Array type laminated piezoelectric actuator, manufacturing method thereof and piezoelectric deflection mirror

Abstract

The invention relates to the technical field of mechanical equipment, in particular to an array type laminated piezoelectric actuator, a manufacturing method of the array type laminated piezoelectric actuator and a piezoelectric deflection mirror. The array type laminated piezoelectric actuator comprises a base, a driving unit, an electrode group and an electrode leading-out part, the driving units and the base are integrally formed, the multiple driving units are distributed on the base in an array mode, and each driving unit comprises a positive electrode layer and a negative electrode layer; the electrode lead-out part comprises a positive electrode lead-out layer and a negative electrode lead-out layer, the positive electrode layer is electrically connected with the positive electrode lead-out layer, and the negative electrode layer is electrically connected with the negative electrode lead-out layer; the electrode group comprises a plurality of positive electrodes and a plurality of negative electrodes matched with the positive electrodes, the electrode group is arranged on the base, the positive electrode leading-out layer is electrically connected with the positive electrodes, and the negative electrode leading-out layer is electrically connected with the negative electrodes. And the stability and the manufacturing precision of the structure can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical equipment, more particularly to an array type laminated piezoelectric driver, a manufacturing method thereof and a piezoelectric yaw mirror. BACKGROUND

[0002] With the rapid development of optical technology, precision instruments and micro-nano processing technology, piezoelectric yaw mirrors have been widely used in the fields of laser communication, precision scanning, optical imaging and micro-electro-mechanical systems (MEMS) due to their high precision, high response speed and no mechanical wear. The piezoelectric yaw mirror realizes the precise deflection of the mirror surface through the piezoelectric driver, which can realize fast and stable angle adjustment in a small scale and meet the demand of high-precision optical path control. However, the current piezoelectric driver generally has a large volume, which is difficult to adapt to the technical trend of the development of piezoelectric yaw mirrors towards high integration and miniaturization.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide an array type laminated piezoelectric driver, a manufacturing method thereof and a piezoelectric yaw mirror, aiming at solving the technical problem of the large volume of the piezoelectric driver in the related art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0006] The present application provides an array type laminated piezoelectric driver, comprising a base, a driving unit and an electrode group and an electrode lead-out part.

[0007] The driving unit is connected with the base, and the driving unit is integrally formed with the base. The number of the driving units is multiple, and the multiple driving units are arrayed on the base. The driving unit comprises a positive electrode layer and a negative electrode layer.

[0008] The electrode lead-out part comprises a positive electrode lead-out layer and a negative electrode lead-out layer. The positive electrode layer is electrically connected with the positive electrode lead-out layer, and the negative electrode layer is electrically connected with the negative electrode lead-out layer.

[0009] The electrode group comprises multiple positive electrodes and multiple negative electrodes matched with the positive electrodes. The electrode group is arranged on the base. The positive electrode lead-out layer is electrically connected with the positive electrode, and the negative electrode lead-out layer is electrically connected with the negative electrode.

[0010] In some implementations, the driving unit further comprises an insulating body, the positive electrode layer and the negative electrode layer are separated by the insulating body;

[0011] In the driving unit, the number of the positive electrode layers and the number of the negative electrode layers are multiple respectively, the multiple positive electrode layers and the multiple negative electrode layers are stacked along a first direction, and the multiple positive electrode layers and the multiple negative electrode layers are alternately distributed in the first direction;

[0012] The driving unit further comprises a positive electrode lead-out wire and a negative electrode lead-out wire; in the driving unit, the multiple positive electrode layers are electrically connected by the positive electrode lead-out wire, and the multiple negative electrode layers are electrically connected by the negative electrode lead-out wire;

[0013] The positive electrode lead-out wire is electrically connected with the positive electrode lead-out layer, and the negative electrode lead-out wire is electrically connected with the negative electrode lead-out layer;

[0014] The first direction is parallel to the height direction of the arrayed laminated piezoelectric driver.

[0015] In some implementations, the positive electrode layer is embedded in the insulating body, and the negative electrode layer is embedded in the insulating body.

[0016] In some implementations, the insulating body comprises multiple insulating layers, and the multiple insulating layers are stacked along the first direction;

[0017] In the driving unit, the positive electrode layer and the negative electrode layer are located on opposite sides of the insulating layer.

[0018] In some implementations, the circumference of the base has a first side and a second side, the first side has a positive electrode, and the second side has a negative electrode.

[0019] In some implementations, the material of the base is ceramic, and the material of the insulating body is ceramic.

[0020] The present application provides a piezoelectric yaw mirror, comprising: the arrayed laminated piezoelectric driver in any of the above implementations.

[0021] The present application provides a manufacturing method of an arrayed laminated piezoelectric driver, the manufacturing method is used for manufacturing the arrayed laminated piezoelectric driver in any of the above implementations;

[0022] The manufacturing method comprises:

[0023] Preparation of a piezoelectric green sheet with a through hole;

[0024] Filling the through hole with conductive silver paste;

[0025] printing silver palladium paste to the surface of the piezoelectric green sheet by silk screen printing plate, the silver palladium paste is used to form a conductive layer, the conductive layer forms a dielectric diaphragm with the piezoelectric green sheet, the conductive layer is used for the positive electrode layer and the negative electrode layer;

[0026] stacking multiple dielectric diaphragm layers to form a bar block;

[0027] sequentially performing the operations of voltage equalization, cutting, glue removal and sintering on the bar block to form an integrally formed driver monomer;

[0028] performing a slotting operation on the driver monomer to form a base of a driving unit and multiple driving units, wherein multiple driving units are arrayed on the base.

[0029] In some implementations, the piezoelectric green sheet with a through hole comprises:

[0030] coating ceramic slurry on a base film by a flow casting process, so that the ceramic slurry forms a piezoelectric green sheet;

[0031] cutting the piezoelectric green sheet to form multiple piezoelectric green sheets;

[0032] punching on the piezoelectric green sheet to form the through hole.

[0033] In some implementations, the thickness of the piezoelectric green sheet is 40-110 microns;

[0034] The aperture of the through hole is 50-200 microns.

[0035] The arrayed laminated piezoelectric driver and its manufacturing method, and the piezoelectric yaw mirror provided by the application have the following beneficial effects:

[0036] The driving unit of the application can be set to different sizes as needed, and multiple miniaturized driving units are arrayed on the base. Compared with the single piezoelectric driver in the related art, the overall volume can be significantly reduced. The driving unit and the base are integrally formed, which not only reduces the mechanical connecting components in the assembly process, reduces the volume and weight, but also improves the stability and manufacturing precision of the structure. Each driving unit contains a positive electrode layer, a negative electrode layer and a corresponding lead-out layer, and is controlled by an electrode group. An independent voltage signal can be applied to each driving unit, so as to realize the multi-degree-of-freedom deflection of the piezoelectric yaw mirror. The arrayed distribution also allows multiple driving units to work cooperatively, improving the accuracy and flexibility of the angle adjustment of the piezoelectric yaw mirror. In addition, the arrayed distribution of multiple driving units provides redundancy. Even if part of the driving units fail, other units can still maintain the function of the system. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0038] Figure 1 is a structural schematic diagram of an array type laminated piezoelectric driver provided by the embodiments of the present application;

[0039] Figure 2 is a schematic diagram of a longitudinal section of a driving unit provided by the embodiments of the present application;

[0040] Figure 3 is a schematic diagram of another longitudinal section of a driving unit provided by the embodiments of the present application;

[0041] Figure 4 is a schematic diagram of a transverse section of an array type laminated piezoelectric driver of a first form (exposing a negative electrode lead-out layer) provided by the embodiments of the present application;

[0042] Figure 5 is a schematic diagram of another transverse section of an array type laminated piezoelectric driver of the first form (exposing a positive electrode lead-out layer) provided by the embodiments of the present application;

[0043] Figure 6 is a schematic diagram of a transverse section of an array type laminated piezoelectric driver of a second form (exposing a negative electrode lead-out layer) provided by the embodiments of the present application;

[0044] Figure 7 is a schematic diagram of another transverse section of an array type laminated piezoelectric driver of the second form (exposing a positive electrode lead-out layer) provided by the embodiments of the present application;

[0045] Figure 8 is a schematic diagram of a transverse section of an array type laminated piezoelectric driver of a third form (exposing a negative electrode lead-out layer) provided by the embodiments of the present application;

[0046] Figure 9 is a schematic diagram of another transverse section of an array type laminated piezoelectric driver of the third form (exposing a positive electrode lead-out layer) provided by the embodiments of the present application;

[0047] Figure 10 is a schematic diagram of a transverse section of an array type laminated piezoelectric driver of a fourth form (exposing a negative electrode lead-out layer) provided by the embodiments of the present application;

[0048] Figure 11is a schematic diagram of another transverse section of the fourth form of array type laminated piezoelectric driver provided by the embodiments of the present application (exposing the positive electrode lead-out layer).

[0049] Main figure mark explanation:

[0050] 101, base; 102, driving unit; 103, positive electrode group; 104, negative electrode group; 105, first lead wire; 106, second lead wire; 107, positive electrode layer; 108, negative electrode layer; 109, positive electrode; 110, negative electrode; 111, insulating layer; 112, positive electrode lead-out wire; 113, negative electrode lead-out wire; 114, insulating body; 115, first side surface; 116, second side surface;

[0051] 201, through hole. DETAILED DESCRIPTION

[0052] In the related art, piezoelectric drivers use the inverse piezoelectric effect of piezoelectric materials to induce mechanical strain by applying an electric field, drive mechanical systems to achieve precise position and motion control, and are widely used in ultra-precision machining, micro-robot, laser radar and optical instrument posture adjustment industries. However, due to the large volume of piezoelectric drivers after assembly, it is difficult to meet the technical needs of the development of piezoelectric yaw mirrors towards high integration and miniaturization, which limits their application in space-limited scenarios (such as AR / VR devices, portable laser radars). In addition, the electrode surface and non-electrode surface of the piezoelectric driver are exposed to the air, which is easily affected by environmental factors such as humidity, increasing the risk of failure, thereby reducing the reliability and service life of the device in harsh environments.

[0053] Therefore, the embodiments of the present application provide an array type laminated piezoelectric driver and a manufacturing method thereof and a piezoelectric yaw mirror to solve the problems in the related art.

[0054] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0055] In combination with Figures 1 to 5As shown, this application provides an array-type stacked piezoelectric actuator, including: a base 101, a driving unit 102, an electrode group, and an electrode lead-out portion; the electrode lead-out portion includes a positive electrode lead-out layer and a negative electrode lead-out layer; the driving unit 102 is connected to the base 101 and is integrally formed with the base 101; there are multiple driving units 102, which are arranged in an array on the base 101; each driving unit 102 includes a positive electrode layer 107 and a negative electrode layer 108; the positive electrode layer 107 is electrically connected to the positive electrode lead-out layer, and the negative electrode layer 108 is electrically connected to the negative electrode lead-out layer; the electrode group includes multiple positive electrodes 109 and multiple negative electrodes 110 that cooperate with the positive electrodes 109; the electrode group is disposed on the base 101; the positive electrode lead-out layer is electrically connected to the positive electrodes 109, and the negative electrode lead-out layer is electrically connected to the negative electrodes 110. It should be noted that... Figure 2 Longitudinal section and Figure 3 The longitudinal sections are perpendicular to each other; the longitudinal sections are parallel to the height direction of the array-type stacked piezoelectric actuator; the height direction of the array-type stacked piezoelectric actuator is defined as the AA direction; the transverse section of the array-type stacked piezoelectric actuator is perpendicular to the height direction.

[0056] In this embodiment, the drive unit 102 can be configured with different sizes as needed, and multiple miniaturized drive units 102 are arrayed on the base 101, significantly reducing the overall volume compared to single-type piezoelectric actuators in related technologies. The drive unit 102 is integrally formed with the base 101, reducing mechanical connection parts during assembly, lowering volume and weight, and improving structural stability and manufacturing precision. Each drive unit 102 includes a positive electrode layer 107, a negative electrode layer 108, and a corresponding lead-out layer. Through electrode group control, an independent voltage signal can be applied to each drive unit 102, thereby achieving multi-degree-of-freedom deflection of the piezoelectric pendulum mirror. The array distribution also allows multiple drive units 102 to work collaboratively, improving the accuracy and flexibility of angle adjustment of the piezoelectric pendulum mirror. Furthermore, the array distribution of multiple drive units 102 provides redundancy; even if some drive units 102 fail, other units can still maintain the system's functionality.

[0057] In some embodiments, the array-type stacked piezoelectric actuator can be used for a piezoelectric deflector or a reflector; the driving unit 102 and the base 101 form an integral structure; and the number of driving units 102 can be 4, 9, 16, 25, 36, 49, 64, 81, 100 or 128, etc.; multiple driving units 102 can be arranged in rows and columns, so that multiple driving units 102 are arranged to form a rectangle; Figure 1 The diagram shows 36 drive units, corresponding to Figure 8 and Figure 9 It showsFigure 1 negative electrode lead-out layer and the positive electrode lead-out layer in the negative electrode lead-out layer and the positive electrode lead-out layer. Figure 4 and Figure 5 is a cross-sectional view of an arrayed laminated piezoelectric actuator with 16 driving units; Figure 6 and Figure 7 is a cross-sectional view of an arrayed laminated piezoelectric actuator with 25 driving units; Figure 10 and Figure 11 is a cross-sectional view of an arrayed laminated piezoelectric actuator with 64 driving units. It can be understood that the plurality of driving units 102 can also be arranged on a plurality of concentric circles, so that the plurality of driving units 102 form a cylindrical shape after arrangement. The plurality of positive electrodes 109 in the electrode group in the arrayed laminated piezoelectric actuator form a positive electrode group 103, and the plurality of negative electrodes 110 form a negative electrode group 104. The positive electrodes 109 are fixed on the base 101, and the negative electrodes 110 are fixed on the base 101. The positive electrodes 109 can be bump structures, and the negative electrodes 110 can be bump structures.

[0058] In some embodiments, the positive electrode lead-out layer can be embedded in the base 101, and the negative electrode lead-out layer can be embedded in the base 101. This can reduce the complexity of external wiring, reduce the height and volume of the overall structure, and integrate the positive electrode lead-out layer and the negative electrode lead-out layer with the base 101 respectively, reducing additional connecting components and facilitating the miniaturization of the array-type stacked piezoelectric driver. One end of the driving unit 102 is a connecting end connected to the base 101, and the other end of the driving unit 102 is a free end. The connecting end of the driving unit 102 forms a stable mechanical connection with the base 101, and the free end can achieve a larger deflection angle. The rigidity of the base 101 reduces the mechanical stress concentration of the driving unit 102, improves the stability of long-term operation, and the embedding of the positive electrode lead-out layer and the negative electrode lead-out layer reduces the interference of external wiring with the movement of the free end, effectively improving the driving efficiency. For example, the positive electrode lead-out layer can be completely embedded in the base 101, and the positive electrode lead-out layer is not exposed. The negative electrode lead-out layer can be completely embedded in the base 101, and the negative electrode lead-out layer is not exposed. The positive electrode lead-out layer includes a plurality of first leads 105, one end of the first lead 105 is electrically connected to the positive electrode layer 107, and the other end of the first lead 105 is electrically connected to the positive electrode 109. The number of first leads 105 is equal to the number of driving units 102. This one-to-one connection design allows each driving unit 102 to receive electrical signals through an independent positive electrode 109, thereby achieving individual driving, which can significantly improve the control accuracy and flexibility of the piezoelectric yaw mirror. Compared with the unified driving method in the related art, this design can accurately adjust the deflection angle and response speed of each driving unit 102, meeting the needs of high resolution and high dynamic range for optical imaging and laser radar. The negative electrode lead-out layer includes a plurality of second leads 106, the second lead 106 is electrically connected to the negative electrode layer 108, and the second lead 106 is also electrically connected to the negative electrode 110. The plurality of second leads 106 can be in a mesh form by crossing each other, which can reduce the total number of negative electrodes 110. The mesh negative electrode lead-out layer reduces the number of electrodes and the complexity of wiring, and reduces the overall volume and manufacturing difficulty of the driver. The number of positive electrodes 109 in the electrode group can be greater than the number of negative electrodes 110, so that a plurality of driving units 102 can be provided with a common ground or negative electrode 110 connection through the shared mesh negative electrode lead-out layer. The number of positive electrodes 109 is equal to the number of driving units 102, so that the first lead 105 of the positive electrode lead-out layer directly connects the positive electrode layer 107 and the positive electrode 109, ensuring efficient transmission of electrical signals; and the mesh structure of the negative electrode lead-out layer increases the redundancy of electrical connection through the cross design.

[0059] It can be understood that the plurality of leads can also be independently arranged, that is, one end of the second lead 106 is electrically connected to the negative electrode layer 108, and the other end of the second lead 106 is electrically connected to the negative electrode 110.

[0060] It should be noted that in some other possible embodiments, the positive electrode lead-out layer may also be embedded in the driving unit 102, and the negative electrode lead-out layer may also be embedded in the driving unit 102; or, the positive electrode lead-out layer may also be sandwiched between the driving unit 102 and the base 101, and the negative electrode lead-out layer may also be sandwiched between the driving unit 102 and the base 101.

[0061] Combination Figure 2 and Figure 3 As shown, in some embodiments, the driving unit 102 further includes an insulating body 114, through which the positive electrode layer 107 and the negative electrode layer 108 are separated. In the driving unit 102, there are multiple positive electrode layers 107 and multiple negative electrodes 110, and the multiple positive electrode layers 107 and multiple negative electrode layers 108 are stacked along a first direction, and the multiple positive electrode layers 107 and multiple negative electrode layers 108 are alternately distributed in the first direction. The driving unit 102 also includes positive electrode leads 112 and negative electrode leads 113. In the driving unit 102, the multiple positive electrode layers 107 are electrically connected to each other through the positive electrode leads 112, and the multiple negative electrode layers 108 are electrically connected through the negative electrode leads 113. The positive electrode leads 112 are electrically connected to the positive electrode leads layer, and the negative electrode leads 113 are electrically connected to the negative electrode leads layer. The first direction is parallel to the height direction of the array-type stacked piezoelectric actuator. In the drive unit 102, multiple positive electrode layers 107 and multiple negative electrode layers 108 are alternately stacked along a first direction (height direction) and separated by an insulating body 114. This stacking design makes full use of vertical space and significantly improves the integration density of the drive unit 102. The insulating body 114 ensures electrical isolation between the positive electrode layers 107 and negative electrode layers 108, preventing short circuits while maintaining a compact structure. The alternating stacking of multiple positive electrode layers 107 and multiple negative electrode layers 108 also increases the working area of ​​the piezoelectric material, which can generate greater mechanical strain when an electric field is applied, thereby enhancing the driving force of the drive unit 102. The multiple positive electrode layers 107 are arranged in parallel to be electrically connected to the positive electrode lead 112, and the multiple negative electrode layers 108 are arranged in parallel to be electrically connected to the negative electrode lead 113. This ensures uniform distribution of electrical signals, reduces deformation deviation caused by voltage unevenness, and improves the deflection accuracy of the piezoelectric pendulum mirror. This parallel connection reduces the overall resistance and reduces energy loss in electrical signal transmission. This reduces signal delay and improves the response speed of the piezoelectric actuator. The alternating stacking of multiple positive electrode layers 107 and multiple negative electrode layers 108 can be achieved through MEMS processes such as deposition, photolithography and etching, or other processes.

[0062] Combination Figure 2 and Figure 3As shown, in some embodiments, the positive electrode layer 107 is embedded in the insulating body 114, and the negative electrode layer 108 is embedded in the insulating body 114. By the embedded design, the exposed or complex structure of the positive electrode layer 107 and the negative electrode layer 108 requiring external connection is avoided, and the volume of the driving unit 102 is significantly reduced; and the positive electrode layer 107 and the negative electrode layer 108 are both completely embedded in the insulating body 114, so that the electrode layers are completely wrapped by the insulating material, effectively shielding the influence of external environmental factors, preventing the erosion of humidity, dust or corrosive gas on the positive electrode layer 107 and the negative electrode layer 108, solving the failure risk caused by the exposure of the positive electrode layer 107 and the negative electrode layer 108 in the piezoelectric driver in the related art, and improving the reliability of the device in a high humidity, high temperature or vibration environment. Exemplarily, the positive electrode lead-out wire 112 and the negative electrode lead-out wire 113 are also both completely embedded in the insulating body 114. The positive electrode layer 107 is electrically connected to the positive electrode lead-out layer through the positive electrode lead-out wire 112, and the negative electrode layer 108 is electrically connected to the negative electrode lead-out layer through the negative electrode lead-out wire 113, wherein the positive electrode lead-out wire 112 is electrically connected to one end of the first lead wire 105, and the negative electrode lead-out wire 113 is electrically connected to the second lead wire 106. The positive electrode lead-out wire 112 can extend along the height direction of the arrayed laminated piezoelectric driver, and the negative electrode lead-out wire 113 can extend along the height direction of the arrayed laminated piezoelectric driver; the positive electrode layer 107, the negative electrode layer 108, the positive electrode lead-out layer and the negative electrode lead-out layer can be perpendicular to the height direction of the arrayed laminated piezoelectric driver, respectively.

[0063] In combination Figure 2 and Figure 3 As shown, in some embodiments, the insulating body 114 includes a plurality of insulating layers 111, and the plurality of insulating layers 111 are arranged in a stack along the first direction; in the driving unit 102, adjacent positive electrode layers 107 and negative electrode layers 108 are located on opposite sides of the insulating layers 111, so as to ensure electrical isolation and prevent short circuiting while maintaining a compact structure. Exemplarily, in the driving unit 102, each positive electrode layer 107 is sandwiched between two adjacent insulating layers 111, and each negative electrode layer 108 is sandwiched between two adjacent insulating layers 111; the positive projection of the positive electrode layer 107 on a first plane is completely located on the positive projection of the insulating layer 111 on the first plane, and the positive projection of the negative electrode layer 108 on the first plane is completely located on the positive projection of the insulating layer 111 on the first plane, the first plane being perpendicular to the height direction of the arrayed laminated piezoelectric driver, so that the positive electrode layer 107 and the negative electrode layer 108 are completely wrapped by the insulating layer 111, effectively shielding the influence of external environmental factors, preventing the erosion of humidity, dust or corrosive gas on the positive electrode layer 107 and the negative electrode layer 108, solving the failure risk caused by the exposure of the positive electrode layer 107 and the negative electrode layer 108 in the piezoelectric driver in the related art, and improving the reliability of the device in a high humidity, high temperature or vibration environment.

[0064] Referring to Figure 1 As shown in the figures, in some embodiments, the base 101 has a first side 115 and a second side 116, the first side 115 is provided with a plurality of positive electrodes 109, and the second side 116 is provided with a plurality of negative electrodes 110, which facilitates the electrical connection between the arrayed laminated piezoelectric driver and other electronic components. For example, the arrayed laminated piezoelectric driver can be cuboid, and the base 101 can also be cuboid; the first side 115 and the second side 116 of the base 101 are parallel to the first direction. The number of the first side 115 can be 3, and the number of the second side 116 can be 1; in this way, the plurality of positive electrodes 109 are all distributed on the three first sides 115, and the plurality of negative electrodes 110 are all distributed on the second side 116.

[0065] It can be understood that in some other possible embodiments, one or more positive electrodes 109 can also be provided on the second side. In some possible embodiments, one or more negative electrodes 110 can also be provided on the first side.

[0066] It should be noted that, Figure 4 and Figure 5 the plurality of positive electrodes 109 are all distributed on the three first sides 115, and the plurality of negative electrodes 110 are all distributed on the second side 116. Figure 6 and Figure 7 the plurality of positive electrodes 109 are distributed on the three first sides 115 and the second side 116, and the plurality of negative electrodes 110 are all distributed on the second side 116. Figure 8 and Figure 9 the plurality of positive electrodes 109 are all distributed on the three first sides 115, and the plurality of negative electrodes 110 are all distributed on the second side 116. Figure 10 and Figure 11 the plurality of positive electrodes 109 are distributed on the three first sides 115 and the second side 116, and the plurality of negative electrodes 110 are all distributed on the second side 116.

[0067] In some embodiments, the material of the base 101 is ceramic, and the material of the insulating body 114 is ceramic. For example, the material of the insulating body 114 can be piezoelectric ceramic. It can be understood that the material of the base 101 can also be piezoelectric ceramic, which can simplify the manufacturing process of the insulating body 114 and the base 101.

[0068] The embodiment of the present application provides a piezoelectric yaw mirror, which comprises the arrayed laminated piezoelectric driver provided in any of the above embodiments. The piezoelectric yaw mirror device has the same technical effects as the arrayed laminated piezoelectric driver provided in the above embodiments, and details are not repeated here.

[0069] The embodiment of the present application provides a manufacturing method of the array type laminated piezoelectric driver, and the manufacturing method is used for manufacturing the array type laminated piezoelectric driver provided in any one of the foregoing embodiments. The manufacturing method of the array type laminated piezoelectric driver has the same technical effects as the array type laminated piezoelectric driver provided in the foregoing embodiments, and details are not described herein.

[0070] The manufacturing method of the array type laminated piezoelectric driver provided by the embodiment of the present application can include at least a part or all of the following steps.

[0071] In step S100, a piezoelectric green sheet with a through hole 201 is prepared, so that a channel is provided for subsequent conductive filling and electrode connection, and the foundation of the miniaturized and highly integrated driving unit 102 is laid. The number of the through holes 201 on the piezoelectric green sheet can be multiple, and the specific number can be designed according to the needs, which is not limited in the present application.

[0072] In step S200, the through hole 201 is filled with conductive silver paste, so that the conductive silver paste fills the through hole 201 to form a conductive path, that is, to form the positive electrode lead-out wire 112 and the negative electrode lead-out wire 113, to ensure the reliable electrical connection between the positive electrode layer 107 and the positive electrode lead-out wire 112, and the reliable electrical connection between the negative electrode layer 108 and the negative electrode lead-out wire 113, and to improve the electrical signal transmission efficiency and the stability of the driver. After the conductive silver paste fills the through hole 201, the through hole 201 can be completely filled after drying, so that the conductive silver paste is filled, to facilitate the subsequent reliable electrical connection. The solid structure formed by the conductive silver paste contacts the conductive sheet on different dielectric film sheets after the dielectric film sheets are stacked, so that the conductive sheets are stacked, to form the positive electrode lead-out wire 112 and the negative electrode lead-out wire 113 by the conductive sheets in the different through holes 201 of the dielectric film sheets. It can be understood that the conductive silver paste can include graphene and silver paste when the conductive silver paste is used to fill the through hole 201, so that high-conductivity paste is formed, and the current carrying capacity of the through hole 201 is improved.

[0073] Step S300, printing silver palladium paste to the surface of the piezoelectric green sheet through a silk screen, the silver palladium paste is used to form a conductive layer, the conductive layer forms a dielectric diaphragm with the piezoelectric green sheet, and the conductive layer is used for the positive electrode layer 107 and the negative electrode layer 108, so as to provide an efficient electric field driving basis for the piezoelectric effect. After the silver palladium paste is printed to the surface of the piezoelectric green sheet through the silk screen, the silver palladium paste can form a conductive layer after drying operation. For example, there can be only one conductive layer on each piezoelectric green sheet, that is, only one side of the piezoelectric green sheet is printed; the patterns of the positive electrode layer 107 and the negative electrode layer 108 can be the same or different. Through step S300, the positive electrode dielectric diaphragm and the negative electrode dielectric diaphragm can be prepared; it should be noted that the positive electrode lead-out layer and the negative electrode lead-out layer are also formed by the conductive layer respectively.

[0074] Step S400, the plurality of dielectric diaphragms are stacked to form a bar block, so as to increase the working area of the piezoelectric material by using three-dimensional space, enhance the driving force and the deflection angle, and support high-precision and large field angle applications. For example, the printed positive electrode dielectric diaphragm and the negative electrode dielectric diaphragm are neatly stacked together in a certain order to form a bar block with consistent thickness.

[0075] Step S500, the bar block is sequentially subjected to pressure equalization, cutting, degassing and sintering operations to form an integrally formed driver monomer, so as to ensure that the bar block structure is uniform, the size is accurate, and a solid integrated driver monomer is formed, the mechanical stability and manufacturing consistency are improved, and the production cost is reduced. For example, for the pressure equalization operation, the bar block formed in step S400 is treated by hydrostatic pressure equalization with uniform temperature, so that the stacked layers in the bar block are tightly combined with each other, so as to improve the density of the ceramic body after sintering. After the pressure equalization operation, the pressure-equalized bar block is cut transversely and longitudinally according to the design requirements using a sheet-shaped thick blade according to the design, so that the bar block forms a plurality of completely separated driver monomers. Then, the single driver monomer is subjected to degassing operation and sintering operation according to the set temperature gradient, wherein the sintering condition is heating at a temperature range of 1000°C to 1100°C, and the holding time is 3 to 7 hours. For example, the holding time at 1050°C is 5 hours to realize the sintering densification of the driver monomer; it can be understood that the holding time at 1000°C can be 7 hours, and the holding time at 1100°C can be 3 hours.

[0076] Step S600, slotting operation is performed on the driver monomer to form the base 101 and a plurality of driving units 102, wherein the plurality of driving units 102 are arrayed on the base 101, so that high-density integration and independent driving capability can be achieved, the control flexibility and miniaturization degree are improved, and various application scenarios are adapted. Exemplarily, the method of slotting operation on the driver monomer includes: slotting the sintered single driver monomer using a grinding wheel cutting machine or a wire cutting machine.

[0077] In some embodiments, for step S100, the method for preparing the piezoelectric green ceramic sheet with the through hole 201 includes:

[0078] Step S102, the ceramic slurry is coated on the substrate film by a flow casting process, so that the ceramic slurry forms a piezoelectric green ceramic tape. Exemplarily, the ceramic slurry is coated on the circulating silicone film through the pouring port of the flow casting machine, so as to form a uniform ceramic slurry layer, and then most of the solvent in the ceramic slurry layer is volatilized through hot air, and then the ceramic slurry layer is dried by heating to form a piezoelectric green ceramic tape with a set thickness. The thickness of the piezoelectric green ceramic tape can be 40-110 μm; specifically, the thickness of the piezoelectric green ceramic tape can be 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 100 μm or 110 μm.

[0079] Step S104, the piezoelectric green ceramic tape is cut to form a plurality of piezoelectric green ceramic sheets; exemplarily, the piezoelectric green ceramic tape is cut according to a certain size, and the cutting size can be slightly larger than the set size to meet the subsequent processing. It should be noted that the piezoelectric green ceramic tape is still on the silicone film, and the cut piezoelectric green ceramic sheet is also on the silicone film. When a plurality of dielectric film pieces are stacked in step S400, the silicone film needs to be torn off from the piezoelectric green ceramic sheet.

[0080] Step S103, punching is performed on the piezoelectric green ceramic sheet to form the through hole 201. Exemplarily, the punching can be performed on the piezoelectric green ceramic sheet in a mechanical punching or laser punching manner to form the through hole 201 for electrical interconnection; the aperture of the through hole 201 is 50-200 μm, and specifically, it can be 50 μm, 100 μm, 125 μm, 150 μm or 200 μm.

[0081] In some embodiments, after the slotting operation is performed on the driver monomer, that is, after step S600, the manufacturing method of the array type laminated piezoelectric driver further includes:

[0082] Step S700, preparing the positive electrode 109 and the negative electrode 110; illustratively, a conductive material is coated on the side of the base 101 of the driver monomer corresponding to the position of the positive electrode lead-out layer and the negative electrode lead-out layer, and a sintering process is performed to form the positive electrode 109 and the negative electrode 110 of the electrode group, wherein the sintering process includes a sintering process at a set temperature to ensure the conductive connection and bonding strength between the electrode and the lead-out layer, and the set temperature can be 700-900℃, and specifically can be 700℃, 800℃ or 900℃. The conductive material can be conductive silver paste.

[0083] Step S800, polarizing the driver monomer to form an array type laminated piezoelectric driver. Illustratively, a polarization voltage is applied to the positive electrode group 103 composed of a plurality of positive electrodes 109 and the negative electrode group 104 composed of a plurality of negative electrodes 110 respectively, so that the piezoelectric ceramic is polarized, thereby forming an array type laminated piezoelectric driver.

[0084] In summary, the array type laminated piezoelectric driver and the manufacturing method thereof and the piezoelectric yaw mirror provided by the embodiments of the present application have the advantages of compact structure, high integration, small volume, etc. by realizing the integration of the array type laminated piezoelectric driver through the through hole 201 and the conductive layer. The driving unit 102 of the array type laminated piezoelectric driver is a spatially isolated discrete unit, and each driving unit 102 does not interfere with each other, and can be independently controlled by applying a voltage, thereby realizing high-precision control. By embedding the positive electrode layer 107 and the negative electrode layer 108 in the interior of the insulating body 114 of ceramic material, and leading out through the positive electrode lead-out wire 112 and the negative electrode lead-out wire 113, not only the assembly density is improved and the overall volume is reduced, but also the positive electrode layer 107 and the negative electrode layer 108 are protected, thereby enhancing the insulation, moisture resistance and reliability of the device.

[0085] It should be understood that in the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixed connection", "contact" and the like should be understood in a broad sense. For those skilled in the art, the specific meanings of the above-mentioned various terms in the embodiments of the present application can be understood according to the specific circumstances.

[0086] Illustratively, for "connection", it can be various connection modes such as fixed connection, rotary connection, flexible connection, sliding connection, integral molding, electrical connection, contact type connection, etc.; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship of two elements.

[0087] Exemplarily, for "fixed connection", one element can be directly or indirectly fixedly connected to another element; the fixed connection can include mechanical connection, welding, bonding or one-piece forming and the like, wherein the mechanical connection can include riveting, bolt connection, threaded connection, key pin connection, buckle connection, lock connection, plug-in and the like, and the bonding can include adhesive bonding and solvent bonding and the like.

[0088] It should also be understood that "parallel" or "perpendicular" described in the embodiments of the present application can be understood as "approximately parallel" or "approximately perpendicular".

[0089] It should also be understood that the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. The features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0090] In the embodiments of the present application, unless otherwise explicitly specified and limited, the "on" or "under" of the first feature to the second feature can be that the first feature and the second feature are in direct contact, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, the "over", "above" and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "under", "below" and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0091] It should also be understood that the orientations or positional relationships (if any) indicated by the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0092] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims. In summary, the above is only a preferred embodiment of the technical solution of the present application and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An arrayed laminated piezoelectric actuator, characterized by, The arrayed laminated piezoelectric driver comprises: a base; a driving unit connected with the base, the driving unit being integrally formed with the base, the number of the driving unit being multiple, the multiple driving units being arrayed on the base, the driving unit comprising a positive electrode layer and a negative electrode layer; an electrode leading-out part comprising a positive electrode leading-out layer and a negative electrode leading-out layer, the positive electrode layer being electrically connected with the positive electrode leading-out layer, the negative electrode layer being electrically connected with the negative electrode leading-out layer; an electrode group comprising multiple positive electrodes and multiple negative electrodes matched with the positive electrodes, the electrode group being arranged on the base, the positive electrode leading-out layer being electrically connected with the positive electrodes, the negative electrode leading-out layer being electrically connected with the negative electrodes.

2. The arrayed laminated piezoelectric actuator according to claim 1, wherein, The driving unit further comprises an insulating body, the positive electrode layer and the negative electrode layer being separated by the insulating body; In the driving unit, the number of the positive electrode layers and the number of the negative electrodes are multiple respectively, the multiple positive electrode layers and the multiple negative electrode layers being arranged in a first direction, the multiple positive electrode layers and the multiple negative electrode layers being alternately distributed in the first direction; The driving unit further comprises a positive electrode leading-out wire and a negative electrode leading-out wire; in the driving unit, the multiple positive electrode layers are electrically connected by the positive electrode leading-out wire, the multiple negative electrode layers are electrically connected by the negative electrode leading-out wire; The positive electrode leading-out wire is electrically connected with the positive electrode leading-out layer, the negative electrode leading-out wire is electrically connected with the negative electrode leading-out layer; The first direction is parallel to the height direction of the arrayed laminated piezoelectric driver.

3. The arrayed laminated piezoelectric actuator according to claim 2, wherein, The positive electrode layer is embedded in the insulating body, the negative electrode layer is embedded in the insulating body.

4. The arrayed laminated piezoelectric actuator of claim 2, wherein, The insulating body comprises multiple insulating layers, the multiple insulating layers being arranged in the first direction; In the driving unit, the positive electrode layer and the negative electrode layer are located on opposite sides of the insulating layer.

5. The arrayed laminated piezoelectric actuator according to any one of claims 1 to 4, wherein The base has a first side and a second side in the circumferential direction, the first side having positive electrodes, the second side having negative electrodes.

6. The arrayed laminated piezoelectric actuator according to claim 3 or 4, wherein, The base is made of ceramic, the insulating body is made of ceramic.

7. A piezoelectric yaw mirror characterized by, The arrayed laminated piezoelectric driver comprises: The manufacturing method is used for manufacturing the arrayed laminated piezoelectric driver of any one of claims 1-6; 8. A method of fabricating an array of laminated piezoelectric actuators, characterized by, The manufacturing method comprises: preparing a piezoelectric green sheet with a through hole; filling the through hole with conductive silver paste; printing silver-palladium paste to the surface of the piezoelectric green sheet through a silk screen, the silver-palladium paste being used for forming a conductive layer, the conductive layer forming a dielectric diaphragm with the piezoelectric green sheet, the conductive layer being used for the positive electrode layer and the negative electrode layer; stacking multiple dielectric diaphragms to form a bar block; sequentially performing pressure equalization, cutting, degassing and sintering operations on the bar block to form an integrally formed driving unit; performing slotting operation on the driving unit to form a base and multiple driving units, wherein the multiple driving units are arrayed on the base. ​ 9. The method of fabricating an array of laminated piezoelectric actuators of claim 8, wherein, The preparation of the piezoelectric green sheet with a through hole comprises: coating a ceramic slurry on a base film by a flow casting process, so that the ceramic slurry forms a piezoelectric green tape; cutting the piezoelectric green tape to form a plurality of piezoelectric green sheets; punching the piezoelectric green sheet to form the through hole.

10. The method of fabricating an array of laminated piezoelectric actuators of claim 9, wherein, The thickness of the piezoelectric green tape is 40-110 μm; The aperture of the through hole is 50-200 μm.

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