A filtering mechanism based on wafer chemical nickel-palladium-gold plating

Abstract

The application discloses a filtering mechanism based on wafer chemical nickel-palladium-gold plating, and belongs to the technical field of filtering and separating, which comprises a pre-filtering mechanism, a V-shaped shunt pipe is arranged at the bottom end of the pre-filtering mechanism, and a liquid flow channel switching mechanism is arranged in the V-shaped shunt pipe; the pre-filtering mechanism comprises a filter cartridge, a patting and pressing mechanism and a turnover mechanism are arranged in the filter cartridge, a filter bag is fixedly sleeved to the outer side of the turnover mechanism; an electric sliding rail is fixedly installed at the outer side of the filter cartridge, and a driving rack is fixedly installed on the sliding block of the electric sliding rail. Through the pre-filtering mechanism, the V-shaped shunt pipe and the liquid flow channel switching mechanism, multi-stage filtering of the plating solution is realized, the pre-filtering mechanism can effectively intercept larger particles, the particles can be prevented from directly entering the precision filter, the burden of the precision filter is significantly reduced, the service life of the filter core is prolonged, and long-term stable operation of the filtering system is ensured.

Description

Technical Field

[0001] This invention relates to the field of filtration and separation technology, specifically to a filtration mechanism based on wafer electroless nickel-palladium-gold plating. Background Technology

[0002] As integrated circuits enter the era of miniaturization and 3D packaging, the surface treatment of wafer copper pads faces severe challenges: copper is prone to oxidation, leading to poor soldering, and it easily forms brittle compounds with solder, affecting connection reliability. Traditional electroless nickel-gold plating carries the risk of "black pads," while electroless nickel-palladium-gold plating, by adding a palladium layer, can effectively block diffusion and prevent oxidation, becoming an ideal solution. Therefore, wafer copper-based pad electroless nickel-palladium-gold plating equipment has emerged. Its core purpose is to selectively deposit three thin films of nickel, palladium, and gold sequentially on each copper pad on the wafer surface in a fully automated, ultra-clean environment using a precise electroless plating method. This forms a high-performance composite metallization structure, providing a near-perfect interface for subsequent chip bonding (such as gold wire bonding and flip chip soldering), ultimately ensuring high yield rates, robust mechanical connections, and excellent long-term electrical reliability in high-end chip packaging.

[0003] Tiny solid particles generated spontaneously during the plating process, as well as externally introduced contaminants, can remain in the plating solution and deposit on the wafer surface, causing defects such as roughness, pitting, porosity, and even poor adhesion in the plating layer, severely affecting product yield. Therefore, a circulating filtration mechanism is installed on the tank containing the plating solution to maintain the chemical purity and stability of the plating solution, prevent the plating solution from self-decomposing, and thus ensure a uniform, dense, and defect-free plating layer, guaranteeing the high reliability of the final chip packaging.

[0004] However, the filtration mechanism in existing electroless nickel-palladium-gold plating equipment is usually a precision filter installed on the circulating filtration loop of the plating solution. Due to the lack of pre-filtration function for the plating solution, the plating solution is directly circulated and filtered by the precision filter. A large number of larger particles in the plating solution will directly enter the filter element. The large particles in the plating solution will directly clog the filter element, resulting in increased resistance and decreased flow rate. This not only shortens the life of the filter element and increases costs, but may also damage the filter element due to high pressure differential, affecting the stability of the filtration system and the cleanliness of the plating solution. Summary of the Invention

[0005] The purpose of this invention is to provide a filtration mechanism based on wafer electroless nickel-palladium-gold plating to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a filtration mechanism based on wafer electroless nickel-palladium-gold plating, including a pre-filtration mechanism, wherein a V-shaped diversion tube is provided at the bottom end of the pre-filtration mechanism, and a liquid flow channel switching mechanism is provided inside the V-shaped diversion tube;

[0007] The pre-filtration mechanism includes a filter cylinder, inside which a tapping and pressing mechanism and a flipping mechanism are provided. A filter bag is fixedly sleeved on the outside of the flipping mechanism, with a filtration accuracy of 5-10μm.

[0008] An electric slide rail is fixedly installed on the outside of the filter cartridge, and a drive rack is fixedly installed on the slider of the electric slide rail.

[0009] The drive rack has three stations:

[0010] At the first station, the drive rack is positioned opposite the liquid flow channel switching mechanism, driving the liquid flow channel switching mechanism to switch the flow direction of the liquid in the V-shaped diverter.

[0011] In the second station, the drive rack is positioned opposite the flipping mechanism, driving the flipping mechanism to rotate the filter bag 180 degrees so that it is upside down.

[0012] In the third station, the drive rack is positioned opposite the tapping and pressing mechanism, driving the tapping and pressing mechanism to tap and press the inverted filter bag.

[0013] As a further description of the above technical solution: the V-shaped diversion pipe is composed of an interconnected circulation channel pipe and a drainage channel pipe.

[0014] As a further description of the above technical solution: the liquid flow channel switching mechanism includes two hollow rubber plates and a rotating shaft, and a full gear and a flow channel switching plate are fixedly sleeved on the outer surface of the rotating shaft.

[0015] As a further description of the above technical solution: the flipping mechanism includes a first hollow frame and a second hollow frame, and a plurality of arc-shaped elastic support bars are fixedly connected between the first hollow frame and the second hollow frame. The first hollow frame is rotatably installed inside the filter cylinder through a second rotating shaft, and one end of the second rotating shaft passes through the filter cylinder and is fixedly connected to a second gear.

[0016] As a further description of the above technical solution: the tapping and pressing mechanism includes a third rotating shaft and a fourth rotating shaft. The third rotating shaft is rotatably and through-mounted on the filter cylinder, and two connecting frames are fixedly connected to the outer surface of the third rotating shaft. A tapping and pressing plate is fixedly connected to the connecting frames. A residual gear is fixedly connected to one end of the third rotating shaft. The fourth rotating shaft is rotatably mounted on the filter cylinder, and a full gear and a residual gear are fixedly sleeved on the outer surface of the fourth rotating shaft.

[0017] As a further description of the above technical solution: a connecting block is fixedly connected to the end of the rotating shaft three away from the residual gear one, and a reset torsion spring is fixedly connected between the connecting block and the filter cylinder.

[0018] As a further description of the above technical solution: the end of the circulation channel pipe away from the filter cylinder is fixedly connected to a return pipe, and a precision filter is installed on the return pipe. The end of the return pipe away from the V-shaped diverter pipe is connected to the plating bath of the electroless nickel-palladium-gold plating equipment. The precision filter is a cartridge filter, which consists of one or more cylindrical PTFE / PFA / ETFE filter elements inside a PFA filter housing; the accuracy range is 0.04μm-1μm.

[0019] As a further description of the above technical solution: the top of the filter cylinder is fixedly connected to a liquid inlet pipe, a liquid pump is installed on the liquid inlet pipe, and the end of the liquid inlet pipe away from the filter cylinder is connected to the bottom end of the plating tank on the electroless nickel-palladium-gold plating equipment.

[0020] As a further description of the above technical solution: the end of the drain channel pipe away from the filter cylinder is fixedly connected to a waste liquid discharge pipe, and the other end of the waste liquid discharge pipe is connected to an external plating solution collection vessel. The plating solution collection vessel collects the plating solution in a unified manner so that the waste plating solution containing precious metals can be treated in a unified manner in the future.

[0021] The present invention has the following beneficial effects:

[0022] This invention achieves multi-stage filtration of plating solution by setting up a pre-filtration mechanism and a V-shaped diversion pipe combined with a liquid flow channel switching mechanism. The pre-filtration mechanism can effectively intercept larger particles, preventing them from directly entering the precision filter, significantly reducing the burden on the precision filter, extending the service life of the filter element, and ensuring the long-term stable operation of the filtration system.

[0023] This invention uses a filter bag as a pre-filtration medium and combines a flipping mechanism and a tapping and pressing mechanism. When it is necessary to replace the plating solution in the plating tank (i.e., drain some or all of the old plating solution and add new plating solution), the filter bag is automatically flipped upside down. The plating solution flows in the filter cylinder to backwash the particles intercepted in the filter bag and taps and presses it. When the tapping and pressing plate taps and presses the hollow frame two, the arc-shaped elastic support strip bends and deforms. When the tapping and pressing plate disengages from the hollow frame two, the arc-shaped elastic support strip returns to its original position, thereby causing the hollow frame two to drive the outer filter bag to shake. This effectively removes the particles attached to the inside of the filter bag and avoids the problem of filter element blockage caused by the accumulation of large particles.

[0024] This invention achieves automatic switching between three workstations through the coordinated control of an electric slide rail and a drive rack: First workstation: Controlling the liquid flow channel switching to automatically change the direction of the plating solution flow. When it is necessary to discharge the plating solution from the tank, the flow channel switching plate automatically flips into the circulation channel pipe and abuts against the hollow rubber plate inside, closing the circulation channel pipe and opening the drain channel pipe; Second workstation: Driving the flipping mechanism to rotate the filter bag 180 degrees to an inverted state, facilitating the cleaning of trapped particles; Third workstation: Driving the tapping and pressing mechanism to backwash and tap / shake the inverted filter bag to remove slag. The entire process requires no manual intervention, improving the automation level and operational safety of the equipment.

[0025] This invention effectively removes particulate contaminants from the plating solution through a dual filtration mechanism of pre-filtration and precision filtration, ensuring the chemical purity and stability of the plating solution. This results in the formation of a uniform, dense, and defect-free nickel-palladium-gold plating layer on the wafer surface, improving the reliability and yield of chip packaging. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of the overall structure of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention;

[0027] Figure 2 This is a schematic diagram of the filter cylinder and electric slide rail of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0028] Figure 3 This is a schematic diagram of the drive rack and gear structure of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0029] Figure 4 This is a schematic diagram of the three types of gears (full gear one, full gear two, and full gear three) of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0030] Figure 5 This is a schematic diagram of the internal structure of the filter cartridge of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0031] Figure 6 This is a schematic diagram of a V-shaped shunt tube and a hollow rubber plate of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0032] Figure 7 This is a schematic diagram of the flipping mechanism of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention;

[0033] Figure 8 This is a schematic diagram of the internal structure of a V-shaped shunt tube in a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention.

[0034] Figure 9 This is a schematic diagram of the filter bag in the inverted state of a filter mechanism based on wafer electroless nickel-palladium-gold plating proposed in this invention;

[0035] Figure 10 This is a schematic diagram of the filtration mechanism based on wafer electroless nickel-palladium-gold plating and its assembly with the plating bath, as proposed in this invention. Figure 1 ;

[0036] Figure 11 This is a schematic diagram of the filtration mechanism based on wafer electroless nickel-palladium-gold plating and its assembly with the plating bath, as proposed in this invention. Figure 2 .

[0037] In the diagram: 1. Pre-filtration mechanism; 101. Filter cylinder; 102. Filter bag; 2. V-shaped diversion pipe; 201. Circulation channel pipe; 202. Drainage channel pipe; 3. Liquid flow channel switching mechanism; 301. Hollow rubber plate; 302. Rotating shaft one; 303. Full gear one; 304. Flow channel switching plate; 4. Tapping and pressing mechanism; 401. Rotating shaft three; 402. Rotating shaft four; 403. Connecting frame; 404. Tapping and pressing plate; 4 05. Residual Gear 1; 406. Full Gear 3; 407. Residual Gear 2; 408. Connecting Block; 409. Reset Torsion Spring; 5. Tilting Mechanism; 501. Hollow Frame 1; 502. Hollow Frame 2; 503. Arc-shaped Elastic Support Bar; 504. Rotating Shaft 2; 505. Full Gear 2; 6. Electric Slide Rail; 7. Drive Rack; 8. Return Pipe; 9. Precision Filter; 10. Liquid Inlet Pipe; 11. Liquid Pump; 12. Waste Liquid Discharge Pipe. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] As attached Figure 1 To be continued Figure 11 As shown: This embodiment provides a filtration mechanism based on wafer electroless nickel-palladium-gold plating, including a pre-filtration mechanism 1, a V-shaped diversion pipe 2 at the bottom end of the pre-filtration mechanism 1, and a liquid flow channel switching mechanism 3 inside the V-shaped diversion pipe 2.

[0040] The pre-filtration mechanism 1 includes a filter cylinder 101. The filter cylinder 101 is provided with a tapping and pressing mechanism 4 and a flipping mechanism 5. A filter bag 102 is fixedly sleeved on the outside of the flipping mechanism 5.

[0041] An electric slide rail 6 is fixedly installed on the outside of the filter cartridge 101, and a drive rack 7 is fixedly installed on the slider of the electric slide rail 6.

[0042] During installation, the pre-filtration mechanism 1 is sealed to the top of the V-shaped diversion pipe 2 via a flange or threaded interface at its bottom. The filter cylinder 101 is made of corrosion-resistant plastic (such as PFA or PP) material, and its interior constitutes the main pre-filtration chamber. The filter bag 102 is preferably made of PTFE material, and its filtration accuracy of 5-10μm is designed to intercept larger particles, flocculent precipitates, or accidentally introduced foreign matter generated by chemical reactions in the plating solution. The electric slide rail 6 is fixed parallel to the outer wall of the filter cylinder 101 by a bracket, and its sliding... The block is precisely driven by a servo motor or stepper motor to ensure the stability of operation; the drive rack 7 itself is a metal strip with teeth, and its length is half the circumference of the full gear. In the initial state, the lower quarter of the drive rack 7 meshes with the full gear 303, so that the drive rack 7 sequentially meshes with the full gears of the three actuators (liquid flow channel switching mechanism 3, flipping mechanism 5, and tapping and pressing mechanism 4) during the sliding process, and drives the full gear 303 to rotate 90 degrees, which in turn drives the full gear 505 to rotate 180 degrees.

[0043] The drive rack 7 has three stations (the drive rack 7 is a strip-shaped structure, and teeth are arranged in different sections on the side facing the filter cartridge 101. When the electric slide rail 6 drives the drive rack 7 to move, these toothed sections can sequentially mesh with the full gear 2 505 of the flipping mechanism 5 and the full gear 3 406 of the tapping and pressing mechanism 4. In the initial state, the first toothed section of the drive rack 7 is meshed with the full gear 1 303 of the liquid flow channel switching mechanism 3):

[0044] At the first station, the drive rack 7 is positioned opposite to the liquid flow channel switching mechanism 3, driving the liquid flow channel switching mechanism 3 to switch the flow direction of the liquid in the V-shaped diversion pipe 2.

[0045] In the second station, the drive rack 7 is positioned opposite to the flipping mechanism 5, driving the flipping mechanism 5 to rotate the filter bag 102 180 degrees so that it is upside down.

[0046] In the third station, the drive rack 7 is positioned opposite the tapping and pressing mechanism 4, driving the tapping and pressing mechanism 4 to tap and press the inverted filter bag 102.

[0047] Furthermore, the V-shaped diversion pipe 2 consists of an interconnected circulation channel pipe 201 and a drainage channel pipe 202.

[0048] In a further embodiment of the present invention, the liquid flow channel switching mechanism 3 includes two hollow rubber plates 301 and a rotating shaft 302. The outer surface of the rotating shaft 302 is fixedly fitted with a full gear 303 and a flow channel switching plate 304. The two hollow rubber plates 301 are respectively fixedly installed inside the circulation flow channel pipe and the drainage flow channel pipe. The included angle between the two hollow rubber plates 301 is 90 degrees. In the initial state, the flow channel switching plate 304 abuts against the hollow rubber plate 301 inside the drainage channel pipe 202. When the drive rack 7 meshes with it at the first station, it drives the rotating shaft 302 to rotate, causing the flow channel switching plate 304 to swing, thereby blocking the entrance of one of the channels and pressing the hollow rubber plate 301 inside the channel to achieve a seal, while opening the other channel.

[0049] In a further embodiment of the present invention, the flipping mechanism 5 includes a first hollow frame 501 and a second hollow frame 502. A plurality of arc-shaped elastic support bars 503 are fixedly connected between the first hollow frame 501 and the second hollow frame 502. The first hollow frame 501 is rotatably installed inside the filter cylinder 101 via a second rotating shaft 504. One end of the second rotating shaft 504 passes through the filter cylinder 101 and is fixedly connected to a second full gear 505. When the drive rack 7 meshes with the second full gear 505 and moves at the second station, it will drive the entire cage structure together with the filter bag 102 to rotate 180 degrees, so that it changes from an upright state to an inverted state.

[0050] In a further embodiment of the present invention, the tapping and pressing mechanism 4 includes a third rotating shaft 401 and a fourth rotating shaft 402. The third rotating shaft 401 is rotatably mounted on the filter cylinder 101, and two connecting brackets 403 are fixedly connected to the outer surface of the third rotating shaft 401. A tapping and pressing plate 404 is fixedly connected to the connecting brackets 403. A residual gear 405 is fixedly connected to one end of the third rotating shaft 401. The fourth rotating shaft 402 is rotatably mounted on the filter cylinder 101, and a full gear 406 and a residual gear 407 are fixedly sleeved on the outer surface of the fourth rotating shaft 402. Initially, residual gear 1 405 and residual gear 2 407 are disengaged. When the drive rack 7 engages with the full gear 3 406 in the third position, it drives the rotating shaft 402 to rotate, causing residual gear 2 407 on the rotating shaft 402 to rotate through a certain angle and engage with residual gear 1 405. After engagement, the continuing to rotate residual gear 2 407 will drive residual gear 1 405 and rotating shaft 3 401 to rotate by a certain angle (e.g., 90 degrees), thereby causing rotating shaft 3 401 and the striking and pressing plate 404 to swing downward by about 60 degrees, completing one striking action. After disengagement, the return torsion spring 409 drives the striking and pressing plate 404 to quickly return to its original position.

[0051] Furthermore, a connecting block 408 is fixedly connected to the end of the rotating shaft 3 401 away from the residual gear 1 405, and a reset torsion spring 409 is fixedly connected between the connecting block 408 and the filter cylinder 101; when the tapping and pressing plate 404 swings downward under the gear drive, the reset torsion spring 409 is tightened and accumulates elastic potential energy; when the drive rack 7 moves and causes the residual gear 2 407 to disengage from the residual gear 1 405, under the elastic force of the reset torsion spring 409, the rotating shaft 3 401 rotates in the opposite direction, driving the tapping and pressing plate 404 to automatically reset to the initial position and tap and press the filter bag 102, and prepare for the next tapping.

[0052] In a further embodiment of the present invention, the end of the circulation channel pipe 201 away from the filter cartridge 101 is fixedly connected to the return pipe 8, and a precision filter 9 is provided on the return pipe 8. The end of the return pipe 8 away from the V-shaped diversion pipe 2 is connected to the plating bath of the electroless nickel-palladium-gold plating equipment. The precision filter 9 is a cartridge filter, which consists of one or more cylindrical PTFE / PFA / ETFE filter elements inside a PFA filter housing. The filtration accuracy can be selected between 0.04μm and 1μm according to the process requirements.

[0053] In a further embodiment of the present invention, the top of the filter cylinder 101 is fixedly connected to an inlet pipe 10, and a liquid pump 11 is provided on the inlet pipe 10. With the liquid pump 11, when the filter mechanism is running, the plating solution in the plating tank can be extracted and transported to the pre-filtration mechanism 1 through the inlet pipe 10 for pre-filtration treatment. The end of the inlet pipe 10 away from the filter cylinder 101 is connected to the bottom end of the plating tank on the electroless nickel-palladium-gold plating equipment.

[0054] In a further embodiment of the present invention, one end of the drain channel pipe 202 away from the filter cylinder 101 is fixedly connected to the waste liquid discharge pipe 12, and the other end of the waste liquid discharge pipe 12 is connected to the external plating solution collection vessel. The plating solution collection vessel collects the plating solution in a unified manner so that the waste plating solution containing precious metals can be treated in a unified manner in the future.

[0055] The full gear 1 303, full gear 2 505 and full gear 3 406 in this invention have the same size, and the pre-filtration mechanism 1, V-shaped diversion pipe 2, liquid flow channel switching mechanism 3, tapping and pressing mechanism 4 and flipping mechanism 5 in this invention are all made of corrosion-resistant materials or have a corrosion-resistant coating on their structural surface to avoid corrosion by chemical plating solution, which would prevent the equipment from operating stably for a long time.

[0056] Working principle:

[0057] The entire filtration system operates based on two modes: "normal filtration" and "automatic sludge removal / liquid discharge".

[0058] 1. Normal Circulation Filtering Mode

[0059] Process: Plating bath tank → Liquid pump 11 → Liquid inlet pipe 10 → Filter cartridge 101 → Filter bag 102 (5-10μm pre-filtration) → V-shaped diversion pipe 2 (passing through circulation channel pipe 201, the flow channel switching plate 304 abuts against the hollow rubber plate 301 inside the drain channel pipe 202, so that the drain channel pipe 202 is in a closed state, and the plating solution cannot flow from the drain channel pipe 202 to the waste liquid discharge pipe 12) → Return pipe 8 → Precision filter 9 (0.04-1μm fine filtration) → Return to plating bath tank;

[0060] Status: In this mode, the liquid flow channel switching mechanism 3 keeps the circulation channel pipe 201 open and the drain channel pipe 202 closed; larger particles in the plating solution are intercepted by the filter bag 102 and adhere to the inner surface of the filter bag 102; the pre-filtered liquid is then filtered by the precision filter 9 to remove fine particles, thereby maintaining the high purity of the plating solution and ensuring the quality of the wafer plating layer.

[0061] 2. Automatic sludge removal and liquid drainage mode

[0062] When the equipment has been running for a period of time and the plating solution in the plating tank needs to be partially or completely replaced, the system will initiate the slag removal and liquid discharge procedure:

[0063] First station (flow channel switching):

[0064] When the electric slide rail 6 operates, it drives the drive rack 7 to move upward. Since the drive rack 7 meshes with the full gear 303 of the liquid flow channel switching mechanism 3, it drives the full gear 303 to rotate, which in turn drives the rotating shaft 302 to rotate, causing the flow channel switching plate 304 to swing. When the drive rack 7 moves upward and completely disengages from the full gear 303, the circulation channel pipe 201 is closed (the flow channel switching plate 304 presses against the hollow rubber plate 301 inside it), and the drain channel pipe 202 is opened at the same time. At this time, the liquid flowing down from the filter bag 102 no longer enters the circulation loop, but turns to the drain channel pipe 202 and is discharged through the waste liquid discharge pipe 12.

[0065] Second station (filter bag 102 flips over):

[0066] When the electric slide rail 6 drives the drive rack 7 to move to the second station, it meshes with the full gear 505 of the flipping mechanism 5. The drive rack 7 moves upward to drive the rotating shaft 504 to rotate. When the drive rack 7 disengages from the full gear 505, the rotating shaft 504 rotates exactly 180 degrees, causing the support body composed of the hollow frame 501, the hollow frame 502 and the arc-shaped elastic support bar 503 and the filter bag 102 outside it to flip 180 degrees as a whole, so that the filter bag 102 is in an upside-down state. At this time, the continuously flowing plating solution backwashes the inside of the upside-down filter bag 102, washing away most of the loosely attached particles from the filter cloth.

[0067] Third station (tapping and descaling):

[0068] The electric slide rail 6 drives the rack 7 to move to the third position and mesh with the full gear 406 of the tapping and pressing mechanism 4. The movement of the rack 7 first drives the full gear 406 to rotate, and drives the rotating shaft 402 to rotate, so that the residual gear 407 on the rotating shaft 402 and the residual gear 405 on the rotating shaft 401 enter the meshing state. When the movement continues, the residual gear 407 drives the residual gear 405 to rotate, which drives the rotating shaft 401 and the tapping and pressing plate 404 on it to swing downward, and forcefully tapping and pressing the bottom of the inverted filter bag 102 (i.e., the hollow frame 502).

[0069] The tapping pressure causes the arc-shaped elastic support bar 503 to bend and deform; when the residual gear 2 407 disengages from the residual gear 1 405, the tapping and pressing plate 404 rebounds rapidly under the action of the reset torsion spring 409, driving another tapping and pressing plate 404 to tap and press the other side of the filter bag 102. At the same time, when the arc-shaped elastic support bar 503 resets instantly, it causes the entire filter bag 102 to shake violently. The combined action of "backwashing + tapping + shaking" can efficiently and thoroughly remove the particles stubbornly attached to the filter bag 102. These impurities are collected uniformly in the plating solution collection vessel through the opened drain channel pipe 202 and the waste liquid discharge pipe 12, along with the plating solution to be discharged.

[0070] 3. Reset and Cyclic Restart:

[0071] After the slag removal process is completed, the electric slide rail 6 drives the drive rack 7 to move down and return to the initial position; the tapping and pressing mechanism 4 is reset under the action of the reset torsion spring 409, the filter bag 102 is flipped back to the upright state under the drive of the flipping mechanism 5, the flow channel switching plate 304 is reset to open the circulation channel pipe 201, the system returns to the normal circulation filtration mode, and continues to provide clean plating solution for the chemical plating process.

[0072] This filtration system employs a dual mechanism of pre-filtration and precision filtration, combined with functions such as automatic flow channel switching, slag removal by flipping, and slag shaking, to achieve efficient and automated filtration and maintenance of wafer electroless nickel-palladium-gold plating solutions, significantly improving filter life, system stability, and plating quality.

[0073] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A filtration mechanism based on wafer electroless nickel-palladium-gold plating, characterized in that: It includes a pre-filtration mechanism (1), the bottom end of which is provided with a V-shaped diversion pipe (2), and the interior of the V-shaped diversion pipe (2) is provided with a liquid flow channel switching mechanism (3). The pre-filtration mechanism (1) includes a filter cylinder (101), and the filter cylinder (101) is provided with a tapping and pressing mechanism (4) and a flipping mechanism (5) inside. A filter bag (102) is fixedly sleeved on the outside of the flipping mechanism (5). An electric slide rail (6) is fixedly installed on the outside of the filter cylinder (101), and a drive rack (7) is fixedly installed on the slider of the electric slide rail (6). The drive rack (7) has three stations: At the first station, the drive rack (7) is positioned opposite to the liquid flow channel switching mechanism (3), driving the liquid flow channel switching mechanism (3) to switch the flow direction of the liquid in the V-shaped diversion pipe (2); In the second station, the drive rack (7) is positioned opposite to the flipping mechanism (5), driving the flipping mechanism (5) to run and flip the filter bag (102) 180 degrees so that it is upside down; In the third station, the drive rack (7) is positioned opposite to the tapping and pressing mechanism (4), driving the tapping and pressing mechanism (4) to run and tap and press the inverted filter bag (102). The liquid flow channel switching mechanism (3) includes two hollow rubber plates (301) and a rotating shaft (302). The outer surface of the rotating shaft (302) is fixedly fitted with a full gear (303) and a flow channel switching plate (304). The flipping mechanism (5) includes a first hollow frame (501) and a second hollow frame (502). Multiple arc-shaped elastic support bars (503) are fixedly connected between the first hollow frame (501) and the second hollow frame (502). The first hollow frame (501) is rotatably installed in the filter cylinder (101) through the second rotating shaft (504). One end of the second rotating shaft (504) passes through the filter cylinder (101) and is fixedly connected to the second gear (505). The tapping and pressing mechanism (4) includes a third rotating shaft (401) and a fourth rotating shaft (402). The third rotating shaft (401) is rotatably mounted on the filter cylinder (101), and two connecting frames (403) are fixedly connected to the outer surface of the third rotating shaft (401). A tapping and pressing plate (404) is fixedly connected to the connecting frame (403). A residual gear (405) is fixedly connected to one end of the third rotating shaft (401). The fourth rotating shaft (402) is rotatably mounted on the filter cylinder (101), and a full gear (406) and a residual gear (407) are fixedly sleeved on the outer surface of the fourth rotating shaft (402). A connecting block (408) is fixedly connected to the end of the rotating shaft three (401) away from the residual gear one (405), and a reset torsion spring (409) is fixedly connected between the connecting block (408) and the filter cylinder (101).

2. The filtration mechanism based on wafer electroless nickel-palladium-gold plating according to claim 1, characterized in that: The V-shaped diversion pipe consists of an interconnected circulation channel pipe (201) and a drainage channel pipe (202).

3. The filtration mechanism based on wafer electroless nickel-palladium-gold plating according to claim 2, characterized in that: The end of the circulation channel pipe (201) away from the filter cylinder (101) is fixedly connected to the return pipe (8), and a precision filter (9) is provided on the return pipe (8).

4. The filtration mechanism based on wafer electroless nickel-palladium-gold plating according to claim 1, characterized in that: The top of the filter cartridge (101) is fixedly connected to the liquid inlet pipe (10), and a liquid pump (11) is installed on the liquid inlet pipe (10).

5. A filter mechanism based on wafer electroless nickel-palladium-gold plating according to claim 2, characterized in that: The end of the drain channel pipe (202) away from the filter cylinder (101) is fixedly connected to the waste liquid discharge pipe (12).

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