LED device

Abstract

The invention relates to an LED device, and relates to the technical field of LED packaging. The LED device comprises a substrate and a packaging light-emitting assembly, wherein the packaging light-emitting assembly is mounted on the substrate; the packaging light-emitting assembly comprises a light-emitting component, a covering component and a light conversion component, the light conversion component comprises a light-in face, a light-out face and a side face, the side face comprises an auxiliary light-out face, the light-emitting component is located on one side of the light-in face of the light conversion component, and the covering component wraps the light-emitting component and part of the light conversion component to enable the light-out face and the auxiliary light-out face of the light conversion component to be exposed. According to the LED device, through the specific structural design, the LED device has higher light extraction efficiency, the structure can be adjusted according to the requirements of different application scenes, and the effect of enlarging or reducing the optical distribution angle is achieved.

Description

Technical Field

[0001] This invention relates to the technical field of LED packaging, and in particular to an LED device. Background Technology

[0002] In existing flip-chip white LED technology, a light-emitting component and a light-converting component are typically mounted sequentially on a substrate, and then covered with a filler material. During processing, the light-emitting surface of the light-converting component is exposed, allowing light emitted from the light-emitting component to pass through the light-converting component and exit from the light-emitting surface. However, in the aforementioned conventional flip-chip LED structure design, the upper surface of the covering element that covers the light-emitting component and the light-converting component is coplanar and flush with the light-emitting surface. This feature poses a challenge to the packaging process: how to ensure that the two surfaces are perfectly flush without abrading the upper surface of the light-converting component. If the light-converting component is abraded, the light-converting material it contains will be reduced, leading to a detrimental change in the device's emitted color. Furthermore, it is foreseeable that, since the four sides of the light-converting component are completely covered by the covering element, some light rays in these directions cannot be emitted directly and can only exit from the light-emitting surface through reflection or multiple reflections. During these reflections and multiple reflections, light energy is absorbed and lost. Devices with this feature have low light extraction efficiency.

[0003] Meanwhile, existing fluorescent conversion technology has certain limitations in order to focus on different aspects of material properties, such as melting point, compatibility of doped materials, cost, and environmental requirements. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides an LED device that, through a specific structural design, achieves higher light extraction efficiency. Furthermore, the structure can be adjusted to expand or reduce the optical distribution angle according to the needs of different application scenarios.

[0005] To achieve the above objectives, the present invention provides an LED device, including a substrate and an encapsulated light-emitting component, wherein the encapsulated light-emitting component is mounted on the substrate;

[0006] The encapsulated light-emitting component includes: a light-emitting component, a covering component, and a light conversion component. The light conversion component includes a light-incident surface, a light-emitting surface, and a side surface. The side surface includes an auxiliary light-emitting surface. The light-emitting component is located on the side of the light-incident surface of the light conversion component. The covering component wraps around the light-emitting component and part of the light conversion component, exposing the light-emitting surface and the auxiliary light-emitting surface of the light conversion component. The covering component is connected to the auxiliary light-emitting surface through an adjacent area, which is an arc surface.

[0007] The inventors have studied the aforementioned technical problems and believe that the key issue lies in ensuring that the light-emitting surface and the upper surface of the covering component are flush. Therefore, the inventors propose abandoning the existing structural design where the light-emitting surface of the light conversion component is flush with the upper surface of the covering component. Instead, the light conversion component is made higher than the covering component; that is, the covering component does not completely cover the sides of the light conversion component, but only covers a portion, exposing the remaining sides of the light conversion component to form an auxiliary light-emitting surface. On the one hand, this eliminates the high requirements and inconveniences in processing caused by having the light-emitting surface flush with the upper surface of the covering component. On the other hand, by adding an auxiliary light-emitting surface, the LED can achieve a more efficient light extraction rate.

[0008] In one embodiment, the area of ​​the auxiliary light-emitting surface accounts for 5%-95% of the area of ​​the side surface.

[0009] When the auxiliary light-emitting surface is below the aforementioned range, the light conversion component is excessively covered, affecting light extraction and causing brightness loss; if it is above this range, there is a risk of blue light escaping from the sides, damaging the light color quality. When the area of ​​the auxiliary light-emitting surface is within the aforementioned range, it ensures that the light conversion component protrudes beyond the covering component, forming the auxiliary light-emitting surface from a portion of the side of the light conversion component, while also ensuring that the covering component includes a portion of the side of the light conversion component. Furthermore, it should be noted that the portion of the side of the light conversion component covered by the covering component is located on the side away from the light-emitting surface. This covering method ensures that the contact interface between the light conversion component and the light-emitting component is completely covered (i.e., the light-emitting component is completely covered), thereby preventing blue light from escaping from the contact interface between the light conversion component and the light-emitting component.

[0010] In one embodiment, the area of ​​the auxiliary light-emitting surface accounts for 10-75% of the area of ​​the side surface.

[0011] As the auxiliary light-emitting surface changes from small to large within the aforementioned range, the emission angle of the resulting LED device also gradually increases. Based on the probability distribution observed in batch testing, the inventors found that the average emission angle gradually changes from 115° to 125°. Therefore, this structure allows technicians to adjust the auxiliary light-emitting surface to meet the different emission angles required for different products.

[0012] In one embodiment, the length of the auxiliary light-emitting surface in the vertical direction is 5%-95% of the length of the side surface in the vertical direction.

[0013] In one embodiment, the length of the auxiliary light-emitting surface in the vertical direction is 10%-75% of the length of the side surface in the vertical direction.

[0014] In one embodiment, the covering component is connected to the auxiliary light-emitting surface via an adjacent region, which is an arc surface.

[0015] In one embodiment, the arc surface is a protruding arc surface or a concave arc surface.

[0016] The initial height of the cover component is greater than that of the light conversion component. Therefore, the upper surface of the cover component needs to be thinned to be lower than that of the light conversion component through a selective thinning process. When the height difference initially appears, the cross-sectional shape of the adjacent area is a step with a near right angle. As the thinning degree increases, the cross-sectional shape of the adjacent area gradually shows a transitional rounded corner. If the rounded corner direction is from the upper surface of the cover component upwards to the side of the light conversion component, the adjacent area is a concave arc surface. If the rounded corner direction is from the upper surface of the cover component downwards to the side of the light conversion component, the adjacent area is a protruding arc surface.

[0017] In one embodiment, the number of the light-emitting component and the light-converting component is at least one.

[0018] In one embodiment, the substrate includes a substrate layer and a connecting member, the connecting member penetrating the substrate layer, one end of the connecting member being connected to the encapsulated light-emitting component, and the other end of the connecting member being exposed in the substrate layer.

[0019] The other end of the aforementioned connecting component is used to connect to the circuit board.

[0020] In one embodiment, the connecting component includes: an inner connector, an outer connector, and an intermediate connector. The inner connector is disposed on one side of the substrate layer and is connected to the encapsulated light-emitting component. The outer connector is disposed on the other side of the substrate layer, and the inner connector is connected to the outer connector through the intermediate connector.

[0021] In one embodiment, the external connector is used to connect a circuit board.

[0022] In one embodiment, when the number of light-emitting components and light-converting components is ≥2, the light-converting components correspond one-to-one with the light-emitting components, and the light-emitting components are connected in series or in parallel.

[0023] In one embodiment, when the light-emitting components are connected in series, the substrate further includes a series connector and a heat sink. The series connector and the inner connector are located on the same side of the substrate layer. The series connector is used to connect a plurality of light-emitting components in series. Electrical clearances are maintained between the inner connectors and between the inner connectors and the series connectors.

[0024] The heat sink and the external connector are located on the same side of the substrate layer, and electrical clearances are maintained between the external connectors and between the external connector and the heat sink.

[0025] In one embodiment, when the light-emitting components are connected in parallel, each light-emitting component has a pair of inner connectors and a pair of outer connectors corresponding to each other. An electrical clearance is maintained between the inner connectors and between the outer connectors.

[0026] The external connector is used to connect the circuit board and form an external metal electrode that supplies power to the light-emitting component.

[0027] In one embodiment, the raw material for preparing the light conversion component includes low-melting-point glass; the low-melting-point glass includes a basic network forging body, an alkali metal oxide, and additives, wherein the additives include at least one of light transmittance modifiers, flexibility modifiers, modifiers, stabilizers, and mechanical property modifiers;

[0028] The basic network form includes at least one of P2O5, Na2CO3, B2O3, and ZnO.

[0029] The existing components used to fabricate light conversion devices typically consist of a certain proportion of SiO2, B2O3, ZnO, P2O5, Na2CO3, Al2O3, and metal oxides such as barium, calcium, magnesium, and strontium (hereinafter referred to as RO), as well as small or trace amounts of alkali metal oxides (hereinafter referred to as R2O). After mixing a certain proportion of the fluorescent conversion material, the mixture is melted and sintered into a glass ingot, then sliced, and finally granulated and analyzed. Among the factors affecting performance, the sintering temperature must not be too high, otherwise it can easily cause thermal quenching of the fluorescent conversion material; secondly, its mechanical properties, such as flexibility, hardness, and light transmittance, as well as the compatibility between the glass and the doped fluorescent material, must be considered; finally, cost and environmental compatibility must also be taken into account (e.g., it must not contain toxic substances or heavy metals such as lead).

[0030] After studying existing light conversion components, the inventors found that their disclosed component categories are all the same or similar, differing only in proportion. Common low-melting-point glasses typically use boron oxide or zinc oxide as the network forging body, with other components acting as modifiers. In some of these cases, the melting point is relatively high, which can easily cause quenching of the phosphor inside during sintering; others contain heavy metal ions, affecting the adaptability to rare-earth doping, especially in doped phosphor conversion material systems containing high concentrations of Eu. 3+ / Ce 3+ In addition to activators, some materials containing higher costs, such as Al2O3 / TiO2, are added to improve mechanical strength. Therefore, the inventors propose that the light conversion component prepared from the above-mentioned raw materials can not only have a relatively lower melting point temperature, better rare earth doping compatibility, or lower manufacturing cost, but also achieve better light extraction efficiency.

[0031] In one embodiment, when the basic network forming body comprises P2O5 and Na2CO3, the low-melting-point glass comprises the following raw materials by mass percentage:

[0032]

[0033] The light transmittance modifier includes B2O3, the flexibility modifier includes ZnO, and the modifier includes CaO.

[0034] In one embodiment, the basic network forming body comprises B2O3, and the low-melting-point glass comprises the following raw materials in weight percentages:

[0035]

[0036] The stabilizer includes MgO, and the flexibility modifier includes ZnO.

[0037] In one embodiment, when the basic network forming body includes P2O5 and Na2CO3, the alkali metal oxide includes at least one of K2O, Na2O, and Li2O.

[0038] In one embodiment, the basic network forming body comprises ZnO, and the low-melting-point glass comprises the following raw materials in weight percentages:

[0039]

[0040] The alkali metal oxides include Na2O and K2O, wherein Na2O accounts for 21%-25% of the mass percentage of the raw materials of the low melting point glass, and K2O accounts for 9%-15% of the mass percentage of the raw materials of the low melting point glass.

[0041] The light transmittance modifier includes B2O3, and the mechanical property modifier includes P2O5.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] The present invention discloses an LED device that, through a specific structural design, enables the LED device to have a more efficient light extraction efficiency, and the structure can be adjusted according to the needs of different application scenarios to achieve the effect of expanding or reducing the optical distribution angle. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the LED device in Example 1;

[0045] Figure 2 This is a schematic diagram of the LED device and adjacent area in Example 1;

[0046] Figure 3 This is a structural schematic diagram of the adjacent region in Example 1 when the cross-sectional shape is a step with a near right angle;

[0047] Figure 4 This is a schematic diagram of several light emission modes in Example 1;

[0048] Figure 5 This is a schematic diagram of the LED device structure in Example 2;

[0049] Figure 6 This is a schematic diagram of several light emission modes in Example 2.

[0050] Figure 7 This is a schematic diagram of the structure of an LED containing two or more chips connected in series, as shown in Example 4.

[0051] Figure 8 This is a schematic diagram of the structure of an LED in Example 5 when two or more chips are connected in parallel;

[0052] Wherein, 10 is the substrate, 101 is the substrate layer, 102a is the inner connector, 102b is the outer connector, 103 is the intermediate connector, 104 is the heat dissipation component, 105 is the series connector, 106 is the outer connector, 20 is the light-emitting component, 30 is the light conversion component, 301 is the light-emitting surface, 302 is the side surface, 302a is the auxiliary light-emitting surface, 40 is the covering component, 40a is the adjacent area, 402 is the inner side surface of the covering component, 501 is the light emitted from the light-emitting surface, 502 is the light emitted from the auxiliary light-emitting surface, and 503 is the light emitted after being reflected by the inner sidewall 402 of the covering component. Detailed Implementation

[0053] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0054] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0056] source:

[0057] Unless otherwise specified, all reagents, materials and equipment used in this invention are commercially available; unless otherwise specified, all test methods are conventional test methods in the field.

[0058] Example 1

[0059] An LED device.

[0060] 1. The structure of the LED device.

[0061] The LED device includes a substrate 10 and an encapsulated light-emitting component mounted on one side of the substrate 10. The encapsulated light-emitting component includes a light-emitting element 20, a covering element 40, and a light conversion element 30. The light-emitting element 20 and the light conversion element 30 are sequentially stacked on one side of the substrate 10. The light conversion element 30 has one light-incident surface, one light-emitting surface 301, and four side surfaces 302. Each side surface 302 has an auxiliary light-emitting surface 302a. The light-emitting element 20 is located on the light-incident surface side of the light conversion element 30. The covering element 40 covers the light-emitting element 20 and part of the light conversion element 30, exposing the light-emitting surface 301 and the auxiliary light-emitting surface 302a. The area of ​​the auxiliary light-emitting surface 302a occupies 5%-95% of the area of ​​the side surface 302. It is understood that technicians can adjust the area of ​​the auxiliary light-emitting surface 302a to occupy 10%-75% of the area of ​​the side surface 302 according to the light emission angle requirements of different products. The area where the covering component 40 connects with the auxiliary light-emitting surface 302a is the adjacent area 40a, and the surface of the adjacent area 40a is a curved surface.

[0062] The substrate 10 includes a substrate layer 101 and a connecting component. The connecting component penetrates the substrate layer 101, with one end connected to the packaged light-emitting component and the other end exposed from the substrate layer 101 for connecting the circuit board.

[0063] In this embodiment, the arc surface is a concave arc surface facing the substrate 10, and the number of light-emitting components 20 and light conversion components 30 is one; the connecting component consists of an inner connector 102a, an outer connector 102b, and an intermediate connector 103. The inner connector 102a is disposed on one side of the substrate layer 101 and is used to connect with the packaged light-emitting component. The outer connector 102b is disposed on the other side of the substrate layer 101 and is used to connect with the circuit board. The inner connector 102a is connected to the outer connector 102b through the intermediate connector 103.

[0064] The structural schematic diagram of the LED device in this embodiment is shown below. Figure 1 , Figure 2 As shown.

[0065] 2. The fabrication method of the LED device.

[0066] The initial height of the cover component 40 is greater than that of the light conversion component 30. Therefore, a selective thinning process is needed to thin the upper surface of the cover component 40 to below the upper surface of the light conversion component 30. When the height difference initially appears, the cross-sectional shape of the adjacent region 40a is a near-right-angle step (e.g., ...). Figure 3 As the thinning degree increases, the cross-sectional shape of the adjacent region 40a gradually presents a transition rounded corner. The direction of the rounded corner is from the upper surface of the covering member 40 to the upper surface of the light conversion member 30. That is, the adjacent region 40a is an arc surface that is recessed towards the substrate 10.

[0067] 3. The working principle of this LED device.

[0068] The light emitted by the light-emitting component 20 enters the light conversion component 30 from the incident surface. After wavelength conversion, most of the light exits from the light-emitting surface 301 of the light conversion component 30. A small portion of the light does not exit directly from the light-emitting surface 301 due to scattering and reflection by the light conversion material particles and the non-directional nature of the light excited after wavelength conversion. Of these rays that do not exit from the light-emitting surface 301, the portion that does not illuminate the covering component 40 exits from the auxiliary light-emitting surface 302a in the side 302 of the light conversion component 30; the other portion directly illuminates the inner side 302 of the covering component 40 and is reflected back to the light conversion component 30. After several refractions and reflections, most of the light eventually exits from the light-emitting surface 301 or from a position not blocked by the covering component 40, such as... Figure 4 As shown.

[0069] In this embodiment, the cross-sectional shape of the adjacent region 40a gradually presents a transitional rounded corner. When the rounded corner is upward, that is, when the adjacent region 40a is an arc surface concave towards the substrate 10, the light emitted from the side 302 increases the optical distribution angle of the LED device, which is suitable for application scenarios with a larger light emission angle and a lower center light intensity.

[0070] Example 2

[0071] An LED device.

[0072] 1. The structure of the LED device.

[0073] The LED device includes a substrate 10 and an encapsulated light-emitting component mounted on one side of the substrate 10. The encapsulated light-emitting component includes a light-emitting element 20, a covering element 40, and a light conversion element 30. The light-emitting element 20 and the light conversion element 30 are sequentially stacked on one side of the substrate 10. The light conversion element 30 has one light-incident surface, one light-emitting surface 301, and four side surfaces 302. Each side surface 302 has an auxiliary light-emitting surface 302a. The light-emitting element 20 is located on the light-incident surface side of the light conversion element 30. The covering element 40 covers the light-emitting element 20 and part of the light conversion element 30, exposing the light-emitting surface 301 and the auxiliary light-emitting surface 302a. The area of ​​the auxiliary light-emitting surface 302a occupies 5%-95% of the area of ​​the side surface 302. It is understood that technicians can adjust the area of ​​the auxiliary light-emitting surface 302a to occupy 10%-75% of the area of ​​the side surface 302 according to the light emission angle requirements of different products. The area where the covering component 40 connects with the auxiliary light-emitting surface 302a is the adjacent area 40a, and the surface of the adjacent area 40a is a curved surface.

[0074] The substrate 10 includes a substrate layer 101 and a connecting component. The connecting component penetrates the substrate layer 101, with one end connected to the packaged light-emitting component and the other end exposed from the substrate layer 101 for connecting the circuit board.

[0075] In this embodiment, the arc surface is an arc surface protruding away from the substrate 10, and the number of light-emitting components 20 and light conversion components 30 is one; the connecting component consists of an inner connector 102a, an outer connector 102b, and an intermediate connector 103. The inner connector 102a is disposed on one side of the substrate layer 101 and is used to connect with the packaged light-emitting component. The outer connector 102b is disposed on the other side of the substrate layer 101 and is used to connect with the circuit board. The inner connector 102a is connected to the outer connector 102b through the intermediate connector 103.

[0076] The structural schematic diagram of the LED device in this embodiment is shown below. Figure 5 As shown.

[0077] 2. The fabrication method of the LED device.

[0078] The initial height of the cover component 40 is greater than that of the light conversion component 30. Therefore, a selective thinning process is needed to thin the upper surface of the cover component 40 to below the upper surface of the light conversion component 30. When the height difference initially appears, the cross-sectional shape of the adjacent region 40a is a near-right-angle step (e.g., ...). Figure 3 As shown); those skilled in the art can select different grinding materials, grinding speeds, pressures, etc., than those in the preparation method in Example 1 to reduce the thickness according to conventional techniques in the art. As the degree of thinning increases, the cross-sectional shape of the adjacent region 40a becomes a downward-facing rounded corner, that is, the adjacent region 40a is an arc surface protruding away from the substrate 10.

[0079] 3. The working principle of this LED device.

[0080] The light emitted by the light-emitting component 20 enters the light conversion component 30 from the incident surface. After wavelength conversion, most of the light exits from the light-emitting surface 301 of the light conversion component 30. A small portion of the light does not exit directly from the light-emitting surface 301 due to scattering and reflection by the light conversion material particles and the non-directional nature of the excited light after wavelength conversion. Of these rays that do not exit from the light-emitting surface 301, the portion that does not illuminate the covering component 40 exits from the auxiliary light-emitting surface 302a in the side 302 of the light conversion component 30; the other portion directly illuminates the inner surface of the covering component 40 and is reflected back to the light conversion component 30. After several refractions and reflections, most of the light eventually exits from the light-emitting surface 301 or from a position not blocked by the covering component 40, such as... Figure 6 As shown.

[0081] In this embodiment, the cross-sectional shape of the adjacent region 40a gradually presents a transitional rounded corner. When the rounded corner is downward, that is, when the adjacent region 40a is an arc surface protruding away from the substrate 10, part of the light emitted from the side 302 will be reflected by the slope towards the main light emission direction, which reduces the optical distribution angle of the LED device and is suitable for application scenarios with smaller light emission angle and higher beam convergence.

[0082] Example 3

[0083] LED devices were fabricated within the technical framework of Examples 1 and 2.

[0084] A ceramic-based LED device includes: a ceramic-based circuit board (i.e., substrate 10), a light-emitting component 20 mounted on the ceramic-based circuit board, a light-converting component 30 mounted on the light-emitting component 20, and a covering component 40 mounted on the ceramic-based circuit board and surrounding the light-emitting component 20 and the light-converting component 30 on all four sides. Specifically, the covering component 40 completely covers all sides 302 of the light-emitting component 20 and a portion of the height of the four sides 302 of the light-converting component 30, such that the exposed height of the four sides 302 is 5%-95% of the total height of the sides 302. The exposed height can be adjusted to 10-75% of the total height of the sides 302 according to the product's light emission angle requirements. In the area adjacent to the light-converting component 30 (i.e., adjacent area 40a), one of three cross-sectional shapes is formed: a right-angled step, an upward rounded corner, or a downward rounded corner.

[0085] Specifically, the ceramic-based circuit board includes: a ceramic substrate layer (i.e., substrate layer 101), internal metal circuits and pads (i.e., internal connectors 102a) formed on the surface of the ceramic substrate, external metal circuits and pads (i.e., external connectors 102b) formed on the opposite side of the surface where the pads are located, and conductive vias formed by drilling holes and metallizing the internal hole walls inside the ceramic substrate. The conductive vias are electrically connected to the two metal pads, and the interior of the conductive vias is tightly filled with metallized filler.

[0086] Specifically, the light-emitting component 20 is mounted on the internal metal pad by gold-tin reflow or ultrasonic thermoforming, and forms the correct electrical connection.

[0087] Specifically, the light conversion component 30 includes a substrate and fluorescent conversion material particles dispersed within the substrate. The substrate has a sheet-like structure, with its upper surface parallel to the mounting surface of the light-emitting element serving as the main light-emitting surface (i.e., light-emitting surface 301). Four side surfaces 302 are perpendicular to the main light-emitting surface, with the areas not obscured by the covering component 40 serving as auxiliary light-emitting surfaces. Specifically, the substrate material can be one of silicone, ceramic, or glass; the fluorescent conversion material particles can be one or more combinations of aluminates, silicates, nitrides, oxynitrides, fluorides, etc.

[0088] Specifically, the covering component 40 includes: a main body, an inner surface of the main body surrounding the four sides of the light conversion component 30, and an area where the main body is adjacent to the light conversion component 30. Specifically, the main body can be one of white silicone, transparent silicone filled with white particulate filler, white EMC resin, white SMC resin, etc.

[0089] Specific implementation steps:

[0090] S1: Install the light-emitting component 20 on the ceramic-based circuit board;

[0091] S2: Install the light conversion component 30 on the light-emitting component 20;

[0092] S3: Fill the light-emitting component 20 and the light conversion component 30 with the raw material of the covering component 40. Depending on the optional material type, the raw material can be liquid or solid, and different filling and curing methods are adopted accordingly.

[0093] Liquid materials: can be cured by self-leveling adhesive injection or injection molding, followed by heating.

[0094] Solid materials: can be produced using a molding thermoforming process, followed by heating and curing.

[0095] S4: In step S3, the height of the glue injection is controlled to be higher than that of the light conversion component 30. The completed component is selectively thinned until the light conversion component 30 of the designed height is exposed, so that the adjacent area 40a forms an arc surface that is recessed towards the ceramic substrate circuit board or an arc surface that protrudes away from the ceramic substrate 10.

[0096] Example 4

[0097] An LED device.

[0098] 1. The structure of the LED device.

[0099] The LED device includes a substrate 10 and an encapsulated light-emitting component mounted on one side of the substrate 10. The encapsulated light-emitting component includes: a plurality of light-emitting elements 20, a cover element 40, and a plurality of light-converting elements 30. The light-converting elements 30 and the light-emitting elements 20 correspond one-to-one, and the light-emitting elements 20 are connected in series.

[0100] Light-emitting component 20 and light-converting component 30 are sequentially stacked and mounted on one side of substrate 10. Light-converting component 30 has one light-incident surface, one light-emitting surface 301, and four side surfaces 302, each side surface 302 having an auxiliary light-emitting surface 302a. Light-emitting component 20 is located on the light-incident surface side of light-converting component 30. Covering component 40 covers light-emitting component 20 and part of light-converting component 30, exposing light-emitting surface 301 and auxiliary light-emitting surface 302a. The area of ​​auxiliary light-emitting surface 302a occupies 5%-95% of the area of ​​side surface 302. Understandably, technicians can adjust the area of ​​auxiliary light-emitting surface 302a to occupy 10%-75% of the area of ​​side surface 302 according to the light emission angle requirements of different products. The area where covering component 40 connects to auxiliary light-emitting surface 302a is called adjacent area 40a, and the surface of adjacent area 40a is curved.

[0101] The substrate 10 includes a substrate layer 101 and a plurality of connecting components. The connecting components penetrate the substrate layer 101, with one end connected to the packaged light-emitting component and the other end exposed from the substrate layer 101 for connecting the circuit board.

[0102] In this embodiment, the arc surface is concave towards the substrate 10. There are at least two light-emitting components 20 and two light-converting components 30, and the light-emitting components 20 are connected in series. The connecting component consists of an inner connector 102a, an outer connector 102b, and an intermediate connector 103. The inner connector 102a is located on one side of the substrate layer 101 and is used to connect to the encapsulated light-emitting component. The outer connector 102b is located on the other side of the substrate layer 101 and is used to connect to the circuit board. The inner connector 102a is connected to the outer connector 102b via the intermediate connector 103. When the light-emitting components 20 are connected in series, in this embodiment, the substrate 10 further includes a series connector 105 and a heat sink 104. The series connector 105 and the inner connector 102a are located on the same side of the substrate layer 101. The series connector 105 is used to connect several light-emitting components 20 end to end. Electrical gaps are maintained between the inner connectors 102a and between the inner connectors 102a and the series connector 105. Metal pads can be selected as the series connector 105. The heat sink 104 and the outer connector 102b are located on the same side of the substrate layer 101. Electrical gaps are maintained between the outer connectors 102b and between the outer connectors 102b and the heat sink 104. The heat sink 104 is not connected to any electrical components and only serves as a heat dissipation area to achieve electrothermal separation. Non-energized metal pads can be selected as the heat sink 104.

[0103] The structural schematic diagram of the LED device in this embodiment is shown below. Figure 7 As shown.

[0104] 2. The fabrication method of the LED device.

[0105] Compared to the preparation method in Example 3, the difference lies in that it includes at least two LED chips (i.e., light-emitting components 20), and the LED chips are connected in series. On the back side of the ceramic substrate circuit board (i.e., the side where the external metal electrode is located), there is a non-charged neutral electrode (i.e., heat sink 104), covering the ceramic surface of the blank area other than the external electrode metal region, and maintaining an electrical gap with the external electrode metal. Its function is for heat dissipation.

[0106] The optical conversion component 30 used in this embodiment can be any of the aforementioned implementations of the optical conversion component 30.

[0107] Example 5

[0108] An LED device.

[0109] 1. The structure of the LED device.

[0110] The LED device includes a substrate 10 and an encapsulated light-emitting component mounted on one side of the substrate 10. The encapsulated light-emitting component includes: a plurality of light-emitting elements 20, a covering element 40, and a plurality of light-converting elements 30. The light-converting elements 30 and the light-emitting elements 20 correspond one-to-one, and the light-emitting elements 20 are connected in parallel.

[0111] Light-emitting component 20 and light-converting component 30 are sequentially stacked and mounted on one side of substrate 10. Light-converting component 30 has one light-incident surface, one light-emitting surface 301, and four side surfaces 302, each side surface 302 having an auxiliary light-emitting surface 302a. Light-emitting component 20 is located on the light-incident surface side of light-converting component 30. Covering component 40 covers light-emitting component 20 and part of light-converting component 30, exposing light-emitting surface 301 and auxiliary light-emitting surface 302a. The area of ​​auxiliary light-emitting surface 302a occupies 5%-95% of the area of ​​side surface 302. Understandably, technicians can adjust the area of ​​auxiliary light-emitting surface 302a to occupy 10%-75% of the area of ​​side surface 302 according to the light emission angle requirements of different products. The area where covering component 40 connects to auxiliary light-emitting surface 302a is called adjacent area 40a, and the surface of adjacent area 40a is curved.

[0112] The substrate 10 includes a substrate layer 101 and a plurality of connecting components. The connecting components penetrate the substrate layer 101, with one end connected to the packaged light-emitting component and the other end exposed from the substrate layer 101 for connecting the circuit board.

[0113] In this embodiment, the arc surface is concave towards the substrate 10. There are two light-emitting components 20 and two light-converting components 30, and the light-emitting components 20 are connected in parallel. The connecting component consists of an inner connector 102a, an outer connector, and an intermediate connector 103. The inner connector 102a is located on one side of the substrate layer 101 and is used to connect with the packaged light-emitting component. The outer connector is located on the other side of the substrate layer 101 and is used to connect with the circuit board. Each light-emitting component 20 has a pair of corresponding inner connectors 102a and a pair of corresponding outer connectors 102b and 106. The inner connectors 102a are connected to the outer connectors 102b and 106 one-to-one through the intermediate connectors 103. An electrical gap is maintained between the inner connectors 102a and between the outer connectors. In this embodiment, there are four connecting components. Each light-emitting component 20 corresponds to two inner connectors 102a and two outer connectors 102b and 106. The light-emitting component 20 is connected to the substrate 10 through the inner connectors 102a. The substrate 10 is connected to the circuit board through the outer connectors 102b and 106. The outer connectors 102b and 106 form external metal electrodes that supply power to each LED chip.

[0114] The structural schematic diagram of the LED device in this embodiment is shown below. Figure 8 As shown.

[0115] 2. The fabrication method of the LED device.

[0116] Compared with the preparation method of Example 3, the difference is that it includes at least two LED chips (i.e., light-emitting components 20), and the LED chips are electrically connected in parallel. Each LED has a pair of corresponding independent external metal electrodes (i.e., a pair of external connectors 102b), and all the external metal electrodes basically cover the back side of the ceramic substrate 10, while maintaining the necessary electrical clearance. There is no electrically neutral heat dissipation electrode.

[0117] The optical conversion component 30 used in this embodiment can be any of the aforementioned implementations of the optical conversion component 30.

[0118] Example 6

[0119] Based on the above embodiments 1-5, the light conversion component 30 is further studied.

[0120] 1. Implementation method 1 for optical conversion component 30.

[0121] To obtain a relatively larger emission angle, this embodiment also discloses a glass matrix material sheet. The glass matrix material sheet is a low-melting-point glass substrate thin sheet constituting the light conversion component 30.

[0122] In this embodiment, the low-melting-point glass belongs to a high-P2O5-low-B2O3 system: P2O5 and Na2CO3 are used as the basic network formants, a small amount of B2O3 is added to improve light transmittance, CaO and alkali metal oxides are used as modifiers to synergistically reduce viscosity and ensure a low melting point (approximately 450°C), and a small amount of ZnO is added to adjust the flexibility of the mixture. The alkali metal oxide, one of the constituent materials of the low-melting-point glass, can be one of K2O, Na2O, or Li2O.

[0123] Specifically, the mass percentage of P2O5 is 30-40%;

[0124] The mass percentage of Na2CO3 is 21-25%;

[0125] The mass percentage of B2O3 is 1-4%;

[0126] The mass percentage of ZnO is 1-4%;

[0127] The mass percentage of CaO is 20-25%;

[0128] The remainder consists of alkali metal oxides.

[0129] The high-phosphate formulation provides a higher refractive index, thus enabling a larger light distribution angle. The performance parameters of the prepared light conversion component 30 are shown below:

[0130] Table 1 Performance parameters of the light conversion component 30 in the high P2O5-low B2O3 system

[0131]

[0132] High refractive index materials can allow light rays that deviate from the normal of the light-emitting surface to exit at a relatively larger exit angle (from the light conversion component 30 to the outside air). Therefore, the low melting point glass substrate obtained by the above formula can effectively reduce the proportion of light intensity in the center and increase the proportion of light intensity in the surrounding spatial angle, making it suitable for application scenarios that require a large light emission angle.

[0133] To further optimize the effect, an antireflective coating material can be added to the light-emitting surface 301 of the substrate to improve its transmittance. The antireflective coating material can be prepared by vapor deposition, and the material can be an alumina or titanium dioxide optical layer.

[0134] In addition, the aforementioned low-melting-point glass formulation has a lower initial melting temperature and avoids interference from Ti / Al ions, resulting in a lower risk of thermal quenching of the fluorescent conversion material and more stable light conversion efficiency.

[0135] In this embodiment, the low-melting-point glass is also mixed with an appropriate proportion (proportion > 0%) of fluorescent conversion material, which can be common substances such as yttrium aluminum garnet system and nitride system.

[0136] 2. Implementation method 2 for optical conversion component 30.

[0137] Similar to the above-described method 1 for implementing the light conversion component 30, the light conversion component 30 is a low-melting-point glass substrate sheet doped with a fluorescent conversion material. The difference lies in that, to effectively improve light extraction efficiency, this embodiment discloses another low-melting-point glass matrix material sheet.

[0138] In this embodiment, the low-melting-point glass belongs to a high B2O3, P2O5-free, MgO-free stabilizer system: B2O3 is used as the basic network forging body, and MgO is added as a stabilizer to avoid the disadvantage of easy phase separation in high borosilicate glass. Simultaneously, an appropriate amount of alkali metal oxide, such as Li2O, is added to inhibit crystallization and adjust the coefficient of thermal expansion (expected to be ≤5.0×10⁻⁶). -6 / K, superior to existing technologies). A small amount of ZnO is added to adjust flexibility. Furthermore, the use of heavy metal strontium ions is avoided, resulting in stronger rare-earth doping adaptability, especially suitable for high-concentration Eu doping. 3+ / Ce 3+ Phosphor system. This scheme uses borate glass to obtain low-melting-point (approximately 480°C) glass-based thin films.

[0139] Specifically, the mass percentage of B2O3 is 81-90%; the mass percentage of MgO is 1-5%; the mass percentage of ZnO is 1-4%; and the remainder is alkali metal oxides. These alkali metal oxides can also be one or more combinations of K2O, Na2O, and Li2O.

[0140] As is well known, the refractive index matching of each component must be considered in the LED packaging structure.

[0141] The refractive index of the LED light-emitting element 20 is typically approximately 1.7–2.2 (taking a gallium nitride epitaxial chip with a sapphire substrate as an example). A thin adhesive layer, made of silicone / epoxy resin, is present between the light-emitting element 20 and the light conversion element 30, with a refractive index typically between 1.41 and 1.55. To achieve better light extraction, the theoretically optimal refractive index of the light conversion element 30 connected by the adhesive layer needs to be greater than 1.55 to prevent total internal reflection. However, along the light propagation direction, the next stage medium after the light conversion element 30 is air. The refractive index of air is approximately 1. If the refractive index of the light conversion element 30 is greater than 1.55, it will lead to a large amount of total internal reflection of light from the light conversion element 30 to the air, resulting in significant light loss. The performance parameters of the light conversion element 30 prepared using a high B2O3, P2O5-free, MgO stabilizer-free system are shown below:

[0142] Table 2 Performance parameters of the light conversion component 30 prepared by the high B2O3, P2O5-free, and MgO stabilizer system.

[0143]

[0144] Therefore, the refractive index of the light conversion component 30, which is in contact with the adhesive layer, should be selected at a compromise between 1 and 1.55. Starting from the LED light-emitting component 20, along the light propagation direction, and reaching the outside of the LED (air), the refractive index of each component gradually decreases, avoiding large changes. This avoids excessive total internal reflection at any interface, thus achieving the best overall light extraction effect.

[0145] The above-mentioned low-melting-point glass formulation can achieve a refractive index level between 1 and 1.55. Actual testing shows that it is around the typical value of 1.47, thus achieving the purpose of mitigating excessive changes in refractive index.

[0146] The low-melting-point glass in this example is suitable for applications requiring a narrower emission angle and a higher central light intensity ratio, and also has relatively better light extraction efficiency.

[0147] The above-mentioned low-melting-point glass formulation does not contain heavy metal ions and has stronger adaptability to rare earth doping, making it particularly suitable for high-concentration Eu glass. 3 + / Ce3+ Fluorescent system.

[0148] Similarly, the low-melting-point glass is mixed with an appropriate proportion (proportion > 0%) of fluorescent conversion material, preferably a mixed material containing Eu. 3+ / Ce 3+ Phosphor system materials for activators.

[0149] 3. Implementation method 3 for optical conversion component 30.

[0150] To effectively improve light extraction efficiency, this embodiment proposes a third type of low-melting-point glass matrix material sheet. Similar to the previous two implementations of the light conversion component 30, the light conversion component 30 in this embodiment is a low-melting-point glass substrate sheet doped with a fluorescent conversion material.

[0151] The difference lies in the fact that this low-melting-point glass belongs to a high-ZnO, high-alkali metal system. Using ZnO as the base network forging material gives the glass substrate good flexibility, making it suitable for use under complex mechanical conditions. It is supplemented with dual alkali metals Na₂O and K₂O to reduce crystallization, with a total alkali content of 30-40%. An appropriate amount of B₂O₃ is added to adjust light transmittance and temperature resistance, and trace amounts of P₂O₅ are added to adjust mechanical properties. High-cost additives such as Al₂O₃ / TiO₂ are unnecessary.

[0152] Specifically, the mass percentage of ZnO is 66-75%; the mass percentage of Na2O is 21-25%; the mass percentage of K2O is 9-15%; the mass percentage of B2O3 is 3%-5%; and the balance is P2O5.

[0153] The dual-alkali metal scheme typically exhibits a moderate full width at half maximum (FWHM), meeting the requirements of a conventional 120° emission angle Lambertian light distribution. Furthermore, it offers superior transmittance.

[0154] Table 3 Performance parameters of the light conversion component 30 prepared by the high ZnO and high alkali metal system

[0155]

[0156] The principle of its light extraction efficiency is similar to that of the above scheme, and will not be repeated here.

[0157] Similarly, the low-melting-point glass is mixed with an appropriate proportion (proportion > 0%) of fluorescent conversion material, the type of which is not strictly limited in this invention.

[0158] The aforementioned low-melting-point glass has good flexibility, and its economic efficiency is not significantly affected.

[0159] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0160] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An LED device, characterized in that, It includes a substrate and a packaged light-emitting component, wherein the packaged light-emitting component is mounted on the substrate; The encapsulated light-emitting component includes: a light-emitting component, a covering component, and a light conversion component. The light conversion component includes a light-incident surface, a light-emitting surface, and a side surface. The side surface includes an auxiliary light-emitting surface. The light-emitting component is located on the side of the light-incident surface of the light conversion component. The covering component wraps around the light-emitting component and part of the light conversion component, exposing the light-emitting surface and the auxiliary light-emitting surface of the light conversion component. The covering component is connected to the auxiliary light-emitting surface through an adjacent area, which is an arc surface.

2. The LED device according to claim 1, characterized in that, The area of ​​the auxiliary light-emitting surface accounts for 5%-95% of the area of ​​the side surface.

3. The LED device according to claim 1, characterized in that, The arc surface can be a protruding arc surface or a concave arc surface.

4. The LED device according to claim 1, characterized in that, The number of the light-emitting component and the light-converting component is at least one.

5. The LED device according to claim 4, characterized in that, The substrate includes a substrate layer and a connecting component. The connecting component penetrates the substrate layer, one end of the connecting component is connected to the encapsulated light-emitting component, and the other end of the connecting component is exposed in the substrate layer.

6. The LED device according to claim 5, characterized in that, The connecting component includes: an inner connector, an outer connector, and an intermediate connector. The inner connector is disposed on one side of the substrate layer and is connected to the encapsulated light-emitting component. The outer connector is disposed on the other side of the substrate layer, and the inner connector is connected to the outer connector through the intermediate connector.

7. The LED device according to any one of claims 1-6, characterized in that, The raw materials for preparing the light conversion component include low-melting-point glass; the low-melting-point glass includes a basic network forging body, an alkali metal oxide, and additives, wherein the additives include at least one of light transmittance modifiers, flexibility modifiers, modifiers, stabilizers, and mechanical property modifiers; The basic network form includes at least one of P2O5, Na2CO3, B2O3, and ZnO.

8. The LED device according to claim 7, characterized in that, When the basic network forming body includes P2O5 and Na2CO3, the low-melting-point glass comprises the following raw materials in the indicated mass percentages: The light transmittance modifier includes B2O3, the flexibility modifier includes ZnO, and the modifier includes CaO.

9. The LED device according to claim 7, characterized in that, The basic network forming body comprises B2O3, and the low-melting-point glass comprises the following raw materials in weight percentages: The stabilizer includes MgO, and the flexibility modifier includes ZnO.

10. The LED device according to claim 7, characterized in that, The basic network forming body comprises ZnO, and the low-melting-point glass comprises the following raw materials in weight percentages: The alkali metal oxides include Na2O and K2O, wherein Na2O accounts for 21%-25% of the mass percentage of the raw materials of the low melting point glass, and K2O accounts for 9%-15% of the mass percentage of the raw materials of the low melting point glass. The light transmittance modifier includes B2O3, and the mechanical property modifier includes P2O5.

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