Inkjet adaptive planarization compositions

The new inkjet adaptive planarization composition with a specific solvent content addresses discharge instability, placement inaccuracies, and enhances filling and photocuring abilities, improving heat resistance and film adhesion, thus enhancing manufacturing efficiency.

WO2026131932A1PCT designated stage Publication Date: 2026-06-25MERCK PATENT GMBH

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
MERCK PATENT GMBH
Filing Date
2025-12-17
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Existing inkjet adaptive planarization compositions face issues with instability in discharge, inaccurate placement, insufficient filling ability, photocuring inefficiency, poor heat resistance, film shrinkage, adhesion, and cracking, along with insufficient etch resistance and void formation in cured films.

Method used

A new inkjet adaptive planarization composition comprising an organic compound, a photo initiator, and a solvent with a specific solvent content range of 0.5 to 40 mass%, preferably 0.8 to 20 mass%, and more preferably 1 to 10 mass%, which stabilizes discharge, ensures accurate placement, enhances filling and photocuring abilities, improves heat resistance, suppresses shrinkage, and prevents cracking and void formation.

Benefits of technology

The composition achieves stable discharge, accurate placement, sufficient filling, improved photocuring, enhanced heat resistance, suppressed shrinkage, and reduced cracking, while maintaining film adhesion and etch resistance, thereby increasing manufacturing efficiency.

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Patent Text Reader

Abstract

The present application relates to inkjet adaptive planarization compositions, methods of forming a cured film, methods of manufacturing a device, and uses of a composition for inkjet adaptive planarization. The formulation may exhibit at least one of properties as an advanced material or as a high-performance material. The formulation may be used in the nanotechnology process to make semiconductor device / display device application, for example semiconductor chip, or a liquid crystal, quantum dot, OLED display fabricated on a substrate controlled by semiconductors.
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Description

[0001] Foreignfiling text P24-233-SEC-WO01 20250926

[0002] - 1 -

[0003] Inkjet adaptive planarization compositions

[0004] FIELD OF THE INVENTION

[0005] The present application relates to inkjet adaptive planarization compositions,

[0006] 5 methods of forming a cured film, methods of manufacturing a device, and uses of a composition for inkjet adaptive planarization.

[0007] BACKGROUND OF THE INVENTION

[0008] Inkjet Adaptive Planarization (IAP) is a process to apply a planarized material on a surface of a substrate. The process contains steps of jetting liquid drops of a photocurable composition on the surface of the substrate and bringing a superstrate in direct contact with the added liquid to form a liquid layer.

[0009] PRIOR ART DOCUMENTS

[0010] PATENT DOCUMENTS

[0011] [Patent document 1 ] US 2024-191088 A

[0012] [Patent document 2] US 2023-203210 A

[0013] Patent Document 1 studies a curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c) for a planarizing technique.

[0014] Patent Document 2 studies a photocurable composition comprising a polymerizable material and a photo initiator which can be adapted for use in inkjet adaptive planarization (IAP) or nanoimprint lithography (NIL).

[0015] SUMMARY OF THE INVENTION

[0016] The inventors newly have found that there are still one or more of considerable problems for which improvement is desired, as listed below:

[0017] 30 an inkjet adaptive planarization composition is discharged unstably by an inkjet device, an inkjet adaptive planarization composition is not accurately arranged at designated portions, filling ability of an inkjet adaptive Foreignfiling text P24-233-SEC-WO01 20250926

[0018] - 2 - planarization composition into holes of a substrate is insufficient, filling ability of a cured film into holes of a substrate is insufficient, photocuring ability of an inkjet adaptive planarization composition is insufficient, heat resistance of a cured film is insufficient, shrinkage of a film by heating is not suppressed, a

[0019] 5 cured film peels off due to its shrinkage, weight loss of a film is not suppressed, planarity of a cured film is insufficient, viscosity of a composition is not low enough to be used for inkjet adaptive planarization, an inkjet adaptive planarization composition doesn’t spread sufficiently above a substrate when the composition is brought into contact with a superstrate, affinity of an inkjet adaptive planarization composition to a substrate is insufficient, a superstrate can’t be released from a cured film, a superstrate can’t be released from a cured film without breaking the cured film, a crack of a cured film occurs, a solvent contained in an inkjet adaptive planarization composition vaporizes, etch resistance of a cured film is insufficient, a void occurs in a cured film, adhesion of a cured film to a substrate is insufficient, and efficiency of manufacturing process is insufficient.

[0020] The inventors aimed to solve one or more of the above-mentioned problems. Then, the present inventors have surprisingly found that one or more of the above-described technical problems can be solved by the features as defined in the claims.

[0021] Namely, it is found a new inkjet adaptive planarization composition comprising, essentially consisting of, or consisting of, an organic compound (A), a photo initiator and a solvent (S); wherein the content of the solvent (S) is in the range from 0.5 to 40 mass%, preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.

[0022] 30 In another aspect, the invention further relates to a method of forming a cured film comprising the following steps (i-1 ), (ii) and (iii) in the following order; Foreignfiling text P24-233-SEC-WO01 20250926

[0023] - 3 -

[0024] (i-1 ) arranging droplets of the inkjet adaptive planarization composition of the present invention above a substrate by an inkjet method;

[0025] (ii) bringing the composition into contact with a superstrate;

[0026] (iii) irradiating the composition with light to polymerize the organic compound

[0027] 5 (A).

[0028] In another aspect, the invention furthermore relates to a method of manufacturing a device comprising the following steps (I) and (II);

[0029] (I) forming a cured film by the method of the present invention;

[0030] (II) processing the substrate.

[0031] In another aspect, the invention furthermore relates to use of a composition for inkjet adaptive planarization, wherein the composition comprises an organic compound (A), a photo initiator and a solvent (S); wherein the content of the solvent (S) is in the range from 0.5 to 40 mass%, preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.

[0032] TECHNICAL EFFECTS OF THE INVENTION

[0033] The present invention may provide one or more of the following effects: an inkjet adaptive planarization composition is discharged stably by an inkjet device, an inkjet adaptive planarization composition is sufficiently accurately arranged at designated portions, filling ability of an inkjet adaptive planarization composition into holes of a substrate is sufficient, filling ability of a cured film into holes of a substrate is sufficient, photocuring ability of an inkjet adaptive planarization composition is sufficient, heat resistance of a cured film is sufficient, shrinkage of a film by heating is suppressed, a cured film due to its shrinkage is suppressed, weight loss of a film is suppressed,

[0034] 30 planarity of a cured film is sufficient, viscosity of a composition is low enough to be used for inkjet adaptive planarization, an inkjet adaptive planarization composition spread sufficiently above a substrate when the composition is Foreignfiling text P24-233-SEC-WO01 20250926

[0035] - 4 - brought into contact with a superstrate, affinity of an inkjet adaptive planarization composition to a substrate is sufficient, a superstrate can be released from a cured film, a superstrate can be released from a cured film without breaking the cured film, a crack of a cured film is suppressed,

[0036] 5 vaporization of a solvent contained in an inkjet adaptive planarization composition is suppressed, etch resistance of a cured film is sufficient, a void of a cured film is suppressed, adhesion of a cured film to a substrate is sufficient, and efficiency of manufacturing process is sufficient.

[0037] [Definition of the terms]

[0038] Unless otherwise specified in the present specification, the definitions and examples described in this paragraph are followed.

[0039] The singular form includes the plural form and “one” or “that” means “at least one”. An element of a concept can be expressed by a plurality of species, and when the amount (for example, mass % or mol%) is described, it means sum of the plurality of species. “And / or” includes a combination of all elements and also includes single use of the element.

[0040] When a numerical range is indicated using “to” or it includes both endpoints and units thereof are common. For example, 5 to 25 mol% means 5 mol% or more and 25 mol% or less.

[0041] The descriptions such as “Cx-y”, “Cx-Cy” and “Cx” mean the number of carbons in a molecule or substituent. For example, C1-6 alkyl means an alkyl chain having 1 or more and 6 or less carbons (methyl, ethyl, propyl, butyl, pentyl, hexyl etc.).

[0042] When a polymer has a plural type of repeating units, these repeating units copolymerize. The copolymerization of these repeating units is any of

[0043] 30 alternating copolymerization, random copolymerization, block copolymerization, graft copolymerization, or a mixture thereof. When polymer Foreignfiling text P24-233-SEC-WO01 20250926

[0044] - 5 - or resin is represented by a structural formula, n, m or the like that is attached next to parentheses indicate the number of repetitions.

[0045] Celsius is used as the temperature unit. For example, 20 degrees means 20

[0046] 5 degrees Celsius.

[0047] The additive refers to a compound itself having a function thereof (for example, in the case of a base generator, a compound itself that generates a base). An embodiment in which the compound is dissolved or dispersed in a solvent and added to a composition is also possible.

[0048] DETAILED DESCRIPTION OF THE INVENTION

[0049] Hereinafter, embodiments of the present invention are described in detail.

[0050] [Inkjet adaptive planarization composition]

[0051] The Inkjet adaptive planarization composition according to the present invention (hereinafter, referred to as “ the composition”) comprises, essentially consists of, or consists of, an organic compound (A), a photo initiator and a solvent (S).

[0052] In a preferable embodiment, the viscosity of the composition is in the range from 1 to 25mPa s, preferably 3 to 23mPa s, more preferably 5 to 21 mPa s, further preferably 10 to 20mPa s.

[0053] In the present invention, “viscosity” means kinematic viscosity.

[0054] The viscosity of the composition may be measured by Cannon-Fenske Routine capillary viscometer (Industrial Research Glassware LTD). The measurement steps are the followings.

[0055] The composition is measured at 8 ml with a glass pipette and loaded into a

[0056] 30 capillary viscometer of size 150. The solution temperature is maintained at 23°C in a waterbath with a digitized temperature control system. The viscometer is placed into the holder vertically and inserted into the waterbath Foreignfiling text P24-233-SEC-WO01 20250926

[0057] - 6 - that is maintained at 23°C. The efflux time is measured by allowing the solution to flow freely down past marks. The kinematic viscosity of liquid sample in centistokes is calculated by multiplying the efflux time in seconds by the viscometer constant (0.035).

[0058] 5

[0059] - Solvent (S)

[0060] The composition comprises a solvent (S). The content of the solvent (S) is in the range from 0.5 to 40 mass%, preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.

[0061] It is believed that the viscosity of the composition gets adjusted so that the composition can be used for inkjet adaptive planarization when the content of the solvent (S) is in the range from 0.5 to 40 mass% based on the composition.

[0062] The solvent (S) may be a mixture of two or more different solvents.

[0063] In a preferable embodiment of the present invention, the boiling point of the solvent (S) is in the range from 60 to 200°C, preferably 70 to 180°C, more preferably 80 to 160°C, further preferably 80 to 145°C.

[0064] In the present invention, the boiling point of the solvent (S) is the boiling point at 1 atm.

[0065] It is believed that the viscosity of the composition more efficiently gets adjusted so that the composition can be used for inkjet adaptive planarization when the boiling point of the solvent (S) is in the range from 60 to 200°C.

[0066] In another preferable embodiment of the present invention, the solvent (S)

[0067] 30 comprises one or more hydroxy or -CO-O-, preferably the solvent (S) is an alcohol or an ester, more preferably a primary or secondary alcohol, or an ester, further preferably a secondary alcohol or an ester. Foreignfiling text P24-233-SEC-WO01 20250926

[0068] - 7 -

[0069] It is believed that the viscosity of the composition furthermore efficiently gets adjusted so that the composition can be used for inkjet adaptive planarization when the solvent (S) comprises one or more hydroxy or -CO-O-.

[0070] 5

[0071] In another preferable embodiment of the present invention, the solvent (S) is represented by formula (1 -i) or (1-ii);

[0072] R11is H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl, or cyclic C3-10 alkyl; more preferably H, linear C1-7 alkyl or branched C3-7 alkyl; further preferably H, linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably H, methyl, ethyl, i-propyl, n-propyl, n-butyl, sec-butyl, i-butyl or t- butyl.

[0073] R12is C1-10 alkyl; preferably linear C1-10 alkyl, branched C3-10 alkyl, or cyclic C3- 10 alkyl; more preferably linear C1-7 alkyl or branched C3-7 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably methyl, ethyl, i-propyl, n-propyl, n-butyl, sec-butyl, i-butyl or t-butyl.

[0074] L11is a single bond or C1-10 alkylene; preferably a single bond, linear C1-10 alkylene, branched C3-10 alkylene, or cyclic C3-10 alkylene; more preferably a single bond, linear C1-7 alkylene or branched C3-7 alkylene; further preferably a single bond, linear C1-5 alkylene or branched C3-5 alkylene; furthermore preferably a single bond, methylene, ethylene, propylene, methylethylene, 1 - methylpropylene, 2-methylpropylene, 1 ,2-dimethylethylene, 1 ,1 - dimethylethylene, ethylethylene, n-propylmethylene or i-propylmethylene. One or more of non-adjacent -CH2- of R11, R12, and L11may independently

[0075] 30 be replaced with -O-, -S-, -CO-, -CO-O-, -O-CO-, -O-CO-O-, -CR13=CR14- or - C=C-; preferably none of -CH2- of R11, R12, and L11is replaced with any other linker. Foreignfiling text P24-233-SEC-WO01 20250926

[0076] - 8 -

[0077] R13and R14are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl, or cyclic C3-10 alkyl; more preferably H or linear Cis alkyl; further preferably H, methyl, ethyl, n-propyl or n-butyl.

[0078] One or more H of R11, R12and L11may each independently be replaced with

[0079] 5 OH or COOH; preferably none of H of R11, R12and L11is replaced with any other substituent. n11 is 0 or 1 , preferably 1 .

[0080] In a preferable embodiment of the present invention, at least one of R11and R12is methyl, ethyl, i-propyl or n-propyl; preferably at least one of R11and R12is methyl or ethyl; more preferably R11and R12are methyl or ethyl; further preferably R11and R12are methyl.

[0081] In a more preferable embodiment of the present invention, L11is a single bond, methylene or ethylene when R11and R12are methyl; preferably L11is a single bond or methylene when R11and R12are methyl.

[0082] R15and R16are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H, linear C1-7 alkyl or branched C3-7 alkyl; further preferably H, linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably H, methyl, ethyl, i-propyl, n-propyl, n-butyl, sec-butyl, i-butyl or t-butyl.

[0083] One or more of non-adjacent -CH2- of R15and R16may independently be replaced with -O-, -S-, -CO-, -CO-O-, -O-CO-, -O-CO-O-, -CR17=CR18- or - C=C-; preferably one or more -CH2- of R16is replaced with -O-, and none of -

[0084] 30 CH2- of R15is replaced with any other linker; more preferably one -CH2- of R16is replaced with -O-, and none of -CH2- of R15is replaced with any other linker. Foreignfiling text P24-233-SEC-WO01 20250926

[0085] - 9 -

[0086] R17and R18are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl; further preferably H, methyl, ethyl, n-propyl or n-butyl.

[0087] One or more H of R15and R16may each independently be replaced with OH

[0088] 5 or COOH; preferably one or more H of R15is replaced with OH, and none of H of R16is replaced with any other substituent; more preferably one H of R15is replaced with OH, and none of H of R16is replaced with any other substituent.

[0089] In a preferable embodiment of the present invention, R15is methyl, ethyl, i- propyl or n-propyl where one H of R15is replaced with OH or not; preferably methyl or ethyl where one H of R15is replaced with OH or not; more preferably methyl, or ethyl where one H is replaced with OH.

[0090] In a preferable embodiment of the present invention, R16is linear C1-5 alkyl or branched C3-5 alkyl where one -CH2- of R16is replaced with -0- or not; preferably linear C2-4 alkyl or branched Cs alkyl where one -CH2- of R16is replaced with -0- or not; more preferably ethyl, n-butyl, or 1 -methylbutyl where one -CH2- is replaced with -O-.

[0091] The following explains how to read the compound represented by the formula (a1 ) with the formula (1 -i):

[0092] R11is Ci alkyl (methyl), L11is Ci alkylene (methylene) where -CH2- is replaced with -CO-, R12is C2 alkyl (ethyl) and n11 is 1 .

[0093] 30 The following explains how to read the compound represented by the formula (a2) with the formula (1 -i): Foreignfiling text P24-233-SEC-WO01 20250926

[0094] - 10 -

[0095] R11is H, L11is Ci alkylene (methylene), R12is Ci alkyl (methyl) and

[0096] 5 n11 is 1.

[0097] The following explains how to read the compound represented by the formula (a3) with the formula (1-ii):

[0098] R15is Ci alkyl (methyl), R16is Cs alkyl where one -CH2- is replaced with -O-.

[0099] It is believed that the viscosity of the composition furthermore efficiently gets adjusted so that the composition can be used for inkjet adaptive planarization when the solvent (S) is represented by the formula (1 -i) or (1 -ii).

[0100] As one embodiment of this invention, the solvent (S) represented by formula (1 -i) is preferable. As another aspect of this invention, the solvent (S) represented by formula (1 -ii) is preferable.

[0101] The composition may comprise one or more solvents other than the solvent (S) (hereafter, referred to as “the other solvent”).

[0102] When the content of the solvent (S) is represented by SA and the content of the other solvent is represented by SB, SA / (SA+SB) is preferably in the range from 80 to 100 mass%, more preferably 90 to 100 mass%, and further preferably 95 to 100 mass%. It is also a preferred embodiment of the composition not to include the other solvent (SA / (SA+SB) =100 mass%).

[0103] 30 Foreignfiling text P24-233-SEC-WO01 20250926

[0104] - 11 -

[0105] In another preferable embodiment of the present invention, the molecular weight of the solvent (S) is in the range from 40 to 160, preferably 50 to 140, more preferably 60 to 120.

[0106] In the present invention, the molecular weight of the solvent (S) may be

[0107] 5 measured by methods known in the art such as cryoscopy.

[0108] The solvent (S) may be selected from one or more members of the following group consisting of methanol, ethanol, n-propanol, i-propanol, n-butanol, i- butanol, sec-butanol, t-butanol, n-pentanol, i-pentanol, 2-methylbutanol, secpentanol, t-pentanol, 3-methoxybutanol, n-hexanol, 2-methylpentanol, sechexanol, 2-ethylbutanol, sec-heptanol, heptanol-3, n-octanol, 2-ethylhexanol, sec-octanol, n-nonyl alcohol, 2,6-dimethylheptanol-4, n-decanol, sec-undecyl alcohol, trimethylnonyl alcohol, sec-tetradecyl alcohol, sec-heptadecyl alcohol, phenol, cyclohexanol, methylcyclohexanol, 3,3,5- trimethylcyclohexanol, benzyl alcohol, phenylmethylcarbinol, diacetone alcohol, cresol, toluene, anisole, cyclopentanone, cyclohexanone, ethylene glycol, propylene glycol, 1 ,3-butylene glycol, pentanediol-2,4, 2- methylpentanediol-2,4, hexanediol-2,5, heptanediol-2,4, 2-ethyl-1 ,3- hexanediol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, glycerin, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol mono-n-hexyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol mono-n-hexyl ether, ethoxytriglycol, propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono propyl ether, dipropylene glycol monobutyl ether, tripropylene glycol

[0109] 30 monomethyl ether, 4-methyl-2-pentanol, 3-methyl-2-pentanol, 2-methyl-2- pentanol, 3-methyl-2-butanol, 2-methyl-2-butanol, 4-methyl-2-hexanol, 5- methyl-2-hexanol, 3-methyl-2-hexanol, 2-methyl-2-hexanol, ethyl lactate (EL), Foreignfiling text P24-233-SEC-WO01 20250926

[0110] - 12 - propyl lactate, n-butyl lactate, n-butyl acetate, n-amyl lactate, butyric acid, methyl 2-hydroxyisobutyrate, methyl 2-hydroxybutyrate, methyl 3- hydroxybutyrate, methyl 4-hydroxy butyrate, ethyl 2-hydroxyisobutyrate, ethyl 2-hydroxybutyrate, ethyl 3-hydroxybutyric acid and ethyl 4-hydroxybutyrate;

[0111] 5 preferably selected from one or more members of the following group consisting of i-propanol, PGME, PGMEA, EL, toluene, n-butyl acetate, anisole, cyclopentanone and cyclohexanone; more preferably selected from one or more members of the following group consisting of n-butyl acetate, PGME, PGMEA and EL.

[0112] - Organic compound (A)

[0113] The composition comprises an organic compound (A). The composition may comprise two or more of the different organic compounds (A).

[0114] In a preferable embodiment of the present invention, the organic compound (A) comprises one or more double and / or triple bonds, preferably one or more unsaturated hydrocarbon groups, more preferably one or more vinyl and / or ethynyl, further preferably one or more vinyl, furthermore preferably two or more vinyl.

[0115] In a more preferable embodiment of the present invention, the organic compound (A) is represented by formula (2);

[0116] X21and X22are each independently -L22-CR23=CH2 or -L23-C=CH, preferably - L22-CR23=CH2.

[0117] 30 L21, L22and L23are each independently a single bond or C1-20 alkylene; preferably a single bond, linear C1-20 alkylene, branched C3-20 alkyl, or cyclic C3-20 alkylene; more preferably a single bond or linear C1-10 alkylene; further Foreignfiling text P24-233-SEC-WO01 20250926

[0118] - 13 - preferably a single bond or linear C1-5 alkylene; furthermore preferably a single bond, methylene or ethylene.

[0119] R21and R22are each independently C1-20 alkyl; preferably linear C1-20 alkyl, branched C3-20 alkyl, or cyclic C3-20 alkyl; more preferably linear C1-10 alkyl or

[0120] 5 branched C3-10 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably methyl, ethyl, i-propyl, n-propyl, n-butyl, sec-butyl, i- butyl or t-butyl.

[0121] R23is H or C1-20 alkyl; preferably H, linear C1-20 alkyl, branched C3-20 alkyl, or cyclic C3-20 alkyl; more preferably H, linear C1-10 alkyl or branched C3-10 alkyl;

[0122] 10 further preferably H, linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably H, methyl, ethyl, i-propyl, n-propyl, n-butyl, sec-butyl, i-butyl or t- butyl.

[0123] One or more non-adjacent -CH2- of R21, R22,R23, L21, L22and L23may each independently be replaced with -O-, -S-, -SO2-, -CO-, -CO-O-, -O-CO-, -O-CO- O-, -CR24=CR25- or -C=C- It is more preferable embodiment of this invention that none of -CH2- of R21, R22,R23, L21, L22, nor L23is replaced.

[0124] R24and R25are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl, or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl; further preferably H, methyl, ethyl, n-propyl or n-butyl.

[0125] 20 One or more H of R21, R22, R23, L21, L22and L23may each independently be replaced with OH or COOH. It is more preferable embodiment of this invention that none of H of R21, R22, R23, L21, L22nor L23is replaced. n20=0 or 1 ; preferably 1 .

[0126] When n20=0; m21 , m22, n21 and n22 are each independently 0 to 6; preferably m21 is 1 or 2 and m22 is 0.

[0127] When n20=0, m21 +m22+n21 +n22<6, and m21 +m22>0.

[0128] When n20=1 ; m21 , m22, n21 and n22 are each independently 0 to 5; preferably m21 and m22 are each independently 1 or 2.

[0129] When n20=1 ; m21 +n21 <5, m22+n22<5, and m21 +m22>0.

[0130] 30

[0131] In a preferable embodiment of the present invention, n20 is 1 and L21is methylene; more preferably n20 is 1 , L21is methylene, m21 is 2 and m22 is 1 ; Foreignfiling text P24-233-SEC-WO01 20250926

[0132] - 14 - further preferably n20 is 1 , L21is methylene, m21 is 2 and m22 is 1. X21and X22are -L22-CR23=CH2; furthermore preferably n20 is 1 , L21is methylene, m21 is 2 and m22 is 1 . X21and X22are -CR23=CH2.

[0133] 5 In another preferable embodiment of the present invention, the content of the organic compound (A) is in the range from 50 to 98 mass%, preferably 60 to 97 mass%, more preferably 70 to 96 mass%, further preferably 80 to 95 mass% based on the total amount of the composition.

[0134] The following explains how to read the compound represented by the formula (a4) with the formula (2); 22is a single bond, R23is H, L21is Ci alkylene (methylene), m21 is 2, m22 is 1 , and n20 is 1. n21 and n22 are 0.

[0135] The following explains how to read the compound represented by the formula (a5) with the formula (2);

[0136] The composition may comprise one or more organic compounds other than the organic compound (A) (hereafter, referred to as “the other organic compound”).

[0137] When the content of the organic compound (A) is represented by CA and the

[0138] 30 content of the other compound is represented by CB, CA / (CA+CB) is preferably in the range from 80 to 100 mass%, more preferably 90 to 100 mass%, and Foreignfiling text P24-233-SEC-WO01 20250926

[0139] - 15 - further preferably 95 to 100 mass%. It is also a preferred embodiment of the composition not to include the other compound (CA / (CA+CB) = 100 mass%).

[0140] In another preferable embodiment of the present invention, the molecular

[0141] 5 weight of the organic compound (A) is in the range from 170 to 450, preferably 200 to 400, more preferably 230 to 380, further preferably 250 to 350.

[0142] In the present invention, the molecular weight may be measured by gel permeation chromatography (GPC). In the measurement, it is a preferable example that a GPC column at 40 degrees Celsius, an elution solvent of tetrahydrofuran at 0.6 mL / min and monodisperse polystyrene as a standard are used.

[0143] In the present invention, the molecular weight may also be measured by methods known in the art other than GPC such as cryoscopy.

[0144] Exemplified embodiments of the organic compound (A) may be selected from one or more members of the following group consisting of;

[0145] 30 Foreignfiling text P24-233-SEC-WO01 20250926

[0146] - 16 -

[0147] - Photo initiator

[0148] The composition comprises a photo initiator. The composition may comprise

[0149] 20 two or more of the different photo initiators. The photo initiator generates radicals by radiation. Examples of the radiation includes visible light, ultraviolet light, infrared light, X-rays, electron beams, alpha rays, and gamma rays.

[0150] In a preferable embodiment of the present invention, the photo initiator is selected from one or more of members of the group consisting of 2,4,5- triarylimidazole dimer, benzophenone derivative, quinone, benzoin ether derivative, benzyl derivative, N-phenylglycine derivative, acetophenone derivative, thioxanthone derivative, acylphosphine oxide derivative and oxime ester derivative; preferably oxime ester derivative.

[0151] 30 Foreignfiling text P24-233-SEC-WO01 20250926

[0152] - 17 -

[0153] Examples of 2,4,5-triarylimidazole dimers include a 2-(o-chlorophenyl)-4,5- diphenylimidazole dimer, a 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, a 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, and a 2-(o- or p- methoxyphenyl)-4,5-diphenylimidazole dimer; examples of benzophenone

[0154] 5 derivatives include benzophenone, N,N'-tetramethyl-4,4'- diaminobenzophenone, N,N'-tetraethyl-4,4'-diaminobenzophenone, 4- methoxy-4'-dimethylaminobenzophenone, 4-chlorobenzophenone, 4,4'- dimethoxybenzophenone, and 4,4'-diaminobenzophenone; examples of quinones include 2-ethylanthraquinone, phenanthrenequinone, 2-t- butylanthraquinone, octamethylanthraquinone, 1 ,2-benzanthraquinone, 2,3- benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylamthraquinone, 1 - chloroanthraquinone, 2-methylanthraquinone, 1 ,4-naphtoquinone, 9,10- phenanthraquinone, 2-methyl-1 ,4-naphtoquinone, and 2,3- dimethylanthraquinone; examples of benzoin ether derivatives include benzoin methyl ether, benzoin ethyl ether, and benzoin phenyl ether; examples of benzoin derivatives include benzoin, methyl benzoin, ethyl benzoin, and propyl benzoin; examples of benzyl derivatives are include benzyldimethylketal; examples of N-phenylglycine derivatives include N-phenylglycine; examples of acetophenone derivatives include acetophenone, 3-methylacetophenone, acetophenone benzylketal, 1 -hydroxycylohexyl phenylketone, and 2,2- dimethoxy-2-phenyl acetophenone; examples of thioxanthone derivatives include thioxanthone, diethylthioxanthone, 2-isopropylthioxanthone, and 2- chlorothioxanthone; examples of acylphosphine oxide derivatives include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6- trimethylbenzoyl)phenylphosphine oxide, and bis-(2,6-dimethoxybenzoyl)- 2,4,4-trimethylpentylphosphine oxide; examples of oxime ester derivatives include 1 ,2-octanedione, 1 -[4-(phenylthiol)-,2-(O-benzoyloxime)] and 1 -[[[1 -[9- Ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethylidene]amino]oxy]ethan-1 -one.

[0155] 30 In another preferable embodiment of the present invention, the photo initiator is represented by the formula (3); Foreignfiling text P24-233-SEC-WO01 20250926

[0156] - 18 -

[0157] L31and L32are each independently a single bond, C1-20 alkylene or -NR36-;

[0158] 10 preferably a single bond, linear C1-20 alkylene, branched C3-20 alkyl, cyclic C3- 20 alkylene, or -NR36-; more preferably a single bond, linear C1-10 alkylene or - NR36-; further preferably linear C1-3 alkylene or -NR36-; furthermore preferably methyl, ethyl or -NR36-.

[0159] R31, R32, R33, R34, R35and R36are each independently C1-20 alkyl; preferably linear C1-20 alkyl, branched C3-20 alkyl or cyclic C3-20 alkyl; more preferably linear C1-10 alkyl or branched C3-10 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl; furthermore preferably methyl, ethyl, i-propyl, n-propyl, n- butyl, sec-butyl, i-butyl or t-butyl.

[0160] One or more non-adjacent -CH2- of R31, R32, R33, R34, R35, R36, L31and L32may

[0161] 20 each independently be replaced with -O-, -S-, -SO2-, -CO-, -CO-O-, -O-CO-, - O-CO-O-, -CR37=CR38- or -C=C-. As one embodiment of this invention, preferably one or more -CH2- of L31is replaced with -CO-; more preferably one -CH2- of L31is replaced with -CO- As another embodiment of this invention, preferably none of -CH2- of R31, R32, R33, R34, R35, R36nor L32is replaced.

[0162] R37and R38are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl; further preferably H, methyl, ethyl, n-propyl or n-butyl.

[0163] One or more H of R31, R32, R33, R34, R35, R36, L31and L32may each

[0164] 30 independently be replaced with OH or COOH. It is more preferable embodiment of this invention that none of H of R31, R32, R33, R34, R35, R36, L31nor L32is replaced. Foreignfiling text P24-233-SEC-WO01 20250926

[0165] - 19 - n31 is 0 to 5; preferably 0 to 3; more preferably 0 or 1 . n32 and n33 are each independently 0 to 3; preferably 0 or 1 .

[0166] In a preferable embodiment of the present invention, n31 is 1. R31, R34and R35

[0167] 5 are methyl; preferably n31 is 1 , n32 and n33 are 0. R31, R34and R35are methyl; more preferably n31 is 1 , n32 and n33 are 0. R31, R34and R35are methyl, L31is methylene where one -CH2- is replaced with -CO-.

[0168] The following explains how to read the compound represented by the formula

[0169] L31is Ci alkylene (methylene) where -CH2- is replaced with -CO-. L32is -NR36- where R36is C2 alkyl (ethyl). R31, R34and R35are Ci alkyl (methyl). n31 is 1. n32 and n33 are 0.

[0170] In another preferable embodiment of the present invention, the content of the photo initiator is in the range from 0.5 to 20 mass%, preferably 0.8 to 15 mass%, more preferably 1 to 10 mass%, further preferably 1.5 to 8 mass% based on the total amount of the composition.

[0171] In another preferable embodiment of the present invention, the molecular

[0172] 30 weight of the photo initiator is in the range from 50 to 900, preferably 100 to 700, more preferably 200 to 600, further preferably 300 to 500. Foreignfiling text P24-233-SEC-WO01 20250926

[0173] - 20 -

[0174] In the present invention, the molecular weight of the photo initiator may be measured by methods known in the art such as cryoscopy.

[0175] - Additives

[0176] 5 The composition may further include one or more additives. Examples of additives include silanol condensation catalysts, surfactants, adhesion promoters, corrosion resistance additives, crosslinking agents, dispersants, fillers, functional pigments (such as those providing functional effects like conductivity, thermal conductivity and magnetic properties), nanoparticles, optical pigments (such as those providing optical effects like color tone, refractive index and pearlescent effect), particles that reduce thermal expansion, polymerization initiators, polymerization inhibitors, primers, rheology modifiers (such as thickeners), and adhesion enhancers.

[0177] The additives are different from the organic compound (A), the photo initiator and the solvent (S).

[0178] The content of additives is preferably 0 to 10 parts by mass, more preferably 0 to 8 parts by mass, further preferably 0 to 6 part by mass, and furthermore preferably 0 to 5 parts by mass, based on 100 parts by mass of the composition. It is also a preferable embodiment that the composition doesn’t contain the additives.

[0179] Examples of silanol condensation catalysts include photoacid generators, photobase generators, thermal acid generators, and thermal base generators. In the present invention, a photoacid generator or photobase generator refers to a compound that generates an acid or base by bond cleavage upon exposure to light.

[0180] Examples of light include visible light, ultraviolet light, infrared light, X-rays,

[0181] 30 electron beams, alpha rays, and gamma rays. In the present invention, a thermal acid generator or thermal base generator refers to a compound that generates an acid or base by bond cleavage upon heating. The generated acid Foreignfiling text P24-233-SEC-WO01 20250926

[0182] - 21 - or base is believed to contribute to the polymerization reaction of the siloxane compound.

[0183] Examples of photoacid generators include diazomethane compounds, triazine

[0184] 5 compounds, sulfonate esters, iodonium salts such as diphenyliodonium salts, sulfonium salts such as triphenylsulfonium salts, ammonium salts, phosphonium salts, and sulfonimide compounds.

[0185] Examples of photobase generators include multi-substituted amide compounds having an amide group, lactams, imide compounds; and ionic photobase generators containing anions such as amide anions, methide anions, borate anions, phosphate anions, sulfonate anions, or carboxylate anions.

[0186] Examples of thermal acid generators include aliphatic sulfonic acids and their salts; aliphatic carboxylic acids such as citric acid, acetic acid, maleic acid, and their salts; aromatic carboxylic acids such as benzoic acid, phthalic acid, and their salts; aromatic sulfonic acids and their salts; aromatic diazonium salts; and phosphonic acids and their salts.

[0187] Examples of thermal base generators include compounds that generate bases such as imidazoles and tertiary amines.

[0188] Examples of surfactants include fluorine-containing surfactants, nonionic surfactants, anionic surfactants, amphoteric surfactants, silicon-containing surfactants and any combination thereof.

[0189] Examples of the fluorine-containing surfactants include surfactants having fluorinated hydrocarbon groups and hydrophilic groups, such as Megaface

[0190] 30 (DIC), Florad (3M), and Surfion (AGC Seimi Chemical). Foreignfiling text P24-233-SEC-WO01 20250926

[0191] - 22 -

[0192] Nanoparticles may be selected from particles of nitrides, titanates, diamonds, oxides, sulfides, sulfites, sulfates, silicates, and carbides. Nanoparticles can be optionally surface-modified using capping agents.

[0193] The particle size of nanoparticles may be in the range from 1 to 100 nm, 1 to

[0194] 5 50 nm, or 1 to 25 nm. The particle size can be measured by any standard method known to those skilled in the art.

[0195] Examples of polymerization initiators include polymerization initiators that generate acids or bases by radiation or heat.

[0196] Examples of polymerization inhibitors include ultraviolet absorbers, as well as nitrones, nitrogen oxide radicals, hydroquinones, catechols, phenothiazines, phenoxazines, hindered amines, and their derivatives. Preferably, methylhydroquinone, catechol, 4-t-butylcatechol, 3-methoxycatechol, phenothiazine, chlorpromazine, phenoxazine, hindered amines such as TINUVIN 144, 292, and 5100 (BASF), and ultraviolet absorbers such as TINUVIN 326, 328, 384-2, 400, and 477 (BASF) can be used.

[0197] Adhesion enhancers are effective in preventing the coating film from peeling off the substrate due to stress applied during curing by heating when a composition according to one embodiment is applied to a substrate to form a coating film. Preferred adhesion enhancers include imidazole compounds and silane coupling agents. Examples of imidazole compounds include 2- hydroxybenzimidazole, 2-hydroxyethylbenzimidazole, benzimidazole, 2- hydroxyimidazole, imidazole, 2-mercaptoimidazole, and 2-aminoimidazole.

[0198] Examples of silane coupling agents include epoxy silane coupling agents, amino silane coupling agents, and mercapto silane coupling agents. Preferable examples include 3-glycidoxypropyltrimethoxysilane, 3- glycidoxypropyltriethoxysilane, N-2-(2-aminoethyl)-3-

[0199] 30 aminopropyltrimethoxysilane, N-2-(2-aminoethyl)-3- aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3- aminopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, 3- Foreignfiling text P24-233-SEC-WO01 20250926

[0200] - 23 - chloropropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3- isocyanatopropyltriethoxysilane.

[0201] Furthermore, silane compounds having acid groups can be used as silane

[0202] 5 coupling agents. Examples of acid groups include carboxyl groups, acid anhydride groups, and phenolic hydroxyl groups.

[0203] [Method of forming a cured film]

[0204] In another aspect, the present invention also relates to a method of forming a cured film (hereinafter, referred to as “ the method”) comprising the following steps (i-1 ), (ii) and (iii) in the following order;

[0205] (i-1 ) arranging droplets of the inkjet adaptive planarization composition according to the present invention above a substrate by an inkjet method;

[0206] (ii) bringing the composition into contact with a superstrate;

[0207] (iii) irradiating the composition with light to polymerize the organic compound (A).

[0208] - Step (i-1 )

[0209] “Above a substrate” means that the composition according to the present invention may be applied either directly or via one or more other layers (hereinafter, referred to as “the underlayer”) on the substrate. Examples of the underlayer include a SOC (Spin on Carbon), an adhesion enhancing film. It is a more preferable embodiment of this invention that step (i-a) arranges droplets of the composition directly on the substrate.

[0210] The droplets may be arranged from an inkjet nozzle of an inkjet device such as an inkjet recording printer in the step (i-1 ).

[0211] The inkjet device may be commercially obtainable one.

[0212] 30 In a preferable embodiment of the present invention, the fluid pressure of the inkjet device is in the range from 0.1 to 3MPa. Foreignfiling text P24-233-SEC-WO01 20250926

[0213] - 24 -

[0214] In another preferable embodiment of the present invention, the nozzle pitch of the inkjet device is in the range from 1 to 10mm.

[0215] In another preferable embodiment of the present invention, the amount of the

[0216] 5 droplet is in the range from 50 to 300nl.

[0217] Examples of the substrate include a silicone substrate, a glass substrate and a resin film. The substrate may be patterned on its surface.

[0218] The adhesion of the surface of the substrate to the composition may be improved by treatments such as a silane coupling treatment, a silazane treatment, or deposition of an organic thin film.

[0219] - Step (ii)

[0220] The duration of the step (ii) is preferably in the range from 0.1 to 3 sec, more preferably 0.1 sec to 1 sec.

[0221] Examples of the superstrate to be used in the step (ii) include a silicone substrate, a glass substrate and a resin film. The superstrate may be patterned on its surface. The pattern on the surface of the superstrate may have a height in the range from 4nm to 200 nm.

[0222] The pressure to be applied to the composition when bringing the superstrate into contact with the composition (A) is preferably in the range from 0 to 100 MPa, more preferably 0 to 50 MPa, further preferably 0 to 20 MPa.

[0223] - Step (iii)

[0224] In a preferable embodiment of the present invention, the wavelength of the light in the step (iii) is in the range from 150 to 450nm, preferably 200 to

[0225] 30 440nm, more preferably 250 to 410nm. Foreignfiling text P24-233-SEC-WO01 20250926

[0226] - 25 -

[0227] The light to be used in the step (iii) may have either a single wavelength or multiple wavelengths. When the light has multiple wavelengths, the values of the multiple wavelengths may respectively be selected in the above-mentioned ranges.

[0228] 5

[0229] In another preferable embodiment of the present invention, the exposure during the light irradiation in the step (iii) is in the range from 10 to 40,000mJ / cm2, preferably 20 to 30,000mJ / cm2, more preferably 30 to 20,000mJ / cm2.

[0230] It is believed that the variation of exposure time is sufficiently suppressed when the exposure is 10 J / cm2or more. It is also believed that the amount of damage to the composition and a device is sufficiently reduced when the exposure is 40,000mJ / cm2or less.

[0231] Examples of a light source that emits the light of the step (iii) are a LED lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a low- pressure mercury lamp, a Deep-UV lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, a KrF excimer laser, an ArF excimer laser or an F2 laser.

[0232] In one embodiment of the present invention, the light is intermittently emitted to the entire region of the composition on the substrate a plurality of times in the step (iii).

[0233] In another embodiment of the present invention, the light is continuously emitted to the entire region of the composition on the substrate in the step (iii).

[0234] - Step (i-2)

[0235] The method according to the present invention may further comprise the following step (i-2) between the step (i-1 ) and the step (ii);

[0236] 30 (i-2) waiting for the arranged droplets to combine with their respective adjacent droplets to form a continuous liquid film on the substrate. Foreignfiling text P24-233-SEC-WO01 20250926

[0237] - 26 -

[0238] In a preferable embodiment of the present invention, the duration of the step (i-2) is in the range from 0.1 to 600 sec, preferably 10 to 300 sec.

[0239] In a more preferable embodiment of the present invention, the arranged

[0240] 5 droplets in the step (i-1 ) are heated for one or more partial durations of the step (i-2) or throughout the step (i-2).

[0241] In a furthermore preferable embodiment of the present invention, the duration of the heating is in the range from 10 to 600 sec, preferably 50 to 500 sec, more preferably 100 to 400 sec.

[0242] In a furthermore preferable embodiment of the present invention, the heating temperature is in the range from 30 to 200°C, preferably 50 to 180°C.

[0243] The heating of the step (i-2) may be conducted in an oxygen gas atmosphere, atmospheric air, or an atmosphere of an inert gas such as nitrogen. When heating is performed by multiple steps, the steps may be conducted under different atmospheric conditions.

[0244] In the present invention, the oxygen gas atmosphere means that the partial pressure of the oxygen gas is 0.5 to 1 times the total pressure.

[0245] In the present invention, the nitrogen gas atmosphere means that the partial pressure of the nitrogen gas is 0.5 to 1 times the total pressure.

[0246] - Step (iv)

[0247] The method according to the present invention may further comprise the following step (iv) just after the step (iii);

[0248] (iv) heating the irradiated composition.

[0249] 30 The heating temperature of the step (iv) is preferably in the range from 60 to 1 ,000°C, more preferably 70 to 750°C, further preferably 80 to 600°C, further more preferably 90 to 500°C. Foreignfiling text P24-233-SEC-WO01 20250926

[0250] - 27 -

[0251] The heating duration of the step (iv) is preferably in the range from 40 to 300sec, more preferably 60 to 200sec, further preferably 80 to 150sec.

[0252] 5 - Steps (v), (vi)

[0253] The method according to the present invention may further comprise the following step (v) or (vi);

[0254] (v) releasing the superstrate from the composition.

[0255] (vi) releasing the substrate from the composition.

[0256] In the step (v), the way of releasing the superstrate from the composition is not limited provided that the method does not physically break a part of the composition.

[0257] In one embodiment of the present invention, the substrate is fixed and the superstrate is moved away from the composition in the step (v).

[0258] In the step (vi), the way of releasing the substrate from the composition is not limited provided that the method does not physically break a part of the composition.

[0259] In one embodiment of the present invention, the superstrate is fixed and the substrate is moved away from the composition in the step (vi).

[0260] Steps (v) or (vi) may be performed anytime after the step (iii) is performed.

[0261] - Step (vii)

[0262] The method according to the present invention may further comprise the following step (vii) just after the step (v) or (vi);

[0263] (vii) heating the irradiated composition.

[0264] 30 The heating temperature of the step (vii) is preferably in the range from 150 to 1 ,000°C, more preferably 200 to 950°C, further preferably 250 to 900°C, further more preferably 300 to 850°C. Foreignfiling text P24-233-SEC-WO01 20250926

[0265] - 28 -

[0266] The heating duration of the step (vii) is preferably in the range from 30 to 1 ,800sec, more preferably 40 to 1 ,500sec, further preferably 50 to 1 ,200sec, further more preferably 60 to 900sec.

[0267] 5

[0268] [Method of manufacturing a device]

[0269] In another aspect, the present invention also relates to a method of manufacturing a device comprising the following steps (I) and (II);

[0270] (I) forming a cured film by the method of the present invention;

[0271] (II) processing the substrate.

[0272] The device manufactured by the method is preferably a semiconductor device.

[0273] The processing of the step (II) may comprise one or more etching processes to transfer a relief image into the substrate. The relief image corresponds to the pattern in the patterned layer or an inverse of that pattern.

[0274] The processing of the step (II) may further comprise processes selected from one or more members of the group consisting of inspection, layer formation, deposition, doping, etching, formable material removal, dicing, bonding, packaging, mounting and circuit board assembly.

[0275] The detail of the composition is described in the chapter “[Inkjet adaptive planarization composition].”

[0276] [Use of a composition for inkjet adaptive planarization]

[0277] In another aspect, the present invention also relates to use of a composition for inkjet adaptive planarization,

[0278] 30 wherein the composition comprises an organic compound (A), a photo initiator and a solvent (S), Foreignfiling text P24-233-SEC-WO01 20250926

[0279] - 29 - wherein the content of the solvent (S) is in the range from 0.5 to 40 mass%, preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.

[0280] 5 The detail of the composition is described in the chapter “[Inkjet adaptive planarization composition].”

[0281] [Woking examples]

[0282] The present invention is described below with reference to several examples.

[0283] 10 The embodiment of the present invention is not limited only to these examples. Mass ratios described in the examples are all based on 100 mass parts of the composition.

[0284] Synthesis of compound (A): 1 ,3-diethenyl-5-[3-ethenylphenylmethyl] benzene 500g of 1 ,3-dibromo-5-[(3-bromophenyl)methyl]benzene, 565g of potassium vinyltrifluoroborate and 1.3g of bis-(di-tert-butyl-(4-dimethylaminophenyl)- phosphin)-dichloro-palladium(ll) are dissolved in 4.3L of tetrahydrofuran. The mixture is heated up to 50 °C. 1.19L of 50% sodium hydroxide aqueous solution is added dropwise. The mixture is stirred overnight at 50 °C. 2.6 L of

[0285] 20 n-heptane and 14.9 L of water are added. The aqueous phase is separated. A solution of 99.2g of N-acetylcysteine and 3.3L of water is added to the organic layer. The mixture is heated up to 40 °C and stirred for 1 h. The aqueous phase is separated. The organic phase is fritted over aluminum oxide. The solvent of the obtained filtrate is removed under vacuum at 40°C. 271.4g of the compound (A) is obtained. The structure of the compound (A) is shown by the following formula.

[0286] 30

[0287] Preparation of compositions

[0288] [Example 1 ] Foreignfiling text P24-233-SEC-WO01 20250926

[0289] - 30 -

[0290] 3.7 mass parts of isopropanol as a solvent is added to the mixture of 90.3 mass parts of the compound (A) and 6.0 mass parts of Omnirad OXE02 (1 -[[[1 -[9- Ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethylidene]amino]oxy]ethan-1 - one) (Also called as Irgacure OXE02, by BASF) as a photo initiator in a 200m L

[0291] 5 round bottom flask. The solution is stirred overnight.

[0292] [Examples 2 to 9, comparative example 1 ]

[0293] Except for the points that the solvent and the contents of the compound (A), the photo initiator and the solvent are changed as described in Table 1 , compositions are prepared by the same manner as described in Example 1 .

[0294] Measurement of viscosity

[0295] The viscosity of the composition of Example 1 is measured by Cannon-Fenske Routine capillary viscometer (Industrial Research Glassware LTD). The composition is measured at 8 ml with a glass pipette and loaded into a capillary viscometer of size 150. The solution temperature is maintained at 23°C in a waterbath with a digitized temperature control system. The viscometer is placed into the holder vertically and inserted into the waterbath that is maintained at a fixed temperature. The efflux time is measured by allowing the solution to flow freely down past marks. The kinematic viscosity of liquid sample in centistokes is calculated by multiplying the efflux time in seconds by the viscometer constant (0.035). The viscosity of the compositions of Examples 2 to 9 and Comparative example 1 are also measured by the same manner. The results are described in Table 1.

[0296] Discharging stability

[0297] An inkjet recording device equipped with an inkjet nozzle for ink with viscosity in the range from 5 to 23mPa s and the composition of Example 1 is let stand for 24 hours in an ambient temperature of 23°C. The temperature of the inside Foreignfiling text P24-233-SEC-WO01 20250926

[0298] - 31 - performed on a silicone substrate at 23°C, using the composition of Example 1 . The discharge stability is evaluated according to the criteria below.

[0299] A: The composition is stably discharged.

[0300] 5 B: The printing contains a defect, or the composition is not stably discharged.

[0301] The same evaluation is performed for the compositions of Examples 2 to 9 and Comparative example 1 . The results are described in Table 1 .

[0302] Preparation of cured film

[0303] The composition of Example 1 is arranged dropwise on a 725pm-thick silicone substrate. The arranged composition is spin-coated at 500rpm for 45sec using spin coater MS-B150 (Mikasa). A 700pm-thick glass plate is brought into contact with the composition to form a film. The film is irradiated by UV light with an intensity of 120mW / cm2and a wavelength of 365nm for 84 sec. The exposure is 10,080mJ / cm2. The irradiated film is heated at 350C° for 90 sec to form a cured film with a thickness of 8 pm. Cured films from the compositions of Examples 2 to 9 and Comparative Example 1 are also formed by the same manner.

[0304] Thermal stability

[0305] The Thermographic analysis (TGA) is conducted for 8mg of the cured film from the composition of Example 1 using simultaneous thermogravimetric analyzer NEXTA STA300 (Hitachi High-Tech Science Corporation). The samples are heated at a temperature increasing rate of 10C7min under nitrogen at an influx rate of 100 milliliter per min during the measurement. The weight loss of the cured film is recorded. The thermal stability of the cured films is evaluated as follows.

[0306] 30 A: The temperature at which the weight loss of the cured film is 1 % is 250°C or higher. Foreignfiling text P24-233-SEC-WO01 20250926

[0307] - 32 -

[0308] B: The temperature at which the weight loss of the cured film is 1 % is lower than 250°C.

[0309] The same evaluation is performed for the cured films of Examples 2 to 9. The

[0310] 5 results are described in Table 1 .

[0311] 30 Foreignfiling text P24-233-SEC-WO01 20250926

[0312] Table 1

[0313] 5

[0314] 30

Claims

Foreignfiling text P24-233-SEC-WO01 20250926- 34 -Claims1. An inkjet adaptive planarization composition comprising an organic5 compound (A), a photo initiator and a solvent (S); wherein the content of the solvent (S) is in the range from 0.5 to 40 mass%, preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.

2. The inkjet adaptive planarization composition according to claim 1 , wherein the viscosity of the composition is in the range from 1 to 25mPa s, preferably 3 to 23mPa s, more preferably 5 to 21 mPa s, further preferably 10 to 20mPa s.

3. The inkjet adaptive planarization composition according to claim 1 or 2, wherein the boiling point of the solvent (S) is in the range from 60 to 200°C, preferably 70 to 180°C, more preferably 80 to 160°C, further preferably 80 to 145°C.

4. The inkjet adaptive planarization composition according to any one of claims 1 to 3, wherein the solvent (S) comprises one or more hydroxy or -CO-O-, preferably the solvent is an alcohol or an ester, more preferably a primary or secondary alcohol, or an ester, further preferably a secondary alcohol or an ester.

5. The inkjet adaptive planarization composition according to any one of claims 1 to 4, wherein the solvent (S) is represented by formula (1-i) or (1-ii);Foreignfiling text P24-233-SEC-WO01 20250926- 35 -5 where R11is H or C1-10 alkyl; preferably linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably linear C1-7 alkyl or branched C3-7 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl;R12is C1-10 alkyl; preferably linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 10 alkyl; more preferably linear C1-7 alkyl or branched C3-7 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl;L11is a single bond, or C1-10 alkylene; preferably linear C1-10 alkylene, branched C3-10 alkylene, or cyclic C3-10 alkylene; more preferably linear C1-7 alkylene or branched C3-7 alkylene; further preferably linear C1-5 alkylene or branched C3-5 alkylene; one or more of non-adjacent -CH2- of R11, R12, and L11may independently be replaced with -O-, -S-, -CO-, -CO-O-, -O-CO-, -O-CO-O-, -CR13=CR14- or - C=C-;R13and R14are each independently H or C1-10 alkyl; preferably linear C1-1020 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl; one or more H of R11, R12and L11may each independently be replaced with OH or COOH; and n11 is 0 or 1 ;30 where R15and R16are each independently H or C1-10 alkyl; preferably linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably linear C1-7Foreignfiling text P24-233-SEC-WO01 20250926- 36 - alkyl or branched C3-7 alkyl; further preferably linear C1-5 alkyl or branched C3- 5 alkyl; one or more of non-adjacent -CH2- of R15and R16may independently be replaced with -O-, -S-, -CO- -CO-O-, -O-CO-, -O-CO-O-, -CR17=CR18- or -5 C=C-;R17and R18are each independently H or C1-10 alkyl; preferably linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl; and one or more H of R15and R16may each independently be replaced with OH or COOH.

6. The inkjet adaptive planarization composition according to any one of claims 1 to 5, wherein the organic compound (A) comprises one or more double and / or triple bonds, preferably one or more unsaturated hydrocarbon groups, more preferably one or more vinyl and / or ethynyl, further preferably one or more vinyl, further more preferably two or more vinyl.

7. The inkjet adaptive planarization composition according to any one of claims 1 to 6, wherein the molecular weight of the organic compound (A) is in the range from 170 to 450, preferably 200 to 400, more preferably 230 to 380, further preferably 250 to 350.

8. The inkjet adaptive planarization composition according to any one of claims 1 to 7, wherein the organic compound (A) is represented by formula (2):Foreignfiling text P24-233-SEC-WO01 20250926- 37 - where X21and X22are each independently -L22-CR23=CH2 or -L23-C=CH, preferably - L22-CR23=CH2;L21, L22and L23are each independently a single bond or C1-20 alkylene; preferably a single bond, linear C1-20 alkylene, branched C3-20 alkylene or5 cyclic C3-20 alkylene; more preferably a single bond or linear C1-10 alkylene; further preferably a single bond or linear C1-5 alkylene; furthermore preferably a single bond, methylene or ethylene;R21and R22are each independently C1-20 alkyl; preferably linear C1-20 alkyl, branched C3-20 alkyl or cyclic C3-20 alkyl; more preferably linear C1-10 alkyl or10 branched C3-10 alkyl; further preferably linear C1-5 alkyl or branched C3-5 alkyl; R23is H or C1-20 alkyl; preferably H, linear C1-20 alkyl, branched C3-20 alkyl or cyclic C3-20 alkyl; more preferably H, linear C1-10 alkyl or branched C3-10 alkyl; further preferably H, linear C1-5 alkyl or branched C3-5 alkyl;One or more non-adjacent -CH2- of R21, R22,R23, L21, L22and L23may each independently be replaced with -O-, -S-, -SO2-, -CO-, -CO-O-, -O-CO-, -O- CO-O-, -CR24=CR25- or -CEC-;R24and R25are each independently H or C1-10 alkyl; preferably H, linear C1-10 alkyl, branched C3-10 alkyl or cyclic C3-10 alkyl; more preferably H or linear C1-5 alkyl;20 One or more H of R21, R22,R23, L21, L22and L23may each independently be replaced with OH or COOH; n20=0 or 1 , preferably 1 ; and when n20=0, m21 , m22, n21 and n22 are each independently 0 to 6, preferably m21 is 1 or 2 and m22 is 0, provided that m21 +m22+n21 +n22<6, m21 +m22>0; when n20=1 , m21 , m22, n21 and n22 are each independently 0 to 5, preferably m21 and m22 are each independently 1 or 2, provided that m21 +n21 <5, m22+n22<5 and m21 +m22>0.30 9. The inkjet adaptive planarization composition according to any one of claims 1 to 8,Foreignfiling text P24-233-SEC-WO01 20250926- 38 - wherein the content of the photo initiator is in the range from 0.5 to 20 mass%, preferably 0.8 to 15 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 8 mass% based on the total amount of the composition.5 10. The inkjet adaptive planarization composition according to any one of claims 1 to 9, wherein the photo initiator is selected from one or more members of the group consisting of 2,4,5-triarylimidazole dimer, benzophenone derivative, quinone, benzoin ether derivative, benzyl derivative, N-phenylglycine derivative, acetophenone derivative, thioxanthone derivative, acylphosphine oxide derivative and oxime ester derivative; preferably oxime ester derivative.11 . A method of forming a cured film comprising the following steps (i-1 ), (ii) and (iii) in the following order;(i-1 ) arranging droplets of the inkjet adaptive planarization composition according to at least one of claims 1 to 10 above a substrate by an inkjet method;(ii) bringing the composition into contact with a superstrate;(iii) irradiating the composition with light to polymerize the organic compound (A).

12. The method of forming a cured film according to claim 11 , wherein the wavelength of the light in the step (iii) is in the range from 150 to 450nm, preferably 200 to 440nm, more preferably 250 to 410nm.

13. The method of forming a cured film according to claim 11 or 12, wherein the exposure during the light irradiation in the step (iii) is in the range from 10 to 40,000mJ / cm2, preferably 20 to 30,000mJ / cm2, more preferably 30 to 20,000mJ / cm2.3014. The method of forming a cured film according to any one of claims 11 to 13,Foreignfiling text P24-233-SEC-WO01 20250926- 39 - wherein the method further comprises the following step (i-2) between the step (i-1 ) and the step (ii);(i-2) waiting for the arranged droplets to combine with their respective adjacent droplets to form a continuous liquid film on the substrate;5 wherein the duration of the step (i-2) is preferably in the range from 0.1 to 600 sec, more preferably 10 to 300 sec.

15. The method of forming a cured film according to claim 14, wherein the arranged droplets are heated for one or more partial durations of the step (i-2) or throughout the step (i-2); wherein the duration of the heating is preferably in the range from 10 to 600 sec, more preferably 50 to 500 sec, further preferably 100 to 400 sec, wherein the heating temperature is preferably in the range from 30 to 200°C, more preferably 50 to 180°C.

16. The method of forming a cured film according to any one of claims 11 to 15, wherein the method further comprises the following step (iv) after the step(iii);(iv) heating the irradiated film at preferably 60 to 1 ,000°C, more preferably 70 to 750°C, further preferably 80 to 600°C, further more preferably 90 to 500°C, for 20 to 400sec, preferably 40 to 300sec more preferably 60 to 200sec, further preferably 80 to 150sec.

17. A method of manufacturing a device comprising the following steps (I) and (II);(I) forming a cured film by the method according to any one of claims 11 to 16;(II) processing the substrate;30 wherein the device is preferably a semiconductor device.Foreignfiling text P24-233-SEC-WO01 20250926- 40 -18. Use of a composition for inkjet adaptive planarization, wherein the composition comprises an organic compound (A), a photo initiator and a solvent (S); wherein the content of the solvent (S) is in the range from 0.5 to 40 mass%,5 preferably 0.8 to 20 mass%, more preferably 1 to 10 mass%, further preferably 1 .5 to 6 mass% based on the total amount of the composition.30