Intelligent preparation method of hot melt adhesive based on Internet of Things

Abstract

The invention relates to the technical field of hot melt adhesive preparation, in particular to an intelligent hot melt adhesive preparation method based on Internet of Things, which comprises the following steps: adding raw materials except conductive filler into a melting kettle; heating and dissolving, and adding a conductive material; after uniform mixing is determined according to the pressure change of the melting kettle, the viscosity is adjusted; filtering and shaping; and applying the obtained adjustment coefficients of the pressure and the viscosity to the next production process. By accurately controlling the stirring time of the hot melt adhesive raw material, the dispersion uniformity of the conductive filler can be improved, and the conductivity of the hot melt adhesive is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hot melt adhesive preparation, and in particular to a hot melt adhesive intelligent preparation method based on the Internet of Things. BACKGROUND

[0002] With the increasing demand of the electronic manufacturing industry for low-temperature, fast, flexible and efficient conductive connection solutions, and the continuous progress of conductive filler technology, polymer matrix technology and processing technology, the conductive hot melt adhesive is more important in the electronic manufacturing industry. The core is to stably and efficiently build a conductive network in the hot melt adhesive system, and balance the conductivity, bonding strength, processing performance and cost. The traditional hot melt adhesive production method has high dependence on manual work; the process transparency is low, there is a lack of real-time data, and it is difficult to quickly locate the problem source after a problem occurs. Therefore, in order to solve the problems of low efficiency and quality fluctuation in the traditional hot melt adhesive production mode, the increasingly mature low-cost Internet of Things technology can be used to realize the digitization and intelligentization of the hot melt adhesive preparation process.

[0003] Chinese Patent Publication No. CN111040679B discloses a conductive hot melt adhesive, which is made of the following raw materials in mass fraction: butyl acrylate 11-16 parts; ethyl acrylate 13-20 parts; methyl methacrylate 4-8 parts; ethyl acetate 9-13 parts; polyethylene 3-5 parts; silicone oil 1-3 parts; potassium persulfate 14-18 parts; and nano nickel-based composite material particles 15-20 parts. The conductive filler uses nano nickel-based composite material particles, which have small size and can be more uniformly dispersed in the hot melt adhesive compared with ordinary nickel materials, thereby making the conductivity of the conductive hot melt adhesive more uniform and stable. However, this method mainly uses traditional chemical raw materials, which has an impact on the environment; the key control parameters of each preparation step cannot be monitored during the production process, making it difficult to ensure the consistency of product quality; and the material used for the conductive filler also has room for further optimization and improvement. SUMMARY

[0004] Therefore, the present application provides a hot melt adhesive intelligent preparation method based on the Internet of Things to overcome the problems of poor mixing uniformity of conductive fillers and low conductivity of prepared hot melt adhesives caused by the inability to accurately control the key process data of the key process in the prior art.

[0005] To achieve the above-mentioned purpose, the present application provides a hot melt adhesive intelligent preparation method based on the Internet of Things, which comprises:

[0006] Step S1, adding raw materials other than conductive fillers in the proportion of the hot melt adhesive into a melting kettle with stirring and heating functions;

[0007] Step S2, gradually increase the temperature to 160-180℃ to melt the solid components into a homogeneous liquid, stir until the mixture is uniform, the preset stirring speed is 50-100rpm, add the conductive filler, and detect the pressure parameter of the melting kettle after adding the conductive filler. If the pressure parameter exceeds the preset pressure threshold, adjust the vacuum degree of the melting kettle;

[0008] Step S3, continuously detect the pressure change of the melting kettle during the mixing of the conductive filler to determine the gas discharge amount, and draw a discharge amount change curve based on the pressure change of the melting kettle and time to determine the mixing uniformity of the conductive filler;

[0009] Wherein, if the predicted stirring termination time according to the discharge amount change curve is greater than the preset time threshold, the pressure of the melting kettle is adjusted to improve the gas discharge efficiency;

[0010] Step S4, detect the viscosity of the mixed filler mixture, adjust the ratio of tackifying resin and plasticizer, and re-determine the stirring termination time;

[0011] Step S5, continuously stir the mixture in the melting kettle, obtain the corresponding relationship between the component ratio of the adjusted hot melt adhesive and the gas discharge amount, viscosity, and obtain the corresponding stirring and pressure parameters. Based on the correlation analysis, the first adjustment coefficient of the pressure of the melting kettle and the gas discharge amount, and the second adjustment coefficient of the amount of plasticizer and the viscosity are determined;

[0012] Step S6, according to the determined stirring termination time, the preparation of the filler mixture is completed, and the hot melt adhesive meeting the performance requirements is obtained. The hot melt adhesive is filtered and uniformly mixed to remove impurities. The filtered hot melt adhesive is transferred to a molding equipment for shaping to obtain shaped hot melt adhesive particles;

[0013] Wherein, the weight ratio of the basic components of the hot melt adhesive is: 20-30 parts of natural rubber, 20-30 parts of EVA resin, 25-45 parts of tackifying resin, 10-20 parts of plasticizer, 1-3 parts of antioxidant, 1-2 parts of crosslinking agent, and 10-20 parts of conductive filler.

[0014] Further, it further includes step S7:

[0015] According to the first adjustment coefficient, the process parameters in step S2 and / or step S3 are adjusted;

[0016] According to the second adjustment coefficient, the adjustment amount of the ratio of tackifying resin and plasticizer in step S4 is adjusted.

[0017] Further, in step S7, the process parameters in step S3 are adjusted, including:

[0018] Adjusting the amount of adjustment of the vacuum degree of the melting kettle in the step S2 and / or the step S3 according to the first adjustment coefficient.

[0019] Further, the weight ratio of the base component of the conductive filler is:

[0020] 100 parts of silver-plated copper powder, 0.5-1 parts of water, 5-10 parts of ethanol, 0.05-0.1 parts of acetic acid, 0.5-1 parts of organic resin silicon, 1-2 parts of hyperbranched polymer carrier;

[0021] The preparation method of the conductive filler is:

[0022] Mixing the organic silicon resin with acetic acid, water and ethanol according to the ratio to obtain an organic silicon resin treatment agent;

[0023] Coating the silver-plated copper powder with the organic silicon resin to obtain a mixture;

[0024] Coating the mixture with the hyperbranched polymer carrier to obtain the conductive filler.

[0025] Further, in the step S2, the step of adjusting the vacuum degree comprises:

[0026] Obtaining the pressure data of the melting kettle detected by the pressure sensor after a preset time after the addition of the conductive filler;

[0027] Comparing the pressure data with the target pressure value to determine a first difference value;

[0028] Determining the adjustment amount of the vacuum degree according to the first difference value;

[0029] The preset time is 3-10 minutes.

[0030] Further, in the step S3, determining the mixing uniformity of the conductive filler comprises:

[0031] Determining the pressure stabilization time based on the discharge amount change curve;

[0032] Determining the stirring termination time according to the pressure stabilization time and a pre-set pressure maintaining time;

[0033] Comparing the stirring termination time with a pre-set time threshold to determine the mixing uniformity of the conductive filler, wherein,

[0034] If the stirring termination time is greater than the pre-set time threshold, it is determined that the mixing uniformity of the conductive filler is unqualified.

[0035] Further, in the step S3, it further comprises:

[0036] If the predicted stirring termination duration is greater than the preset duration threshold, the pressure of the melting kettle is adjusted according to the stirring termination duration, and the stirring speed of the melting kettle is adjusted;

[0037] The pressure adjustment amount of the melting kettle is in a positive correlation with the stirring termination duration, and the stirring speed of the melting kettle is adjusted to 150 rpm to accelerate the gas discharge.

[0038] Further, in the step S5, the first adjustment coefficient of the pressure of the melting kettle and the gas discharge amount is determined based on the correlation analysis, including:

[0039] The Pearson correlation coefficient of the pressure of the melting kettle and the gas discharge amount is calculated, and is recorded as a first coefficient;

[0040] The average slope of the discharge amount change curve is calculated, and is recorded as a second coefficient;

[0041] The first adjustment coefficient is determined based on the first coefficient and the second coefficient.

[0042] Further, in the step S4, including:

[0043] Based on the comparison of the viscosity sensor detection data and the target viscosity, a second difference value is determined;

[0044] The adjustment amount of the tackifying resin and the plasticizer is determined according to the second difference value.

[0045] Further, in the step S3, further including:

[0046] When determining the stirring termination timing, the electrical conductivity of the filler mixture is verified, and the mixture conductivity is measured by 10 kHz-100 kHz alternating current to obtain a current conductivity detection value;

[0047] If the current conductivity detection value is less than a preset conductivity threshold, it is determined to increase the filler amount and continue to stir and mix.

[0048] When verifying the electrical conductivity of the filler mixture, if the conductivity fluctuation is greater than 15% for 5 consecutive minutes, it is determined to trigger the adjustment of the stirring speed to 150 rpm.

[0049] Compared with the prior art, the beneficial effects of the present application are that the Internet of Things intelligent control technology is used to solve the problems of high artificial dependence and low process transparency in the traditional hot melt adhesive production method; multiple quality detection links are set in the production process for timely adjustment; and the obtained adjustment coefficient is applied to the next production, effectively improving the production efficiency.

[0050] Further, by accurately controlling the stirring duration of the hot melt adhesive raw materials, the dispersion uniformity of the conductive filler is effectively improved, and the electrical conductivity of the hot melt adhesive is improved.

[0051] Further, the material in the conductive filler is optimized, wherein the conductive metal powder adopts silver-plated copper powder which has better conductive performance and low cost; the shell material adopts hyperbranched polymer, which can significantly increase the amount of filler without significantly affecting the viscosity of the hot melt adhesive.

[0052] Further, the present application uses natural materials to replace the chemical raw materials used in traditional hot melt adhesives, significantly reduces environmental impact, and promotes the industry towards sustainable development. BRIEF DESCRIPTION OF DRAWINGS

[0053] Figure 1 is the logic diagram of the hot melt adhesive intelligent preparation method based on the Internet of Things of the present application;

[0054] Figure 2 is the flow chart of the hot melt adhesive intelligent preparation method based on the Internet of Things of the present application;

[0055] Figure 3 is the logic diagram of the pressure adjustment of the melting kettle in steps S2 and S3 of the present application;

[0056] Figure 4 is the logic diagram of the adjustment of the hot melt adhesive production parameters in step S7 of the present application. DETAILED DESCRIPTION

[0057] In order to make the purpose and advantages of the present application more clear and explicit, the present application will be further described below in combination with examples; it should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0058] The preferred embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application, and are not used to limit the protection scope of the present application.

[0059] It should be noted that in the description of the present application, the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicate the direction or positional relationship of the terms based on the direction or positional relationship shown in the drawings, which is only for the convenience of description, and does not indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0060] Moreover, it needs to be explained that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0061] Please refer to Figure 1 As shown in the figure, it is a logic diagram of the intelligent preparation method of hot melt adhesive based on Internet of Things, the embodiment provides an intelligent preparation method of hot melt adhesive based on Internet of Things, as a preferred embodiment of the present application, the weight ratio of the basic components of the hot melt adhesive is:

[0062] 20-30 parts of natural rubber, 20-30 parts of EVA resin, 25-45 parts of tackifying resin, 10-20 parts of plasticizer, 1-3 parts of antioxidant, 1-2 parts of crosslinking agent, 10-20 parts of conductive filler;

[0063] In the embodiment, the natural rubber is preferably selected from 3L rubber with a Mooney viscosity of 50-80, CV rubber and white crinkled rubber; the EVA resin is preferably selected from EVA resin with a VA content of 20%-28%; the tackifying resin is preferably selected from any one of pitch resin or rosin; the plasticizer is preferably selected from epoxy soybean oil plasticizer; the antioxidant is preferably selected from Irganox 1010 combined with Irgafos 168; and the crosslinking agent is preferably selected from dicumyl peroxide crosslinking agent.

[0064] The intelligent preparation method of hot melt adhesive provided in the embodiment comprises:

[0065] Step S1, adding the raw materials except the conductive filler in the ratio of the hot melt adhesive into a melting kettle with stirring and heating functions;

[0066] Step S2, gradually heating to 160-180℃ to melt the solid components into a homogeneous liquid, stirring until mixed evenly, presetting the stirring speed to 50-100 rpm, adding the conductive filler, and detecting the pressure parameter of the melting kettle after adding the conductive filler, if the pressure parameter exceeds the preset pressure threshold, adjusting the vacuum degree of the melting kettle;

[0067] Step S3, continuously detecting the pressure change of the melting kettle in the mixing process of the conductive filler to determine the gas discharge amount, and drawing a discharge amount change curve based on the pressure change and time of the melting kettle to determine the mixing uniformity of the conductive filler;

[0068] If the stirring termination time predicted according to the discharge amount change curve is greater than a preset time threshold, it is determined to adjust the pressure of the melting kettle to improve the gas discharge efficiency.

[0069] In step S4, the viscosity of the mixed filler mixture is detected, the ratio of tackifying resin and plasticizer is adjusted, and the stirring termination time is re-determined.

[0070] In step S5, the mixture in the melting kettle is continuously stirred, the component ratio of the adjusted hot melt adhesive, the corresponding gas discharge amount, and the viscosity are obtained, and the corresponding stirring and pressure parameters are obtained. Based on the correlation analysis, the first adjustment coefficient of the pressure of the melting kettle and the gas discharge amount, and the second adjustment coefficient of the amount of plasticizer and the viscosity are determined.

[0071] In step S6, the preparation of the filler mixture is completed according to the determined stirring termination time, and the hot melt adhesive meeting the performance requirements is obtained. The hot melt adhesive is filtered and uniformly mixed to remove impurities, and the filtered hot melt adhesive is transferred to a molding equipment for shaping to obtain shaped hot melt adhesive particles.

[0072] In this embodiment, the intelligent preparation method of the hot melt adhesive further includes step S7:

[0073] According to the first adjustment coefficient, the process parameters in steps S2 and / or S3 are continuously adjusted.

[0074] According to the second adjustment coefficient, the adjustment amount of the ratio of tackifying resin and plasticizer in step S4 is continuously adjusted.

[0075] Specifically, in step S7, the process parameters in step S3 are adjusted, including:

[0076] According to the first adjustment coefficient, the adjustment amount of the vacuum degree of the melting kettle in steps S2 and / or S3 is adjusted.

[0077] Specifically, the weight ratio of the basic components of the conductive filler is:

[0078] 100 parts of silver-plated copper powder, 0.5-1 parts of water, 5-10 parts of ethanol, 0.05-0.1 parts of acetic acid, 0.5-1 parts of organic resin silicon, and 1-2 parts of hyperbranched polymer carrier.

[0079] The organic resin silicon is preferably polysiloxane, and the hyperbranched polymer carrier is preferably a hyperbranched polycaprolactone with a branched end of hydroxyl.

[0080] The preparation method of the conductive filler is:

[0081] Mix the silicone resin with acetic acid, water and ethanol according to the ratio to obtain a silicone resin treatment agent;

[0082] Coat the silver-plated copper powder with the silicone resin to obtain a mixture;

[0083] Coat the mixture with the hyperbranched polymer carrier to obtain a conductive filler.

[0084] Specifically, in the step S2, the step of adjusting the vacuum degree comprises:

[0085] Obtain the pressure data of the melting kettle detected by the pressure sensor after the conductive filler is added for a preset time length;

[0086] Compare the pressure sensor detection data with the target pressure value to determine a first difference value;

[0087] Determine the adjustment amount of the vacuum degree according to the first difference value.

[0088] The preset time length is 3-10 minutes.

[0089] Specifically, in the step S3, determining the mixing uniformity of the conductive filler comprises:

[0090] Determine the pressure stabilization time based on the discharge amount change curve;

[0091] Determine the stirring termination time length according to the pressure stabilization time and a pre-set pressure maintaining time length;

[0092] Compare the stirring termination time length with a preset time length threshold to determine the mixing uniformity of the conductive filler, wherein if the stirring termination time length is greater than the preset time length threshold, it is determined that the mixing uniformity of the conductive filler is unqualified.

[0093] Specifically, in the step S3, it further comprises:

[0094] If the predicted stirring termination time length is greater than the preset time length threshold, adjust the pressure of the melting kettle according to the stirring termination time length and adjust the stirring speed of the melting kettle;

[0095] The pressure adjustment amount of the melting kettle and the stirring termination time length are in a positive correlation, and the stirring speed of the melting kettle is adjusted to 150 rpm to accelerate the gas discharge.

[0096] Specifically, in the step S5, the first adjustment coefficient of the pressure of the melting kettle and the gas discharge amount is determined based on the correlation analysis, comprising:

[0097] Calculate the Pearson correlation coefficient of the pressure of the melting kettle and the gas discharge amount, denoted as the first coefficient;

[0098] calculating an average slope of the discharge amount change curve, denoted as a second coefficient;

[0099] determining the first adjustment coefficient based on the first coefficient and the second coefficient.

[0100] Specifically, in the step S4, comprising:

[0101] determining a second difference value based on the comparison between the viscosity sensor detection data and the target viscosity;

[0102] determining the adjustment amount of the tackifying resin and the plasticizer according to the second difference value.

[0103] Specifically, in the step S3, further comprising:

[0104] When determining the stirring termination opportunity, verifying the electrical conductivity of the filler mixture, measuring the electrical conductivity of the mixture at 10 kHz-100 kHz alternating current to obtain a current electrical conductivity detection value;

[0105] If the current electrical conductivity detection value is less than a preset electrical conductivity threshold value, it is determined to increase the amount of filler and continue to stir and mix.

[0106] When verifying the electrical conductivity of the filler mixture, if the electrical conductivity fluctuation is >15% for 5 consecutive minutes, it is determined to trigger the adjustment of the stirring speed to 150 rpm.

[0107] Embodiment 1:

[0108] The preparation method of the conductive filler is:

[0109] Step S0, mixing 0.5 kg of polysiloxane, 0.5 kg of water, 5 kg of ethanol, and 0.05 kg of acetic acid to obtain a silicone-based treatment agent, uniformly spraying the silicone-based treatment agent on the surface of the silver-coated copper powder to obtain a mixture, and then coating the mixture with 1 kg of hyperbranched polycaprolactone with a branched end of hydroxyl group to obtain a conductive filler.

[0110] The intelligent preparation method of the hot melt adhesive comprises:

[0111] Step S1, mixing 20 kg of 3L rubber with a Mooney viscosity of 50, 20 kg of EVA resin with a VA content of 20%, 25 kg of styrene resin, 10 kg of epoxy soybean oil plasticizer, 1 kg of Irganox 1010 (40%) mixed with Irgafos 168 (60%), and 1 kg of dicumyl peroxide crosslinking agent into a melting kettle with stirring and heating functions.

[0112] Step S2, gradually heating to 160°C, stirring at a speed of 50 rpm, melting the solid components into a homogeneous liquid, and then stirring until the mixture is uniform, adding 15 kg of conductive filler, and monitoring the pressure parameter in real time through a pressure sensor.

[0113] Step S3, when the pressure of the melting kettle no longer changes with time within the preset pressure maintaining duration, the conductivity of the mixture is measured by 10 kHz alternating current.

[0114] wherein the preset stirring duration is 1 h, if the predicted stirring termination duration is greater than 1 h, the pressure is adjusted to -0.1 MPa, and the stirring speed of the melting kettle is adjusted to 150 rpm.

[0115] Step S4, the viscosity of the filler mixture is detected, after the viscosity is qualified, the filler mixture is degassed by continuing to stir for 30 min, and the preparation of the filler mixture is completed by terminating the stirring.

[0116] Step S5, the corresponding relationship between the adjusted component ratio of the hot melt adhesive and the corresponding gas discharge amount, viscosity, and the corresponding stirring and pressure parameters are obtained, and the first adjustment coefficient of the pressure of the melting kettle and the gas discharge amount is determined based on the correlation analysis, comprising:

[0117] calculating the Pearson correlation coefficient of the pressure of the melting kettle and the gas discharge amount, denoted as the first coefficient;

[0118] calculating the average slope of the discharge amount change curve, denoted as the second coefficient;

[0119] determining the first adjustment coefficient based on the first coefficient and the second coefficient.

[0120] and the second adjustment coefficient of the amount of plasticizer and the viscosity;

[0121] Step S6, the molten adhesive is filtered and uniformly mixed to remove impurities, and the filtered molten adhesive is transferred to a molding equipment for shaping to obtain shaped hot melt adhesive particles.

[0122] Step S7, using the optimized first adjustment coefficient, continuously adjusting the process parameters in steps S2 and / or S3; using the optimized second adjustment coefficient, continuously adjusting the adjustment amount of the ratio of tackifying resin and plasticizer in step S4.

[0123] Example 2:

[0124] The difference between this embodiment and example 1 is that only the weight ratio of the basic components of the hot melt adhesive in example 1 is changed: 30 kg of 3L rubber with a Mooney viscosity of 50, 30 kg of EVA resin with a VA content of 20%, 45 kg of styrene resin, 20 kg of epoxy soybean oil plasticizer, 3 kg of Irganox 1010 (40%) mixed with Irgafos 168 (60%), and 2 kg of dicumyl peroxide crosslinking agent; the rest is the same as example 1.

[0125] Example 3

[0126] The difference between this embodiment and Example 1 is that the weight ratio of the base components of the hot melt adhesive in Example 1 is changed in this embodiment: 25 kg of 3L rubber with a Mooney viscosity of 50, 25 kg of EVA resin with a VA content of 20%, 35 kg of styrene resin, 15 kg of epoxy soybean oil plasticizer, 2 kg of Irganox 1010 (40%) mixed with Irgafos 168 (60%), 1.5 kg of dicumyl peroxide crosslinking agent; the rest is the same as Example 1.

[0127] Example 4

[0128] The difference between this embodiment and Example 3 is that the amount of conductive filler in Example 3 is changed to 10 kg in this embodiment; the rest is the same as Example 3.

[0129] Example 5

[0130] The difference between this embodiment and Example 1 is that the amount of conductive filler in Example 3 is changed to 20 kg in this embodiment; the rest is the same as Example 3.

[0131] Comparative Example 1 is a common hot melt adhesive produced by a certain company, and Comparative Example 2 is a conductive hot melt adhesive produced by a certain company.

[0132] Table 1 Weight ratio of base components of hot melt adhesive in Examples 1-4

[0133]

[0134]

[0135] Table 2 Performance test results of hot melt adhesive

[0136]

[0137] As can be seen from the above Table 2, the conductive hot melt adhesive produced by the present application significantly reduces the resistivity while maintaining the viscosity without increasing, and performs well.

[0138] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings, but those skilled in the art can easily understand that the protection scope of the present application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to related technical features without deviating from the principles of the present application, and the technical solutions after these changes or replacements will fall within the protection scope of the present application.

Claims

1. A smart preparation method for hot melt adhesive based on the Internet of Things, characterized in that, include: Step S1: Add all raw materials except conductive fillers to the hot melt adhesive formulation into a melting vessel equipped with stirring and heating functions; Step S2: Gradually increase the temperature to 160℃-180℃ to melt the solid components into a homogeneous liquid. Stir until the mixture is uniform. The preset stirring speed is 50-100 rpm. Add conductive filler and detect the pressure parameters of the melting vessel after the addition of the conductive filler. If the pressure parameters exceed the preset pressure threshold, adjust the vacuum degree of the melting vessel. Step S3: Continuously monitor the pressure change in the melting vessel during the mixing process of the conductive filler to determine the gas discharge rate. Plot the discharge rate change curve based on the pressure change in the melting vessel and time to determine the mixing uniformity of the conductive filler. If the stirring termination time predicted based on the discharge rate change curve is greater than a preset time threshold, it is determined that the pressure of the melting vessel should be adjusted to improve the gas discharge efficiency. Step S4: Detect the viscosity of the mixed filler mixture, determine the adjustment ratio of tackifying resin and plasticizer, and redetermine the timing for stopping stirring. Step S5: Continuously stir the mixture in the melting vessel, obtain the relationship between the adjusted composition ratio of the hot melt adhesive and the corresponding gas discharge rate and viscosity, and obtain the corresponding stirring and pressure parameters. Based on the correlation analysis, determine the first adjustment coefficient of the pressure and gas discharge rate of the melting vessel, and the second adjustment coefficient of the plasticizer dosage and viscosity. Step S6: According to the determined stirring termination time, complete the preparation of the filler mixture to obtain a molten colloid that meets the performance requirements. Filter and mix the molten colloid to remove impurities. Transfer the filtered molten colloid to the molding equipment for shaping to obtain shaped hot melt adhesive granules. The basic components of the hot melt adhesive are in the following weight ratios: 20-30 parts natural rubber, 20-30 parts EVA resin, 25-45 parts tackifying resin, 10-20 parts plasticizer, 1-3 parts antioxidant, 1-2 parts crosslinking agent, and 10-20 parts conductive filler.

2. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 1, characterized in that, It also includes step S7, The process parameters in step S2 and / or step S3 are adjusted according to the first adjustment coefficient. The adjustment amount for adjusting the ratio of tackifying resin and plasticizer in step S4 is determined according to the second adjustment coefficient.

3. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 2, characterized in that, In step S7, the process parameters in step S3 are adjusted, including: The adjustment amount of the vacuum degree of the melting vessel in step S2 and / or step S3 is adjusted according to the first adjustment coefficient.

4. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 1, characterized in that, The basic component weight ratio of the conductive filler is: 100 parts silver-plated copper powder, 0.5-1 part water, 5-10 parts ethanol, 0.05-0.1 parts acetic acid, 0.5-1 part organic resin silicone, 1-2 parts hyperbranched polymer carrier; The method for preparing the conductive filler is as follows: The organosilicon resin is mixed with acetic acid, water and ethanol in a certain proportion to obtain an organosilicon resin treatment agent. The silver-plated copper powder was coated with silicone resin to obtain a mixture; The mixture is coated with a hyperbranched polymer carrier to obtain a conductive filler.

5. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 1, characterized in that, In step S2, the step of adjusting the vacuum level includes: The pressure data of the melting vessel detected by the pressure sensor is obtained after a preset time after the addition of conductive filler; The pressure data is compared with the target pressure value to determine the first difference; The adjustment amount of the vacuum degree is determined based on the first difference; The preset duration is 3 to 10 minutes.

6. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 5, characterized in that, In step S3, determining the uniformity of the conductive filler mixture includes: The timing of pressure stabilization is determined based on the discharge rate change curve. The stirring termination time is determined based on the pressure stabilization time and the preset pressure holding time. The mixing uniformity of the conductive filler is determined by comparing the stirring termination time with a preset time threshold. If the stirring termination time is longer than the preset time threshold, the mixing uniformity of the conductive filler is determined to be unqualified.

7. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 6, characterized in that, Step S3 further includes: If the predicted stirring termination time exceeds the preset time threshold, the pressure of the melting vessel is adjusted according to the stirring termination time, and the stirring speed of the melting vessel is also adjusted. The pressure adjustment of the melting vessel is positively correlated with the duration of stirring termination. The stirring speed of the melting vessel is adjusted to 150 rpm to accelerate gas discharge.

8. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 7, characterized in that, In step S5, the first adjustment coefficient for the pressure and gas discharge rate of the melting vessel is determined based on correlation analysis, including: Calculate the Pearson correlation coefficient between the pressure in the melting vessel and the gas discharge rate, and denote it as the first coefficient; Calculate the average slope of the discharge change curve and denote it as the second coefficient; The first adjustment coefficient is determined based on the first coefficient and the second coefficient.

9. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 8, characterized in that, Step S4 includes: A second difference is determined by comparing the viscosity sensor data with the target viscosity. The adjustment amounts of the tackifying resin and plasticizer are determined based on the second difference.

10. The intelligent preparation method for hot melt adhesive based on the Internet of Things according to claim 9, characterized in that, Step S3 further includes: When determining the timing of stopping the stirring, the conductivity of the filler mixture is verified by measuring the conductivity of the mixture with AC current of 10kHz-100kHz to obtain the current conductivity detection value. If the current conductivity detection value is less than the preset conductivity threshold, it is determined that the amount of filler should be increased and the mixing should continue. When verifying the conductivity of the filler mixture, if the conductivity fluctuation is greater than 15% for 5 consecutive minutes, it is determined that the stirring speed should be adjusted to 150 rpm.

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