Micro-hemisphere chamfering device and method

Abstract

The device comprises a main rack, a moving mechanism, a tilting driving mechanism arranged on the moving mechanism, a chamfering structure rotationally mounted on the moving mechanism and a mounting seat rotationally mounted on the main rack, and the mounting seat is arranged on one side of the chamfering structure and used for fixing a micro hemisphere with an upward opening. The chamfering structure comprises a mounting plate, a balancing weight and a grinding wheel mechanism, the mounting plate is hinged to the moving mechanism, the balancing weight and the grinding wheel mechanism are arranged on the mounting plate and arranged on the two sides, in the axial direction of the grinding wheel mechanism, of the hinging mechanism correspondingly, and the balancing weight can move in the axial direction of the grinding wheel mechanism relative to the mounting plate; and the tilting driving mechanism drives the mounting plate to tilt to a working state or a non-working state in the vertical plane around the hinge point. The micro-hemisphere grinding head can avoid the phenomenon that the micro-hemisphere collapses or is crushed at the moment when the grinding head makes contact with the lip edge of the micro-hemisphere due to too large pressure.

Description

Technical Field

[0001] This invention relates to the field of solid gyroscope manufacturing technology, specifically to a micro-hemispherical chamfering device and method. Background Technology

[0002] Microspheres belong to the hemispherical resonant gyroscope family. They are solid-state wave gyroscopes based on the Coriolis effect, offering the advantage of low cost and representing an important direction for future gyroscope development. Conventional microspheres are formed by blowing planar quartz sheets, resulting in small size, thin walls, light weight, difficulty in ensuring dimensional consistency, and fragility. After forming, the microsphere requires skirt cutting to remove excess molding material, maintaining good shape symmetry and minimizing frequency fragmentation. However, after skirt cutting, the microsphere's lip edge remains sharp. This sharp edge can cause chipping during subsequent grinding and polishing, leading to a deterioration in the Q-value and frequency fragmentation. Chamfering the lip before grinding and polishing significantly reduces chipping.

[0003] However, quartz is fragile, and the lip wall of the micro-hemispherical is extremely thin, only about 150um. Using conventional chamfering devices often leads to chipping or damage to the micro-hemispherical. Summary of the Invention

[0004] To address the problems in the background art, this invention proposes a micro-hemispherical chamfering device, which can prevent the micro-hemispherical from chipping or being damaged when the grinding head contacts the lip edge of the micro-hemispherical due to excessive pressure. Correspondingly, a method for achieving inner and outer chamfering of the micro-hemispherical using the above-mentioned device is also provided.

[0005] The present invention adopts the following technical solution: A micro-hemispherical chamfering device includes: a main frame, a moving mechanism, a tilting drive mechanism disposed on the moving mechanism, a chamfering structure rotatably mounted on the moving mechanism, and a mounting base rotatably mounted on the main frame. The mounting base is disposed on one side of the chamfering structure and is used to fix the micro-hemispherical with its opening facing upwards. The chamfering structure includes a mounting plate, a counterweight, and a grinding wheel mechanism. The mounting plate is hinged to the moving mechanism via a hinge mechanism. The counterweight and grinding wheel mechanism are mounted on the mounting plate and are located on opposite sides of the hinge mechanism along the axial direction of the grinding wheel mechanism. The counterweight can move relative to the mounting plate along the axial direction of the grinding wheel mechanism. The grinding wheel mechanism includes a grinding wheel motor and a grinding wheel assembly. The grinding wheel motor is connected to the grinding wheel assembly via a transmission and is used to drive the grinding wheel assembly to rotate circumferentially. The tilting drive mechanism is mounted on the main frame and is connected to the mounting plate via a transmission. It is used to drive the mounting plate to tilt around the hinge point in the vertical plane to either the working or non-working state. During the process of the mounting plate rotating from the non-working state to the working state... The grinding wheel mechanism at one end of the mounting plate tilts toward the mounting base below it until its central axis forms a set angle with the central axis of the micro-hemispherical part on the mounting base. The moving mechanism is used to drive the tilting drive mechanism and the chamfering structure to move so that the grinding wheel mechanism comes into contact with or disengages from the circumference of the micro-hemispherical part to be chamfered on the mounting base.

[0006] Optionally, the weight of the counterweight is 0.8-1.2 times the weight of the grinding wheel mechanism.

[0007] Optionally, the tilting drive mechanism includes a drive cylinder, a pull plate, and a stop. The drive cylinder is located below the end of the mounting plate with the counterweight and is arranged vertically. The cylinder barrel of the drive cylinder is fixed to the moving mechanism. The piston rod of the drive cylinder extends from the upper end of the cylinder barrel. One end of the pull plate passes through the extended end of the piston rod, and the other end of the pull plate is fixed to the hinge mechanism. The stop is located at the end of the extended end of the piston rod. The pull plate has an inclined state corresponding to the non-working state of the mounting plate and a horizontal state corresponding to the working state of the mounting plate. When the drive cylinder retracts, the stop member descends to abut against the pull plate in the horizontal state, thereby driving the mounting plate to rotate around the hinge point to the non-working state. At this time, the pull plate is converted to the inclined state. When the drive cylinder extends, the downward pressure of the stop member on the inclined pull plate decreases, and the mounting plate rotates in the opposite direction around the hinge point to the working state under the gravity of the grinding wheel mechanism. At this time, the pull plate is converted to the horizontal state.

[0008] Optionally, the moving mechanism includes a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is mounted on the main frame, and the vertical moving mechanism is slidably mounted on the horizontal moving mechanism. The chamfering structure is hinged to the vertical moving mechanism. The vertical moving mechanism is used to drive the chamfering structure to move up and down, and the horizontal moving mechanism is used to drive the vertical moving mechanism and the chamfering structure to move horizontally, so that the grinding wheel mechanism contacts or disengages from the circumference of the micro-hemispherical part to be chamfered on the mounting base.

[0009] Optionally, it also includes a micrometer, which is mounted on the vertical moving mechanism. The central axis of the micrometer is in the same plane as the central axis of the grinding wheel mechanism in the working state. The micrometer is used to adjust to abut against the mounting plate in the working state.

[0010] Optionally, the grinding wheel assembly includes a grinding wheel shaft and a grinding wheel. The grinding wheel shaft is rotatably mounted on the mounting plate via a grinding wheel bearing. Both ends of the shaft extend from the grinding wheel bearing. The extended end near the grinding wheel motor is connected to the grinding wheel motor via a grinding wheel shaft sleeve. The other extended end fixes the grinding wheel. The grinding end of the grinding wheel is covered with a slow rebound buffer, and the surface of the slow rebound buffer is covered with sandpaper.

[0011] Optionally, the slow rebound buffer is made of sponge.

[0012] Optionally, a screw is rotatably mounted on the mounting plate along the axial direction of the grinding wheel mechanism, the counterweight is threadedly connected to the screw, and two locking nuts are also threadedly connected to the screw, with the two locking nuts located on both sides of the counterweight along the axial direction of the grinding wheel mechanism.

[0013] Optionally, the mounting base is connected to a rotary drive mechanism for driving the mounting base to rotate horizontally in the circumferential direction.

[0014] Optionally, the rotary drive mechanism includes a drive motor, a belt drive mechanism, and a main shaft. The main shaft is rotatably mounted on the main frame via a drive bearing. A mounting base is fixed to the upper end of the main shaft. A secondary frame is provided on one side of the main frame. The drive motor is fixed to the secondary frame. The main pulley of the belt drive mechanism is connected to the drive motor, and its driven pulley is fixed to the main shaft. The belt is tensioned between the main pulley and the driven pulley.

[0015] Optionally, the hinge mechanism includes a hinge shaft, a bushing fixed on the hinge shaft, and a hinge bearing rotatably connected to the hinge shaft, with the hinge bearing fixed on the moving mechanism.

[0016] As a general inventive concept, the present invention also provides a method for achieving micro-hemispherical chamfering using the above-mentioned micro-hemispherical chamfering device, comprising: S1: Adjust the position of the counterweight on the mounting plate so that the weight of the chamfered structure is equal to the set value; S2: Start the tilt drive mechanism to drive the mounting plate to tilt until the central axis of the grinding wheel mechanism and the central axis of the micro-hemispherical on the mounting base are at a set angle; S3: Start the moving mechanism to drive the tilting drive mechanism and the chamfering structure to move so that the grinding wheel mechanism comes into contact with the circumference of the micro-hemispherical part to be chamfered on the mounting base; S4: Drive the grinding wheel assembly and the mounting base to rotate respectively, so that the grinding wheel assembly can chamfer the circumference of the micro-hemispherical part to be chamfered.

[0017] Compared with the prior art, the advantages of the present invention are as follows: This invention utilizes a lever-type chamfering structure. A counterweight is added to one side of the hinge point of the mounting plate, while the chamfering structure is fixed on the other side. Therefore, the lever principle can be adopted. By controlling the position of the counterweight, when the chamfering mechanism of the elastic grinding head is deflected to the point where the elastic grinding head contacts the micro-hemispherical for chamfering, the pressure applied by the grinding wheel head to the lip of the micro-hemispherical during chamfering is controlled to be only about 0.5 kgf. This avoids the phenomenon of the micro-hemispherical chipping or being crushed at the moment of contact between the grinding head and the lip of the micro-hemispherical due to excessive pressure. Attached Figure Description

[0018] To facilitate understanding of the invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of the invention and should not be considered as limiting the scope of protection of the invention.

[0019] Figure 1 This is a three-dimensional structural diagram of the micro-hemispherical chamfering device in operation according to an embodiment of the present invention.

[0020] Figure 2 This is a cross-sectional structural diagram of the micro-hemispherical chamfering device in operation according to an embodiment of the present invention.

[0021] Figure 3 This is a three-dimensional structural diagram of the micro-hemispherical chamfering device in a non-working state according to an embodiment of the present invention.

[0022] Figure 4 This is a partial cross-sectional structural diagram of the micro-hemispherical chamfering device according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the grinding wheel chamfering the outer edge of the micro-hemispherical lip.

[0024] Figure 6 This is a schematic diagram of the grinding wheel performing an inner chamfer on the edge of the micro-hemispherical lip.

[0025] Figure label: 1. Main frame; 2. Mounting tube; 3. Mounting base; 4. Grinding wheel assembly; 41. Grinding wheel; 42. Grinding wheel shaft; 43. Grinding wheel bearing; 44. Grinding wheel bushing; 45. Slow rebound buffer; 46. Sandpaper; 5. Grinding wheel motor; 6. Counterweight; 61. Mounting plate; 62. Locking nut; 63. Fixed base; 64. Screw; 7. Tilting drive mechanism; 71. Pull plate; 72. Piston rod; 73. Cylinder; 74. L 75. Profile plate; 8. Stop; 9. Hinge mechanism; 10. Hinge bearing; 11. Bushing; 12. Hinge shaft; 13. Vertical moving mechanism; 14. Horizontal moving mechanism; 15. Micrometer; 16. Fixed plate; 17. Microsphere; 18. Adhesive; 19. Rotary drive mechanism; 10. Drive motor; 10. Main shaft; 11. Drive bearing; 12. Main pulley; 13. Driven pulley; 14. Belt; 15. Sub-frame. Detailed Implementation

[0026] The embodiments of the present invention are described below with reference to the accompanying drawings to enable those skilled in the art to better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0027] like Figures 1-4As shown, the micro-hemispherical chamfering device of this embodiment includes: a main frame 1, a moving mechanism, a tilting drive mechanism 7 disposed on the moving mechanism, a chamfering structure rotatably mounted on the moving mechanism, and a mounting base 3 rotatably mounted on the main frame 1. The mounting base 3 is disposed on one side of the chamfering structure and is used to fix the micro-hemispherical with the opening facing upward. The chamfering structure includes a mounting plate 61, a counterweight 6, and a grinding wheel mechanism. The mounting plate 61 is hinged to the moving mechanism via a hinge mechanism 8. The counterweight 6 and the grinding wheel mechanism are mounted on the mounting plate 61 and are located on opposite sides of the hinge mechanism 8 along the axial direction of the grinding wheel mechanism. The counterweight 6 can move relative to the mounting plate 61 along the axial direction of the grinding wheel mechanism. The grinding wheel mechanism includes a grinding wheel motor 5 and a grinding wheel assembly 4. The grinding wheel motor 5 is connected to the grinding wheel assembly 4 for driving the grinding wheel assembly 4 to rotate circumferentially. The tilting drive mechanism 7 is connected to the mounting plate 61 for driving the mounting plate 61 to tilt around the hinge point in the vertical plane to either a working state or a non-working state. During the process of the mounting plate 61 rotating from the non-working state to the working state... The grinding wheel mechanism at one end of the mounting plate 61 tilts toward the mounting base 3 below it until its central axis forms a set angle with the central axis of the micro-hemispherical on the mounting base 3. The moving mechanism is used to drive the tilting drive mechanism 7 and the chamfering structure to move so that the grinding wheel mechanism comes into contact with or disengages from the circumference of the micro-hemispherical part to be chamfered on the mounting base 3.

[0028] Therefore, by designing a lever-type chamfering structure, a counterweight is added to one side of the hinge point of the mounting plate, and the chamfering structure is fixed on the other side. Thus, the lever principle can be used. By controlling the position of the counterweight, when the chamfering mechanism of the elastic grinding head is deflected to the point where the elastic grinding head contacts the micro-hemispherical for chamfering, the pressure weight of the grinding wheel head on the lip edge of the micro-hemispherical during chamfering is controlled to be only about 0.5 kgf. This can avoid the phenomenon of the micro-hemispherical chipping or being crushed at the moment of contact between the grinding head and the lip edge of the micro-hemispherical due to excessive pressure.

[0029] In this embodiment, the weight of the counterweight 6 is 0.8-1.2 times the weight of the grinding wheel mechanism.

[0030] The counterweight should weigh 0.8-1.2 times the weight of the grinding wheel mechanism. The counterweight's position can be adjusted along the grinding wheel's axial direction on one side of the hinge point. Weigh the descending weight on the mounting plate using a spring scale, controlling it to approximately 0.5 kgf. If the control force is less than the specified value, loosen the locking nuts on both sides of the counterweight and adjust it towards a slightly hemispherical direction; if the control force is greater than the specified value, adjust the counterweight backward. After adjustment, tighten the locking nuts to prevent the counterweight from moving.

[0031] In this embodiment, the tilting drive mechanism 7 includes a drive cylinder, a pull plate 71, and a stop 75. The drive cylinder is located below the mounting plate 61 with the counterweight 6 at one end and is arranged vertically. The cylinder barrel 73 of the drive cylinder is fixed to the moving mechanism. The piston rod 72 of the drive cylinder extends from the upper end of the cylinder barrel 73. One end of the pull plate 71 passes through the extended end of the piston rod 72, and the other end of the pull plate 71 is fixed to the hinge mechanism 8. The stop 75 is located at the end of the extended end of the piston rod 72. The pull plate 71 has an inclined state corresponding to the non-working state of the mounting plate 61 and a horizontal state corresponding to the working state of the mounting plate 61. When the drive cylinder retracts, the stop 75 descends to abut against the horizontal pull plate 71, thereby driving the mounting plate 61 to rotate around the hinge point to the non-working state. At this time, the pull plate 71 is converted to the inclined state. When the drive cylinder extends, the downward pressure of the stop 75 on the inclined pull plate 71 decreases, and the mounting plate 61 rotates in the opposite direction around the hinge point to the working state under the gravity of the grinding wheel mechanism. At this time, the pull plate 71 is converted to the horizontal state.

[0032] Therefore, by designing a pull plate that matches the chamfering structure, it is inserted through the piston rod extension end of the drive cylinder. A plunger is designed on the piston rod extension end as a stop. By using pneumatic or hydraulic pressure to push the piston to extend or retract, the pull plate can drive the chamfering structure to tilt in both directions. When the drive cylinder extends, the pull plate moves slowly under the control of the pressure regulating nozzle or hydraulic nozzle of the drive cylinder, pulling the weight-controlled chamfering structure towards the micro-hemispherical lip along the grinding and polishing direction until it contacts the top of the micrometer. When the cylinder moves downward, it pulls the chamfering structure away, causing the grinding head to rise slowly and ending the chamfering process. This avoids damage to the micro-hemispherical due to excessive impact force at the moment of contact or separation between the grinding wheel and the micro-hemispherical.

[0033] In this embodiment, the moving mechanism includes a vertical moving mechanism 9 and a horizontal moving mechanism 10. The horizontal moving mechanism 10 is mounted on the main frame 1, and the vertical moving mechanism 9 is slidably mounted on the horizontal moving mechanism 10. The chamfering structure is hinged to the vertical moving mechanism 9. The vertical moving mechanism 9 is used to drive the chamfering structure to move up and down, and the horizontal moving mechanism 10 is used to drive the vertical moving mechanism 9 and the chamfering structure to move horizontally, so that the grinding wheel mechanism contacts or disengages from the circumference of the micro-hemispherical chamfer to be chamfered on the mounting base 3.

[0034] By combining a horizontal motion mechanism and a vertical motion mechanism that uses a gear and rack structure for transmission, the position of the chamfering structure can be adjusted. This allows the device to chamfer the outer lip, inner lip, and outer circle of the center pin of a micro-hemispherical. Furthermore, this device is also suitable for chamfering the lips of micro-hemisphericals of different sizes.

[0035] In this embodiment, a micrometer 11 is also included. The micrometer 11 is mounted on the vertical moving mechanism 9. The central axis of the micrometer 11 is in the same plane as the central axis of the grinding wheel mechanism in the working state. The micrometer 11 is used to adjust to abut against the mounting plate 61 in the working state.

[0036] The lower part of the grinding head is supported by a micrometer, which makes it easy to adjust the contact between the grinding head and the micro-spherical lip so that the chamfer size meets the expectations.

[0037] In this embodiment, the grinding wheel assembly 4 includes a grinding wheel shaft 42 and a grinding wheel 41. The grinding wheel shaft 42 is rotatably mounted on the mounting plate 61 through a grinding wheel bearing 43. Both ends of the shaft extend out of the grinding wheel bearing 43. The extended end near the grinding wheel motor 5 is connected to the grinding wheel motor 5 through a grinding wheel shaft sleeve 44. The other extended end fixes the grinding wheel 41. The grinding end of the grinding wheel 41 is covered with a slow rebound buffer 45, and the surface of the slow rebound buffer 45 is covered with sandpaper 45.

[0038] The grinding wheel adopts an elastic grinding head design with a sponge sandwiched between the grinding wheel and sandpaper. Due to the slow rebound buffering characteristics of the sponge, it can perform uniform chamfering even when the micro-hemispherical bonding is skewed or not concentric with the fixture, and ensure that the micro-hemispherical does not chip or break during chamfering.

[0039] In addition, using a bushing with a longer opening to connect the motor and the grinding wheel mechanism can ensure the coaxiality of the equipment, avoid uneven chamfer size, and facilitate installation.

[0040] In this embodiment, the slow rebound buffer 45 is made of sponge.

[0041] In this embodiment, a screw 64 is rotatably mounted on the mounting plate 61 and arranged along the axial direction of the grinding wheel mechanism. The counterweight 6 is threadedly connected to the screw 64. Two locking nuts 62 are also threadedly connected to the screw 64 and are respectively located on both sides of the counterweight 6 along the axial direction of the grinding wheel mechanism.

[0042] In this embodiment, the mounting base 3 is connected to a rotary drive mechanism 15, which is used to drive the mounting base 3 to rotate horizontally in the circumferential direction.

[0043] In this embodiment, the rotary drive mechanism 15 includes a drive motor 151, a belt drive mechanism, and a main shaft 152. The main shaft 152 is rotatably mounted on the main frame 1 via a drive bearing 153. The mounting base 3 is fixed to the upper end of the main shaft 152. A secondary frame 16 is provided on one side of the main frame 1. The drive motor 151 is fixed on the secondary frame 16. The main pulley 154 of the belt drive mechanism is connected to the drive motor 151. Its driven pulley 155 is fixed on the main shaft 152. Its belt 156 is tensioned between the main pulley 154 and the driven pulley 155.

[0044] By separating the motor that drives the grinding wheel from the integrated design and fixing it separately on the sub-frame, the vibration generated by the motor is isolated from the grinding and polishing body of the micro-hemispherical part. This ensures that the micro-hemispherical part is not affected by the motor vibration during chamfering, further reducing the risk of chipping at the chamfered edge of the micro-hemispherical part.

[0045] In this embodiment, the hinge mechanism 8 includes a hinge shaft 83, a bushing 82 fixed on the hinge shaft 83, and a hinge bearing 81 rotatably connected to the hinge shaft 83. The hinge bearing 81 is fixed on the moving mechanism.

[0046] The method for achieving micro-hemispherical chamfering using the micro-hemispherical chamfering device of this embodiment includes: Step 1: Connect the drive cylinder to the external air source, start the air source, and move the piston rod 72 on the drive cylinder downward, causing the top stop 75 (double-headed nut) to finally contact the pull plate 71, and finally drive the grinding wheel motor 5 and grinding wheel assembly 4 fixed on the mounting plate 61 to slowly rise to the horizontal position through the hinge mechanism 8. Step 2: Fix the micro-hemispherical 13 to the mounting tube 2 with an adhesive 14 such as rosin or paraffin, fix the mounting tube 2 with the micro-hemispherical 13 to the mounting base 3 with screws, and fix the mounting base 3 to the rotary drive mechanism 15. Step 3: Adjust the micrometer 11 fixed to the vertical moving mechanism 9 by the fixing plate 12 so that when the micrometer 11 contacts the mounting plate 61, the grinding wheel assembly 4 will not directly contact the micro hemisphere and the mounting base 3.

[0047] Step 4: Adjust the vertical moving mechanism 9 and the horizontal moving mechanism 10 to move the tilting drive mechanism 7 and the chamfering structure of the main body to a suitable position to ensure that the grinding wheel assembly 4 basically intersects with the center line of the micro-hemispherical. Step 5: Weigh the descending weight on the mounting plate 61 using a spring scale, controlling it to be around 0.5 kgf. If the control force is less than the specified value, loosen the locking nuts 62 on both sides of the counterweight 6 and adjust it towards the slightly hemispherical direction; if the control force is greater than the specified value, adjust the counterweight 6 backward. After adjustment, tighten the locking nuts 62 to prevent the counterweight 6 from moving.

[0048] Step 6: The drive cylinder rises and stops pulling the pull plate 71 for coordinated operation. At this time, the grinding wheel motor 5 and grinding wheel assembly 4 on the mounting plate 61 tilt towards the micro-hemispherical direction under the action of gravity. The cylinder runs slowly under the control of the pressure regulating nozzle, so that the grinding wheel mechanism tilts only at a slow speed. When the gravity increases with the tilt angle and exceeds the rising speed of the cylinder, the nut on the piston rod 72 will contact the pull plate 71, preventing the lever mechanism from tilting towards the micro-hemispherical direction until the cylinder rises again, so that the piston rod 72 no longer contacts the pull plate 72. The lever device will then drive the grinding wheel assembly 4 to move towards the micro-hemispherical direction under the action of gravity until the top of the micrometer 11 contacts the bottom of the mounting plate 61. Step 7: Adjust the vertical moving mechanism 9, the horizontal moving mechanism 10, and the micrometer 11 so that the grinding wheel 41 contacts the chamfered lip of the micro-hemispherical surface; the adjustment positions for the outer and inner chamfers of the lip are shown in the following figures. Figure 5 and Figure 6 ; Step 8: Start the motor of the rotary drive mechanism 15 to drive the mounting base 3 and the micro hemisphere to rotate, and then start the grinding wheel motor 5 to drive the grinding wheel assembly 4 to work. Grind and polish the micro hemisphere for 10-20 seconds to complete the chamfer of about 0.01mm. Step 9: Activate the pneumatic mechanism to make the cylinder move downwards, which in turn drives the lever mechanism to lift away from the micro-hemispherical shape.

[0049] The embodiments described above are merely preferred embodiments of the present invention. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A micro-hemispherical chamfering device, characterized in that, include: The main frame (1), the moving mechanism, the tilting drive mechanism (7) provided on the moving mechanism, the chamfered structure rotatably mounted on the moving mechanism, and the mounting base (3) rotatably mounted on the main frame (1), the mounting base (3) being provided on one side of the chamfered structure for fixing the micro-hemispherical with the opening facing upward. The chamfering structure includes a mounting plate (61), a counterweight (6), and a grinding wheel mechanism. The mounting plate (61) is hinged to the moving mechanism via a hinge mechanism (8). The counterweight (6) and the grinding wheel mechanism are located on the mounting plate (61) and are respectively located on both sides of the hinge mechanism (8) along the axial direction of the grinding wheel mechanism. The counterweight (6) can move relative to the mounting plate (61) along the axial direction of the grinding wheel mechanism. The grinding wheel mechanism includes a grinding wheel motor (5) and a grinding wheel assembly (4). The grinding wheel motor (5) is connected to the grinding wheel assembly (4) for driving the grinding wheel assembly (4) to rotate circumferentially. The tilting drive mechanism (7) is connected to the mounting plate (61) for driving the mounting plate (61) to tilt in the vertical plane around the hinge point to either the working state or the non-working state. During the process of the mounting plate (61) rotating from the non-working state to the working state, The grinding wheel mechanism at one end of the mounting plate (61) tilts toward the mounting base (3) below it until its central axis forms a set angle with the central axis of the micro-hemispherical on the mounting base (3); The moving mechanism is used to drive the tilting drive mechanism (7) and the chamfering structure to move so that the grinding wheel mechanism comes into contact with or disengages from the circumference of the micro-hemispherical part to be chamfered on the mounting base (3).

2. The micro-hemispherical chamfering device according to claim 1, characterized in that, The weight of the counterweight (6) is 0.8-1.2 times the weight of the grinding wheel mechanism.

3. The micro-hemispherical chamfering device according to claim 1 or 2, characterized in that, The tilting drive mechanism (7) includes a drive cylinder, a pull plate (71) and a stop (75). The drive cylinder is located below the end of the mounting plate (61) with a counterweight (6) and is arranged vertically. The cylinder barrel (73) of the drive cylinder is fixed on the moving mechanism. The piston rod (72) of the drive cylinder extends from the upper end of the cylinder barrel (73). One end of the pull plate (71) is inserted through the extended end of the piston rod (72). The other end of the pull plate (71) is fixed to the hinge mechanism (8). The stop (75) is located at the end of the extended end of the piston rod (72). The pull plate (71) has an inclined state corresponding to the non-working state of the mounting plate (61) and a horizontal state corresponding to the working state of the mounting plate (61). When the drive cylinder retracts, the stop (75) descends to abut against the horizontal pull plate (71) to drive the mounting plate (61) to rotate around the hinge point to the non-working state. At this time, the pull plate (71) is converted to the inclined state. When the drive cylinder extends, the downward pressure of the stop (75) on the inclined pull plate (71) decreases, and the mounting plate (61) rotates in the opposite direction around the hinge point to the working state under the gravity of the grinding wheel mechanism. At this time, the pull plate (71) is converted to the horizontal state.

4. The micro-hemispherical chamfering device according to claim 3, characterized in that, The moving mechanism includes a vertical moving mechanism (9) and a horizontal moving mechanism (10). The horizontal moving mechanism (10) is mounted on the main frame (1), and the vertical moving mechanism (9) is slidably mounted on the horizontal moving mechanism (10). The chamfering structure is hinged to the vertical moving mechanism (9). The vertical moving mechanism (9) is used to drive the chamfering structure to move up and down, and the horizontal moving mechanism (10) is used to drive the vertical moving mechanism (9) and the chamfering structure to move horizontally, so that the grinding wheel mechanism can contact or disengage from the circumference of the micro-hemispherical chamfer on the mounting base (3).

5. The micro-hemispherical chamfering device according to claim 4, characterized in that, It also includes a micrometer (11), which is mounted on the vertical moving mechanism (9). The central axis of the micrometer (11) is in the same plane as the central axis of the grinding wheel mechanism in the working state. The micrometer (11) is used to adjust to abut against the mounting plate (61) in the working state.

6. The micro-hemispherical chamfering device according to claim 1 or 2, characterized in that, The grinding wheel assembly (4) includes a grinding wheel shaft (42) and a grinding wheel (41). The grinding wheel shaft (42) is rotatably mounted on the mounting plate (61) via a grinding wheel bearing (43). Both ends of the shaft extend out from the grinding wheel bearing (43). The end of the shaft that is close to the grinding wheel motor (5) is connected to the grinding wheel motor (5) via a grinding wheel shaft sleeve (44). The other end of the shaft is fixed to the grinding wheel (41). The grinding end of the grinding wheel (41) is covered with a slow rebound buffer (45). The surface of the slow rebound buffer (45) is covered with sandpaper (45).

7. The micro-hemispherical chamfering device according to claim 6, characterized in that, The material of the slow rebound buffer (45) is sponge.

8. The micro-hemispherical chamfering device according to claim 1 or 2, characterized in that, A screw (64) is rotatably mounted on the mounting plate (61) along the axial direction of the grinding wheel mechanism. The counterweight (6) is threadedly connected to the screw (64). Two locking nuts (62) are also threadedly connected to the screw (64). The two locking nuts (62) are located on both sides of the counterweight (6) along the axial direction of the grinding wheel mechanism.

9. The micro-hemispherical chamfering device according to claim 1 or 2, characterized in that, The mounting base (3) is connected to a rotary drive mechanism (15) for driving the mounting base (3) to rotate horizontally in the circumferential direction. The rotary drive mechanism (15) includes a drive motor (151), a belt drive mechanism and a main shaft (152). The main shaft (152) is rotatably mounted on the main frame (1) via a drive bearing (153). The mounting seat (3) is fixed to the upper end of the main shaft (152). A secondary frame (16) is provided on one side of the main frame (1). The drive motor (151) is fixed on the secondary frame (16). The main pulley (154) of the belt drive mechanism is connected to the drive motor (151) for transmission. Its driven pulley (155) is fixed on the main shaft (152). Its belt (156) is tensioned between the main pulley (154) and the driven pulley (155).

10. A method for achieving micro-hemispherical chamfering using the micro-hemispherical chamfering device as described in any one of claims 1-9, characterized in that, include: S1: Adjust the position of the counterweight (6) on the mounting plate (61) so that the weight of the chamfered structure is equal to the set value; S2: Start the tilt drive mechanism (7) to drive the mounting plate (61) to tilt until the central axis of the grinding wheel mechanism and the central axis of the micro-hemispherical on the mounting base (3) are at a set angle; S3: Start the moving mechanism to drive the tilting drive mechanism (7) and the chamfering structure to move so that the grinding wheel mechanism contacts the circumference of the micro-hemispherical chamfer on the mounting base (3); S4: Drive the grinding wheel assembly (4) and the mounting base (3) to rotate respectively, so that the grinding wheel assembly (4) can chamfer the circumference of the micro-hemispherical part to be chamfered.

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