A pose adjustment device for wafer measurement

Abstract

The application discloses a pose adjusting device for wafer measurement, which is used for adjusting a jig clamping a target wafer, and comprises a first supporting mechanism, a second supporting mechanism and a third supporting mechanism. The first supporting mechanism comprises a first V-shaped structural member, is used for positioning and supporting a first positioning member, and is used for determining a reference point of a semi-closed jig. The second supporting mechanism comprises a first guide member and a second V-shaped structural member slidingly arranged in the first guide member, is used for positioning and supporting a second positioning member, and comprises a first adjusting assembly and a second adjusting assembly. The third supporting mechanism comprises a second guide member and a third V-shaped structural member slidingly arranged in the second guide member, is used for positioning and supporting a third positioning member, and comprises a third adjusting assembly and a fourth adjusting assembly. The application can adjust the pose of the target wafer in the device main body, so that the detection efficiency and the detection precision of the wafer measurement are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection equipment, in particular to a pose adjusting device for wafer measurement. BACKGROUND

[0002] In the process of measuring the wafer, the wafer needs to be placed in the wafer measurement equipment, and then the related parameters of the wafer are measured through the mirror group in the wafer measurement equipment. After the wafer is placed in the wafer measurement equipment, the adjusting mechanism in the wafer measurement equipment is used to adjust the placement angle of the wafer, so as to provide necessary conditions for accurate measurement of the wafer.

[0003] The current adjusting mechanism usually swings the clamping jig of the wafer by a proper amplitude, that is, swings along the two sides of the axis of the wafer. The angle of the wafer relative to the outgoing light of the mirror group can be changed by swinging to make it perpendicular to the light. However, due to the initial placement deviation of the wafer, it cannot be guaranteed that the V-shaped groove or horizontal groove on the wafer is always aligned with the specific mark. When there is a certain rotational angle difference in the placement of the wafer, the detection efficiency and detection accuracy of the wafer measurement will be significantly reduced. SUMMARY

[0004] In view of the defects in the prior art, the purpose of the present application is to provide a pose adjusting device for wafer measurement, which aims to solve the problem in the prior art that when measuring the wafer, due to the initial placement deviation of the wafer, it cannot be guaranteed that the V-shaped groove or horizontal groove on the wafer is always aligned with the specific mark, and when there is a certain rotational angle difference in the placement of the wafer, the detection efficiency and detection accuracy of the wafer measurement will be significantly reduced.

[0005] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0006] A pose adjusting device for wafer measurement is arranged in a wafer measurement equipment. The wafer measurement equipment includes a device main body and a mirror group unit arranged in the device main body. The device is used to adjust a semi-closed jig clamping a target wafer, so as to change the relative position of the target wafer between the device main body and the mirror group unit.

[0007] The device includes:

[0008] A first supporting mechanism includes a first V-shaped structural member, which is used to position and support a first positioning member arranged at a first position of an opening of the semi-closed jig, so as to determine the reference point of the semi-closed jig.

[0009] a second supporting mechanism comprising a first guide and a second V-shaped structure slidingly arranged in the first guide, configured to position and support a second positioning member arranged at a second position of the opening of the semi-enclosed jig, and a first adjusting assembly and a second adjusting assembly configured to adjust Y-direction movement and X-direction movement of the second V-shaped structure relative to the first guide, respectively;

[0010] a third supporting mechanism comprising a second guide and a third V-shaped structure slidingly arranged in the second guide, configured to position and support a third positioning member arranged at a third position of the semi-enclosed jig, and a third adjusting assembly and a fourth adjusting assembly configured to adjust Y-direction movement and Z-direction movement of the third V-shaped structure relative to the second guide, respectively.

[0011] According to an aspect of the above technical solution, the jig is a semi-enclosed jig, and one side of the jig is provided with an opening.

[0012] According to an aspect of the above technical solution, the first positioning member and the second positioning member are arranged at a first position and a second position on both sides of the opening of the semi-enclosed jig, respectively.

[0013] According to an aspect of the above technical solution, the first positioning member, the second positioning member and the third positioning member have the same structure, and each comprise a fixed part for connecting the semi-enclosed jig and a positioning part extending outwardly.

[0014] In the first positioning member, the first positioning part is arranged to abut against a first V-shaped groove on a surface of the first V-shaped structure; in the second positioning member, the second positioning part is arranged to abut against a second V-shaped groove on a surface of the second V-shaped structure; and in the third positioning member, the third positioning part is arranged to abut against a third V-shaped groove on a surface of the third V-shaped structure.

[0015] According to an aspect of the above technical solution, in the first supporting mechanism, the first V-shaped structure is fixed to the equipment main body, the first V-shaped groove extends along the X-direction on a top surface of the first V-shaped structure, and the first positioning part of the first positioning member abuts against the first V-shaped groove.

[0016] According to an aspect of the above technical solution, in the second supporting mechanism, the first guide is slidingly connected to the equipment main body, and the second V-shaped structure is slidingly connected to the first guide.

[0017] According to an aspect of the above technical solution, the first adjusting assembly is configured to drive the first guide to move along the Y-direction to drive the second V-shaped structure and the second positioning member to move along the Y-direction, so that the position of the second positioning member changes to drive the semi-enclosed jig and the target wafer to swing around the reference point.

[0018] The second adjustment component is used to drive the second V-shaped structural member to move along the X direction within the first guide member, thereby changing the position of the second positioning member to cause the semi-enclosed fixture and the target wafer to swing around the reference point.

[0019] According to one aspect of the above technical solution, a reset through hole is provided in the first guide member along the X direction, and an elastic member is provided in the reset through hole. One end of the elastic member is fixed in the reset through hole, and the other end protrudes through the reset through hole toward the second adjustment component and connects to the flange on the second V-shaped structure member, so that the elastic member is connected between the first guide member and the second V-shaped structure member, so that the second V-shaped structure member always has the tendency to move toward the first guide member.

[0020] According to one aspect of the above technical solution, in the third support mechanism, the second guide is slidably connected to the main body of the equipment, and the third V-shaped member is slidably connected to the second guide.

[0021] According to one aspect of the above technical solution, the third adjustment component is used to drive the second guide to move along the Y direction to drive the third V-shaped structural component and the third positioning component to move along the Y direction, so that the position of the third positioning component changes to drive the semi-enclosed fixture and the target wafer to swing around the reference point.

[0022] The fourth adjustment component is used to drive the third V-shaped structural member to move along the Z direction within the second guide member, thereby changing the position of the second positioning member to drive the semi-enclosed fixture and the target wafer to swing around the reference point.

[0023] Compared with the prior art, the pose adjustment device for wafer measurement shown in this invention has the following advantages:

[0024] The present application sets a mirror group unit in the equipment main body of wafer measurement equipment, and sets a jig for fixing the target wafer in the equipment main body, positions and supports the first positioning piece of the first position of the semi-closed jig through the first V-shaped structure piece in the first supporting mechanism, so as to form the reference point of wafer pose adjustment, realizes the Y-direction adjustment and X-direction adjustment of the second positioning piece of the second position of the semi-closed jig opening through the cooperation of the first guide piece and the second V-shaped structure piece in the second supporting mechanism, and realizes the Y-direction adjustment and Z-direction adjustment of the third positioning piece of the third position of the semi-closed jig through the cooperation of the second guide piece and the third V-shaped structure piece in the third supporting mechanism, so as to adjust the position and attitude of the target wafer in the equipment main body through the first supporting mechanism, the second supporting mechanism and the third supporting mechanism, eliminate the slight rotation angle difference after the wafer is placed, be beneficial to accurate imaging, and thus the detection efficiency and detection precision of wafer measurement can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings, in which:

[0026] Figure 1 It is a perspective view of a pose adjustment device for wafer measurement in an embodiment of the present application;

[0027] Figure 2 It is a sectional view of a pose adjustment device for wafer measurement in an embodiment of the present application;

[0028] Figure 3 It is a structure diagram of a second supporting mechanism in an embodiment of the present application;

[0029] Figure 4 It is a structure diagram of a third supporting mechanism in an embodiment of the present application;

[0030] Explanation of drawing component symbols:

[0031] Equipment main body 10, semi-closed jig 20, first position 20a, second position 20b, third position 20c, first positioning piece 21, second positioning piece 22, third positioning piece 23, target wafer 30, first supporting mechanism 40, first V-shaped structure piece 41, second supporting mechanism 50, first guide piece 51, reset through hole 51a, second V-shaped structure piece 52, second V-shaped groove 52a, first adjustment assembly 53, second adjustment assembly 54, third supporting mechanism 60, second guide piece 61, third V-shaped structure piece 62, third V-shaped groove 62a, third adjustment assembly 63, fourth adjustment assembly 64. DETAILED DESCRIPTION

[0032] In order to make the objects, features and advantages of the present application more clear, the detailed description of the specific embodiments of the present application is given below with reference to the accompanying drawings. Several embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided for the purpose of making the disclosure of the present application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] Embodiment One

[0035] Please refer to Figures 1-4 The first embodiment of the present application provides a pose adjustment device for wafer measurement, which is arranged in a wafer measurement device, and the wafer measurement device includes a device main body 10 and a lens group unit (not shown in the figure) arranged in the device main body 10 for imaging detection of a target wafer 30.

[0036] When the device detects the target wafer 30, the target wafer 30 needs to be clamped and fixed by the pre-set semi-closed jig 20 in the device, and then the pose adjustment of the semi-closed jig 20, i.e. the position and attitude, including the adjustment of multiple degrees of freedom in XYZ direction, etc. is performed to change the relative position of the target wafer 30 between the device main body 10 and the lens group unit through the driving of the semi-closed jig 20, so that the distance and angle between the target wafer 30 and the lens group unit can be finely adjusted, the pose of the target wafer 30 in the device main body 10 is changed, and thus the imaging accuracy of the lens group unit and the overall detection efficiency can be improved.

[0037] First of all, it is explained that the target wafer 30 is an additional object loaded on the semi-closed jig 20, and the function of the device includes the pose adjustment of the target wafer 30, but in fact, the pose adjustment of the semi-closed jig 20 is performed, and the target wafer 30 moves with the semi-closed jig 20 to realize the pose adjustment of the target wafer 30. In order to facilitate the explanation, the effect of adjusting the semi-closed jig 20 and the target wafer 30 is collectively referred to as adjusting the target wafer 30.

[0038] In the embodiment, the device comprises a first supporting mechanism 40 for reference point positioning of the semi-enclosed jig 20 and the target wafer 30 fixed thereby, a second supporting mechanism 50 for adjustment of the semi-enclosed jig 20 and the target wafer 30 fixed thereby, and a third supporting mechanism 60 for adjustment of the semi-enclosed jig 20 and the target wafer 30 fixed thereby. The first supporting mechanism 40, the second supporting mechanism 50 and the third supporting mechanism 60 are used to position, support and adjust the target wafer 30, so that the position of the target wafer 30 in the device main body 10 can be adjusted.

[0039] Specifically, the semi-enclosed jig 20 is provided with an opening on at least one side, forming a C-shaped structure, or a semi-enclosed ring structure or a ring-like structure. The first position 20a and the second position 20b on both sides of the opening of the semi-enclosed jig 20 are respectively provided with the first positioning member 21 and the second positioning member 22, and the third position 20c of the semi-enclosed jig 20 away from the first positioning member 21 and the second positioning member 22 is provided with the third positioning member 23.

[0040] In the embodiment, the first positioning member 21, the second positioning member 22 and the third positioning member 23 are respectively matched with the first supporting mechanism 40, the second supporting mechanism 50 and the third supporting mechanism 60, so as to realize the position adjustment of the target wafer 30.

[0041] More specifically:

[0042] In the first supporting mechanism 40, the first V-shaped structure 41 is provided on the device main body 10, and a first V-shaped groove (not shown in the figure) is formed on the top surface thereof, used for positioning and supporting the first positioning member 21 at the first position 20a of the opening of the semi-enclosed jig 20. Specifically, the first V-shaped groove on the top surface is used for positioning and supporting the first positioning member 21.

[0043] Moreover, the position of the first V-shaped structure 41 on the device main body 10 is fixed, and the first positioning member 21 abuts against the first V-shaped groove. In the embodiment, since the position of the first V-shaped structure 41 is constant, it can be used as a reference point for the position adjustment of the semi-enclosed jig 20 and the target wafer 30, and all adjustments of the semi-enclosed jig 20 and the target wafer 30 are based on the reference point.

[0044] In the second supporting mechanism 50, the first guide member 51 and the second V-shaped structure 52 slidingly arranged in the first guide member 51 are included, and the second V-shaped structure 52 is used for positioning and supporting the second positioning member 22 at the second position 20b of the semi-enclosed jig 20.

[0045] Unlike the first support mechanism 40 described above, the second support mechanism 50 also includes a first adjustment component 53 for adjusting the first guide member 51 and a second adjustment component 54 for adjusting the second V-shaped structural member 52.

[0046] More specifically, the first guide member 51 is slidably connected to the main body 10 of the device, while the first adjustment component 53 is fixed by an additional support block. By rotating the first knob in the first adjustment component 53, for example by using a motor drive, the first guide member 51 moves along the Y direction, thereby driving the second V-shaped structural member 52 to move along the Y direction, including the Y+ direction and the Y- direction.

[0047] In addition, the second adjustment component 54 directly acts on the second V-shaped structural member 52 arranged along the X direction on the first guide member 51. By rotating the second knob in the second adjustment component 54, the second V-shaped structural member 52 can also be driven by a motor to move along the X direction on the first guide member 51, including the X+ direction and the X- direction.

[0048] In the above, the first adjustment component 53 and the second adjustment component 54 drive the second V-shaped structure 52 to move along the Y and X directions respectively. Finally, the second positioning component 22, which abuts against the second V-shaped groove 52a on the second V-shaped structure 52, drives the semi-enclosed fixture 20 to swing, including swinging in the Y and X directions, so that the target wafer 30 swings along the Y and X directions with the reference point as the origin.

[0049] In addition, a reset through hole 51a is provided in the first guide member 51 along the X direction. For example, two reset through holes 51a are symmetrically arranged on both sides of the second V-shaped structure 52 in the first guide member 51. An elastic member (not shown in the figure) is provided in the reset through hole 51a. One end of the elastic member is fixed in the reset through hole 51a, that is, fixedly connected to the second V-shaped structure 52, while the other end passes through the reset through hole 51a towards the second adjustment component 54 and is connected to the flange on the second V-shaped structure 52, so that the elastic member is connected between the first guide member 51 and the second V-shaped structure 52, so that the second V-shaped structure 52 always has a tendency to move towards the first guide member 51.

[0050] Since the second V-shaped structural member 52 and the second positioning member 22 cooperate only through the open second V-shaped groove 52a, the second adjustment component 54 can only make the second positioning member 22 move towards one side, which is equivalent to pushing the second positioning member 22 to move along the X direction, for example, the X- direction. When it is necessary to move in the opposite direction, i.e., X+, by rotating the second knob in the second adjustment component 54 in the opposite direction, under the elastic force of the elastic member, the second V-shaped structural member 52 will move towards the first guide member 51 along the X+ direction, releasing the support for the second positioning member 22. Then the semi-enclosed fixture 20 and the target wafer 30 will also swing accordingly.

[0051] Or, the elastic member is a plunger, and only one end of the plunger is fixed in the reset through hole 51a of the second V-shaped structure 52, and the other end of the plunger is a free end which penetrates through the reset through hole 51a and abuts against the flange side surface of the second V-shaped structure 52.

[0052] And in the third supporting mechanism 60, it includes a second guide 61, and a third V-shaped structure 62 slidingly connected in the second guide 61, and the third V-shaped structure 62 is used for positioning and supporting the third positioning member 23 in the third position 20c of the semi-closed jig 20.

[0053] The third supporting mechanism 60 is basically the same as the second supporting mechanism 50, and it also includes a third adjusting assembly 63 used for adjusting the second guide 61, and a fourth adjusting assembly 64 used for adjusting the third V-shaped structure 62.

[0054] The second guide 61 is slidingly connected to the equipment main body 10, and the position of the third adjusting assembly 63 is fixed. By rotating the third knob of the third adjusting assembly 63, the second guide 61 drives the third V-shaped structure 62 to move along the Y direction, including the Y+ direction and the Y- direction. In addition, the fourth adjusting assembly 64 directly acts on the third V-shaped structure 62 arranged along the Z direction of the second guide 61, and by rotating the fourth knob of the fourth adjusting assembly 64, the third V-shaped structure 62 moves along the Z direction on the second guide 61, including the Z+ direction and the Z- direction.

[0055] The third V-shaped structure 62 is driven to move along the Y direction and the Z direction by the third adjusting assembly 63 and the fourth adjusting assembly 64, and finally the third positioning member 23 abutting against the third V-shaped groove 62a of the third V-shaped structure 62 drives the semi-closed jig 20 to swing, including the Y direction and the Z direction, so that the target wafer 30 swings along the Y direction and the Z direction with the reference point as the origin.

[0056] It should be noted that in the embodiment, the first positioning member 21, the second positioning member 22 and the third positioning member 23 have the same structure, and each includes a fixed part for connecting the semi-closed jig 20 and a positioning part extending outward.

[0057] The first positioning part in the first positioning member 21 is used for abutting into the first V-shaped groove on the surface of the first V-shaped structure 41, the second positioning part in the second positioning member 22 abuts into the second V-shaped groove 52a on the surface of the second V-shaped structure 52, and the third positioning part in the third positioning member 23 abuts into the third V-shaped groove 62a on the surface of the third V-shaped structure 62.

[0058] More specifically, the first fixing part, the second fixing part and the third fixing part can be fixed to the first position 20a, the second position 20b and the third position 20c of the semi-enclosed jig 20 by means of bolts or the like, and the first positioning part, the second positioning part and the third positioning part extending from the first fixing part, the second fixing part and the third fixing part are respectively abutted to the corresponding V-shaped grooves, so that the corresponding V-shaped structural members can be positioned, supported and adjusted.

[0059] The working principle of the wafer pose adjustment device shown in the embodiment is as follows:

[0060] After the target wafer 30 is fixed by the semi-enclosed jig 20, whether the pose of the target wafer 30 in the device main body 10 needs to be adjusted is determined according to the feedback of the imaging result of the lens unit. If yes, the first V-shaped structural member 41 is adjusted by the first adjustment assembly 53 based on the reference point formed by the cooperation of the first support mechanism 40 and the first positioning member 21, so that the first positioning member 21 drives the semi-enclosed jig 20 and the target wafer 30 to swing along the Y direction, and / or the first V-shaped structural member 41 is adjusted by the second adjustment assembly 54, so that the first positioning member 21 drives the semi-enclosed jig 20 and the target wafer 30 to swing along the X direction, and / or the third V-shaped structural member 62 is adjusted by the third adjustment assembly 63, so that the third positioning member 23 drives the semi-enclosed jig 20 and the target wafer 30 to swing along the Y direction, and / or the third V-shaped structural member 62 is adjusted by the fourth adjustment assembly 64, so that the third positioning member 23 drives the semi-enclosed jig 20 and the target wafer 30 to swing along the Z direction. Then, the target wafer 30 can be adjusted in the corresponding pose according to the actual imaging condition of the wafer.

[0061] Compared with the prior art, the wafer pose adjustment device for wafer measurement has the following beneficial effects:

[0062] The embodiment sets the mirror group unit in the device main body 10 of the wafer measurement device, sets the semi-enclosed jig 20 for fixing the target wafer 30 in the device main body 10, positions and supports the first positioning piece 21 of the first position 20a of the semi-enclosed jig 20 through the first V-shaped structural piece 41 in the first supporting mechanism 40, so as to form the reference point of wafer pose adjustment, realizes the Y-direction adjustment and X-direction adjustment of the second positioning piece 22 of the second position 20b of the semi-enclosed jig 20 through the cooperation of the first guide piece 51 and the second V-shaped structural piece 52 in the second supporting mechanism 50, and the promotion of the first adjustment assembly 53 and the second adjustment assembly 54, realizes the Y-direction adjustment and Z-direction adjustment of the third positioning piece 23 of the third position 20c of the semi-enclosed jig 20 through the cooperation of the second guide piece 61 and the third V-shaped structural piece 62 in the third supporting mechanism 60, and the promotion of the third adjustment assembly 63 and the fourth adjustment assembly 64, so as to adjust the position and pose of the target wafer 30 in the device main body 10 through the first supporting mechanism 40, the second supporting mechanism 50 and the third supporting mechanism 60, eliminate the slight rotation angle difference after the wafer is placed, be beneficial to accurate imaging, and thus improve the detection efficiency and detection precision of wafer measurement.

[0063] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as the limitation of the patent scope of the present application. It should be noted that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A pose adjustment device for wafer measurement, disposed within a wafer measurement apparatus, the wafer measurement apparatus comprising an apparatus body and a mirror assembly unit disposed within the apparatus body, characterized in that: The device is used to adjust the semi-enclosed fixture holding the target wafer to change the relative position of the target wafer between the device body and the mirror unit. The device includes: The first support mechanism includes a first V-shaped structural member, which is used to position and support the first positioning member located at the first position of the opening of the semi-enclosed fixture, so as to determine the reference point of the semi-enclosed fixture. The second support mechanism includes a first guide member and a second V-shaped structural member slidably disposed within the first guide member, used to position and support the second positioning member located at the second position of the semi-closed fixture opening, and a first adjustment component and a second adjustment component respectively used to adjust the second V-shaped structural member to move in the Y direction and the X direction relative to the first guide member. The third support mechanism includes a second guide member and a third V-shaped structural member slidably disposed within the second guide member, used to position and support the third positioning member located at the third position in the semi-enclosed fixture, and a third adjustment component and a fourth adjustment component respectively used to adjust the third V-shaped structural member to move in the Y direction and Z direction relative to the second guide member.

2. The pose adjustment device for wafer measurement according to claim 1, characterized in that, The fixture is a semi-enclosed fixture, with an opening on one side.

3. The pose adjustment device for wafer measurement according to claim 2, characterized in that, The first positioning member and the second positioning member are respectively located at the first position and the second position on both sides of the opening of the semi-closed fixture.

4. The pose adjustment device for wafer measurement according to claim 3, characterized in that, The first positioning member, the second positioning member, and the third positioning member have the same structure, each including a fixing part for connecting the semi-enclosed fixture, and a positioning part extending outward; Wherein, the first positioning part of the first positioning member is used to abut against the first V-groove on the surface of the first V-shaped structure, the second positioning part of the second positioning member abuts against the second V-groove on the surface of the second V-shaped structure, and the third positioning part of the third positioning member is used to abut against the third V-groove on the surface of the third V-shaped structure.

5. The pose adjustment device for wafer measurement according to claim 4, characterized in that, In the first support mechanism, the first V-shaped structural member is fixed to the main body of the equipment, the first V-shaped groove extends along the X direction on the top surface of the first V-shaped structural member, and the first positioning part of the first positioning member abuts against the first V-shaped groove.

6. The pose adjustment device for wafer measurement according to claim 4, characterized in that, In the second support mechanism, the first guide is slidably connected to the main body of the equipment, and the second V-shaped structural member is slidably connected to the first guide.

7. The pose adjustment device for wafer measurement according to claim 6, characterized in that, The first adjustment component is used to drive the first guide member to move along the Y direction to drive the second V-shaped structure member and the second positioning member to move along the Y direction, so that the position of the second positioning member changes to drive the semi-enclosed fixture and the target wafer to swing around the reference point; The second adjustment component is used to drive the second V-shaped structural member to move along the X direction within the first guide member, thereby changing the position of the second positioning member to cause the semi-enclosed fixture and the target wafer to swing around the reference point.

8. The pose adjustment device for wafer measurement according to claim 7, characterized in that, The first guide member has a reset through hole along the X direction. An elastic member is provided in the reset through hole. One end of the elastic member is fixed in the reset through hole, and the other end protrudes through the reset through hole toward the second adjustment component and connects to the flange on the second V-shaped structure. The elastic member is connected between the first guide member and the second V-shaped structure, so that the second V-shaped structure always has a tendency to move toward the first guide member.

9. The pose adjustment device for wafer measurement according to claim 4, characterized in that, In the third support mechanism, the second guide is slidably connected to the main body of the equipment, and the third V-shaped structural member is slidably connected to the second guide.

10. The pose adjustment device for wafer measurement according to claim 9, characterized in that, The third adjustment component is used to drive the second guide to move along the Y direction to drive the third V-shaped structure and the third positioning component to move along the Y direction, so that the position of the third positioning component changes to drive the semi-enclosed fixture and the target wafer to swing around the reference point. The fourth adjustment component is used to drive the third V-shaped structural member to move along the Z direction within the second guide member, thereby changing the position of the second positioning member to drive the semi-enclosed fixture and the target wafer to swing around the reference point.

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