Substrate liquid processing apparatus, substrate liquid processing method, and image processing method

Abstract

The present disclosure provides a technique that facilitates confirmation of whether or not a substrate immersed in a processing liquid is appropriately held by a substrate holding member. The substrate liquid processing apparatus includes: a processing tank for storing a processing liquid; a substrate support member that supports a plurality of substrates arranged in an upright posture at intervals from each other; a support movement unit that moves the substrate support member so that the plurality of substrates are disposed at a processing position where the substrates are positioned so as to be immersed in the processing liquid and at an avoidance position where the substrates are positioned outside the processing tank; an imaging unit that acquires captured images of the outer peripheral end surfaces of the plurality of substrates; and an image processing unit that performs image processing on the basis of a comparison between a captured image of the outer peripheral end surfaces of the plurality of substrates before being immersed in the processing liquid and a captured image of the outer peripheral end surfaces of the plurality of substrates after being immersed in the processing liquid. A determination is made in accordance with a positional shift between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a substrate liquid processing apparatus, a substrate liquid processing method, and an image processing method. BACKGROUND

[0002] Patent Literature 1 discloses a technology capable of confirming whether a substrate is properly held by a substrate support member in a state immersed in a processing liquid.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2022-158331 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present disclosure provides a technology that is advantageous in confirming whether a substrate after being immersed in a processing liquid (i.e., after being soaked in a processing liquid and taken out) is properly held by a substrate holding member.

[0008] MEANS OF SOLVING THE PROBLEM

[0009] One technical solution of the present disclosure relates to a substrate liquid processing apparatus including: a processing tank that stores a processing liquid; a substrate support member that arranges and supports a plurality of substrates at a standing posture at intervals from each other; a support moving section that moves the substrate support member to arrange the plurality of substrates at a processing position and an avoiding position, wherein at the processing position, the plurality of substrates are positioned in the processing tank in a manner of being immersed in the processing liquid, and at the avoiding position, the plurality of substrates are positioned outside the processing tank; a photographing section that acquires a photographed image of an outer peripheral end surface of the plurality of substrates; and an image processing section that performs a judgment corresponding to a positional shift between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the photographed image of the outer peripheral end surface of the plurality of substrates before being immersed in the processing liquid and the photographed image of the outer peripheral end surface of the plurality of substrates after being immersed in the processing liquid (i.e., after being immersed in the processing liquid).

[0010] EFFECT OF THE INVENTION

[0011] According to the present disclosure, it is possible to provide a technology that is advantageous in confirming whether a substrate after being immersed in a processing liquid is properly held by a substrate holding member. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a schematic plan view showing an overall structure of an example of a substrate liquid processing system.

[0013] Figure 2This is a system diagram illustrating an example of the structure of an etching process apparatus assembled in a substrate liquid treatment system.

[0014] Figure 3 This is a schematic longitudinal cross-sectional view of an example of a processing tank in an etching apparatus.

[0015] Figure 4 This is a rough longitudinal section view along the length of an example of a processing tank.

[0016] Figure 5 This is a schematic top view of an example of a processing tank.

[0017] Figure 6 This is a longitudinal cross-sectional view of an example of a processing tank with only the cover and surrounding components in the closed position removed.

[0018] Figure 7 This is a three-dimensional diagram of an example of a cover.

[0019] Figure 8 It means from Figure 6 The diagram shows a longitudinal cross-section of the cover after it has been moved from the closed position to the open position.

[0020] Figure 9 This is a schematic diagram showing an example of a camera (capturing unit) and lighting unit arranged near the processing tank.

[0021] Figure 10 This is an example of an image taken from the outer peripheral surface of a substrate.

[0022] Figure 11 This is a flowchart illustrating an example of a substrate solution treatment method.

[0023] Figure 12 This is a flowchart illustrating an example of an image processing method.

[0024] Figure 13A This is an example diagram showing a portion of a captured image; it is used for illustration. Figure 12 A conceptual diagram of the image processing method shown.

[0025] Figure 13B This is an example diagram showing a portion of a captured image; it is used for illustration. Figure 12 A conceptual diagram of the image processing method shown.

[0026] Figure 13C This is an example diagram showing a portion of a captured image; it is used for illustration. Figure 12 A conceptual diagram of the image processing method shown.

[0027] Figure 13D This is an example diagram showing a portion of a captured image; it is used for illustration.Figure 12 A conceptual diagram of the image processing method.

[0028] Figure 13E is a diagram showing an example of a partial region of a captured image, and is used to explain Figure 12 A conceptual diagram of the image processing method.

[0029] Figure 13F is a diagram showing an example of a partial region of a captured image, and is used to explain Figure 12 A conceptual diagram of the image processing method.

[0030] Figure 13G is a diagram showing an example of a partial region of a captured image, and is used to explain Figure 12 A conceptual diagram of the image processing method.

[0031] Figure 14 is a diagram showing an example of a comparison process between a captured image before liquid processing and a captured image after liquid processing.

[0032] Figure 15 is a diagram showing an example of an outline partial enlarged plan view of an outer peripheral end surface of a substrate.

[0033] Figure 16 is a flowchart showing an example of an edge enhancement process (substrate end surface enhancement process) performed by the image processing section. DETAILED DESCRIPTION

[0034] Hereinafter, an embodiment of the present technology will be described with reference to the drawings.

[0035] Figure 1 is a diagram showing an example of an outline plan view of the overall structure of the substrate liquid processing system 1A.

[0036] Figure 1 The substrate liquid processing system 1A shown in the figure has a carrier in-out section 2, a batch forming section 3, a batch placement section 4, a batch conveying section 5, a batch processing section 6, and a control section 7.

[0037] The carrier in-out section 2 performs the in-out of a carrier 9 that houses a plurality of (for example, 25) substrates (for example, silicon wafers) 8 arranged in a horizontal posture in a stack. Each substrate 8 has a disc shape and has a notch in the outer peripheral portion.

[0038] In the carrier in-out section 2, a carrier table 10 on which a plurality of carriers 9 can be placed, a carrier transport mechanism 11 that transports the carriers 9, carrier storage sections 12, 13 that temporarily store the carriers 9, and a carrier placement table 14 on which the carriers 9 can be placed are provided. The carrier storage section 12 temporarily stores the substrates 8 as products before the substrates are processed by the batch processing section 6. The carrier storage section 13 temporarily stores the substrates 8 as products after the substrates are processed by the batch processing section 6.

[0039] The carrier in-out section 2 transports the carriers 9 that are carried in from the outside to the carrier table 10 using the carrier transport mechanism 11 to the carrier storage section 12, the carrier placement table 14. In addition, the carrier in-out section 2 transports the carriers 9 that are placed on the carrier placement table 14 using the carrier transport mechanism 11 to the carrier storage section 13, the carrier table 10. The carriers 9 that are transported to the carrier table 10 are carried out to the outside.

[0040] The batch forming section 3 combines the substrates 8 housed in one or more carriers 9 to form a batch (also referred to as a processing batch or a batch) composed of a plurality of (for example, 50 to 100) substrates 8 that are processed at the same time. In the batch, two substrates 8 that are adjacent to each other and are arranged so that the pattern formation surfaces thereof face each other can be included, or the pattern formation surfaces of all the substrates 8 included in the batch can face the same direction.

[0041] The batch forming section 3 is provided with a substrate transport mechanism 15 that transports a plurality of substrates 8. The substrate transport mechanism 15 can change the attitude of the substrates 8 from a horizontal attitude to a vertical attitude and from a vertical attitude to a horizontal attitude in the middle of the transport of the substrates 8.

[0042] The batch forming section 3 transports the substrates 8 from the carriers 9 placed on the carrier placement table 14 to the batch placement section 4 using the substrate transport mechanism 15, and places the substrates 8 that form a batch on the batch placement section 4. In addition, the batch forming section 3 transports the batch placed on the batch placement section 4 to the carrier 9 placed on the carrier placement table 14 using the substrate transport mechanism 15. In the substrate transport mechanism 15, as a substrate support section for supporting a plurality of substrates 8, there are a pre-processing substrate support section that supports the pre-processing substrates 8 before the substrates are transported by the batch transport section 5, and a post-processing substrate support section that supports the post-processing substrates 8 after the substrates are transported by the batch transport section 5. With the substrate support section having such a structure, it is possible to prevent particles attached to the pre-processing substrates 8 and the like from being transferred to the post-processing substrates 8 and the like.

[0043] The batch placement section 4 temporarily places (stands by) the batch that is transported between the batch forming section 3 and the batch processing section 6 by the batch transport section 5 on the batch placement table 16.

[0044] The batch placement section 4 is provided with a batch placement table 17 on the incoming side for placing a batch before processing (before being transported by the batch transport section 5) and a batch placement table 18 on the outgoing side for placing a batch after processing (after being transported by the batch transport section 5). On the batch placement table 17 on the incoming side and the batch placement table 18 on the outgoing side, a plurality of substrates 8 in a batch of one lot can be placed in vertical posture in a row.

[0045] In the batch placement section 4, the batch formed by the batch forming section 3 is placed on the batch placement table 17 on the incoming side, and is transported to the batch processing section 6 via the batch transport section 5. Also, in the batch placement section 4, the batch transported from the batch processing section 6 is transported to the batch placement table 18 on the outgoing side via the batch transport section 5 and is placed, and thereafter, is transported to the batch forming section 3.

[0046] The batch transport section 5 transports a batch between the batch placement section 4 and the batch processing section 6 and inside the batch processing section 6.

[0047] The batch transport section 5 is provided with a batch transport mechanism 19 that transports a batch. The batch transport mechanism 19 has a track 20 that extends along the batch placement section 4 and the batch processing section 6, and a moving body 21 that moves along the track 20 while holding a plurality of substrates 8. The moving body 21 is provided with a substrate holding body 22 that can hold a plurality of substrates 8 in vertical posture in a row in a retractable manner.

[0048] The batch transport section 5 receives the batch placed on the batch placement table 17 on the incoming side with the substrate holding body 22 of the batch transport mechanism 19, and hands over the batch to the batch processing section 6. Also, the batch transport section 5 receives the batch processed by the batch processing section 6 with the substrate holding body 22 of the batch transport mechanism 19, and hands over the batch to the batch placement table 18 on the outgoing side. Further, the batch transport section 5 transports a batch inside the batch processing section 6 using the batch transport mechanism 19.

[0049] The batch processing section 6 performs processing such as etching, cleaning, and drying on each batch including a plurality of substrates 8 in vertical posture in a row.

[0050] In the batch processing section 6, a drying processing device 23, a substrate holding body cleaning processing device 24, a cleaning processing device 25, and an etching processing device (substrate liquid processing device) 1 are arranged in a row. The drying processing device 23 performs drying processing of the substrates 8. The substrate holding body cleaning processing device 24 performs cleaning processing of the substrate holding body 22. The cleaning processing device 25 performs cleaning processing of the substrates 8. The etching processing device (substrate liquid processing device) 1 performs etching processing of the substrates 8.

[0051] The drying processing device 23 has a processing tank 27 and a substrate lifting mechanism 28 provided in the processing tank 27 so as to be liftable. Processing gas for drying (IPA (isopropyl alcohol) or the like) is supplied to the processing tank 27. The substrate lifting mechanism 28 is capable of holding a plurality of substrates 8 in one batch in a vertical posture in a row. The drying processing device 23 receives the batch from the substrate holding body 22 of the batch transport mechanism 19 with the substrate lifting mechanism 28, and lifts the batch with the substrate lifting mechanism 28, thereby performing drying processing of the substrates 8 with the processing gas for drying supplied to the processing tank 27. Further, the drying processing device 23 hands over the batch from the substrate lifting mechanism 28 to the substrate holding body 22 of the batch transport mechanism 19.

[0052] The substrate holding body cleaning processing device 24 has a processing tank 29 to which a processing liquid for cleaning and a drying gas are supplied, and performs cleaning processing of the substrate holding body 22 by supplying the drying gas after supplying the processing liquid for cleaning to the substrate holding body 22 of the batch transport mechanism 19.

[0053] The cleaning processing device 25 has a processing tank 30 for cleaning and a processing tank 31 for rinsing, and substrate lifting mechanisms 32, 33 are provided in each of the processing tanks 30, 31 so as to be liftable. A processing liquid for cleaning (SC-1 or the like) is stored in the processing tank 30 for cleaning. A processing liquid for rinsing (pure water or the like) is stored in the processing tank 31 for rinsing.

[0054] The etching processing device 1 has an etching processing tank 34 and a rinsing processing tank 35, and substrate lifting mechanisms 36, 37 are provided in each of the processing tanks 34, 35 so as to be liftable. An etching processing liquid (aqueous phosphoric acid solution) is stored in the etching processing tank 34. A rinsing processing liquid (pure water or the like) is stored in the rinsing processing tank 35. As described above, the etching processing device 1 constitutes a substrate liquid processing device.

[0055] The cleaning treatment device 25 and the etching treatment device 1 have the same structure. The etching treatment device (substrate liquid treatment device) 1 will be described. In the substrate lifting mechanism 36, a batch of a plurality of substrates 8 is held in a vertical posture in a row. In the etching treatment device 1, the batch is received from the substrate holding body 22 of the batch transport mechanism 19 by the substrate lifting mechanism 36, and the batch is lifted by the substrate lifting mechanism 36, so that the batch is immersed in the etching treatment liquid of the treatment tank 34 to perform etching treatment of the substrates 8. After that, the etching treatment device 1 hands over the batch from the substrate lifting mechanism 36 to the substrate holding body 22 of the batch transport mechanism 19. In addition, the batch is received from the substrate holding body 22 of the batch transport mechanism 19 by the substrate lifting mechanism 37, and the batch is lifted by the substrate lifting mechanism 37, so that the batch is immersed in the rinsing treatment liquid of the treatment tank 35 to perform rinsing treatment of the substrates 8. After that, the batch is handed over from the substrate lifting mechanism 37 to the substrate holding body 22 of the batch transport mechanism 19.

[0056] The control section 7 controls the operation of each section of the substrate liquid treatment system 1A (for example, the carrier feeding and discharging section 2, the batch forming section 3, the batch placement section 4, the batch transport section 5, the batch treatment section 6, and each of the etching treatment devices 1).

[0057] The control section 7 is constituted by, for example, a computer, and has a storage medium 38 readable by the computer. In the storage medium 38, a program for controlling various treatments performed in the substrate liquid treatment device 1 is stored. The control section 7 controls the operation of the substrate liquid treatment device 1 by reading and executing the program stored in the storage medium 38. In addition, the program can be stored in the storage medium 38 readable by the computer, or can be installed from another storage medium to the storage medium 38 of the control section 7. As the storage medium 38 readable by the computer, for example, a hard disk (HD), a floppy disk (FD), a compact disc (CD), a magneto-optical disk (MO), a memory card, or the like is used.

[0058] As described above, in the treatment tank 34 of the etching treatment device 1, an aqueous solution (phosphoric acid aqueous solution) of a reagent (phosphoric acid) of a predetermined concentration is used as a treatment liquid (etching liquid) to perform liquid treatment (etching treatment) on the substrates 8.

[0059] Figure 2 is a system diagram showing a structure example of the etching treatment device 1 assembled in the substrate liquid treatment system 1A.

[0060] The etching treatment device 1 has the above-described treatment tank 34 that stores an aqueous solution of phosphoric acid of a predetermined concentration as a treatment liquid. The treatment tank 34 has an inner tank 34A and an outer tank 34B. The aqueous solution of phosphoric acid overflowing from the inner tank 34A flows into the outer tank 34B. The liquid level of the outer tank 34B is maintained lower than the liquid level of the inner tank 34A.

[0061] The upstream end of a circulation line 50 is connected to the bottom of the outer tank 34B. The downstream end of the circulation line 50 is connected to a treatment liquid supply nozzle 49 provided in the inner tank 34A. In the circulation line 50, a pump 51, a heater 52, and a filter 53 are provided in this order from the upstream side. By driving the pump 51, a circulation flow of phosphoric acid aqueous solution can be formed, which is fed from the outer tank 34B into the inner tank 34A via the circulation line 50 and the treatment liquid supply nozzle 49, and then flows out from the inner tank 34A to the outer tank 34B again.

[0062] A liquid treatment section 39 is formed by the treatment tank 34, the circulation line 50, and devices provided in the circulation line 50 (e.g., the pump 51, the heater 52, the filter 53, and the like). In addition, a circulation system is constituted by the treatment tank 34 and the circulation line 50.

[0063] Below the treatment liquid supply nozzle 49 in the inner tank 34A, a gas nozzle 60 (for performing bubbling) for discharging bubbles of a non-active gas such as nitrogen gas into the phosphoric acid aqueous solution in the inner tank 34A is provided. The gas nozzle 60 is supplied with a non-active gas such as nitrogen gas from a gas supply source 60B via a flow regulator 60C constituted by an on-off valve, a flow control valve, a flow meter, and the like.

[0064] The treatment tank 34 is provided with the above-described substrate lifting mechanism 36. The substrate lifting mechanism 36 can hold a plurality of substrates 8 in a state in which they are arranged at intervals in a vertical standing attitude in the horizontal direction, and can lift them in this state.

[0065] The etching treatment apparatus 1 has a phosphoric acid aqueous solution supply section 40 for supplying phosphoric acid aqueous solution to the liquid treatment section 39, a pure water supply section 41 for supplying pure water to the liquid treatment section 39, a silicon supply section 42 for supplying a silicon solution to the liquid treatment section 39, and a phosphoric acid aqueous solution discharge section 43 for discharging phosphoric acid aqueous solution from the liquid treatment section 39.

[0066] The phosphoric acid aqueous solution supply section 40 supplies phosphoric acid aqueous solution of a prescribed concentration to an arbitrary position in the circulation system constituted by the treatment tank 34 and the circulation line 50, i.e., in the liquid treatment section 39, preferably to the outer tank 34B as illustrated. The phosphoric acid aqueous solution supply section 40 includes a phosphoric acid aqueous solution supply source 40A constituted by a tank that stores phosphoric acid aqueous solution, a phosphoric acid aqueous solution supply line 40B that connects the phosphoric acid aqueous solution supply source 40A to the outer tank 34B, and a flow meter 40C, a flow control valve 40D, and an on-off valve 40E provided in this order from the upstream side on the phosphoric acid aqueous solution supply line 40B. The phosphoric acid aqueous solution supply section 40 can supply phosphoric acid aqueous solution to the outer tank 34B at a controlled flow rate via the flow meter 40C and the flow control valve 40D.

[0067] The pure water supply section 41 is used to supply pure water to replenish the water evaporated due to heating of the phosphoric acid aqueous solution. The pure water supply section 41 includes a pure water supply source 41A that supplies pure water at a prescribed temperature, which is connected to the outer tank 34B via a flow regulator 41B. The flow regulator 41B can be constituted by an on-off valve, a flow control valve, a flow meter, or the like.

[0068] The silicon supply section 42 has a silicon supply source 42A constituted by a tank, which stores a liquid obtained by dispersing a silicon-containing compound solution such as colloidal silica, and a flow regulator 42B. The flow regulator 42B can be constituted by an on-off valve, a flow control valve, a flow meter, or the like.

[0069] The phosphoric acid aqueous solution discharge section 43 is provided to discharge the phosphoric acid aqueous solution present in the circulation system constituted by the liquid treatment section 39 and the circulation line 50, i.e., in the liquid treatment section 39. The phosphoric acid aqueous solution discharge section 43 has a discharge line 43A branched from the circulation line 50, and a flow meter 43B, a flow control valve 43C, an on-off valve 43D, and a cooling tank 43E provided in this order from the upstream side on the discharge line 43A. The phosphoric acid aqueous solution discharge section 43 can discharge the phosphoric acid aqueous solution at a controlled flow rate via the flow meter 43B and the flow control valve 43C.

[0070] The cooling tank 43E temporarily stores and cools the phosphoric acid aqueous solution flowing through the discharge line 43A. The phosphoric acid aqueous solution (see reference numeral 43F) flowing out of the cooling tank 43E can be discarded into a factory waste liquid system (not shown), or can be sent back to the phosphoric acid aqueous solution supply source 40A after removal of silicon contained in the phosphoric acid aqueous solution by a regeneration device (not shown) to be reused.

[0071] In the illustrated example, the discharge line 43A is connected to the circulation line 50 at the position of the filter drain (in the drawing), but is not limited thereto, and can be connected to another portion in the circulation system, such as the bottom of the inner tank 34A.

[0072] A silicon concentration meter 43G that measures the silicon concentration in the phosphoric acid aqueous solution is provided in the discharge line 43A. In addition, a phosphoric acid concentration meter 55B that measures the phosphoric acid concentration in the phosphoric acid aqueous solution is provided in a branch line 55A branched from the circulation line 50 and connected to the outer tank 34B. A liquid level meter 44 that detects the liquid level in the outer tank 34B is provided in the outer tank 34B.

[0073] Next, the operation of the phosphoric acid aqueous solution supply device 30 will be described with reference to the flowchart of Fig. 6. Figures 3-7The structure of the processing tank 34 of the etching processing apparatus 1 will be described in detail. For the convenience of explanation, an XYZ orthogonal coordinate system is set and referred to as necessary. Also, the X negative direction is sometimes referred to as "front side" or "front", the X positive direction is sometimes referred to as "rear side" or "rear", the Y negative direction is sometimes referred to as "right side" or "right", and the Y positive direction is sometimes referred to as "left side" or "left".

[0074] As described above, the processing tank 34 has an inner tank 34A which is open at the upper portion and an outer tank 34B which is open at the upper portion. The inner tank 34A is housed inside the outer tank 34B. The phosphoric acid aqueous solution overflowing from the inner tank 34A flows into the outer tank 34B. During the execution of the liquid processing, most of the inner tank 34A including the bottom is immersed in the phosphoric acid aqueous solution inside the outer tank 34B.

[0075] The outer tank 34B is housed inside a liquid receiving container (water tank) 80, and a drain space 81 is formed between the outer tank 34B and the liquid receiving container 80. A drain line 82 is connected to the bottom of the drain space 81.

[0076] The processing liquid supply nozzle 49 is composed of a cylindrical body which extends in the X direction (horizontal direction) inside the inner tank 34A. The processing liquid supply nozzle 49 discharges the processing liquid from a plurality of discharge ports 49D (refer to Figure 3 and Figure 4 ) provided through the periphery thereof toward the substrate 8 held by the substrate lifting mechanism 36. Two processing liquid supply nozzles 49 are provided in the drawing, but three or more processing liquid supply nozzles 49 can be provided. The processing liquid (phosphoric acid aqueous solution) is supplied to the processing liquid supply nozzle 49 from a pipe 49A which extends in the vertical direction.

[0077] The gas nozzle 60 is composed of a cylindrical body which extends in the X direction (horizontal direction) at a lower height position than the processing liquid supply nozzle 49 inside the inner tank 34A. The gas nozzle 60 discharges bubbles of the non-active gas (for example, nitrogen) from a plurality of discharge ports 60D (refer to Figure 3 and Figure 4 ) provided through the periphery thereof. By bubbling the non-active gas, the boiling state of the phosphoric acid aqueous solution inside the inner tank 34A can be stabilized. The processing liquid (phosphoric acid aqueous solution) is supplied to the gas nozzle 60 from a pipe 60A which extends in the vertical direction.

[0078] The substrate lifting mechanism 36 has a support plate 36A which extends in the vertical direction (Z direction) and is lifted by a lifting mechanism 36C, and a pair of substrate support members 36B which extend in the horizontal direction (X direction) and are supported at one end by the support plate 36A (also refer to Figure 9). Each substrate support member 36B has a plurality of (e.g., 50 to 52) substrate holding grooves (not shown) arranged at intervals in the horizontal direction (X direction). The peripheral edge portion of the substrate 8 is inserted into each substrate holding groove, and a plurality of substrates are supported by the pair of substrate support members 36B in a manner of standing in the Z direction (first direction). As described above, the pair of substrate support members 36B can arrange and support a plurality of (e.g., 50 to 52) substrates 8 at intervals in the horizontal direction (X direction) in a standing attitude (vertical attitude). Such a substrate lifting mechanism 36 is known in the art, and the illustration and description of the detailed structure are omitted.

[0079] The processing tank 34 is provided with a first cover 71 and a second cover 72 for opening and closing the upper opening of the inner tank 34A. The first cover 71 and the second cover 72 are respectively coupled to rotating shafts 71S, 72S extending in the horizontal direction (X direction). The rotating shafts 71S, 72S are linked to a bearing 83 fixed to the liquid receiving container 80 and a rotating actuator 84 (refer to Figure 4 、 Figure 5 By operating the rotating actuator 84, the first cover 71 and the second cover 72 can be rotated (swung) about the respective rotating axes extending in the horizontal direction (X direction) between a closed position (position shown in Figure 3 and Figure 6 ) in which the first region (left half) and the second region (right half) of the upper opening of the inner tank 34A are covered, and an open position (position shown in Figure 8 ) in which the first region and the second region of the upper opening of the inner tank 34A are opened in a substantially upright state (refer to arrows SW1, SW2 in Figure 3 ).

[0080] The first cover 71 and the second cover 72 do not cover the regions of the upper opening of the inner tank 34A in which the support plate 36A, the pipes 49A, 60A are provided.

[0081] In the normal operation of the etching processing device 1, the first cover 71 and the second cover 72 are located at the closed position except when the substrate 8 held by the substrate lifting mechanism 36 is sent into or out of the inner tank 34A, preventing the temperature of the aqueous phosphoric acid solution located in the inner tank 34A from decreasing, and suppressing the water vapor generated from the boiling aqueous phosphoric acid solution from escaping to the outside of the processing tank 34.

[0082] The first cover 71 has a substantially rectangular main body portion 71A, a first mist barrier portion 71B extending in the X direction, a second mist barrier portion 71C and a closing portion 71D, and a third mist barrier portion 71E extending in the Y direction, as viewed from directly above. Likewise, the second cover 72 has a substantially rectangular main body portion 72A, a first mist barrier portion 72B extending in the X direction, a second mist barrier portion 72C and a closing portion 72D, and a third mist barrier portion 72E extending in the Y direction.

[0083] A large rectangular recess 71R is formed in the upper surface of the main body portion 71A. The recess 71R is defined by a bottom wall 711R and four side walls 712R, 713R, 714R, 715R.

[0084] In order not to hinder the overflow of the aqueous phosphoric acid solution from the inner tank 34A to the outer tank 34B when the first cover 71 is in the closed position (refer to arrow OF), a gap is provided between the side wall of the inner tank 34A and the side wall 712R, 713R that opposes it in close proximity. Further, although not shown, a plurality of V-shaped notches are formed at intervals in the upper ends of the four side walls of the inner tank 34A, so that the overflow can be performed smoothly. Figure 6

[0085] The bottom wall 711R of the first cover 71 is inclined in such a manner as to become higher as it moves away from the second cover 72 in the Y direction (as it moves closer to the side wall of the inner tank 34A in the Y direction). By this inclination, the above-described overflow can be performed smoothly.

[0086] Since the aqueous phosphoric acid solution in the inner tank 34A is in a boiling state or bubbling is performed, mist of the aqueous phosphoric acid solution also splashes from the inner tank 34A along with the aqueous phosphoric acid solution that overflows from the inner tank 34A to the outer tank 34B. This splashed mist collides with the first mist barrier portion 71B of the first cover 71 that is in the closed position, and falls into the space between the side wall of the inner tank 34A and the side wall of the outer tank 34B, and does not fly out to the outside of the outer tank 34B. It is preferable that the lower end of the first mist barrier portion 71B of the first cover 71 in the closed position be located at a position that is at least lower than the upper end of the side wall of the inner tank 34A in close proximity.

[0087] The second mist barrier portion 71C functions in the same way as the first mist barrier portion 71B of the first cover 71 in the closed position when the first cover 71 is in the open position. It is preferable that the lower end of the first mist barrier portion 71B of the first cover 71 in the open position be located at a position that is at least lower than the upper end of the side wall of the inner tank 34A in close proximity.

[0088] When the first cover 71 is in the open position (refer to arrow OF), the aqueous phosphoric acid solution in the inner tank 34A overflows to the outer tank 34B through the gap between the side wall of the inner tank 34A and the side wall 712R, 713R of the first cover 71 in close proximity. Figure 8 ​The closing part 71D covers the area above the region from the rotation shaft 71S to the side wall of the outer tank 34B in the gap between the upper end of the side wall of the inner tank 34A and the upper end of the side wall of the outer tank 34B. When the first cover 71 is in the open position, the closing part 71D guides the liquid adhering to the upper surface of the main body 71A when the first cover 71 is in the closed position (e.g., liquid falling from the substrate as the wet substrate passes over the processing tank 34) to the drainage space 81 between the outer tank 34B and the liquid receiving container 80, preventing the liquid from flowing into the outer tank 34B. The liquid entering the drainage space 81 is discarded through the drainage line 82.

[0089] The third droplet shielding portion 71E is configured to extend above the space between the sidewall of the inner groove 34A and the sidewall of the outer groove 34B on the side away from the substrate lifting mechanism 36. The third droplet shielding portion 71E extends along the entire length of the end edge of the first cover 71 from the rotation axis 71S in the Y direction. When the first cover 71 is in the closed position, the third droplet shielding portion 71E functions the same as the first droplet shielding portion 71B. Preferably, in the open position, the lower end of the third droplet shielding portion 71E of the first cover 71 is located at least lower than the upper end of the adjacent sidewall of the inner groove 34A.

[0090] On the side near the substrate lifting mechanism 36, a droplet shielding part extending along the edge of the first cover 71 in the Y direction may not be provided. This is because the phosphoric acid aqueous solution that is scattered in the positive X direction will collide with the support plate 36A, pipes 49A, 60A, etc. of the substrate lifting mechanism 36, and therefore will hardly reach the outer tank 34B.

[0091] The second cover 72 is formed in a manner that is approximately mirror-symmetrical to the first cover 71. The structures of the first cover 71 and the second cover 72 are substantially the same. The difference between them lies in the presence or absence of the auxiliary components (plate-like body 73P, substrate pressing member 74) described later. Therefore, the description of the structure and function of the second cover 72 can follow the description of the structure and function of the first cover 71. The corresponding components of the first cover 71 and the second cover 72 (components located symmetrically and having the same function) are labeled with the same letter at the end of their reference numerals, differing only in whether the first two digits of the reference numerals are "71" or "72".

[0092] like Figure 6 As shown, when the first cover 71 and the second cover 72 are in the closed position, the side wall 712R extending upward from the bottom wall 711R of the first cover 71 and the side wall 722R extending upward from the bottom wall 721R of the second cover 72 face each other, forming a gap G of height H between the two side walls. By providing the recesses 71R and 72R, the increase in weight of the first cover 71 and the second cover 72 caused by the gap of height H can be suppressed.

[0093] As Figure 6 shown, in a case where the lower surface of the main body portion 71A (the lower surface of the bottom wall 711R) of the first lid body 71 and the lower surface of the main body portion 72A (the lower surface of the bottom wall 721R) of the second lid body 72 are in contact with the liquid surface of the treatment liquid in the inner tank 34A in the closed position, the phosphoric acid aqueous solution that is boiling or bubbling can splash upward from the gap between the first lid body 71 and the second lid body 72 and scatter around. However, by providing the gap G having the height H as described above, the treatment liquid is not likely to splash outward from the gap G. In order to achieve this effect, the height H can be, for example, about 5 cm or more.

[0094] In a case where the treatment liquid in the inner tank 34A is the phosphoric acid aqueous solution, at least the main body portions 71A, 72A of the first lid body 71 and the second lid body 72 are formed of a material such as quartz that is not eroded by the treatment liquid. In a case where the main body portions 71A, 72A are formed of quartz, cracks or notches can be generated by the quartz colliding with each other. In order to prevent this, it is preferable to provide a gap between the first lid body 71 and the second lid body 72 in a manner that the main body portions 71A, 72A do not contact each other when the first lid body 71 and the second lid body 72 are in the closed position. In a case where the main body portions 71A, 72A are provided with a gap therebetween, the phosphoric acid aqueous solution in the treatment tank 34, particularly in the inner tank 34A, can be scattered outward through the gap. However, by providing the gap G having the height H as described above, it is possible to at least greatly suppress the phosphoric acid aqueous solution from scattering from the gap G.

[0095] In addition, in a case where the bottom wall 711R (721R) is inclined as described above so as to be in contact with the phosphoric acid aqueous solution in the inner tank 34A and in order to make the overflow smooth, if the side wall 712R (722R) that extends upward from the bottom wall 711R (721R) is not present, the leading end of the bottom wall 711R (721R) will be immersed in the phosphoric acid aqueous solution. However, by providing the side wall 712R (722R) that extends upward from the bottom wall 711R (721R) as described above, it is possible to make the height position of the liquid surface of the phosphoric acid aqueous solution lower than the upper end of the side wall 712R (722R).

[0096] As Figure 6 shown, it is preferable to provide the cover 73 that extends to or beyond the upper end of the other (here, the main body portion 72A) from the leading end of either one of the main body portion 71A of the first lid body 71 and the main body portion 72A of the second lid body 72 (here, the main body portion 71A) so as to cover the gap G from above. By providing the cover 73, it is possible to prevent the treatment liquid from splashing upward from the gap G. Furthermore, in Figures 3-5 , in order to prevent the drawing from being complicated, the cover 73 (and the plate-shaped body 73P) is not described.

[0097] Furthermore, the gap G has a height H, so the momentum of the treatment liquid droplets scattering from the surface of the phosphoric acid aqueous solution in the inner tank 34A is reduced before colliding with the cover 73. Therefore, the treatment liquid will not splash to the side after colliding with the cover 73.

[0098] For example, such as Figure 6 As shown, the cover 73 can be provided by mounting a plate-shaped body 73P on the upper surface of the main body portion 71A of the first cover 71, wherein the plate-shaped body 73P has a generally rectangular cut-out portion 73Q that conforms to the outline of the recess 71R of the first cover 71. In this case, the cover 73 is formed by the end edge portion of the plate-shaped body 73P.

[0099] It is possible Figure 6 As shown, when the first cover 71 and the second cover 72 are in the closed position, a gap is provided between the cover 73 and the second cover 72. Alternatively, when the first cover 71 and the second cover 72 are in the closed position, the cover 73 is in contact with the second cover 72. In this case, the cover 73 functions as a seal that closes the upper end of the gap G.

[0100] When the cover 73 comes into contact with the second cover 72, the cover 73 is preferably made of a resin material that is soft enough to not cause damage to the quartz even if it collides with it, and has relatively high corrosion resistance, such as fluoropolymers such as PTFE and PFA.

[0101] Alternatively, the cover 73 can be integrally formed with the first cover 71. Alternatively, the cover 73 may not be provided. In the case where the cover 73 is not provided, it is preferable to further increase the aforementioned height H compared to the case where it is provided.

[0102] Additionally, a substrate pressing member 74 is provided on either the main body portion 71A of the first cover 71 or the main body portion 72A of the second cover 72 (in the example shown, the front end of the main body portion 72A of the second cover 72). A plurality of substrate holding grooves 74G are formed on the lower surface of the substrate pressing member 74, arranged at the same X-direction position along the arrangement direction (X direction) of the substrates 8 with the same spacing as the substrate holding grooves 36BG of the substrate support member 36B (see reference). Figure 7 Each substrate holding slot 74G can accommodate the periphery of one substrate 8. It should be noted that... Figure 7 The lower end (substrate holding groove 74G) of the substrate pressing member 74 can be seen in the three-dimensional view, but it is actually hidden by the bottom wall 721R of the recess 72R and cannot be seen.

[0103] In the illustrated embodiment, the substrate pressing member 74 is formed of an elongated plate-shaped body that is separate from the second cover 72 and is fixed to the main body portion 72A of the second cover 72 by screw fastening. Alternatively, the substrate pressing member 74 can be formed integrally with the second cover 72. In either case, the substrate pressing member 74 constitutes a part of the side wall 722R of the main body portion 72A of the second cover 72.

[0104] When the substrate 8 is being processed, the substrate pressing member 74 provided on the second cover 72 in the closed position cooperates with the substrate 8 supported by the substrate support member 36B to prevent or inhibit upward displacement of the substrate 8. Therefore, even if the treatment liquid is ejected from the treatment liquid supply nozzle 49 at a large flow rate, or even if the boiling level of the treatment liquid in the inner tank 34A rises, or even if nitrogen bubbling is performed vigorously, there is no fear of the substrate 8 falling from the substrate support member 36B.

[0105] Figure 9 is a schematic diagram showing an example of a camera (imaging section) 90 and an illuminating section 92 disposed in the vicinity of the processing tank 34.

[0106] The camera 90 and the illuminating section 92 are provided in the etching processing apparatus (substrate liquid processing apparatus) 1 of the present embodiment.

[0107] The camera 90 acquires an imaging image of the peripheral end surface 8a (APEX (outermost periphery of the substrate 8) and the vicinity thereof) of a plurality of substrates 8 (batch) held by the substrate support member 36B and transmits the imaging image to the image processing section 94. The camera 90 acquires imaging data of each substrate 8 held by the substrate support member 36B by simultaneously imaging all of the plurality of substrates 8 contained in the batch.

[0108] In the imaging image, although only an image of a part of the peripheral portion (in this example, the upper peripheral portion) of each substrate 8 is contained, an image of the peripheral end surface 8a in a range that is twice as large as the range of the recess N is contained in the peripheral portion of each substrate 8. In addition, in the imaging image, in addition to the image of the substrate 8, an image of a device element other than the substrate 8 (for example, an image (background image) of the substrate support member 36B or the like) is also included.

[0109] The camera 90 of the present embodiment acquires an imaging image of the peripheral end surface 8a of a plurality of substrates 8 irradiated with light emitted from the illuminating section 92. The camera 90 of the present example performs imaging in a state in which the plurality of substrates 8 supported by the substrate support member 36B are located outside the processing tank 34 and acquires an imaging image of the plurality of substrates 8.

[0110] That is, the substrate support member 36B acquires an imaging image of the peripheral end surface 8a of the plurality of substrates 8 held by the substrate support member 36B by simultaneously imaging the plurality of substrates 8 in the state in which the plurality of substrates 8 are located outside the processing tank 34, as described above. Figure 3The substrate support member 36B is moved by the action of the robot (not shown) and the like, and is capable of positioning the plurality of substrates 8 (batch) supported thereby in a processing position Pa and an avoidance position Pb. The plurality of substrates 8 disposed in the processing position Pa are positioned in the processing tank 34 and receive liquid processing (etching processing) in the processing liquid stored in the processing tank 34. On the other hand, the plurality of substrates 8 disposed in the avoidance position Pb are positioned outside the processing tank 34. Figure 9 The avoidance position Pb of the illustrated example is set directly above the processing position Pa, and the substrate support member 36B is moved upward (in the Z direction) together with the plurality of substrates 8 disposed in the processing position Pa, whereby the plurality of substrates 8 are disposed in the avoidance position Pb.

[0111] The camera 90 of the present embodiment performs imaging in a state in which the substrate support member 36B and the plurality of substrates 8 are stopped, but can also perform imaging in a state in which the substrate support member 36B and the plurality of substrates 8 are moving. The imaging direction Ds of the camera 90 at the time of acquiring an imaged image is not limited, but the imaging direction Ds of the present embodiment is a direction inclined with respect to the Z direction (first direction) (i.e., a direction forming an angle of greater than 0° and less than 90° with respect to the Z direction). The imaging direction Ds of the present example includes a component in the extending direction (Y direction) of each substrate 8.

[0112] A fan filter unit (FFU) 100 is disposed above the camera 90, and the rising of gas and liquid mist from the processing liquid from the processing tank 34 is suppressed by the vertical laminar flow of clean air brought about by the fan filter unit 100. The camera 90 can be disposed so as to overlap the fan filter unit 100 in the Z direction (height direction), but in the illustrated example, it is disposed so as not to overlap the fan filter unit 100 in the Z direction. Figure 9

[0113] Furthermore, a cover (omitted from illustration) covering at least a portion of the camera 90 can also be provided, and the camera 90 disposed inside the cover can be protected from the gas and liquid mist of the processing liquid by supplying a protective gas to the inside of the cover.

[0114] The illumination section 92 irradiates light toward the outer peripheral end surface 8a of the plurality of substrates 8 supported by the substrate support member 36B (particularly, the portion of the outer peripheral end surface 8a imaged by the camera 90 (in the present example, the upper portion)).

[0115] The illumination section 92 of the present embodiment is positioned between the camera 90 and the outer peripheral end surface (particularly, the upper outer peripheral end surface) 8a of the plurality of substrates 8. Figure 9 ​The illumination unit 92 shown is located below the camera 90, above and near the upper end of the substrate 8 disposed in the avoidance position Pb, and extends in the Y direction (horizontal direction) perpendicular to the Z direction. When multiple substrates 8 of the subject are disposed in the avoidance position Pb, light from the illumination unit 92 is reflected at the outer peripheral end face 8a and incident on the camera 90 as imaging light, thereby performing imaging.

[0116] The illumination unit 92, configured in this way, emits light from a portion or the entire length of its extension direction toward the inside of the paper. Therefore, when the camera 90 captures images of the outer peripheral surfaces 8a of the multiple substrates 8, the direction in which the illumination unit 92 illuminates the outer peripheral surfaces 8a of the multiple substrates 8 becomes a direction inclined relative to the Z direction (the first direction) (i.e., toward...). Figure 9 (The direction of light emission from the inside and downward side of the paper). In this example, the light emission direction from the illumination unit 92 includes components in the arrangement direction (X direction) of multiple substrates 8.

[0117] The extension direction (Y direction) of the illumination unit 92 is consistent with the extension direction of each of the multiple substrates 8 of the subject being photographed, and the range of the outer peripheral end face 8a of each substrate 8 illuminated by the light from the illumination unit 92 has a certain length in the Y direction. Therefore, the outer peripheral end face 8a of each substrate 8 of the subject being photographed appears as a line image in the captured image.

[0118] In addition, the lighting unit 92 can have any shape and structure, for example, it can include one or more line light sources and / or point light sources. The light source of such lighting unit 92 can be, for example, a fluorescent lamp or an LED (Light Emitting Diode).

[0119] As an example, the lighting unit 92 may include multiple point light sources (see reference). Figure 9 The reference numeral "92a" indicates that multiple point light sources 92a can be arranged linearly in the extension direction (Y direction) of the illumination section 92. In this case, the camera 90 acquires images of the outer peripheral end faces 8a of multiple substrates 8 illuminated by light emitted from the multiple point light sources 92a respectively.

[0120] In images captured under illumination from multiple point light sources 92a arranged in a linear configuration, the image portion Ia of the outer peripheral end face 8a of each substrate 8 is at least partially as shown in the image. Figure 10 As shown, there is a tendency for the image to appear as multiple interconnected light spots. Thus, since the image portion Ia of the outer peripheral end face 8a in the captured image has a characteristic shape, it is advantageous to derive the position, extent, and other characteristics of the outer peripheral end face 8a in the captured image through image processing.

[0121] The above-described positional relationship of the camera 90, the lighting unit 92, and the plurality of substrates 8 (particularly, the plurality of substrates 8 disposed in the avoidance position Pb (the photographing disposition position)) is advantageous in that a photographing image of the outer peripheral end surface 8a of each substrate 8 is acquired in a form suitable for image processing described later.

[0122] Further, the plurality of substrates 8 (batch) as a photographing target is configured to be movable together with the substrate support member 36B, but the camera 90 and the lighting unit 92 can be fixedly supported by a support frame or the like or can be configured to be movable. In a case where the camera 90 and / or the lighting unit 92 is configured to be movable, the camera 90 and / or the lighting unit 92 can be moved by a dedicated moving mechanism (omitted from illustration) driven under the control of the control unit 7.

[0123] The image processing unit 94 is connected to the camera 90 by wire or wirelessly, performs image processing on a photographing image transmitted from the camera 90, and can make various determinations based on a result of the image processing. The image processing unit 94 can be constituted by the control unit 7 or can be constituted by an arithmetic processing unit (omitted from illustration) provided separately from the control unit 7.

[0124] The image processing unit 94 of the present embodiment makes a comparison between a photographing image of the outer peripheral end surface 8a of the plurality of substrates 8 before immersion in the processing liquid and a photographing image of the outer peripheral end surface 8a of the plurality of substrates 8 after immersion in the processing liquid (i.e., after immersion in the processing liquid). Then, the image processing unit 94 detects a positional shift between the plurality of substrates 8 before immersion in the processing liquid and the plurality of substrates 8 after immersion in the processing liquid based on a result of the comparison and makes a determination corresponding to the positional shift.

[0125] The image processing unit 94 can acquire setting information of the substrate 8 (for example, position information of a substrate image region in the photographing image corresponding to the range of the substrate 8) by performing image processing on the photographing image, for example, determining a reflection image of the outer peripheral end surface 8a of the upper portion of the substrate 8 included in the photographing image. In addition, the image processing unit 94 can determine whether the processed substrate 8 is disposed in an appropriate position by determining whether a difference between the position of each substrate 8 before processing based on the processing liquid and the position of each substrate 8 after processing in the processing tank 34 is within an allowable range.

[0126] In addition, specific examples of the image processing performed by the image processing unit 94 are described later, but the content of the image processing is not limited to specific examples. That is, the image processing unit 94 can perform arbitrary arithmetic processing to derive arbitrary information from the photographing image.

[0127] [Substrate liquid processing method (etching processing method)]

[0128] Next, a substrate solution treatment method (etching method) performed by the etching treatment apparatus (substrate solution treatment apparatus) 1 described above will be exemplarily described. The etching method will be described in the following description, but the following technique can also be applied to other substrate solution treatment apparatuses (e.g., cleaning treatment apparatus 25 (see reference)). Figure 1 The substrate solution treatment method performed.

[0129] Figure 11 This is a flowchart illustrating an example of a substrate solution treatment method. Figure 11 The substrate liquid treatment method shown is performed by appropriately driving various devices under the control of the control unit 7.

[0130] After multiple batches of substrates 8 are fed into the module of the etching apparatus 1 together with substrate support components 36B ( Figure 11 S1), is configured at the shooting position (in this example, the avoidance position Pb (refer to...) Figure 9 (S2) The camera 90 takes pictures (S3). That is, before the multiple substrates 8, which are arranged and supported by the substrate support member 36B in an upright position and spaced apart from each other, are immersed in the processing liquid in the processing tank 34, the outer peripheral end face 8a of the multiple substrates 8 is captured.

[0131] The captured image is sent from the camera 90 to the image processing unit 94 for image processing (S4). In this image processing, multiple substrates 8 can be detected from the captured image based on the image processing algorithm, for example, obtaining the overall position information (e.g., coordinate information) of multiple substrates 8 (batch) and the position information of each substrate 8.

[0132] Based on the detection results of image processing, the image processing unit 94 determines whether the number of multiple substrates 8 (i.e., multiple substrates 8 contained in the batch of liquid-processed objects) arranged at the avoidance position Pb (shooting position) is appropriate (S5).

[0133] The image processing unit 94 can obtain information about the predetermined number of substrates 8 contained in the target batch from the control unit 7 based on information used for batch formation (e.g., the number of substrates set in the request command), and simultaneously obtain the actual number of substrates 8 contained in the captured image through image processing. The image processing unit 94 can determine whether the number of multiple substrates 8 contained in the batch of liquid processing target is appropriate by comparing the predetermined number and the actual number of substrates 8 in the batch obtained in this way.

[0134] In a case where it is determined that the number of the plurality of substrates 8 included in the batch of processing targets is not appropriate (NO in S5), the cycle of the substrate liquid processing method is suspended (S12), and the substrate liquid processing method for the batch is ended. In a case where the cycle is thus suspended, the etching processing apparatus 1 (or the substrate liquid processing system 1A) can perform an arbitrary process, and for example, an alarm can be issued to a user (e.g., an operator) under the control of the control section 7.

[0135] In a case where the cycle is thus suspended before the liquid processing is performed on the batch of processing targets (the plurality of substrates 8), the subsequent processes (S6 to S11) in the substrate liquid processing method are skipped, and as a result, the liquid processing (S6) is not performed on the batch of processing targets. The control section 7 can control various devices so that the substrates 8 of the batch that have failed to receive the liquid processing are processed separately from the substrates 8 that have received the liquid processing, for example, in the carrier storage section 13 (see FIG. 1) or the like. Figure 1

[0136] On the other hand, in a case where it is determined that the number of the plurality of substrates 8 included in the batch of liquid processing targets is appropriate (YES in S5), the plurality of substrates 8 supported by the substrate support member 36B is positioned in the processing tank 34 in a manner of being immersed in the processing liquid in the processing tank 34. Thus, the plurality of substrates 8 (batch) is disposed at the processing position Pa together with the substrate support member 36B, and receives the liquid processing (S6).

[0137] After the plurality of substrates 8 is immersed in the processing liquid for a certain period of time, the plurality of substrates 8 is moved out of the processing tank 34 together with the substrate support member 36B in a manner of being separated from the processing liquid, and is disposed at the shooting position (avoidance position Pb) (S7). In this way, the plurality of substrates 8 is separated from the processing liquid, and thus the liquid processing of the plurality of substrates 8 is ended.

[0138] Then, the plurality of substrates 8 is shot by the camera 90 in a state of being disposed at the shooting position (avoidance position Pb) (S8). That is, after the plurality of substrates 8 supported by the substrate support member 36B in a manner of being arranged at intervals from each other in a standing attitude is immersed in the processing liquid in the processing tank 34, a shot image of the outer peripheral end surface 8a of the plurality of substrates 8 is acquired.

[0139] The shot image thus acquired is transmitted from the camera 90 to the image processing section 94, and is subjected to image processing by the image processing section 94 (S9). In the image processing, the plurality of substrates 8 can be detected from the shot image based on an image processing algorithm, and for example, position information of the entire batch of the plurality of substrates 8, position information of each substrate 8 is acquired.

[0140] ​Further, the image processing of the captured image of the plurality of substrates 8 after immersion in the processing liquid (S9) and the image processing of the captured image of the plurality of substrates 8 before immersion in the processing liquid (S4) can include common processing procedures or can include non-common processing procedures.

[0141] The image processing section 94, similarly to the above-described processing step S5, judges whether the number of the plurality of substrates 8 arranged at the capturing position is appropriate or not based on the detection result of the image processing (S10).

[0142] However, in a case where it is judged that the number of the plurality of substrates 8 included in the batch to be processed is not appropriate (NO in S10), the cycle of the substrate liquid processing method is suspended (S12), and the substrate liquid processing method for the batch is ended. In a case where the cycle is suspended in this way, an alarm can be issued, or other arbitrary processing can be performed.

[0143] On the other hand, in a case where it is judged that the number of the plurality of substrates 8 to be liquid-processed is appropriate (YES in S10), the image processing section 94 performs a judgment corresponding to the positional shift between the plurality of substrates 8 before immersion in the processing liquid and the plurality of substrates 8 after immersion in the processing liquid (S11).

[0144] That is, based on a comparison between the captured image of the outer peripheral end surface 8a of the plurality of substrates 8 before immersion in the processing liquid and the captured image of the outer peripheral end surface 8a of the plurality of substrates 8 after immersion in the processing liquid, a judgment corresponding to the positional shift of each substrate 8 between before and after liquid processing is performed.

[0145] For example, based on the positional coordinates of each substrate 8 obtained as a result of the image processing, a difference between the position of each substrate 8 before immersion in the processing liquid and the position of each substrate 8 after immersion in the processing liquid is calculated, and it is judged whether the difference is within an allowable range (for example, whether it is below a judgment threshold value set by the user). In a case where it is judged that the batch (plurality of substrates 8) processed is including a substrate 8 for which a positional difference exceeding the allowable range has occurred between before and after processing (NO in S11), the cycle of the substrate liquid processing method is suspended (S12), and the substrate liquid processing method for the batch is ended. In a case where the cycle is suspended in this way, an alarm can be issued, or other arbitrary processing can be performed. On the other hand, in a case where it is judged that the positional difference between before and after processing for all of the substrates 8 of the batch processed is within the allowable range (YES in S11), it is judged that all of the substrates 8 included in the batch have received liquid processing in an appropriate position and attitude, and they are transported to the carrier storage section 13 (refer to Figure 1 ).

[0146] The above-described series of processing (S1 to S12) is performed for each batch (plurality of substrates 8) that needs to be processed in the etching processing apparatus 1.

[0147] [Image processing method]

[0148] Next, an exemplary image processing method performed by the image processing section 94 in the above-described substrate liquid processing method (etching processing method) will be described. The image processing method described below is merely an example, and the image processing method can include any image processing process in addition to or instead of one or more of the following image processing processes.

[0149] In the above-described Figure 11 , the image processing method performed by the image processing section 94 includes a step of acquiring the captured images before and after the liquid processing of the plurality of substrates 8 (batch) from the camera 90 (S3 and S8), and a step of performing a judgment corresponding to the positional displacement of the plurality of substrates 8 (S4, S5, and S9 to S11).

[0150] In particular, in order to perform a judgment corresponding to the positional displacement of the plurality of substrates 8, it is required to acquire positional information (position coordinates, etc.) of each substrate 8 in the captured images before and after the processing. It is not necessarily easy to acquire such positional information of each substrate 8 with high accuracy from the captured images while suppressing the computational load required for image processing.

[0151] The present inventors have newly found an image processing method (image processing process) that can effectively acquire positional information of the plurality of substrates 8 included in the batch of processing targets with high accuracy from captured images while suppressing the computational load, through repeated trial and error. Hereinafter, an example of such an image processing method will be described.

[0152] Figure 12 is a flowchart showing an example of an image processing method. Figures 13A-G is an example of a partial region of a captured image 150 (including a substrate image region 151), which is used to explain Figure 12 the concept of the image processing method shown in Figure 14 is a diagram showing an example of a comparison process between a captured image before liquid processing and a captured image after liquid processing.

[0153] As shown in Figure 13A , the image processing section 94 determines the substrate image region 151 in the captured image 150, which contains at least a part of the image portion (substrate image 152) of the outer peripheral end surface 8a of the plurality of substrates 8.

[0154] In the case where the plurality of substrates 8 (batch) arranged in the X direction are captured by the single camera 90, the farther the substrate 8 is from the optical axis of the camera 90, the more distorted the image thereof becomes. In this example, as shown in Figure 13B , there is a tendency that the farther the substrate 8 is from the optical axis of the camera 90, the more distorted the image thereof becomes. Figure 13BThe image of substrate 8 located further away from the center of the captured image 150 (substrate image 152) in the left-right direction exhibits a greater tilt. Therefore, the substrate image region 151 in this example is determined taking into account such distortion (tilt) of the image of substrate 8. Specifically, it has Figure 13A The trapezoidal shape shown.

[0155] The specific method for determining the substrate image region 151 is not limited. For example, the substrate image region 151 can be determined based on images captured from a test batch before liquid treatment of the batch of liquid-processing objects (multiple substrates 8). For example, images can be taken with test substrates positioned on the substrate holding portions (the aforementioned substrate holding slots) at both ends of the substrate support member 36B. In this case, the position coordinates of the upper and lower ends of the images of the test substrates (especially the outer peripheral end faces) at the left and right ends derived from the captured images (i.e., the position coordinates of the upper left, upper right, lower left, and lower right) can be set as the coordinates of the four corners of the substrate image region 151. Furthermore, when the lateral length (width) of the image of the outer peripheral end face of the test substrate is relatively large (see reference...), the determination can be made based on images captured from the test substrate batch (multiple substrates 8) before liquid treatment. Figure 10 ), can be based on the horizontal center position of the image (e.g. Figure 10 The center position of the elliptical spot image shown is used to set the corner coordinates of the substrate image area 151.

[0156] Then, as Figure 13B As shown, the image processing unit 94 applies a substrate image region 151 to the captured images 150 of multiple substrates 8 (batch) of the processing object. All images of the multiple substrates 8 of the processing object appearing in the captured images 150 are located within the substrate image region 151. Furthermore, the images of each substrate 8 in the captured images 150 do not necessarily need to be entirely located within the substrate image region 151; they may be partially located outside the substrate image region 151.

[0157] The image 150 captured during the application of substrate image region 151 includes not only the substrate image region 151 but also images of elements other than the substrate 8. Figure 13B In the example shown, the lower side of the multiple substrates 8 located on the subject being photographed ( Figure 13B The image of the device elements (the inside of the paper), i.e., the background image 153, also appears in the captured image 150.

[0158] Then, as Figure 13C As shown, the image processing unit 94 performs a process that transforms the overall shape of the substrate image region 151 from a trapezoid to a rectangle (image reshaping processing). Figure 12S21). Thus, the distortion of the image (particularly the substrate image 152) within the substrate image region 151 is corrected, and the extension direction (substrate image extension direction) of each substrate image 152 is adjusted to substantially align with the arrangement direction of the images of the plurality of substrates 8. Figure 13C It is perpendicular to the left and right directions (X direction).

[0159] Furthermore, in this example, such image reshaping is performed before the edge enhancement process (S22) described later, but it can also be performed after the edge enhancement process or simultaneously with the edge enhancement process. However, in the case where image reshaping is performed after the edge enhancement process, it is preferable to perform image reshaping before the pixel sorting process (S23) described later.

[0160] After that, as Figure 13D As shown, the image processing unit 94 performs edge enhancement processing (substrate end face enhancement processing) on ​​at least the substrate image region 151 in the captured image 150 to enhance the image of the outer peripheral end face 8a of each substrate 8 (S22).

[0161] In the captured image 150 after such edge enhancement processing, the image of the outer peripheral end face 8a of each substrate 8 remains as substrate image 152, while the presence of the image of device elements other than the substrate 8 (background image 153) is weakened. Figure 13D In the example shown, the edge portions of the background image 153 remain in the edge-enhanced captured image 150, but the presence of the middle portions between the edges of the background image 153 is reduced. Furthermore, the substrate images 152 representing each substrate 8 are shown in... Figure 13D The example shown is represented by a single line, but after the substrate end-face enhancement process described above, it can also be represented by multiple lines (e.g., representing the edges of each end face (see reference)). Figure 15 The two lines in the attached figures (labeled “181” and “182”) indicate this.

[0162] Furthermore, the edge enhancement processing in step S22 can be performed by applying an edge enhancement filter to at least the substrate image region 151 in the captured image 150, but the specific processing content of the edge enhancement processing is not limited.

[0163] After that, as Figure 13E As shown, the image processing unit 94 performs pixel sorting processing (S23) to rearrange the pixels contained in the image data of the substrate image region 151 after edge enhancement processing.

[0164] The image data undergoing pixel sorting processing comprises multiple groups of pixels arranged in a direction perpendicular to the extension direction (substrate image extension direction) of the image portion (substrate image 152) of each substrate 8. The term "pixel group" here refers to... Figure 13EMultiple pixels arranged in a row along the vertical (Y-direction) axis. By... Figure 13E The image data of the substrate image region 151 is a collection of multiple "pixel groups" arranged in the left-right direction (X direction).

[0165] The pixel sorting process in this embodiment involves rearranging the pixels within each pixel group—that is, the pixels arranged along the substrate image extension direction (Y direction)—according to their brightness values. In each pixel group after the pixel sorting process, pixels are sorted from one end to the other (e.g., from...). Figure 13E From the top to the bottom, the pixels are arranged sequentially, starting with the brightest pixels and ending with the highest brightness values. As a result, pixels with extremely high brightness values ​​(bright pixels) are concentrated at one end of each pixel group (in...). Figure 13E In the example shown (top side), pixels with extremely low brightness values ​​(dark pixels) are concentrated at the other end of each pixel group (in... Figure 13E (The example shown is the bottom side).

[0166] Typically, noisy images sometimes have extremely bright large pixel values, while the images of the grooves N of each substrate 8 sometimes have extremely dark small pixel values. Therefore, in the substrate image 152 after pixel sorting, the pixels constituting the noisy image are concentrated on one end of the substrate image extension direction ( Figure 13E The pixels constituting the groove image are concentrated on the other end of the substrate image's extension direction (on the upper side). Figure 13E (the lower side). On the other hand, in the substrate image 152 after pixel sorting, the pixels of the image constituting the normal portion of the outer peripheral end face 8a of the substrate 8 are concentrated in the central part of the substrate image extension direction.

[0167] By performing pixel sorting in this way, abnormal pixels with extremely high or extremely low brightness values ​​can be separated from the normal pixels of the image constituting the normal portion of the outer peripheral end face 8a of the substrate 8 in each substrate image 152.

[0168] After that, as Figure 13F As shown, the image processing unit 94 sets a detection pixel region 154 for the captured image 150 (especially the substrate image region 151) after pixel sorting processing (S24).

[0169] The detection pixel region 154 is configured to include a plurality of pixels in the central portion of the substrate image extension direction of all substrate images 152 (particularly the substrate image 152 in the substrate image region 151) of the captured image of the substrate 8, but excludes a plurality of pixels at both ends of the substrate image extension direction. That is, the detection pixel region 154 is configured to include "normal pixels constituting the normal image of the outer peripheral end face 8a of the substrate 8" of the substrate image 152 after pixel sorting processing, and to exclude a large number of "abnormal pixels" from the detection pixel region 154.

[0170] There is no limitation on the method for determining the detection pixel region 154. For example, the detection pixel region 154 can be set such that a predetermined proportion of pixels, with the center of the substrate image extension direction (Y direction) of the substrate image region 151 as a reference, are included in the detection pixel region 154. As an example, the detection pixel region 154 can be set such that the length of the detection pixel region 154 in the substrate image extension direction (Y direction) is 1 / 2 (50%) of the total length of the substrate image region 151 in the substrate image extension direction.

[0171] After that, as Figure 13G As shown, the image processing unit 94 performs substrate detection processing (S25) to detect each substrate 8 from each substrate image 152 in the detection pixel region 154.

[0172] For example, the presence or absence of the corresponding substrate 8 image can be detected based on the overall data of each substrate image 152 in the detection pixel region 154 (all pixel data of each substrate image 152). As an example, in the detection pixel region 154, a representative value (e.g., average value) of the pixel values ​​of multiple pixels (pixel groups) arranged in the substrate image extension direction (Y direction) can be used as the pixel value of the pixel group. In addition, based on the data at the center of each substrate image 152 in the detection pixel region 154 (one or more pixel data located at the center of the substrate image extension direction of each substrate image 152), the position of the corresponding substrate 8 (especially in the X direction) can be detected. Figure 13G (Position in the left and right directions).

[0173] As described above, according to this example, a comparison is made between the pixel-sorted processing of the outer peripheral end faces 8a of the multiple substrates 8 before immersion in the processing liquid and the pixel-sorted processing of the outer peripheral end faces 8a of the multiple substrates 8 after immersion in the processing liquid, and a judgment is made based on this comparison. Figure 13GIn the example shown, a substrate position marker image 155 of a prescribed shape (in this example, a rectangle (for example, 10 pixels x 10 pixels)) is superimposed on the corresponding substrate image 152 at the position of the detected image of each substrate 8 (particularly, the central position in the direction in which the substrate image extends).

[0174] The image processing section 94 performs the above-described series of image processing on the "photographed image 150 of the outer peripheral end surface 8a of the plurality of substrates 8 before immersion in the treatment liquid" and the "photographed image 150 of the outer peripheral end surface 8a of the plurality of substrates 8 after immersion in the treatment liquid", respectively. Figures 12-13G The image processing section 94 then compares the substrate position marker image 155a of the "photographed image 150 of the outer peripheral end surface 8a of the plurality of substrates 8 before immersion in the treatment liquid" and the substrate position marker image 155b of the "photographed image 150 of the outer peripheral end surface 8a of the plurality of substrates 8 after immersion in the treatment liquid".

[0175] With respect to a substrate 8 that has not undergone any positional shift (particularly, positional shift in the substrate arrangement direction (X direction)) before and after the liquid treatment, the substrate position marker image 155a before the liquid treatment and the substrate position marker image 155b after the liquid treatment are identical. That is, the area of the overlapping region between the marker images 155a, 155b, i.e., the marker overlapping region 155c (see FIG. 6) is the largest (i.e., 100% of the area of the marker image 155). Figure 14 On the other hand, as shown in FIG. 7, the greater the positional shift (particularly, positional shift in the substrate arrangement direction (X direction)) between before and after the liquid treatment, the smaller the area of the marker overlapping region 155c. Figure 14

[0176] Therefore, the image processing section 94 can set a threshold value with respect to the area of the marker overlapping region 155c, and determine the positional shift of each substrate 8 based on a comparison of whether the actual area of the marker overlapping region 155c of each substrate 8 is equal to or greater than the threshold value. That is, in the case where the area of the marker overlapping region 155c is equal to or greater than the threshold value (for example, 70% of the area of the marker image 155), it can be determined that the positional shift of the substrate 8 is within an allowable range. On the other hand, in the case where the area of the marker overlapping region 155c is less than the threshold value, it can be determined that the positional shift of the substrate 8 exceeds the allowable range.

[0177] Next, a specific example of the above-described edge enhancement processing (substrate end surface enhancement processing, see S22 of FIG. 4) will be described. Figure 12

[0178] Figure 15 is a schematic partial enlarged plan view showing an example of the outer peripheral end surface 8a of a substrate 8.

[0179] ​​The width of the outer peripheral end surface 8a of each chip 8 (particularly, the length in the chip arrangement direction (X direction)) is generally small, but in a case where the pixel basis is considered, the outer peripheral end surface 8a has a certain width. That is, as shown in FIG. 8, the outer peripheral end surface 8a of the chip 8 includes an elongated linear first end surface edge 181 and a second end surface edge 182, and an end surface region 180 sandwiched by the two end surface edges 181, 182 and having a larger width than the two end surface edges 181, 182. Figure 15

[0180] Figure 16 is a flowchart showing an example of an edge enhancement processing method (chip end surface enhancement processing method) implemented by the image processing section 94.

[0181] In the edge enhancement processing of this example, first, the first edge enhancement processing (S31) is performed on the captured image (original image). Thereby, the first edge enhancement image in which the image portions of the first end surface edge 181 and the second end surface edge 182 are respectively enhanced is obtained in the image of the outer peripheral end surface 8a of each chip 8 (chip image 152). Figure 16

[0182] Generally, in the edge image portion, there is a large change in brightness, and the edge image portion is bordered by a bright image and a dark image or by a dark image and a bright image. Therefore, in a case where the differential processing of the image is performed, in the edge image portion, the image differential value is often expressed as a peak value on the positive side or the negative side.

[0183] The first edge enhancement processing in this step includes, for example, the X direction differential processing on the captured image (gray scale image of the original image). At this time, the X direction differential processing is applied to the pixel values (particularly, the pixel values represented by the gray scale values corresponding to the brightness) of the plurality of pixels constituting the captured image.

[0184] In the first edge enhancement image thus obtained, for example, the first end surface edge 181 in which the pixel differential value is expressed as a peak value on the positive side is represented by white pixels connected by large pixel values (brightness values). On the other hand, for example, the second end surface edge 182 in which the pixel differential value is expressed as a peak value on the negative side is represented by black pixels connected by small pixel values (brightness values) in the first edge enhancement image. Further, in the first edge enhancement image, the gray scale region between the white pixels and the black pixels represents the outer peripheral end surface 8a (particularly, the end surface region 180) of the chip 8 which is captured relatively uniformly brightly and has a small change in brightness in the captured image.

[0185] ​​Then, image processing of extracting an image portion of the first end surface edge 181 from the first edge enhanced image is performed (S32). Specifically, only white pixels having a large pixel value are extracted in the first edge enhanced image. Actually, in this image processing, not only the image portion of the first end surface edge 181 is extracted, but also a bright image portion having the same degree or more of the pixel value as the image portion of the first end surface edge 181 among image portions representing other device elements (background image) is extracted together.

[0186] Then, image processing of dilating the image portion extracted in the first edge enhanced image (the image portion of the first end surface edge 181) is performed (dilation processing) (S33). In this dilation processing, the image portion of the object (the image portion of the first end surface edge 181) is dilated in the X direction corresponding to the width direction of the outer peripheral end surface 8a of each substrate 8 (i.e., the substrate arrangement direction). The degree of dilation at this time is not limited, but it is preferable to perform the dilation processing to the degree that the dilated image portions of the first end surface edge 181 and the second end surface edge 182 (refer to S33 and S35 described later) do not overlap with each other between different substrates 8.

[0187] On the other hand, image processing of extracting an image portion of the second end surface edge 182 from the first edge enhanced image is performed (S34). Specifically, only black pixels having a small pixel value are extracted in the first edge enhanced image. Actually, in this image processing, not only the image portion of the second end surface edge 182 is extracted, but also a dark image portion having the same degree or less of the pixel value as the image portion of the second end surface edge 182 among image portions representing other device elements (background image) is extracted together.

[0188] Then, image processing of dilating the image portion extracted in the first edge enhanced image (the image portion of the second end surface edge 182) is performed (dilation processing) (S35). In this dilation processing, the image portion of the object (the image portion of the second end surface edge 182) is dilated in the X direction corresponding to the width direction of the outer peripheral end surface 8a of each substrate 8 (i.e., the substrate arrangement direction). The degree of dilation at this time is also not limited, but it is preferable to perform the dilation processing to the degree that the dilated image portions of the first end surface edge 181 and the second end surface edge 182 (refer to S33 and S35 described later) do not overlap with each other between different substrates 8.

[0189] Then, in the first edge-enhanced image, an image processing is performed to obtain an overlapping region between the image portion of the first end surface edge 181 after the expansion processing (expanded first end surface edge) and the image portion of the second end surface edge 182 after the expansion processing (expanded second end surface edge) (S36). The pixel constituting the overlapping region here is the pixel belonging to both the expanded first end surface edge and the expanded second end surface edge.

[0190] In addition, in the first edge-enhanced image, an image processing is performed to obtain an entire region of the image portion of the first end surface edge 181 after the expansion processing (expanded first end surface edge) and the image portion of the second end surface edge 182 after the expansion processing (expanded second end surface edge) (S37).

[0191] The pixel constituting the entire region here is the pixel belonging to at least either one of the expanded first end surface edge and the expanded second end surface edge. Therefore, the pixel belonging to only the expanded first end surface edge, the pixel belonging to only the expanded second end surface edge, and the pixel belonging to both the expanded first end surface edge and the expanded second end surface edge are included in the entire region.

[0192] Then, in the first edge-enhanced image, an image processing is performed to obtain a difference region between the entire region (S37) and the overlapping region (S36) (S38). The difference region is determined as a difference background region representing a region other than the substrate 8, and the above-described expansion processing (S33 and S35) is preferably performed in such a manner that the difference region (difference background region) is located in the region between the adjacent substrates 8. Therefore, it is preferable that the expanded first end surface edge and the expanded second end surface edge each can cover the entire end surface region 180, the first end surface edge 181, and the second end surface edge 182 of the corresponding substrate 8.

[0193] After the difference background region is obtained as described above, a second edge-enhanced processing is performed on the captured image (original image) (S39). Thereby, a second edge-enhanced image in which the image portions of the first end surface edge 181 and the second end surface edge 182 are similarly enhanced in the image of the outer peripheral end surface 8a of each substrate 8 (substrate image 152) is obtained.

[0194] The second edge-enhanced processing can include, for example, an X-direction differentiation processing on the captured image (grayscale original image), but unlike the above-described first edge-enhanced image (S31), the absolute value of the pixel differentiation value is obtained.

[0195] That is, in the second edge-enhanced image, for example, the first end surface edge 181 in which the pixel differential value is expressed as a peak value on the positive side and the absolute value of the pixel differential value is large, is expressed by white pixels connected with a large pixel value (luminance value). Also, for example, the second end surface edge 182 in which the pixel differential value is expressed as a peak value on the negative side and the absolute value of the pixel differential value is large, is expressed by white pixels connected with a large pixel value (luminance value) in the second edge-enhanced image as well as the first end surface edge 181. On the other hand, in the second edge-enhanced image, the region in which the absolute value of the pixel differential value is small, such as the outer peripheral end surface 8a (particularly, the end surface region 180) of the substrate 8, is expressed by black pixels with a small pixel value (luminance value).

[0196] Thus, the first edge-enhanced image is expressed in a pixel pattern reflecting the sign of the pixel differential value, and, on the other hand, the second edge-enhanced image is not expressed in a pixel pattern reflecting the sign of the pixel differential value, but is expressed in a pixel pattern reflecting the absolute value of the pixel differential value. Therefore, the image portion of the second end surface edge 182 expressed by black pixels in the first edge-enhanced image is expressed by white pixels in the same image portion as the first end surface edge 181 in the second edge-enhanced image.

[0197] Then, in the second edge-enhanced image, image processing (S40) of suppressing enhancement of the image region corresponding to the differential background region (S38) is performed. The image processing of suppressing enhancement of the image region corresponding to the differential background region, for example, can be processing of replacing the pixels of the image region corresponding to the differential background region with black pixels having a small pixel value.

[0198] Through this image processing (S40), the captured image 150 (particularly, the captured image 150 in which the background image is attenuated) after the edge-enhancement processing (substrate end surface enhancement processing, S22) of the above-described series of processing (S31 to S40) is obtained. Figure 12 Thus, by using the image (captured image 150) obtained through the above-described series of processing (S31 to S40), the processing (particularly, the image sorting processing, S23) after the image processing of the above-described series of processing (S31 to S40) can be performed, and the plurality of substrates 8 constituting the lot can be detected with high accuracy. Figure 16 Figure 12 As described above, according to the present embodiment, it is possible to provide a substrate state monitoring system capable of automatically confirming and monitoring whether the substrate 8 after liquid processing is appropriately held by the substrate support member 36B.

[0199] As described above, according to the present embodiment, it is possible to provide a substrate state monitoring system capable of automatically confirming and monitoring whether the substrate 8 after liquid processing is appropriately held by the substrate support member 36B.

[0200] ​In particular, in the present embodiment, it is confirmed whether the substrates 8 after the liquid processing are held by the substrate support member 36B appropriately based on a comparison between the captured image of the batch (the plurality of substrates 8) before the liquid processing and the captured image of the same batch after the liquid processing. That is, the captured image of the batch before the liquid processing is used as a reference image, and data obtained by image processing of the reference image is used as reference information. Then, the substrate information obtained by image processing of the captured image of the batch after the liquid processing is compared with the substrate information before the liquid processing as the reference information, and it is determined whether the state of the position, the attitude, and the like of each substrate 8 at the time of the liquid processing is abnormal or not.

[0201] As such an abnormality, for example, the substrate 8 can be unexpectedly floated in the processing liquid in the liquid processing (batch processing), or the substrate 8 can be broken. Various process defects can be generated due to such an abnormality, for example, the substrate 8 can be held in a different holding slot (for example, an adjacent holding slot) from the original holding slot (substrate holding site) of the substrate support member 36B (jump slot / double). In addition, one end side of the substrate 8 can be held by the original holding slot, but the other end side of the substrate 8 can be held in an adjacent holding slot (jump slot / cross).

[0202] According to the device and the method of the present embodiment described above, such a process defect can be automatically detected with high reliability and high precision without depending on visual confirmation by a user. In addition, according to the device and the method of the present embodiment, even if the substrate liquid processing system 1A has a plurality of processing slots, the processing slot in which the process defect has occurred can be quickly and accurately determined, so that the labor and the time for recovery work can be reduced, and secondary damage can be effectively suppressed.

[0203] Further, the state of the position, the attitude, and the like of the plurality of substrates 8 held by the substrate support member 36B is almost never the same between the batches, but is unique to each batch. For example, in the case where only a part (for example, the lower part) of the plurality of substrates 8 is supported, such as the substrate support member 36B of the present embodiment, the other part (for example, the upper part) of the plurality of substrates 8 can be slightly moved with the supported position as a reference.

[0204] Therefore, in the case where the common (shared) reference information registered in advance is used for the abnormality detection (monitoring) of a plurality of batches, the process defects of each batch can not necessarily be detected with high precision. On the other hand, according to the present embodiment, the information obtained from the captured image of each batch before the liquid processing (particularly, immediately before the liquid processing) of the actual processing target is used as the reference information for the abnormality detection (monitoring) of each batch, so that the process defects of each batch can be detected with high precision.

[0205] In addition, according to the present embodiment, the configuration of the camera 90 and the illumination section 92 with respect to the plurality of substrates 8 of the subject is carefully designed, and the image portion of the outer peripheral end surface 8a of each substrate 8 in the captured image is expressed as a linear image having a large area, rather than a dot image having a small area. Thus, by image processing of the captured image, the positional information of the outer peripheral end surface 8a (and further, the positional information of the substrate 8) can be obtained with high accuracy and with comparative ease.

[0206] In particular, in the present embodiment, the image portion of the outer peripheral end surface 8a of each substrate 8 in the captured image is ensured to be sufficiently larger than the image portion of the groove N, and thus the influence of the groove N on the detection accuracy of the process defect can be suppressed.

[0207] The embodiments and modified examples disclosed in the present specification are merely illustrative in all aspects and are not to be construed in a limiting manner. The above-described embodiments and modified examples can be omitted, replaced, and changed in various manners without departing from the technical scope of the claimed invention and the gist thereof. For example, the above-described embodiments and modified examples can be combined in whole or in part, and embodiments other than the above-described embodiments can be combined with the above-described embodiments or modified examples. In addition, the effects of the present disclosure described in the present specification are merely illustrative and other effects can be provided.

[0208] The technical category that embodies the above-described technical idea is not limited. For example, the above-described technical idea can be embodied by a computer program for causing a computer to execute one or a plurality of steps (steps) included in a method of manufacturing or using the above-described device. In addition, the above-described technical idea can be embodied by a non-transitory recording medium that is readable by a computer and on which such a computer program is recorded.

[0209] Explanation of Reference Numerals

[0210] 1: etching processing device, 8: substrate, 8a: outer peripheral end surface, 34: processing tank, 36B: substrate support member, 36C: lifting mechanism, 90: camera, 94: image processing section, Pa: processing position, Pb: avoidance position.

Claims

1. A substrate liquid processing apparatus, wherein, including: a processing tank that stores a processing liquid; a substrate support member that arranges and supports a plurality of substrates at stand-up attitudes at intervals from each other; a support moving section that moves the substrate support member to arrange the plurality of substrates at a processing position where the plurality of substrates are positioned in the processing tank in a manner of being immersed in the processing liquid and an avoiding position where the plurality of substrates are positioned outside the processing tank; a photographing section that acquires a photographing image of an outer peripheral end surface of the plurality of substrates; and an image processing section that performs a judgment corresponding to a positional shift between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the photographing image of the outer peripheral end surface of the plurality of substrates before being immersed in the processing liquid and the photographing image of the outer peripheral end surface of the plurality of substrates after being immersed in the processing liquid.

2. The substrate liquid processing apparatus according to claim 1, wherein a lighting section that emits light is included, the photographing section acquires the photographing image of the outer peripheral end surface of the plurality of substrates that is irradiated with the light emitted from the lighting section, and the lighting section is located between the photographing section and the outer peripheral end surface of the plurality of substrates.

3. The substrate liquid processing apparatus according to claim 1, wherein a lighting section that includes a plurality of point light sources arranged in a line is included, the photographing section acquires the photographing image of the outer peripheral end surface of the plurality of substrates that is irradiated with the light emitted from the plurality of point light sources.

4. The substrate liquid processing apparatus according to claim 1, wherein an image portion of the outer peripheral end surface of the plurality of substrates in the photographing image includes a plurality of light point images that are connected to each other.

5. The substrate liquid processing apparatus according to claim 1, wherein the plurality of substrates are supported by the substrate support member in a manner of standing up in a first direction, a photographing direction of the photographing section at the time of acquiring the photographing image is a direction that is inclined with respect to the first direction.

6. The substrate liquid processing apparatus according to claim 2, wherein the plurality of substrates are supported by the substrate support member in a manner of standing up in a first direction, a direction in which the lighting section irradiates the outer peripheral end surface of the plurality of substrates with light at the time when the photographing section photographs the outer peripheral end surface of the plurality of substrates is a direction that is inclined with respect to the first direction.

7. The substrate liquid processing apparatus according to claim 1, wherein the photographing section acquires the photographing image in a state where the plurality of substrates supported by the substrate support member are positioned outside the processing tank.

8. The substrate liquid processing apparatus according to claim 1, wherein the plurality of substrates each have a groove in an outer peripheral portion, in the photographing image, an image of the outer peripheral end surface that includes a range of the outer peripheral portion of each of the plurality of substrates that is greater than twice a range of the groove.

9. The substrate liquid processing apparatus according to claim 1, wherein in the image processing section, a substrate image region that includes at least a part of an image portion of the outer peripheral end surface of the plurality of substrates in the photographing image is decided, The judgment is made based on a comparison between the substrate image area of the captured image of the peripheral edge surface of the plurality of substrates before being immersed in the processing liquid and the substrate image area of the captured image of the peripheral edge surface of the plurality of substrates after being immersed in the processing liquid.

10. The substrate liquid processing apparatus according to claim 1, wherein in the image processing section, a substrate image area of at least a portion of an image portion including the peripheral edge surface of the plurality of substrates in the captured image is decided, an edge enhancement process is performed on the substrate image area, a pixel reordering process is performed on pixels included in image data of the substrate image area after the edge enhancement process, the judgment is made based on a comparison between image data of the substrate image area after the pixel reordering process of the captured image of the peripheral edge surface of the plurality of substrates before being immersed in the processing liquid and image data of the substrate image area after the pixel reordering process of the captured image of the peripheral edge surface of the plurality of substrates after being immersed in the processing liquid, the image data subjected to the pixel reordering process includes a plurality of pixel groups arranged in a direction perpendicular to a substrate image extension direction which is an extension direction of each of the image portions of the plurality of substrates, in the pixel reordering process, a plurality of pixels included in each of the plurality of pixel groups and arranged in the substrate image extension direction are reordered in order of magnitude of luminance value.

11. A substrate liquid processing method, wherein, including: a step of acquiring a captured image of a peripheral edge surface of a plurality of substrates before being immersed in a processing liquid in a processing tank, the plurality of substrates being arranged at intervals from each other in a standing attitude and being supported by a substrate supporting member; a step of positioning the plurality of substrates supported by the substrate supporting member in the processing tank in a manner of being immersed in the processing liquid in the processing tank; a step of acquiring a captured image of a peripheral edge surface of the plurality of substrates after being immersed in the processing liquid in the processing tank, the plurality of substrates being supported by the substrate supporting member; and a step of making a judgment corresponding to a positional shift between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid based on a comparison between the captured image of the peripheral edge surface of the plurality of substrates before being immersed in the processing liquid and the captured image of the peripheral edge surface of the plurality of substrates after being immersed in the processing liquid.

12. An image processing method, wherein, including: a step of acquiring a captured image of a peripheral edge surface of a plurality of substrates before being immersed in a processing liquid in a processing tank, the plurality of substrates being arranged at intervals from each other in a standing attitude and being supported by a substrate supporting member; a step of acquiring a captured image of a peripheral edge surface of the plurality of substrates after being immersed in the processing liquid in the processing tank, the plurality of substrates being arranged at intervals from each other in a standing attitude and being supported by the substrate supporting member; and and The step of judging the positional displacement between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid is performed based on a comparison between the captured image of the outer peripheral end surface of the plurality of substrates before being immersed in the processing liquid and the captured image of the outer peripheral end surface of the plurality of substrates after being immersed in the processing liquid.

Images