A reflow soldering temperature control method and system

Abstract

The application provides a reflow soldering temperature control method and system, which is suitable for the technical field of data processing, and the method comprises the following steps: generating target industrial wireless frequency information, target industrial wireless signal transmission power information and target temperature control signal retransmission frequency information according to industrial wireless frequency band information, temperature control signal retransmission frequency information, temperature control information retransmission frequency threshold, in-furnace temperature, reflow soldering temperature control node position information, reflow soldering in-furnace temperature information and reflow soldering in-furnace wireless signal interference intensity information; transmitting the reflow soldering temperature control signal according to the target industrial wireless frequency information, the target industrial wireless signal transmission power information and the target temperature control signal retransmission frequency information, so as to control the reflow soldering temperature through the reflow soldering temperature control signal. The application reduces the packet loss rate and transmission delay of the temperature control signal in a high-temperature strong-interference environment, and guarantees the efficient transmission of the temperature control instruction.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of data processing, and particularly relates to a reflow soldering temperature control method and system. BACKGROUND

[0002] As a main board-level interconnection method in SMT assembly process, reflow soldering is widely used in the electronic industry field.

[0003] In the prior art, a plurality of temperature monitoring points are arranged in the reflow soldering furnace to obtain the temperature information in the furnace, and the heating device is controlled according to the temperature data to ensure that the temperature in the furnace meets a specific reflow soldering temperature curve.

[0004] However, it is difficult to accurately control the temperature in the furnace, and temperature fluctuations often occur, which causes the temperature during welding to not reach the minimum temperature required for welding or to exceed the appropriate range, resulting in problems such as false welding, cold welding, and blackened solder joints. At the same time, in the complex furnace environment, it is difficult to ensure the stable transmission and accurate control of the key parameters during the welding process, so that the temperature control command cannot be timely and accurately issued, affecting the welding effect, and thus causing welding defects such as component false welding, monument, tin bead, part falling, and tin cracking. SUMMARY

[0005] Therefore, the embodiments of the present application provide a reflow soldering temperature control method and system, aiming to solve the problems of inaccurate control of the temperature in the reflow soldering furnace and unstable transmission of the temperature control signal in the complex furnace environment in the prior art.

[0006] The first aspect of the embodiments of the present application provides a reflow soldering temperature control method, comprising:

[0007] obtaining a plurality of reflow soldering temperature control node position information, a plurality of reflow soldering furnace temperature information, a plurality of reflow soldering furnace wireless signal interference intensity information, industrial wireless frequency band information, and industrial wireless signal transmission power range information; the plurality of reflow soldering temperature control node position information corresponds one-to-one to the plurality of reflow soldering furnace temperature information and the plurality of reflow soldering furnace wireless signal interference intensity information;

[0008] According to a preset number of reflow soldering temperature intervals, the plurality of reflow soldering temperature control node position information, the plurality of reflow soldering furnace temperature information, and the plurality of reflow soldering furnace wireless signal interference intensity information are associated with feature construction and division processing to generate a plurality of furnace temperature and wireless signal state associated feature set information;

[0009] generate a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information and a plurality of initial temperature control information retransmission times information according to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, a plurality of randomly generated temperature control signal retransmission times information and a preset temperature control information retransmission times threshold value;

[0010] generate a plurality of target industrial wireless frequency information, a plurality of target industrial wireless signal transmission power information and a plurality of target temperature control signal retransmission times information according to the plurality of furnace temperature and wireless signal state association feature set information, the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, the plurality of initial temperature control signal retransmission times information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission times threshold value;

[0011] transmit a plurality of reflow solder temperature control signals according to the plurality of target industrial wireless frequency information, the plurality of target industrial wireless signal transmission power information and the plurality of target temperature control signal retransmission times information, and control reflow solder temperature through the plurality of reflow solder temperature control signals.

[0012] A second aspect of the embodiment of the application provides a reflow solder temperature control system, comprising:

[0013] An information acquisition module is configured to acquire a plurality of reflow solder temperature control node position information, a plurality of reflow solder furnace temperature information, a plurality of reflow solder furnace wireless signal interference intensity information, industrial wireless frequency band information and industrial wireless signal transmission power range information; the plurality of reflow solder temperature control node position information corresponds to the plurality of reflow solder furnace temperature information and the plurality of reflow solder furnace wireless signal interference intensity information one by one;

[0014] A furnace temperature and wireless signal state association feature set information generation module is configured to generate a plurality of furnace temperature and wireless signal state association feature set information by performing association feature construction and division processing on the plurality of reflow solder temperature control node position information, the plurality of reflow solder furnace temperature information and the plurality of reflow solder furnace wireless signal interference intensity information according to a preset reflow solder temperature interval number;

[0015] An initial reflow soldering temperature control signal transmission parameter generation module is configured to generate a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information, and a plurality of initial temperature control information retransmission times information according to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, a plurality of randomly generated temperature control signal retransmission times information, and a preset temperature control information retransmission times threshold.

[0016] A target reflow soldering temperature control signal transmission parameter generation module is configured to generate a plurality of target industrial wireless frequency information, a plurality of target industrial wireless signal transmission power information, and a plurality of target temperature control signal retransmission times information according to the plurality of furnace temperature and wireless signal state association feature set information, the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, the plurality of initial temperature control signal retransmission times information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, and the preset temperature control information retransmission times threshold.

[0017] A reflow soldering temperature control module is configured to perform transmission processing on a plurality of reflow soldering temperature control signals according to the plurality of target industrial wireless frequency information, the plurality of target industrial wireless signal transmission power information, and the plurality of target temperature control signal retransmission times information, so as to control reflow soldering temperature through the plurality of reflow soldering temperature control signals.

[0018] A third aspect of the embodiments of the present application provides a terminal device, which comprises a memory and a processor, the memory stores a computer program capable of running on the processor, and the processor implements the steps of the reflow soldering temperature control method in the first aspect described above when executing the computer program.

[0019] A fourth aspect of the embodiments of the present application provides a computer readable storage medium, which comprises a computer program stored therein, and the computer program is executed by a processor to implement the steps of the reflow soldering temperature control method in the first aspect described above.

[0020] Compared with the prior art, the beneficial effects of the embodiments of the present application are that: the present application establishes the correspondence relationship of the reflow soldering temperature control node position information, the reflow soldering furnace temperature information and the reflow soldering furnace wireless signal interference intensity information, realizes the comprehensive perception of the three-dimensional environment in the reflow soldering furnace, avoids that the single dimension data cannot reflect the communication environment difference, transmits and processes the reflow soldering temperature control signal through the multiple optimized wireless communication parameters, ensures that the signal loss rate is reduced and the delay is shortened in the high-temperature strong interference environment, enables each temperature control node to accurately receive the instruction, enables the temperature of each area in the furnace to strictly follow the preheating-constant temperature-reflow-cooling process curve, thereby improving the welding yield, reducing the equipment downtime and material waste caused by communication failure, and improving the industrial production efficiency and stability. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is an implementation flow diagram of the reflow soldering temperature control method provided by the first embodiment of the present application;

[0023] Figure 2 is an implementation flow diagram of the reflow soldering temperature control method provided by the second embodiment of the present application;

[0024] Figure 3 is an implementation flow diagram of the reflow soldering temperature control method provided by the third embodiment of the present application;

[0025] Figure 4 is an implementation flow diagram of the reflow soldering temperature control method provided by the fourth embodiment of the present application;

[0026] Figure 5 is an implementation flow diagram of the reflow soldering temperature control method provided by the fifth embodiment of the present application;

[0027] Figure 6 is an implementation flow diagram of the reflow soldering temperature control method provided by the sixth embodiment of the present application;

[0028] Figure 7 is an implementation flow diagram of the reflow soldering temperature control method provided by the seventh embodiment of the present application;

[0029] Figure 8 is a structure diagram of the reflow soldering temperature control system provided by the embodiments of the present application;

[0030] Figure 9is a schematic diagram of a terminal device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0031] In the following description, for the purpose of explanation and not limitation, specific details are set forth, such as particular system configurations, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0032] In order to illustrate the technical solutions described in the present application, the following will be described by specific embodiments.

[0033] Figure 1 An implementation flowchart of the reflow soldering temperature control method provided by Embodiment One of the present application is shown, and is described in detail as follows:

[0034] In step S101, a plurality of reflow soldering temperature control node position information, a plurality of reflow soldering furnace temperature information, a plurality of reflow soldering furnace wireless signal interference intensity information, industrial wireless frequency band information, and industrial wireless signal transmission power range information are acquired; the plurality of reflow soldering temperature control node position information corresponds one-to-one to the plurality of reflow soldering furnace temperature information and the plurality of reflow soldering furnace wireless signal interference intensity information.

[0035] In the present embodiment, the reflow soldering temperature control node position information can refer to the specific spatial coordinate information of all hardware nodes (such as temperature sensors, control modules, etc.) in the furnace for collecting and transmitting temperature data and executing temperature control instructions, covering the position parameters in the furnace length direction, the furnace width direction, and the vertical height. These positions directly determine the furnace environment (such as different functional areas such as preheating area, reflow area, cooling area, etc.) where the nodes are located. The reflow soldering temperature control node position information bound to the unique identification of the nodes can be acquired by establishing a three-dimensional coordinate system with the furnace body inlet as the origin during the installation and debugging stage of the reflow soldering furnace, positioning and marking each temperature control node, recording the coordinate data, and storing it.

[0036] The reflow soldering furnace temperature information can refer to the real-time temperature data at different positions in the reflow soldering furnace, which can reflect the thermal field distribution of each area in the furnace, including the preheating area temperature, the constant temperature area temperature, the reflow area peak temperature, the cooling area temperature, etc., and corresponds one-to-one to the corresponding reflow soldering temperature control node position. It can be acquired by deploying temperature sensors at key positions in the furnace and collecting and transmitting real-time data at a specific sampling frequency.

[0037] The wireless signal interference intensity information in the reflow soldering furnace can refer to the data of the strength of electromagnetic interference on the wireless communication channel at different positions in the reflow soldering furnace, usually in decibel-milliwatts (dBm), the lower the value, the stronger the interference, which corresponds to the position of the reflow soldering temperature control node and the temperature information in the furnace, and is used to reflect the severity of the wireless communication environment at each node. The background noise intensity and interference signal power at the position can be monitored in real time by the wireless communication module built-in the temperature control node, and the interference intensity value can be obtained after calculation and processing, and uploaded with the temperature data for acquisition.

[0038] The industrial wireless frequency band information can refer to specific frequency range information suitable for wireless communication in industrial environments. These frequency bands need to comply with national radio management regulations and can stably transmit data in high-temperature and high-electromagnetic interference industrial scenarios. For example, the frequency bands commonly used in industrial Internet of Things, such as 433MHz, 868MHz, 2.4GHz, and their subdivided channel ranges, can be extracted from the technical parameters of the wireless communication module based on industry standards and device hardware support, or obtained by querying the industrial wireless frequency band division file published by the national radio management agency.

[0039] The industrial wireless signal transmission power range information can refer to the range between the minimum and maximum values of the transmission power that the wireless communication module of the temperature control node can output. This range is constrained by hardware performance, power consumption, and electromagnetic compatibility standards. For example, the transmission power range of a certain module can be 5dBm to 20dBm. The adjustable interval of the rated transmission power can be read from the technical specification of the wireless communication module, or the effective power range of the module under the premise of ensuring communication stability and meeting power consumption requirements can be determined through actual testing.

[0040] In step S102, according to the pre-set number of reflow soldering temperature intervals, the multiple reflow soldering temperature control node position information, multiple reflow soldering furnace temperature information, and multiple reflow soldering furnace wireless signal interference intensity information are associated and processed to generate multiple furnace temperature and wireless signal state association feature set information.

[0041] In the embodiment, the preset reflow soldering temperature interval quantity can be artificially set, and can be artificially set as four temperature intervals according to the four stages of preheating, constant temperature, reflow and cooling commonly used in the reflow soldering process. The single reflow soldering furnace temperature information and the single reflow soldering furnace wireless signal interference intensity information corresponding to the single reflow soldering temperature control node position information can be bound and the three-dimensional correlation characteristics of the reflow soldering temperature control node position information, the reflow soldering furnace temperature information and the reflow soldering furnace wireless signal interference intensity information can be constructed. Then, according to the temperature range threshold corresponding to the preset reflow soldering temperature interval quantity, the three-dimensional correlation characteristics of all reflow soldering temperature control node positions are classified, the three-dimensional correlation characteristics of the reflow soldering furnace temperature information in the same reflow soldering temperature interval are classified into one category, and finally the multiple reflow soldering temperature control node position information, the multiple reflow soldering furnace temperature information and the multiple reflow soldering furnace wireless signal interference intensity information in each category are integrated. The distribution range of the reflow soldering temperature control node position information, the average value and the fluctuation range of the reflow soldering furnace temperature information and the average value and the change trend of the reflow soldering furnace wireless signal interference intensity information in each category are counted, the furnace temperature and wireless signal state correlation characteristic set information corresponding to each category is formed, and finally the multiple furnace temperature and wireless signal state correlation characteristic set information consistent with the preset reflow soldering temperature interval quantity is generated.

[0042] In step S103, according to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, the multiple randomly generated temperature control signal retransmission times information and the preset temperature control information retransmission times threshold, multiple initial industrial wireless frequency information, multiple initial industrial wireless signal transmission power information and multiple initial temperature control information retransmission times information are generated.

[0043] In the embodiment, the preset industrial wireless frequency point interval information can be artificially set, and can be set in combination with the industrial wireless frequency band information coverage range and communication anti-interference requirement. For example, if the industrial wireless frequency band information is 433 MHz to 435 MHz, to avoid adjacent frequency point signal interference and ensure moderate frequency point quantity, the preset industrial wireless frequency point interval information can be set as 200 kHz, that is, starting from 433 MHz, a frequency point is selected every 200 kHz, and 11 frequency points are generated in total, which covers the range corresponding to the entire industrial wireless frequency band information and ensures small interference between the frequency points. The preset industrial wireless signal transmission power adjustment interval information can be artificially set, and the balance between power adjustment precision and parameter combination quantity can be considered. If the industrial wireless signal transmission power range information is 10 dBm to 20 dBm, to ensure adjustment precision while avoiding excessive parameters to increase calculation amount, the preset industrial wireless signal transmission power adjustment interval information can be set as 2 dBm, that is, starting from 10 dBm, a power value is selected every 2 dBm, and 6 power values are generated in total, so as to balance adjustment flexibility and calculation efficiency. The preset temperature control information retransmission times threshold value can be artificially set, and the temperature control real-time requirement and communication reliability requirement can be comprehensively considered. If the reflow soldering temperature control requires that the signal transmission delay requirement is not more than 100 ms, and the single signal transmission time consumption is about 20 ms, to avoid excessive retransmission times to cause delay exceeding the standard, the preset temperature control information retransmission times threshold value can be set as 3 times, and the total time consumption is not more than 80 ms, so as to improve the communication success rate through limited retransmission, and ensure to meet the real-time requirement of the reflow soldering temperature control.

[0044] The initial industrial wireless frequency information can be obtained by starting from the initial frequency value corresponding to the industrial wireless frequency band information, and sequentially extracting or calculating the frequency values meeting the interval requirement according to the interval size set by the preset industrial wireless frequency point interval information. Each frequency value meeting the requirement is an independent initial industrial wireless frequency information. The extraction or calculation is continued until the entire frequency range contained in the industrial wireless frequency band information is covered, so as to obtain a plurality of initial industrial wireless frequency information. Then, according to the industrial wireless signal transmission power range information, the minimum value and the maximum value range of the industrial wireless signal transmission power defined by the information are determined, and the preset industrial wireless signal transmission power adjustment interval information is combined. Starting from the minimum transmission power value corresponding to the industrial wireless signal transmission power range information, the transmission power values meeting the interval requirement are sequentially extracted or calculated according to the adjustment interval size set by the preset industrial wireless signal transmission power adjustment interval information. Each transmission power value meeting the requirement is an independent initial industrial wireless signal transmission power information. The entire power interval contained in the industrial wireless signal transmission power range information is covered to generate a plurality of initial industrial wireless signal transmission power information. Then, a plurality of temperature control signal retransmission times values can be generated according to a random generation rule. For each randomly generated temperature control signal retransmission times value, the preset temperature control information retransmission times threshold is compared, and the temperature control signal retransmission times values less than or equal to the preset temperature control information retransmission times threshold are selected. Each selected value is an initial temperature control information retransmission times information, so as to generate a plurality of initial temperature control information retransmission times information.

[0045] In step S104, according to the plurality of furnace temperature and wireless signal state association feature set information, the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, the plurality of initial temperature control signal retransmission times information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, and the preset temperature control information retransmission times threshold, the plurality of target industrial wireless frequency information, the plurality of target industrial wireless signal transmission power information, and the plurality of target temperature control signal retransmission times information are generated.

[0046] In the present embodiment, the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, the plurality of initial temperature control signal retransmission times information can be combined two by two or three, to construct a plurality of groups of initial parameter combinations containing "initial industrial wireless frequency information-initial industrial wireless signal transmission power information-initial temperature control signal retransmission times information", and then for each group of initial parameter combinations containing initial industrial wireless frequency information, initial industrial wireless signal transmission power information, initial temperature control signal retransmission times information, combined with the corresponding in-furnace temperature and wireless signal state association feature set information of the plurality of reflow solder temperature control node position information, the plurality of reflow solder in-furnace temperature information, the plurality of reflow solder in-furnace wireless signal interference intensity information, determine the transmission environment corresponding to the initial parameter combination, that is, the specific reflow solder temperature control node position, the reflow solder in-furnace temperature at this position, the reflow solder in-furnace wireless signal interference intensity at this position, in this transmission environment, by means of simulation transmission or actual transmission, a predetermined number of reflow solder temperature control signals are sent, and key data in the transmission process is recorded, including the number of successfully received reflow solder temperature control signals, the time required to transmit each reflow solder temperature control signal, the number of reflow solder temperature control signals with signal loss or error, then the key indicators can be calculated according to the recorded data, such as the proportion of the number of successfully received reflow solder temperature control signals to the total number of transmissions, the average and maximum values of all reflow solder temperature control signal transmission times, the proportion of the number of reflow solder temperature control signals with signal loss or error to the total number of transmissions, and then the calculated key indicators are compared with the preset transmission effect standard, such as the successful reception ratio not less than 98%, the average transmission time not more than 100 milliseconds, and the signal loss or error ratio not more than 2%, if all key indicators meet the preset standard, it is determined that the transmission effect of the initial parameter combination in the corresponding environment meets the standard, if there is a key indicator that does not meet the preset standard, it is determined that the transmission effect of the initial parameter combination does not meet the standard.For the initial parameter combination with poor effect, new industrial wireless frequency information can be obtained by adjusting the multiple initial industrial wireless frequency information according to the preset industrial wireless frequency interval information, new industrial wireless signal transmission power information can be obtained by adjusting the multiple initial industrial wireless signal transmission power information according to the preset industrial wireless signal transmission power adjustment interval information, and new temperature control signal retransmission number information can be obtained by adjusting the multiple initial temperature control signal retransmission number information within the range of not exceeding the preset temperature control information retransmission number threshold, thereby forming a new parameter combination, and then reanalyzing the transmission effect of the new parameter combination under the corresponding environment, and repeating the adjustment process until the transmission effect of the parameter combination reaches the expectation; finally, the industrial wireless frequency information in the parameter combination reaching the expected effect is determined as the target industrial wireless frequency information, the industrial wireless signal transmission power information is determined as the target industrial wireless signal transmission power information, and the temperature control signal retransmission number information is determined as the target temperature control signal retransmission number information, and finally multiple target industrial wireless frequency information, multiple target industrial wireless signal transmission power information and multiple target temperature control signal retransmission number information corresponding to the multiple in-furnace temperature and wireless signal state association feature set information are generated.

[0047] Step S105, according to the multiple target industrial wireless frequency information, multiple target industrial wireless signal transmission power information and multiple target temperature control signal retransmission number information, the multiple reflow soldering temperature control signals are transmitted and processed to control the reflow soldering temperature through the multiple reflow soldering temperature control signals.

[0048] In the embodiment, the target industrial wireless frequency information, the target industrial wireless signal transmission power information, and the target temperature control signal retransmission number information corresponding to each reflow soldering temperature control node can be determined according to the multiple target industrial wireless frequency information, the multiple target industrial wireless signal transmission power information, and the multiple target temperature control signal retransmission number information corresponding to the set of features associated with the wireless signal state of each furnace temperature.

[0049] The reflow soldering temperature control method provided by the embodiment of the application can realize comprehensive perception of the three-dimensional environment in the reflow soldering furnace by establishing the corresponding relationship among the reflow soldering temperature control node position information, the reflow soldering furnace temperature information, and the reflow soldering furnace wireless signal interference intensity information, avoid the situation that a single dimension data cannot reflect the difference in the communication environment, and ensure that the signal packet loss rate is reduced and the delay is shortened in a high-temperature strong-interference environment by transmitting and processing the reflow soldering temperature control signal through multiple optimized wireless communication parameters, so that each temperature control node can accurately receive the instruction, the temperature in each area in the furnace strictly follows the preheating-constant temperature-reflow-cooling process curve, the welding yield is improved, the equipment downtime and material waste caused by communication failure are reduced, and the industrial production efficiency and stability are improved.

[0050] Figure 2 An implementation flowchart of the reflow soldering temperature control method provided by the second embodiment of the application is shown, which is different from the first embodiment in that the step S102 specifically includes:

[0051] In step S201, the maximum reflow soldering furnace temperature information, the minimum reflow soldering furnace temperature information, and the reflow soldering furnace temperature range information are calculated according to the multiple reflow soldering furnace temperature information.

[0052] In the embodiment, the reflow furnace temperature maximum value information refers to the highest temperature value selected from the plurality of reflow furnace temperature information, the reflow furnace temperature minimum value information refers to the lowest temperature value selected from the plurality of reflow furnace temperature information, and the reflow furnace temperature range information refers to the difference between the reflow furnace temperature maximum value information and the reflow furnace temperature minimum value information. Specifically, all the plurality of reflow furnace temperature information can be collected first, and then the reflow furnace temperature maximum value information is determined to be 250 DEG C, the reflow furnace temperature minimum value information is determined to be 150 DEG C, and finally the reflow furnace temperature range information is calculated to be 250 DEG C-150 DEG C=100 DEG C.

[0053] In step S202, the plurality of reflow furnace temperature information is structured according to the reflow furnace temperature maximum value information, the reflow furnace temperature minimum value information, and the reflow furnace temperature range information, to obtain a plurality of reflow furnace temperature structured information.

[0054] In the embodiment, each reflow furnace temperature information can be combined with the information of two dimensions of "temperature interval attribution" and "relative temperature proportion" to form structured data containing original temperature value, interval label, and relative proportion, i.e. the plurality of reflow furnace temperature structured information. Specifically, the temperature range can be evenly divided according to the reflow furnace temperature range information 100 DEG C and the preset number of reflow furnace temperature intervals, and the temperature span of each interval is 100 DEG C÷4=25 DEG C, i.e. the preheating interval is 150 DEG C-175 DEG C, the constant temperature interval is 175 DEG C-200 DEG C, the reflow interval is 200 DEG C-225 DEG C, and the cooling interval. Then, for each reflow furnace temperature information, the temperature interval to which it belongs is determined and the interval label is marked, and the proportion of the temperature value relative to the reflow furnace temperature range information is calculated, for example, the relative proportion of 150 DEG C is (150 DEG C-150 DEG C)÷100 DEG C=0%, and the relative proportion of 250 DEG C is (250 DEG C-150 DEG C)÷100 DEG C=100%. Finally, each reflow furnace temperature information is converted into a structured form of "original temperature value-interval label-relative proportion", for example, the reflow furnace temperature structured information corresponding to 220 DEG C is 220 DEG C-reflow zone-70%.

[0055] In step S203, the reflow furnace wireless signal interference strength maximum value information, the reflow furnace wireless signal interference strength minimum value information, and the reflow furnace wireless signal interference strength range information are calculated according to the plurality of reflow furnace wireless signal interference strength information.

[0056] In the embodiment, the maximum value information of the wireless signal interference intensity in the reflow soldering furnace refers to the highest value selected from the multiple wireless signal interference intensity information in the reflow soldering furnace, the minimum value information of the wireless signal interference intensity in the reflow soldering furnace refers to the lowest value selected from the multiple wireless signal interference intensity information in the reflow soldering furnace, and the range information of the wireless signal interference intensity in the reflow soldering furnace refers to the difference between the maximum value information of the wireless signal interference intensity in the reflow soldering furnace and the minimum value information of the wireless signal interference intensity in the reflow soldering furnace. Specifically, all the multiple wireless signal interference intensity information in the reflow soldering furnace can be collected first, and then the maximum value information of the wireless signal interference intensity in the reflow soldering furnace is determined to be -50 dBm, the minimum value information of the wireless signal interference intensity in the reflow soldering furnace is determined to be -75 dBm, and finally the range information of the wireless signal interference intensity in the reflow soldering furnace is calculated to be -50 dBm-(-75 dBm)=25 dBm through comparison.

[0057] In step S204, the multiple wireless signal interference intensity information in the reflow soldering furnace is standardized according to the maximum value information of the wireless signal interference intensity in the reflow soldering furnace, the minimum value information of the wireless signal interference intensity in the reflow soldering furnace, and the range information of the wireless signal interference intensity in the reflow soldering furnace, to obtain multiple wireless signal interference intensity standardized information in the reflow soldering furnace.

[0058] In the embodiment, each wireless signal interference intensity information in the reflow soldering furnace can be mapped to a value interval of 0-1 to eliminate the dimensional difference of the original data, and multiple wireless signal interference intensity standardized information in the reflow soldering furnace is obtained. Specifically, a linear normalization method can be used, the minimum value information of the wireless signal interference intensity in the reflow soldering furnace is taken as the lower limit, the maximum value information of the wireless signal interference intensity in the reflow soldering furnace is taken as the upper limit, and the standardization formula logic is (certain interference intensity information-interference intensity minimum value information)÷interference intensity range information. Then, specific data is calculated, for example, for the interference intensity of -65 dBm, the standardization calculation process is (-65 dBm-(-75 dBm))÷25 dBm=10 dBm÷25 dBm=0.4, that is, the wireless signal interference intensity standardized information in the reflow soldering furnace corresponding to the interference intensity is 0.4; for the interference intensity of -50 dBm, the calculation process is (-50 dBm-(-75 dBm))÷25 dBm=25 dBm÷25 dBm=1.0, and the standardized information is 1.0; for the interference intensity of -75 dBm, the calculation process is (-75 dBm-(-75 dBm))÷25 dBm=0 dBm÷25 dBm=0.0, so that all the wireless signal interference intensity information in the reflow soldering furnace is converted into standardized values in the interval of 0-1, which is convenient for subsequent correlation analysis with the temperature structured information.

[0059] Step S205, generating a plurality of in-furnace temperature and wireless signal state association characteristic information according to the plurality of reflow soldering temperature control node position information, the plurality of reflow soldering in-furnace temperature structured information, and the plurality of reflow soldering in-furnace wireless signal interference intensity standardized information.

[0060] In the embodiment, the single reflow soldering temperature control node position information can be taken as a core link to bind the single reflow soldering in-furnace temperature structured information and the single reflow soldering in-furnace wireless signal interference intensity standardized information corresponding to the position to form a characteristic unit containing the three-dimensional information of “position-temperature structure-interference standardization”. Specifically, the unique identifier of each reflow soldering temperature control node position information can be determined first, and then the reflow soldering in-furnace temperature structured information and the reflow soldering in-furnace wireless signal interference intensity standardized information corresponding to the position are found, and finally the three are integrated into a group of association characteristic information, for example, the in-furnace temperature and wireless signal state association characteristic information corresponding to node 5-reflow zone center: 250℃-reflow zone-100%, interference standardization 0.0.

[0061] Step S206, dividing and processing the plurality of in-furnace temperature and wireless signal state association characteristic information according to the preset number of reflow soldering temperature intervals to generate a plurality of in-furnace temperature and wireless signal state association characteristic set information.

[0062] In the embodiment, the preset number of reflow soldering temperature intervals can be 4. The characteristic information can be classified according to the “interval label” in the temperature structured information according to the preset number of reflow soldering temperature intervals and the corresponding interval range to generate a plurality of in-furnace temperature and wireless signal state association characteristic set information. The “interval label” of the temperature structured information in each characteristic information can be extracted by traversing all the in-furnace temperature and wireless signal state association characteristic information, and then the characteristic information with the same label is classified into a group, for example, all the characteristic information containing the “preheating zone” label is integrated into the preheating zone in-furnace temperature and wireless signal state association characteristic set information, and the characteristic set information corresponding to the constant temperature zone, the reflow zone, and the cooling zone is generated in the same way; the distribution number of the reflow soldering temperature control node position information in the interval, the average relative proportion of the reflow soldering in-furnace temperature structured information, and the average value of the reflow soldering in-furnace wireless signal interference intensity standardized information in each set also need to be counted, for example, the average value of the interference standardization in the reflow zone set is 0.2, and finally four in-furnace temperature and wireless signal state association characteristic set information with complete structure and unified attributes are formed.

[0063] The reflow soldering temperature control method provided by the embodiment of the present application can effectively avoid the correlation deviation caused by the non-uniform data format, provide more accurate input for subsequent generation of multiple target industrial wireless frequency information, multiple target industrial wireless signal transmission power information, and multiple target temperature control signal retransmission times information, thereby improving the stability and reliability of multiple reflow soldering temperature control signal transmission, reducing signal packet loss and delay in a high-temperature strong interference environment, ensuring that the temperature in each area of the reflow soldering furnace strictly follows the process curve, and improving the welding yield and production efficiency, and reducing equipment downtime and material waste caused by communication failure.

[0064] Figure 3 The implementation flowchart of the reflow soldering temperature control method provided by the embodiment three of the present application is shown, which is different from the above-mentioned embodiment two in that the step S206 specifically includes:

[0065] In step S301, according to the preset number of reflow soldering temperature intervals, the multiple furnace temperature and wireless signal state correlation characteristic information is randomly extracted to obtain multiple extracted furnace temperature and wireless signal state correlation characteristic information.

[0066] In the embodiment, the preset number of reflow soldering temperature intervals can be artificially set and can be 4. The extraction number can be determined by dividing the total number of furnace temperature and wireless signal state correlation characteristic information by the number of reflow soldering temperature intervals, for example, if the total number of furnace temperature and wireless signal state correlation characteristic information is 40, then the extraction number is 40÷4=10, that is, 10 are randomly extracted from the 40 furnace temperature and wireless signal state correlation characteristic information as multiple extracted furnace temperature and wireless signal state correlation characteristic information.

[0067] In step S302, according to the multiple furnace temperature and wireless signal state correlation characteristic information and the multiple extracted furnace temperature and wireless signal state correlation characteristic information, multiple remaining furnace temperature and wireless signal state correlation characteristic information is obtained.

[0068] In the embodiment, the 10 extracted furnace temperature and wireless signal state correlation characteristic information can be excluded from the total set of multiple furnace temperature and wireless signal state correlation characteristic information, and the remaining 30 characteristic information is the multiple remaining furnace temperature and wireless signal state correlation characteristic information.

[0069] Step S303, calculate the Euclidean distance of the plurality of extracted furnace temperature and wireless signal state associated feature information and the plurality of remaining furnace temperature and wireless signal state associated feature information, and obtain a plurality of furnace temperature and wireless signal state associated feature distance information.

[0070] In this embodiment, based on the reflow soldering furnace temperature structured information and the reflow soldering furnace wireless signal interference intensity standardized information, each feature information can be converted into two-dimensional data of "relative temperature proportion-interference standardized value", and the spatial distance between the remaining feature information and each extracted feature information is calculated to obtain a plurality of furnace temperature and wireless signal state associated feature distance information. For example, the quantitative index of a certain remaining feature information is relative temperature proportion 20% and interference standardized value 0.7, and the quantitative index of a certain extracted feature information is relative temperature proportion 0% and interference standardized value 0.8. Through the Euclidean distance calculation logic, the corresponding furnace temperature and wireless signal state associated feature distance information of this group is obtained. The spatial distance between all 30 remaining feature information and 10 extracted feature information is calculated one by one, and finally 30x10=300 furnace temperature and wireless signal state associated feature distance information is generated.

[0071] Step S304, according to the plurality of extracted furnace temperature and wireless signal state associated feature information and the plurality of furnace temperature and wireless signal state associated feature distance information, the plurality of remaining furnace temperature and wireless signal state associated feature information is divided and processed to obtain a plurality of furnace temperature and wireless signal state associated feature grouping information; the furnace temperature and wireless signal state associated feature grouping information includes a plurality of furnace temperature and wireless signal state associated feature elements.

[0072] In this embodiment, the 10 extracted furnace temperature and wireless signal state associated feature information can be divided into 4 groups according to the preset reflow soldering temperature interval number, and then for each remaining feature information, find the minimum value of the plurality of furnace temperature and wireless signal state associated feature distance information of the 4 groups of extracted feature information, and the remaining feature information is classified into the group corresponding to the minimum value. Until all 30 remaining feature information is allocated to 4 groups, finally 4 furnace temperature and wireless signal state associated feature grouping information is obtained, each group contains a plurality of furnace temperature and wireless signal state associated feature elements, and each group corresponds to a preset reflow soldering temperature interval. The furnace temperature and wireless signal state associated feature elements can be node information with similar environmental characteristics in the reflow soldering temperature interval.

[0073] Step S305, according to the plurality of furnace temperature and wireless signal state associated feature elements corresponding to the plurality of furnace temperature and wireless signal state associated feature grouping information, a plurality of furnace temperature and wireless signal state associated feature grouping center information is obtained.

[0074] In the embodiment, the multiple group center information of the in-furnace temperature and wireless signal state correlation characteristic can refer to the average value of all in-furnace temperature and wireless signal state correlation characteristic elements in each group, and the two-dimensional coordinates of the center can be obtained by averaging the "relative temperature proportion" and "interference standardized value" of all elements in the group, respectively, so as to calculate the center information of the four groups, and obtain the four group center information of the in-furnace temperature and wireless signal state correlation characteristic.

[0075] In step S306, the difference between the multiple group center information of the in-furnace temperature and wireless signal state correlation characteristic and the multiple extracted in-furnace temperature and wireless signal state correlation characteristic information is calculated to obtain the multiple group difference information of the in-furnace temperature and wireless signal state correlation characteristic.

[0076] In the embodiment, the "relative temperature proportion" and "interference standardized value" of the in-furnace temperature and wireless signal state correlation characteristic group information corresponding to the in-furnace temperature and wireless signal state correlation characteristic group center information are subtracted from the corresponding indicators of the multiple extracted in-furnace temperature and wireless signal state correlation characteristic information in the group, respectively, and the absolute value is taken to obtain the difference, so as to obtain 4 groups x the number of extracted characteristic information in each group = 10 in-furnace temperature and wireless signal state correlation characteristic group difference information, and each difference information reflects the deviation degree of the extracted characteristic information from the group center.

[0077] In step S307, the mean value of the multiple in-furnace temperature and wireless signal state correlation characteristic group difference information is calculated to obtain the in-furnace temperature and wireless signal state correlation characteristic group difference mean value information.

[0078] In the embodiment, the "relative temperature proportion difference" and "interference standardized value difference" in the 10 in-furnace temperature and wireless signal state correlation characteristic group difference information are summed up, respectively, and then divided by the total number of difference information to obtain the mean value of the two types of indicators, and then the arithmetic mean value of the two is taken as the in-furnace temperature and wireless signal state correlation characteristic group difference mean value information, which is used to reflect the average deviation degree of all extracted characteristic information from the corresponding group center.

[0079] In step S308, it is judged whether the in-furnace temperature and wireless signal state correlation characteristic group difference mean value information is less than a preset in-furnace temperature and wireless signal state correlation characteristic group difference mean value threshold; if yes, step S309 is entered; if no, step S310 is entered.

[0080] In the embodiment, the preset in-furnace temperature and wireless signal state correlation characteristic grouping difference mean threshold value can be artificially set, can be set in combination with the requirement of in-furnace grouping precision of reflow soldering temperature control, can be 10% of the temperature range and the interference range as the upper limit of the deviation, that is, the upper limit of the temperature deviation is 10%, the upper limit of the interference deviation is 10%, and 10% of the mean of the two is taken as the threshold value, that is, (10%+0.1)÷2×10%=0.01, so that the preset in-furnace temperature and wireless signal state correlation characteristic grouping difference mean threshold value is artificially set to 0.01. The in-furnace temperature and wireless signal state correlation characteristic grouping difference mean information can be compared with the preset in-furnace temperature and wireless signal state correlation characteristic grouping difference mean threshold value.

[0081] In step S309, the plurality of in-furnace temperature and wireless signal state correlation characteristic grouping information is taken as a plurality of in-furnace temperature and wireless signal state correlation characteristic set information.

[0082] In the embodiment, when the in-furnace temperature and wireless signal state correlation characteristic grouping difference mean information is less than the preset in-furnace temperature and wireless signal state correlation characteristic grouping difference mean threshold value, it is indicated that the plurality of in-furnace temperature and wireless signal state correlation characteristic grouping information has been stabilized, the environment in the same group is similar, the environment difference between different groups is significant, and there is no need for further adjustment, so that the four in-furnace temperature and wireless signal state correlation characteristic grouping information can be directly taken as a plurality of in-furnace temperature and wireless signal state correlation characteristic set information, each set information corresponds to a preset reflow soldering temperature interval, and contains the position information, the temperature structured information and the interference standardized information of all reflow soldering temperature control nodes in the interval.

[0083] In step S310, the plurality of in-furnace temperature and wireless signal state correlation characteristic grouping center information and the logical distance of the plurality of in-furnace temperature and wireless signal state correlation characteristic elements are calculated to obtain a plurality of in-furnace temperature and wireless signal state correlation characteristic element distance information.

[0084] In the embodiment, the two-dimensional space distance calculation can be performed on the in-furnace temperature and wireless signal state correlation characteristic grouping center information of the group based on the “relative temperature proportion” and the “interference standardized value” of each in-furnace temperature and wireless signal state correlation characteristic element in the group, which can be Euclidean distance. The in-furnace temperature and wireless signal state correlation characteristic elements in the four groups are calculated one by one, so as to generate 40 in-furnace temperature and wireless signal state correlation characteristic element distance information.

[0085] Step S311, the minimum value of the plurality of in-furnace temperature and wireless signal state association feature element distance information is taken as the plurality of extracted in-furnace temperature and wireless signal state association feature information, and the process returns to step S302.

[0086] In the embodiment, when screening the new plurality of extracted in-furnace temperature and wireless signal state association feature information, the minimum value of the plurality of in-furnace temperature and wireless signal state association feature element distance information in each group is found, and the in-furnace temperature and wireless signal state association feature element corresponding to the minimum value is taken as the new extracted feature information of the group, so as to re-calculate the plurality of remaining in-furnace temperature and wireless signal state association feature information, start the next round of grouping optimization, and continue until the in-furnace temperature and wireless signal state association feature grouping difference average value information is less than the preset in-furnace temperature and wireless signal state association feature grouping difference average value threshold.

[0087] The reflow soldering temperature control method provided by the embodiment improves the grouping precision of the plurality of in-furnace temperature and wireless signal state association feature set information, thereby adapting to the scene that the in-furnace temperature and interference of the reflow soldering furnace dynamically change with the production process, ensuring that the wireless communication parameters are highly matched with the real-time environment, reducing the packet loss rate and delay of the plurality of reflow soldering temperature control signals in the high-temperature strong interference environment, making the temperature of each area in the reflow soldering furnace more accurately follow the process curve, improving the welding yield and production stability, and reducing parameter adaptation errors and equipment failures caused by inaccurate grouping.

[0088] Figure 4 An implementation flowchart of the reflow soldering temperature control method provided by the fourth embodiment of the present application is shown, which is different from the third embodiment described above in that the step S305 specifically includes:

[0089] Step S401, the mean and median of the plurality of in-furnace temperature and wireless signal state association feature elements corresponding to the plurality of in-furnace temperature and wireless signal state association feature grouping information are calculated to obtain the plurality of in-furnace temperature and wireless signal state association feature grouping mean information and the plurality of in-furnace temperature and wireless signal state association feature grouping median information.

[0090] In the embodiment, the multiple in-furnace temperature and wireless signal state association feature grouping mean value information can refer to the arithmetic mean value of the relative temperature proportion and the reflow furnace in-furnace wireless signal interference intensity standardized value of all in-furnace temperature and wireless signal state association feature elements in each in-furnace temperature and wireless signal state association feature grouping information. The multiple in-furnace temperature and wireless signal state association feature grouping median information refers to the statistical value obtained by taking the middle position value of the relative temperature proportion and the reflow furnace in-furnace wireless signal interference intensity standardized value of all elements in each grouping after sorting from small to large, as the in-furnace temperature and wireless signal state association feature grouping median information.

[0091] Step S402, calculating the mean value of the multiple in-furnace temperature and wireless signal state association feature grouping mean value information and the multiple in-furnace temperature and wireless signal state association feature grouping median information, to obtain the multiple in-furnace temperature and wireless signal state association feature grouping center information.

[0092] In the embodiment, the in-furnace temperature and wireless signal state association feature grouping center information can be obtained by taking the arithmetic mean value of the in-furnace temperature and wireless signal state association feature grouping mean value information and the in-furnace temperature and wireless signal state association feature grouping median information corresponding to each grouping.

[0093] The reflow soldering temperature control method provided by the embodiment of the application optimizes the stability and accuracy of the grouping center, effectively resists the influence of the local abnormal environment in the reflow soldering furnace on the grouping reference, improves the grouping precision, reduces the parameter adaptation errors caused by the deviation of the grouping reference, reduces the equipment downtime frequency and material waste, and thus improves the stability and efficiency of industrial production.

[0094] Figure 5 An implementation flowchart of the reflow soldering temperature control method provided by the fifth embodiment of the application is shown, which is different from the first embodiment in that the step S104 specifically includes:

[0095] Step S501, generating multiple reflow soldering temperature control signal transmission parameter combinations according to the multiple initial industrial wireless frequency information, the multiple initial industrial wireless signal transmission power information, and the multiple initial temperature control signal retransmission times information.

[0096] In the embodiment, for example, the initial industrial wireless frequency information is 11, corresponding to the industrial wireless frequency band information 433-435 MHz, the preset industrial wireless frequency point interval information is 200 kHz; the initial industrial wireless signal transmission power information is 6, corresponding to the industrial wireless signal transmission power range information 10-20 dBm, the preset industrial wireless signal transmission power adjustment interval information can be 2 dBm; the initial temperature control signal retransmission times information is 4, corresponding to the preset temperature control information retransmission times threshold value can be 3 times, and after random generation and screening, 0 times, 1 time, 2 times and 3 times are obtained, and the total number of combinations can be calculated as 11*6*4=264, that is, 264 reflow solder temperature control signal transmission parameter combinations are generated, each combination contains three elements of “initial industrial wireless frequency information-initial industrial wireless signal transmission power information-initial temperature control signal retransmission times information”, and all initial parameter collocation possibilities are covered.

[0097] In step S502, a plurality of reflow solder temperature control signal transmission parameter quality characterization information is calculated according to the plurality of furnace temperature and wireless signal state association feature set information, the plurality of reflow solder temperature control signal transmission parameter combinations, the plurality of preset furnace temperature change calibration curve information and the preset reflow solder temperature control signal transmission parameter quality characterization weight information; wherein the preset furnace temperature change calibration curve information corresponds to the reflow solder temperature control node position information one by one.

[0098] In the embodiment, the preset furnace temperature change calibration curve information can be set artificially according to the reflow soldering process standard, for example, the preheating zone temperature rising rate is 2-3 ℃ / s, the constant temperature zone temperature is 150-180 ℃, the reflow zone peak temperature is 230-250 ℃, and the cooling zone temperature falling rate is 3-5 ℃ / s. For each reflow soldering temperature control node position information, the temperature change curve that the position should follow is set in combination with the furnace area where the position is located, and each calibration curve is bound to the corresponding reflow soldering temperature control node position information one by one, and 40 nodes correspond to 40 calibration curves. The preset reflow soldering temperature control signal transmission parameter quality characterization weight information can be set artificially, can be set in combination with the influence degree of the parameter on the transmission quality, can be set as signal transmission stability weight 40%, temperature control accuracy weight 40%, and energy consumption weight 20%. First, for each reflow soldering temperature control signal transmission parameter combination, in the environment of the corresponding furnace temperature and wireless signal state association feature set information, the success reception proportion is counted by simulating the transmission of multiple reflow soldering temperature control signals, the signal transmission stability is reflected, then the deviation value of the actual temperature curve of the node after transmission and the preset furnace temperature change calibration curve information is compared, the temperature control accuracy is reflected, then the energy consumption value is calculated according to the transmission power of the parameter combination, the energy consumption is reflected, finally the comprehensive score is calculated according to the weight: assuming that the stability score is 98 points, the accuracy score is 95 points, and the energy consumption score is 90 points, then the quality characterization information is 98*40%+95*40%+90*20%=95.2 points, each parameter combination corresponds to a quality characterization information, thereby generating 264 reflow soldering temperature control signal transmission parameter quality characterization information.

[0099] In step S503, it is judged whether the reflow soldering temperature control signal transmission parameter quality characterization information is greater than the preset reflow soldering temperature control signal transmission parameter quality characterization threshold value; if yes, step S504 is entered; if no, step S505 is entered.

[0100] In the embodiment, the preset reflow soldering temperature control signal transmission parameter quality characterization threshold value can be set artificially, can be set in combination with the requirements of industrial production on reflow soldering temperature control, that is, the signal success reception proportion is not less than 98%, the temperature deviation is not more than ±3 ℃, and the energy consumption is not higher than 8 W, for example, the minimum score of stability is 98 points, the minimum score of accuracy is 90 points, and the minimum score of energy consumption is 80 points, the threshold value is calculated according to the weight as 98*40%+90*40%+80*20%=92 points, and then the preset reflow soldering temperature control signal transmission parameter quality characterization threshold value can be set as 92. The reflow soldering temperature control signal transmission parameter quality characterization information and the preset reflow soldering temperature control signal transmission parameter quality characterization threshold value can be compared in size.

[0101] Step S504, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characterization information are taken as the target industrial wireless frequency information, the target industrial wireless signal transmission power information and the target temperature control signal retransmission number information.

[0102] In the embodiment, when the reflow soldering temperature control signal transmission parameter quality characterization information is greater than the preset reflow soldering temperature control signal transmission parameter quality characterization threshold value, it is indicated that the parameter combination meets the industrial production requirements in terms of signal transmission stability, temperature control precision and energy consumption, and further optimization is not needed, so that the initial industrial wireless frequency information in the combination is determined as the target industrial wireless frequency information, the initial industrial wireless signal transmission power information is determined as the target industrial wireless signal transmission power information, and the initial temperature control signal retransmission number information is determined as the target temperature control signal retransmission number information, and is bound with the corresponding furnace temperature and wireless signal state association characteristic set information, so as to ensure that the region node uses the adaptive parameter transmission signal.

[0103] Step S505, according to the reflow soldering temperature control signal transmission parameter combination corresponding to the maximum value of the plurality of reflow soldering temperature control signal transmission parameter quality characterization information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission number threshold value, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characterization information are optimized to obtain the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information and the intermediate temperature control signal retransmission number information.

[0104] In the embodiment, the combination corresponding to the maximum value of the plurality of reflow soldering temperature control signal transmission parameter quality characterization information can be first searched as a reference combination, the initial industrial wireless frequency information is optimized, the intermediate industrial wireless frequency information can be obtained by adjusting the frequency of the reference combination according to the preset industrial wireless frequency point interval information, the initial industrial wireless signal transmission power information is optimized, the intermediate industrial wireless signal transmission power information can be obtained by adjusting the power of the reference combination according to the preset industrial wireless signal transmission power adjustment interval information, and the initial temperature control signal retransmission number information is optimized, the intermediate temperature control signal retransmission number information can be obtained by adjusting the retransmission number of the reference combination within the range of not exceeding the preset temperature control information retransmission number threshold value.

[0105] Step S506, the intermediate industrial wireless frequency information, intermediate industrial wireless signal transmission power information and intermediate temperature control signal retransmission number information are counted and summarized to obtain a plurality of intermediate industrial wireless frequency information, a plurality of intermediate industrial wireless signal transmission power information and a plurality of intermediate temperature control signal retransmission number information.

[0106] In this embodiment, the counting and summarizing process is performed on all the optimized industrial wireless frequency information, industrial wireless signal transmission power information and temperature control signal retransmission number information. When summarizing, the values can be classified in the order of industrial wireless frequency information, industrial wireless signal transmission power information and temperature control signal retransmission number information, and then the repeated values are removed to obtain a plurality of intermediate industrial wireless frequency information, a plurality of intermediate industrial wireless signal transmission power information and a plurality of intermediate temperature control signal retransmission number information.

[0107] Step S507, the plurality of intermediate industrial wireless frequency information, the plurality of intermediate industrial wireless signal transmission power information and the plurality of intermediate temperature control signal retransmission number information are used as a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information and a plurality of initial temperature control signal retransmission number information, and return to step S501.

[0108] In this embodiment, the plurality of intermediate industrial wireless frequency information, the plurality of intermediate industrial wireless signal transmission power information and the plurality of intermediate temperature control signal retransmission number information after summarizing can replace the original plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information and the plurality of initial temperature control signal retransmission number information, and be used to regenerate a new reflow soldering temperature control signal transmission parameter combination, so as to ensure that the parameters are continuously optimized in the optimal direction, and all regional nodes match the target parameters.

[0109] The reflow soldering temperature control method provided by the embodiment of the application introduces the preset furnace temperature change calibration curve information and the quality characterization weight, so that the parameter evaluation is more suitable for the actual needs of the reflow soldering process, avoids the parameter adaptation deviation caused by single-dimensional evaluation, and makes the generated target industrial wireless frequency information, target industrial wireless signal transmission power information and target temperature control signal retransmission number information ensure signal transmission stability, improve the success receiving rate of the reflow soldering temperature control signal and temperature control accuracy, reduce the packet loss rate of a plurality of reflow soldering temperature control signals in a high-temperature strong interference environment, and reduce the equipment energy waste and downtime frequency caused by improper parameter adaptation, thereby significantly improving the stability, accuracy and economy of industrial production.

[0110] Figure 6An implementation flowchart of the reflow soldering temperature control method provided by Embodiment Six of the present application is shown, which is different from Embodiment Five described above in that the step S502 specifically comprises:

[0111] In step S601, a plurality of in-furnace temperature deviation information is calculated according to the plurality of in-furnace temperature and wireless signal state association feature set information and a plurality of preset in-furnace temperature variation calibration curve information.

[0112] In the present embodiment, the plurality of in-furnace temperature deviation information refers to the absolute value of the difference between the actual temperature corresponding to each reflow soldering temperature control node position and the calibration temperature at the corresponding time point in the preset in-furnace temperature variation calibration curve information, and each in-furnace temperature deviation information corresponds to the reflow soldering temperature control node position information in one-to-one correspondence. The actual temperature data of each node can be extracted from the plurality of in-furnace temperature and wireless signal state association feature set information, and then the calibration temperature at the corresponding time point in the preset in-furnace temperature variation calibration curve information of the node is searched, and the absolute value of the difference between the two is calculated, which is the in-furnace temperature deviation information corresponding to the node.

[0113] In step S602, a plurality of reflow soldering in-furnace packet loss rate information is calculated according to the plurality of in-furnace temperature and wireless signal state association feature set information, a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information, and a plurality of initial temperature control signal retransmission times information.

[0114] In the present embodiment, the plurality of reflow soldering in-furnace packet loss rate information refers to the proportion of the number of lost signals to the total number of transmitted signals when transmitting the reflow soldering temperature control signal in the environment corresponding to the in-furnace temperature and wireless signal state association feature set information for each reflow soldering temperature control signal transmission parameter combination. The environmental interference level can be reflected in combination with the reflow soldering in-furnace wireless signal interference intensity information in the plurality of in-furnace temperature and wireless signal state association feature set information, and the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, and the plurality of initial temperature control signal retransmission times information. It can be that for a selected parameter combination, the average value of the reflow soldering in-furnace wireless signal interference intensity information of the nodes in the set is -65dBm in the environment corresponding to the preheating zone in-furnace temperature and wireless signal state association feature set information, 1000 reflow soldering temperature control signals are continuously transmitted, and the number of signals that are not successfully received is recorded, which is assumed to be 30. Then the reflow soldering in-furnace packet loss rate information of the combination in the environment is 30÷1000×100%=3%. Thus, 264 parameter combinations are tested in the environments of 4 in-furnace temperature and wireless signal state association feature sets respectively, and 4 packet loss rate information corresponding to each combination is generated to generate 264×4=1056 reflow soldering in-furnace packet loss rate information, each of which reflects the signal transmission stability of a specific parameter combination in a specific environment.

[0115] In step S603, the multiple reflow soldering temperature control signal transmission parameter quality characterization information is calculated according to the multiple in-furnace temperature deviation information, the multiple reflow soldering in-furnace packet loss rate information, and the preset reflow soldering temperature control signal transmission parameter quality characterization weight information.

[0116] In this embodiment, the multiple in-furnace temperature deviation information corresponding to each parameter combination can be averaged, such as 2℃, the multiple reflow soldering in-furnace packet loss rate information can be averaged, such as 3%, and the energy consumption score can be converted into 0-100 points, such as 100 points. The in-furnace temperature deviation is converted according to "100 points for deviation ≤2℃, and 20 points are reduced for each increase of 1℃", and 100 points are obtained for 2℃. The reflow soldering in-furnace packet loss rate is calculated according to "100 points for packet loss rate ≤2%, and 30 points are reduced for each increase of 1%", and 70 points are obtained for 3%. Then, the comprehensive score is calculated according to the weight: 100x50%+70x40%+100x10%=50+28+10=88 points. The score is the reflow soldering temperature control signal transmission parameter quality characterization information corresponding to the parameter combination. All 264 parameter combinations are calculated one by one to generate 264 reflow soldering temperature control signal transmission parameter quality characterization information, which comprehensively reflects the performance of the parameter combination in terms of temperature accuracy, signal stability, and energy consumption.

[0117] The reflow soldering temperature control method provided by the embodiments of the present application improves the adaptability of the multiple target industrial wireless frequency information, the multiple target industrial wireless signal transmission power information, and the multiple target temperature control signal retransmission number information, thereby improving the accuracy of reflow soldering temperature control and the stability of signal transmission, reducing defective products caused by temperature deviation or signal loss, reducing production loss, and balancing energy consumption control, thereby bringing higher economic benefits and stability to industrial production.

[0118] Figure 7 An implementation flowchart of the reflow soldering temperature control method provided by the seventh embodiment of the present application is shown, which is different from the fifth embodiment described above in that the step S505 specifically includes:

[0119] In step S701, the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information, and the reference temperature control signal retransmission number information are obtained according to the reflow soldering temperature control signal transmission parameter combination corresponding to the maximum value of the multiple reflow soldering temperature control signal transmission parameter quality characterization information.

[0120] In the embodiment, the industrial wireless frequency information, the industrial wireless signal transmission power information and the temperature control signal retransmission number information can be extracted from the reflow soldering temperature control signal transmission parameter combination corresponding to the maximum value of the reflow soldering temperature control signal transmission parameter quality characteristic information as the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information and the reference temperature control signal retransmission number information.

[0121] In step S702, the industrial wireless frequency adjustment interval information, the industrial wireless signal transmission power adjustment interval information and the temperature control signal retransmission number adjustment interval information are calculated according to the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information, the reference temperature control signal retransmission number information, the preset temperature control information retransmission number threshold, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characteristic information.

[0122] In the embodiment, the adjustable upper and lower limits of each industrial wireless frequency information, industrial wireless signal transmission power information and temperature control signal retransmission number information can be determined based on the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information and the reference temperature control signal retransmission number information, in combination with the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information and the preset temperature control information retransmission number threshold.

[0123] In step S703, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characteristic information are optimized to obtain the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information and the intermediate temperature control signal retransmission number information according to the industrial wireless frequency adjustment interval information, the industrial wireless signal transmission power adjustment interval information, the temperature control signal retransmission number adjustment interval information, the preset industrial wireless frequency interval information and the preset industrial wireless signal transmission power adjustment interval information.

[0124] In the embodiment, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information that do not meet the requirements can be adjusted to reasonable values closest to the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information and the reference temperature control signal retransmission number information in the preset industrial wireless frequency interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission number threshold, so as to obtain the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information and the intermediate temperature control signal retransmission number information.

[0125] The reflow soldering temperature control method provided by the embodiment avoids parameter drift and invalid attempts in the optimization calculation process, so as to improve the effectiveness and robustness of the optimization of the industrial wireless frequency information, the industrial wireless signal transmission power information and the temperature control signal retransmission number information, thereby improving the transmission stability of the reflow soldering temperature control signal while reducing the number of cyclic optimizations and reducing the consumption of computing resources.

[0126] The method provided by the embodiment corresponds to the method of the above embodiment, Figure 8 The structure block diagram of the reflow soldering temperature control system provided by the embodiment is shown, and only the parts related to the embodiment are shown for ease of illustration. Figure 8 The reflow soldering temperature control system can be the execution subject of the reflow soldering temperature control method provided by the first embodiment.

[0127] Referring to Figure 8 The reflow soldering temperature control system comprises:

[0128] The information acquisition module 810 is configured to acquire a plurality of reflow soldering temperature control node position information, a plurality of reflow soldering furnace temperature information, a plurality of reflow soldering furnace wireless signal interference intensity information, industrial wireless frequency band information and industrial wireless signal transmission power range information; the plurality of reflow soldering temperature control node position information corresponds to the plurality of reflow soldering furnace temperature information and the plurality of reflow soldering furnace wireless signal interference intensity information one by one;

[0129] The furnace temperature and wireless signal state association feature set information generation module 820 is configured to perform association feature construction and division processing on the plurality of reflow soldering temperature control node position information, the plurality of reflow soldering furnace temperature information and the plurality of reflow soldering furnace wireless signal interference intensity information according to a preset reflow soldering temperature interval number, to generate a plurality of furnace temperature and wireless signal state association feature set information;

[0130] The initial reflow soldering temperature control signal transmission parameter generation module 830 is configured to generate a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information, and a plurality of initial temperature control information retransmission times information according to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, a plurality of randomly generated temperature control signal retransmission times information, and a preset temperature control information retransmission times threshold.

[0131] The target reflow soldering temperature control signal transmission parameter generation module 840 is configured to generate a plurality of target industrial wireless frequency information, a plurality of target industrial wireless signal transmission power information, and a plurality of target temperature control signal retransmission times information according to the plurality of in-furnace temperature and wireless signal state association feature set information, the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, the plurality of initial temperature control signal retransmission times information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, and the preset temperature control information retransmission times threshold.

[0132] The reflow soldering temperature control module 850 is configured to perform transmission processing on a plurality of reflow soldering temperature control signals according to the plurality of target industrial wireless frequency information, the plurality of target industrial wireless signal transmission power information, and the plurality of target temperature control signal retransmission times information, so as to perform reflow soldering temperature control through the plurality of reflow soldering temperature control signals.

[0133] The reflow soldering temperature control system provided in the embodiments of the present application can implement the processes of the respective functions of the modules, and specific implementation processes can be referred to the description of the foregoing embodiment one, which will not be described here. Figure 1

[0134] It should be understood that the size of the serial number of each step in the foregoing embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0135] It should be understood that when used in the present application and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or sets thereof.

[0136] It should also be understood that the term "and / or" used in the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0137] ​References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0138] The reflow soldering temperature control method provided in this application can be applied to terminal devices such as mobile phones, tablets, wearable devices, vehicle devices, laptops, and netbooks. This application does not impose any restrictions on the specific type of terminal device.

[0139] For example, the terminal device may be a station in a WLAN, a cellular phone, a personal digital processing device, a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, a vehicle networking terminal, a computer, a laptop computer, a handheld communication device, a handheld computing device, a satellite wireless device, a wireless modem card, a set-top box, a user premises equipment and / or other devices for communicating over a wireless system, as well as next-generation communication systems.

[0140] Figure 9 This is a schematic diagram of the structure of a terminal device provided in an embodiment of this application. For example... Figure 9 As shown, the terminal device 9 of this embodiment includes: at least one processor 90 ( Figure 9 Only one is shown in the image), and a memory 91 stores a computer program 92 that can run on the processor 90. When the processor 90 executes the computer program 92, it implements the steps in the various reflow soldering temperature control method embodiments described above, for example... Figure 1 Steps S101 to S105 are shown. Alternatively, when the processor 90 executes the computer program 92, it implements the functions of each module / unit in the above system embodiments, for example... Figure 8 The functions of modules 810 to 850 are shown.

[0141] The terminal device 9 can be a desktop computer, laptop, handheld computer, or cloud server, etc. The terminal device may include, but is not limited to, a processor 90 and a memory 91. Those skilled in the art will understand that... Figure 9The terminal device 9 is only an example and does not constitute a limitation on the terminal device 9, and can include more or fewer components than shown, or combine certain components, or include different components, for example, the terminal device can also include an input sending device, a network access device, a bus, etc.

[0142] The processor 90 can be a central processing unit, and can also be other general-purpose processors, digital signal processors, application-specific integrated circuits, ready programmable gate arrays, or discrete gates or transistor logic components, etc. The general-purpose processor can be a microprocessor, or the processor can also be any conventional processor, etc.

[0143] The memory 91 can be an internal storage unit of the terminal device 9 in some embodiments, for example, a hard disk or a memory of the terminal device 9. The memory 91 can also be an external storage device of the terminal device 9, for example, a plug-in hard disk, a smart memory card, a secure digital card, a flash memory card, etc. equipped on the terminal device 9. Further, the memory 91 can include both the internal storage unit and the external storage device of the terminal device 9. The memory 91 is used to store an operating system, an application program, a boot loader, data, and other programs, etc., for example, program codes of the computer program, etc. The memory 91 can also be used to temporarily store data that has been transmitted or will be transmitted.

[0144] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0145] The embodiments of the present application also provide a terminal device, which includes at least one memory, at least one processor, and a computer program stored in the at least one memory and executable on the at least one processor, and the processor executes the computer program to enable the terminal device to implement the steps in any of the above method embodiments.

[0146] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the steps in any of the above method embodiments.

[0147] The embodiments of the present application provide a computer program product, when the computer program product is executed on a terminal device, so that the terminal device is executed to implement the steps in any of the above method embodiments.

[0148] The integrated modules / units, if implemented in the form of software functional units and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the above-mentioned embodiments can also be implemented by a computer program instructing related hardware, and the computer program can be stored in a computer readable storage medium. When the computer program is executed by a processor, the steps of each method embodiment described above can be implemented. The computer program includes computer program code, which can be in the form of source code, object code, executable files or some intermediate forms. The computer readable medium can include any entity or system that can carry the computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory, random access memory, electrical carrier signal, telecommunication signal and software distribution medium, etc.

[0149] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0150] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. A person skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0151] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A reflow soldering temperature control method, characterized by, The method comprises the following steps: Obtaining multiple reflow soldering temperature control node position information, multiple reflow soldering furnace temperature information, multiple reflow soldering furnace wireless signal interference intensity information, industrial wireless frequency band information and industrial wireless signal transmission power range information; the multiple reflow soldering temperature control node position information corresponds to the multiple reflow soldering furnace temperature information and the multiple reflow soldering furnace wireless signal interference intensity information one by one; According to the preset reflow soldering temperature interval quantity, the multiple reflow soldering temperature control node position information, the multiple reflow soldering furnace temperature information and the multiple reflow soldering furnace wireless signal interference intensity information are associated with the feature construction and division processing, and multiple furnace temperature and wireless signal state associated feature set information is generated; According to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, the multiple randomly generated temperature control signal retransmission times information and the preset temperature control information retransmission times threshold, multiple initial industrial wireless frequency information, multiple initial industrial wireless signal transmission power information and multiple initial temperature control information retransmission times information are generated; According to the multiple furnace temperature and wireless signal state associated feature set information, the multiple initial industrial wireless frequency information, the multiple initial industrial wireless signal transmission power information, the multiple initial temperature control signal retransmission times information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission times threshold, multiple target industrial wireless frequency information, multiple target industrial wireless signal transmission power information and multiple target temperature control signal retransmission times information are generated; According to the multiple target industrial wireless frequency information, the multiple target industrial wireless signal transmission power information and the multiple target temperature control signal retransmission times information, multiple reflow soldering temperature control signals are transmitted to control the reflow soldering temperature through the multiple reflow soldering temperature control signals.

2. The reflow soldering temperature control method according to claim 1, wherein The step of generating multiple furnace temperature and wireless signal state associated feature set information according to the preset reflow soldering temperature interval quantity, the multiple reflow soldering temperature control node position information, the multiple reflow soldering furnace temperature information and the multiple reflow soldering furnace wireless signal interference intensity information, specifically comprises: According to the multiple reflow soldering furnace temperature information, the maximum reflow soldering furnace temperature information, the minimum reflow soldering furnace temperature information and the reflow soldering furnace temperature range information are calculated; According to the maximum reflow soldering furnace temperature information, the minimum reflow soldering furnace temperature information and the reflow soldering furnace temperature range information, the multiple reflow soldering furnace temperature information is structured to obtain multiple reflow soldering furnace temperature structured information; According to the multiple reflow soldering furnace wireless signal interference intensity information, the maximum reflow soldering furnace wireless signal interference intensity information, the minimum reflow soldering furnace wireless signal interference intensity information and the reflow soldering furnace wireless signal interference intensity range information are calculated; According to the maximum value information of the wireless signal interference intensity in the reflow soldering furnace, the minimum value information of the wireless signal interference intensity in the reflow soldering furnace, and the range information of the wireless signal interference intensity in the reflow soldering furnace, the wireless signal interference intensity information in the multiple reflow soldering furnaces is standardized to obtain wireless signal interference intensity standardized information in the multiple reflow soldering furnaces; According to the multiple reflow soldering temperature control node position information, the multiple reflow soldering furnace internal temperature structured information, and the multiple reflow soldering furnace internal wireless signal interference intensity standardized information, multiple furnace internal temperature and wireless signal state association characteristic information is generated; According to the preset reflow soldering temperature interval quantity, the multiple furnace internal temperature and wireless signal state association characteristic information is divided to generate multiple furnace internal temperature and wireless signal state association characteristic set information.

3. The reflow soldering temperature control method according to claim 2, wherein The step of generating multiple furnace internal temperature and wireless signal state association characteristic set information according to the preset reflow soldering temperature interval quantity and the multiple furnace internal temperature and wireless signal state association characteristic information, specifically includes: According to the preset reflow soldering temperature interval quantity, the multiple furnace internal temperature and wireless signal state association characteristic information is randomly extracted to obtain multiple extracted furnace internal temperature and wireless signal state association characteristic information; According to the multiple furnace internal temperature and wireless signal state association characteristic information and the multiple extracted furnace internal temperature and wireless signal state association characteristic information, multiple remaining furnace internal temperature and wireless signal state association characteristic information is obtained; The Euclidean distance of the multiple extracted furnace internal temperature and wireless signal state association characteristic information and the multiple remaining furnace internal temperature and wireless signal state association characteristic information is calculated to obtain multiple furnace internal temperature and wireless signal state association characteristic distance information; According to the multiple extracted furnace internal temperature and wireless signal state association characteristic information and the multiple furnace internal temperature and wireless signal state association characteristic distance information, the multiple remaining furnace internal temperature and wireless signal state association characteristic information is divided to obtain multiple furnace internal temperature and wireless signal state association characteristic grouping information; the furnace internal temperature and wireless signal state association characteristic grouping information includes multiple furnace internal temperature and wireless signal state association characteristic elements; According to the multiple furnace internal temperature and wireless signal state association characteristic elements corresponding to the multiple furnace internal temperature and wireless signal state association characteristic grouping information, multiple furnace internal temperature and wireless signal state association characteristic grouping center information is obtained; The difference value of the multiple furnace internal temperature and wireless signal state association characteristic grouping center information and the multiple extracted furnace internal temperature and wireless signal state association characteristic information is calculated to obtain multiple furnace internal temperature and wireless signal state association characteristic grouping difference value information; The mean value of the multiple furnace internal temperature and wireless signal state association characteristic grouping difference value information is calculated to obtain furnace internal temperature and wireless signal state association characteristic grouping difference value mean value information; It is judged whether the furnace internal temperature and wireless signal state association characteristic grouping difference value mean value information is less than a preset furnace internal temperature and wireless signal state association characteristic grouping difference value mean value threshold; If yes, the multiple in-furnace temperature and wireless signal state association feature grouping information is taken as the multiple in-furnace temperature and wireless signal state association feature set information; If no, the multiple in-furnace temperature and wireless signal state association feature grouping center information and the logical distance of the multiple in-furnace temperature and wireless signal state association feature elements are calculated to obtain the multiple in-furnace temperature and wireless signal state association feature element distance information; The in-furnace temperature and wireless signal state association feature element corresponding to the minimum value of the multiple in-furnace temperature and wireless signal state association feature element distance information is taken as the multiple extracted in-furnace temperature and wireless signal state association feature information, and returned to the step of obtaining the multiple remaining in-furnace temperature and wireless signal state association feature information according to the multiple in-furnace temperature and wireless signal state association feature information and the multiple extracted in-furnace temperature and wireless signal state association feature information.

4. The reflow soldering temperature control method according to claim 3, wherein The step of obtaining the multiple in-furnace temperature and wireless signal state association feature grouping center information according to the multiple in-furnace temperature and wireless signal state association feature grouping information specifically includes: The mean and median of the multiple in-furnace temperature and wireless signal state association feature elements corresponding to the multiple in-furnace temperature and wireless signal state association feature grouping information are calculated to obtain the multiple in-furnace temperature and wireless signal state association feature grouping mean information and the multiple in-furnace temperature and wireless signal state association feature grouping median information; The mean of the multiple in-furnace temperature and wireless signal state association feature grouping mean information and the multiple in-furnace temperature and wireless signal state association feature grouping median information is calculated to obtain the multiple in-furnace temperature and wireless signal state association feature grouping center information.

5. The reflow soldering temperature control method according to Claim 1, wherein The step of generating the multiple target industrial wireless frequency information, the multiple target industrial wireless signal transmission power information and the multiple target temperature control signal retransmission times information according to the multiple in-furnace temperature and wireless signal state association feature set information, the multiple initial industrial wireless frequency information, the multiple initial industrial wireless signal transmission power information, the multiple initial temperature control signal retransmission times information, the preset industrial wireless frequency interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission times threshold specifically includes: The multiple reflow solder temperature control signal transmission parameter combinations are generated according to the multiple initial industrial wireless frequency information, the multiple initial industrial wireless signal transmission power information and the multiple initial temperature control signal retransmission times information; The multiple reflow solder temperature control signal transmission parameter quality characterization information is calculated according to the multiple in-furnace temperature and wireless signal state association feature set information, the multiple reflow solder temperature control signal transmission parameter combinations, the multiple preset in-furnace temperature change calibration curve information and the preset reflow solder temperature control signal transmission parameter quality characterization weight information; the preset in-furnace temperature change calibration curve information is one-to-one corresponding to the reflow solder temperature control node position information; determining whether the reflow soldering temperature control signal transmission parameter quality characterization information is greater than a preset reflow soldering temperature control signal transmission parameter quality characterization threshold value; if yes, taking the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information, and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characterization information as the target industrial wireless frequency information, the target industrial wireless signal transmission power information, and the target temperature control signal retransmission number information; if no, performing optimization processing on the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information, and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characterization information according to the maximum value of the reflow soldering temperature control signal transmission parameter quality characterization information, the preset industrial wireless frequency interval information, the preset industrial wireless signal transmission power adjustment interval information, and the preset temperature control information retransmission number threshold value, to obtain intermediate industrial wireless frequency information, intermediate industrial wireless signal transmission power information, and intermediate temperature control signal retransmission number information; performing statistical and summary processing on the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information, and the intermediate temperature control signal retransmission number information to obtain a plurality of intermediate industrial wireless frequency information, a plurality of intermediate industrial wireless signal transmission power information, and a plurality of intermediate temperature control signal retransmission number information; taking the plurality of intermediate industrial wireless frequency information, the plurality of intermediate industrial wireless signal transmission power information, and the plurality of intermediate temperature control signal retransmission number information as a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information, and a plurality of initial temperature control signal retransmission number information, and returning to the step of generating a plurality of reflow soldering temperature control signal transmission parameter combinations according to the plurality of initial industrial wireless frequency information, the plurality of initial industrial wireless signal transmission power information, and the plurality of initial temperature control signal retransmission number information.

6. The reflow soldering temperature control method according to claim 5, wherein The step of calculating a plurality of reflow soldering temperature control signal transmission parameter quality characterization information according to the plurality of furnace temperature and wireless signal state association feature set information, a plurality of reflow soldering temperature control signal transmission parameter combinations, a plurality of preset furnace temperature change calibration curve information, and preset reflow soldering temperature control signal transmission parameter quality characterization weight information specifically comprises: calculating a plurality of furnace temperature deviation information according to the plurality of furnace temperature and wireless signal state association feature set information and the plurality of preset furnace temperature change calibration curve information; calculating a plurality of reflow soldering furnace packet loss rate information according to the plurality of furnace temperature and wireless signal state association feature set information, a plurality of initial industrial wireless frequency information, a plurality of initial industrial wireless signal transmission power information, a plurality of initial temperature control signal retransmission number information; According to the multiple furnace temperature deviation information, multiple reflow soldering furnace packet loss rate information and preset reflow soldering temperature control signal transmission parameter quality characteristic weight information, multiple reflow soldering temperature control signal transmission parameter quality characteristic information is calculated.

7. The reflow soldering temperature control method according to claim 5, wherein According to the maximum value of the multiple reflow soldering temperature control signal transmission parameter quality characteristic information, the preset industrial wireless frequency interval information, the preset industrial wireless signal transmission power adjustment interval information and the preset temperature control information retransmission number threshold, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characteristic information are optimized to obtain the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information and the intermediate temperature control signal retransmission number information, and the step specifically includes: According to the maximum value of the multiple reflow soldering temperature control signal transmission parameter quality characteristic information, the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information and the reference temperature control signal retransmission number information are obtained. According to the reference industrial wireless frequency information, the reference industrial wireless signal transmission power information, the reference temperature control signal retransmission number information, the preset temperature control information retransmission number threshold, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characteristic information, the industrial wireless frequency adjustment interval information, the industrial wireless signal transmission power adjustment interval information and the temperature control signal retransmission number adjustment interval information are calculated. According to the industrial wireless frequency adjustment interval information, the industrial wireless signal transmission power adjustment interval information, the temperature control signal retransmission number adjustment interval information, the preset industrial wireless frequency interval information and the preset industrial wireless signal transmission power adjustment interval information, the initial industrial wireless frequency information, the initial industrial wireless signal transmission power information and the initial temperature control signal retransmission number information corresponding to the reflow soldering temperature control signal transmission parameter quality characteristic information are optimized to obtain the intermediate industrial wireless frequency information, the intermediate industrial wireless signal transmission power information and the intermediate temperature control signal retransmission number information.

8. A reflow soldering temperature control system characterized by, It includes: The information acquisition module is used for acquiring multiple reflow soldering temperature control node position information, multiple reflow soldering furnace temperature information, multiple reflow soldering furnace wireless signal interference intensity information, industrial wireless frequency band information and industrial wireless signal transmission power range information; the multiple reflow soldering temperature control node position information is one-to-one corresponding to the multiple reflow soldering furnace temperature information and the multiple reflow soldering furnace wireless signal interference intensity information; The furnace temperature and wireless signal state association feature set information generation module is configured to associate and divide the multiple reflow soldering temperature control node position information, the multiple reflow soldering furnace temperature information, and the multiple reflow soldering furnace wireless signal interference intensity information according to a preset reflow soldering temperature interval number, and generate multiple furnace temperature and wireless signal state association feature set information. The initial reflow soldering temperature control signal transmission parameter generation module is configured to generate multiple initial industrial wireless frequency information, multiple initial industrial wireless signal transmission power information, and multiple initial temperature control information retransmission number information according to the industrial wireless frequency band information, the industrial wireless signal transmission power range information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, the multiple randomly generated temperature control signal retransmission number information, and the preset temperature control information retransmission number threshold. The target reflow soldering temperature control signal transmission parameter generation module is configured to generate multiple target industrial wireless frequency information, multiple target industrial wireless signal transmission power information, and multiple target temperature control signal retransmission number information according to the multiple furnace temperature and wireless signal state association feature set information, the multiple initial industrial wireless frequency information, the multiple initial industrial wireless signal transmission power information, the multiple initial temperature control signal retransmission number information, the preset industrial wireless frequency point interval information, the preset industrial wireless signal transmission power adjustment interval information, and the preset temperature control information retransmission number threshold. The reflow soldering temperature control module is configured to transmit multiple reflow soldering temperature control signals according to the multiple target industrial wireless frequency information, the multiple target industrial wireless signal transmission power information, and the multiple target temperature control signal retransmission number information, so as to control the reflow soldering temperature through the multiple reflow soldering temperature control signals.

9. A terminal device, comprising: The terminal device comprises a memory and a processor, the memory stores a computer program capable of running on the processor, and the processor implements the steps of the method of any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, the computer-readable storage medium comprising: The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 7.

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