Wafer etching apparatus and process

Abstract

This invention proposes a wafer etching apparatus and process. The wafer etching apparatus includes an equipment housing, and within the equipment housing are etching components, a spraying component, an ultraviolet lamp, and a shielding component. The equipment housing includes a housing body and a door. The etching component includes a worktable and a translation mechanism. The worktable includes a recovery tank and a placement plate. The placement plate is placed in the recovery tank. The translation mechanism is drivenly connected to the recovery tank. The spraying component includes a lifting cylinder, a guide column, a spray plate, and a nozzle. The lifting cylinder is connected to the spray plate. The spray plate is slidably mounted on the guide column. The nozzle is mounted on the spray plate. The ultraviolet lamp is mounted on the door. The shielding component includes a shielding plate, a connecting rod, and a buffer. When the shielding plate descends and presses against the wafer, the buffer supports the spray plate, ensuring that the shielding plate contacts the wafer but the wafer is not subjected to force. This avoids continuous force on the shielding plate and damage, extending its service life, while simultaneously preventing force damage to the wafer and improving wafer quality.

Description

Technical Field

[0001] This invention relates to the field of wafer etching technology, and more particularly to a wafer etching apparatus and process. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions. The raw material of a wafer is silicon, while there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon.

[0003] In the chip manufacturing process, wafers are typically fabricated using photolithography, development, and etching on equipment. However, traditional photolithography, development, and etching equipment has the following drawbacks:

[0004] During the wafer fabrication process, the wafer needs to be shielded from light. However, when the shielding material is lowered and placed, it is easily damaged by the driving source during long-term use, thus failing to provide the shielding effect and affecting wafer fabrication. Summary of the Invention

[0005] In view of this, the present invention proposes a wafer etching apparatus and process to solve the technical problem mentioned in the background art that the light-shielding object is easily damaged by the driving source when it is moved downward, thus failing to play a light-shielding role.

[0006] The technical solution of this invention is implemented as follows:

[0007] In a first aspect, the present invention provides a wafer etching apparatus, including an equipment housing, and an etching assembly, a spray assembly, an ultraviolet lamp, and a shielding assembly disposed within the equipment housing, wherein:

[0008] The equipment box includes a box body and a box door. The side of the box body has an opening, and the box door is hinged to the box body to close the opening.

[0009] The etching assembly includes a worktable and a translation mechanism; the worktable includes a recovery tank and a placement plate, the recovery tank is used to collect liquid during the etching process, the bottom of the recovery tank is provided with a drain hole, the drain hole is sealed by a drain bolt; the placement plate is placed in the recovery tank; the translation mechanism is driven to the recovery tank and is used to drive the recovery tank to move in the direction of the opening;

[0010] The spray assembly includes a lifting cylinder, a guide column, a spray plate, and a nozzle. The lifting cylinder is installed on the top surface of the inner wall of the housing and connected to the spray plate. The guide column is fixedly installed on the top surface of the housing. The spray plate is slidably installed on the guide column. The nozzle is installed on the spray plate.

[0011] The ultraviolet lamp is installed on the door of the enclosure;

[0012] The shielding assembly includes a shielding plate, a connecting rod, and a buffer. One end of the connecting rod is connected to the side of the spray plate away from the lifting cylinder, and the shielding plate is connected to the other end of the connecting rod. The buffer is installed on the end of the guide column away from the top surface of the housing to support the spray plate.

[0013] Based on the above technical solutions, preferably, a limiting sleeve is installed at the end of the guide post away from the top surface of the housing, the buffer is a spring, the spring is sleeved on the guide post, and one end of the spring is connected to the limiting sleeve.

[0014] Based on the above technical solutions, preferably, two guide columns are provided, and the two guide columns are located on the side of the spray plate away from the ultraviolet lamp.

[0015] Based on the above technical solutions, preferably, the nozzle is provided in multiple ways, and the multiple nozzles are evenly distributed around the connecting rod as the center.

[0016] Based on the above technical solutions, preferably, the spray plate is provided with a liquid storage tank, and the spray head is connected to the liquid storage tank;

[0017] The spray assembly also includes an infusion pipe, one end of which is connected to the liquid storage tank and the other end extends out of the housing to provide rinsing solution to the spray head.

[0018] Based on the above technical solutions, preferably, the translation mechanism includes a guide rail, a slider, and a telescopic cylinder. The guide rail is fixed to the bottom of the box in the direction of the opening. The slider is slidably mounted on the guide rail and connected to the recycling trough. The telescopic cylinder is mounted on the bottom of the box and connected to the slider.

[0019] Based on the above technical solutions, preferably, the workbench also includes a water drain trough, the bottom of the recycling tank is recessed to form the water drain trough, and the bottom of the water drain trough has a water drain hole on the side near the opening, and the water drain hole is sealed by a water drain bolt.

[0020] Based on the above technical solutions, preferably, the top surface of the slider is provided with a connecting groove, the bottom surface of the recycling tank is provided with an installation block, the installation block is inserted into the connecting groove, the length of the installation block is less than the length of the connecting groove, and the length direction of the connecting groove is perpendicular to the plane where the opening is located; the side of the recycling tank is provided with a sliding column at the end away from the drain hole, and the inner wall of the side of the tank is provided with a guide groove, the guide groove includes at least a guide section, the guide section gradually extends upward from the end away from the opening toward the opening, and the sliding column is slidably installed in the guide groove.

[0021] Based on the above technical solutions, preferably, the guide groove further includes a horizontal section, which is located on the side of the guide section away from the opening. When the sliding column slides to the end of the horizontal section away from the guide section, the recycling groove abuts against the inner wall of the box.

[0022] Based on the above technical solutions, preferably, the equipment box further includes hinges, which are connected to the top surface of the box and the box door respectively.

[0023] In a second aspect, the present invention provides a wafer etching process using the wafer etching equipment described in the first aspect, comprising:

[0024] Rotate the cabinet door to a horizontal position around the cabinet, open the equipment cabinet, push the worktable out of the cabinet through the translation mechanism, and place the wafer on the placement plate;

[0025] The worktable is retracted into the box by the translation mechanism, the box door is rotated around the box to a vertical position, and the equipment box is closed.

[0026] The lifting cylinder is activated, which drives the spray plate to slide down along the guide column, thereby causing the shielding plate to descend and press down on the wafer, and the buffer is supported below the spray plate.

[0027] The wafer is coated with photoresist, and then ultraviolet light is turned on to irradiate the wafer.

[0028] The rinsing solution is sprayed onto the wafer surface through a nozzle to rinse the photoresist dissolved by ultraviolet light. The rinsing solution and photoresist then enter the recovery tank.

[0029] After rinsing is complete, open the chamber door, push the worktable out of the chamber using the translation mechanism, open the drain bolt, and discharge the rinsing solution and photoresist through the drain hole.

[0030] The wafer etching equipment of the present invention has the following advantages over the prior art:

[0031] (1) The buffer is installed at the end of the guide post away from the top surface of the box to support the spray plate. When the shielding plate descends and presses the wafer, the buffer supports the spray plate, so that the force of the lifting cylinder on the shielding plate is buffered. The shielding plate contacts the wafer but the wafer is not subjected to force, thus avoiding continuous force on the shielding plate and causing damage, extending the service life of the shielding plate, and at the same time avoiding force on the wafer and causing damage, thus improving the quality of the wafer.

[0032] (2) A limiting sleeve is installed at one end of the guide post away from the top surface of the box. The buffer is a spring. The spring is sleeved on the guide post and one end of the spring is connected to the limiting sleeve. When the spray plate moves downward, the spring contacts the spray plate and is compressed. When the shielding plate contacts the wafer, the spring force is balanced with the downward pressure of the lifting cylinder, so that the wafer is in a state of no force, which can improve the quality of the wafer.

[0033] (3) Two guide posts are provided to guide the movement of the spray plate, which makes the movement of the spray plate and the shielding plate more stable and reliable. At the same time, the two guide posts are located on the side of the spray plate away from the ultraviolet lamp, so they will not block the light of the ultraviolet lamp, ensuring that the wafer can be fully irradiated by ultraviolet light and improving the quality of the wafer.

[0034] (4) The bottom of the recycling tank is recessed downward to form the drain tank. The bottom of the drain tank has a drain hole on the side near the opening. The drain hole is sealed by a drain bolt. When it is necessary to drain the liquid in the recycling tank, the drain bolt is removed and the liquid is finally drained from the drain tank until all the liquid in the drain tank is drained. This can make the liquid draining more complete, so as to ensure the cleanliness of the etching equipment and avoid affecting the subsequent etching of the wafer, thereby improving the quality of the wafer.

[0035] (5) A guide groove is provided on the inner wall of the side of the box. The guide groove includes at least a guide section. The guide section extends gradually upward from the end away from the opening towards the opening. The sliding column is slidably installed in the guide groove. When the telescopic cylinder pushes the recycling tank to move out of the box, the sliding column slides into the guide section, so that the recycling tank is in a state where one end of the sliding column is high and the end of the drain hole is low. This allows the liquid in the drain tank to be completely discharged, further improving the cleanliness of the etching equipment and thus further improving the quality of the wafer. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a cross-sectional view of the wafer etching equipment in an embodiment of the present invention;

[0038] Figure 2 This is a perspective view of the wafer etching equipment in an embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of the etching component, spraying component, and shielding component in an embodiment of the present invention;

[0040] Figure 4 This is a cross-sectional view of the spray plate and nozzle in an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of the installation of the etching components and the housing in an embodiment of the present invention;

[0042] Figure 6 This is a schematic diagram of the translation mechanism in an embodiment of the present invention;

[0043] Figure 7 The three-dimensional worktable in the embodiment of the present invention Figure 1 ;

[0044] Figure 8 This is a schematic diagram of the structure of the box in an embodiment of the present invention;

[0045] Figure 9 The three-dimensional worktable in the embodiment of the present invention Figure 2 ;

[0046] Figure 10 This is a schematic diagram of the slider structure in an embodiment of the present invention;

[0047] Figure 11 This is a schematic diagram of the wafer etching process in an embodiment of the present invention.

[0048] Explanation of reference numerals in the attached diagram: 1-Equipment box, 2-Etching assembly, 3-Spray assembly, 4-UV lamp, 5-Shielding assembly;

[0049] 11-Box body, 111-Opening, 112-Guide groove, 1121-Guide section, 1122-Horizontal section, 12-Box door, 13-Hinge;

[0050] 21-Workbench, 211-Recycling trough, 2111-Mounting block, 2112-Sliding column, 212-Placement plate, 213-Water drain, 2131-Water drain hole, 214-Water drain bolt, 22-Translation mechanism, 221-Guide rail, 222-Slider, 2221-Connecting groove, 223-Telescopic cylinder;

[0051] 31-Lifting cylinder, 32-Guide column, 33-Spray plate, 331-Liquid storage tank, 34-Spray head, 35-Infusion pipe;

[0052] 51-Baffle plate, 52-Connecting rod, 53-Buffer component, 54-Limit sleeve, 55-Mounting pin. Detailed Implementation

[0053] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0054] Reference Figure 1-10 As shown, a first aspect of the present invention provides a wafer etching apparatus, including an apparatus housing 1, and an etching assembly 2, a spray assembly 3, an ultraviolet lamp 4, and a shielding assembly 5 disposed within the apparatus housing 1, wherein:

[0055] The equipment box 1 includes a box body 11 and a box door 12. The side of the box body 11 is provided with an opening 111, and the box door 12 is hinged to the box body 11 to close the opening 111.

[0056] The etching assembly 2 includes a worktable 21 and a translation mechanism 22. The worktable 21 includes a recovery tank 211 and a placement plate 212. The recovery tank 211 is used to collect liquid during the etching process. The bottom of the recovery tank 211 is provided with a drain hole 2131, which is sealed by a drain bolt 214. The placement plate 212 is placed in the recovery tank 211. The translation mechanism 22 is driven to the recovery tank 211 and is used to drive the recovery tank 211 to move towards the opening 111. The placement plate 212 is located at the center of the recovery tank 211. The placement plate 212 can be a circle concentric with the wafer. A circular placement slot is provided on the placement plate 212. The wafer is placed in the circular placement slot and will not move during etching.

[0057] The spray assembly 3 includes a lifting cylinder 31, a guide column 32, a spray plate 33, and a nozzle 34. The lifting cylinder 31 is installed on the top surface of the inner wall of the housing 11 and is connected to the spray plate 33. The guide column 32 is fixedly installed on the top surface of the housing 11. The spray plate 33 is slidably installed on the guide column 32. The nozzle 34 is installed on the spray plate 33.

[0058] The ultraviolet lamp 4 is installed on the door 12; the ultraviolet lamp 4 is installed on the vertical central axis of the housing 11, and the installation height can be adjusted according to the actual irradiation angle to ensure that the ultraviolet light can irradiate the entire wafer.

[0059] The shielding assembly 5 includes a shielding plate 51, a connecting rod 52, and a buffer 53. One end of the connecting rod 52 is connected to the side of the spray plate 33 away from the lifting cylinder 31. The shielding plate 51 is connected to the other end of the connecting rod 52. The buffer 53 is installed on the end of the guide column 32 away from the top surface of the housing 11 and is used to support the spray plate 33.

[0060] The wafer etching equipment proposed in this embodiment uses a buffer 53 installed at the end of the guide post 32 away from the top surface of the housing 11 to support the spray plate 33. When the shielding plate 51 descends and presses down on the wafer, the buffer 53 supports the spray plate 33, so that the force of the lifting cylinder 31 on the shielding plate 51 is buffered. The shielding plate 51 contacts the wafer, but the wafer is not subjected to force, thus avoiding continuous force on the shielding plate 51 and causing damage, extending the service life of the shielding plate 51, and at the same time avoiding force on the wafer and causing damage, thereby improving the quality of the wafer.

[0061] In some embodiments, a limiting sleeve 54 is installed at one end of the guide post 32 away from the top surface of the housing 11. The limiting sleeve 54 and the guide post 32 can be connected by a mounting pin 55. The buffer 53 is a spring, which is sleeved on the guide post 32, and one end of the spring is connected to the limiting sleeve 54. When the spray plate 33 moves downward, the spring contacts the spray plate 33 and is compressed. When the shielding plate 51 contacts the wafer, the spring force is balanced with the downward pressure of the lifting cylinder 31, so that the wafer is in a stress-free state, which can improve the quality of the wafer.

[0062] In some embodiments, two guide posts 32 are provided, and the two guide posts 32 are located on the side of the spray plate 33 away from the ultraviolet lamp 4. By guiding the movement of the spray plate 33 with the two guide posts 32, the movement of the spray plate 33 and the shielding plate 51 can be made more stable and reliable. At the same time, the two guide posts 32, located on the side of the spray plate 33 away from the ultraviolet lamp 4, will not block the illumination of the ultraviolet lamp 4, ensuring that the wafer can be fully irradiated by ultraviolet light, thus improving the quality of the wafer.

[0063] In some embodiments, multiple nozzles 34 are provided, and the multiple nozzles 34 are evenly distributed around the connecting rod 52 as the center. By evenly distributing the nozzles 34 around the connecting rod 52 as the center, the rinsing solution sprayed by the nozzles 34 can cover the entire wafer and will not be blocked by the connecting rod 52, thereby improving the rinsing effect and improving the quality of the wafer.

[0064] In some embodiments, the spray plate 33 is provided with a liquid storage tank 331, and the spray head 34 is connected to the liquid storage tank 331. The spray assembly 3 also includes a liquid delivery pipe 35, one end of which is connected to the liquid storage tank 331, and the other end extends out of the housing 11 to connect to a liquid supply device for supplying rinsing solution to the spray head 34. By storing the rinsing solution in the liquid storage tank 331, a single liquid delivery pipe 35 can supply rinsing solution to all spray heads 34, reducing the number of liquid delivery pipes 35, avoiding tangling of the liquid delivery pipes 35, and improving the reliability and stability of the equipment.

[0065] In some embodiments, the translation mechanism 22 includes a guide rail 221, a slider 222, and a telescopic cylinder 223. The guide rail 221 is fixed to the bottom of the housing 11 in the direction of the opening 111. The slider 222 is slidably mounted on the guide rail 221 and connected to the recycling trough 211. The telescopic cylinder 223 is mounted on the bottom of the housing 11 and connected to the slider 222. The length direction of the guide rail 221 is perpendicular to the plane of the opening 111. The telescopic cylinder 223 drives the slider 222 to slide along the guide rail 221, thereby causing the recycling trough 211 to move out of the housing 11 or retract back into the housing 11.

[0066] In some embodiments, during wafer fabrication, some of the dissolved solvent remains inside the equipment after being discharged, making cleaning difficult. This compromises the cleanliness of the photolithography and etching equipment, affecting wafer fabrication and even the quality of the finished wafer. To address this issue, the worktable 21 further includes a water drain 213. The bottom of the recovery tank 211 is recessed to form the water drain 213. A drain hole 2131 is located at the bottom of the water drain 213 near the opening 111, and the drain hole 2131 is sealed by a drain bolt 214. When it is necessary to drain the liquid from the recovery tank 211, the drain bolt 214 is removed, allowing the liquid to drain completely from the water drain 213 until all the liquid is drained. This reduces the final cross-sectional area of ​​the liquid storage, ensuring more complete drainage and maintaining the cleanliness of the etching equipment. This prevents interference with subsequent wafer etching and improves wafer quality.

[0067] In some embodiments, the top surface of the slider 222 is provided with a connecting groove 2221, and the bottom surface of the recycling tank 211 is provided with a mounting block 2111. The mounting block 2111 is inserted into the connecting groove 2221. The length of the mounting block 2111 is less than the length of the connecting groove 2221, ensuring reliable connection while allowing the mounting block 2111 to rotate around the bottom of the connecting groove 2221. The length direction of the connecting groove 2221 is perpendicular to the plane where the opening 111 is located. The side of the recycling tank 211 is provided with a sliding column 2112 at the end away from the drain hole 2131. The inner wall of the side of the box 11 is provided with a guide groove 112. The guide groove 112 includes at least a guide section 1121. The guide section 1121 gradually extends upward from the end away from the opening 111 toward the opening 111. The sliding column 2112 is slidably installed in the guide groove 112. As the telescopic cylinder 223 pushes the recycling tank 211 out of the housing 11, the sliding column 2112 slides into the guide section 1121, so that the recycling tank 211 is in a state where one end of the sliding column 2112 is high and the other end of the drain hole 2131 is low. This allows the liquid in the drain tank 213 to be completely discharged, further improving the cleanliness of the etching equipment and thus further improving the quality of the wafer.

[0068] In some embodiments, the guide groove 112 further includes a horizontal section 1122 located on the side of the guide section 1121 away from the opening 111. When the sliding column 2112 slides to the end of the horizontal section 1122 away from the guide section 1121, the recycling groove 211 abuts against the inner wall of the housing 11. The horizontal section 1122 limits the movement of the sliding column 2112, preventing the recycling groove 211 from moving excessively and colliding with the housing 11 when the telescopic cylinder 223 retracts, thus improving the service life and reliability of the equipment.

[0069] In some embodiments, the equipment housing 1 further includes a hinge 13, which is connected to the top surface of the housing 11 and the door 12. The hinge 13 connects to both the top surface of the housing 11 and the door 12, allowing the door 12 to rotate around the edge of the top surface of the housing 11. When the door 12 is opened, it flips upwards, preventing interference with the workbench 21 being pushed out of the housing 11. This also avoids collisions between the workbench 21 and the UV lamp 4 when the door flips downwards, thus improving the reliability and stability of the equipment.

[0070] Based on the same concept, a second aspect of the present invention provides a wafer etching process, using the wafer etching equipment described in the first aspect, with reference to... Figure 11 As shown, it includes:

[0071] Step S1: Rotate the door 12 around the housing 11 to a horizontal position, open the equipment housing 1, and push the worktable 21 out of the housing 11 through the translation mechanism 22 to place the wafer on the placement plate 212.

[0072] Step S2: The workbench 21 is retracted into the housing 11 by the translation mechanism 22, the housing door 12 is rotated around the housing 11 to a vertical position, and the equipment housing 1 is closed;

[0073] Step S3: Start the lifting cylinder 31, which drives the spray plate 33 to slide down along the guide column 32, thereby causing the shielding plate 51 to descend and press down on the wafer, and the buffer 53 to support the spray plate 33 below.

[0074] Step S4: Photoresist is coated on the wafer, and ultraviolet lamp 4 is turned on to irradiate the wafer;

[0075] Step S5: The rinsing solution is sprayed onto the wafer surface through the nozzle 34 to rinse the photoresist dissolved by ultraviolet light. The rinsing solution and photoresist enter the recovery tank 211.

[0076] Step S6: After rinsing is completed, open the box door 12, push the worktable 21 out of the box 11 through the translation mechanism 22, open the drain bolt 214, and discharge the rinsing solution and photoresist through the drain hole 2131.

[0077] In the wafer etching process proposed in this embodiment of the invention, when the shielding plate 51 descends and presses down on the wafer, the buffer 53 supports the spray plate 33, so that the force of the lifting cylinder 31 on the shielding plate 51 is buffered. The shielding plate 51 contacts the wafer, but the wafer is not subjected to force, thus avoiding continuous force on the shielding plate 51 and causing damage, extending the service life of the shielding plate 51, and at the same time avoiding force on the wafer and causing damage, thereby improving the quality of the wafer.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer etching apparatus, characterized in that, This includes an equipment enclosure, and etching components, spraying components, UV lamps, and shielding components housed within the enclosure, wherein: The equipment box includes a box body and a box door. The side of the box body has an opening, and the box door is hinged to the box body to close the opening. The etching assembly includes a worktable and a translation mechanism; the worktable includes a recovery tank and a placement plate, the recovery tank is used to collect liquid during the etching process, the bottom of the recovery tank is provided with a drain hole, the drain hole is sealed by a drain bolt; the placement plate is placed in the recovery tank; the translation mechanism is driven to the recovery tank and is used to drive the recovery tank to move in the direction of the opening; The spray assembly includes a lifting cylinder, a guide column, a spray plate, and a nozzle. The lifting cylinder is installed on the top surface of the inner wall of the housing and connected to the spray plate. The guide column is fixedly installed on the top surface of the housing. The spray plate is slidably installed on the guide column. The nozzle is installed on the spray plate. The ultraviolet lamp is installed on the door of the enclosure; The shielding assembly includes a shielding plate, a connecting rod, and a buffer. One end of the connecting rod is connected to the side of the spray plate away from the lifting cylinder, and the shielding plate is connected to the other end of the connecting rod. The buffer is sleeved on the guide post and connected to the end of the guide post away from the top surface of the housing. When the shielding plate descends and presses down on the wafer, the buffer supports the spray plate, so that the force of the lifting cylinder on the shielding plate is buffered. The shielding plate contacts the wafer, but the wafer is not subjected to force.

2. The wafer etching equipment as described in claim 1, characterized in that, A limiting sleeve is installed at the end of the guide post away from the top surface of the housing. The buffer is a spring, which is sleeved on the guide post, and one end of the spring is connected to the limiting sleeve.

3. The wafer etching equipment as described in claim 2, characterized in that, The guide post is provided in two parts, and the two guide posts are located on the side of the spray plate away from the ultraviolet lamp.

4. The wafer etching equipment as described in claim 1, characterized in that, The nozzle is provided in multiple ways, and the multiple nozzles are evenly distributed around the connecting rod as the center.

5. The wafer etching equipment as described in claim 4, characterized in that, The spray plate is provided with a liquid storage tank, and the spray head is connected to the liquid storage tank; The spray assembly also includes an infusion pipe, one end of which is connected to the liquid storage tank and the other end extends out of the housing to provide rinsing solution to the spray head.

6. The wafer etching equipment as described in claim 1, characterized in that, The translation mechanism includes a guide rail, a slider, and a telescopic cylinder. The guide rail is fixed to the bottom of the box in the direction of the opening. The slider is slidably mounted on the guide rail and connected to the recycling trough. The telescopic cylinder is mounted on the bottom of the box and connected to the slider.

7. The wafer etching apparatus as described in claim 6, characterized in that, The workbench also includes a water drain trough, the bottom of the recycling tank is recessed to form the water drain trough, and the bottom of the water drain trough has a water drain hole on the side near the opening, and the water drain hole is sealed by a water drain bolt.

8. The wafer etching apparatus as described in claim 7, characterized in that, The top surface of the slider is provided with a connecting groove, and the bottom surface of the recycling tank is provided with a mounting block. The mounting block is inserted into the connecting groove, and the length of the mounting block is less than the length of the connecting groove. The length direction of the connecting groove is perpendicular to the plane where the opening is located. The side of the recycling tank is provided with a sliding column at the end away from the drain hole. The inner wall of the side of the tank is provided with a guide groove. The guide groove includes at least a guide section. The guide section gradually extends upward from the end away from the opening toward the opening. The sliding column is slidably installed in the guide groove.

9. The wafer etching apparatus according to any one of claims 1-8, characterized in that, The equipment box also includes hinges, which are connected to the top surface of the box and the box door respectively.

10. A wafer etching process, using the wafer etching equipment according to any one of claims 1-9, characterized in that, include: Rotate the cabinet door to a horizontal position around the cabinet, open the equipment cabinet, push the worktable out of the cabinet through the translation mechanism, and place the wafer on the placement plate; The worktable is retracted into the box by the translation mechanism, the box door is rotated around the box to a vertical position, and the equipment box is closed. The lifting cylinder is activated, which drives the spray plate to slide down along the guide column, thereby causing the shielding plate to descend and press down on the wafer, and the buffer is supported below the spray plate. The wafer is coated with photoresist, and then ultraviolet light is turned on to irradiate the wafer. The rinsing solution is sprayed onto the wafer surface through a nozzle to rinse the photoresist dissolved by ultraviolet light. The rinsing solution and photoresist then enter the recovery tank. After rinsing is complete, open the chamber door, push the worktable out of the chamber using the translation mechanism, open the drain bolt, and discharge the rinsing solution and photoresist through the drain hole.

Images