1000M vehicle-mounted Ethernet chip common mode inductor and production process

Abstract

The 1000M vehicle-mounted Ethernet chip type common mode inductor structurally comprises a middle column, a first flange and a second flange are arranged on the two sides of the middle column respectively, the inner side of the first flange and the inner side of the second flange are fixedly connected with the middle column in a welded mode, and the inner side of the first flange and the inner side of the second flange are fixedly connected with the middle column in a welded mode. A first bonding pad electrode and a second bonding pad electrode are arranged at the lower end of the first flange, a third bonding pad electrode and a fourth bonding pad electrode are arranged at the lower end of the second flange, and the first bonding pad electrode, the second bonding pad electrode, the third bonding pad electrode and the fourth bonding pad electrode are arranged at the bottoms of the first flange and the second flange in a flush mode. The first bonding pad electrode and the second bonding pad electrode at the lower end of the first flange and the third bonding pad electrode and the fourth bonding pad electrode at the lower end of the second flange are flush with the bottoms of the flanges, so that stress concentration during welding of the electrodes and an external circuit or vehicle-mounted vibration is avoided, the risk of electrode breakage is reduced, meanwhile, the contact area of the electrodes and the flanges is increased, and the service life of the electrodes is prolonged. And the electrode structural strength is enhanced.

Description

Technical Field

[0001] This invention relates to the field of common mode inductor technology, specifically to a 1000M automotive Ethernet chip common mode inductor and its manufacturing process. Background Technology

[0002] With the rapid development of automotive electronics technology towards intelligence and connectivity, automotive Ethernet, as the core carrier of in-vehicle communication networks, is upgrading from the traditional low-speed CAN bus to meet the high-speed transmission requirements of 1000M, in order to satisfy the large data transmission needs of devices such as high-definition cameras, autonomous driving controllers, and in-vehicle infotainment systems. Chip common-mode inductors, as key passive components in automotive Ethernet circuits, primarily play a crucial role in suppressing common-mode interference and ensuring stable signal transmission; their performance directly determines the communication quality and reliability of automotive Ethernet.

[0003] However, existing traditional automotive CAN communication chip common-mode inductors face three major technical bottlenecks when adapting to 1000M automotive Ethernet applications: First, insufficient transmission rate adaptability. The magnetic core structure design and winding process of traditional products result in low magnetic coupling efficiency and severe signal attenuation. At the 1000MHz high-frequency band, they cannot meet the S-parameter performance indicators specified by the Automotive Ethernet Alliance, easily leading to signal distortion and transmission delays, thus failing to meet the demands of high-speed data transmission. Second, poor electrode structure reliability. Traditional products use a raised pad electrode design, and the electrode and magnetic core... The connection points of the retaining edge exhibit stress concentration. Under harsh conditions such as vehicle vibration and high / low temperature cycling, the raised electrode is prone to breakage, leading to circuit breakage and severely affecting product lifespan and vehicle communication stability. Thirdly, production consistency is difficult to control. Traditional winding processes often use single coil winding or irregular commutation methods. Winding tension fluctuations and commutation position deviations can easily lead to insufficient coil turn accuracy and uneven core coupling. Consequently, key parameters such as inductance, Q value, and common-mode rejection ratio of products in the same batch have large dispersion, failing to meet the stringent requirements of automotive electronics for product consistency.

[0004] Therefore, there is an urgent need to design a chip common-mode inductor that is adapted to high-speed transmission, high electrode strength, and high production consistency in order to overcome the above-mentioned shortcomings of the existing technology. Summary of the Invention

[0005] The purpose of this invention is to provide a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a 1000M vehicle-mounted Ethernet chip common-mode inductor, comprising a central column, wherein a first baffle and a second baffle are respectively provided on both sides of the central column, the inner sides of the first baffle and the second baffle are fixedly connected to the central column by welding, a first pad electrode and a second pad electrode are provided at the lower end of the first baffle, and a third pad electrode and a fourth pad electrode are provided at the lower end of the second baffle, wherein the first pad electrode, the second pad electrode, the third pad electrode and the fourth pad electrode are all flush with the bottom of the first baffle and the second baffle;

[0007] The first stop, the second stop, and the central column connecting the first stop and the second stop form an H-core structure. The I-chip magnetic core structure is a magnetic chip disposed above the first stop and the second stop. The length and width dimensions of the I-chip magnetic core structure are the same as those of the H-core structure. The thickness of the magnetic chip is 0.6-1.2 mm.

[0008] In a preferred embodiment of the present invention, a first enameled wire and a second enameled wire are wound around the outer side of the central column. The first enameled wire and the second enameled wire are wound in a double-wire parallel winding manner. The bottom layer of the first enameled wire and the top layer of the second enameled wire are reversed. The first enameled wire and the second enameled wire are respectively fixedly soldered to the first solder pad electrode and the second solder pad electrode. The ends of the first enameled wire and the second enameled wire correspond to the first wire tail and the second wire tail, respectively. The first wire tail is fixedly soldered to the third solder pad electrode, and the second wire tail is fixedly soldered to the fourth solder pad electrode.

[0009] In a preferred embodiment of the present invention, the first enameled wire and the second enameled wire are wound to form four winding segments, namely the first winding segment, the second winding segment, the third winding segment and the fourth winding segment. The first enameled wire and the second enameled wire are switched between each other through a cross segment.

[0010] In a preferred embodiment of the present invention, the cross section includes a first cross section, a second cross section, and a third cross section. The first cross section, the second cross section, and the third cross section are formed by rotating and winding a wire feeding guide pin. The spacing between the first cross section, the second cross section, and the third cross section is controlled at 0.15-0.20 mm, and the rotation angle of the wire feeding guide pin is 180°. A first adhesive is provided at the top center of the first baffle, and a second adhesive is provided at the top center of the second baffle.

[0011] This invention also provides a manufacturing process for a 1000M automotive Ethernet chip common-mode inductor, comprising the following steps:

[0012] S1. The first pad electrode, the second pad electrode, the third pad electrode, and the fourth pad electrode are treated with an electroplating silver process. The electroplating layers are Ag bottom layer, Ni middle layer, and Sn surface layer from the inside to the outside. The thickness of the electroplating layers meets the following requirements: the minimum thickness of the Ag bottom layer is 6μm, the minimum thickness of the Ni middle layer is 2μm, and the minimum thickness of the Sn surface layer is 3μm.

[0013] S2. Hang the first enameled wire and the second enameled wire on the first pad electrode and the second pad electrode of the first stop respectively, and fix the first enameled wire and the second enameled wire to the corresponding pad electrode by spot welding.

[0014] S3. Control the two wire feeding guides to drive the first enameled wire and the second enameled wire to wind in a counterclockwise direction along the central column, so that the second enameled wire is at the bottom layer and the first enameled wire is at the top layer, and the first winding is completed.

[0015] S4. Rotate the two wire guide pins 180° and wind them around once to form the first cross section. Pull the first cross section apart by 0.15-0.20mm to complete the phase reversal between the second enameled wire and the first enameled wire. Then continue to wind the two wires in a counterclockwise direction so that the first enameled wire is at the bottom layer and the second enameled wire is at the top layer, thus completing the second winding.

[0016] S5. Repeat the operation similar to S3. First, rotate the two wire feed guides -180° and wrap them once to form the second cross section. Open the gap by 0.15-0.20mm to achieve phase change, and then wrap the third wire. Next, rotate the wire feed guides 180° and wrap them once to form the third cross section. Open the gap by 0.15-0.20mm to achieve phase change, and continue to wrap the fourth wire. Finally, rotate the wire feed guides -180° to return them to the initial position.

[0017] S6. Hang the first tail of the first enameled wire on the third pad electrode of the second side, and hang the second tail of the second enameled wire on the fourth pad electrode of the second side, and fix them by spot welding; then apply the first adhesive to the top midpoint of the first side and the second adhesive to the top midpoint of the second side, assemble the magnetic chip onto the H magnetic core structure, and dry it to fix the magnetic chip to the H magnetic core structure, thus completing the product manufacturing.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] This invention improves the high performance and reliability of chip common mode inductors in automotive Ethernet 1000M applications.

[0020] This invention avoids the risk of breakage in traditional solder pad electrode protrusion electroplating structures, and the bottom solder pad electrode is flush with the plate to increase product strength.

[0021] This invention breaks with traditional winding processes and achieves high-performance S-parameters resulting from multiple cross-commutations in the primary and secondary winding circuits. Attached Figure Description

[0022] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a bottom view structural schematic diagram of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0024] Figure 2 This is a top view of the structure of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0025] Figure 3 This is a schematic diagram of the overall structure of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0026] Figure 4 This is a schematic diagram of the I-core structure and H-core structure of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0027] Figure 5 This is a schematic diagram of the silver plating sequence of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0028] Figure 6 The circuit diagram shows a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0029] Figure 7 This is a winding internal circuit diagram of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0030] Figure 8 The diagram shows the performance parameters of a 1000M vehicle-mounted Ethernet chip common-mode inductor and its manufacturing process according to the present invention.

[0031] In the diagram: 1. First guard edge; 2. First pad electrode; 3. Second pad electrode; 4. Center post; 5. Second guard edge; 6. Third pad electrode; 7. Fourth pad electrode; 8. First enameled wire; 9. Second enameled wire; 10. First wire tail; 11. Second wire tail; 12. First winding; 13. First cross section; 14. Second winding; 15. Second cross section; 16. Third winding; 17. Third cross section; 18. Fourth winding; 19. First adhesive; 20. Second adhesive; 21. Magnetic chip. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0033] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Please see Figures 1-8 The present invention provides a technical solution: a 1000M vehicle-mounted Ethernet chip common mode inductor, including a central column 4, a first baffle 1 and a second baffle 5 respectively provided on both sides of the central column 4, the inner sides of the first baffle 1 and the second baffle 5 are fixedly connected to the central column 4 by welding, a first pad electrode 2 and a second pad electrode 3 are provided at the lower end of the first baffle 1, a third pad electrode 6 and a fourth pad electrode 7 are provided at the lower end of the second baffle 5, and the first pad electrode 2, the second pad electrode 3, the third pad electrode 6 and the fourth pad electrode 7 are all flush with the bottom of the first baffle 1 and the second baffle 5;

[0035] The first stop 1, the second stop 5, and the central column 4 connecting the first stop 1 and the second stop 5 form an H-core structure. The I-core structure is a magnetic chip 21 set above the first stop 1 and the second stop 5. The length and width of the I-core structure are the same as the length and width of the H-core structure. The thickness of the magnetic chip 21 is 0.6-1.2mm.

[0036] It should be noted that the first retaining edge 1, the second retaining edge 5, and the central column 4 together form the H-core structure. The entire H-core structure can form a closed magnetic circuit foundation, reducing magnetic flux leakage and providing a stable magnetic coupling environment for high-frequency signal transmission. Moreover, the first pad electrode 2 and the second pad electrode 3 at the lower end of the first retaining edge 1, and the third pad electrode 6 and the fourth pad electrode 7 at the lower end of the second retaining edge 5 are all flush with the bottom of the retaining edge, thereby avoiding stress concentration when the electrodes are soldered to external circuits or when there is vehicle vibration, reducing the risk of electrode breakage, while increasing the contact area between the electrodes and the retaining edge, and enhancing the strength of the electrode structure. Furthermore, the length and width dimensions of the magnetic chip 21 are perfectly matched with the H-core, and the thickness is controlled within 0.6-1.2mm, thereby precisely fitting with the H-core to form a complete closed magnetic circuit, further reducing the magnetic leakage rate and improving the magnetic coupling efficiency.

[0037] In an optional embodiment, the first pad electrode 2, the second pad electrode 3, the third pad electrode 6, and the fourth pad electrode 7 are all treated with an electroplating silver process. The electroplating layers are, from the inside out, an Ag bottom layer, a Ni middle layer, and a Sn surface layer. The thickness of the electroplating layers meets the following requirements: the minimum thickness of the Ag bottom layer is 6 μm, the minimum thickness of the Ni middle layer is 2 μm, and the minimum thickness of the Sn surface layer is 3 μm.

[0038] It should be noted that the three plating layers work together synergistically: the Ag bottom layer has excellent conductivity, which can reduce the contact resistance of the electrode, reduce ohmic loss during 1000M high-frequency signal transmission, and ensure signal transmission efficiency; the Ni middle layer, as a transition layer, can enhance the bonding force between the Ag bottom layer and the magnetic core edge, preventing plating peeling off, and can also isolate Ag from corrosive substances such as sulfides in the external environment, improving the electrode's corrosion resistance; the Sn surface layer has good solder wettability, which can ensure the formation of stable solder joints when the electrode is soldered to the automotive PCB board, avoiding problems such as cold solder joints and poor soldering, thus meeting the low resistance requirement of 1000M high-frequency signal transmission and adapting to the reliability requirements of the harsh automotive environment.

[0039] In an optional embodiment, a first enameled wire 8 and a second enameled wire 9 are wound around the outer side of the central column 4. The first enameled wire 8 and the second enameled wire 9 are wound in a double-wire parallel winding manner. The bottom layer of the first enameled wire 8 and the top layer of the second enameled wire 9 are reversed. The first ends of the first enameled wire 8 and the second enameled wire 9 are respectively fixedly welded to the first pad electrode 2 and the second pad electrode 3. The ends of the first enameled wire 8 and the second enameled wire 9 correspond to the first wire tail 10 and the second wire tail 11, respectively. The first wire tail 10 is fixedly welded to the third pad electrode 6, and the second wire tail 11 is fixedly welded to the fourth pad electrode 7.

[0040] It should be noted that by adopting a dual-wire parallel winding method, a symmetrical primary and secondary coil structure can be formed, enhancing the common-mode interference suppression capability. During the winding process, the design of "commutation between the bottom layer of the first enameled wire 8 and the top layer of the second enameled wire 9" optimizes the magnetic coupling distribution between coils, reduces parasitic capacitance and inductance during high-frequency signal transmission, and reduces signal attenuation. Furthermore, it enables the coil and electrodes to form a complete current loop. At the same time, the dual-wire parallel winding and commutation structure can ensure the current balance of the primary and secondary coils, further improving the common-mode rejection ratio and meeting the stringent interference suppression requirements of 1000M automotive Ethernet.

[0041] In an optional embodiment, the first enameled wire 8 and the second enameled wire 9 are wound to form four winding segments, namely the first winding 12, the second winding 14, the third winding 16 and the fourth winding 18. The first enameled wire 8 and the second enameled wire 9 are switched between each other through a cross section. The cross section includes the first cross section 13, the second cross section 15 and the third cross section 17. The first cross section 13, the second cross section 15 and the third cross section 17 are formed by rotating the wire feeding guide. The spacing between the first cross section 13, the second cross section 15 and the third cross section 17 is controlled at 0.15-0.20mm and the rotation angle of the wire feeding guide is 180°. The top center of the first guard edge 1 is provided with the first adhesive 19 and the top center of the second guard edge 5 is provided with the second adhesive 20.

[0042] It should be noted that the 180° rotation angle ensures complete commutation of the enameled wire, avoiding coil short circuits or magnetic coupling imbalances caused by incomplete commutation; moreover, the 0.15-0.20mm spacing prevents insulation wear caused by excessive close contact of the enameled wires at the crossing sections, while ensuring the compactness of the coil structure; the first adhesive 19 and the second adhesive 20 work together to ensure a tight fit between the magnetic chip 21 and the H magnetic core structure, preventing displacement of the magnetic chip 21 due to vehicle vibration, thereby ensuring the stability of the magnetic circuit closure.

[0043] This invention also provides a manufacturing process for a 1000M automotive Ethernet chip common-mode inductor, comprising the following steps:

[0044] S1. The first pad electrode 2, the second pad electrode 3, the third pad electrode 6, and the fourth pad electrode 7 are treated with an electroplating silver process. The electroplating layers are Ag bottom layer, Ni middle layer, and Sn surface layer from the inside to the outside. The thickness of the electroplating layers meets the following requirements: the minimum thickness of the Ag bottom layer is 6μm, the minimum thickness of the Ni middle layer is 2μm, and the minimum thickness of the Sn surface layer is 3μm.

[0045] S2. Hang the first enameled wire 8 and the second enameled wire 9 on the first pad electrode 2 and the second pad electrode 3 of the first sidewall 1 respectively, and fix the first enameled wire 8 and the second enameled wire 9 to the corresponding pad electrode by spot welding.

[0046] S3. Control the two wire feeding guides to drive the first enameled wire 8 and the second enameled wire 9 to wind the two wires in a counterclockwise direction along the central column 4, so that the second enameled wire 9 is at the bottom layer and the first enameled wire 8 is at the surface layer, and the first winding 12 is completed.

[0047] S4. Rotate the two wire guide pins 180° and wind them once to form the first cross section 13. Pull the first cross section 13 apart by 0.15-0.20mm to complete the phase reversal of the second enameled wire 9 and the first enameled wire 8. Then continue to wind the two wires in a counterclockwise direction so that the first enameled wire 8 is at the bottom layer and the second enameled wire 9 is at the top layer, thus completing the second winding 14.

[0048] S5. Repeat the operation similar to S3. First, rotate the two wire feed guides -180° and wrap them once to form the second cross section 15. Open the gap by 0.15-0.20mm to achieve phase change, and then wrap the third winding 16. Next, rotate the wire feed guides 180° and wrap them once to form the third cross section 17. Open the gap by 0.15-0.20mm to achieve phase change, and continue to wrap the fourth winding 18. Finally, rotate the wire feed guides -180° to return them to the initial position.

[0049] S6. Hang the first tail 10 of the first enameled wire 8 on the third pad electrode 6 of the second side 5, and hang the second tail 11 of the second enameled wire 9 on the fourth pad electrode 7 of the second side 5, and fix them by spot welding; then apply the first adhesive 19 to the top midpoint of the first side 1, apply the second adhesive 20 to the top midpoint of the second side 5, assemble the magnetic chip 21 onto the H magnetic core structure, and fix the magnetic chip 21 to the H magnetic core structure by drying, and complete the product manufacturing.

[0050] It is worth noting that the spot welding operations in steps S1 and S5 must ensure a firm connection between the enameled wire and the pad electrode to avoid incomplete soldering or detachment.

[0051] It is worth noting that when winding the enameled wire in steps S2, S3, and S4, the winding tension must be kept consistent to ensure that the winding is tight and neat, and to avoid overlapping, loosening, or damage of the enameled wire.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A 1000M vehicle-mounted Ethernet chip common-mode inductor, comprising a center column (4), characterized in that: The central column (4) is provided with a first baffle (1) and a second baffle (5) on both sides respectively. The inner sides of the first baffle (1) and the second baffle (5) are fixedly connected to the central column (4) by welding. The lower end of the first baffle (1) is provided with a first pad electrode (2) and a second pad electrode (3). The lower end of the second baffle (5) is provided with a third pad electrode (6) and a fourth pad electrode (7). The first pad electrode (2), the second pad electrode (3), the third pad electrode (6) and the fourth pad electrode (7) are all flush with the bottom of the first baffle (1) and the second baffle (5). The first stop (1), the second stop (5) and the central column (4) connecting the first stop (1) and the second stop (5) form an H-core structure. The I-core structure is a magnetic chip (21) set above the first stop (1) and the second stop (5). The length and width of the I-core structure are the same as the length and width of the H-core structure. The thickness of the magnetic chip (21) is 0.6-1.2mm.

2. The 1000M vehicle-mounted Ethernet chip common-mode inductor according to claim 1, characterized in that: The outer side of the central column (4) is wound with a first enameled wire (8) and a second enameled wire (9). The first enameled wire (8) and the second enameled wire (9) are wound in a double-wire parallel winding manner. The bottom layer of the first enameled wire (8) and the top layer of the second enameled wire (9) are reversed. The first ends of the first enameled wire (8) and the second enameled wire (9) are respectively fixedly welded to the first pad electrode (2) and the second pad electrode (3). The ends of the first enameled wire (8) and the second enameled wire (9) correspond to the first wire tail (10) and the second wire tail (11) respectively. The first wire tail (10) is fixedly welded to the third pad electrode (6), and the second wire tail (11) is fixedly welded to the fourth pad electrode (7).

3. A 1000M vehicle-mounted Ethernet chip common-mode inductor according to claim 2, characterized in that: The first enameled wire (8) and the second enameled wire (9) are wound to form four windings, namely the first winding (12), the second winding (14), the third winding (16) and the fourth winding (18). The first enameled wire (8) and the second enameled wire (9) are switched between each other through a cross section.

4. A 1000M vehicle-mounted Ethernet chip common-mode inductor according to claim 3, characterized in that: The cross section includes a first cross section (13), a second cross section (15), and a third cross section (17). The first cross section (13), the second cross section (15), and the third cross section (17) are formed by rotating and winding the wire feeding guide. The spacing between the first cross section (13), the second cross section (15), and the third cross section (17) is controlled at 0.15-0.20 mm, and the rotation angle of the wire feeding guide is 180°. A first adhesive (19) is provided at the top center of the first baffle (1), and a second adhesive (20) is provided at the top center of the second baffle (5).

5. A manufacturing process for a 1000M automotive Ethernet chip common-mode inductor according to any one of claims 1-4, characterized in that, Includes the following steps: S1. The first pad electrode (2), the second pad electrode (3), the third pad electrode (6), and the fourth pad electrode (7) are treated with silver plating. The plating layers are Ag bottom layer, Ni middle layer, and Sn surface layer from the inside to the outside. The thickness of the plating layers meets the following requirements: the minimum thickness of the Ag bottom layer is 6μm, the minimum thickness of the Ni middle layer is 2μm, and the minimum thickness of the Sn surface layer is 3μm. S2. Hang the first enameled wire (8) and the second enameled wire (9) on the first pad electrode (2) and the second pad electrode (3) of the first side (1) respectively, and fix the first enameled wire (8) and the second enameled wire (9) to the corresponding pad electrode by spot welding. S3. Control the two wire feeding guides to drive the first enameled wire (8) and the second enameled wire (9) to wind the two wires in a counterclockwise direction along the central column (4), so that the second enameled wire (9) is at the bottom layer and the first enameled wire (8) is at the top layer, and the first winding is completed (12). S4. Rotate the two wire guides 180° and wind them once to form the first cross section (13). Pull the first cross section (13) apart by 0.15-0.20mm to complete the phase reversal between the second enameled wire (9) and the first enameled wire (8). Then continue to wind the two wires in a counterclockwise direction so that the first enameled wire (8) is at the bottom layer and the second enameled wire (9) is at the top layer, and the second winding is completed (14). S5. Repeat the operation similar to S3. First, rotate the two wire guide pins -180° and wind them once to form the second cross section (15). Open the gap by 0.15-0.20mm to realize the phase change, and then wind the third winding (16). Next, rotate the wire guide pin 180° and wind it once to form the third cross section (17). Open the gap by 0.15-0.20mm to realize the phase change, and continue to wind the fourth winding (18). Finally, rotate the wire guide pin -180° to return it to the initial position. S6. Hang the first wire tail (10) of the first enameled wire (8) on the third pad electrode (6) of the second side (5), and hang the second wire tail (11) of the second enameled wire (9) on the fourth pad electrode (7) of the second side (5) and fix it by spot welding. Then apply the first adhesive (19) to the top center point of the first side (1) and the second adhesive (20) to the top center point of the second side (5). Assemble the magnetic chip (21) onto the H magnetic core structure. After drying, fix the magnetic chip (21) to the H magnetic core structure and complete the product manufacturing.

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