Device and method for testing low-temperature irradiation electrical performance of electronic component
By designing a test device with a low-temperature irradiation sealed box and test module, and using liquid nitrogen cooling and low-temperature resistant materials, the problem of component damage under low-temperature irradiation conditions was solved, realizing in-situ testing under low-temperature irradiation, improving testing efficiency and safety, and supporting integrated circuit research in extreme space environments.
Patent Information
- Application Number
- CN202511290586.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2025-12-05
AI Technical Summary
Existing testing equipment and components under test are prone to damage under low-temperature irradiation conditions, making in-situ testing impossible. Furthermore, compressor cooling is easily damaged, resulting in high costs and making it difficult to meet the requirements of low-temperature irradiation experiments.
Design a test device that includes a low-temperature irradiation sealed box and a test module. Use liquid nitrogen physical cooling and low-temperature resistant materials and sealing components to protect the components, avoid thermal shock and ESD damage, and ensure test safety and accuracy.
It enables in-situ testing under low-temperature irradiation, reducing testing costs and difficulty, improving testing efficiency, ensuring device safety and the accuracy of test data, and supporting integrated circuit research in extreme space environments.
Smart Images
Figure CN121069066A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic component testing, in particular to an electronic component low-temperature irradiation electrical property testing device and method. BACKGROUND
[0002] In scientific research and production, there is a need for testing the electrical properties of electronic components under low-temperature irradiation conditions in the research of device performance in extreme space environments. The testing device needs to meet the in-situ testing requirements, i.e., it needs to meet both low-temperature and irradiation experimental conditions.
[0003] The low-temperature condition of the testing device is usually achieved by using an electric mechanical compressor for refrigeration. However, after irradiation by the irradiation source, the compressor will be damaged, the refrigeration performance will be greatly reduced or even completely lost, and the refrigeration effect cannot be achieved. If the device is directly placed on the test socket installed on the PCB and immersed in liquid nitrogen for testing, the instantaneous thermal shock (temperature difference exceeding 200℃) will cause the packaged device to crack or delaminate internally, resulting in device damage. If the device is placed on the test socket installed on the PCB for direct irradiation experiment, electric charge will be introduced, causing ESD damage to the device.
[0004] Therefore, there is an urgent need for an electronic component low-temperature irradiation electrical property testing device and method, which can enable the normal testing of electronic components under low-temperature irradiation in-situ conditions, and is of great significance for the research of the electrical property changes of analog electronic components in extreme space environments. SUMMARY
[0005] The present application aims to provide an electronic component low-temperature irradiation electrical property testing device and method to solve the problems of damage to the existing testing device and the tested components under low-temperature irradiation conditions, improve the efficiency of low-temperature irradiation testing, reduce the cost and difficulty of low-temperature irradiation testing, promote the development and improvement of component research technology under low-temperature irradiation, and support the research of integrated circuits in extreme space environments.
[0006] To solve the above technical problems, the present application provides an electronic component low-temperature irradiation electrical property testing device, which comprises a low-temperature irradiation sealed box and a testing module, wherein,
[0007] The low-temperature irradiation sealed box comprises a PCB and a sealing assembly with a top test lead opening, and the PCB is fixed in the sealed box by PCB screws;
[0008] The testing module comprises a test socket and a lead on the PCB, and the test socket is fixed at the bottom of the PCB by PCB screws;
[0009] The lead is led out through the top test lead opening of the low-temperature irradiation sealed box;
[0010] The lead-out wire comprises a test lead and a thermocouple low-temperature test wire, one end of the test lead is welded on the PCB board, and the other end is provided with a BNC female head for connecting a test instrument; one end of the thermocouple low-temperature test wire is connected to the PCB board, and the other end is provided with a probe for connecting a thermocouple temperature meter.
[0011] In an embodiment, the low-temperature irradiation sealed box further comprises a test box cover, a sealing gasket and a test box body, the sealing gasket is arranged between the test box cover and the test box body, and the test box cover is assembled with the test box body by using test box screws at four corners.
[0012] In an embodiment, the sealing gasket is made of a material with low-temperature resistance and low thermal expansion coefficient, including but not limited to polytetrafluoroethylene and polyimide; the test box cover and the test box body are made of a material with low-temperature resistance and large thermal conductivity, including but not limited to copper, silver and gallium-based low-temperature alloy; and the inner and outer surfaces of the test box cover and the test box body are sprayed with insulating paint.
[0013] In an embodiment, the sealing assembly of the top test lead-out wire opening comprises a nut, a sealing gasket and a heat-shrinkable sleeve, the sealing gasket is arranged between the opening and the nut, the top of the low-temperature irradiation sealed box is threadedly connected with the nut, and the lead-out wire is cast with low-temperature resistant glue in the nut after being led out through the top of the sealed box, and the heat-shrinkable sleeve is installed outside the nut to ensure the sealing property of the top interface of the sealed box.
[0014] In an embodiment, the low-temperature resistant glue includes but is not limited to epoxy structural glue, polyimide glue and low-temperature ceramic glue; the sealing gasket is made of a material with low-temperature resistance and low thermal expansion coefficient, including but not limited to polytetrafluoroethylene and polyimide; and the heat-shrinkable sleeve is made of a low-temperature resistant material, including but not limited to polytetrafluoroethylene and modified silicone rubber.
[0015] In an embodiment, the PCB board is made of a low-temperature resistant material, including but not limited to polytetrafluoroethylene, polyimide, ceramic and modified epoxy resin.
[0016] In an embodiment, the test instrument includes but is not limited to a semiconductor parameter tester, a signal source, an oscilloscope and a multimeter.
[0017] The application also provides a test method based on the electronic component low-temperature irradiation electrical property test device, which comprises the following steps:
[0018] The electronic component to be tested is installed on the test socket, and the low-temperature irradiation sealed box is sealed by using the sealing assembly and placed in an irradiation room.
[0019] Put the low-temperature irradiation sealed box vertically into the low-temperature resistant container containing liquid nitrogen;
[0020] Connect the test lead at the top of the low-temperature irradiation sealed box with the voltage source, set the bias voltage, connect the thermocouple low-temperature test line with the thermocouple thermometer, and perform temperature monitoring;
[0021] Turn on the irradiation source, connect the test lead at the top of the low-temperature irradiation sealed box with the test instrument after reaching the required irradiation dose, perform electrical performance test of the device, and determine the low-temperature irradiation electrical performance of the electronic component to be tested.
[0022] The electronic component low-temperature irradiation electrical performance test device and method provided by the application has the advantages of simple operation and strong practicability. The electronic component is placed in the sealed test box provided with the test module, and low-temperature irradiation test is performed in liquid nitrogen. The sealed test box plays a sealing protection and temperature buffering role for the electronic component, avoids damage to the packaged device caused by excessive instantaneous thermal shock, avoids ESD damage to the device, ensures the safety of the experimental electronic component, and ensures the accuracy of the device test data. At the same time, liquid nitrogen physical refrigeration is used instead of compressor refrigeration, which avoids damage to the compressor caused by the irradiation source, so that the low-temperature irradiation experiment cannot be carried out. Therefore, the application can be used as an excellent device for low-temperature irradiation experiment, improves the low-temperature irradiation test efficiency, reduces the cost of replacing the compressor refrigeration, realizes in-situ low-temperature irradiation test, meets the test requirements of low-temperature irradiation research, and supports the research of integrated circuits in extreme space environments. BRIEF DESCRIPTION OF DRAWINGS
[0023] Fig. 1 The front view of the test device provided by the embodiment of the application is shown in the figure.
[0024] Fig. 2 The rear view of the test device provided by the embodiment of the application is shown in the figure.
[0025] Fig. 3 The structure diagram of the top test lead-out line opening of the test device provided by the embodiment of the application is shown in the figure. DETAILED DESCRIPTION
[0026] The electronic component low-temperature irradiation electrical performance test device and method provided by the application will be further described in detail below in combination with the drawings and specific embodiments. According to the following description, the advantages and characteristics of the application will be more apparent. It should be noted that the drawings are very simplified and use non-precise proportions, and are only used to facilitate and clarify the purpose of assisting in the description of the embodiments of the application.
[0027] As Figs. 1 to 3As shown, the present application provides an electronic device low-temperature irradiation electrical performance testing device, which can solve the problem of damage to the existing low-temperature irradiation testing device and the tested components, improve the low-temperature irradiation testing efficiency, reduce the cost and difficulty of low-temperature irradiation testing, promote the development and improvement of component research technology under low-temperature irradiation, and support the research of integrated circuits in extreme space environments. The testing device comprises a low-temperature irradiation sealed box and a testing module; wherein,
[0028] The low-temperature irradiation sealed box comprises a PCB 5 and a top testing lead-out opening sealing assembly 8; the testing module comprises a testing socket 7 and a lead-out wire arranged on the PCB 5; the lead-out wire is led out through the top testing lead-out opening of the low-temperature irradiation sealed box, and the lead-out wire comprises a testing lead 9 and a thermocouple low-temperature testing wire 10. One end of the testing lead 9 is welded on the PCB 5, and the other end is provided with a BNC female head 11 for connecting a testing instrument; one end of the thermocouple low-temperature testing wire 10 is connected to the PCB 5, and the other end is provided with a probe for connecting a thermocouple temperature meter.
[0029] In the above low-temperature irradiation sealed box, the PCB 5 is fixed in the sealed box by a PCB screw 6, and the PCB 5 is made of a low-temperature resistant material, including but not limited to polytetrafluoroethylene, polyimide, ceramic, and modified epoxy resin.
[0030] The low-temperature irradiation sealed box comprises a test box cover 1, a sealing gasket 3, and a test box body 4. The sealing gasket 3 is placed between the test box cover 1 and the test box body 4, and the test box cover 1 is assembled with the test box body 4 by test box screws 2 at four corners.
[0031] In the above low-temperature irradiation sealed box, the test box cover 1 and the test box body 4 are made of a low-temperature resistant material with a large thermal conductivity, including but not limited to copper, silver, and gallium-based low-temperature alloy. The inner and outer surfaces of the test box cover 1 and the test box body 4 are sprayed with insulating paint.
[0032] In the above low-temperature irradiation sealed box, the sealing gasket 3 is made of a low-temperature resistant material with a low thermal expansion coefficient, including but not limited to polytetrafluoroethylene and polyimide.
[0033] In the above low-temperature irradiation sealed box, the top testing lead-out opening sealing assembly 8 is composed of a sealing gasket 12, a nut 13, and a heat-shrinkable sleeve 14. The sealing gasket 12 is placed between the top testing lead-out opening and the nut 13, and the top of the sealed box and the nut 13 are connected by threads. The lead-out wire (including the testing lead 9 and the thermocouple low-temperature testing wire 10) is poured with low-temperature resistant glue in the nut 13 after being led out from the top of the test box, and the heat-shrinkable sleeve 14 is installed outside the nut 13 to ensure the sealing of the top interface of the sealed box.
[0034] The low-temperature resistant glue includes but is not limited to epoxy structural glue, polyimide glue and low-temperature ceramic glue.
[0035] The sealing gasket 12 is made of low-temperature resistant material with low thermal expansion coefficient, including but not limited to polytetrafluoroethylene and polyimide.
[0036] The heat-shrinkable sleeve 14 is made of low-temperature resistant material, including but not limited to polytetrafluoroethylene and modified silicone rubber.
[0037] In the test module, the test socket 7 is fixed to the bottom of the PCB 5 through the PCB screw 6.
[0038] In the test module, the lead-out wire is led out from the top test lead-out opening of the low-temperature irradiation sealing box, including the test lead 9 and the thermocouple low-temperature test wire 10.
[0039] In the test module, the test instrument includes but is not limited to a semiconductor parameter tester, a signal source, an oscilloscope and a multimeter.
[0040] The application also provides an electronic component low-temperature irradiation electrical property testing method based on the testing device.
[0041] The electronic component to be tested is installed on the test socket of the test module, and the low-temperature irradiation sealing box is sealed by using the sealing assembly and placed in an irradiation room.
[0042] The low-temperature irradiation sealing box is vertically placed in a low-temperature resistant container containing liquid nitrogen.
[0043] The test lead at the top of the low-temperature irradiation sealing box is connected with a voltage source to set a bias voltage, the thermocouple low-temperature test wire is connected with a thermocouple thermometer to monitor the temperature, the irradiation source is turned on, after reaching the required irradiation dose, the test lead at the top of the low-temperature irradiation sealing box is connected with a test instrument to test the electrical property of the device, and the low-temperature irradiation electrical property of the electronic component to be tested is determined.
[0044] The test device and method of the present application are simple in operation and have strong practicability. By placing electronic components in a sealed test box provided with a test module, low-temperature irradiation test is carried out in liquid nitrogen. The low-temperature irradiation sealed box plays a sealing protection and temperature buffering role for the electronic components, avoids excessive instantaneous thermal shock from causing damage to the packaged devices, avoids causing ESD damage to the devices, ensures the safety of the experimental electronic components, and ensures the accuracy of the device test data. At the same time, liquid nitrogen physical refrigeration is used instead of compressor refrigeration, avoiding damage to the compressor by the irradiation source, so that the low-temperature irradiation experiment cannot be carried out. Therefore, the present application can be used as an excellent device for low-temperature irradiation experiment, improving the efficiency of low-temperature irradiation test, reducing the cost of constantly replacing the compressor refrigeration, realizing in-situ low-temperature irradiation test, meeting the test requirements of low-temperature irradiation research, and supporting the research of integrated circuits in extreme space environments
[0045] The above description is only a description of the preferred embodiments of the present application, and is not any limitation on the scope of the present application. Any modification or modification made by a person skilled in the art according to the above disclosure is within the protection scope of the claims.
Claims
1. An electronic device low temperature irradiation electrical property testing device, characterized in that, The application relates to a low-temperature irradiation sealing box and a test module. The low-temperature irradiation sealing box comprises a PCB plate and a sealing assembly of a top test lead outlet, and the PCB plate is fixed in the sealing box through a PCB plate screw; The test module comprises a test socket and a lead-out line arranged on the PCB plate, and the test socket is fixed at the bottom of the PCB plate through a PCB plate screw; The lead-out line is led out through the top test lead outlet of the low-temperature irradiation sealing box; The lead-out line comprises a test lead and a thermocouple low-temperature test line, one end of the test lead is welded on the PCB plate, and the other end is provided with a BNC female head for connecting a test instrument; one end of the thermocouple low-temperature test line is connected to the PCB plate, and the other end is provided with a probe for connecting a thermocouple temperature measuring instrument. The low-temperature irradiation sealing box further comprises a test box cover, a sealing washer and a test box body, the sealing washer is arranged between the test box cover and the test box body, and the test box cover is assembled with the test box body through test box screws at four corners.
2. The low-temperature irradiation electrical performance testing device for electronic components as described in claim 1, characterized in that, The sealing washer is made of a material with low-temperature resistance and low thermal expansion coefficient, and the material includes but is not limited to polytetrafluoroethylene and polyimide; the test box cover and the test box body are made of a material with low-temperature resistance and high thermal conductivity, and the material includes but is not limited to copper, silver and gallium-based low-temperature alloy; the inner and outer surfaces of the test box cover and the test box body are sprayed with insulating paint.
3. The low-temperature irradiation electrical performance testing device for electronic components as described in claim 2, characterized in that, The sealing assembly of the top test lead outlet comprises a nut, a sealing washer and a heat-shrinkable sleeve, the sealing washer is arranged between the opening and the nut, the top of the low-temperature irradiation sealing box is connected with the nut through threads, and the lead-out line is cast with low-temperature resistant glue in the nut after being led out through the top of the sealing box, and the heat-shrinkable sleeve is installed outside the nut to ensure the sealing property of the top interface of the sealing box.
4. The low-temperature irradiation electrical performance testing device for electronic components as described in claim 3, characterized in that, The low-temperature resistant glue includes but is not limited to epoxy structural glue, polyimide glue and low-temperature ceramic glue; the sealing washer is made of a material with low-temperature resistance and low thermal expansion coefficient, and the material includes but is not limited to polytetrafluoroethylene and polyimide; the heat-shrinkable sleeve is made of a low-temperature resistant material, and the material includes but is not limited to polytetrafluoroethylene and modified silicone rubber.
5. The low-temperature irradiation electrical performance testing device for electronic components as described in claim 4, characterized in that, The PCB plate is made of a low-temperature resistant material, and the material includes but is not limited to polytetrafluoroethylene, polyimide, ceramic and modified epoxy resin.
6. The device of claim 1, wherein the device is an electronic device. The test instrument includes but is not limited to a semiconductor parameter tester, a signal source, an oscilloscope and a multimeter.
7. The device of claim 1, wherein the device is an electronic device. The application further discloses a low-temperature irradiation test method.
8. A testing method based on the device for testing electrical properties of electronic components and devices under low-temperature irradiation according to any one of claims 1-7, characterized in that, The electronic component to be tested is installed on the test socket, and the low-temperature irradiation sealing box is sealed by using the sealing assembly and placed in an irradiation room; The low-temperature irradiation sealing box is vertically placed in a low-temperature resistant container containing liquid nitrogen; The test lead at the top of the low-temperature irradiation sealing box is connected with a voltage source, and a bias voltage is set; The thermocouple low-temperature test line is connected with a thermocouple temperature measuring instrument for temperature monitoring; After the irradiation source is started and the required irradiation dose is reached, the test lead at the top of the low-temperature irradiation sealing box is connected with the test instrument for testing the electrical performance of the device, so that the low-temperature irradiation electrical performance of the electronic component to be tested is determined.