, a plurality of return springs are provided between the water-cooled copper block and the refrigeration assembly support, a plurality of spring holes are provided on the cold end heat conduction copper sheet, and shape memory alloy springs are installed in the spring holes; under the action of the return springs, the cold end heat conduction copper sheet is tightly attached to the outer wall of the furnace body; when the temperature of the outer wall of the furnace body is higher than the first set temperature, the shape memory alloy springs change phase and elongate, pushing the refrigeration assembly away from the outer wall of the furnace body; when the temperature of the outer wall of the furnace body is lower than the second set temperature, the shape memory alloy springs change phase and shrink, and the cold end heat conduction copper sheet is tightly attached to the outer wall of the furnace body again under the action of the return springs.

[0012] In the above technical solution, the refrigeration assembly can slide on the refrigeration assembly support as a whole, and when refrigerating, the refrigeration assembly is pushed towards the furnace by the return spring, at this time, the shape memory alloy springs retract in the spring holes of the cold end heat conduction copper sheet, so that the heat conduction copper sheet can tightly attach to the outer wall of the furnace, realizing the refrigeration effect. When heating is needed, the heating assembly heats the outer wall of the furnace, when the temperature reaches the first set temperature (for example, 60℃), the shape memory alloy springs begin to change phase and elongate, overcoming the force of the return spring, pushing the refrigeration assembly away from the furnace, and the cold end heat conduction copper sheet is separated, which can prevent the semiconductor refrigeration sheet from being damaged by high temperature. When the temperature drops, when the second set temperature (for example, 40℃) is reached, the shape memory alloy springs begin to change phase and shrink, and the cold end heat conduction copper sheet is tightly attached to the furnace under the action of the return spring, preparing for the next step of low temperature refrigeration.

[0013] In a preferred embodiment, the outer wall of the furnace body is a cuboid, and a circular through hole is provided in the center of the cuboid along its long axis. An upper clamp and a lower clamp are provided at the upper and lower ends of the circular through hole, respectively. The circular through hole portion surrounded by the outer wall of the furnace body, the upper clamp, and the lower clamp constitutes the test chamber.

[0014] In the above technical solution, a cooling component is respectively provided on two opposite sides of the outer wall of the furnace body, and the two cooling components are arranged close to the side of the outer wall of the furnace body; on the other two opposite side walls of the outer wall of the furnace body, a blind hole for installing a heating tube extending along the length of the side wall is opened, and a resistance wire heating tube is placed and fixed inside the hole.

[0015] In the above technical solution, the refrigeration component support is a C-shaped support, with slides extending along the length direction formed at the upper and lower ends of the support; the refrigeration component is adapted to be installed in the C-shaped support and can slide along the upper and lower slides; the opening of the C-shaped support faces the outer wall of the furnace body, and a return spring positioning structure is provided on its back plate to position the plurality of return springs.

[0016] The reset spring positioning structure can be a groove on the back plate of the bracket that corresponds to the reset spring, or a protrusion on the back plate of the bracket that corresponds to the reset spring.

[0017] In a further technical solution, the lower end of the upper clamp and the upper end of the lower clamp are respectively provided with material clamping structures, and the material to be tested is tightened between the upper clamp and the lower clamp. The upper clamp and the lower clamp also serve as lead-out electrodes.

[0018] In a preferred embodiment, a loading device is fixedly connected to the lower end of the lower clamp, and the loading device may be a weight receiving plate.

[0019] A further technical solution involves a weight receiving pan with a smooth bottom surface, equipped with a laser displacement sensor to detect displacement changes in the weight receiving pan. This allows for the deduction of material displacement changes (strain).

[0020] In a preferred embodiment, a stepped groove is formed on the top of the outer wall of the furnace body, and an upper cover fits onto the stepped groove to seal the top of the inner cavity. The upper end of the upper clamp is fixedly connected to the upper cover.

[0021] The high and low temperature testing environment control device provided by this invention can effectively overcome many defects of the prior art and achieve significant technical effects: 1. This invention configures the refrigeration component to slide on the refrigeration component support, and uses a shape memory alloy spring to achieve automatic detachment during heating and automatic contact during cooling, which solves the technical problem that semiconductor refrigeration chips are easily damaged at high temperatures, and enables semiconductor refrigeration technology to be applied to high and low temperature test environment control devices.

[0022] 2. In terms of temperature control range, the device has successfully achieved temperature control of -40~180℃ and wider, fully covering the temperature resistance characteristic testing of products in aerospace, military, electrical equipment, automotive and other fields, as well as the temperature range required for the study of temperature characteristics and phase transition temperature of resistive materials, NiTi shape memory alloys and other materials, providing sufficient temperature range support for various tests and research. 3. In terms of temperature control accuracy, the optimized temperature control mechanism has greatly improved the temperature control accuracy of the device, achieving precise temperature control. It can accurately simulate temperature conditions under extreme environments, ensuring the accuracy and reliability of test and research results. 4. In terms of environmental protection and user experience, the device adopts an integrated structural design, eliminating the need for materials that easily pollute the environment, such as oil and refrigerants, thus avoiding environmental pollution problems at the source. At the same time, it operates without vibration or noise, which not only reduces interference with the testing environment but also improves the ease of installation and comfort of use. 5. In terms of functional integration, the device ingeniously integrates detection functions such as current, voltage, displacement, and resistance, enabling temperature-related characteristic studies to be completed without the need for additional auxiliary equipment. This simplifies the testing process, improves work efficiency, and provides an integrated solution for product testing and material research in related fields, effectively promoting the smooth progress of research work.

[0023] 6. While it's possible to detach the thermoelectric cooler during heating, the conventional approach involves using a microcontroller, temperature sensor, and motor to perform the bonding and separation. This invention, however, conveniently achieves this function using a shape memory alloy spring and a regular spring, offering high efficiency, low cost, smooth operation, and a simple structure. Furthermore, the structure of this invention can be implemented within a small space, something impossible with a microcontroller + temperature sensor + motor system. Attached Figure Description

[0024] Figure 1 This is a structural schematic diagram of an embodiment of the present invention (shape memory alloy spring in elongated state). Figure 2 yes Figure 1 The left view; Figure 3 yes Figure 2 AA section view; Figure 4 yesFigure 1 A top view diagram (excluding the top cover, lead wires, and other accessories). Figure 5 This is a schematic diagram of the resistance wire heating tube in the embodiment; Figure 6 This is a schematic diagram of the cooling component bracket in the embodiment; Figure 7 This is a graph showing the change in resistance of the test material of the comparative test refrigeration chip as a function of temperature in the embodiments; Figure 8 This is a graph showing the change in resistance of the test material as a function of temperature when heated by a heating wire, as described in the embodiment. Figure 9 This is a graph showing the change in resistance of the test material with temperature in an embodiment of the present invention.

[0025] The components are as follows: 1. Furnace body; 2. Circular through hole; 3. Upper clamp; 4. Lower clamp; 5. Outer wall of furnace body; 6. Refrigeration component; 7. Blind hole for heating tube installation; 8. Resistance wire heating tube; 9. Semiconductor refrigeration chip; 10. Cold end heat-conducting copper sheet; 11. Hot end water-cooled copper block; 12. Water inlet; 13. Water outlet; 14. Refrigeration component bracket; 15. Slide rail; 16. Reset spring positioning structure; 17. Reset spring; 18. Shape memory alloy spring; 19. Material to be tested; 20. Weight receiving plate; 21. Laser displacement sensor; 22. Stepped groove; 23. Top cover. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments: Example 1: A high and low temperature testing environment control device, including a furnace body 1, combined with... Figure 1 , Figure 2 , Figure 3 , Figure 4 As can be seen, the outer wall 5 of the furnace body is a cuboid with a square bottom surface. A circular through hole 2 is provided in the center of the cuboid along the long axis. An upper clamp 3 and a lower clamp 4 are provided at the upper and lower ends of the circular through hole 2, respectively. The circular through hole 2, which is surrounded by the outer wall 5 of the furnace body, the upper clamp 3 and the lower clamp 4, constitutes the test chamber.

[0027] On two opposite sides of the outer wall 5 of the furnace body, a refrigeration component 6 is respectively provided; on the other two opposite side walls of the outer wall of the furnace body, a blind hole 7 for installing a heating pipe extending along the length of the side wall is respectively opened (see Figure 4 ), its contents are placed and fixed with resistance wire heating tube 8. Figure 5 This is a schematic diagram of a resistance wire heating tube.

[0028] The refrigeration component 6 mainly consists of a semiconductor refrigeration chip 9, a cold-end heat-conducting copper sheet 10, and a hot-end water-cooled copper block 11. The hot-end water-cooled copper block 11 has a built-in hot water exchange pipe and is equipped with an inlet 12 and an outlet 13. A refrigeration component support 14 is provided, which limits the refrigeration component 6 and allows the refrigeration component 6 to slide within the refrigeration component support 14.

[0029] In this embodiment, as Figure 6 As shown, the refrigeration component support is a C-shaped support, with slide rails 15 extending along its length at both the upper and lower ends. The refrigeration component is fitted and installed within this C-shaped support and can slide along the upper and lower slide rails. The opening of the C-shaped support faces the outer wall 5 of the furnace body, and its back plate is equipped with a return spring positioning structure 16 to position multiple return springs 17. The two return springs shown in the figure are for illustration only; the actual number and distribution of return springs can be determined according to testing requirements.

[0030] like Figure 3 As shown, multiple reset springs 17 are provided between the hot-end water-cooled copper block 11 and the cooling component support 14. Multiple spring holes are provided on the cold-end heat-conducting copper sheet 10, and shape memory alloy springs 18 are installed in the spring holes. Under the action of the reset springs 17, the cold-end heat-conducting copper sheet 10 is tightly attached to the outer wall 5 of the furnace body. When the temperature of the outer wall 5 of the furnace body is higher than the first set temperature (e.g., 60°C), the shape memory alloy spring 18 undergoes a phase change and elongates, pushing the cooling component 6 away from the outer wall 5 of the furnace body. When the temperature of the outer wall of the furnace body is lower than the second set temperature (e.g., 40°C), the shape memory alloy spring 18 undergoes a reverse phase change and contracts, causing the cold-end heat-conducting copper sheet 10 to re-attach tightly to the outer wall 5 of the furnace body.

[0031] The reset spring positioning structure 16 can be a groove on the back plate of the bracket that corresponds to the reset spring, or a protrusion on the back plate of the bracket that corresponds to the reset spring.

[0032] Thus, the cooling assembly can slide as a whole on the cooling assembly support. During cooling, the return spring pushes the cooling assembly towards the furnace body. At this time, the shape memory alloy spring retracts into the spring hole of the cold-end heat-conducting copper sheet, allowing the heat-conducting copper sheet to adhere tightly to the outer wall of the furnace body, achieving the cooling effect. When heating is required, the heating assembly heats the outer wall of the furnace body. When the temperature reaches the first set temperature (e.g., 60°C), the shape memory alloy spring begins to undergo a phase change and elongate, overcoming the force of the return spring and pushing the cooling assembly away from the furnace body. The cold-end heat-conducting copper sheet detaches, preventing high-temperature damage to the semiconductor cooling chip. When the temperature drops and reaches the second set temperature (e.g., 40°C), the shape memory alloy spring begins to undergo a reverse phase change and contract. Under the action of the return spring, the cold-end heat-conducting copper sheet re-adheres tightly to the furnace body, preparing for the next step of low-temperature cooling.

[0033] In this embodiment, material clamping structures are respectively provided at the lower end of the upper clamp 3 and the upper end of the lower clamp 4. The material to be tested 19 is tightened between the upper clamp 3 and the lower clamp 4, and the upper clamp 3 and the lower clamp 4 also serve as lead-out electrodes. At this time, electrical performance testing can be performed.

[0034] In this embodiment, a weight receiving plate 20 is fixedly connected to the lower end of the lower clamp 4. This plate is used to provide counterweight during testing to induce strain and elongation in the material.

[0035] The weight receiving pan 20 has a smooth bottom surface and is equipped with a laser displacement sensor 21 to detect the displacement change of the weight receiving pan. From this, the displacement change (strain) of the material can be deduced.

[0036] In this embodiment, a stepped groove 22 is provided on the top of the outer wall 5 of the furnace body, and an upper cover 23 is adapted to cover the stepped groove 22, which on the one hand seals the top of the inner cavity, and on the other hand fixes the upper clamp 3.

[0037] In a comparative experiment, when using a thermoelectric cooler to test the material, the resistance changes with temperature as follows: Figure 7 As shown, high-temperature testing is limited. When the test material is heated with a heating wire, the resistance changes with temperature as follows: Figure 8 As shown, low-temperature testing is limited. However, when testing materials using the embodiments of this invention, as... Figure 9 As shown, it can perform low-temperature tests that are impossible with heating wire tests, as well as high-temperature tests that are higher than those with cooling pad tests.

Claims

1. A high and low temperature testing environment control device, comprising a furnace body, at least one heating component, and at least one cooling component, wherein the furnace body has an outer wall, and the inner cavity formed by the outer wall is a testing chamber for accommodating a sample, characterized in that: The heating element of the heating assembly is located inside the outer wall of the furnace body, and the cooling assembly is arranged adjacent to the outer side of the outer wall of the furnace body. The cooling assembly mainly consists of a semiconductor cooling chip, a cold-end heat-conducting copper sheet, and a hot-end water-cooled copper block. A cooling assembly support is provided, and the cooling assembly is limited by the cooling assembly support and the two are slidably connected. Multiple return springs are provided between the water-cooled copper block and the cooling assembly support. Multiple spring holes are provided on the cold-end heat-conducting copper sheet, and shape memory alloy springs are installed in the spring holes. Under the action of the return springs, the cold-end heat-conducting copper sheet is in close contact with the outer wall of the furnace body. When the temperature of the outer wall of the furnace body is higher than the first set temperature, the shape memory alloy spring undergoes a phase change and elongates, pushing the cooling assembly away from the outer wall of the furnace body. When the temperature of the outer wall of the furnace body is lower than the second set temperature, the shape memory alloy spring undergoes a reverse phase change and contracts, and under the action of the return springs, the cold-end heat-conducting copper sheet is brought back into close contact with the outer wall of the furnace body.

2. The high and low temperature test environment control device according to claim 1, characterized in that: The outer wall of the furnace body is a cuboid, and a circular through hole is provided in the center of the cuboid along the long axis. An upper clamp and a lower clamp are provided at the upper and lower ends of the circular through hole, respectively. The circular through hole portion surrounded by the outer wall of the furnace body, the upper clamp and the lower clamp constitutes the test chamber.

3. The high and low temperature test environment control device according to claim 2, characterized in that: A cooling component is provided on each of the two opposite sides of the outer wall of the furnace body, and the two cooling components are arranged close to the side of the outer wall of the furnace body. On the other two opposite side walls of the outer wall of the furnace body, a blind hole for installing a heating tube extending along the length of the side wall is opened, and a resistance wire heating tube is placed and fixed inside the hole.

4. The high and low temperature test environment control device according to any one of claims 1 to 3, characterized in that: The refrigeration component support is a C-shaped support, with slides extending along the length direction formed at the upper and lower ends of the support. The refrigeration component is adapted to be installed in the C-shaped support and can slide along the upper and lower slides. The opening of the C-shaped support faces the outer wall of the furnace body, and a return spring positioning structure is provided on its back plate to position the plurality of return springs.

5. The high and low temperature test environment control device according to claim 4, characterized in that: The reset spring positioning structure is a groove on the back plate of the bracket that corresponds to the reset spring.

6. The high and low temperature test environment control device according to claim 4, characterized in that: The reset spring positioning structure is a protrusion on the back plate of the bracket that corresponds to the reset spring.

7. The high and low temperature test environment control device according to claim 2, characterized in that: The upper chuck and the lower chuck are respectively provided with material clamping structures. The material to be tested is pulled between the upper chuck and the lower chuck, and the upper chuck and the lower chuck also serve as lead-out electrodes.

8. The high and low temperature test environment control device according to claim 7, characterized in that: A loading device is fixedly connected to the lower end of the lower clamp.

9. The high and low temperature test environment control device according to claim 8, characterized in that: The weight receiving plate has a smooth bottom surface and is equipped with a laser displacement sensor to detect changes in the displacement of the weight receiving plate.

10. The high and low temperature test environment control device according to claim 1, characterized in that: A stepped groove is provided on the top of the outer wall of the furnace body. An upper cover fits onto the stepped groove to seal the top of the inner cavity. The upper end of the upper clamp is fixedly connected to the upper cover.

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