Portable double-pulse testing device and double-pulse testing method

Abstract

The invention relates to the technical field of pulse testing, and particularly discloses a portable double-pulse testing device and a double-pulse testing method.The method comprises the steps that S1, an upper cover is opened, a semiconductor power module is placed in a positioning groove of a supporting seat, a module fastener is installed on the upper surface of the power module, and the power module is fixed through a limiting column of the module fastener; connecting an AC terminal of the power module with an inductance line; s2, closing the upper cover, enabling the HPD driving board to be embedded with the signal terminal of the power module, and connecting an external power supply to a power interface of the wiring panel; s3, testing parameters are input through a double-pulse simulator, the double-pulse simulator generates simulation waveforms according to the testing parameters and outputs the simulation waveforms to a double-pulse controller, an oscilloscope probe is connected to the corresponding position of the bridge arm to be tested, and switch dynamic waveforms are collected; s4, after the test is completed, opening the upper cover, removing the module fastener, replacing a new semiconductor power module, and repeating the steps S1 to S3; the high-efficiency, accurate and low-cost test of the HPD / HPDL packaged semiconductor power module is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pulse test, in particular to a portable double-pulse test device and double-pulse test method. BACKGROUND

[0002] In the field of power electronics, the dynamic performance of semiconductor power modules is the core indicator that determines the efficiency, reliability and safety of power electronic systems. Double-pulse test, as the "golden indicator" for evaluating the dynamic characteristics of power modules, can accurately measure key parameters such as switching delay time, switching loss and reverse recovery characteristics, providing irreplaceable basic data for device selection, drive circuit design, system topology optimization and reliability research.

[0003] The existing double-pulse test equipment has the following defects: large volume and poor portability: traditional test systems are mostly fixed rack structures with low integration, relying on laboratory fixed power supply and environment, which cannot meet the needs of on-site debugging, outdoor verification or multi-scene mobile testing; lack of speciality and low testing efficiency: existing equipment mostly adopts general design, lacking targeted positioning and connection structure for HPD / HPD_L special packaging power modules, resulting in long module clamping time; high cost and complex operation: high-precision test systems are costly, small and medium-sized manufacturers are difficult to afford, and the equipment interface is closed, parameter debugging is tedious, requiring professional operation, which is not convenient to use.

[0004] In view of the above problems, there is an urgent need for a double-pulse test device and matching test method that combines portability, speciality, low cost and high precision, especially for HPD / HPD_L packaged power modules. SUMMARY

[0005] In order to overcome the above technical problems existing in the prior art, the present application provides a portable double-pulse test device and double-pulse test method, which realizes efficient, accurate and low-cost testing of HPD / HPD_L packaged semiconductor power modules.

[0006] In order to achieve the above object, the embodiment of the present application provides a portable double pulse testing device, comprising an upper cover, a box body and a module fastener; the upper cover comprises a cover body, a wiring panel, a double pulse controller, a double pulse simulator and an HPD drive board are embedded in the cover body, the double pulse controller is connected with the HPD drive board and the wiring panel respectively, and the double pulse simulator is connected with the wiring panel; the box body comprises a support plate, at least two DC filter capacitors, a DC bus, at least three absorption capacitors and a double pulse testing platform, the double pulse testing platform is arranged on the support plate, the DC filter capacitors are fixed on the bottom plate of the double pulse testing platform, the absorption capacitors are welded on the output end of the DC bus, the DC bus is provided with six inductance lines, and the DC bus is fixed on the DC filter capacitors; the module fastener is arranged on the top of the double pulse testing platform and is used for positioning and clamping a measured module; and the power input line of the DC bus, the six inductance lines and the AC output terminal inductance line are all connected to the wiring panel.

[0007] Preferably, a panel base is arranged in the cover body, the panel base is provided with a mounting groove, the double pulse controller and the double pulse simulator are arranged in the mounting groove in a left-right manner, the wiring panel is arranged on the upper surface of the panel base and is located above the double pulse controller, a through hole is arranged on the wiring panel, the button of the double pulse controller is arranged through the through hole, and the wiring of the double pulse controller is connected with the wiring panel; the HPD drive board is arranged on the lower surface of the panel base and is located below the double pulse simulator, the signal wiring of the double pulse controller is connected to the HPD drive board through the internal space of the panel base, and the power wiring of the double pulse simulator is connected to the wiring panel through the internal space of the panel base.

[0008] Preferably, the DC filter capacitors and the DC bus are located below the double pulse controller, and the module fastener is located below the HPD drive board; the module fastener is provided with a plurality of limiting holes and a plurality of limiting columns, the limiting holes correspond to the pins and mounting columns of the measured power module and are used for penetrating the pins and mounting columns of the measured power module, the top of the double pulse testing platform is provided with three inductance line terminals, and the limiting columns penetrate the inductance line terminals and the double pulse testing platform.

[0009] Preferably, the DC bus is fixed with the six inductance lines through power terminal connecting nails, the power terminal connecting nails penetrate the mounting holes of the DC bus and the end portions of the inductance lines and are fixed through welding.

[0010] Preferably, the DC filter capacitors are fixed vertically on the bottom plate of the double pulse testing platform, and the HPD drive board is fixed on the support plate, and the signal terminals of the measured module are connected with the HPD drive board vertically downward.

[0011] Preferably, the direct current filter capacitor is horizontally mounted on the bottom plate of the double pulse test platform and connected with the direct current busbar through a wire.

[0012] Correspondingly, the application further provides a double pulse test method based on the portable double pulse test device, comprising the following steps: S1: performing clamping operation, opening the upper cover, placing the semiconductor power module in the positioning groove of the double pulse test platform, mounting the module fastener on the upper surface of the power module, fixing the power module through the limiting column of the module fastener, and connecting the AC terminal of the power module with the inductor line; S2: performing connection operation, closing the upper cover, embedding the HPD drive board with the signal terminal of the power module, connecting the external power supply to the power supply interface of the wiring panel, and connecting the external inductor to the inductor interface of the wiring panel; S3: performing test operation, inputting test parameters through the double pulse simulator, the double pulse simulator generating simulation waveforms according to the test parameters and outputting to the double pulse controller, connecting the high-voltage differential probe of the oscilloscope to the corresponding position of the bridge arm to be tested on the wiring panel, and collecting the switching dynamic waveform; S4: performing replacement operation, opening the upper cover after the test is completed, removing the module fastener, and repeating S1-S3 after replacing the new semiconductor power module.

[0013] Preferably, in S1, the power module is fixed through the module fastener, the DC terminal of the power module is connected with the DC busbar, and the AC terminal of the power module is connected with the inductor line.

[0014] Preferably, S3 specifically comprises: the test parameters include the DC bus voltage, the test current, the first pulse width and the second pulse width; a first pulse is applied, the double pulse controller outputs a first drive pulse to the HPD drive board, controls the power module to turn on, makes the inductor load current rise to the test current, and the duration is the first pulse width; after the first pulse ends, the power module is controlled to turn off, the inductor load current flows through the power module, and the freewheeling time is within the time threshold interval; a second pulse is applied, the double pulse controller outputs a second drive pulse, controls the power module to turn on again and turn off after a preset time, and the end voltage waveform and the load current waveform of the power module are collected through the oscilloscope.

[0015] Preferably, it further comprises: multi-working condition test, changing the DC bus voltage and the test current, repeating S3, obtaining dynamic parameters under different working conditions, and generating the dynamic characteristic curve of the power module according to the dynamic parameters.

[0016] Through the technical scheme provided by the application, the application has at least the following technical effects: The portable double-pulse testing device and double-pulse testing method provided by the application are designed for HPD / HPD_L packaged semiconductor power modules, are integrated in the device as a whole, are convenient for transportation and on-site testing, are convenient for replacing the driving board and the emulator component, can be flexibly adapted to different testing requirements, and optimize the positioning and clamping of the HPD / HPD_L packaged power module through the setting of the module fastener pin, realize efficient clamping and accurate testing, shorten the module replacement time, reduce the signal terminal position tolerance, do not need to repeatedly adjust the external wiring in the clamping process, shorten the testing preparation time, integrate the absorption capacitor and optimize the busbar layout, reduce the parasitic parameter interference, and improve the testing accuracy; the manufacturing cost is lower than that of the traditional equipment, and the application is suitable for small and medium-sized enterprises; the standardized interface and the automatic process reduce the operation threshold, and ordinary technical personnel can use the application after simple training; the application is convenient to operate, when used for testing, the HPD driving board can be automatically embedded with the signal terminal of the semiconductor power module, the testing wiring is uniformly completed through the external wiring board, and the operation process is simplified. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the embodiments of the application, constitute a part of the specification and are used together with the specific embodiments described below to explain the embodiments of the application, but do not constitute a limitation on the embodiments of the application. In the drawings: Figure 1 The structure schematic diagram of the portable double-pulse testing device provided by the application is shown in the figure. Figure 2 The structure schematic diagram of the upper cover in the application is shown in the figure. Figure 3 The structure schematic diagram of the box body in the application is shown in the figure. Figure 4 The structure schematic diagram of the module fastener installation position in the application is shown in the figure. Figure 5 The structure schematic diagram of the module fastener in the application is shown in the figure. Figure 6 The flowchart of the double-pulse testing method based on the portable double-pulse testing device provided by the application is shown in the figure.

[0018] Icon: upper cover 1, cover plate 2, hinge 3, upper cover filler 4, wiring panel 5, panel base 6, double-pulse controller 7, double-pulse emulator 8, HPD driving board 9, box body 10, box body filler 11, support plate 12, DC filter capacitor 13, DC busbar 14, absorption capacitor 15, power terminal connecting pin 16, module fastener 17, limiting column 18. DETAILED DESCRIPTION

[0019] The specific embodiments of the embodiments of the application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the embodiments of the application, and are not used to limit the embodiments of the application.

[0020] The terms "system" and "network" can be used interchangeably in the embodiments of the present application. "Multiple" means two or more, and in view of this, "multiple" can also be understood as "at least two" in the embodiments of the present application. "And / or", which describes the association relationship of associated objects, means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / ", if not specially stated, generally represents that the associated objects before and after it are in an "or" relationship. In addition, it should be understood that in the description of the embodiments of the present application, the terms "first", "second", etc. are only used for distinguishing purposes of description and cannot be understood as indicating or implying relative importance or indicating or implying order.

[0021] As shown in Figure 1 The present application provides a portable double-pulse test device suitable for HPD / HPD_L packaged semiconductor power modules and applied to double-pulse test of HPD / HPD_L packaged semiconductor power modules. The portable double-pulse test device includes three parts of an upper cover 1, a box body 10 and a module fastener 17. Specifically, as shown in Figure 2 The upper cover 1 can adopt an aluminum alloy aviation box upper cover 1, which includes a cover body. A wiring panel 5, a double-pulse controller 7, a double-pulse simulator 8 and an HPD drive board 9 are embedded in the cover body. The wiring panel 5 is provided with a plurality of wiring terminals for connecting external power supply and oscilloscope and other test equipment. A cover plate 2 is also provided on the cover body at a position corresponding to the wiring panel 5. The cover plate 2 is connected with the cover body and the cover plate 2 through a hinge 3, which is used to protect the wiring panel 5. For example, six M4*6 cross groove countersunk head screws and six M4 hexagonal thin nuts are used to fixedly connect the hinge 3 with the cover body and the cover plate 2. The wiring of the double-pulse controller 7 is connected with the HPD drive board 9 and the wiring panel 5, respectively. The wiring of the double-pulse simulator 8 is connected with the wiring panel 5. The inductance line, the positive power supply line and the negative power supply line led out of the box body 10 are fixedly arranged at the bottom of the wiring panel 5. For example, nine M5*12 cross groove recess hexagonal head bolts and M5 hexagonal nuts are used to fix the inductance line led out of the box body 10 at the bottom of the wiring panel 5. For example, two groups of M5*12 cross groove recess hexagonal head combination bolts and M5 hexagonal nuts are used to fix the positive and negative power supply lines led out of the box body 10 at the bottom of the wiring panel 5.

[0022] In one embodiment, as Figure 2As shown, the cover body is internally fixed with a panel base 6, the panel base 6 is provided with a mounting groove, the double-pulse controller 7 and the double-pulse simulator 8 are embedded into the mounting groove left and right, the wiring panel 5 is installed on the upper surface of the panel base 6 and above the double-pulse controller 7, the wiring panel 5 is provided with a through hole, the button on the double-pulse controller 7 is inserted into the through hole, the wiring of the double-pulse controller 7 is connected with the wiring panel 5, and the HPD drive board 9 is installed on the lower surface of the panel base 6 and below the double-pulse simulator 8, for example, eight M4*8 inner hexagonal flat round head screws are used to fix the wiring panel 5 and the HPD drive board 9 on the upper surface and the lower surface of the panel base 6 respectively, the cover body is further provided with an upper cover 1 filler, after the wiring panel 5, the double-pulse controller 7, the double-pulse simulator 8 and the HPD drive board 9 are installed on the panel base 6, the whole is embedded into the upper cover 1 filler, for fixing the above components and reducing vibration interference, the signal wiring of the double-pulse controller 7 is connected to the HPD drive board 9 through the internal space of the panel base 6, other wiring led out from the double-pulse controller 7 is connected below the wiring panel 5, and the power supply wiring of the double-pulse simulator 8 is connected to below the wiring panel 5 through the internal space of the panel base 6.

[0023] In the embodiment of the present application, as Figure 3As shown, the box 10 includes a support plate 12, at least two DC filter capacitors 13, a DC busbar 14, at least three absorption capacitors 15, and a double pulse test platform provided on the support plate 12, the DC filter capacitors 13 are fixed on the bottom plate of the double pulse test platform, the absorption capacitors 15 are welded on the output end of the DC busbar 14, the DC busbar 14 is provided with six inductance lines, the DC busbar 14 is fixed on the DC filter capacitors 13, the DC filter capacitors 13 and the DC busbar 14 are located below the double pulse controller 7, and the module fastener 17 is located below the HPD drive board 9; the power input line, the six inductance lines and the AC output terminal inductance line of the DC busbar 14 are all connected to the wiring panel 5, and the box 10 is also provided with a box 10 filler for fixing the internal components and leading out the cables through the internal space. For example, the box 10 adopts an aluminum alloy aviation box 10, two DC filter capacitors 13 and three absorption capacitors 15 are provided in the box 10, the DC filter capacitors 13 adopt aluminum shell dry-type DC filter capacitors 13, the DC busbar 14 adopts an HPD DC busbar, and the two aluminum shell dry-type DC filter capacitors 13 are fixed on the bottom plate of the double pulse test platform by using two M12 hexagonal nuts and M12 flat washers; two pins of the three absorption capacitors 15 are welded on the positive and negative poles of three groups of output ends in the HPD DC busbar respectively to form three output units; six inductance lines are welded on the HPD DC busbar, and the welded HPD DC busbar is fixed on the two aluminum shell dry-type DC filter capacitors 13 by using four groups of M6*12 cross groove recess hexagonal head combination bolts; at the power input end of the HPD DC busbar, two groups of M5*12 cross groove recess hexagonal head combination bolts and M5 hexagonal nuts are used to fix the input power line and lead it out through the internal space of the box 10 filler; three inductance line terminals are provided on the support plate 12 at positions corresponding to the HPD / HPD_L packaged semiconductor power module AC output terminals, which are concentric with the three inner / outer blind holes and led out through the internal space of the box 10 filler, the above components are embedded in the box 10 filler and then assembled into the aluminum alloy aviation box 10.

[0024] In one embodiment, as shown in Figure 3 The DC busbar 14 is welded with six inductance lines through power terminal connecting nails 16, the power terminal connecting nails 16 penetrate the mounting holes of the DC busbar 14 and the end of the inductance lines and are fixed by welding; for example, six power terminal connecting nails 16 are used, the six power terminal connecting nails 16 are inserted into one end of the six inductance lines and the output end mounting hole of the HPD DC busbar from bottom to top, the power terminal connecting nails 16, the inductance lines and the HPD DC busbar are fixed by welding, and the other end of the six inductance lines is led out; then the welded HPD DC busbar is fixed on the two aluminum shell dry-type DC filter capacitors 13 by using four groups of M6*12 cross groove recess hexagonal head combination bolts.

[0025] In the embodiments of the present application, as shown in Figure 4 and Figure 5 The module fastener 17 is arranged on the top of the double-pulse test platform, and in use, the measured HPD / HPD_L packaged semiconductor power module is placed on the double-pulse test platform, and then the module fastener 17 is placed on the measured semiconductor power module for positioning and clamping the measured semiconductor power module. The module fastener 17 is provided with a plurality of limiting holes and a plurality of limiting columns, the plurality of limiting holes correspond to the pins and mounting columns of the measured power module, the limiting block is used for penetrating the pins and mounting columns of the measured power module, and the top of the double-pulse test platform is provided with three inductor line terminals. After the limiting column penetrates the measured power module and the inductor line terminal, the limiting column is connected with the double-pulse test platform. Specifically, a through hole is arranged on the double-pulse test platform at a position corresponding to the limiting column, and the limiting column of the module fastener can be inserted into the through hole. Therefore, after the limiting column of the module fastener penetrates the measured power module and the inductor line terminal, the limiting column is inserted into the through hole of the double-pulse test platform, so that the limiting column of the module fastener 17, the AC output terminal of the measured semiconductor power module and the three inner / outer blind holes of the three inductor line terminals are in contact and fixed, ensuring that the AC output terminal of the measured semiconductor power module is accurately connected with the inductor line port of the box body 10, and reducing the positional tolerance of the signal terminal. The two positive and negative power lines of the power input end in the DC busbar 14, the six inductor lines of the power output end in the DC busbar 14 and the three inductor lines at the position of the AC output terminal are all led out to the upper cover 1 through the internal space filled by the box body 10, and are fixed at the bottom of the wiring panel 5 of the upper cover 1.

[0026] In one embodiment, the DC filter capacitor 13 is vertically fixed on the bottom plate of the double-pulse test platform, the HPD drive board 9 is fixed on the support plate 12, and the signal terminal of the measured semiconductor power module is vertically downward connected with the HPD drive board 9. In another embodiment, the DC filter capacitor 13 is horizontally mounted on the bottom plate of the double-pulse test platform and can be connected with the DC busbar 14 through a wire.

[0027] Working principle: when the portable double pulse test device provided by the application is used to test the HPD / HPD_L packaged semiconductor power module, the upper cover is opened, the semiconductor power module is placed on the corresponding hole position of the double pulse test platform arranged on the support plate, and the module fastener is placed to fix and clamp it, to ensure that the positive and negative poles of the direct current bus are in contact with the power terminal connection pins of the HPD direct current bus, and the alternating current output terminal is connected with the inductor terminal; the upper cover is closed, the HPD drive board is embedded with the signal terminal of the semiconductor power module; the cover plate is opened, the direct current power supply and the oscilloscope high voltage differential probe and other equipment are connected through the wiring panel; the double pulse controller and the double pulse simulator are started, the double pulse test is performed, the voltage and current waveforms are recorded through the oscilloscope to calculate the dynamic parameters; when the semiconductor power module is replaced, only the upper cover is opened, the old semiconductor power module is removed and the new semiconductor power module is placed, and after the upper cover is closed, the test can continue without the need to re-adjust the external wiring.

[0028] Please refer to Figure 6 , based on the same inventive concept, the application embodiment provides a double pulse test method based on the portable double pulse test device, comprising the following steps: S1: performing clamping operation, opening the upper cover, placing the semiconductor power module in the positioning groove of the double pulse test platform, installing the module fastener on the upper surface of the power module, fixing the power module through the limiting column of the module fastener, and connecting the power module alternating current terminal with the inductor line; S2: performing connection operation, closing the upper cover, embedding the HPD drive board with the signal terminal of the power module, connecting the external power supply to the power supply interface of the wiring panel, and connecting the external inductor to the inductor interface of the wiring panel; S3: performing test operation, inputting test parameters through the double pulse simulator, the double pulse simulator generates simulation waveforms according to the test parameters and outputs to the double pulse controller, connecting the oscilloscope high voltage differential probe to the corresponding position of the test bridge arm on the wiring panel, and collecting switch dynamic waveforms; S4: performing replacement operation, opening the upper cover after the test is completed, removing the module fastener, and repeating S1-S3 after replacing the new semiconductor power module.

[0029] In the embodiment of the present application, the portable double pulse test device provided by the embodiment of the present application is used for double pulse test of the HPD / HPD_L packaged semiconductor power module. The specific double pulse test method is as follows: first, the clamping operation of the HPD / HPD_L packaged semiconductor power module is performed, the upper cover of the portable double pulse test device is opened, the semiconductor power module to be tested is placed in the positioning groove of the double pulse test platform in the box of the device, specifically, the semiconductor power module to be tested is placed in the positioning groove of the double pulse test platform on the support plate, after being placed, the module fastener is installed on the upper surface of the power module, at this time, the limiting column of the module fastener is respectively through the measured semiconductor power module AC output terminal, three inductance line terminals and three inner / outer blind holes, so that the limiting column of the module fastener, the AC output terminal of the measured semiconductor power module and the three inductance line terminals are in contact and fixed with the three inner / outer blind holes, to ensure that the AC output terminal of the measured semiconductor power module is accurately connected with the inductance line port of the box, so as to fix the power module, connect the DC terminal of the power module with the DC bus, connect the AC terminal of the power module with the inductance line, and reduce the position tolerance of the signal terminal; then S2 is performed.

[0030] In the embodiment of the present application, step S2 mainly performs a connection operation. After the semiconductor power module to be tested is placed and the module fastener is installed, the upper cover is closed. After being closed, the HPD drive board of the upper cover is embedded with the signal terminals of the power module, and the cover plate of the upper cover is opened. The external power supply is connected to the power supply interface of the wiring panel, and the external inductor is connected to the inductor interface of the wiring panel. Then, S3 is performed. S3 specifically performs a test operation. First, the test parameters are input through the double-pulse simulator. The test parameters specifically include a DC bus voltage, a test current, a first pulse width, and a second pulse width. The double-pulse simulator generates a simulation waveform according to the test parameters and outputs the simulation waveform to the double-pulse controller. The oscilloscope high-voltage differential probe is connected to the corresponding position of the bridge arm to be tested on the wiring panel, and the switching dynamic waveform is collected. Specifically, the first pulse is applied. The double-pulse controller outputs the first drive pulse to the HPD drive board to control the power module to be turned on, so that the inductor load current rises to the test current (for example, the inductor load current is linearly raised from 0 to the test current), and the duration is the first pulse width. Then, the freewheeling stage is entered. After the first pulse ends, the power module is controlled to be turned off, and the inductor load current flows through the power module for freewheeling. The freewheeling time is within a time threshold interval, so as to maintain the current stable. For example, the first pulse width is preset to T1, the freewheeling time is T0, and the time threshold interval can be set to 0.5T1≤T0≤2T1. Then, the second pulse is applied. The double-pulse controller outputs the second drive pulse to control the power module to be turned on again and turned off after a preset time. The end voltage waveform and the load current waveform of the power module are collected through the oscilloscope to obtain the turn-on transient parameter and the turn-off transient parameter. The parameter calculation is performed. The turn-on delay time, the turn-off delay time, the turn-on loss, the turn-off loss, and the reverse recovery parameter of the anti-parallel diode of the power module are calculated based on the collected waveforms. Then, S4 is performed.

[0031] In the embodiment of the present application, S4 performs a replacement operation. After the test is completed, the upper cover is opened, the module fastener is removed, and the new semiconductor power module is replaced. After the new semiconductor power module is replaced, S1-S3 are repeatedly performed without disassembling the external wiring. The double-pulse test is directly started after the new semiconductor power module is replaced. In the embodiment, the HPD drive board is selected to be a special HPD drive board. The special HPD drive board is provided with elastic probes corresponding to the signal terminals of the HPD / HPD_L packaged semiconductor power module, so as to compensate for the installation position tolerance of the power module. The upper cover and the box body are both aluminum alloy aviation box structures. The cover body of the upper cover is provided with an upper cover filling layer, and the box body is provided with a box body filling layer. The upper cover filling layer and the box body filling layer can both be high-density polyurethane materials, which are used to fix the internal components and reduce vibration interference.

[0032] In the embodiment of the present application, the double-pulse test method further comprises multi-working condition test, the direct current bus voltage and test current are changed, the operation of S3 is repeated, so that the dynamic parameters under different working conditions are obtained, and the dynamic characteristic curve of the power module is generated according to the dynamic parameters.

[0033] Compared with the prior art, the portable double-pulse test device and the double-pulse test method provided by the present application have the beneficial effects that: the device is specially designed for HPD / HPD_L packaged semiconductor power modules, without the need to purchase a complete test system, greatly reducing equipment investment, and being suitable for the needs of small and medium-sized manufacturers focusing on double-pulse test; portable and modular: integrated in the box, convenient for transportation and on-site testing; supporting replacement of drive boards, emulators and other components, flexible adaptation to different test requirements; reducing signal terminal position tolerance through module fasteners, without the need to repeatedly adjust external wiring during clamping, shortening test preparation time; integrated absorption capacitor and optimized busbar layout, reducing parasitic parameter interference and improving test accuracy; convenient operation: when the upper cover is closed, the HPD drive board can be automatically fitted with the semiconductor power module signal terminal, and the test wiring is completed uniformly through the wiring panel, simplifying the operation process.

[0034] The above describes the optional implementation manners of the embodiments of the present application in detail in combination with the drawings, but the embodiments of the present application are not limited to the specific details in the above implementation manners, and various simple modifications can be made to the technical solutions of the embodiments of the present application within the technical concept range of the embodiments of the present application, and these simple modifications all belong to the protection range of the embodiments of the present application.

[0035] In addition, it should be noted that various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, various possible combinations are not described again in the embodiments of the present application.

[0036] Those skilled in the art can understand that all or part of the steps of the above-mentioned embodiment methods can be completed by programs instructing related hardware. The programs are stored in a storage medium, and include a plurality of instructions for causing a single-chip microcomputer, a chip or a processor to execute all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk and various program code storage media.

[0037] In addition, various different embodiments of the embodiments of the present application can also be combined in any appropriate manner, as long as they do not contradict the idea of the embodiments of the present application, and should be considered as disclosed by the embodiments of the present application.

Claims

1. A portable dual pulse testing device, characterized by, The box body and the module fastener; The upper cover comprises a cover body, a wiring panel, a double-pulse controller, a double-pulse simulator and an HPD drive board embedded in the cover body, the double-pulse controller is connected with the HPD drive board and the wiring panel respectively, and the double-pulse simulator is connected with the wiring panel; The box body comprises a support plate, at least two DC filter capacitors, a DC bus, at least three absorption capacitors and a double-pulse test platform, the double-pulse test platform is arranged on the support plate, the DC filter capacitors are fixed on the bottom plate of the double-pulse test platform, the absorption capacitors are welded on the output end of the DC bus, the DC bus is provided with six inductance lines, and the DC bus is fixed on the DC filter capacitors; The module fastener is arranged on the top of the double-pulse test platform and is used for positioning and clamping the measured module; The power input line, the six inductance lines and the AC output terminal inductance line of the DC bus are connected to the wiring panel.

2. The portable dual pulse testing device of claim 1, wherein, The cover body is internally provided with a panel base, the panel base is provided with a mounting groove, the double-pulse controller and the double-pulse simulator are arranged in the mounting groove in a left-right manner; The wiring panel is mounted on the upper surface of the panel base and is located above the double-pulse controller, the wiring panel is provided with a through hole, the button of the double-pulse controller is arranged through the through hole, and the wiring of the double-pulse controller is connected with the wiring panel; The HPD drive board is mounted on the lower surface of the panel base and is located below the double-pulse simulator, the signal wiring of the double-pulse controller is connected to the HPD drive board through the internal space of the panel base, and the power wiring of the double-pulse simulator is connected to the wiring panel through the internal space of the panel base.

3. The portable dual pulse testing device of claim 2, wherein, The DC filter capacitors and the DC bus are located below the double-pulse controller, and the module fastener is located below the HPD drive board; The module fastener is provided with a plurality of limiting holes and a plurality of limiting columns, the limiting holes correspond to the pins and mounting columns of the measured power module and are used for penetrating the pins and mounting columns of the measured power module; The top of the double-pulse test platform is provided with three inductance line terminals, the limiting columns penetrate the inductance line terminals and the double-pulse test platform.

4. The portable dual pulse testing device of claim 3, wherein, The DC bus is fixed with the six inductance lines through power terminal connection nails, the power terminal connection nails penetrate the mounting holes of the DC bus and the end portions of the inductance lines and are fixed by welding.

5. The portable dual pulse testing device of claim 1, wherein, The DC filter capacitors are fixed vertically on the bottom plate of the double-pulse test platform, and the HPD drive board is fixed on the support plate, and the signal terminals of the measured module are connected to the HPD drive board vertically downward.

6. The portable dual pulse testing device of claim 1, wherein, The DC filter capacitors are installed horizontally on the bottom plate of the double-pulse test platform and are connected to the DC bus through wires.

7. A double pulse test method based on the portable double pulse test device according to any one of claims 1 to 5, characterized in that, The method comprises the following steps: S1: performing clamping operation, opening the upper cover, placing the semiconductor power module on the positioning groove of the double-pulse test platform, installing the module fastener on the upper surface of the power module, fixing the power module through the limiting columns of the module fastener, and connecting the AC terminals of the power module with the inductance lines; S2: performing a connection operation, closing the upper cover, embedding the HPD drive board and the power module signal terminal, connecting the external power supply to the power interface of the wiring panel, and connecting the external inductor to the inductor interface of the wiring panel; S3: performing a test operation, inputting test parameters through a double-pulse simulator, the double-pulse simulator generating a simulation waveform according to the test parameters and outputting to a double-pulse controller, connecting an oscilloscope high-voltage differential probe to the corresponding position of the bridge arm to be tested on the wiring panel, and collecting switch dynamic waveforms; S4: performing a replacement operation, opening the upper cover after the test is completed, releasing the module fastener, and repeating S1-S3 after replacing a new semiconductor power module.

8. The dual pulse test method of claim 6, wherein, In S1, the power module is fixed by the module fastener, so that the DC terminals of the power module are connected to the DC busbar and the AC terminals of the power module are connected to the inductor wire.

9. The dual pulse test method of claim 6, wherein, S3 specifically includes: The test parameters include DC bus voltage, test current, first pulse width, and second pulse width. A first pulse is applied, the double-pulse controller outputs a first drive pulse to the HPD drive board, controls the power module to turn on, and makes the inductor load current rise to the test current, with a duration of the first pulse width. After the first pulse ends, the power module is controlled to turn off, and the inductor load current flows through the power module, with a freewheeling time within a time threshold interval. A second pulse is applied, the double-pulse controller outputs a second drive pulse, controls the power module to turn on again and turn off after a preset time, and collects the end voltage waveform and load current waveform of the power module through the oscilloscope.

10. The dual pulse test method of claim 8, wherein, Further comprising: Multi-condition testing, changing the DC bus voltage and test current, repeating S3, obtaining dynamic parameters under different conditions, and generating a dynamic characteristic curve of the power module according to the dynamic parameters.

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