A continuous production device and a continuous production process of a tape-rolling chip-level packaging module

Abstract

The application relates to the technical field of semiconductor chip production, and discloses a continuous production device and a continuous production process of a reel chip level packaging module, which comprises a tin paste printing structure, a flip chip structure, a reflow soldering structure and a filling and solidifying structure. The tin paste printing structure is used for conveying a reel carrier tape and printing tin paste on the reel carrier tape. The flip chip structure is arranged downstream of the tin paste printing structure, and is used for overturning chips to flip the chips on the reel carrier tape after the tin paste is printed. The reflow soldering structure is arranged downstream of the flip chip structure, and is used for reflow soldering the reel carrier tape with the flipped chips. The filling and solidifying structure is arranged downstream of the reflow soldering structure, and is used for bottom glue filling and solidification of the module after the reflow soldering is completed. The structure completes the reel carrier tape type chip production, and meets the large-scale and high-efficiency production demand.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip production, in particular to a continuous production device and process for a reel-to-reel chip scale package module. BACKGROUND

[0002] Traditional CSP products are usually packaged with sheet-shaped carriers as substrates, and the connection between the chip and the carrier is completed by relying on the soldering process. Related packaging equipment (such as solder paste printing machines, chip mounters, reflow soldering furnaces, etc.) generally carries loading and unloading, positioning and transmission mechanisms designed for sheet-shaped carriers, and can only realize intermittent processing of single sheet-shaped carriers.

[0003] With the development of electronic components towards light, thin, small, high-density integration, the market has higher requirements for packaging efficiency, cost and reliability, and the existing sheet-shaped carrier packaging method has gradually been difficult to meet the large-scale and high-efficiency production demand. SUMMARY

[0004] Therefore, the present application provides a continuous production device and process for a reel-to-reel chip scale package module to solve the problem that the existing sheet-shaped carrier packaging method has gradually been difficult to meet the large-scale and high-efficiency production demand.

[0005] In a first aspect, the present application provides a continuous production device for a reel-to-reel carrier chip, comprising:

[0006] A solder paste printing structure is used to transport a reel-to-reel carrier and print solder paste on the reel-to-reel carrier.

[0007] A flip chip structure is arranged downstream of the solder paste printing structure, and is used to flip a chip to flip the chip on the reel-to-reel carrier after printing the solder paste.

[0008] A reflow soldering structure is arranged downstream of the flip chip structure, and is used to reflow solder the reel-to-reel carrier with the chip.

[0009] A filling and curing structure is arranged downstream of the reflow soldering structure, and is used to bottom glue filling and curing for the module after reflow soldering.

[0010] Beneficial effects: when the tape carrier tape needs to be produced, the tape carrier tape first passes through the solder paste printing structure, which is responsible for accurately applying solder paste at the predetermined position of the tape carrier tape, and then the tape carrier tape printed with solder paste is sent to the flip chip structure, which flips and mounts the chip to the position where the tape carrier tape has printed solder paste; the tape carrier tape with flip-chip is sent to the reflow oven for reflow soldering, the tape carrier tape passes through different temperature zones of the reflow oven at a constant speed, and experiences preheating, constant temperature, reflow and cooling processes, so that the solder paste melts and the chip is welded on the tape carrier tape. The tape carrier tape after reflow soldering is sent to the filling and curing structure for dispensing and wrapping the chip surface at the bottom of the chip, and then the tape carrier tape after dispensing is sent to the curing oven for curing. Through the above setting, the chip production of the tape carrier tape is completed, meeting the production demand of large scale and high efficiency.

[0011] In an alternative embodiment, the tape carrier tape comprises:

[0012] A continuous tape substrate, wherein a plurality of chip mounting areas are arranged on the continuous tape substrate;

[0013] A plurality of chip mounting structures are arranged on the chip mounting areas;

[0014] The chip mounting structure comprises:

[0015] A first circuit is arranged in an irregular shape on the front surface of the continuous tape substrate, and a chip is adapted to be flip-chip bonded on the front surface of the continuous tape substrate so that the flip-chip bumps of the chip are connected to the first circuit;

[0016] A gold finger pad array is arranged on the back surface of the continuous tape substrate corresponding to the first circuit;

[0017] A conductive via is arranged through the substrate to realize the electrical interconnection between the first circuit and the gold finger pad array.

[0018] Beneficial effects: the chip is directly flip-chip bonded on the continuous tape substrate, and the flip-chip bumps are directly connected to the first circuit. The flip-chip bumps of the chip are directly welded on the first circuit on the front surface, and the wire bonding is completely cancelled. The first circuit on the front surface and the gold finger pad array on the back surface are connected through the conductive via through the substrate, realizing ultra-short interconnection, low material cost and excellent electrical performance.

[0019] Compared with the existing wire bonding process, the production is carried out by flip-chip process, the process treatment requirements of the surface electroplated gold layer are lower, and the required production standards are easier to achieve, thereby improving the production efficiency and yield.

[0020] In an alternative embodiment, the tin paste printing structure comprises, in sequence along the conveying direction of the tape carrier tape: a first unwinding structure, a first conveying roller, a tin paste printing unit, and a second conveying roller.

[0021] The first unwinding structure is configured to release the tape carrier tape.

[0022] The first conveying roller is configured to receive the tape carrier tape released by the first unwinding structure and convey it to the tin paste printing unit.

[0023] The second conveying roller is configured to receive the tape carrier tape output by the tin paste printing unit.

[0024] In an alternative embodiment, the tin paste printing unit comprises:

[0025] A first conveying structure and a second conveying structure are arranged in sequence along the conveying direction of the tape carrier tape.

[0026] A lifting and adsorbing structure is mounted between the first conveying structure and the second conveying structure; the first conveying structure, the lifting and adsorbing structure, and the second conveying structure combine to form a conveying channel for conveying the tape carrier tape.

[0027] The lifting and adsorbing structure has a first working state in which the tape carrier tape is lifted to a first working position; and the lifting and adsorbing structure has a second working state in which the tape carrier tape is lowered to a second working position.

[0028] In an alternative embodiment, the lifting and adsorbing structure comprises:

[0029] Two limiting members are arranged in sequence along a direction perpendicular to the conveying direction of the tape carrier tape; the two ends of the limiting members are respectively connected to the first conveying structure and the second conveying structure.

[0030] An adsorbing member is mounted between the two limiting members.

[0031] A driving member is connected to the adsorbing member at its output end.

[0032] Beneficial effects: when the tin printing of the reel tape carrier in the lifting adsorption structure is needed, the reel tape carrier is first laid in the conveying channel, the lifting adsorption structure drives the reel tape carrier to rise to the first working position, the reel tape carrier is taut, and the lifting adsorption structure tightly adsorbs the reel tape carrier on the surface of the lifting adsorption structure, the external printing mechanism tin prints the upper surface of the reel tape carrier, and the first conveying structure assists the lifting adsorption structure to pull and stretch the reel tape carrier to make it taut. Avoid displacement during printing to provide stable support for printing. After printing, the lifting adsorption structure closes the vacuum and lowers, so that the reel tape carrier on the lifting adsorption structure is in a suspended state again. The second conveying structure drives the reel tape carrier to continue moving in the conveying direction. Repeat the above steps to realize continuous tin printing of the reel tape carrier. Through the above setting, when the reel tape carrier is conveyed step by step, the bottom of the reel tape carrier will not be continuously rubbed by the surface of the fixed track, which will not cause damage to the bottom surface of the reel tape carrier, thereby improving the yield.

[0033] In an alternative embodiment, the flip chip structure comprises, in sequence along the transmission direction of the reel tape carrier: a third transmission roller, a flip chip unit, a fourth transmission roller and a first winding structure;

[0034] The third transmission roller is used to receive the reel tape carrier output from the second transmission roller and convey it into the flip chip unit,

[0035] The fourth transmission roller is used to receive the reel tape carrier output by the flip chip unit;

[0036] The first winding structure is used to recycle the reel tape carrier output by the fourth transmission roller.

[0037] In an alternative embodiment, the reflow soldering structure comprises, in sequence along the transmission direction of the reel tape carrier: a second unwinding structure, a fifth transmission roller, a reflow furnace, a sixth transmission roller and a second winding structure;

[0038] The second unwinding structure is used to release the reel tape carrier with chips mounted;

[0039] The fifth transmission roller is used to receive the reel tape carrier with chips mounted released by the second unwinding structure and convey it into the reflow furnace;

[0040] The sixth transmission roller is used to receive the reel tape carrier output by the reflow furnace;

[0041] The second winding structure is used to recycle the reel tape carrier output by the sixth transmission roller.

[0042] In an alternative embodiment, the filling and curing structure comprises, in sequence along the conveying direction of the tape carrier tape: a third unwinding structure, a seventh conveying roller, a dispensing machine, an eighth conveying roller, a ninth conveying roller, a curing furnace, a tenth conveying roller, and a third winding structure.

[0043] The third unwinding structure is configured to release the tape carrier tape after reflow soldering.

[0044] The seventh conveying roller is configured to receive the tape carrier tape released by the third unwinding structure and convey it to the dispensing machine, and the dispensing machine is configured to dispense the chip.

[0045] The eighth conveying roller is configured to receive the tape carrier tape dispensed by the dispensing machine.

[0046] The ninth conveying roller is configured to receive the tape carrier tape output by the eighth conveying roller and convey it into the curing furnace, and the curing furnace is configured to cure the filling glue on the tape carrier tape.

[0047] The tenth conveying roller is configured to receive the tape carrier tape output by the curing furnace.

[0048] The third winding structure is configured to recycle the tape carrier tape output by the tenth conveying roller.

[0049] In an alternative embodiment, the tape carrier tape between the second conveying roller and the third conveying roller and the tape carrier tape between the eighth conveying roller and the ninth conveying roller are downwardly concave.

[0050] Beneficial effects: The second conveying roller and the third conveying roller are used to coordinate the production cycle difference between the previous and subsequent processes. The second conveying structure in the solder paste printing unit starts or stops by judging the remaining amount of the tape carrier tape in the second conveying roller and the third conveying roller, ensuring that the tape carrier tape between the second conveying roller and the third conveying roller is sufficient, preventing the subsequent process from being affected, and ensuring that the flip chip unit continuously produces. When the flip chip unit is working, it will pull the tape carrier tape from the part between the second conveying roller and the third conveying roller, and the degree of sagging will gradually decrease. By monitoring the sagging height in real time, the system can intelligently start and stop the solder paste printing unit, ensuring that there is always material in the second conveying roller and the third conveying roller, thereby ensuring the continuous production of the flip chip unit. The eighth conveying roller and the ninth conveying roller form a non-linear path buffer section, and the glue needs to use this buffer section to complete the capillary flow to completely fill the gap at the bottom of the chip and discharge the air. This curved path increases the transmission length of the tape carrier tape, thereby creating the necessary standing time to ensure that the filling effect is sufficient and uniform, and to avoid air holes.

[0051] The second aspect of the present application further provides a continuous production process of the tape carrier chip, which is suitable for the continuous production device of the tape carrier chip.

[0052] The production process specifically comprises: continuously feeding the tape carrier into a tin paste printing structure, printing tin paste at a predetermined position of the tape carrier; then feeding the tape carrier printed with tin paste into a flip chip structure, which flips and mounts the chip to the position of the tape carrier printed with tin paste; feeding the tape carrier with flip chip into a reflow furnace to perform reflow soldering; feeding the tape carrier with completed reflow soldering into a filling and curing structure to perform glue dispensing and filling at the bottom of the chip and wrapping the surface of the chip, and then feeding the tape carrier after glue dispensing into a curing furnace to perform curing. BRIEF DESCRIPTION OF DRAWINGS

[0053] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0054] Figure 1 The structure diagram of the tin paste printing structure and the flip chip structure in the embodiment of the present application;

[0055] Figure 2 The structure diagram of the reflow soldering structure in the embodiment of the present application;

[0056] Figure 3 The structure diagram of the filling and curing structure in the embodiment of the present application;

[0057] Figure 4 The overall structure diagram of the tin paste printing unit in the embodiment of the present application;

[0058] Figure 5 The overall structure diagram of the lifting and adsorbing structure in the embodiment of the present application;

[0059] Figure 6 The structure diagram of the lifting and adsorbing structure close to one end of the second conveying structure in the embodiment of the present application;

[0060] Figure 7 The side sectional view of the lifting and adsorbing structure in the embodiment of the present application;

[0061] Figure 8 The structure diagram of the first conveying structure in the embodiment of the present application

[0062] Figure 9The mounting schematic view of the damping driving wheel and the damping driven wheel in the first conveying structure in the embodiment of the present application;

[0063] Figure 10 The structural schematic view of the second conveying structure in the embodiment of the present application;

[0064] Figure 11 The cooperation schematic view of the driving wheel, the driving tooth and the winding tape carrier in the embodiment of the present application;

[0065] Figure 12 The parameter labeling view of the first avoiding wheel in the embodiment of the present application;

[0066] Figure 13 The simulation curve view of the definition of the second avoiding wheel radius and the arc length corresponding angle in the embodiment of the present application;

[0067] Figure 14 The overall structural schematic view of the winding tape carrier in the embodiment of the present application;

[0068] Figure 15 The structural schematic view of the chip mounting structure in the embodiment of the present application;

[0069] Figure 16 The structural schematic view of the gold finger pad array in the embodiment of the present application;

[0070] Explanation of reference signs:

[0071] 1, the solder paste printing structure; 11, the first unwinding structure; 12, the first transmission roller; 13, the solder paste printing unit; 131, the first conveying structure; 1311, the first conveying track; 1312, the first motor; 1313, the first mounting seat; 1314, the first mounting frame; 1315, the damping driving wheel; 1316, the damping driven wheel; 132, the second conveying structure; 1321, the second conveying track; 1322, the second motor; 1323, the second mounting seat; 1324, the driving wheel; 1325, the driving tooth; 1326, the cover plate; 133, the lifting adsorption structure; 1331, the limiting piece; 13311, the adjusting groove; 1332, the adsorption accessory; 13321, the adsorption part; 13322, the lifting part; 1333, the driving piece; 1334, the track strip; 1335, the mounting part; 1336, the limiting plate; 1337, the first avoiding wheel; 1338, the second avoiding wheel; 14, the second transmission roller;

[0072] 2, the flip chip structure; 21, the third transmission roller; 22, the flip chip unit; 23, the fourth transmission roller; 24, the first winding structure;

[0073] 3, the reflow soldering structure; 31, the second unwinding structure; 32, the fifth transmission roller; 33, the reflow furnace; 34, the sixth transmission roller; 35, the second winding structure;

[0074] 4, filling and curing structure; 41, third unwinding structure; 42, seventh transmission roller; 43, dispensing machine; 44, eighth transmission roller; 45, ninth transmission roller; 46, curing oven; 47, tenth transmission roller; 48, third winding structure;

[0075] 5, tape carrier tape; 51, continuous tape substrate; 511, positioning hole; 52, chip mounting structure; 521, first circuit; 522, gold finger pad array; 523, conductive via; 53, first electroplated lead; 54, second electroplated lead; 55, third electroplated lead; 56, broken muscle hole; 57, fourth electroplated lead. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0077] Traditional CSP type product packaging usually uses a sheet-shaped carrier board as a base material, and relies on soldering process to complete the connection of the chip and the carrier board. Related packaging equipment (such as solder paste printing machine, chip mounter, reflow soldering furnace, etc.) generally carries loading and unloading, positioning and transmission mechanisms designed for sheet-shaped carrier boards, and can only realize intermittent processing of single sheet carrier boards.

[0078] With the development of electronic components towards light, thin, small, high-density integration, the market has higher requirements for packaging efficiency, cost and reliability, and the existing sheet-shaped carrier board packaging method has gradually been difficult to meet the large-scale and high-efficiency production demand.

[0079] In order to solve the above technical problems, the embodiments of the present application will be described below in combination with Figures 1 to 16 , the embodiments of the present application.

[0080] According to the embodiments of the present application, on the one hand, a continuous production device for tape carrier tape 5 chip is provided, which comprises a solder paste printing structure 1, a flip chip mounting structure 2, a reflow soldering structure 3 and a filling and curing structure 4.

[0081] As Figures 1 to 3As shown, the solder paste printing structure 1 is located at the most upstream position of the continuous production device of the tape carrier tape 5, as the first device and the first step of the production of the tape carrier tape 5, the solder paste printing structure 1 is used to transport the tape carrier tape 5 and print solder paste on the tape carrier tape 5. The flip chip structure 2 is a downstream device of the solder paste printing structure 1, and the flip chip structure 2 is used to flip the chip to be mounted on the tape carrier tape 5 after printing the solder paste. The reflow soldering structure 3 is a downstream device of the flip chip structure 2, and the reflow soldering structure 3 is used for reflow soldering of the tape carrier tape 5 with the chip mounted thereon. The filling and curing structure 4 is a downstream device of the reflow soldering structure 3, and the filling and curing structure 4 is used for bottom dispensing and curing of the module after reflow soldering.

[0082] When the tape carrier tape 5 needs to be produced, the tape carrier tape 5 will first pass through the solder paste printing structure 1, which is responsible for accurately applying solder paste at a predetermined position of the tape carrier tape 5, and then the tape carrier tape 5 with printed solder paste is sent to the flip chip structure 2, which flips and mounts the chip to the position where the tape carrier has printed the solder paste; the tape carrier tape 5 with the flip-chip mounted chip is sent to the reflow furnace 33 for reflow soldering, and the tape carrier passes through different temperature zones of the reflow furnace 33 at a constant speed, and experiences preheating, constant temperature, reflow and cooling processes, so that the solder paste melts and the chip is welded on the tape carrier tape 5. The tape carrier tape 5 after reflow soldering is sent to the filling and curing structure 4, which dispenses and fills at the bottom of the chip and wraps the surface of the chip, and then the tape carrier tape 5 after dispensing is sent to the curing furnace 46 for curing.

[0083] Through the above arrangement, the chip production of the tape carrier tape 5 is completed, meeting the demand of large-scale and high-efficiency production.

[0084] As shown in Figures 14 to 16 The tape carrier tape 5 includes a continuous tape substrate 51 and a chip mounting structure 52. The continuous tape substrate 51 is in the shape of a long strip, and a plurality of chip mounting areas are provided on the continuous tape substrate 51. In this embodiment, the plurality of chip mounting areas are arranged in two columns along the width direction of the continuous tape substrate 51. The plurality of chip mounting areas in each column are arranged in an array along the length direction of the continuous tape substrate 51. The chip mounting structure 52 is consistent with and corresponds to the number of chip mounting areas, and is mounted in the corresponding chip mounting area.

[0085] The specific structure of one of the chip mounting structures 52 will be described. The chip mounting structure 52 includes a first circuit 521, a gold finger pad array 522, and a conductive via 523. As shown in Figure 15As shown, the solid line is the first line 521, and the dashed line is the gold finger pad array 522. Five first lines 521 are provided, and each of the five first lines 521 forms an irregular shape. The five first lines 521 are arranged on the front surface of the continuous strip substrate 51. The gold finger pad array 522 is provided in six, and the six gold finger pad arrays 522 are arranged on the back surface of the continuous strip substrate 51. A conductive via hole 523 is provided on the position of the continuous strip substrate 51 where each first line 521 is located, and the conductive via hole 523 penetrates the substrate to realize the electrical interconnection between the first line 521 and the corresponding gold finger pad array 522.

[0086] In addition to the five first lines 521, two fourth electroplated leads 57 are provided. The two fourth electroplated leads 57 are arranged around the five first lines 521 at one end, and the other end of the two fourth electroplated leads 57 is connected to the second electroplated lead 54. The fourth electroplated lead 57 protrudes around the first line 521, which can limit the spread of glue during dispensing and packaging, and is more resistant to bending than thinner and cornered traces. The chip is suitable for flip-chip bonding on the front surface of the continuous strip substrate 51, and five of the seven flip-chip bumps of the chip are connected to the corresponding first line 521, and the other two are connected to the corresponding fourth electroplated lead 57.

[0087] Through the above arrangement, compared with the external lead of the prior art, in the present embodiment, the chip is directly flip-chip bonded on the continuous strip substrate 51, and the flip-chip bumps are directly connected to the first line 521. The flip-chip bumps of the chip are directly bonded on the first line 521 on the front surface, and the wire bonding is completely cancelled. The conductive via hole 523 penetrates the substrate to connect the first line 521 on the front surface and the gold finger pad array 522 on the back surface, realizing ultra-short interconnection, low material cost and excellent electrical performance.

[0088] Compared with the existing wire bonding process, the production is carried out through the flip-chip process, the process treatment requirements of the surface electroplated gold layer are lower, and the required production standards are easier to achieve, thereby improving the production efficiency and yield.

[0089] In the present embodiment, as shown in FIG. 6, the first line 521 is arranged on the front surface of the continuous strip substrate 51, and the gold finger pad array 522 is arranged on the back surface of the continuous strip substrate 51. Figure 14As shown, the flip-chip bumps on the chip intersect with five first lines 521 to form five solder paste coating areas for coating solder paste, and the flip-chip bumps on the chip intersect with two fourth electroplated leads 57 to form two solder paste coating areas. When the subsequent solder paste coating is performed on the tape carrier tape 5, the steel mesh aligns the solder paste coating areas, and the solder paste dots are coated on the solder paste coating areas, and the flip-chip bumps of the chip are arranged in the seven solder paste coating areas, respectively, and then reflow soldering is performed to fix the chip in the chip mounting area, and the seven flip-chip bumps are connected to the corresponding first lines 521 and fourth electroplated leads 57. Through the above arrangement, the solder paste is coated on the solder paste coating areas where the flip-chip bumps on the chip intersect with the first lines 521, effectively avoiding the risk of short circuit caused by bridging between adjacent lines.

[0090] In the embodiment, as shown in Figure 14 The tape carrier tape 5 is also pre-embedded with a first electroplated lead 53, a second electroplated lead 54, and a third electroplated lead 55. The first electroplated lead 53 is arranged along the length direction of the continuous tape substrate 51 at the side edge of the continuous tape substrate 51, and one first electroplated lead 53 is arranged on each length side of the continuous tape substrate 51. The second electroplated lead 54 is arranged around the edge of the chip mounting area. Specifically, as shown in Figure 14 The length direction of the continuous tape substrate 51 is the left-right direction, and the width direction of the continuous tape substrate 51 is the up-down direction. Two chip mounting structures 52 form a group, and the two chip mounting structures 52 in the group are arranged in the up-down direction. Multiple chip mounting structures 52 are arranged in the left-right direction. The second electroplated lead 54 is located between the two chip mounting structures 52, and the two ends of the second electroplated lead 54 are connected to the first electroplated leads 53 on both sides. One end of the third electroplated lead 55 is connected to the corresponding gold finger pad array 522. Before the entire chip mounting structure 52 is electroplated, the other end of the third electroplated lead 55, which is away from the gold finger pad array 522, is connected to the second electroplated lead 54.

[0091] The first electroplated lead 53, the second electroplated lead 54, and the third electroplated lead 55 are mainly used for subsequent electroplating of the gold finger pad array 522. The first electroplated lead 53 serves as the main input channel for electroplating current, and the second electroplated lead 54 serves as a partition ring line and is arranged between two adjacent chip mounting areas along the width direction of the continuous tape substrate 51. The two ends of the second electroplated lead 54 are connected to the first electroplated leads 53 on the upper and lower sides, respectively, to form a local current distribution ring.

[0092] The third electroplating lead 55 serves as the input line, conducting current to the gold finger pad array 522. In this embodiment, the six gold finger pad arrays 522 are each equipped with a corresponding third electroplating lead 55. During electroplating, the entire roll carrier tape 5 is immersed in the electroplating solution. The cathode of the electroplating equipment clamps the wide metal strip at the edge of the carrier tape. Current flows from the cathode to the first electroplating lead 53, then from the second electroplating lead 54 and the third electroplating lead 55 to the gold finger pad arrays 522, and finally through the electroplating solution to the anode of the electroplating equipment, forming a complete circuit and uniformly plating a nickel / gold layer onto the surface of all gold finger pad arrays 522. This configuration connects all the gold finger pad arrays 522 in series, ensuring that all gold finger pad arrays 522 receive similar current densities, guaranteeing uniform plating thickness. Furthermore, the input from both sides of the first electroplating lead 53 avoids end-current attenuation caused by single-sided power supply, ensuring consistent plating thickness.

[0093] In this embodiment, as Figure 16 As shown, the six gold finger pad arrays 522 correspond to six third electroplated leads 55. To facilitate the subsequent hole-making process, a portion of the third electroplated leads 55 on adjacent chip mounting structures 52, away from the corresponding gold finger pad array 522, will be connected to an intersection point on the second electroplated lead 54 between the two adjacent chip mounting structures 52. For example, taking... Figure 16 Based on the direction, the upper left side of the second electroplated lead 54 is the first chip mounting structure, the upper right side of the second electroplated lead 54 is the second chip mounting structure, the lower left side of the second electroplated lead 54 is the third chip mounting structure, and the lower right side of the second electroplated lead 54 is the fourth chip mounting structure.

[0094] The third electroplating lead 55 corresponding to a gold finger pad array 522 at the upper left of the second chip mounting structure, the third electroplating lead 55 corresponding to a gold finger pad array 522 at the upper right of the first chip mounting structure, and the third electroplating lead 55 corresponding to a gold finger pad array 522 at the middle of the top of the first chip mounting structure intersect at the same point on the second electroplating lead 54 between the first chip mounting structure and the second chip mounting structure, which is the first intersection point.

[0095] The third electroplated lead 55 corresponding to the gold finger pad array 522 at the lower right of the first chip mounting structure, the third electroplated lead 55 corresponding to the gold finger pad array 522 at the lower left of the second chip mounting structure, the third electroplated lead 55 corresponding to the gold finger pad array 522 at the middle below of the second chip mounting structure, the third electroplated lead 55 corresponding to the gold finger pad array 522 at the upper left of the third chip mounting structure, the third electroplated lead 55 corresponding to the gold finger pad array 522 at the middle above of the third chip mounting structure, and the third electroplated lead 55 corresponding to the gold finger pad array 522 at the upper left of the fourth chip mounting structure, all intersect at the same point of the second electroplated lead 54 between the first chip mounting structure and the second chip mounting structure, as the second intersection point.

[0096] The third electroplated lead 55 corresponding to the gold finger pad array 522 at the lower right of the third chip mounting structure, the third electroplated lead 55 corresponding to the gold finger pad array 522 at the middle below of the third chip mounting structure, and the third electroplated lead 55 corresponding to the gold finger pad array 522 at the lower left of the fourth chip mounting structure, all intersect at the same point of the second electroplated lead 54 between the first chip mounting structure and the second chip mounting structure, as the third intersection point.

[0097] The continuous tape substrate 51 is provided with a cutout hole 56 at the connecting position of the second electroplated lead 54 and the third electroplated lead 55. That is, the cutout hole 56 is provided at the first intersection point, the second intersection point, and the third intersection point, so that each gold finger pad array 522 returns to an independent state.

[0098] It should be noted that, Figure 16 The middle part of the cutout hole 56 should be a blank area in the actual situation diagram. Here, the intersection point of the third electroplated lead 55 and the second electroplated lead 54 is drawn in the cutout hole 56 for easy understanding.

[0099] In an embodiment, as Figure 14 shown, a plurality of positioning holes 511 are provided on both sides of the continuous tape substrate 51 along the length direction thereof, and the positioning holes 511 are used to match the downstream conveying device to convey the tape carrier tape 5. The distance between any two adjacent positioning holes 511 is the same. The positioning holes 511 on both side edges of the tape substrate engage with the driving teeth 1325 of the downstream device to convey the tape carrier tape 5, and the device gears simultaneously engage with the positioning holes 511 on both sides to ensure zero lateral deviation of the tape during transmission.

[0100] In an embodiment, a mark is provided in the chip mounting area to facilitate positioning of the steel mesh by a visual detection device, for example Figure 14The small triangles and small circles shown in the chip mounting area.

[0101] In the embodiment, as shown in the figure, Figure 1 The tin paste printing structure 1 includes, in sequence along the conveying direction of the tape carrier tape 5: a first unwinding structure 11, a first conveying roller 12, a tin paste printing unit 13, and a second conveying roller 14. The first unwinding structure 11 is used to release the tape carrier tape 5. The first conveying roller 12 is used to receive the tape carrier tape 5 released by the first unwinding structure 11 and convey it to the tin paste printing unit 13. The second conveying roller 14 is used to receive the tape carrier tape 5 output by the tin paste printing unit 13. The first unwinding structure 11 is the source of the entire tin paste printing process and is used to carry and release the original tape carrier tape 5 without any processing. It is usually composed of a motor-driven conveying roller for fixing the carrier tape reel. The carrier tape reel is loaded with the tape carrier tape 5. The motor rotates at a specific torque or speed under the command of the control system, gradually releasing the tape carrier tape 5. The first conveying roller 12 receives the tape carrier tape 5 from the first unwinding structure 11, changes its conveying path and direction, and accurately guides the tape carrier tape 5 from the first unwinding mechanism to the entrance track of the tin paste printing unit 13, specifically to the first conveying structure 131 described below. The tin paste printing unit 13 is responsible for accurately printing tin paste of a specific thickness at a predetermined position of the carrier tape. The second conveying roller 14 receives the tape carrier tape 5 on which the tin paste printing is completed from the tin paste printing unit 13, smoothly guides the tape carrier tape 5 from the second conveying structure 132 described below, and guides the tape carrier tape 5 to the next module.

[0102] The above arrangement realizes continuous production of tin paste printing, eliminating the loading, positioning, unloading, and conveying of the sheet carrier board printer. The overall output efficiency of the equipment is greatly improved.

[0103] In the embodiment, the tin paste printing unit 13 includes: a first conveying structure 131, a second conveying structure 132, and a lifting and adsorbing structure 133. As shown in the figure, Figures 4 to 13As shown, the first conveying structure 131 and the second conveying structure 132 are front and rear conveying tracks, respectively located at the front end and the rear end. The first conveying structure 131 and the second conveying structure 132 are arranged at intervals along the conveying direction. The lifting adsorption structure 133 is installed between the first conveying structure 131 and the second conveying structure 132. The two ends of the lifting adsorption structure 133 are connected with the first conveying structure 131 and the second conveying structure 132 respectively. The length direction of the lifting adsorption structure 133 as a whole is the conveying direction of the reel tape carrier tape 5. The first conveying structure 131, the lifting adsorption structure 133 and the second conveying structure 132 combine to form a conveying channel for conveying the reel tape carrier tape 5. The lifting adsorption structure 133 has a first working state of lifting the reel tape carrier tape 5 to a first working position; and the lifting adsorption structure 133 has a second working state of lowering the reel tape carrier tape 5 to a second working position.

[0104] In the initial state of the solder paste printing unit 13, the lifting adsorption structure 133 is in the low second working position, the first conveying structure 131, the second conveying structure 132 and the lifting adsorption structure 133 form a continuous conveying channel, the reel tape carrier tape 5 is suspended on the lifting adsorption structure 133 to avoid friction between the surface of the reel tape carrier tape 5 and the lifting adsorption structure 133, and the second conveying structure 132 is used to convey the reel tape carrier tape 5 to drive it to move along the conveying direction. When it is necessary to print solder paste on the reel tape carrier tape 5 located in the lifting adsorption structure 133, the reel tape carrier tape 5 is first laid in the conveying channel, the lifting adsorption structure 133 drives the reel tape carrier tape 5 to rise to the first working position, the reel tape carrier tape 5 is taut, and the lifting adsorption structure 133 tightly adsorbs the reel tape carrier tape 5 on the surface of the lifting adsorption structure 133, an external printing mechanism prints solder paste on the upper surface of the reel tape carrier tape 5, and the first conveying structure 131 assists the lifting adsorption structure 133 to pull and stretch the reel tape carrier tape 5 to make it taut, avoiding displacement of the reel tape carrier tape 5 during printing and providing stable support for printing. After printing is completed, the lifting adsorption structure 133 is closed and the reel tape carrier tape 5 on the lifting adsorption structure 133 is in a suspended state again. The second conveying structure 132 drives the reel tape carrier tape 5 to continue moving along the conveying direction. The above steps are repeated to realize continuous solder paste printing of the reel tape carrier tape 5. Through the above arrangement, when the reel tape carrier tape 5 is conveyed step by step, the bottom of the reel tape carrier tape 5 will not be continuously rubbed against the surface of the fixed track, so that damage to the bottom of the reel tape carrier tape 5 is avoided and the yield is improved.

[0105] In this embodiment, specifically, as shown in FIG. 1, the first conveying structure 131 and the second conveying structure 132 are front and rear conveying tracks, respectively located at the front end and the rear end. The first conveying structure 131 and the second conveying structure 132 are arranged at intervals along the conveying direction. The lifting adsorption structure 133 is installed between the first conveying structure 131 and the second conveying structure 132. The two ends of the lifting adsorption structure 133 are connected with the first conveying structure 131 and the second conveying structure 132 respectively. The length direction of the lifting adsorption structure 133 as a whole is the conveying direction of the reel tape carrier tape 5. The first conveying structure 131, the lifting adsorption structure 133 and the second conveying structure 132 combine to form a conveying channel for conveying the reel tape carrier tape 5. The lifting adsorption structure 133 has a first working state of lifting the reel tape carrier tape 5 to a first working position; and the lifting adsorption structure 133 has a second working state of lowering the reel tape carrier tape 5 to a second working position. Figures 4 to 7As shown, the lifting adsorption structure 133 comprises: a limiting piece 1331, an adsorption piece 1332, a driving piece 1333, a track strip 1334, a mounting part 1335 and a limiting plate 1336. The limiting piece 1331 is a long strip plate, and a single limiting piece 1331 is vertically placed, and the length direction thereof is the same as the conveying direction of the tape carrier ribbon 5. The two ends of the limiting piece 1331 are connected with the first conveying structure 131 and the second conveying structure 132 respectively, and the limiting piece 1331 is clamped with the first conveying structure 131 and the second conveying structure 132. The limiting piece 1331 is provided with two, which are arranged in a direction perpendicular to the conveying direction, and the interval distance thereof is slightly narrower than the width of the tape carrier ribbon 5. The adsorption piece 1332 is installed between the two limiting pieces 1331, and the adsorption piece 1332 comprises: an adsorption part 13321 and a lifting part 13322; the adsorption part 13321 is installed at the top end of the lifting part 13322, and the adsorption end of the adsorption part 13321 is adapted to face upward; and the driving piece 1333 is installed at the bottom of the lifting part 13322. The width of the adsorption part 13321 is equal to the distance between the two limiting pieces 1331, the side surface of the adsorption part 13321 is in contact with the inner side wall of the limiting piece, the lifting part 13322 is always below the two limiting pieces 1331 during movement, and the width of the lifting part 13322 is greater than the distance between the two limiting pieces 1331, so that the two sides of the lifting part 13322 can be in contact with the bottom end of the two limiting pieces 1331. The driving piece 1333 can drive the upper surface of the lifting part 13322 to move to a lower limit position lower than the lower limit position of the bottom surface of the limiting piece 1331. The track strip 1334 is provided with two, which are arranged on the upper surfaces of the two limiting pieces 1331 respectively. The length direction of the track strip 1334 is the conveying direction of the tape carrier ribbon 5. The mounting part 1335 is installed on the outer side of the track strip 1334, and the mounting part 1335 is provided with a plurality of, the length direction of a single mounting part 1335 on the upper surface of a single limiting piece 1331 is the conveying direction of the tape carrier ribbon 5, and the arrangement direction of the plurality of mounting parts 1335 on the upper surface of a single limiting piece 1331 is also the conveying direction of the tape carrier ribbon 5. The upper surface of the mounting part 1335 is vertically distant from the bottom surface of the limiting piece 1331 by a distance greater than the distance between the upper surface of the track strip 1334 and the bottom surface of the limiting piece 1331, that is, the upper surface of the mounting part 1335 is higher than the upper surface of the track strip 1334. The limiting plate 1336 is installed on the mounting part 1335, and the limiting plate 1336 is horizontally installed on the upper surface of the mounting part 1335, and the lower surface of the limiting plate 1336 is vertically distant from the upper surface of the track strip 1334 by a conveying gap for conveying the tape carrier ribbon 5. The side edges of the tape carrier ribbon 5 are arranged between the track strip 1334 and the limiting plate 1336.

[0106] When the initial state of the solder paste printing unit 13, the suction member 1332 and the limiting member 1331 are located at the lowermost point of their respective activity ranges. The tape carrier tape 5 is placed between the track bar 1334 and the limiting plate 1336. When lifting is required, the driving member 1333 pushes the lifting part 13322 to move upwards. In the previous period, the lifting part 13322 does not reach the lower limit of the activity position of the limiting member 1331, and the limiting member 1331, the first conveying structure 131 and the second conveying structure 132 remain stationary. With the continuous rising, the lifting part 13322 contacts the bottom of the limiting member 1331 on both sides, ensuring vertical guidance, and the lifting part 13322 pushes the suction part 13321, the limiting member 1331, the first conveying structure 131 and the second conveying structure 132 to continue moving upwards until the suction part 13321, the limiting member 1331, the first conveying structure 131 and the second conveying structure 132 all reach the highest point of the activity position. The suction part 13321 lifts the tape carrier tape 5, and the suction end of the suction part 13321 applies negative pressure upward, and the carrier tape is tightly attached to the upper surface of the suction part 13321. The external printing mechanism performs solder paste printing on the specific position of the upper surface of the tape carrier tape 5 located between the two limiting members 1331.

[0107] When the printing is completed and reset, the suction part 13321 closes the vacuum, and the tape carrier tape 5 is separated from the suction surface. The driving member 1333 pushes the lifting part 13322 to move downwards, and the suction part 13321, the limiting member 1331, the first conveying structure 131 and the second conveying structure 132 all move downwards, but do not reach the lowermost point of the activity position of the limiting member 1331. With the continuous downward movement, the limiting member 1331 moves downward to the lowermost point of the activity position of the limiting member 1331, ready to disengage from the lifting part 13322. The lifting part 13322 continues to move downward, and the limiting member 1331 is disengaged from the lifting part 13322. The limiting member 1331, the first conveying structure 131 and the second conveying structure 132 stop descending, and the suction member 1332 continues to move downwards until it moves to the lower limit of the activity position of the suction member 1332, and the descending stops. The suction member 1332 and the limiting member 1331 are located at the lowermost point of their respective activities, and the tape carrier tape 5 returns to the suspended conveying state.

[0108] It should be noted that when the adsorption part 13321 and the limiting part 1331 reach the active process, no matter whether they are in the highest position or the lowest position, the side edge of the tape carrier ribbon 5 is always in the gap between the track strip 1334, the mounting part 1335 and the limiting plate 1336, and the transverse displacement space can be eliminated. When the adsorption part 13321 and the limiting part 1331 are both in the highest position, the adsorption part 13321 lifts the tape carrier ribbon 5, makes it tight, and adsorbs and fixes it on the upper surface, and is stable again, further avoiding the deviation phenomenon generated in the solder paste printing process. When the adsorption part 13321 and the limiting part 1331 are both in the lowest position, the upper surface of the adsorption part 13321 is lower than the upper surface of the track strip 1334, so that the adsorption part 13321 is separated from the tape carrier ribbon 5, and the tape carrier ribbon 5 can be started to be conveyed, so that the tape carrier ribbon 5 is prevented from contacting the top surface of the adsorption part 13321 in the conveying process, so as to avoid scratching and smearing the metal surface below the tape carrier ribbon 5.

[0109] In the embodiment, as shown in Figure 6 and Figure 7 The limiting part 1331 is provided with an adjusting groove 13311 along the conveying direction. The lifting and adsorbing structure 133 further comprises a first avoiding wheel 1337 and a second avoiding wheel 1338, the outer diameter of the first avoiding wheel 1337 is smaller than that of the second avoiding wheel 1338, two first avoiding wheels 1337 are arranged, and the two first avoiding wheels 1337 are respectively arranged on the inner sides of the two limiting parts 1331, and the two first avoiding wheels 1337 are arranged on the side of the track strip 1334 close to the second conveying structure 132. The first avoiding wheel 1337 and the second avoiding wheel 1338 support the side edge of the tape carrier ribbon 5, and do not contact the area where the solder paste is printed. The second avoiding wheel 1338 is installed in the adjusting groove 13311, for example, a screw rod can be installed on the central axis of the second avoiding wheel 1338, the screw rod is inserted into the adjusting groove 13311, nuts are installed on the screw rods on both sides of the adjusting groove 13311, and the nuts are tightened to fix the second avoiding wheel 1338 on the adjusting groove 13311; or the nuts are rotated away from the corresponding limiting part 1331, so as to loosen the second avoiding wheel 1338, and the position of the second avoiding wheel 1338 in the adjusting groove 13311 can be adjusted. The side edge of the tape carrier ribbon 5 is wound between the first avoiding wheel 1337 and the second avoiding wheel 1338, specifically, the tape carrier ribbon 5 is wound from the upper end of the first avoiding wheel 1337, and extends from the lower end of the second avoiding wheel 1338, forming a bending propagation path. The tape carrier ribbon 5 can have a large angle avoiding with a small radius towards the obliquely downward at the first avoiding wheel 1337, so that the current printing area of the tape carrier ribbon 5 during printing can effectively avoid the solder paste printing area of the tape carrier ribbon 5 before printing, and the printed solder paste is protected from being contacted and the solder paste form is not damaged.

[0110] As Figure 12 shown, the specific calculation steps for determining the position of the second avoiding wheel 1338 on the adjusting groove 13311 are as follows: defining the radius of the second avoiding wheel 1338 as R2, the length (arc length) of the tape carrier tape 5 on the guide wheel as L, the arc length corresponding angle as θ, the projection of the arc length in the X direction as Lx, and the projection in the Y direction as Ly. According to the above conditions, the following equations can be listed.

[0111]

[0112]

[0113] In combination with the constraint conditions and the abstract graphic geometric constraints, the following variable constraints are listed:

[0114]

[0115] In order to avoid the height of the solder paste, a relatively large redundancy is taken:

[0116]

[0117] The length of the tape carrier tape 5 on the guide wheel The projection in the horizontal direction must be smaller than its length itself:

[0118]

[0119] Since the length of the tape carrier tape 5 on the guide wheel corresponds to an angle of ° to °:

[0120]

[0121] According to the material properties of the tape carrier tape 5, it can be obtained through experiments that short-time bending has little effect on product performance when the bending radius is above 1.75 mm, and the redundant value is taken, and the actual adopted bending radius is limited as follows:

[0122]

[0123] The image as shown in Figure 13 is obtained, the vertical coordinate is (mm), the horizontal coordinate is (°), and the starting point of the leftmost line segment of the table is taken as the reference, from top to bottom, the first curve, the first horizontal line, the second curve and the third curve are respectively, and the vertical lines from left to right are respectively the first vertical line and the second vertical line, and the first curve is the curve of equation ① when the constraint condition ③ is taken as the extreme value; the second curve is the curve of equation ② when the constraint condition ④ is taken as the extreme value.​​​​ The curve at time; the first and second vertical lines represent The extreme values ​​are defined by the first horizontal line, which is the intersection of the maximum extreme value and the first curve in equation ①. The range of values ​​for is the closed interval of the curves above it within the constraints. Intersection Therefore, the radius of the first clearance wheel 1337 can be determined. Using a bearing with a radius of less than 4.9mm and more than 2mm as the first clearance wheel 1337 can ensure that the strip product will not be damaged without damaging the printed solder paste within the bending angle range of 45° to 90°.

[0124] In this embodiment, as Figure 8 and Figure 9 As shown, the first conveying structure 131 includes a first conveying track 1311, a first motor 1312, a first mounting base 1313, a first mounting frame 1314, a damping drive wheel 1315, and a damping driven wheel 1316. The first conveying track 1311 is connected to a limiting member 1331, and a vertical first through hole is formed on the first conveying track 1311. The first mounting base 1313 and the first mounting frame 1314 are mounted on the first conveying track 1311. The first motor 1312 is mounted on the first mounting base 1313. The damping drive wheel 1315 and the damping driven wheel 1316 are arranged vertically at the position of the first through hole. Both the damping drive wheel 1315 and the damping driven wheel 1316 are mounted on the first mounting frame 1314. The damping drive wheel 1315 is connected to the output end of the first motor 1312. The first motor 1312 is a damping motor.

[0125] The output of the first motor 1312 delivers a constant damping torque to the damping drive wheel 1315. The damping drive wheel 1315 rotates with a fixed torque, driving the roll carrier belt 5 at this position to tend to move away from the limiting member 1331, ensuring that the roll carrier belt 5 maintains tension. The damping driven wheel 1316 below presses the roll carrier belt 5 against the damping drive wheel 1315, preventing relative displacement between the roll carrier belt 5 and the surface of the damping drive wheel 1315, avoiding slippage of the drive wheel, and ensuring the stability of torque and tension. The surfaces of the damping drive wheel 1315 and the damping driven wheel 1316 are made of flexible material to prevent them from scratching the roll carrier belt 5.

[0126] The first conveying track 1311 can be configured as a double layer, with the roll carrier belt 5 located between the double layers of the first conveying track 1311.

[0127] In this embodiment, as Figures 10 to 11As shown, the second conveying structure 132 comprises a second conveying track 1321, a second motor 1322, a second mounting base 1323, a driving wheel 1324 and a cover plate 1326. The second conveying track 1321 is connected with a limiting piece 1331, and a second through hole is vertically formed in the second conveying track 1321. The second motor 1322 is mounted on the second conveying track 1321 through the second mounting base 1323, and the axial direction of the output shaft of the second motor 1322 is perpendicular to the conveying direction. Two driving wheels 1324 are provided, and two driving members 1333 are mounted on the second motor 1322. The annular side wall of each driving wheel 1324 is provided with a plurality of driving teeth 1325 along the circumferential direction, and at least part of the driving wheel 1324 penetrates through the second through hole to the upper side of the second conveying track 1321. The cover plate 1326 is hinged on the second mounting base 1323, and the cover plate 1326 can be covered above the driving wheel 1324.

[0128] Through the above arrangement, the second conveying structure 132 plays a role in conveying the reel tape carrier tape 5. The output end of the second motor 1322 is further provided with a speed reducer, and the second motor 1322 drives the driving wheel 1324 to rotate through the speed reducer. The driving teeth 1325 on the part of the driving wheel 1324 penetrating through the second through hole to the upper side of the second conveying track 1321 are inserted into the positioning holes 511 on both sides of the reel tape carrier tape 5, so as to drive the reel tape carrier tape 5 to move. With the continuous rotation of the driving wheel 1324, the driving teeth 1325 thereon cooperate with the positioning holes 511 to drive the reel tape carrier tape 5 to continuously move. When the limiting piece 1331 and the suction member 1332 are in the lowest position, the second conveying structure 132 is started to drive the reel tape carrier tape 5 to move. When the limiting piece 1331 and the suction member 1332 are in the uppermost position, the second conveying structure 132 stops conveying so as to facilitate the external solder paste printing mechanism to print the reel tape carrier tape 5. Each movement is a fixed step, which is used to ensure the accuracy of the running position of the reel tape carrier tape 5 at each step. Before the second conveying structure 132 conveys, the cover plate 1326 can be opened to place the reel tape carrier tape 5. During the working process, the cover plate 1326 needs to be covered above the reel tape carrier tape 5 to prevent the reel tape carrier tape 5 from being separated from the driving teeth 1325 on the driving wheel 1324.

[0129] In the embodiment, as shown in Figure 4 、 Figures 8 to 11 , the first conveying track 1311 and the second conveying track 1321 are arc-shaped tracks away from the one end of the lifting and suction structure 133, which can make the reel tape carrier tape 5 smoothly transition between the upstream and downstream devices.

[0130] In the embodiment, as shown in Figure 1As shown, the flip chip structure 2 includes, in sequence along the conveying direction of the tape carrier tape 5: a third conveying roller 21, a flip chip unit 22, a fourth conveying roller 23, and a first winding structure 24; the third conveying roller 21 is configured to receive the tape carrier tape 5 output from the second conveying roller 14 and convey it into the flip chip unit 22, and the fourth conveying roller 23 is configured to receive the tape carrier tape 5 output from the flip chip unit 22; and the first winding structure 24 is configured to recycle the tape carrier tape 5 output from the fourth conveying roller 23.

[0131] The third conveying roller 21 receives the tape carrier tape 5 with printed solder paste conveyed from the upstream second conveying roller 14, and ensures that the tape carrier tape 5 enters the flip chip unit 22 smoothly at a correct height and angle. The flip chip unit 22 identifies the chip by mapping and high-precision camera, sucks up the chip with bump balls by a mechanical arm, flips the chip by another mechanical arm, at this time the back of the chip is adsorbed, and then places it to a position for brushing solder paste, to complete the flip of the chip and the initial soldering. The high-precision camera simultaneously identifies the bump on the flipped chip and the position of the solder paste already printed on the tape carrier, so that the two can be accurately mounted. The fourth conveying roller 23 receives the tape carrier tape 5 output from the flip chip unit 22, and its function is symmetrical to the third conveying roller 21 but in the opposite direction, and smoothly leads the tape carrier tape 5 with completed flip chip out of the flip chip unit 22. The first winding structure 24 is the same as the first unwinding structure 11 but in the opposite direction, and can neatly wind up the semi-finished tape carrier tape 5 with completed flip chip.

[0132] Through the above structure, the modular integration of high-precision process is realized, the flip chip process is integrated into the continuous tape production system, and the design of the conveying roller and the winding structure realizes the transportation of the tape carrier tape 5, ensures the continuous and stable movement of the tape carrier tape 5 in the solder paste printing structure 1, and meets the production requirements of high-speed flip chip.

[0133] In this embodiment, as shown, Figure 2 The reflow soldering structure 3 includes, in sequence along the conveying direction of the tape carrier tape 5: a second unwinding structure 31, a fifth conveying roller 32, a reflow furnace 33, a sixth conveying roller 34, and a second winding structure 35; the second unwinding structure 31 is configured to release the tape carrier tape 5 with flip-chipped chips; the fifth conveying roller 32 is configured to receive the tape carrier tape 5 with flip-chipped chips released by the second unwinding structure 31 and convey it into the reflow furnace 33; the sixth conveying roller 34 is configured to receive the tape carrier tape 5 output from the reflow furnace 33; and the second winding structure 35 is configured to recycle the tape carrier tape 5 output from the sixth conveying roller 34.

[0134] The second unwinding structure 31 is consistent with the first unwinding structure 11 in structure and function, and will not be described in detail here. It releases the semi-finished tape carrier tape 5 of the patch. The fifth transmission roller 32 receives the tape carrier tape 5 released by the second unwinding structure 31 and accurately guides it into the reflow oven 33. The sixth transmission roller 34 receives the tape carrier tape 5 from the high-temperature area of the reflow oven 33 and starts natural cooling or assisted air cooling. The second winding structure 35 is consistent with the first winding structure 24 in structure and function, and will not be described in detail here. It is the driving force source for pulling the tape carrier tape 5 through the entire reflow oven 33. It collects the finished tape carrier tape 5 after reflow soldering and facilitates the flow to the next process.

[0135] In the above embodiment, the reflow oven 33 is provided with a closed transmission track. The movement speed of the transmission track in the reflow oven 33 is obtained in real time, and cooperates with the second unwinding structure 31, the fifth transmission roller 32, the sixth transmission roller 34 and the second winding structure 35 outside to drive the tape carrier tape 5 to run at the same linear speed as the transmission track inside, and pull the tape carrier tape through each temperature zone at a constant speed, meeting the temperature curve required by reflow soldering.

[0136] In the present embodiment, as shown in Figure 3 The filling and curing structure 4 includes, in sequence along the transmission direction of the tape carrier tape 5, a third unwinding structure 41, a seventh transmission roller 42, a dispensing machine 43, an eighth transmission roller 44, a ninth transmission roller 45, a curing oven 46 and a third winding structure 48. The third unwinding structure 41 is used to release the tape carrier tape 5 after reflow soldering. The seventh transmission roller 42 is used to receive the tape carrier tape 5 released by the third unwinding structure 41 and deliver it to the dispensing machine 43. The dispensing machine 43 dispenses glue on the chip. The eighth transmission roller 44 is used to receive the tape carrier tape 5 after dispensing output by the dispensing machine 43. The ninth transmission roller 45 is used to receive the tape carrier tape 5 output by the eighth transmission roller 44 and deliver it into the curing oven 46. The curing oven 46 cures the filling glue on the tape carrier tape 5. The tenth transmission roller 47 is used to receive the tape carrier tape 5 output by the curing oven 46. The third winding structure 48 is used to recover the tape carrier tape 5 output by the tenth transmission roller 47.

[0137] The third unwinding structure 41 is consistent with the structure and function of the first unwinding structure 11, and will not be described in detail here. It carries and releases the tape carrier tape 5 from the reflow soldering process. The seventh transmission roller 42 receives the tape carrier tape 5 output by the third unwinding structure 41 and guides the tape carrier tape 5 to the dispensing machine 43. The dispensing machine 43 is provided with a dispensing head. According to the program setting, the dispensing head accurately injects a specific amount of epoxy resin glue on one side or both sides of the chip. The glue automatically flows into the narrow gap at the bottom of the chip under the action of capillary force, fills the space between the chip and the carrier tape, and covers the side and part of the back of the chip at the same time, realizing encapsulation. The eighth transmission roller 44 receives the tape carrier tape 5 output by the dispensing machine 43 and transmits it to the ninth transmission roller 45. The ninth transmission roller 45 inputs the tape carrier tape 5 into the curing oven 46. The curing oven 46 heats under a set temperature curve, causing the flowing glue to undergo a cross-linking chemical reaction, becoming a solid that is strong and highly reliable, thereby performing packaging. The tenth transmission roller 47 guides the carrier tape that has completed curing out of the high-temperature furnace,

[0138] The third winding structure 48 neatly winds the finished carrier tape that has completed all packaging processes from the tenth transmission roller 47 into a reel, facilitating subsequent testing, slitting, and packaging.

[0139] In this embodiment, as shown in Figure 1 and Figure 3 The tape carrier tape 5 between the second transmission roller 14 and the third transmission roller 21 and the tape carrier tape 5 between the eighth transmission roller 44 and the ninth transmission roller 45 are downwardly recessed.

[0140] These two downwardly recessed areas establish a passive, physical buffer area using the natural sagging formed by gravity. The tape carrier tape 5 between the second transmission roller 14 and the third transmission roller 21 and the tape carrier tape 5 between the eighth transmission roller 44 and the ninth transmission roller 45 assume a U shape.

[0141] The second transmission roller 14 and the third transmission roller 21 are used to coordinate the production cycle difference between the previous and subsequent processes. The second conveying structure 132 in the solder paste printing unit 13 starts or stops by judging the remaining amount of the tape carrier tape 5 in the second transmission roller 14 and the third transmission roller 21, ensuring that there is enough carrier tape between the second transmission roller 14 and the third transmission roller 21, preventing the subsequent process from being affected, and ensuring that the flip chip unit 22 continuously produces without stopping.

[0142] When the flip chip unit 22 is working, it will pull some of the tape carrier tape 5 from between the second transmission roller 14 and the third transmission roller 21, and the degree of sagging will gradually decrease. By monitoring the sagging height in real time, the system can intelligently start and stop the solder paste printing unit 13, ensuring that there is always material in the second transmission roller 14 and the third transmission roller 21, thereby ensuring the continuous production of the flip chip unit 22.

[0143] The eighth transport roller 44 and the ninth transport roller 45 form a non-linear path buffer section, which is required for the glue to complete the capillary flow to fully fill the gap at the bottom of the chip and to discharge the air. The curved path increases the length of the tape transport, thereby creating the necessary dwell time to ensure that the filling effect is sufficient and uniform, and to avoid the formation of voids.

[0144] According to the embodiment of the present application, in another aspect, a continuous production process of the tape carrier tape 5 chip is also provided, which is suitable for the continuous production device of the tape carrier tape 5 chip described above, and the production process specifically includes: continuously feeding the tape carrier tape 5 into the solder paste printing structure 1 to print the solder paste at a predetermined position of the tape carrier tape 5; then feeding the tape carrier tape 5 printed with the solder paste into the flip chip structure 2, which flips and mounts the chip to the position of the tape carrier tape 5 printed with the solder paste; feeding the tape carrier tape 5 with the flip-chip into the reflow oven 33 to perform reflow soldering; feeding the tape carrier tape 5 with the completed reflow soldering into the filling and curing structure 4 to perform glue dispensing and filling at the bottom of the chip and to wrap the surface of the chip, and then feeding the tape carrier tape 5 after glue dispensing into the curing oven 46 to perform curing. The specific steps are described above in the embodiment, and will not be described in detail here. The continuous production process of the tape carrier tape 5 chip is matched with the continuous production device of the tape carrier tape 5 chip to realize the continuous production of the tape carrier tape 5 chip and to improve the production efficiency.

[0145] Although the embodiments of the present application are described in conjunction with the drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes fall within the scope defined by the appended claims.

Claims

1. A continuous production apparatus for roll-to-roll carrier chips, characterized in that, Comprise: A tin paste printing structure (1) for conveying a reel tape carrier tape (5) and printing tin paste on the reel tape carrier tape (5); A flip chip structure (2) arranged downstream of the tin paste printing structure (1), the flip chip structure (2) is used to flip the chip to be mounted on the reel tape carrier tape (5) after printing tin paste; A reflow soldering structure (3) arranged downstream of the flip chip structure (2), the reflow soldering structure (3) is used to reflow solder the reel tape carrier tape (5) with the chip mounted; A filling and curing structure (4) arranged downstream of the reflow soldering structure (3), the filling and curing structure (4) is used to bottom glue filling and curing for the module after reflow soldering; The reel tape carrier tape (5) comprises: A continuous reel tape substrate (51) provided with a plurality of chip mounting areas; A plurality of chip mounting structures (52) are arranged on the chip mounting areas; The chip mounting structure (52) comprises: A first circuit (521) arranged in an irregular shape on the front surface of the continuous reel tape substrate (51), the chip is adapted to be flip-chip soldered on the front surface of the continuous reel tape substrate (51) so that the flip-chip soldered points of the chip are connected with the first circuit (521); A gold finger pad array (522) corresponding to the first circuit (521) is arranged on the back surface of the continuous reel tape substrate (51); A conductive via (523) penetrates the substrate to realize the electrical interconnection between the first circuit (521) and the gold finger pad array (522); The tin paste printing structure (1) comprises a first unwinding structure (11), a first transmission roller (12), a tin paste printing unit (13) and a second transmission roller (14) arranged in sequence along the transmission direction of the reel tape carrier tape (5); The first unwinding structure (11) is used to release the reel tape carrier tape (5); The first transmission roller (12) is used to receive the reel tape carrier tape (5) released by the first unwinding structure (11) and transmit it to the tin paste printing unit (13); The second transmission roller (14) is used to receive the reel tape carrier tape (5) output by the tin paste printing unit (13); The flip chip structure (2) comprises a third transmission roller (21), a flip chip unit (22), a fourth transmission roller (23) and a first winding structure (24) arranged in sequence along the transmission direction of the reel tape carrier tape (5); The third transmission roller (21) is used to receive the reel tape carrier tape (5) output from the second transmission roller (14) and deliver it to the flip chip unit (22), The fourth transmission roller (23) is used to receive the reel tape carrier tape (5) output by the flip chip unit (22); The first winding structure (24) is used for recycling the tape carrier tape (5) output by the fourth transmission roller (23); The filling and curing structure (4) comprises, in sequence along the transmission direction of the tape carrier tape (5): a third unwinding structure (41), a seventh transmission roller (42), a glue dispenser (43), an eighth transmission roller (44), a ninth transmission roller (45), a curing furnace (46), a tenth transmission roller (47) and a third winding structure (48); The third unwinding structure (41) is used for releasing the tape carrier tape (5) after reflow soldering; The seventh transmission roller (42) is used for receiving the tape carrier tape (5) released by the third unwinding structure (41) and conveying it to the glue dispenser (43); the glue dispenser (43) dispenses glue on the chip; The eighth transmission roller (44) is used for receiving the tape carrier tape (5) dispensed by the glue dispenser (43); The ninth transmission roller (45) is used for receiving the tape carrier tape (5) output by the eighth transmission roller (44) and conveying it into the curing furnace (46); the curing furnace (46) cures the filling glue on the tape carrier tape (5); The tenth transmission roller (47) is used for receiving the tape carrier tape (5) output by the curing furnace (46); The third winding structure (48) is used for recycling the tape carrier tape (5) output by the tenth transmission roller (47); The tape carrier tape (5) between the second transmission roller (14) and the third transmission roller (21) and the tape carrier tape (5) between the eighth transmission roller (44) and the ninth transmission roller (45) are downwardly recessed.

2. The apparatus according to claim 1, wherein The tin paste printing unit (13) comprises: A first conveying structure (131) and a second conveying structure (132), which are arranged at intervals along the transmission direction of the tape carrier tape (5); A lifting and adsorbing structure (133) is installed between the first conveying structure (131) and the second conveying structure (132); the first conveying structure (131), the lifting and adsorbing structure (133) and the second conveying structure (132) combine to form a conveying channel for conveying the tape carrier tape (5); The lifting and adsorbing structure (133) has a first working state of lifting the tape carrier tape (5) to a first working position; and a second working state of lowering the tape carrier tape (5) to a second working position.

3. The apparatus according to claim 2, wherein The lifting and adsorbing structure (133) comprises: Two limiting members (1331) are arranged at intervals along the direction perpendicular to the transmission direction of the tape carrier tape (5); the two ends of the limiting member (1331) are respectively connected with the first conveying structure (131) and the second conveying structure (132); An adsorbing member (1332) is installed between the two limiting members (1331). A driving member (1333) has an output end connected with the suction accessory (1332).

4. The apparatus according to claim 1, wherein The reflow soldering structure (3) comprises, sequentially along a conveying direction of the tape carrier tape (5), a second unwinding structure (31), a fifth conveying roller (32), a reflow furnace (33), a sixth conveying roller (34) and a second winding structure (35). The second unwinding structure (31) is used for releasing the flip chip-mounted tape carrier tape (5). The fifth conveying roller (32) is used for receiving the flip chip-mounted tape carrier tape (5) released by the second unwinding structure (31) and conveying the flip chip-mounted tape carrier tape (5) into the reflow furnace (33). The sixth conveying roller (34) is used for receiving the tape carrier tape (5) output by the reflow furnace (33). The second winding structure (35) is used for recycling the tape carrier tape (5) output by the sixth conveying roller (34).

5. A continuous process for producing a tape carrier chip on film, characterized by, The continuous production device of the flip chip-mounted tape carrier tape (5) is suitable for the tape carrier tape (5) of any one of claims 1-4. The production process specifically comprises the following steps: continuously feeding the tape carrier tape (5) into the tin paste printing structure (1) to print tin paste at a predetermined position of the tape carrier tape (5); subsequently feeding the tape carrier tape (5) printed with tin paste into the flip chip mounting structure (2), the flip chip mounting structure (2) flips and mounts the chip to the position of the tape carrier printed with tin paste; feeding the tape carrier tape (5) mounted with the flip chip into the reflow furnace (33) to perform reflow soldering; feeding the tape carrier tape (5) after the reflow soldering into the filling and curing structure (4) to perform glue dispensing and filling at the bottom of the chip and to wrap the surface of the chip, and subsequently feeding the tape carrier tape (5) after the glue dispensing into the curing furnace (46) to perform curing. ​

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