Liquid cooling plate
By introducing a groove structure and a multi-inlet design into the liquid cooling plate flow channel cavity, the problem of insufficient heat dissipation efficiency of the liquid cooling plate flow channel is solved, achieving more efficient heat dissipation performance and lower temperature rise and pressure drop.
Patent Information
- Application Number
- CN202511146667.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-15
- Publication Date
- 2025-12-12
AI Technical Summary
There is still room for improvement in the heat dissipation efficiency of current liquid cooling plates, making it difficult to further improve heat dissipation performance while ensuring system reliability.
A groove structure is introduced into the flow channel cavity to optimize the flow channel structure, enhance boundary layer turbulence, increase the flow channel area, and set multiple liquid inlets to optimize fluid flow and reduce pressure drop.
By improving the boundary layer heat transfer conditions through the groove structure, the temperature rise and pressure drop are reduced, thereby improving the overall heat dissipation efficiency and performance of the liquid cooling plate.
Smart Images
Figure CN121126733A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat exchange technology, and more particularly to a liquid cooling plate. Background Technology
[0002] With the continuous increase in the power density of electronic devices, liquid cooling plates have been widely used in aerospace, power electronics, and communication base stations as a high-efficiency heat dissipation solution. Compared with traditional air cooling, liquid cooling plates exhibit significant performance advantages through forced convection heat transfer using a liquid working medium: First, the indirect cooling structure design effectively isolates electronic components from direct contact with the cooling medium, significantly improving system reliability while ensuring heat dissipation efficiency; second, the fine flow channel design inside the cold plate enables uniform distribution of heat load; third, the closed-loop circulation system reduces cooling medium loss, and with the use of a high specific heat capacity working medium, the heat exchange capacity can reach 3-5 times that of traditional solutions for the same volume. However, there is still room for improvement in the heat dissipation efficiency of current liquid cooling plate flow channels. Summary of the Invention
[0003] This application aims to at least solve one of the technical problems existing in the related art. To this end, this application proposes a liquid cooling plate, which aims to optimize the structure of the flow channel cavity and improve the heat dissipation efficiency of the liquid cooling plate.
[0004] The liquid cooling plate according to the embodiments of this application includes: Main body of the board; A flow channel structure is provided on the plate body. The flow channel structure has a flow channel cavity inside. The flow channel cavity includes a flow channel body and a groove structure. The flow channel body penetrates the flow channel structure. At least one section of the flow channel structure has the groove structure. The groove structure is connected to the flow channel body. In a cross-section perpendicular to the liquid flow direction, the width dimension of the groove structure is smaller than the dimension of the flow channel body in a first direction of the cross-section. The ratio between the depth dimension of the groove structure and the dimension of the flow channel body in a second direction of the cross-section is 0.01 to 0.04.
[0005] According to the embodiments of this application, the liquid cooling plate improves the heat transfer conditions of the boundary layer of the flow channel body by providing a groove structure on the flow channel cavity that connects to the main body of the flow channel. This intensifies boundary layer turbulence, thins the boundary layer, enhances convective heat transfer, and reduces the temperature rise of the cooling plate. At the same time, the groove structure increases the cross-sectional area of the flow channel, thereby reducing the pressure drop under the same inlet flow rate.
[0006] According to one embodiment of this application, the groove structure extends through the flow channel structure in the direction of its extension.
[0007] According to one embodiment of this application, the groove structure is symmetrically disposed on both sides of the flow channel body.
[0008] According to one embodiment of this application, the groove structure is symmetrically disposed on both sides of the length direction of the flow channel body.
[0009] According to one embodiment of this application, the channel body has a first-direction dimension of 3mm-8mm in cross-section, the channel body has a second-direction dimension of 10mm-20mm in cross-section, the groove structure has a width dimension of 3mm-8mm, and the groove structure has a depth dimension of 0.1mm-0.8mm.
[0010] According to one embodiment of this application, the flow channel structure is provided with a first liquid inlet, a second liquid inlet, and a liquid outlet communicating with the flow channel cavity. The first liquid inlet is located at a first end of the flow channel structure, the second liquid inlet is located at a second end of the flow channel structure, and the liquid outlet is located between the first liquid inlet and the second liquid inlet.
[0011] According to one embodiment of this application, the length of the flow channel cavity between the liquid outlet and the first liquid inlet is L1, and the length of the flow channel cavity between the liquid outlet and the second liquid inlet is L2, where L1=L2.
[0012] According to one embodiment of this application, the flow channel structure has multiple flow channel cavities arranged side by side inside.
[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0015] Figure 1 This is a front view of the liquid cooling plate provided in the embodiment of this application.
[0016] Figure 2 This is a schematic diagram of the axial cross-section of a flow channel cavity without a groove structure provided in one embodiment of this application.
[0017] Figure 3 This is a schematic diagram of the axial cross-section of a flow channel cavity with a groove structure provided in another embodiment of this application.
[0018] Figure 4 This is a schematic diagram of the temperature boundary layer of a flow channel structure provided in one embodiment of this application.
[0019] Figure 5 This is a pressure drop contour map of a flow channel structure without grooves provided by a control group of this application.
[0020] Figure 6 This is a temperature cloud map of a flow channel structure without grooves provided in a control group of this application.
[0021] Figure 7 This is a pressure drop contour map of a flow channel structure with a groove structure provided in one embodiment of this application.
[0022] Figure 8 This is a temperature cloud map of a flow channel structure with a groove structure provided in one embodiment of this application.
[0023] Figure 9 This is a schematic diagram of a flow channel structure without a groove structure provided in one embodiment of this application.
[0024] Figure 10 yes Figure 9 Temperature contour curves of the coolant flowing through the flow channel structure in the embodiment.
[0025] Figure 11 yes Figure 9 The flow velocity contour plot of the coolant flowing through the flow channel structure in the embodiment.
[0026] Figure 12 yes Figure 9 Field-coordinated angular distribution diagram of coolant flowing through the flow channel structure in the embodiment.
[0027] Figure 13 This is a schematic diagram of a flow channel structure with a groove structure provided in one embodiment of this application.
[0028] Figure 14 yes Figure 13 Temperature contour curves of the coolant flowing through the flow channel structure in the embodiment.
[0029] Figure 15 yes Figure 13 The flow velocity contour plot of the coolant flowing through the flow channel structure in the embodiment.
[0030] Figure 16 yes Figure 13 Field-coordinated angular distribution diagram of coolant flowing through the flow channel structure in the embodiment.
[0031] Figure 17 This is a schematic diagram of the flow channel structure provided in one embodiment of this application.
[0032] Figure 18 This is a pressure drop contour plot of a flow channel structure provided by a control group in this application.
[0033] Figure 19 This is a temperature contour map of the flow channel structure provided by a control group in this application.
[0034] Figure 20 This is a pressure drop contour map of a flow channel structure provided in one embodiment of this application.
[0035] Figure 21 This is a temperature cloud map of a flow channel structure provided in one embodiment of this application.
[0036] Figure 22 This is a pressure drop contour plot of a flow channel structure provided by a control group in this application.
[0037] Figure 23 This is a temperature contour map of the flow channel structure provided by a control group in this application.
[0038] Figure 24 This is a pressure drop contour map of a flow channel structure provided in one embodiment of this application.
[0039] Figure 25 This is a temperature cloud map of a flow channel structure provided in one embodiment of this application.
[0040] Figure label: 100. Main body of the board; 200. Flow channel structure; 201. First inlet; 202. Second inlet; 203. Outlet; 210. Flow channel cavity; 211. Flow channel body; 212. Groove structure; Detailed Implementation
[0041] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.
[0042] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0043] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections, wherein a fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0044] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0046] With the continuous increase in the power density of electronic devices, liquid cooling plates have been widely used in aerospace, power electronics, and communication base stations as a high-efficiency heat dissipation solution. Compared with traditional air cooling, liquid cooling plates exhibit significant performance advantages through forced convection heat transfer using a liquid working medium: First, the indirect cooling structure design effectively isolates electronic components from direct contact with the cooling medium, significantly improving system reliability while ensuring heat dissipation efficiency; second, the fine flow channel design inside the cold plate enables uniform distribution of heat load; third, the closed-loop circulation system reduces cooling medium loss, and with the use of a high specific heat capacity working medium, the heat exchange capacity can reach 3-5 times that of traditional solutions for the same volume. However, there is still room for improvement in the heat dissipation efficiency of current liquid cooling plate flow channels.
[0047] This application proposes a liquid cooling plate, which aims to optimize the structure of the flow channel cavity 210 and improve the heat dissipation efficiency of the liquid cooling plate.
[0048] The following is combined with Figures 1-25 The liquid cooling plate of the present invention is described.
[0049] The liquid cooling plate according to the embodiments of this application includes a plate body 100 and a flow channel structure 200. The flow channel structure 200 is disposed on the plate body 100. The flow channel structure 200 has a flow channel cavity 210 inside. The flow channel cavity 210 includes a flow channel body 211 and a groove structure 212. The flow channel body 211 penetrates the flow channel structure 200. At least one section of the flow channel structure 200 has a groove structure 212. The groove structure 212 communicates with the flow channel body 211. In a cross section perpendicular to the liquid flow direction, the width dimension of the groove structure 212 is smaller than the dimension of the flow channel body 211 in the first direction of the cross section. The ratio between the depth dimension of the groove structure 212 and the dimension of the flow channel body 211 in the second direction of the cross section is 0.01 to 0.04.
[0050] According to the liquid cooling plate of this application embodiment, by providing a groove structure 212 on the flow channel cavity 210 that connects to the flow channel body 211, the heat transfer conditions of the boundary layer of the flow channel body 211 are improved, the boundary layer turbulence is intensified, the boundary layer thickness is thinned, and the convective heat transfer effect is enhanced, thereby reducing the temperature rise of the liquid cooling plate. At the same time, the groove structure 212 increases the cross-sectional area of the flow channel, thereby reducing the pressure drop under the same inlet flow rate.
[0051] As is understandable, a liquid cooling plate is a component used for heat dissipation and can be applied in scenarios requiring heat dissipation, such as electronic devices and battery modules. By setting a flow channel structure 200 on the liquid cooling plate, the coolant flows in the flow channel structure 200 and exchanges heat with the object that needs heat dissipation, carrying away the heat and thus achieving the purpose of heat dissipation.
[0052] The main plate 100 serves as the foundation support structure for the liquid cooling plate. The main plate 100 can be made of a material with high thermal conductivity, such as aluminum alloy. The main plate 100 can quickly transfer heat from the heat source to the flow channel structure 200 while ensuring the structural stability of the liquid cooling plate. The shape and size of the main plate 100 can be designed according to the actual application scenario to adapt to different installation spaces and heat dissipation requirements.
[0053] The flow channel structure 200 is disposed on the main body 100 of the plate and is a key component for the liquid cooling plate to achieve its heat dissipation function. The flow channel structure 200 has a flow channel cavity 210 inside, which includes a flow channel body 211 and a groove structure 212. The flow channel body 211 penetrates the flow channel structure 200 and is the main channel for coolant flow. The shape and size of the flow channel body 211 are designed according to the heat dissipation requirements and the overall structure of the liquid cooling plate, and generally constitute a channel with a certain width and height to ensure sufficient flow space for the coolant.
[0054] The groove structure 212 connects to the main flow channel 211. In a cross-section perpendicular to the liquid flow direction, the width of the groove structure 212 is smaller than the dimension of the main flow channel 211 in the first direction of the cross-section, ensuring that the groove structure 212 does not excessively affect the mainstream flow of the main flow channel 211. The ratio between the depth of the groove structure 212 and the dimension of the main flow channel 211 in the second direction of the cross-section is between 0.01 and 0.04.
[0055] This ratio range was obtained through extensive experiments and simulation optimization. Within this range, the groove structure 212 can effectively improve the heat transfer conditions of the boundary layer of the flow channel body 211, while avoiding excessively large cross-sectional areas of the flow channel that would result in excessively low coolant flow rates and affect heat dissipation. In some possible embodiments, the flow channel body 211 has a first-direction dimension of 3mm-8mm, a second-direction dimension of 10mm-20mm, a groove structure 212 has a width of 3mm-8mm, and a groove structure 212 has a depth of 0.1mm-0.8mm.
[0056] In one embodiment, the width of the flow channel body 211 is 5 mm, the length of the flow channel body 211 is 15 mm, the width of the groove structure 212 is 3.9 mm, and the depth of the groove structure 212 is 0.2 mm.
[0057] Figure 1 This is a front view of a liquid cooling plate according to one embodiment. Figure 2 This is a schematic axial cross-sectional view of the flow channel cavity 210 without the groove structure 212 in the flow channel structure 200 provided in one embodiment of this application, serving as a control group. Figure 2 It can be seen that the main body of the flow channel 211 is 15mm deep and 5mm wide. Figure 3 This is an axial cross-sectional schematic diagram of a flow channel cavity 210 with a groove structure 212 provided in another embodiment of the present application, wherein a groove structure 212 with a width of 3.9 mm and a depth of 0.2 mm is added to the upper and lower surfaces of the flow channel body 211.
[0058] It should be noted that the flow channel body 211 has a depth of 15mm, which means that the dimension of the flow channel body 211 in the second direction of the cross-section is 15mm. The flow channel body 211 has a width of 5mm, which means that the dimension of the flow channel body 211 in the first direction of the cross-section is 5mm. This can be clearly seen from the attached drawings, and will not be elaborated here.
[0059] According to the theory of convection-enhanced heat transfer, when the fluid temperature differs from the wall temperature, heat exchange must occur between the pipe wall and the fluid. The thin layer near the wall where the fluid temperature changes significantly is called the temperature boundary layer. In this embodiment, the fluid temperature within this boundary layer reaches 99% of the mainstream temperature. Figure 4 As shown, improving the boundary layer heat transfer conditions is key to enhancing the heat transfer performance of cold plates.
[0060] After adding the groove structure 212, the boundary layer turbulence is intensified, the boundary layer thickness is thinned, the convective heat transfer effect is enhanced, and the temperature rise of the cold plate is reduced. Simultaneously, the groove structure 212 increases the cross-sectional area of the flow channel cavity 210, resulting in a lower pressure drop under the same inlet flow rate. Under the same inlet conditions (inlet velocity: 3.15 m / s, inlet temperature: 45℃), the temperature and pressure drop contour maps in the flow channel structure 200 without the groove structure 212 are shown below. Figure 5 and Figure 6 As shown. The temperature and pressure drop contours in the flow channel structure 200 with the groove structure 212 are shown below. Figure 7 and Figure 8 As shown.
[0061] Figure 5 It can be clearly seen that the pressure drop in the flow channel structure 200 without the groove structure 212 is 1.2 bar. Figure 6 It can be clearly seen that the highest temperature of the flow channel structure 200 without the groove structure 212 is 59.34℃. Figure 7 It can be clearly seen that the pressure drop in the flow channel structure 200 with the groove structure 212 is 1.17 bar. Figure 8 It can be clearly seen that the highest temperature of the flow channel structure 200 with the groove structure 212 is 57.60℃. It can be seen that the pressure drop of the grooved flow channel is reduced by 0.03 bar and the maximum temperature rise is reduced by 1.74℃ compared with the original flow channel.
[0062] To better illustrate the advantages of the groove structure 212, the longitudinal section AA of the flow channel structure 200 without the groove structure 212 is taken. Figure 9 In Fluent, the analysis yields the following isopleths: temperature profile, flow velocity profile, and field-coordinated angular distribution of the coolant flowing through flow channel structure 200. Figure 10 , Figure 11 , Figure 12 .
[0063] Similarly, take the longitudinal section AA of the flow channel structure 200 with the groove structure 212. Figure 13 In Fluent, the analysis yields the following isopleths: temperature profile, flow velocity profile, and field-coordinated angular distribution of the coolant flowing through flow channel structure 200. Figure 14 , Figure 15 , Figure 16 .
[0064] Depend on Figure 10 and Figure 14It can be seen that the temperature inlet development section of the flow channel structure 200 with the groove structure 212 becomes longer, increasing from 0.29m to 0.34m. With the temperature inlet development section becoming longer, the temperature boundary layer thickness becomes thinner while the axial coordinate values are equal, thus enhancing convective heat transfer.
[0065] Depend on Figure 11 and Figure 15 It can be seen that the center velocity of the coolant flowing through the flow channel structure 200 without the groove structure 212 is 2.6 m / s, while the center velocity of the coolant flowing through the flow channel structure 200 with the groove structure 212 is 2.8 m / s. The higher coolant velocity allows for more heat exchange in the same amount of time, removing more heat.
[0066] Depend on Figure 13 and Figure 16 It can be seen that the flow channel structure 200 with groove structure 212 has a smaller field cooperation angle value in the central region and a more uniform distribution. The field cooperation angle is an important indicator for measuring the cooperation between temperature gradient and velocity gradient; the smaller the value, the better the cooperation between the two. Therefore, it can be concluded that the flow channel structure 200 with groove structure 212 has better heat dissipation.
[0067] According to one embodiment of this application, the groove structure 212 corresponds to the extension direction of the flow channel structure 200 and extends through the flow channel structure 200.
[0068] In this embodiment, the groove structure 212 extends through the flow channel structure 200 along its extension direction, meaning the entire flow channel structure 200 is provided with the groove structure 212. The through-flow design of the groove structure 212 ensures that the coolant is always influenced by it throughout the flow of the entire flow channel structure 200. This intensifies boundary layer turbulence throughout the entire flow channel, resulting in a continuously thinning boundary layer and enhanced convective heat transfer across the entire flow channel, rather than just in a localized area.
[0069] In some embodiments, the groove structure 212 is disposed on one side of the heated surface of the flow channel body 211. This can effectively increase the degree of boundary layer turbulence on one side of the heated surface, thereby improving heat dissipation efficiency.
[0070] In some embodiments, the groove structure 212 is symmetrically arranged on both sides of the flow channel body 211. The symmetrical arrangement of the groove structure 212 ensures that when the coolant flows in the flow channel body 211, the boundary layer on both sides is affected by the groove structure 212, making the heat transfer-related parameters such as the degree of boundary layer turbulence intensification and the change of boundary layer thickness on both sides of the flow channel body 211 more uniform.
[0071] According to one embodiment of this application, the groove structure 212 is symmetrically disposed on both sides of the flow channel body 211 along its length.
[0072] According to one embodiment of this application, refer to Figure 17 The flow channel structure 200 is provided with a first liquid inlet 201, a second liquid inlet 202 and an outlet 203 that connect the flow channel cavity 210. The first liquid inlet 201 is located at the first end of the flow channel structure 200, the second liquid inlet 202 is located at the second end of the flow channel structure 200, and the outlet 203 is located between the first liquid inlet 201 and the second liquid inlet 202.
[0073] In this embodiment, the flow channel structure 200 has three important openings: a first inlet 201, a second inlet 202, and an outlet 203. The first inlet 201 is located at the first end of the flow channel structure 200 and is one of the main inlets for external fluid to enter the flow channel cavity 210. The first inlet 201 can have a standard interface size to ensure reliable connection with external fluid supply equipment (such as pipes, pumps, etc.). When fluid enters the first inlet 201, the inflow rate and velocity can be controlled by adjusting the parameters of the external equipment (such as the pump speed). The second inlet 202 is located at the second end of the flow channel structure 200 and is positioned opposite to the first inlet 201. By using both the first inlet 201 and the second inlet 202 simultaneously, fluid can enter at the same time. The outlet 203 is located between the first inlet 201 and the second inlet 202 and is the outlet of the flow channel structure 200, used to discharge the fluid flowing through the flow channel cavity 210.
[0074] In some possible embodiments, the flow rate of fluid entering the flow channel cavity 210 from the first inlet 201 and the second inlet 202 can be adjusted according to the different positions of the outlet 203.
[0075] Understandably, by using two inlets (first inlet 201 and second inlet 202), the coolant travels a shorter distance in the cold plate, thus reducing the pressure drop.
[0076] Below is one embodiment of this application, in which the flow channel structure 200 is provided with a first inlet 201, a second inlet 202, and an outlet 203. Another embodiment serves as a control group, in which the flow channel structure 200 has only one inlet and one outlet 203. The temperature and pressure drop contour maps of the flow channel structure 200 in the control group are shown below. Figure 18 and Figure 19 As shown, the temperature and pressure drop contour maps in the flow channel structure 200 of this embodiment are as follows: Figure 20 and Figure 21 As shown.
[0077] Depend on Figure 18 and Figure 19 It can be seen that the flow channel structure of the control group has a pressure drop of 1.2 bar and a maximum temperature of 59.34℃.
[0078] Depend on Figure 20 and Figure 21 It can be seen that the flow channel structure 200 in this embodiment has a pressure drop of 1.03 bar and a maximum temperature of 58.94°C. Therefore, by setting the first liquid inlet 201 and the second liquid inlet 202, the pressure drop is reduced by 0.17 bar, and the maximum temperature rise is also reduced.
[0079] According to one embodiment of this application, the length of the flow channel cavity 210 between the liquid outlet 203 and the first liquid inlet 201 is L1, and the length of the flow channel cavity 210 between the liquid outlet 203 and the second liquid inlet 202 is L2, where L1=L2.
[0080] The length of the flow channel cavity 210 between the outlet 203 and the first inlet 201 is L1, and the length of the flow channel cavity 210 between the outlet 203 and the second inlet 202 is L2, and L1 = L2. When two different fluids enter the flow channel cavity 210 from the two inlets, since the flow channel lengths are equal, the distance they need to travel within the flow channel cavity 210 is reduced by half.
[0081] The following is one embodiment of this application: the flow channel structure 200 is provided with a first inlet 201, a second inlet 202, and an outlet 203, and the flow channel cavity 210 is provided with a groove structure 212. Another embodiment is a control group, in which the flow channel structure 200 has only one inlet and one outlet 203, and the flow channel cavity 210 does not have a groove structure 212.
[0082] Temperature and pressure drop contour plots in the flow channel structure 200 of the control group are shown below. Figure 22 and Figure 23 As shown, the temperature and pressure drop contour maps in the flow channel structure 200 of this embodiment are as follows: Figure 24 and Figure 25 As shown.
[0083] Depend on Figure 22 and Figure 23 It can be seen that the control group's flow channel structure has a pressure drop of 1.2 bar and a maximum temperature of 59.34℃. The temperature rise is 14.34℃. Figure 24 and Figure 25 It can be seen that the flow channel structure 200 in this embodiment has a pressure drop of 0.98 bar, a maximum temperature of 56.67°C, and a temperature rise of 11.67°C. Therefore, the flow channel structure 200 in this embodiment has a lower pressure drop of 0.22 bar and a lower maximum temperature rise of 2.67°C compared to the control group. The pressure drop is reduced by 18.3%, and the temperature rise is reduced by 18.6%, resulting in a significant improvement in the overall performance of the liquid cooling plate.
[0084] According to one embodiment of this application, the flow channel structure 200 has a plurality of flow channel cavities 210 arranged side by side. The plurality of side-by-side flow channel cavities 210 can simultaneously accommodate and transport more fluid. Compared to a single flow channel cavity 210, this structure significantly increases the fluid throughput.
[0085] This invention, starting from the theoretical level of convective heat transfer enhancement technology, proposes a liquid-cooled plate with a novel flow channel structure 200. It solves the problem that traditional cold plate structure optimization measures cannot simultaneously address temperature rise and pressure drop. The temperature rise and pressure drop performance of this liquid-cooled plate are improved compared to the original liquid-cooled plate, and it provides valuable insights for the structural optimization of other flow channel types of heat dissipation devices.
[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A liquid-cooled plate, characterized in that, include: Main body of the board; A flow channel structure is provided on the plate body. The flow channel structure has a flow channel cavity inside. The flow channel cavity includes a flow channel body and a groove structure. The flow channel body penetrates the flow channel structure. At least one section of the flow channel structure has the groove structure. The groove structure is connected to the flow channel body. In a cross-section perpendicular to the liquid flow direction, the width dimension of the groove structure is smaller than the dimension of the flow channel body in a first direction of the cross-section. The ratio between the depth dimension of the groove structure and the dimension of the flow channel body in a second direction of the cross-section is 0.01 to 0.
04.
2. The liquid cooling plate according to claim 1, characterized in that, The groove structure extends through the flow channel structure in the direction corresponding to its extension.
3. The liquid cooling plate according to claim 1, characterized in that, The groove structure is symmetrically arranged on both sides of the flow channel body.
4. The liquid cooling plate according to claim 3, characterized in that, The groove structure is symmetrically arranged on both sides of the length direction of the main flow channel.
5. The liquid cooling plate according to claim 1, characterized in that, The main body of the flow channel has a first-direction dimension of 3mm-8mm, a second-direction dimension of 10mm-20mm, a groove structure width of 3mm-8mm, and a groove structure depth of 0.1mm-0.8mm.
6. The liquid cooling plate according to claim 1, characterized in that, The flow channel structure is provided with a first liquid inlet, a second liquid inlet, and a liquid outlet that connect the flow channel cavity. The first liquid inlet is located at the first end of the flow channel structure, the second liquid inlet is located at the second end of the flow channel structure, and the liquid outlet is located between the first liquid inlet and the second liquid inlet.
7. The liquid cooling plate according to claim 6, characterized in that, The length of the flow channel cavity between the liquid outlet and the first liquid inlet is L1, and the length of the flow channel cavity between the liquid outlet and the second liquid inlet is L2, where L1 = L2.
8. The liquid-cooled plate according to any one of claims 1 to 7, characterized in that, The flow channel structure has multiple flow channel cavities arranged side by side inside.