Laser processing method, controller, laser processing equipment and circuit board

Abstract

The invention is suitable for the technical field of laser processing, and provides a laser processing method, a controller, laser processing equipment and a circuit board. The laser processing method comprises the steps that an initial processing graph corresponding to a target processing structure on a workpiece to be processed is obtained, and the size of the initial processing graph in any linear direction exceeds the laser scanning range of an acousto-optic deflector; according to the laser scanning range of the acousto-optic deflector, the initial processing graph is partitioned and corrected, a plurality of sub-processing graphs are obtained, each sub-processing graph comprises a target laser scanning path, and the size of each sub-processing graph in each linear direction is within the laser scanning range of the acousto-optic deflector; and according to the target laser scanning path in each sub-processing graph, controlling an acousto-optic deflector to deflect the laser beam so as to sequentially process each sub-processing graph on the to-be-processed workpiece to obtain a target processing structure. According to the embodiment of the invention, the laser processing efficiency can be improved.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and particularly relates to a laser processing method, controller, laser processing equipment and circuit board. Background Technology

[0002] In the field of electronics manufacturing, especially in the processing of circuit boards, large-scale structures are often required on workpieces due to considerations such as structural design, electrical connections, or heat dissipation. Examples include drilling large holes and machining large blind slots. Laser processing requires controlling the relative displacement between the laser beam and the workpiece to create specific morphological structures. Related technologies typically use galvanometers to control the deflection of the laser beam; however, the slow deflection speed of galvanometers leads to low efficiency in laser processing. Summary of the Invention

[0003] This application provides a laser processing method, controller, laser processing equipment, and circuit board, which can improve the efficiency of laser processing.

[0004] The first aspect of this application provides a laser processing method, comprising: acquiring an initial processing pattern corresponding to a target processing structure on a workpiece to be processed, wherein the size of the initial processing pattern in any linear direction exceeds the laser scanning range of an acousto-optic deflector (AOD); partitioning and correcting the initial processing pattern according to the laser scanning range of the AOD to obtain multiple sub-processing patterns, each sub-processing pattern containing a target laser scanning path, and the size of each sub-processing pattern in each linear direction being within the laser scanning range of the AOD; and controlling the AOD to deflect a laser beam according to the target laser scanning path in each sub-processing pattern, so as to sequentially process each sub-processing pattern on the workpiece to be processed to obtain the target processing structure.

[0005] In some embodiments of the first aspect, the initial processing pattern includes an initial laser scanning path; the step of partitioning and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns includes: partitioning the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns; and correcting the initial laser scanning path within each sub-processing pattern to obtain a target laser scanning path within each sub-processing pattern.

[0006] In some embodiments of the first aspect, the step of modifying the initial laser scanning path within each sub-processing pattern to obtain a target laser scanning path within each sub-processing pattern includes: scaling down the starting position of the initial laser scanning path within the sub-processing pattern according to the spot parameters of the laser beam to obtain the starting position of the target laser scanning path; and / or scaling down the ending position of the initial laser scanning path within the sub-processing pattern to obtain the ending position of the target laser scanning path; wherein the scaling down is used to control the laser energy density in the interval region between adjacent target laser scanning paths along the path direction.

[0007] In some embodiments of the first aspect, obtaining the initial processing pattern corresponding to the target processing structure on the surface of the workpiece to be processed includes: obtaining the projected outer contour of the target processing structure on the surface of the workpiece to be processed; filling the path within the projected outer contour to obtain a first laser scanning path; and correcting the path parameters of the first laser scanning path to obtain a second laser scanning path, thereby obtaining the initial processing pattern. The path parameters include at least one of the following: path line width, starting position, ending position, and distance between the laser scanning path and the projected outer contour.

[0008] In some embodiments of the first aspect, before partitioning and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method further includes: when processing any target processing structure, establishing a target coordinate system of the acousto-optic deflector based on the position of the target processing structure; the step of partitioning and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns includes: partitioning and correcting the initial processing pattern along the coordinate axis direction of the target coordinate system according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns.

[0009] In some embodiments of the first aspect, any side of the smallest bounding rectangle of the projected outer contour of the initial processed pattern coincides with one coordinate axis of the target coordinate system; the initial processed pattern is partitioned along the coordinate axis direction of the target coordinate system according to the laser scanning range of the acousto-optic deflector, including: arranging the laser scanning range of the acousto-optic deflector in an array along the coordinate axis direction of the target coordinate system, and partitioning the initial processed pattern according to the laser scanning range arranged in the target coordinate system.

[0010] In some embodiments of the first aspect, before partitioning and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method further includes: determining whether the size of the initial processing pattern in each linear direction exceeds the laser scanning range of the acousto-optic deflector; partitioning and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns includes: if the size of the initial processing pattern in any linear direction exceeds the laser scanning range of the acousto-optic deflector, then partitioning and correcting the initial processing pattern to obtain multiple sub-processing patterns.

[0011] In some embodiments of the first aspect, controlling the acousto-optic deflector to deflect the laser beam according to the target laser scanning path within each of the sub-processing patterns, so as to sequentially process each of the sub-processing patterns on the workpiece to obtain the target processed structure, includes: adjusting the deflection state of the laser beam by a first beam deflection mechanism so that the laser beam is located at a preset position, the preset position being within the laser scanning range of the acousto-optic deflector where any of the sub-processing patterns is located; the first beam deflection mechanism controlling the laser beam deflection speed to be less than the acousto-optic deflector controlling the laser beam deflection speed; controlling the acousto-optic deflector to deflect the laser beam according to the target laser scanning path within the sub-processing pattern, so that the laser beam emitted sequentially through the acousto-optic deflector and the first beam deflection mechanism is within the range of the sub-processing pattern, so as to sequentially process each of the sub-processing patterns on the workpiece to obtain the target processed structure.

[0012] In some embodiments of the first aspect, the first beam deflection mechanism includes a galvanometer.

[0013] A second aspect of this application provides a controller, including a memory, a processor, and a computer program stored in the memory and executable on the processor; the processor executes the computer program to implement the steps of the laser processing method described above.

[0014] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the laser processing method described above.

[0015] The fourth aspect of this application provides a computer program product that, when run, causes the laser processing method described above to be executed.

[0016] The fifth aspect of this application provides a laser processing apparatus, comprising: a laser for emitting a laser beam; a beam control system including an acousto-optic deflector for transmitting, controlling, and deflecting the laser beam; a processing platform for carrying a workpiece to be processed; and a controller for controlling the laser, the beam control system, and the processing platform to work together to achieve the laser processing method as described in any one of the first aspects.

[0017] In some embodiments of the fifth aspect, the beam deflection mechanism further includes a first beam deflection mechanism, which includes a galvanometer.

[0018] A sixth aspect of this application provides a circuit board, which is processed according to the method described in any one of the first aspects or based on the laser processing equipment described in any one of the fifth aspects. In the embodiments of this application, by obtaining the initial processing pattern corresponding to the target processing structure on the workpiece to be processed, the initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns. According to the target laser scanning path within each sub-processing pattern, the acousto-optic deflector is controlled to deflect the laser beam so that each sub-processing pattern is processed sequentially on the workpiece to be processed to obtain the target processing structure. Through partitioning and correction, the dimensions of each sub-processing pattern in each linear direction are within the laser scanning range of the acousto-optic deflector, avoiding the laser processing process being limited by the laser scanning range of the acousto-optic deflector. This supports the continuous processing of different sub-processing patterns by the acousto-optic deflector to cover a large initial processing pattern. Furthermore, the speed at which the acousto-optic polarizer controls the laser beam deflection is much higher than the speed at which the galvanometer controls the laser beam deflection, thus improving the laser processing efficiency.

[0019] In addition, the deflection accuracy of the acousto-optic polarizer is higher than that of the galvanometer, thus improving the machining accuracy of the target structure. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram illustrating the implementation process of a laser processing method provided in an embodiment of this application; Figure 2 This is a schematic diagram of the initial processing pattern provided in the embodiments of this application; Figure 3 This is a schematic diagram illustrating the specific implementation process of obtaining the initial processing graphic provided in the embodiments of this application; Figure 4 This is a schematic diagram of path line width adjustment provided in an embodiment of this application; Figure 5 This is a schematic diagram of the overlapping area of ​​the light spots provided in the embodiments of this application; Figure 6 This is a schematic diagram of the modified path parameters provided in the embodiments of this application; Figure 7 This is a schematic diagram illustrating the specific implementation process of partitioning and correction provided in the embodiments of this application; Figure 8 This is a schematic diagram of the partitioning and modification provided in the embodiments of this application; Figure 9 This is a schematic diagram of the target coordinate system provided in the embodiments of this application; Figure 10 This is a schematic diagram showing that there is overlap between the various sub-processing graphics provided in the embodiments of this application; Figure 11 This is a schematic diagram of the processing area provided in the embodiments of this application; Figure 12 This is a schematic diagram of the structure of a controller provided in an embodiment of this application; Figure 13 This is a schematic diagram of another laser processing device provided in the embodiments of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are protected by this application.

[0023] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0024] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0026] In the field of electronics manufacturing, especially in the processing of circuit boards, large-scale structures are often required on workpieces due to considerations such as structural design, electrical connections, or heat dissipation. Examples include drilling large holes and machining large blind slots. Laser processing requires controlling the relative displacement between the laser beam and the workpiece to create specific morphological structures. Related technologies typically use galvanometers to control the deflection of the laser beam; however, the slow deflection speed of galvanometers leads to low efficiency in laser processing.

[0027] In view of this, this application proposes a laser processing method that, through partitioning and correction, ensures that the dimensions of each sub-processed pattern in each linear direction are within the laser scanning range of the acousto-optic deflector. This avoids the laser processing process being limited by the laser scanning range of the acousto-optic deflector, thereby supporting the continuous processing of different sub-processed patterns through the acousto-optic deflector to cover the initial processing pattern of a large-size processing structure. The method effectively utilizes the acousto-optic polarizer to control the laser beam deflection speed, which is much higher than the speed of the laser beam deflection controlled by the galvanometer, thus improving the laser processing efficiency.

[0028] To illustrate the technical solution of this application, specific embodiments are described below.

[0029] Figure 1 A schematic diagram illustrating the implementation flow of a laser processing method provided in an embodiment of this application is shown. This method can be applied to a controller. The controller can be installed on a laser processing device.

[0030] Specifically, the above-mentioned laser processing method may include the following steps S101 to S103.

[0031] Step S101: Obtain the initial machining pattern corresponding to the target machining structure on the workpiece to be machined.

[0032] The workpiece to be processed refers to the workpiece that needs to be laser-processed, including but not limited to circuit boards, sheet metal, and mechanical parts. The target processing structure is the structure to be processed on the workpiece to be processed, which can be determined according to processing requirements. For example, when the workpiece to be processed is a circuit board, the target processing structure may include but is not limited to holes and blind slots.

[0033] In laser processing, a laser typically etches along the depth direction from the surface of the workpiece to form the corresponding processed structure. The initial processing pattern corresponding to the target processed structure on the workpiece may include the projected outer contour formed by the target processed structure projected along the depth direction onto the surface of the workpiece, and the laser scanning path inside the outer contour. The laser scanning path is the processing path when the laser beam scans. In the embodiments of this application, the initial processing pattern may reflect the laser coverage area of ​​the laser beam on the workpiece during processing. The initial processing pattern can be determined according to the processing requirements of the workpiece (i.e., the requirement to form the target processed structure).

[0034] In embodiments of this application, the initial processed pattern has a size that exceeds the laser scanning range of the acousto-optic deflector in any linear direction.

[0035] In this context, the linear direction refers to any direction on the plane of the workpiece to be processed, which may include, but is not limited to, the length and width directions. The laser scanning range of the acousto-optic deflector refers to the area covered by the acousto-optic deflector when it deflects the laser beam while the acousto-optic deflector is relatively fixed to the workpiece. The laser scanning range of the acousto-optic deflector is determined by the operating parameters of the internal components of the laser processing equipment. These operating parameters may include, but are not limited to, the laser beam wavelength of the light source, the radio frequency bandwidth of the acousto-optic crystal of the acousto-optic deflector, and the velocity of sound.

[0036] In other words, the initial processed pattern's dimension in any linear direction exceeds the acousto-optic deflector's dimension in the corresponding linear direction. For example, Figure 2 In the figure, (a) shows a schematic diagram of an initial processing pattern, where each dashed box represents the laser scanning range of the acousto-optic deflector. At this point, the initial processing pattern exceeds the laser scanning range of the acousto-optic deflector in both the length and width directions. Figure 2 In the diagram, (b) shows a schematic diagram of another initial processing pattern, in which the initial processing pattern extends beyond the laser scanning range of the acousto-optic deflector only in the length direction.

[0037] Step S102: Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned and corrected to obtain multiple sub-processing patterns.

[0038] Combination Figure 2As can be seen in the embodiments of this application, when the size of the initial processing pattern exceeds the laser scanning range of the acousto-optic deflector in any linear direction, if the relative position of the workpiece and the acousto-optic deflector is fixed, the laser scanning range of the acousto-optic deflector when deflecting the laser beam cannot cover the complete pattern of the initial processing pattern. To meet the requirements of laser processing, the initial processing pattern can be partitioned according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, ensuring that the size of each sub-processing pattern in each linear direction is within the laser scanning range of the acousto-optic deflector. By correcting the laser scanning path originally covered within each sub-processing pattern, the target laser scanning path within the sub-processing pattern can be obtained. The target laser scanning path contained within each sub-processing pattern is the processing path of the laser beam scanning within the sub-processing pattern.

[0039] Step S103: According to the target laser scanning path within each sub-processing pattern, control the acousto-optic deflector to deflect the laser beam so as to process each sub-processing pattern sequentially on the workpiece to be processed, thereby obtaining the target processing structure.

[0040] Specifically, based on the target laser scanning path within the first sub-processing pattern, the acousto-optic deflector is controlled to deflect the laser beam to perform laser processing on the first sub-processing pattern. After completing the laser processing of the first sub-processing pattern, based on the target laser scanning path within the second sub-processing pattern, the acousto-optic deflector is controlled to deflect the laser beam to perform laser processing on the second sub-processing pattern, and so on, until the laser processing of each sub-processing pattern is completed. At this point, the structure formed by splicing the laser processing results of each sub-processing pattern together is the target processing structure.

[0041] It should be noted that this application does not impose any restrictions on the processing order of the sub-processing graphics. For example, the sub-processing graphics can be processed sequentially from left to right and from bottom to top.

[0042] In the embodiments of this application, by obtaining the initial processing pattern corresponding to the target processing structure on the workpiece to be processed, the initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns. According to the target laser scanning path within each sub-processing pattern, the acousto-optic deflector is controlled to deflect the laser beam so that each sub-processing pattern is processed sequentially on the workpiece to be processed to obtain the target processing structure. Through partitioning and correction, the dimensions of each sub-processing pattern in each linear direction are within the laser scanning range of the acousto-optic deflector, avoiding the laser processing process being limited by the laser scanning range of the acousto-optic deflector. This supports the continuous processing of different sub-processing patterns by the acousto-optic deflector to cover a large initial processing pattern. Furthermore, the speed at which the acousto-optic polarizer controls the laser beam deflection is much higher than the speed at which the galvanometer controls the laser beam deflection, thus improving the laser processing efficiency.

[0043] In addition, the deflection accuracy of the acousto-optic polarizer is higher than that of the galvanometer, thus improving the machining accuracy of the target structure.

[0044] In some embodiments of this application, such as Figure 3 As shown, obtaining the initial machining pattern corresponding to the target machining structure on the workpiece to be machined may include steps S301 to S302.

[0045] Step S301: Obtain the projected outer contour of the target machining structure on the surface of the workpiece to be machined.

[0046] In the embodiments of this application, the projected outer contour is the outer contour line of the target machining structure projected onto the surface of the workpiece to be machined.

[0047] In some embodiments, the projected outer contour can be obtained based on information about the target processing structure, for example, by providing boundary information of the target processing structure and obtaining the projected outer contour from the boundary information; in other embodiments, the projected outer contour can also be obtained through image capture and contour recognition. This application does not limit the method of obtaining the projected outer contour.

[0048] Step S302: Fill the path within the projected outer contour to obtain the first laser scanning path.

[0049] After obtaining the projected outer contour, a path planning algorithm can be used to fill the path within the projected outer contour, resulting in the first laser scanning path within the projected outer contour. The first laser scanning path is a global path that covers the projected outer contour.

[0050] It should be noted that the path planning algorithms here include, but are not limited to, path filling and contour offset filling, which can be selected according to the processing requirements.

[0051] At this point, the first laser scanning path and the projected outer contour can form the initial processing pattern.

[0052] Considering that the distribution of laser energy density of the laser beam is not an ideal flat-top shape, but has the characteristics of being strong in the middle and weak at both sides, and that the process of obtaining the first laser scanning path through the path planning algorithm usually does not take into account the shape of the laser beam, the spacing control between adjacent first laser scanning paths and the spacing control between the first laser scanning path and the projected outer contour are not precise enough, which in turn affects the processing accuracy.

[0053] Therefore, after step S302, step S303 may also be included: modifying the path parameters of the first laser scanning path to obtain the second laser scanning path, so as to obtain the initial processing pattern.

[0054] The path parameters may include at least one of the following: path line width, starting position, ending position, and distance between the laser scanning path and the projected outer contour.

[0055] In some embodiments of this application, the path parameters of the first laser scanning path can be modified based on the spot parameters of the laser beam.

[0056] Specifically, the aforementioned spot parameters can include one or more combinations of spot diameter, spot width, spot area, and spot energy density distribution. The spot diameter of the laser beam is the diameter of the laser spot acting on the processing position of the workpiece after the laser beam has been transmitted, controlled, and deflected by the beam control system. It is understood that the laser spot is usually circular, but it can be controlled to other shapes as needed; in this case, the spot diameter can refer to the length of the laser spot along the laser beam deflection direction. Correspondingly, the spot width is the dimension of the spot perpendicular to the beam deflection direction.

[0057] For example, regarding path line width, please refer to... Figure 4 The closed curve S represents the projected outer contour of the target processing structure on the surface of the workpiece. By filling the projected outer contour with a path, the first laser scanning path shown by line 41 can be obtained. The path width is the distance between two adjacent first laser scanning paths. Since the energy density distribution of the laser spot usually has the characteristic of being strong in the middle and weak at the edges, the path width is adjusted according to the laser beam spot diameter to make the laser spots on the two adjacent first laser scanning paths have a certain overlap rate, resulting in a new laser scanning path 42. The size of the overlapping area between the two adjacent laser scanning paths 42 can be adjusted according to the processing needs and the energy density distribution of the laser spot, thereby controlling the laser energy density of the overlapping area. Since this overlapping area is located at the edge of the laser spot, the laser energy density at the edge of the laser spot can be made to be basically the same as the laser energy density in the middle area of ​​the laser spot, thereby improving the flatness of the bottom wall morphology of the target processing structure.

[0058] For more details, please refer to Figure 5 , Figure 5 Two adjacent laser scanning paths 42 in the vertical direction along the path direction are shown. The gray circle and the white circle represent the laser spot when the laser beam passes through these two laser scanning paths 42, respectively. It can be seen that the overlapping area between the two laser spots is located at the edge area of ​​the two laser spots. The laser energy density of this overlapping area is increased due to the two scans of the upper and lower laser scanning paths 42, so that it can be basically the same as the laser energy density of the middle area of ​​the laser spot.

[0059] For example, please refer to the starting and ending positions. Figure 6The closed curve S represents the projected outer contour of the target machining structure on the surface of the workpiece. Filling the projected outer contour with a path yields the first laser scanning path shown by line 41. The first laser scanning path directly borders the projected outer contour without any gap. In this case, when the laser spot center is at the starting and ending positions, the spot edge is outside the projected outer contour, resulting in unnecessary machining outside the target machining structure. Adjusting the starting and ending positions along the path direction according to the laser beam spot diameter allows for a certain gap between the starting and ending positions of the laser scanning path and the projected outer contour, resulting in a new laser scanning path 43.

[0060] For example, the tangent of the laser spot can be made to fall on the outer contour of the target processing structure at the starting and ending positions, thereby avoiding the problem of the size of the target processing structure not matching the processing requirements due to unnecessary processing outside the target processing structure.

[0061] In some other embodiments of this application, the path parameters of the first laser scanning path can be modified according to a preset distance threshold.

[0062] Taking the starting path and ending path as examples, the distance between the first laser scanning path and the projected outer contour of the target processing structure can be limited based on a distance threshold. This ensures that the distance between the starting path and the projected outer contour, as well as the distance between the ending path and the projected outer contour, are both greater than the distance threshold. This prevents the laser spot edge from falling outside the target processing structure, thereby avoiding the problem of inconsistent dimensions between the target processing structure and processing requirements due to unnecessary processing outside the target processing structure. The starting path and ending path are the paths closest to the projected outer contour in the vertical direction of the path direction.

[0063] Understandably, the correction based on a preset distance threshold can be combined with the aforementioned correction based on the laser beam spot diameter. This application does not restrict the order in which the corrections are performed. Please refer to... Figure 6 For example, after the starting and ending positions of the first laser scanning path 41 are corrected according to the spot diameter of the laser beam, the laser scanning path 43 is obtained. Further limiting the distance between the new laser scanning path 43 and the projected outer contour can yield the laser scanning path 44.

[0064] It is understandable that by modifying one or more of the following parameters of the first laser scanning path: path width, starting position, ending position, and distance between the laser scanning path and the projected outer contour, a second laser scanning path can be obtained. At this point, the second laser scanning path and the projected outer contour can form an initial processing graphic.

[0065] In some embodiments of this application, before dividing and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method may further include: determining whether the size of the initial processing pattern in each linear direction exceeds the laser scanning range of the acousto-optic deflector.

[0066] Specifically, the dimensions in each linear direction can be determined based on the aforementioned initial processing pattern or projected outer contour to see if they exceed the laser scanning range of the acousto-optic deflector. For example, the length and width of the projected outer contour can be compared with the length and width of the laser scanning range of the acousto-optic deflector to determine whether the dimensions of the initial processing pattern in each linear direction exceed the laser scanning range of the acousto-optic deflector.

[0067] Accordingly, the initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector. This may include: if the size of the initial processing pattern in any linear direction exceeds the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned and corrected to obtain multiple sub-processing patterns.

[0068] Specifically, if the length of the projected outer contour is greater than the length of the laser scanning range of the acousto-optic deflector, or if the width of the projected outer contour is greater than the width of the laser scanning range of the acousto-optic deflector, then the size of the initial processed pattern in any linear direction exceeds the laser scanning range of the acousto-optic deflector. In this case, steps S102 and S103 are required for laser processing.

[0069] Correspondingly, if the length of the projected outer contour is less than or equal to the length of the laser scanning range of the acousto-optic deflector, and the width of the projected outer contour is less than or equal to the width of the laser scanning range of the acousto-optic deflector, it means that the dimensions of the initial processing pattern in each linear direction do not exceed the laser scanning range of the acousto-optic deflector. In this case, the acousto-optic deflector can be controlled to deflect the laser beam according to the initial laser scanning path within the initial processing pattern, so as to process the initial processing pattern on the workpiece to be processed and obtain the target processing structure.

[0070] Here, the initial laser scanning path is the laser scanning path filled within the initial processing pattern, which can refer to the aforementioned first laser scanning path or the second laser scanning path, preferably the aforementioned second laser scanning path.

[0071] In some embodiments of this application, such as Figure 7 As shown, the initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, which may include steps S701 to S702.

[0072] Step S701: Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is divided into multiple sub-processing patterns.

[0073] Specifically, by using the laser scanning range of the acousto-optic deflector as the size of a single sub-processing pattern, the initial processing pattern can be divided into multiple sub-processing patterns, so that the size of each sub-processing pattern in each linear direction is within the laser scanning range of the acousto-optic deflector.

[0074] For example, the initial processing graphic is Figure 8 The initial processed graphic shown in region 45 can be divided into four sub-processed graphics: regions A, B, C, and D. At this point, the dimensions of regions A, B, C, and D in both the length and width directions are within the laser scanning range of the acousto-optic deflector.

[0075] Step S702: Correct the initial laser scanning path within each sub-processing pattern to obtain the target laser scanning path within each sub-processing pattern.

[0076] After partitioning, the original initial laser scanning path of the initial processing graphic is divided into several segments by the boundary lines of the sub-processing graphics. Based on the sub-processing graphic in which each segment is located, the initial laser scanning path within each sub-processing graphic can be classified. For example... Figure 8 In the diagram, line segment PQ0 is one of the initial laser scanning paths for region A.

[0077] For a single sub-processing pattern, the initial laser scanning path within it can be corrected to obtain the target laser scanning path within that sub-processing pattern. By correcting different sub-processing patterns separately, the target laser scanning path within each sub-processing pattern can be obtained.

[0078] Specifically, the initial laser scanning path within each sub-processing pattern is modified to obtain the target laser scanning path within each sub-processing pattern. This may include: scaling down the starting position of the initial laser scanning path within the sub-processing pattern according to the laser beam spot parameters to obtain the starting position of the target laser scanning path, and / or scaling down the ending position of the initial laser scanning path within the sub-processing pattern to obtain the ending position of the target laser scanning path.

[0079] The reduction processing is used to control the laser energy density in the interval region between adjacent target laser scanning paths along the path direction. As mentioned above, the spot parameters can include one or more combinations of spot diameter, spot width, spot area, and spot energy density distribution.

[0080] The path direction is the scanning direction of the laser scanning path. It can be understood that before the reduction processing, the start and end points of adjacent target laser scanning paths along the path direction coincide. For example Figure 8 In [figure reference], the end position of the initial laser scanning path PQ0 in area A coincides with the start position of the initial laser scanning path Q0R in area B. Since the laser scanning path PQ0 and the initial laser scanning path Q0R belong to different sub-processing patterns, and different sub-processing patterns need to be processed separately in step S103, the coincidence point Q0 is repeatedly processed during the processing of the two different sub-processing patterns, resulting in a higher laser energy density at and around this coincidence point compared to other positions. Therefore, by performing a reduction process on the start position and / or the end position, the start and end points of adjacent target laser scanning paths along the path direction are separated, and thus the laser energy density in the interval area between adjacent target laser scanning paths along the path direction is basically the same as that of other positions.

[0081] More specifically, the above reduction process can refer to moving the start position / end position of the initial laser scanning path within the sub-processing pattern along the initial laser scanning path in the direction away from the nearest point of the adjacent initial laser scanning path, and after moving, obtaining the start position / end position of the target laser scanning path.

[0082] For example, Figure 8 In [figure reference], the end position Q0 of the initial laser scanning path PQ0 in area A can be moved along the initial laser scanning path PQ0 in the direction away from Q0 to obtain the end position Q1 of the target laser scanning path PQ1. The start position Q0 of the initial laser scanning path Q0R in area B can be moved along the initial laser scanning path Q0R in the direction away from Q0 to obtain the start position Q2 of the target laser scanning path Q2R.

[0083] Among them, the moving length of the start position / end position can be a preset step size or can be determined according to the spot parameters of the laser beam. For example, the moving length can be N times the spot diameter (0 < N < 1, for example, N = 0.5), and this application does not limit this.

[0084] In this way, since the start and end points of adjacent target laser scanning paths along the path direction are separated, the laser energy density in the interval area between adjacent target laser scanning paths along the path direction is basically the same as that of other positions. Subsequently, in the structure formed by separately performing laser processing on different sub-processing patterns and splicing the laser processing results of each sub-processing pattern together, the formed target processing structure is relatively smooth, improving the processing accuracy.

[0085] In some embodiments of this application, before dividing and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method may further include: when processing any target processing structure, establishing a target coordinate system of the acousto-optic deflector based on the position of the target processing structure.

[0086] Specifically, any side of the smallest bounding rectangle of the projected outer contour of the initial processing graphic can coincide with one coordinate axis of the target coordinate system. Specifically, the target coordinate system of the acousto-optic deflector can be established using a set of adjacent sides of the smallest bounding rectangle of the projected outer contour as coordinate axis directions. For example, as... Figure 9 As shown, the target coordinate system of the acousto-optic deflector can be established with the lower left corner of the initial processing graphic as the origin O, and the width direction as the x-axis and the length direction as the y-axis.

[0087] It should be noted that, in the embodiments of this application, a corresponding target coordinate system can be established for each target processing structure, so that the target coordinate system can be used to process the corresponding target processing structure.

[0088] Accordingly, based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned and corrected to obtain multiple sub-processing patterns. This can include: based on the laser scanning range of the acousto-optic deflector, partitioning and correcting the initial processing pattern along the coordinate axis direction of the target coordinate system to obtain multiple sub-processing patterns.

[0089] Specifically, based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned along the coordinate axis of the target coordinate system, including: arranging the laser scanning range of the acousto-optic deflector in an array along the coordinate axis of the target coordinate system, and partitioning the initial processing pattern according to the laser scanning range arranged in the target coordinate system.

[0090] More specifically, starting from the origin of the target coordinate system, the laser scanning range of the acousto-optic deflectors can be laid out in an array along the coordinate axes. When partitioning the initial processing pattern, each sub-processing pattern can be divided according to the boundary of the laser scanning range of two adjacent acousto-optic deflectors in the array. Since any side of the smallest bounding rectangle of the projected outer contour can coincide with one coordinate axis of the target coordinate system, this partitioning method can use as few sub-processing patterns as possible to cover the entire initial processing pattern. This is beneficial for improving laser processing efficiency and reducing the number of partitions in the initial processing pattern, thereby reducing the impact of adjacent boundaries of sub-processing patterns on the morphology of the processed structure.

[0091] Meanwhile, since the laser scanning range of the acousto-optic deflector is arranged in an array during segmentation, the initial processing patterns do not overlap with each other, and the laser processing paths also do not overlap, resulting in relatively low complexity in path planning and correction.

[0092] In other embodiments, the initial processing pattern is partitioned according to the laser scanning range of the acousto-optic deflector along the coordinate axes of the target coordinate system. This can include: starting from the origin of the target coordinate system, translating the laser scanning range of the acousto-optic deflector along the coordinate axes to partition the initial processing pattern, so as to minimize the difference in processing area between the sub-processing patterns. For example... Figure 10 The diagram illustrates the partitioning of the initial processing graphic. While there is overlap between the sub-processing graphics, their processing areas are similar. This method is particularly effective for graphics with unusual shapes, allowing for a more rational distribution of the sub-processing graphics. It should be noted that... Figure 10 Under the division method shown, the correction process can also correct path points located on the boundary between adjacent sub-processing graphics along the path direction. In some embodiments of this application, an acousto-optic deflector is controlled to deflect the laser beam according to the target laser scanning path within each sub-processing pattern, so as to sequentially process each of the sub-processing patterns on the workpiece to obtain the target processed structure. This includes: adjusting the deflection state of the laser beam by the first beam deflection mechanism to position the laser beam at a preset position. The acousto-optic deflector is controlled to deflect the laser beam according to the target laser scanning path within the sub-processing pattern, so that the laser beam emitted sequentially through the acousto-optic deflector and the first beam deflection mechanism is within the range of the sub-processing pattern, so as to sequentially process each sub-processing pattern on the workpiece to obtain the target processed structure.

[0093] The speed at which the first beam deflection mechanism controls the laser beam deflection can be less than the speed at which the acousto-optic deflector controls the laser beam deflection. The preset position is located within the laser scanning range of the acousto-optic deflector where any sub-processing pattern is located; for example, it could be the center point of the sub-processing pattern or a specific positioning marker point.

[0094] Specifically, the aforementioned first beam deflection mechanism includes a galvanometer. The galvanometer can control the scanning direction of the laser beam by deflecting a reflector (small mirror) via electromagnetic drive. The aforementioned first beam deflection mechanism may also include a rotating mirror. The rotating mirror can achieve beam deflection by mechanically rotating a multifaceted prism or a single-sided reflector.

[0095] The first beam deflection mechanism can be used to handle large-area beam projection, while the acousto-optic deflector can further divide the single processing area of ​​the first beam deflection mechanism into several smaller laser scanning areas. For example... Figure 11As shown, the entire circuit board processing area can be divided into four "processing areas" as indicated by solid lines according to the scanning range of the galvanometer. Within each processing area, it is further divided into four "sub-scanning areas" as indicated by dashed lines according to the laser scanning range of the acousto-optic deflector.

[0096] First, the first beam deflection mechanism and / or the processing platform where the workpiece is located can be controlled to ensure that a specific area of ​​the workpiece is within the scanning range of the galvanometer, and this specific area contains the aforementioned target processing structure. By positioning the center of the galvanometer scanning range, a galvanometer coordinate system is established with the center position as the origin. Subsequently, by adjusting the deflection state of the laser beam by the first beam deflection mechanism according to the galvanometer coordinate system, the laser beam can be positioned within a specific AOD scanning range. At this time, the laser beam can be used to process the sub-processing patterns contained within the AOD scanning range. Then, with the lens deflection angle of the first beam deflection mechanism fixed, the acousto-optic deflector is controlled to deflect the laser beam to adjust the position of the laser beam spot on the workpiece, thereby completing the processing of the sub-processing patterns. By repeating the above steps, each sub-processing pattern can be processed sequentially on the workpiece to obtain the target processing structure.

[0097] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because based on this application, some steps can be performed in other orders.

[0098] like Figure 12 The diagram shown is a schematic of a controller provided in an embodiment of this application. Specifically, the controller 40 may include: a processor 400, a memory 401, and a computer program 402 stored in the memory 401 and executable on the processor 400, such as a laser processing program. When the processor 400 executes the computer program 402, it implements the steps in the various laser processing method embodiments described above, for example... Figure 1 Steps S101 to S103 are shown.

[0099] The computer program can be divided into one or more modules / units, which are stored in the memory 401 and executed by the processor 400 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0100] The controller may include, but is not limited to, a processor 400 and a memory 401. Those skilled in the art will understand that... Figure 12This is merely an example of a controller and does not constitute a limitation on the controller. It may include more or fewer components than illustrated, or combine certain components, or different components. For example, the controller may also include input / output devices, network access devices, buses, etc.

[0101] The processor 400 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0102] The memory 401 can be an internal storage unit of the controller, such as the controller's hard drive or memory. The memory 401 can also be an external storage device of the controller, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or FlashCard. Furthermore, the memory 401 can include both internal and external storage units of the controller. The memory 401 is used to store the computer program and other programs and data required by the controller. The memory 401 can also be used to temporarily store data that has been output or will be output.

[0103] It should be noted that, for the sake of convenience and brevity, the structure of the controller described above can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.

[0104] In the embodiments of this application, the controller may be a loading / unloading robot or a control device connected to the loading / unloading robot.

[0105] Specifically, Figure 13 This application illustrates a laser processing apparatus, comprising: Laser 10 is used to emit a laser beam; The beam control system 20 includes an acousto-optic deflector and is used to transmit, control, and deflect the laser beam. The processing platform 30 is used to support the workpiece to be processed; Controller 40 is used to control the laser, the beam control system, and the processing platform to work together to achieve the following: Figures 1 to 11 The laser processing method described above.

[0106] In some embodiments of this application, the laser 10 may be a solid-state laser (e.g., nanosecond laser, picosecond laser, femtosecond laser, etc.), a gas laser (e.g., a CO2 laser), or other types of lasers, and this application does not impose any limitations on this. A laser 10 capable of providing suitable laser pulse wavelength and pulse frequency parameters can be selected according to processing requirements. The power, spot size, and number of pulses of the laser beam emitted by the laser 10 can all be set according to processing requirements.

[0107] In some embodiments of this application, the beam control system 20, in addition to the acousto-optic deflector, may also include, but is not limited to, a beam shaper (e.g., an aperture, a beam expander or beam shrinker, a shaping component that converts the intensity distribution of the laser beam from a Gaussian distribution to the desired shape), a focusing lens, and a first beam deflection mechanism. The beam shaper can be used to shape the laser beam to control the spot size and energy density distribution. The focusing lens can be used to control the focal length, thereby affecting the energy density distribution of the laser spot formed at the processing position of the workpiece. The various devices within the beam control system 20 cooperate to transmit, control, and deflect the laser beam, forming a spot with specific laser parameters to process the signal transmission substrate.

[0108] The first beam deflection mechanism may include a galvanometer, which can control the scanning direction of the laser beam by deflecting a reflector (small lens) via electromagnetic drive. It should be noted that the aforementioned acousto-optic deflector can be positioned between the laser and the first beam deflection mechanism, and the first beam deflection mechanism can be positioned between the acousto-optic deflector and the focusing lens to achieve continuous beam deflection.

[0109] This application embodiment also provides a circuit board, which is based on... Figures 1 to 11 The described laser processing method or such Figure 13 The product obtained from the laser processing equipment.

[0110] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0111] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0112] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.

[0113] In the embodiments provided in this application, it should be understood that the disclosed devices / controllers / systems and methods can be implemented in other ways. For example, the device / controller / system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0114] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected based on actual needs to achieve the purpose of this embodiment.

[0115] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0116] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed based on the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0117] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser processing method, characterized in that, include: Obtain the initial machining pattern corresponding to the target machining structure on the workpiece to be processed, wherein the size of the initial machining pattern in any linear direction exceeds the laser scanning range of the acousto-optic deflector; Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned and corrected to obtain multiple sub-processing patterns. Each sub-processing pattern contains a target laser scanning path, and the dimensions of each sub-processing pattern in each linear direction are within the laser scanning range of the acousto-optic deflector. According to the target laser scanning path within each of the sub-processing patterns, the acousto-optic deflector is controlled to deflect the laser beam so as to process each of the sub-processing patterns sequentially on the workpiece to be processed, thereby obtaining the target processed structure.

2. The laser processing method as described in claim 1, characterized in that, The initial processing pattern includes an initial laser scanning path; the initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, including: Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is divided into multiple sub-processing patterns; The initial laser scanning path within each sub-processing pattern is corrected to obtain the target laser scanning path within each sub-processing pattern.

3. The laser processing method as described in claim 2, characterized in that, The step of correcting the initial laser scanning path within each sub-processing pattern to obtain the target laser scanning path within each sub-processing pattern includes: Based on the spot parameters of the laser beam, the starting position of the initial laser scanning path within the sub-processing pattern is reduced to obtain the starting position of the target laser scanning path; and / or, the ending position of the initial laser scanning path within the sub-processing pattern is reduced to obtain the ending position of the target laser scanning path. The reduction processing is used to control the laser energy density in the interval region between adjacent target laser scanning paths along the path direction.

4. The laser processing method as described in claim 1, characterized in that, The process of obtaining the initial machining pattern corresponding to the target machining structure on the workpiece to be machined includes: Obtain the projected outer contour of the target machining structure on the surface of the workpiece to be machined; The first laser scanning path is obtained by filling the path within the outer contour of the projection. The path parameters of the first laser scanning path are corrected to obtain the second laser scanning path, thereby obtaining the initial processing graphic. The path parameters include at least one of the following: path line width, starting position, ending position, and distance between the laser scanning path and the projected outer contour.

5. The laser processing method as described in claim 1, characterized in that, Before dividing and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method further includes: When processing any target processing structure, the target coordinate system of the acousto-optic deflector is established based on the position of the target processing structure; The initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, including: Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned and corrected along the coordinate axis of the target coordinate system to obtain multiple sub-processing patterns.

6. The laser processing method as described in claim 5, characterized in that, Any side of the smallest bounding rectangle of the projected outer contour of the initial processed graphic coincides with one coordinate axis of the target coordinate system; Based on the laser scanning range of the acousto-optic deflector, the initial processing pattern is partitioned along the coordinate axes of the target coordinate system, including: The laser scanning range of the acousto-optic deflector is arranged in an array along the coordinate axis of the target coordinate system, and the initial processing pattern is partitioned according to the laser scanning range arranged in the target coordinate system.

7. The laser processing method as described in claim 1, characterized in that, Before dividing and correcting the initial processing pattern according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, the laser processing method further includes: Determine whether the dimensions of the initial processed pattern in each linear direction exceed the laser scanning range of the acousto-optic deflector; The initial processing pattern is partitioned and corrected according to the laser scanning range of the acousto-optic deflector to obtain multiple sub-processing patterns, including: If the size of the initial processed pattern in any linear direction exceeds the laser scanning range of the acousto-optic deflector, the initial processed pattern is partitioned and corrected to obtain multiple sub-processed patterns.

8. The laser processing method according to any one of claims 1 to 7, characterized in that, The step of controlling the acousto-optic deflector to deflect the laser beam according to the target laser scanning path within each of the sub-processing patterns, so as to sequentially process each of the sub-processing patterns on the workpiece to be processed, thereby obtaining the target processed structure, includes: The deflection state of the laser beam by the first beam deflection mechanism is adjusted so that the laser beam is located at a preset position, which is within the laser scanning range of the acousto-optic deflector where any of the sub-processed patterns is located; the first beam deflection mechanism controls the laser beam deflection speed to be less than the speed at which the acousto-optic deflector controls the laser beam deflection. According to the target laser scanning path within the sub-processing pattern, the acousto-optic deflector is controlled to deflect the laser beam, so that the laser beam emitted after passing through the acousto-optic deflector and the first beam deflection mechanism in sequence is located within the range of the sub-processing pattern, so that each sub-processing pattern is processed sequentially on the workpiece to be processed to obtain the target processing structure.

9. The laser processing method as described in claim 8, characterized in that, The first beam deflection mechanism includes a galvanometer.

10. A controller comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the laser processing method as described in any one of claims 1 to 9.

11. A laser processing device, characterized in that, include: A laser, used to emit a laser beam; A beam control system, comprising an acousto-optic deflector, wherein the beam control system is used for transmitting, controlling, and deflecting the laser beam; The machining platform is used to support the workpiece to be processed; A controller is used to control the laser, the beam control system and the processing platform to work together to achieve the laser processing method as described in any one of claims 1 to 8.

12. The laser processing equipment as described in claim 11, characterized in that, The beam control system further includes a first beam deflection mechanism, which includes a galvanometer.

13. A circuit board, characterized in that, The circuit board is obtained by the laser processing method according to any one of claims 1 to 9 or by the laser processing equipment according to any one of claims 11 to 12.

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