Multi-wavelength color mixing LED packaging device and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses a multi-wavelength color mixing LED packaging device and a manufacturing method thereof. The multi-wavelength color mixing LED packaging device comprises a support, an LED light-emitting chip and a light-transmitting glue layer. The LED light-emitting chip is arranged on the support. The number of the LED light-emitting chips is at least two. The light-transmitting glue layer is arranged on the support and covers the upper surfaces and the side faces of the LED light-emitting chips and the space among the LED light-emitting chips. Scattering particles are arranged in the light-transmitting glue layer, a reflecting surface is arranged on the side surface of the light-transmitting glue layer, and the reflecting surface is used for reflecting light emitted by the LED light-emitting chips for multiple times, so that the light is emitted after being staggered and mixed for multiple times. By arranging the reflecting surface and presetting a'reflecting channel 'in the light-transmitting glue layer, light emitted by the plurality of LED light-emitting chips is totally reflected for multiple times in the'reflecting channel', so that uniform light mixing of light rays is realized, and the problem that light with different colors is easy to disperse when passing through the secondary light distribution edge of the lens is solved; meanwhile, the device has the advantages of accurate light control and high light energy utilization rate.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor light-emitting, and particularly relates to a multi-wavelength mixed-color LED packaging device and a manufacturing method thereof. BACKGROUND

[0002] Most of the existing LED light mixing devices are packaged by LED light-emitting chips with different light-emitting properties to meet different light mixing requirements. For example, as shown in the prior art, a white light LED light mixing device mostly uses a light-transmitting adhesive layer 3 to package a red light LED light-emitting chip, a green light LED light-emitting chip and a blue light LED light-emitting chip (three LED light-emitting chips 2) in a support 1. The red light emitted by the red light LED light-emitting chip, the green light emitted by the green light LED light-emitting chip and the blue light emitted by the blue light LED light-emitting chip are mixed into white light in the light-transmitting adhesive layer 3. However, due to the limitation of the initial emission angle of the LED light-emitting chip, the light emitted by the LED light-emitting chip is not uniformly mixed, and color dispersion easily occurs at the edge after light distribution by a secondary lens 5, referring to Figures 14-15 which leads to the edge of the existing LED light mixing device being prone to having a light spot inconsistent with the center color. Figure 16

[0003] Based on the above, the problem to be solved at present is to provide a multi-wavelength mixed-color LED packaging device and a manufacturing method thereof, which are not prone to color dispersion at the edge of the light spot, have uniform light mixing, high light energy utilization rate and precise light control. SUMMARY

[0004] The present application aims to provide a multi-wavelength mixed-color LED packaging device, which aims to solve the problems of non-uniform light mixing, color dispersion at the edge of the light spot, low light energy utilization rate and inaccurate light control in the prior art.

[0005] The present application is implemented as follows: a multi-wavelength mixed-color LED packaging device, comprising:

[0006] a support;

[0007] an LED light-emitting chip disposed on the support, the number of the LED light-emitting chip being at least 2;

[0008] a light-transmitting adhesive layer disposed on the support and covering the upper surface and the side surface of the LED light-emitting chip and the space between the LED light-emitting chips, the light-transmitting adhesive layer being provided with scattering particles, and the side surface of the light-transmitting adhesive layer being provided with a reflecting surface for multiple reflections of the light emitted by the LED light-emitting chips so that the light is emitted after multiple staggered mixing.

[0009] ​Further, the reflecting surface is arranged as a concave arc surface, and the cross section of the reflecting surface is narrow in the middle and wide at both ends or gradually narrows away from the support.

[0010] Further, a high-reflection adhesive layer is arranged around the light-transmitting adhesive layer, and the high-reflection adhesive layer is arranged on the support and covers the reflecting surface.

[0011] Further, the upper surface of the light-transmitting adhesive layer is a curved surface or a flat surface.

[0012] Further, a lens is arranged on the side of the light-transmitting adhesive layer away from the support, and a cavity structure is arranged between the lens and the light-transmitting adhesive layer; the lens is a Fresnel lens.

[0013] Further, the lens includes a lower optical interface for inputting light and an upper optical interface for outputting light; the lower optical interface sequentially includes a first optical interface, a second optical interface, and a third optical interface from the middle to the periphery

[0014] The first optical interface is a flat surface or a curved surface; the second optical interface is arranged as an inclined curved surface or a flat surface for increasing the incident angle of light; and the third optical interface is arranged as a flat surface or a curved surface for reflecting light and opposite to the inclined direction of the second optical interface.

[0015] Further, on the cross section passing through the optical axis from the lens to the support, the profile line of the first optical interface is a two-variable Nth power curve, and the profile line of the third optical interface is a two-variable Mth power curve, N and M are integers greater than or equal to 3.

[0016] Further, the connection between the second optical interface and the third optical interface is arranged outside the periphery of the reflecting surface and is lower than the connection between the reflecting surface and the upper surface of the light-transmitting adhesive layer.

[0017] A manufacturing method for manufacturing a multi-wavelength mixed-color LED packaging device, including the following steps:

[0018] Step S1, fixing a plurality of light-emitting chips on a support;

[0019] Step S2, dispensing a light-transmitting adhesive on the pressing surface of a mold, and filling the space between the plurality of light-emitting chips on the support with the light-transmitting adhesive;

[0020] Step S3, pressing the light-transmitting adhesive with the mold, so that the light-transmitting adhesive covers the upper surface and the side surface of all the light-emitting chips, the space between the plurality of light-emitting chips, and part of the upper surface of the support; and controlling the amount of light-transmitting adhesive and the pressing height of the mold, so that the side surface of the light-transmitting adhesive forms a reflecting structure for reflecting the light emitted by the LED light-emitting chips;

[0021] Step S4, after curing, the mold is removed, and the light-transmitting adhesive is cured on the light-emitting chip to form a light-transmitting adhesive layer, and the side surface of the light-transmitting adhesive layer has a reflecting surface.

[0022] Further, after step S4, step S5 is further included.

[0023] Step S5, high-reflection adhesive is filled around the light-transmitting adhesive layer on the support, and after curing, the high-reflection adhesive layer is closely covered on the reflecting surface.

[0024] Compared with the prior art, the multi-wavelength mixed LED packaging device and the manufacturing method thereof have the following beneficial effects:

[0025] 1. The light-transmitting adhesive layer 3 is internally provided with a plurality of scattering particles, and the side surface of the light-transmitting adhesive layer 3 is provided with a reflecting surface 31, that is, a "reflection channel" is pre-set in the light-transmitting adhesive layer 3. The light emitted by the plurality of LED light-emitting chips 2 is multiple times totally reflected in the "reflection channel", the optical path of the light is increased, and the probability of light scattering is increased, and the light emitted by the LED light-emitting chip 2 can be fully mixed, and uniform light mixing is achieved, and the problem that the edge is prone to color dispersion after the light of different colors is twice light-distributed by the lens 5 is further solved. Figure 6

[0026] 2. The reflecting surface 31 is provided with a surface type, the reflection route of the light is accurately controlled, the light emitted by the plurality of LED light-emitting chips 2 is uniformly mixed after multiple times of total reflection according to the pre-set reflection route, the light control effect is good, and the light energy utilization rate is high. The reflecting surface 31 covered by the high-reflection adhesive layer 4 is provided, the light reaching the reflecting surface 31 is totally reflected, and the light energy utilization rate and the light control accuracy are further improved.

[0027] 3. Compared with the prior art, the volume of the light-transmitting adhesive layer 3 is reduced, the plurality of integrated LED light-emitting chips 2 are arranged more concentratedly, the light mixing space is reduced, the number of times of mutual interlacing of the light of different wavelengths in the light mixing space is increased, and the light mixing effect is better.

[0028] 4. The lower optical interface 51 sequentially includes a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle to the periphery. The second optical interface 512 and the third optical interface 513 are provided as inclined surfaces with opposite inclined directions. The second optical interface 512 increases the incidence angle of the light, the light refracted by the second optical interface 512 is easily totally reflected when incident to the third optical interface 513, and the reflected light propagates towards the direction close to the optical axis, thereby having the advantages of uniform light mixing, high light energy utilization rate and good optical shaping effect.

[0029] ​5. In the manufacturing method of this invention, before pressing and molding, transparent adhesive is pre-filled between several light-emitting chips 2 to avoid air bubbles being generated during the pressing process, which would affect the molding quality of the transparent adhesive layer 3, resulting in a high yield. The manufacturing method of this invention can batch-produce multi-wavelength mixed-color LED packages using a single mold, and is simple to operate and has high production efficiency. Attached Figure Description

[0030] Figure 1 This is a cross-sectional structural diagram of the multi-wavelength color mixing LED packaging device provided by the present invention;

[0031] Figure 2 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment 1 of the present invention;

[0032] Figure 3 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment 2 of the present invention;

[0033] Figure 4 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment 3 of the present invention;

[0034] Figure 5 This is a top view of the multi-wavelength color mixing LED packaging device provided by the present invention;

[0035] Figure 6 This is the optical path diagram of the multi-wavelength color mixing LED packaging device provided by the present invention;

[0036] Figure 7 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment 4 of the present invention;

[0037] Figure 8 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment 5 of the present invention;

[0038] Figure 9 This is a cross-sectional structural schematic diagram of the multi-wavelength color mixing LED packaging device provided in Embodiment Six of the present invention;

[0039] Figure 10 This is a schematic diagram of the cross-sectional structure after the implementation of steps S1 and S2 provided by the present invention;

[0040] Figure 11 This is a top view of the bracket and LED light-emitting chip assembly after step S2 is implemented according to the present invention;

[0041] Figure 12 This is a schematic cross-sectional view of the structure after step S3 is implemented according to the present invention;

[0042] Figure 13is a cross-sectional structure schematic diagram after step S4 is implemented provided by the present application;

[0043] Figure 14 is a cross-sectional structure schematic diagram of a prior art multi-wavelength mixed LED packaging device;

[0044] Figure 15 is a top view of a prior art multi-wavelength mixed LED packaging device;

[0045] Figure 16 is a light path diagram of a prior art multi-wavelength mixed LED packaging device;

[0046] In the figure: 1 - support; 2 - LED light emitting chip; 3 - light-transmitting adhesive layer; 31 - reflecting surface; 4 - high-reflecting adhesive layer; 5 - lens; 51 - lower optical interface; 511 - first optical interface; 512 - second optical interface; 513 - third optical interface; 52 - upper optical interface; 6 - cavity structure; 7 - mold; 71 - pressing part; 711 - pressing surface; 72 - supporting part. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0048] The implementation of the present application is described in detail below in combination with specific examples.

[0049] The same or similar reference numerals in the drawings of the present example correspond to the same or similar components; in the description of the present application, it should be understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present patent, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0050] Referring to Figures 1-16 , a preferred embodiment provided by the present application is shown.

[0051] The multi-wavelength mixed LED packaging device comprises a support 1, an LED light emitting chip 2 and a light-transmitting adhesive layer 3, referring to Figure 1The support 1 is a flat support, a bowl cup support, etc. The LED light emitting chips 2 are arranged on the support 1, and the number of the LED light emitting chips 2 is at least two. The light-transmitting glue layer 3 is arranged on the support 1 and covers the upper surfaces and side surfaces of the LED light emitting chips 2 and the space between the LED light emitting chips 2, so as to improve the light efficiency and reduce the light mixing space.

[0052] The arrangement of the light-transmitting glue layer 3 and the light emitting chips 2 has the following beneficial effects: 1. The light-transmitting glue layer 3 only covers part of the upper surface of the support 1, referring to Figure 1 ; the light-transmitting glue layer 3 of the prior art covers the entire upper surface of the support 1, referring to Figures 14-15 . 2. The arrangement of the plurality of light emitting chips 2 is more compact than the prior art (see Figure 5 ), and the plurality of light emitting chips 2 overlap in the cross-sectional structure diagram of the multi-wavelength mixed LED packaging device Figure 1 . The above arrangement of the present application reduces the light mixing space and increases the number of times of the mutual interlacing of the light of different wavelengths in the space, so that the light mixing effect is good.

[0053] The light-transmitting glue layer 3 is provided with scattering particles having a scattering effect. The side surface of the light-transmitting glue layer 3 is provided with a reflecting surface 31, which is used for multiple total reflection of the light emitted by the plurality of LED light emitting chips 2, increases the optical path, increases the light scattering probability, so that the light is uniformly mixed after multiple total reflection and then emitted; on the other hand, the large-angle light emitted to the periphery is reflected upward after the action of the reflecting surface 31 and emitted from the upper surface of the light-transmitting glue layer 3, which improves the light energy utilization rate and is beneficial to the adjustment of the divergence angle.

[0054] The preferred scheme one of the reflecting surface 31 is that the reflecting surface 31 is a concave arc surface, and the cross section surrounded by the two side reflecting surfaces 31 is set to be narrow in the middle and wide at both ends, referring to Figures 1-3 . The preferred scheme two of the reflecting surface 31 is that the reflecting surface 31 is a concave arc surface, and the cross section surrounded by the two side reflecting surfaces 31 gradually narrows in the direction away from the support 1, referring to Figure 4 . The reflecting surface 31 is not limited to the above two schemes, and any arrangement capable of achieving multiple total reflection of the light emitted by the plurality of LED light emitting chips 2 so that the light is uniformly emitted after multiple interlacing mixing is within the concept range of the present application.

[0055] Further, the high-reflection glue layer 4 is arranged around the light-transmitting glue layer 3 on the support 1, referring to Figures 2-4The high-reflectivity adhesive layer 4 tightly covers the reflective surface 31, ensuring total internal reflection of light incident on the reflective surface 31. Light emitted from multiple LED chips 2 is reflected multiple times within the translucent adhesive layer 3, increasing the number of times different wavelengths of light intersect in space, resulting in good light mixing. The high-reflectivity adhesive layer 4 also serves a fixing function. The filling method of the high-reflectivity adhesive layer 4 is not limited; it can cover part or all of the upper surface of the bracket 1, or extend to the inner side of the bracket 1. The upper surface of the high-reflectivity adhesive layer 4 can be set as a plane (see reference). Figure 2 , Figure 4 It can also be set as a concave curved surface (see reference). Figure 3 ) etc. The upper surface of the translucent adhesive layer 3 is set as a curved surface (refer to...). Figure 1 ) or plane (refer to) Figures 2-4 The present invention adds a high-reflectivity adhesive layer 4 to ensure that the light reaching the reflective surface 31 undergoes total internal reflection, thereby improving light energy utilization and light control accuracy.

[0056] A lens 5 for optical shaping can also be installed on the side of the light-transmitting adhesive layer 3 away from the support 1, as shown in reference 7. The upper surface of the lens 5 can be set as a plane or a curved surface as needed. The lens 5 and the light-transmitting adhesive layer 3 can be tightly connected or have a cavity structure 6 (i.e., a gas layer) between them. The light emitted by multiple LED light-emitting chips 2 is uniformly mixed after being acted upon by the light-transmitting adhesive layer 3, so the light entering the lens 5 is not easily dispersed, and the output light is uniform, as shown in reference 7. Figure 6 The refractive index of lens 5 is preferably greater than or equal to 1.41. Lens 5 can be configured as a Fresnel lens, as shown in the reference. Figure 7 .

[0057] Reference Figures 7-8 The mirror 5 includes a lower optical interface 51 for inputting light and an upper optical interface 52 for outputting light. The upper optical interface 52 can be set as a plane or a slightly curved surface, and the middle part of the lower optical interface 51 is set as a plane or a curved surface, and at least one annular convex surface is provided around it. The cross-section of the annular convex surface is sawtooth-shaped. When the lower optical interface 5 is provided with two or more annular convex surfaces, the multiple annular convex surfaces are preferably arranged concentrically.

[0058] Optimization plan: Refer to Figure 9, the lower optical interface 51 comprises a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle to the periphery in sequence. The first optical interface 511, the second optical interface 512 and the third optical interface 513 are connected in sequence. The first optical interface 511 is provided as a plane or a curved surface, preferably a convex curved surface. The second optical interface 512 is provided as an inclined curved surface or a plane for increasing the light incidence angle. The second optical interface 512 can be provided as an inclined curved surface or a plane gradually away from the optical axis from the first optical interface 511 to the support 1. The third optical interface 513 is provided as a plane or a curved surface for reflecting light and opposite to the inclined direction of the second optical interface 512. The third optical interface 513 can be provided as an inclined curved surface or a plane gradually close to the optical axis from the first optical interface 511 to the support 1. The second optical interface 512 increases the light incidence angle, and the light is easy to be totally reflected after being refracted by the second optical interface 512 to reach the third optical interface 513, so that the light propagates in the direction close to the optical axis, so that the mixed light is uniform, the light energy utilization rate is improved, and the optical shaping is facilitated.

[0059] Further, the connection between the second optical interface 512 and the third optical interface 513 is located outside the periphery of the reflecting surface 31 and is lower than the connection between the reflecting surface 31 and the upper surface of the light-transmitting adhesive layer 3, that is, the lowest point of the second optical interface 512 is closer to the support 1 than the lowest point of the upper surface of the light-transmitting adhesive layer 3. The combination of the first optical interface 511 and the second optical interface 512 covers the upper surface of the light-transmitting adhesive layer 3, and a cavity structure 6 is provided between the first optical interface 511, the second optical interface 512 and the light-transmitting adhesive layer 3. This arrangement can improve the light energy utilization rate, make the mixed light more uniform, have a good light shaping effect, and achieve precise light control.

[0060] Further, a cross section is formed by cutting along the optical axis (or the center of the lens 5) from the lens 5 to the support 1, the profile line of the first optical interface 511 on the cross section is a two-variable Nth power curve, the profile line of the third optical interface 513 on the cross section is a two-variable Mth power curve, and N and M are integers greater than or equal to 3. This arrangement makes the mixed light of different colors uniform and accurately reaches the preset divergence angle, for example, the divergence angle range of the mixed light is 20°-90°.

[0061] Referring to Figure 9The lens 5 further comprises a receiving part 53 connected to the periphery of the upper optical interface 52 and the lower optical interface 51. The bottom of the receiving part 53 is connected to the support 1. The inner side and the outer side of the receiving part 53 are provided as inclined surfaces, which gradually move away from the optical axis (or the center of the lens 5) from the upper optical interface 52 to the lower optical interface 51. This structure is easy to be pulled out of the mold. The bottom of the receiving part 53 is provided as a flat surface. This structure is conducive to forming a plurality of multi-wavelength mixed LED packaging devices by array splicing, and then cutting to form a single multi-wavelength mixed LED packaging device with the side surface of the support 1 and the lens 5 in the same plane.

[0062] Embodiment One: Figure 2 The multi-wavelength mixed LED packaging device comprises a support 1, LED light emitting chips 2, and a light-transmitting adhesive layer 3. The support 1 is a bowl-shaped support. The LED light emitting chips 2 are arranged on the support 1, and the number of the LED light emitting chips 2 is three. The three LED light emitting chips 2 are arranged in a triangular shape (see Figure 5 ), and in a cross-sectional view (see Figure 2 ), the three LED light emitting chips 2 overlap, that is, the overall arrangement is relatively compact. The light-transmitting adhesive layer 3 is arranged on the support 1 and covers all the LED light emitting chips 2 and the space between the three LED light emitting chips 2. The light-transmitting adhesive layer 3 is provided with scattering particles. The upper surface of the light-transmitting adhesive layer 3 is provided as a flat surface. The side surface of the light-transmitting adhesive layer 3 is provided with a reflecting surface 31. The reflecting surface 31 is an inner concave arc surface, and the cross section surrounded by the two reflecting surfaces 31 is provided as a structure with a narrow middle part and wide ends. The periphery of the support 1 and the light-transmitting adhesive layer 3 is provided with a highly reflective adhesive layer 4. The highly reflective adhesive layer 4 closely covers the reflecting surface 31. The highly reflective adhesive layer 4 covers the entire upper surface of the support 1 and extends to the inner side surface of the support 1. The upper surface of the highly reflective adhesive layer 4 is provided as a flat surface.

[0063] Embodiment Two: Figure 3 The main difference from Embodiment One is that the upper surface of the highly reflective adhesive layer 4 is provided as an inner concave curved surface. Other settings are the same as those of Embodiment One.

[0064] Embodiment Three: Figure 4 The main difference from Embodiment One is that the reflecting surface 31 is an inner concave arc surface, and the cross section surrounded by the two reflecting surfaces 31 gradually narrows in the direction away from the support 1. Other settings are the same as those of Embodiment One.

[0065] Embodiment Four: Figure 7The multi-wavelength mixed LED packaging device comprises a support 1, LED light emitting chips 2 and a light-transmitting glue layer 3. The support 1 is a bowl cup-shaped support. The LED light emitting chips 2 are arranged on the support 1, and the number of the LED light emitting chips 2 is 3. The light-transmitting glue layer 3 is arranged on the support 1 and covers all the LED light emitting chips 2. The light-transmitting glue layer 3 is internally provided with scattering particles. The upper surface of the light-transmitting glue layer 3 is provided as a micro-arc surface. The side surface of the light-transmitting glue layer 3 is provided with a reflecting surface 31. The reflecting surface 31 is an inner concave arc surface, and the cross section surrounded by the two side reflecting surfaces 31 is provided as a structure with a narrow middle part and wide two ends. The light-transmitting glue layer 3 covers part of the upper surface of the support 1, and the inner side surface of the support 1 and the periphery of the light-transmitting glue layer 3 have a cavity.

[0066] The side of the light-transmitting glue layer 3 away from the support 1 is further provided with a lens 5. The lens 5 is a Fresnel lens. The lens 5 and the light-transmitting glue layer 3 are provided with a cavity structure 6. The lens 5 comprises a lower optical interface 51 for inputting light and an upper optical interface 52 for outputting light. The upper optical interface 52 can be provided as a plane, the middle part of the lower optical interface 51 is provided as a curved surface, the periphery is provided as a plurality of concentric annular convex surfaces, and the cross section of the annular convex surfaces is in a sawtooth shape.

[0067] Embodiment five: refer to Figure 8 The main difference between the embodiment five and the embodiment four is that: 1, the upper surface of the light-transmitting glue layer 3 is provided as a plane. The periphery of the light-transmitting glue layer 3 on the support 1 is provided with a high-reflection glue layer 4. The high-reflection glue layer 4 closely covers the reflecting surface 31. The high-reflection glue layer 4 covers the entire upper surface of the support 1 and extends to the inner side surface of the support 1. The upper surface of the high-reflection glue layer 4 is provided as an inner concave curved surface. Other settings are the same as those of the embodiment four.

[0068] Embodiment six: refer to Figure 9 The main difference between the embodiment six and the embodiment five is that:

[0069] 1, the upper surface of the light-transmitting glue layer 3 is provided as a micro-arc surface.

[0070] 2, the lower optical interface 51 comprises a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle part to the periphery in sequence. The first optical interface 511, the second optical interface 512 and the third optical interface 513 are connected in sequence. The first optical interface 511 is provided as a convex curved surface. The second optical interface 512 is provided as an inclined plane for increasing the light incidence angle. The third optical interface 513 is provided as an inclined curved surface for reflecting light. The direction of the inclination of the third optical interface 513 is opposite to that of the second optical interface 512.

[0071] The connection between the second optical interface 512 and the third optical interface 513 is located outside the four sides of the reflecting surface 31 and is lower than the connection between the reflecting surface 31 and the upper surface of the light-transmitting adhesive layer 3. The combination of the first optical interface 511 and the second optical interface 512 covers the upper surface of the light-transmitting adhesive layer 3, and a cavity structure 6 is arranged between the first optical interface 511, the second optical interface 512, and the light-transmitting adhesive layer 3. Other arrangements are the same as those in Embodiment Five.

[0072] The manufacturing method of the multi-wavelength mixed LED packaging device of the present application is as follows:

[0073] Step S1, fix a plurality of light emitting chips 2 on the support 1, and the plurality of light emitting chips 2 are arranged relatively compactly, refer to Figure 10 .

[0074] Step S2, distribute the light-transmitting adhesive on the pressing surface 711 of the mold 7, and fill the space between the plurality of light emitting chips 2 on the support 1 with the light-transmitting adhesive, refer to Figure 11 . The space between the light emitting chips 2 is filled with the light-transmitting adhesive in advance, which can avoid the generation of bubbles between the light emitting chips 2 during the pressing molding process, thereby affecting the molding quality of the light-transmitting adhesive layer 3.

[0075] The pressing surface 711 can be a flat surface or a curved surface, refer to Figure 10 . The mold 7 includes a supporting part 72 and a pressing part 71 fixed to one side of the supporting part 72. The pressing part 71 is provided with a pressing surface 711 on the side away from the supporting part 72.

[0076] The side of the supporting part 72 close to the pressing part 71 is preferably a flat surface, and a plurality of pressing parts 71 can be arranged on the flat surface of the supporting part 72 for simultaneously batch molding of multi-wavelength mixed LED packaging devices.

[0077] Step S3, refer to Figure 12 , press the light-transmitting adhesive with the mold 7 so that the light-transmitting adhesive covers the upper surface and the side surface of all the light emitting chips 2, the space between the plurality of light emitting chips 2, and part of the upper surface of the light-transmitting adhesive layer support 1. And control the amount of light-transmitting adhesive and the pressing height of the mold 7, so that the side surface of the light-transmitting adhesive forms a reflection structure for reflecting the edge large-angle light emitted by the light emitting chips 2.

[0078] During the pressing process, the plane of the supporting part 72 around the pressing part 71 abuts against the upper surface around the support 1, and the supporting part 72 plays a role of supporting and controlling stability. The pressing part 71 extends into the cavity structure 6 to press the light-transmissive glue to the LED light emitting chip 2. By using the thixotropy of the light-transmissive glue contacting the LED light emitting chip 2, a structure with a concave middle part and large upper and lower dimensions is formed on the side of the light-transmissive glue. The structure can reflect the edge large-angle light emitted by the LED light emitting chip 2. During the pressing process, the height of the upper surface around the support 1, the pressing surface 711 and the upper surface of the LED light emitting chip 2 to the bottom surface of the support 1 is D, L and S respectively, and preferably D>L>S.

[0079] After curing, the mold 7 is removed, the light-transmissive glue is cured to form the light-transmissive glue layer 3 on the light emitting chip 2, and the step S4 is referred to Figure 13 The side of the light-transmissive glue layer 3 has a reflecting surface 31, and the light emitted by the plurality of LED light emitting chips 2 is incident to the reflecting surface 31 and is reflected multiple times in the light-transmissive glue layer 3, so that the number of times of interlacing different wavelengths of light in space is increased, and the light mixing effect is good.

[0080] Further, after the step S4, the step S5 is further included.

[0081] Step 5, the high-reflection glue is filled around the support 1 and the light-transmissive glue layer 3. After curing, the high-reflection glue layer 4 is closely covered on the reflecting surface 31. The filling of the high-reflection glue can be natural or mechanical vibration filling after dispensing, or can be by a mold pressing method.

[0082] After the step S4 or the step S5, steps such as a step of gluing a lens 5 and a step of cutting a plurality of multi-wavelength mixed color LED packaging devices formed in batches can be further provided. The manufacturing method of the present application can form a plurality of multi-wavelength mixed color LED packaging devices in a single mold, and has the advantages of simple operation, high production efficiency and high yield.

[0083] Without limiting the present application, any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-wavelength color-mixed LED package device, characterized by, The application relates to a light-emitting diode (LED) lamp, which comprises the following components: a support (1); LED light-emitting chips (2) arranged on the support (1), wherein the number of the LED light-emitting chips (2) is at least two; a light-transmitting glue layer (3) arranged on the support (1) and covering the upper surfaces and side surfaces of the LED light-emitting chips (2) and the spaces between the LED light-emitting chips (2), wherein scattering particles are arranged in the light-transmitting glue layer (3), and a reflecting surface (31) is arranged on the side surface of the light-transmitting glue layer (3) and used for reflecting the light emitted by the LED light-emitting chips (2) for multiple times so that the light is mixed after multiple times of intersection and then emitted. The reflecting surface (31) is arranged as a concave arc surface, and the cross section surrounded by the reflecting surface (31) is narrow in the middle and wide at both ends or gradually narrows in the direction away from the support (1). A high-reflection glue layer (4) is arranged around the light-transmitting glue layer (3), and the high-reflection glue layer (4) is arranged on the support (1) and covers the reflecting surface (31). The upper surface of the light-transmitting glue layer (3) is a curved surface or a plane.

2. The multi-wavelength color-mixed LED package device according to claim 1, wherein, A lens (5) is further arranged on the side of the light-transmitting glue layer (3) away from the support (1), and a cavity structure (6) is arranged between the lens (5) and the light-transmitting glue layer (3); the lens (5) is a Fresnel lens.

3. The multi-wavelength color-mixed LED package device according to claim 1, wherein, The lens (5) comprises a lower optical interface (51) for inputting light and an upper optical interface (52) for outputting light; the lower optical interface (51) comprises a first optical interface (511), a second optical interface (512) and a third optical interface (513) from the middle to the periphery in sequence; 4. The multi-wavelength color-mixed LED package device according to claim 1, wherein, The first optical interface (511) is a plane or a curved surface; the second optical interface (512) is arranged as an inclined curved surface or a plane for increasing the light incidence angle; and the third optical interface (513) is arranged as a plane or a curved surface for reflecting light and opposite to the inclined direction of the second optical interface (512).

5. The multi-wavelength color-mixed LED package device according to claim 1, wherein, On the cross section along the optical axis from the lens (5) to the support (1), the profile line of the first optical interface (511) is a two-variable Nth power curve, and the profile line of the third optical interface (513) is a two-variable Mth power curve, wherein N and M are integers greater than or equal to 3.

6. The multi-wavelength color-mixed LED package device according to claim 5, wherein, The connection between the second optical interface (512) and the third optical interface (513) is arranged outside the periphery of the reflecting surface (31) and is lower than the connection between the reflecting surface (31) and the upper surface of the light-transmitting glue layer (3). The application further discloses a manufacturing method of the LED lamp.

7. The multi-wavelength color-mixed LED package device according to claim 6, wherein, Step S1: fixing a plurality of light-emitting chips (2) on the support (1); 8. The multi-wavelength color-mixed LED package device according to claim 6, wherein, Step S2: distributing light-transmitting glue on the pressing surface (711) of a mold (7) and filling the spaces between the light-emitting chips (2) on the support (1) with the light-transmitting glue; 9. A manufacturing method for manufacturing the multi-wavelength color-mixed LED package device according to any one of claims 1 to 8, characterized by, ​ ​ ​ Step S3, the mold (7) is used to press the light-transmitting glue, so that the light-transmitting glue covers the upper surface and the side surface of the light-emitting chip (2), the space between the light-emitting chips (2), and part of the upper surface of the support (1); the amount of the light-transmitting glue and the pressing height of the mold (7) are controlled, so that the side surface of the light-transmitting glue forms a reflection structure for reflecting the light emitted by the LED light-emitting chip (2); Step S4, after solidification, the mold (7) is removed, the light-transmitting glue is solidified on the light-emitting chip (2) to form a light-transmitting glue layer (3), and the side surface of the light-transmitting glue layer (3) has a reflection surface (31).

10. The method of manufacturing according to claim 9, wherein, After step S4, step S5 is further included; Step S5, high-reflection glue is filled around the light-transmitting glue layer (3) on the support (1), and after solidification, a high-reflection glue layer (4) is tightly covered on the reflection surface (31).

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