An ultra-thin patch fuse preparation system and process
By using a fixed adsorption and position adjustment mechanism, combined with a piezoelectric actuator, an electromagnet, and an electrically heated thin film, the problem of insufficient adhesion between copper foil and substrate in the preparation of ultra-thin patch fuses was solved, achieving a stable pressing process and improving the flatness and reliability of the product.
Patent Information
- Application Number
- CN202511541476.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-27
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2045-10-27
AI Technical Summary
In the preparation of ultra-thin patch fuses, existing lamination equipment has insufficient bonding force between the substrate material and the electrode copper foil, which easily leads to warping or interface delamination, resulting in reduced product yield and long-term reliability.
A fixed adsorption mechanism is used to tightly adsorb the ultrathin substrate. Combined with a position adjustment mechanism and a preparation mechanism, a high-force impact is achieved through the cooperation of a piezoelectric actuator and an electromagnet to form an anchoring groove and eliminate stress grooves. Combined with an electrically heated thin film, segmented heating and pressurization are performed to ensure stable bonding between the copper foil and the substrate.
This improves the interfacial bonding quality between the copper foil and the ultra-thin substrate, prevents warping and deformation, and enhances the overall flatness and long-term reliability of the product.
Smart Images
Figure CN121034909B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of surface mount fuse manufacturing technology, and in particular to an ultra-thin surface mount fuse manufacturing system and process. Background Technology
[0002] As electronic devices continue to evolve towards thinner, smaller, and more integrated designs, higher demands are being placed on the size, thickness, and electrical performance of internal components. Surface mount fuses, as indispensable overcurrent protection components in circuits, are widely used in consumer electronics, automotive electronics, and medical devices, playing a crucial role in preventing equipment damage and even safety accidents caused by abnormal current. The manufacturing technology of surface mount fuses has evolved from thick-film printing to thin-film etching. Thin-film based fuses, in particular, achieve precise control of the fusible element by constructing fine metal lines on an insulating substrate.
[0003] In the fabrication of ultra-thin surface mount fuses, the bonding between the substrate material and the electrode copper foil is crucial to ensuring stable device performance. Due to the extremely thin overall thickness of the fuse, a highly dense and uniform interface bonding is required to ensure good conductivity, thermal conductivity, and mechanical reliability. However, existing bonding equipment has relatively simple functions, typically only possessing basic pressure capabilities. This can easily lead to insufficient bonding force between the two materials, causing warping of the copper foil or interface delamination. After long-term use or thermal cycling, the copper foil is prone to detachment, severely reducing product yield and long-term reliability. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide an ultra-thin patch fuse preparation system and process with high overall flatness and stable pressing.
[0005] The technical solution adopted to solve the above-mentioned technical problems is as follows: A fixing and adsorption mechanism for adsorbing ultrathin substrates is provided on the cabinet. Multiple support frames are provided on the cabinet, with a top plate on top of each support frame. A position adjustment mechanism is provided at the bottom of the top plate. A preparation mechanism for pressing copper foil onto the upper and lower surfaces of the ultrathin substrate to form a copper-clad laminate is provided at the bottom of the position adjustment mechanism. The preparation mechanism consists of a bracket at the bottom of the position adjustment mechanism, an L-shaped rod rotatably mounted on the bracket, a rotating shaft rotatably connected to the bracket on the L-shaped rod, a third motor mounted on the bracket, and the output shaft of the third motor fixedly connected to the rotating shaft. The L-shaped rod... One side of the L-shaped rod is equipped with an impact head, and a piezoelectric actuator is installed at the top of the impact head. Inside the impact head, there are multiple connecting rods connected to the piezoelectric actuator. Each connecting rod has a magnetic block at its top. Inside the impact head, there are multiple electromagnets that are magnetically connected to the corresponding magnetic blocks. The bottom of the multiple connecting rods is fixedly connected to an impact plate, which is located at the bottom of the impact head. At the bottom of the impact plate, there are multiple impact needles for processing anchoring grooves on the ultrathin substrate. The other side of the L-shaped rod is equipped with a pressing head for pressing copper foil to the ultrathin substrate. At the bottom of the pressing head, there is an electrically heated film and multiple clearance grooves for pressing copper foil.
[0006] Furthermore, during the impact process, the impact head is located directly above the ultrathin substrate, and during the pressing process, the pressing head is located directly above the ultrathin substrate.
[0007] Furthermore, the position adjustment mechanism comprises: a fixed plate at the bottom of the top plate, a first lead screw rotatably mounted on the fixed plate, a first motor mounted on the fixed plate, the output shaft of the first motor being fixedly connected to one end of the first lead screw, the first lead screw being threadedly connected to a second slider, a sliding plate at the bottom of the second slider being located below the fixed plate, a second lead screw rotatably mounted on the sliding plate, a second motor mounted on the sliding plate, the output shaft of the second motor being fixedly connected to one end of the second lead screw, the second lead screw being threadedly connected to the first slider, and an electric push rod at the bottom of the first slider being fixedly connected to the preparation mechanism.
[0008] Furthermore, the straight line containing the fixed plate is perpendicular to the straight line containing the sliding plate.
[0009] Furthermore, the fixed adsorption mechanism is as follows: an adsorption shell is provided on the cabinet, an adsorption cavity is machined inside the adsorption shell, a plurality of adsorption holes are machined on the top of the adsorption shell and are respectively connected to the adsorption cavity, and a vacuum generator is provided on one side of the adsorption shell to evacuate the air inside the adsorption cavity.
[0010] Furthermore, each of the aforementioned adsorption holes is provided with a rubber ring at its top that contacts the ultrathin substrate.
[0011] A process for manufacturing an ultra-thin patch fuse includes the following steps:
[0012] S1, Processing anchoring grooves on the ultrathin substrate: Place the ultrathin substrate in the middle of the top surface of the adsorption housing, and firmly adsorb the ultrathin substrate onto the fixed adsorption mechanism. Adjust the position of the preparation mechanism. The output shaft of the third motor drives the rotating shaft to rotate on the bracket. The rotating shaft drives the L-shaped rod to rotate. The impact head and impact plate on the L-shaped rod rotate to the downward position. At the same time, adjust the impact head to be above the ultrathin substrate so that the distance between the impact needle and the upper surface of the ultrathin substrate is 0.1mm. After the piezoelectric actuator is energized, it pushes the connecting rod to move downward in the vertical direction. The connecting rod drives multiple impact needles on the impact plate to move downward synchronously. At the same time, the electromagnet is energized. The electromagnet is magnetically connected to the magnetic block. Control the impact force of the impact needle to be 8~10N. Multiple impact needles impact the ultrathin substrate for 0.8S. Anchoring grooves are processed on the surface of the ultrathin substrate. After the impact is completed, the piezoelectric actuator and electromagnet are de-energized, and the connecting rod, impact plate and impact needle are reset.
[0013] S2, Stress relief grooves are processed around the anchoring groove of the ultrathin substrate: The position of the preparation mechanism is adjusted so that the impact needle is aligned with the stress concentration area around the anchoring groove on the ultrathin substrate. After the piezoelectric actuator is energized, it pushes the connecting rod to move downward in the vertical direction. The connecting rod drives multiple impact needles on the impact plate to move downward synchronously. At the same time, the electromagnet and the magnetic block have a repulsive effect. The repulsive force cancels the downward force of the connecting rod. The impact force of the impact needle is controlled to be 5-6N. The impact needle impacts the ultrathin substrate with low force for 0.5S. Stress relief grooves are processed around the anchoring groove on the ultrathin substrate. The stress relief grooves are staggered with the anchoring grooves, and the depth of the stress relief grooves is lower than the depth of the anchoring grooves. After the impact is completed, the piezoelectric actuator and the electromagnet are de-energized, and the connecting rod, the impact plate and the impact needles are reset.
[0014] S3, heating and pressing the copper foil with the ultra-thin substrate: The copper foil is covered in the anchoring groove area of the ultra-thin substrate, and the edge of the copper foil is aligned with the anchoring groove area. The output shaft of the third motor drives the rotating shaft to rotate on the bracket. The rotating shaft drives the L-shaped rod to rotate. The pressing head and the electric heating film on the L-shaped rod rotate to the downward position. The clearance groove on the surface of the pressing head corresponds to the anchoring groove on the ultra-thin substrate. The temperature of the first lead screw is raised to 180°C for 10 seconds. The electric push rod is started. The electric push rod drives the pressing head to move in the vertical direction to heat and press the copper foil with the top surface of the ultra-thin substrate.
[0015] S4. Using the same steps S1, S2 and S3, the copper foil is heated and pressed onto the bottom surface of the ultrathin substrate. The copper foil is pressed onto the top and bottom surfaces of the ultrathin substrate to form a copper-clad laminate. The copper-clad laminate is then cut to obtain a single surface-mount fuse chip.
[0016] Furthermore, the method for tightly adsorbing the ultrathin substrate onto the fixed adsorption mechanism in S1 is as follows: start the vacuum generator, the vacuum generator extracts the air inside the adsorption chamber, and multiple adsorption holes tightly adsorb the ultrathin substrate onto the adsorption shell.
[0017] Furthermore, the method for adjusting the position of the preparation mechanism in S1 and S2 is as follows: the output shaft of the first motor drives the first lead screw to rotate, the second slider drives the sliding plate to slide horizontally on the first lead screw, the output shaft of the second motor drives the second lead screw to rotate, the first slider drives the electric push rod and the preparation mechanism to slide horizontally on the second lead screw, and the electric push rod drives the preparation mechanism to move vertically, which can adjust the position of the preparation mechanism in multiple directions.
[0018] Furthermore, the method of heating and pressing the copper foil to the top surface of the ultrathin substrate in S3 includes the following steps: S301, pre-pressing stage: the electric push rod applies a pressure of 10N to the pressing head and the electric heating film for 1 second, expelling the air between the copper foil and the ultrathin substrate, achieving initial bonding between the copper foil and the ultrathin substrate; S302, final pressing stage: the electric push rod applies a pressure of 5N to the pressing head and the electric heating film for 2 seconds, heating the electric heating film to soften and deform the copper foil, fully embedding the copper foil into the anchoring groove of the ultrathin substrate; S303, pressure holding and release stage: the electric push rod slowly releases pressure at a speed of 0.5N / s to prevent the copper foil from rebounding due to a sudden drop in pressure. After pressure release, the electric push rod moves the pressing head 50mm and stops moving, the electric heating film is de-energized, and it cools naturally to room temperature.
[0019] The beneficial effects of the present invention are as follows: (1) The present invention uses an ultra-thin substrate that is tightly adsorbed onto the adsorption shell, avoiding the edge stress concentration and micro-deformation problems caused by traditional mechanical clamping. The position of the preparation mechanism is adjusted to ensure that the pressing head, the impact needle and the substrate to be processed overlap, effectively avoiding the subsequent problems of misalignment of the anchoring groove and offset of the copper foil bonding, and providing a precise position for the subsequent processes of impact anchoring groove and heating pressing.
[0020] (2) In the high-intensity impact stage, the piezoelectric actuator provides a fast-response longitudinal thrust, which, combined with the attraction force of the electromagnet on the magnetic block, drives the impact needle to complete the formation of an array of anchoring grooves, providing a reliable mechanical interlocking basis for copper foil embedding. In the low-intensity impact stage, the electromagnet switches to a weak repulsion mode to offset part of the piezoelectric thrust and reduce the impact force. Shallow stress relief grooves are chiseled around the anchoring grooves. The stress relief grooves effectively release the internal stress of the substrate due to cold rolling or laser cutting by inducing local plastic deformation, improving the overall flatness and preventing warping deformation after pressing.
[0021] (3) The pressing head of the present invention rotates and then presses down vertically to achieve a seamless transition from impact to pressing. Its surface clearance groove is precisely matched with the pre-processed anchoring groove array to avoid damage to the microstructure during the pressing process. The electric heating film is rapidly heated to 180°C and kept at that temperature for 10 seconds, so that the copper foil is softened by heat and is more easily embedded into the anchoring groove to form a firm pressing. The pressing process is divided into three stages: pre-pressing, final pressing and pressure holding and release. Pre-pressing achieves initial bonding, final pressing promotes the copper foil to fully fill the microgroove and enhances the bonding force, and pressure holding and release effectively suppresses elastic rebound and maintains pressing stability. The interface pressing quality of copper foil and ultra-thin substrate is comprehensively improved by segmented heating and pressurization. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of an embodiment of the ultra-thin patch fuse manufacturing system of the present invention.
[0023] Figure 2 This is a schematic diagram of the position adjustment mechanism and the preparation mechanism.
[0024] Figure 3 yes Figure 2 A structural diagram from another angle.
[0025] Figure 4 This is a schematic diagram of the preparation mechanism.
[0026] Figure 5 This is a schematic diagram of the internal structure of the impact head.
[0027] Figure 6 It is a structural diagram of the magnetic block, connecting rod, electromagnet, impact plate and impact needle.
[0028] Figure 7 This is a schematic diagram of the fixed adsorption mechanism.
[0029] Figure 8 This is a schematic diagram of the internal structure of the adsorption shell.
[0030] Reference numerals: 1. Cabinet; 2. Support frame; 3. Top plate; 4. Position adjustment mechanism; 401. First motor; 402. Fixing plate; 403. Second motor; 404. Electric push rod; 405. Sliding plate; 406. First lead screw; 407. Second lead screw; 408. First slider; 409. Second slider; 5. Preparation mechanism; 501. Third motor; 502. L-shaped rod; 503. Impact head; 504. 505. Impact plate; 506. Electric heating film; 507. Clearance groove; 508. Pressing head; 509. Impact needle; 510. Support; 511. Piezoelectric actuator; 512. Magnetic block; 513. Connecting rod; 514. Electromagnet; 515. Rotating shaft; 6. Ultra-thin substrate; 7. Fixed adsorption mechanism; 701. Adsorption housing; 702. Adsorption hole; 703. Vacuum generator; 704. Rubber ring; 705. Adsorption chamber. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.
[0032] like Figure 1 As shown, the ultra-thin patch fuse preparation system of this embodiment consists of a cabinet 1, a support frame 2, a top plate 3, a position adjustment mechanism 4, a preparation mechanism 5, an ultra-thin substrate 6, a fixing and adsorption mechanism 7, and copper foil connection.
[0033] A fixing and adsorption mechanism 7 for adsorbing the ultrathin substrate 6 is provided on the cabinet 1. Multiple support frames 2 are provided on the cabinet 1. A top plate 3 is provided on the top of the multiple support frames 2. A position adjustment mechanism 4 is provided at the bottom of the top plate 3. A preparation mechanism 5 for pressing copper foil onto the upper and lower surfaces of the ultrathin substrate 6 to form a copper foil laminate is provided at the bottom of the position adjustment mechanism 4.
[0034] like Figures 2 to 3 As shown, the position adjustment mechanism 4 is composed of a first motor 401, a fixed plate 402, a second motor 403, an electric push rod 404, a sliding plate 405, a first lead screw 406, a second lead screw 407, a first slider 408, and a second slider 409 connected together.
[0035] The position adjustment mechanism 4 consists of: a fixed plate 402 at the bottom of the top plate 3; a first lead screw 406 rotatably mounted on the fixed plate 402; a first motor 401 mounted on the fixed plate 402; the output shaft of the first motor 401 fixedly connected to one end of the first lead screw 406; the first lead screw 406 threadedly connected to a second slider 409; a sliding plate 405 at the bottom of the second slider 409, located below the fixed plate 402; and the straight line of the fixed plate 402 perpendicular to the straight line of the sliding plate 405. A second lead screw 407 rotatably mounted on the sliding plate 405; a second motor 403 mounted on the sliding plate 405; the output shaft of the second motor 403 fixedly connected to one end of the second lead screw 407; the second lead screw 407 threadedly connected to a first slider 408; and an electric push rod 404 at the bottom of the first slider 408 fixedly connected to the preparation mechanism 5.
[0036] like Figures 2 to 6 As shown, the preparation mechanism 5 is composed of a third motor 501, an L-shaped rod 502, an impact head 503, an impact plate 504, an electrically heated film 505, a clearance groove 506, a pressing head 507, an impact needle 508, a bracket 509, a piezoelectric actuator 510, a magnetic block 511, a connecting rod 512, an electromagnet 513, and a rotating shaft 514.
[0037] The fabrication mechanism 5 consists of: a support 509 at the bottom of the position adjustment mechanism 4; an L-shaped rod 502 rotatably mounted on the support 509; a rotating shaft 514 rotatably connected to the support 509 on the L-shaped rod 502; a third motor 501 mounted on the support 509; and the output shaft of the third motor 501 fixedly connected to the rotating shaft 514. An impact head 503 is mounted on one side of the L-shaped rod 502. During impact, the impact head 503 is positioned directly above the ultrathin substrate 6. A piezoelectric actuator 510, made of PZT-8 piezoelectric ceramic, is located at the top of the impact head 503. Multiple connecting rods 512, made of TC4 titanium alloy, are located inside the impact head 503 and connected to the piezoelectric actuator 510. Each connecting rod 512 has a [missing information - likely a design element]. There is a magnetic block 511. The impact head 503 is equipped with multiple electromagnets 513 that are magnetically connected to the corresponding magnetic block 511. The bottom of multiple connecting rods 512 is fixedly connected to the impact plate 504. The impact plate 504 is located at the bottom of the impact head 503. The bottom of the impact plate 504 is equipped with multiple impact needles 508 that process anchoring grooves on the ultrathin substrate 6. The other side of the L-shaped rod 502 is equipped with a pressing head 507 for pressing the copper foil to the ultrathin substrate 6. The bottom of the pressing head 507 is equipped with an electrically heated film 505. The electrically heated film 505 is made of polyimide material with a thickness of 0.1mm and is covered with high-temperature resistant silicone. The bottom of the pressing head 507 is equipped with multiple clearance grooves 506 for pressing the copper foil. During the pressing process, the pressing head 507 is located directly above the ultrathin substrate 6.
[0038] like Figures 7 to 8 As shown, the fixed adsorption mechanism 7 is composed of an adsorption shell 701, an adsorption hole 702, a vacuum generator 703, a rubber ring 704, and an adsorption chamber 705 connected together.
[0039] The fixed adsorption mechanism 7 consists of an adsorption housing 701 mounted on the cabinet 1. The adsorption housing 701 is made of aluminum alloy and has an anodized surface, providing a bearing surface for the ultra-thin substrate 6. An adsorption cavity 705 is machined inside the adsorption housing 701. Multiple adsorption holes 702, which are interconnected with the adsorption cavity 705, are machined on the top of the adsorption housing 701. A rubber ring 704 is provided on the top of each adsorption hole 702 to contact the ultra-thin substrate 6, ensuring the sealing between the ultra-thin substrate 6 and the adsorption housing 701 and preventing displacement of the ultra-thin substrate 6 during the pressing process, thus ensuring accurate pressing. A vacuum generator 703 is provided on one side of the adsorption housing 701 to evacuate the air inside the adsorption cavity 705. The adsorption housing 701 not only provides basic positioning for subsequent precision pressing but also reduces frictional damage between the ultra-thin substrate 6 and the adsorption housing 701, avoiding uneven pressing caused by initial offset.
[0040] The ultra-thin patch fuse manufacturing process of this embodiment includes the following steps:
[0041] S1, Processing anchoring grooves on the ultrathin substrate 6: Place the ultrathin substrate 6 in the middle of the top surface of the adsorption housing 701, tightly adsorb the ultrathin substrate 6 onto the fixed adsorption mechanism 7, adjust the position of the preparation mechanism 5, the output shaft of the third motor 501 drives the rotating shaft 514 to rotate on the bracket 509, the rotating shaft 514 drives the L-shaped rod 502 to rotate, the impact head 503 and the impact plate 504 on the L-shaped rod 502 rotate to the downward position, at the same time adjust the impact head 503 to be above the ultrathin substrate 6, so that the distance between the impact needle 508 and the upper surface of the ultrathin substrate 6 is 0.1mm, after the piezoelectric actuator 510 is energized, push the connecting rod 512 to move downward in the vertical direction, the connecting rod 512 drives the impact plate 504 on Multiple impact needles 508 move downwards synchronously, while electromagnet 513 is energized. Electromagnet 513 is magnetically connected to magnetic block 511, controlling the impact force of impact needles 508 to be 8-10N. Multiple impact needles 508 impact the ultrathin substrate 6 for 0.8S, and anchoring grooves are processed on the surface of the ultrathin substrate 6. The anchoring grooves are distributed in a 10×10 array, covering an area of 0.5mm×0.5mm. During the impact, the impact needles 508 remain perpendicular to the ultrathin substrate 6 to ensure that the anchoring grooves are not tilted, forming a firm "anchor point" to provide a mechanical interlocking basis for copper foil pressing. After the impact is completed, the piezoelectric actuator 510 and electromagnet 513 are de-energized, and the connecting rod 512, impact plate 504 and impact needles 508 are reset.
[0042] The method for tightly adsorbing the ultrathin substrate 6 onto the fixed adsorption mechanism 7 is as follows: start the vacuum generator 703, the vacuum generator 703 extracts the air inside the adsorption chamber 705, and multiple adsorption holes 702 tightly adsorb the ultrathin substrate 6 onto the adsorption housing 701.
[0043] S2, Stress-relief grooves are processed around the anchoring groove of the ultrathin substrate 6: The position of the preparation mechanism 5 is adjusted so that the impact needle 508 is aligned with the stress concentration area around the anchoring groove on the ultrathin substrate 6. After the piezoelectric actuator 510 is energized, it pushes the connecting rod 512 to move downward in the vertical direction. The connecting rod 512 drives multiple impact needles 508 on the impact plate 504 to move downward synchronously. At the same time, the electromagnet 513 and the magnetic block 511 have a repulsive effect. The repulsive force cancels the downward force of the connecting rod 512, and the impact force of the impact needle 508 is controlled to be 5-6N. The impact needle 508 impacts the ultrathin substrate 6 with low force for 0.5S. Stress-relief grooves are processed around the anchoring groove on the ultrathin substrate 6. The stress-relief grooves are staggered with the anchoring grooves, and the depth of the stress-relief grooves is lower than the depth of the anchoring grooves. After the impact is completed, the piezoelectric actuator 510 and the electromagnet 513 are de-energized, and the connecting rod 512, the impact plate 504 and the impact needle 508 are reset.
[0044] The piezoelectric actuator 510 generates an impact force, and the electromagnet 513 precisely controls the magnitude of the force by switching between attraction and repulsion. The stress relief groove releases the residual internal stress (such as internal stress generated by cold rolling and laser cutting) of the ultrathin substrate 6 through local plastic deformation, thereby improving the flatness of the ultrathin substrate 6.
[0045] The method for adjusting the position of the preparation mechanism 5 is as follows: the output shaft of the first motor 401 drives the first lead screw 406 to rotate, the second slider 409 drives the sliding plate 405 to slide horizontally on the first lead screw 406, the output shaft of the second motor 403 drives the second lead screw 407 to rotate, the first slider 408 drives the electric push rod 404 and the preparation mechanism 5 to slide horizontally on the second lead screw 407, and the electric push rod 404 drives the preparation mechanism 5 to move vertically, which can adjust the position of the preparation mechanism 5 in multiple directions.
[0046] S3, heat and press the copper foil with the ultrathin substrate 6: cover the anchoring groove area of the ultrathin substrate 6 with the copper foil, align the edge of the copper foil with the anchoring groove area, and use the copper foil as a conductive electrode for the fuse. The copper foil and the anchoring groove are precisely aligned to avoid misalignment of the copper foil and the anchoring groove during subsequent pressing, and to ensure that the copper foil can be fully embedded in the anchoring groove. The output shaft of the third motor 501 drives the rotating shaft 514 to rotate on the bracket 509. The rotating shaft 514 drives the L-shaped rod 502 to rotate. The pressing head 507 and the electric heating film 505 on the L-shaped rod 502 rotate to the downward position. The clearance groove 506 on the surface of the pressing head 507 corresponds to the anchoring groove on the ultrathin substrate 6, raising the temperature of the electric heating film 505 to 180°C for 10 seconds to ensure uniform temperature of the pressing head 507. The electric push rod 404 is activated, and the electric push rod 404 drives the pressing head 507 to move vertically, heating and pressing the copper foil to the top surface of the ultrathin substrate 6. The same steps S1, S2 and S3 are used to heat and press the copper foil to the bottom surface of the ultrathin substrate 6. The copper foil is pressed onto the top and bottom surfaces of the ultrathin substrate 6 to form a copper-clad laminate. The copper-clad laminate is cut to obtain a single surface-mount fuse chip.
[0047] The method of heat-pressing copper foil to the top surface of ultrathin substrate 6 includes the following steps:
[0048] S301, Pre-pressing stage: The electric push rod 404 applies a pressure of 10N to the pressing head 507 and the electric heating film 505 for 1S, thereby expelling the air between the copper foil and the ultra-thin substrate 6 and achieving the initial bonding of the copper foil and the ultra-thin substrate 6.
[0049] S302, final pressing stage: the electric push rod 404 applies a pressure of 25N to the pressing head 507 and the electric heating film 505 for 2S. The electric heating film 505 is heated, causing the copper foil to soften and deform, and fully embedding the copper foil into the anchoring groove of the ultrathin substrate 6.
[0050] S303, Pressure holding and release stage: The electric push rod 404 slowly releases pressure at a speed of 0.5 N / S to prevent the copper foil from rebounding due to a sudden drop in pressure. After the pressure is released, the electric push rod 404 drives the pressing head 507 to rise 50 mm and stop moving. The electric heating film 505 is de-energized and naturally cools to room temperature.
[0051] By combining segmented pressurization and heating, the bonding effect between the copper foil and the ultra-thin substrate 6 is improved, effectively preventing the copper foil from falling off due to vibration and temperature changes during long-term use. Slow pressure release avoids copper foil rebound and ensures the flatness of the ultra-thin substrate 6 after bonding.
[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.
Claims
1. A system for manufacturing ultra-thin patch fuses, characterized in that: A fixing adsorption mechanism (7) for adsorbing the ultrathin substrate (6) is provided on the cabinet (1). Multiple support frames (2) are provided on the cabinet (1). A top plate (3) is provided on the top of the multiple support frames (2). A position adjustment mechanism (4) is provided at the bottom of the top plate (3). A preparation mechanism (5) for pressing copper foil onto the upper and lower surfaces of the ultrathin substrate (6) to form a copper foil laminate is provided at the bottom of the position adjustment mechanism (4). The preparation mechanism (5) is as follows: a support (509) is provided at the bottom of the position adjustment mechanism (4), an L-shaped rod (502) is rotatably mounted on the support (509), a rotating shaft (514) is provided on the L-shaped rod (502) and rotatably connected to the support (509), a third motor (501) is provided on the support (509), the output shaft of the third motor (501) is fixedly connected to the rotating shaft (514), an impact head (503) is provided on one side of the L-shaped rod (502), a piezoelectric actuator (510) is provided at the top inside the impact head (503), and multiple connecting rods (512) connected to the piezoelectric actuator (510) are provided inside the impact head (503), with the top part of each connecting rod (512) having a piezoelectric actuator (510) connected to the piezoelectric actuator (510). A magnetic block (511) is provided. The impact head (503) is provided with multiple electromagnets (513) that are magnetically connected to the corresponding magnetic block (511). The bottom of multiple connecting rods (512) is fixedly connected to the impact plate (504). The impact plate (504) is located at the bottom of the impact head (503). The bottom of the impact plate (504) is provided with multiple impact needles (508) that process anchoring grooves on the ultrathin substrate (6). The other side of the L-shaped rod (502) is provided with a pressing head (507) that presses the copper foil to the ultrathin substrate (6). The bottom of the pressing head (507) is provided with an electrically heated film (505). The bottom of the pressing head (507) is provided with multiple clearance grooves (506) that press the copper foil.
2. The ultra-thin patch fuse manufacturing system according to claim 1, characterized in that: During the impact process, the impact head (503) is located directly above the ultrathin substrate (6), and during the pressing process, the pressing head (507) is located directly above the ultrathin substrate (6).
3. The ultra-thin patch fuse manufacturing system according to claim 1, characterized in that, The position adjustment mechanism (4) is as follows: a fixed plate (402) is provided at the bottom of the top plate (3), a first lead screw (406) is rotatably mounted on the fixed plate (402), a first motor (401) is provided on the fixed plate (402), the output shaft of the first motor (401) is fixedly connected to one end of the first lead screw (406), the first lead screw (406) is threadedly connected to the second slider (409), and a sliding plate (405) is provided at the bottom of the second slider (409). 05) Located below the fixed plate (402), a second lead screw (407) is rotatably mounted on the sliding plate (405). A second motor (403) is provided on the sliding plate (405). The output shaft of the second motor (403) is fixedly connected to one end of the second lead screw (407). The second lead screw (407) is threadedly connected to the first slider (408). An electric push rod (404) is provided at the bottom of the first slider (408). The electric push rod (404) is fixedly connected to the preparation mechanism (5).
4. The ultra-thin patch fuse manufacturing system according to claim 3, characterized in that: The line where the fixed plate (402) is located is perpendicular to the line where the sliding plate (405) is located.
5. The ultra-thin patch fuse manufacturing system according to claim 1, characterized in that, The fixed adsorption mechanism (7) is as follows: an adsorption shell (701) is provided on the cabinet (1), an adsorption cavity (705) is processed inside the adsorption shell (701), a plurality of adsorption holes (702) are processed on the top of the adsorption shell (701) and are respectively connected to the adsorption cavity (705), and a vacuum generator (703) is provided on one side of the adsorption shell (701) to evacuate the air inside the adsorption cavity (705).
6. The ultra-thin patch fuse manufacturing system according to claim 5, characterized in that: Each of the adsorption holes (702) is provided with a rubber ring (704) on top that contacts the ultrathin substrate (6).
7. A process for manufacturing an ultra-thin patch fuse, using the ultra-thin patch fuse manufacturing system according to claim 3, characterized in that, Includes the following steps: S1, Processing anchoring grooves on the ultrathin substrate (6): Place the ultrathin substrate (6) in the middle of the top surface of the adsorption housing (701), and tightly adsorb the ultrathin substrate (6) onto the fixed adsorption mechanism (7). Adjust the position of the preparation mechanism (5), and the output shaft of the third motor (501) drives the rotating shaft (514) to rotate on the bracket (509). The rotating shaft (514) drives the L-shaped rod (502) to rotate. The impact head (503) and the impact plate (504) on the L-shaped rod (502) rotate to the downward position. At the same time, adjust the impact head (503) to be above the ultrathin substrate (6), so that the distance between the impact needle (508) and the upper surface of the ultrathin substrate (6) is 0.1 mm. After the electric actuator (510) is powered on, it pushes the connecting rod (512) to move downward in the vertical direction. The connecting rod (512) drives multiple impact needles (508) on the impact plate (504) to move downward synchronously. At the same time, the electromagnet (513) is powered on and magnetically connected to the magnetic block (511). The impact force of the impact needles (508) is controlled to be 8-10N. Multiple impact needles (508) impact the ultrathin substrate (6) for a duration of 0.8S. Anchoring grooves are processed on the surface of the ultrathin substrate (6). After the impact is completed, the piezoelectric actuator (510) and the electromagnet (513) are de-energized, and the connecting rod (512), the impact plate (504) and the impact needles (508) are reset. S2, Stress relief grooves are processed around the anchoring groove of the ultrathin substrate (6): The position of the preparation mechanism (5) is adjusted so that the impact needle (508) is aligned with the stress concentration area around the anchoring groove on the ultrathin substrate (6). After the piezoelectric actuator (510) is energized, it pushes the connecting rod (512) to move downward in the vertical direction. The connecting rod (512) drives multiple impact needles (508) on the impact plate (504) to move downward synchronously. At the same time, the electromagnet (513) and the magnetic block (511) have a repulsive effect, and the repulsive force cancels the connection rod (512) to move downward. 2) The downward force controls the impact force of the impact needle (508) to be 5-6N. The impact needle (508) impacts the ultrathin substrate (6) with low force for 0.5S. Stress relief grooves are processed around the anchoring groove on the ultrathin substrate (6). The stress relief grooves and the anchoring grooves are staggered, and the depth of the stress relief grooves is lower than the depth of the anchoring grooves. After the impact is completed, the piezoelectric actuator (510) and electromagnet (513) are de-energized, and the connecting rod (512), impact plate (504) and impact needle (508) are reset. S3, heat and press the copper foil with the ultrathin substrate (6): cover the anchoring groove area of the ultrathin substrate (6) with the copper foil, align the edge of the copper foil with the anchoring groove area, the output shaft of the third motor (501) drives the rotating shaft (514) to rotate on the bracket (509), the rotating shaft (514) drives the L-shaped rod (502) to rotate, the pressing head (507) and the electric heating film (505) on the L-shaped rod (502) rotate to the downward state, the clearance groove (506) on the surface of the pressing head (507) corresponds to the anchoring groove on the ultrathin substrate (6), raise the temperature of the first lead screw (406) to 180°C for 10 seconds, start the electric push rod (404), the electric push rod (404) drives the pressing head (507) to move in the vertical direction, heat and press the copper foil with the top surface of the ultrathin substrate (6); S4. Using the same steps S1, S2 and S3, the copper foil is heated and pressed onto the bottom surface of the ultrathin substrate (6). The copper foil is pressed onto the top and bottom surfaces of the ultrathin substrate (6) to form a copper foil laminate. The copper foil laminate is then cut to obtain a single surface mount fuse chip.
8. The manufacturing process of the ultra-thin patch fuse according to claim 7, characterized in that, The method for tightly adsorbing the ultrathin substrate (6) onto the fixed adsorption mechanism (7) in S1 is as follows: start the vacuum generator (703), the vacuum generator (703) extracts the air inside the adsorption chamber (705), and multiple adsorption holes (702) tightly adsorb the ultrathin substrate (6) onto the adsorption shell (701).
9. The manufacturing process of the ultra-thin patch fuse according to claim 7, characterized in that, The method for adjusting the position of the preparation mechanism (5) in S1 and S2 is as follows: the output shaft of the first motor (401) drives the first lead screw (406) to rotate, the second slider (409) drives the sliding plate (405) to slide horizontally on the first lead screw (406), the output shaft of the second motor (403) drives the second lead screw (407) to rotate, the first slider (408) drives the electric push rod (404) and the preparation mechanism (5) to slide horizontally on the second lead screw (407), and the electric push rod (404) drives the preparation mechanism (5) to move vertically, which can adjust the position of the preparation mechanism (5) in multiple directions.
10. The manufacturing process of the ultra-thin patch fuse according to claim 7, characterized in that, The method of heating and pressing the copper foil to the top surface of the ultrathin substrate (6) in S3 includes the following steps: S301, Pre-pressing stage: The electric push rod (404) applies a pressure of 10N to the pressing head (507) and the electric heating film (505) for a pressing time of 1S, thereby expelling the air between the copper foil and the ultra-thin substrate (6) and achieving the initial bonding of the copper foil and the ultra-thin substrate (6). S302, final pressing stage: the electric push rod (404) applies a pressure of 5N to the pressing head (507) and the electric heating film (505) for 2S. The electric heating film (505) is heated, causing the copper foil to soften and deform, and fully embedding the copper foil into the anchoring groove of the ultrathin substrate (6). S303, Pressure holding and release stage: The electric push rod (404) slowly releases pressure at a speed of 0.5N / s to prevent the copper foil from rebounding due to a sudden drop in pressure. After the pressure is released, the electric push rod (404) drives the pressing head (507) to rise 50mm and stop moving. The electric heating film (505) is de-energized and naturally cools to room temperature.
Citation Information
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