Manufacturing method of mold type LED packaging support and LED lamp bead

Abstract

The invention discloses a manufacturing method of a mold type LED packaging support and an LED lamp bead. The manufacturing method comprises the following steps that S1, a mold is machined and prepared according to the size and shape of the bowl cup, a plurality of supporting rods are arranged on the peripheral face of the mold in an extending mode, and the surface of the mold is subjected to deburring and cleaning treatment; s2, a mold is placed in the bowl cup, the mold abuts against the isolation belt, the free ends of the multiple supporting rods abut against the inner circumferential face of the bowl cup, and a gap with the preset thickness is formed between the bottom of the mold and the metal substrate; s3, the gap is filled with liquid glue through dispensing equipment, the filling amount and the filling speed of the liquid glue are controlled, and the liquid glue is prevented from overflowing out of the gap; and S4, the packaging support filled with the liquid glue is placed in a curing oven, curing treatment is carried out according to preset temperature and time parameters, the liquid glue forms a box dam, and the mold type LED packaging support is obtained. The problem that in the prior art, white glue covers chip electrodes, welding spots and light-emitting surfaces due to mobility is solved.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, and in particular to a method for manufacturing a mold-type LED packaging bracket and an LED chip. Background Technology

[0002] In the field of LED packaging, SMD (Surface Mount Device) and COB (Chip-on-Board) are the mainstream packaging forms. One of their core processes is to form a reflective layer by spraying white glue. The white glue can reflect the light emitted by the LED chip in the non-light-emitting direction to the front light-emitting area, which significantly improves the light emission efficiency of the LED chip. At the same time, it plays a certain role in physical protection of the chip. Therefore, the coating quality of the white glue directly determines the optical performance and product yield of the LED chip.

[0003] However, when using existing inkjet printing equipment to spray white glue, the glue itself has a certain degree of fluidity, and the bracket cup lacks a physical barrier structure for the glue. This causes the sprayed glue to easily flow down the inner wall of the cup or spread from the bottom plane towards the center area. Since the chip is usually fixed at the bottom of the cup, its electrodes, light-emitting surface, and solder points are all exposed. The flowing glue can easily cover these critical areas, leading to a series of defects. Firstly, when white glue covers the chip electrodes or solder joints, it can interrupt the conductive path between the chip and the external circuit, causing the LED to "die" or have poor contact. Secondly, when white glue is attached to the light-emitting surface of the chip, it will block the chip's original light. At the same time, due to the light absorption characteristics of white glue, the luminous efficiency of the LED beads will be significantly reduced, and the designed luminous flux cannot be achieved. To address these issues, existing production technologies require additional steps such as white glue drip detection and localized wiping and cleaning. This not only extends the production cycle and increases labor costs but may also cause secondary damage such as scratches on the chip surface and electrode damage during the wiping process, further reducing product yield.

[0004] In summary, the lack of an effective physical barrier structure in the existing LED packaging process has long led to the technical problem of white glue contaminating the chip, directly resulting in reduced LED yield and insufficient performance stability. Therefore, the industry urgently needs a method that can form a physical barrier in the white glue spraying process to effectively prevent white glue from flowing and contaminating the chip. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention provides a method for manufacturing a mold-type LED packaging bracket and LED beads, which can effectively solve the problems existing in the prior art.

[0006] The technical solution of this invention is: According to one aspect of the present invention, the packaging bracket includes a plastic bracket and a metal substrate, the plastic bracket covering the metal substrate and forming a cup with a substrate area and a separating band at the bottom, the manufacturing method comprising the following steps: S1. According to the size and shape of the bowl and cup, a mold is processed and prepared. Several support rods are extended on the outer periphery of the mold to deburr and clean the mold surface. S2, place the mold inside the bowl, so that the mold abuts against the isolation strip, and the free ends of several support rods abut against the inner circumference of the bowl, forming a gap of a preset thickness between the bottom of the mold and the metal substrate; S3, using a dispensing device to fill the gap with liquid adhesive, controlling the amount and speed of liquid adhesive filling to prevent liquid adhesive from overflowing the gap; S4. The encapsulation bracket filled with liquid adhesive is placed in a curing oven and cured according to preset temperature and time parameters to form a dam. This dam is used to prevent the white adhesive on the side wall of the cup from flowing into the chip installed inside the cup, thus obtaining the mold-type LED encapsulation bracket.

[0007] Further, in step S1, the mold is made of metal and is a U-shaped frame. It is manufactured by stamping process, specifically including: selecting copper alloy or aluminum alloy sheet with a thickness of 0.1~0.3mm as raw material, first pre-processing the hollow groove matching the support rod on the sheet using laser cutting process, then using CNC stamping equipment with an accuracy of ±0.005mm to stamp and form according to the U-shaped frame structure of the mold and the size of the support rod 31, after stamping, using ultrasonic cleaning equipment to remove stamping debris from the mold surface, and finally polishing the mold edge and the free end of the support rod using plasma polishing process to make the surface roughness Ra≤0.2μm.

[0008] Further, in step S1, the mold is made of glass and is prepared by compression molding process, specifically including: selecting high borosilicate glass as raw material, heating the glass raw material to a softened state of 850~900℃, pouring it into a graphite mold with a preset mold and support rod shape, coating the inner surface of the mold with a boron nitride release agent with a thickness of 5~8μm, using a molding pressure of 15~20MPa to maintain for 10~15s, and demolding after the glass cools to room temperature to obtain a preliminary glass mold. Subsequently, the edges of the mold and support rod are finely ground with a diamond grinding wheel. After fine grinding, hydrofluoric acid solution is used for etching treatment, with the etching time controlled at 3~5min to remove the fine grinding residue and make the light transmittance of the glass mold ≥92%.

[0009] Further, in step S1, the mold is made of plastic and is prepared by injection molding process, specifically including: selecting polycarbonate or polyphenylene sulfide as plastic raw material, drying the plastic raw material to a moisture content ≤0.05%, pouring it into the injection molding machine barrel, controlling the barrel temperature at 260~280℃, setting the injection mold temperature at 80~100℃, using an injection pressure of 60~80MPa to inject the molten plastic into the mold cavity of the preset mold and support rod shape, holding pressure for 15~20s, cooling time for 25~30s, opening the mold and removing the part to obtain the plastic mold, after removing the part, using a hot air gun to trim the mold gate, after trimming, using ultraviolet irradiation equipment to sterilize the mold surface for 5~8min.

[0010] Furthermore, the inner circumferential surface of the bowl / cup is pre-set with a first positioning groove, and the isolation strip is pre-set with a second positioning groove; in step S2, when placing the mold, the support rod is embedded in the first positioning groove, and the edge of the mold is embedded in the second positioning groove.

[0011] Further, in step S3, the diameter of the dispensing needle of the dispensing equipment is 0.2~0.3mm. Before dispensing, the dispensing needle is adjusted to be perpendicular to the upper surface of the mold, and the distance between the bottom of the dispensing needle and the upper surface of the mold is controlled at 0.1~0.2mm. The dispensing pressure is set to 0.1~0.15MPa, the dispensing speed is controlled at 5~8mm / s, and the dispensing path moves in a circular and uniform manner along the gap formed between the bottom of the mold and the metal substrate. During the dispensing process, the amount of glue dispensed by the dispensing needle is monitored in real time to ensure that the amount of glue dispensed per millimeter of path is stable at 0.05~ 0.08mg; The liquid adhesive is an anti-vulcanizing adhesive. When filling, it starts from any end of the gap and ends at the adjacent position of the starting end to form a closed loop filling. After the liquid adhesive is filled, a CCD vision inspection device is used to inspect the anti-vulcanizing adhesive in the gap from the top of the cup and from a 45° tilt direction to identify whether there is insufficient adhesive, overflow, air bubbles, and the degree of adhesion to the gap wall. Unqualified products with insufficient anti-vulcanizing adhesive filling, overflowing into the gap and covering the mold or metal substrate, internal air bubble diameter ≥0.03mm, and adhesion degree less than 95% are rejected.

[0012] Furthermore, in step S4, the curing process adopts a segmented curing method. The curing temperature of the first segment is 60~70℃ and the curing time is 30~40min; the curing temperature of the second segment is 120~130℃ and the curing time is 60~80min.

[0013] Furthermore, in step S4, after the dam has been solidified, the mold can be retained or removed depending on the usage requirements.

[0014] Furthermore, the manufacturing method further includes, before step S1: using an injection molding process, coating plastic raw material onto the treated metal substrate to form a plastic support with a bowl, wherein a substrate area and an isolation strip protruding from the substrate area are formed at the bottom of the bowl.

[0015] According to another aspect of the present invention, an LED bead includes a fluorescent layer, a molded LED packaging bracket manufactured using any of the manufacturing methods described above, and a reflective layer. White glue is applied between the dam and the inner circumferential surface of the bowl, and the white glue forms a reflective layer after curing. The surface of the reflective layer is a sloping surface. A chip is assembled inside the dam, and fluorescent glue is filled inside the bowl, and the fluorescent glue forms a fluorescent layer after curing.

[0016] By adopting the above technical solution, the beneficial effects of the present invention compared with the prior art are as follows: Firstly, the manufacturing method of this invention fundamentally solves the problem in the prior art where white glue covers the chip electrodes, solder joints, and light-emitting surface due to its fluidity by precisely positioning the mold inside the bowl and filling the gap between the bottom of the mold and the metal substrate with liquid glue to form a dam. This effectively avoids defects such as "dead lamps," poor contact, and luminous efficiency attenuation. As a result, subsequent white glue drip detection and manual wiping processes can be eliminated, significantly shortening the production cycle, reducing labor costs, and avoiding secondary damage to the chip during the wiping process, thus greatly improving product yield. At the same time, with the help of mold positioning and precise glue dispensing control, the size and position of the dam are highly consistent, ensuring the stability and reliability of the product's optical performance. Moreover, the dam manufacturing process is standardized, making it easy to integrate with existing production lines and facilitating automated and large-scale production.

[0017] Secondly, the stamping process using metal molds, combined with laser pre-cutting and high-precision CNC stamping, allows for precise control of the mold and support rod dimensions, preventing uneven force distribution when the support rods deviate from their length and abut against the inner circumference of the cup. Ultrasonic cleaning and plasma polishing remove residual impurities and burrs from the stamping process, preventing scratches on the inner circumference of the cup or the isolation zone during mold installation. Furthermore, the high structural strength of the metal mold maintains a stable shape during liquid adhesive filling and curing, preventing mold deformation that could lead to uneven gap thickness and ensuring the quality of the dam formation. The heat dissipation properties of the metal material also aid in subsequent chip cooling, extending the lifespan of the LED beads.

[0018] Thirdly, the molding process of glass molds, through the high softening temperature of high borosilicate glass and the high temperature resistance of graphite molds, enables one-time molding of the mold, avoiding the glass breakage problem caused by traditional cutting processes; the use of boron nitride release agent ensures smooth demolding of the glass mold and prevents mold adhesion from affecting structural integrity; the combination of fine grinding and hydrofluoric acid etching can improve the surface flatness and light transmittance of the glass mold, avoid light scattering caused by surface defects when the LED beads emit light, ensure the luminous efficiency of the beads, and the chemical stability of the glass material can prevent corrosion by sulfides during subsequent use, improving the packaging bracket's resistance to harsh environments.

[0019] Fourth, the injection molding process of plastic molds, through raw material drying treatment, can avoid the generation of air bubbles during injection molding, ensuring the structural density of the mold and support rod, and preventing the subsequent liquid glue from seeping into the mold and affecting the bonding strength; precise control of the barrel and mold temperature can avoid shrinkage marks or warping of the plastic mold, ensuring that the mold size is compatible with the cup, and ensuring that the support rod can stably abut against the inner circumference of the cup; gate trimming and ultraviolet sterilization treatment can remove residual structures from injection molding, preventing the trimmed gate protrusion from affecting the fit between the mold and the isolation strip. At the same time, sterilization treatment can prevent the growth of microorganisms on the surface of the plastic mold, preventing the introduction of contaminants during subsequent LED bead encapsulation. Moreover, the low cost and lightweight characteristics of plastic materials can reduce the overall production cost of the encapsulation bracket, making it suitable for large-scale mass production.

[0020] Fifth, the dual positioning of the first and second positioning grooves can further limit the displacement of the mold in the cup, prevent the mold from shifting during the subsequent filling of liquid glue, ensure that the gap thickness remains consistent, and thus ensure the accurate filling amount of liquid glue, preventing uneven thickness of the dam due to mold shift.

[0021] Sixth, by vertically positioning the dispensing needle and setting a fixed spacing between them, the dispensing offset caused by needle tilting can be avoided, ensuring precise injection of the anti-sulfurization adhesive into the gaps. The circular, uniform dispensing path and stable dispensing volume control ensure that the anti-sulfurization adhesive is evenly distributed within the gaps, preventing localized adhesive shortages from affecting the barrier effect or localized adhesive overflow from contaminating the mold and metal substrate. The closed-loop filling of the anti-sulfurization adhesive can form a complete annular pre-dam structure, laying the foundation for subsequent curing to form a continuous, uninterrupted dam. Dual-view CCD visual inspection can comprehensively screen for anti-sulfurization adhesive filling defects, especially for blind spots in the gaps and the mold and metal substrate, effectively identifying poor adhesion problems and preventing sulfide infiltration during subsequent use due to insufficient adhesion of the anti-sulfurization adhesive. At the same time, the selection of anti-sulfurization adhesive allows the cured dam to have both white glue barrier and anti-sulfurization functions, preventing the metal substrate and chip electrodes from being corroded by sulfidation, further improving the service life and performance stability of the packaging bracket.

[0022] Seventh, the segmented curing method can avoid the formation of air bubbles or shrinkage deformation inside the liquid adhesive due to rapid heating. The first stage of low-temperature curing allows the liquid adhesive to slowly set, while the second stage of high-temperature curing ensures that the liquid adhesive is fully cured, improving the structural strength and stability of the dam and preventing problems such as cracking and falling off during subsequent use, thus ensuring the long-term barrier effect of the dam.

[0023] Eighth, the mold can be flexibly retained or removed after the cofferdam has solidified, which can meet the needs of different packaging scenarios. When removing the mold, a low-temperature heating-assisted removal method is used, which can not only avoid high temperature damage to the cofferdam and other structures of the packaging bracket, but also remove the mold by weakening the adhesive force, which facilitates the recycling and reuse of the mold, reduces production costs, and ensures the structural integrity of the cofferdam after the mold is removed. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a three-dimensional structural diagram of the packaging bracket in this invention; Figure 2 This is a schematic diagram of the structure of the encapsulation bracket without mold in this invention; Figure 3 This is a schematic diagram of the planar structure of the packaging bracket in this invention; Figure 4 This is a schematic cross-sectional view of the packaging bracket in this invention; Figure 5 This is a schematic diagram of the planar structure forming a dam within the encapsulation bracket in this invention; Figure 6 This is a schematic cross-sectional view of the dam formed inside the encapsulation bracket in this invention. Figure 7 This is a schematic diagram of the planar structure of the encapsulation bracket with a reflective layer in this invention; Figure 8 This is a cross-sectional view of the reflective layer disposed within the encapsulation bracket in this invention. Figure 9 This is a schematic diagram of the planar structure of the LED lamp bead in this invention; Figure 10 This is a schematic cross-sectional view of the LED lamp bead in this invention; In the diagram: packaging bracket-100, plastic bracket-1, bowl-cup-102, substrate area-20, gap-10, first positioning groove-11, isolation strip-12, second positioning groove-120, metal substrate-2, spacer-21, mold-3, support rod-31, dam-4, reflective layer-5, fluorescent layer-6, LED lamp bead-200. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the invention. Similarly, the following embodiments are only some, not all, embodiments of the present invention, and all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] like Figures 1 to 10 As shown, this solution provides a method for manufacturing a mold-type LED packaging bracket and LED beads.

[0028] Please see Figures 1 to 8 A mold-type LED packaging bracket includes a plastic bracket 1 and a metal substrate 2. The plastic bracket 1 covers the metal substrate 2 and forms a cup 102 with a substrate area 20 and an isolation strip 12 at the bottom. The isolation strip 12 extends toward the metal substrate 2 and is provided with a spacer 21, which divides the metal substrate 2 into positive and negative electrode areas. The plastic bracket 1, the isolation strip 12, and the spacer 21 are integrally formed. Preferably, the isolation strip 12 protrudes from the substrate area 20. When the mold 3 abuts against the isolation strip 12, a gap 10 is formed between the bottom of the mold 3 and the exposed metal substrate 2 inside the cup 102. The isolation strip 12 is provided with at least one second positioning groove 120, and the mold 3 is positioned in the second positioning groove 120. The second positioning groove 120 on the isolation strip 12 can position the mold 3 to ensure that the mold 3 is installed in an accurate position and to prevent the mold 3 from shifting inside the cup 102. This ensures that the dam 4 can accurately surround the chip area. At the same time, the second positioning groove 120 can restrict the movement of the mold 3. Together with the support rod 31 and the contact between the support rod 31 and the inner circumference of the cup 102, a double positioning and fixing is formed, which further improves the installation stability of the mold 3. Especially during the liquid glue filling and curing process, it can prevent the mold 3 from shifting and causing the dam 4 to deviate in the forming position.

[0029] Please see Figures 1 to 8It also includes mold 3, which is made of metal, glass, or plastic. Different material properties can meet different packaging requirements: metal molds have good heat dissipation performance, which can help dissipate heat from the chip and are suitable for high-power LED packaging scenarios; glass molds have good light transmittance, and if mold 3 is kept inside the cup 102, it will not block the light output of the LED beads, making it suitable for scenarios with high light output efficiency requirements; plastic molds are low in cost, lightweight, and easy to process, which can reduce the overall production cost of the packaging bracket 100 and are suitable for mass production of ordinary LED packaging scenarios, thus enriching the product's applicability and cost options.

[0030] In this embodiment, the mold 3 is a U-shaped frame. In other embodiments, the mold 3 can also be circular, polygonal, or other shapes, and the shape of the mold 3 can be adjusted according to actual needs. Setting the mold 3 as a U-shaped frame can form an annular barrier area inside the bowl 102. In conjunction with the dam 4, it can surround the chip in all directions, forming complete protection around the chip. The mold 3 is set inside the bowl 102, and a gap 10 is formed between the bottom of the mold 3 and the exposed metal substrate 2 inside the bowl 102. This gap 10 is filled with liquid adhesive, preferably anti-sulfur adhesive. The use of anti-sulfur adhesive as the liquid adhesive, after curing, not only blocks the flow of white adhesive but also effectively isolates sulfides (such as hydrogen sulfide and sulfur dioxide) in the external environment from entering the bowl, preventing the metal substrate 2, chip electrodes, and other metal components from being corroded by sulfidation. This avoids problems such as decreased electrode conductivity, LED performance degradation, or failure caused by sulfidation, significantly improving the anti-sulfidation ability and service life of the LED packaging bracket 100 and subsequent LEDs, especially suitable for harsh operating environments such as humid and pollutant-rich environments.

[0031] After the liquid adhesive cures, it forms a dam 4, which prevents the white adhesive on the sidewall of the cup 102 from flowing into the chip (not shown) installed inside the cup 102. After the dam 4 is formed, the mold 3 can be retained inside the cup 102 or removed from the cup 102. The mold 3 can be flexibly retained or removed after the dam 4 is formed, providing diverse options for LED packaging processes. When the mold 3 is retained, its own material properties, such as the heat dissipation of metal and the light transmittance of glass, can be used to add additional functions to the packaging structure. For example, a metal mold can assist in chip heat dissipation and improve the heat dissipation performance of the LED bead. When the mold 3 is removed, the space occupied inside the packaging structure can be reduced, leaving more space for wiring or other components around the chip.

[0032] Please see Figures 1 to 8A plurality of support rods 31 are provided extending from the outer peripheral surface of the mold 3 toward the inner peripheral surface of the cup 102, and the free ends of the support rods 31 abut against the inner peripheral surface of the cup 102. Preferably, the inner peripheral surface of the cup 102 is provided with a first positioning groove 11, and the support rods 31 are placed in the first positioning groove 11. The first positioning groove 11 on the inner peripheral surface of the cup 102 can position the support rods 31, preventing the support rods 31 from sliding inside the cup 102, further enhancing the fixing effect of the mold 3 inside the cup 102, and preventing the mold 3 from shifting due to external vibration or subsequent process operations; at the same time, the first positioning groove 11 can ensure that the installation height of each support rod 31 is consistent, ensuring that the mold 3 is in a horizontal state, making the gap 10 between the bottom of the mold 3 and the metal substrate 2 uniform, thereby ensuring that the thickness of the dam 4 is uniform after the liquid glue is filled, and avoiding the dam 4 being too thin or too thick in some places due to uneven gap 10, which would affect the barrier effect or the encapsulation quality.

[0033] According to another aspect of the present invention, a method for manufacturing a mold-type LED packaging bracket includes the following steps: Example 1, S1, using injection molding, plastic raw material is coated onto the treated metal substrate 2 to form a plastic support 1 with a bowl 102. The bottom of the bowl 102 forms a substrate area 20 and an isolation strip 12 protruding from the substrate area 20. Specifically, in step S1, the mold 3 is made of metal and is a U-shaped frame. It is manufactured by stamping, specifically including: selecting copper alloy or aluminum alloy sheet with a thickness of 0.1~0.3mm as raw material, first pre-processing a hollow groove matching the support rod 31 on the sheet using laser cutting, then using CNC stamping equipment with an accuracy of ±0.005mm to stamp according to the U-shaped frame structure of the mold 3 and the size of the support rod 31, after stamping, using ultrasonic cleaning equipment to remove stamping debris from the surface of the mold 3, and finally using plasma polishing to polish the edges of the mold 3 and the free end of the support rod 31 to make the surface roughness Ra≤0.2μm.

[0034] The stamping process using a metal mold 3, combined with laser pre-cutting and high-precision CNC stamping, allows for precise control of the dimensions of the mold 3 and support rod 31. This avoids uneven force distribution when the support rod 31 abuts against the inner circumference of the cup 102 due to length deviation. Ultrasonic cleaning and plasma polishing remove residual impurities and burrs from the stamping process, preventing the mold 3 from scratching the inner circumference of the cup 102 or the isolation strip 12 during installation. Furthermore, the high structural strength of the metal mold 3 maintains a stable shape during liquid glue filling and curing, preventing deformation of the mold 3 and uneven thickness of the gap 10, ensuring the quality of the dam 4 formation. The heat dissipation properties of the metal material also aid in subsequent chip cooling, extending the lifespan of the LED beads.

[0035] S2. Based on the size and shape of the bowl / cup 102, a mold 3 is fabricated. Several support rods 31 extend from the outer periphery of the mold 3. The surface of the mold 3 is deburred and cleaned. Specifically, in step S2, when placing the mold 3, the support rods 31 are embedded in the first positioning groove 11, and the edge of the mold 3 is embedded in the second positioning groove 120. Through the dual positioning of the first positioning groove 11 and the second positioning groove 120, the displacement of the mold 3 within the bowl / cup 102 is further restricted, preventing the mold 3 from shifting during the subsequent filling of liquid adhesive. This ensures that the thickness of the gap 10 remains consistent, thereby guaranteeing accurate liquid adhesive filling and preventing uneven thickness of the dam 4 due to mold 3 shifting.

[0036] S3, place the mold 3 inside the bowl 102, so that the mold 3 abuts against the isolation strip 12, and the free ends of several support rods 31 abut against the inner circumferential surface of the bowl 102. A gap 10 of a preset thickness is formed between the bottom of the mold 3 and the metal substrate 2. Specifically, in step S3, the diameter of the dispensing needle of the dispensing device is 0.2~0.3mm. Before dispensing, the dispensing needle is adjusted to be perpendicular to the upper surface of the mold 3, and the distance between the bottom end of the dispensing needle and the upper surface of the mold 3 is controlled at 0.1~0.2mm. The dispensing pressure is set to 0.1~0.15MPa, the dispensing speed is controlled at 5~8mm / s, and the dispensing path moves in a circular and uniform manner along the gap 10 formed between the bottom of the mold 3 and the metal substrate 2. During the process, the amount of adhesive dispensed from the dispensing needle is monitored in real time to ensure that the amount of adhesive dispensed per millimeter of path is stable at 0.05~0.08mg. The liquid adhesive is anti-vulcanizing adhesive. When filling, it starts from any end of the gap 10 and ends at the adjacent position of the starting end to form a closed loop filling. After the liquid adhesive is filled, a CCD vision inspection device is used to perform dual-view inspection of the anti-vulcanizing adhesive in the gap 10 from directly above the cup 102 and at a 45° angle to identify whether there is insufficient adhesive, overflow, air bubbles, and the degree of adhesion to the wall of the gap 10. Unqualified products with insufficient anti-vulcanizing adhesive filling, overflow of gap 10 covering the mold 3 or metal substrate 2, internal air bubble diameter ≥0.03mm, and adhesion degree less than 95% are rejected.

[0037] By vertically positioning the dispensing needle and setting a fixed spacing between them, glue displacement caused by needle tilting can be avoided, ensuring accurate injection of anti-sulfurization glue into gap 10. The circular uniform speed dispensing path and stable glue volume control ensure uniform distribution of anti-sulfurization glue within gap 10, preventing local glue shortages from affecting the barrier effect of the dam 4 or local glue overflow from contaminating the mold 3 and metal substrate 2. The closed-loop filling of anti-sulfurization glue can form a complete annular pre-dam structure, laying the foundation for subsequent curing to form a continuous and uninterrupted dam 4. Dual-view CCD visual inspection can comprehensively check for anti-sulfurization glue filling defects, especially for the blind spots of the bonding between gap 10 and mold 3 and metal substrate 2, effectively identifying bonding problems and avoiding sulfide infiltration during subsequent use due to insufficient bonding of anti-sulfurization glue. At the same time, the selection of anti-sulfurization glue enables the cured dam 4 to have both white glue barrier and anti-sulfurization functions, preventing the metal substrate 2 and chip electrodes from being corroded by sulfidation, further improving the service life and performance stability of the packaging bracket.

[0038] S4. Liquid adhesive is filled into gap 10 using a dispensing device. The amount and speed of liquid adhesive filling are controlled to prevent overflow. Specifically, in step S4, the curing process adopts a segmented curing method. The first stage curing temperature is 60~70℃, and the curing time is 30~40 minutes. The second stage curing temperature is 120~130℃, and the curing time is 60~80 minutes. The segmented curing method can prevent the liquid adhesive from generating bubbles or shrinking and deforming due to rapid heating. The first stage of low-temperature curing allows the liquid adhesive to slowly set, and the second stage of high-temperature curing ensures that the liquid adhesive is fully cured, improving the structural strength and stability of the dam 4 and preventing cracking and detachment during subsequent use, thus ensuring the long-term barrier effect of the dam 4.

[0039] Furthermore, after the cofferdam 4 has cured, the mold 3 can be retained or removed depending on the usage requirements. The flexible choice of retaining or removing the mold 3 after the cofferdam 4 has cured can meet the needs of different packaging scenarios. When removing the mold 3, a low-temperature heating-assisted removal method is used, which can avoid high-temperature damage to the cofferdam 4 and other structures of the packaging bracket, and can also remove the mold 3 by weakening the adhesive force, which facilitates the recycling and reuse of the mold 3, reduces production costs, and ensures the structural integrity of the cofferdam 4 after the mold 3 is removed.

[0040] S5, the encapsulation bracket filled with liquid adhesive is placed in a curing oven and cured according to preset temperature and time parameters, so that the liquid adhesive forms a dam 4. The dam 4 is used to prevent the white adhesive on the side wall of the cup 102 from flowing into the chip installed in the cup 102, thus obtaining the mold-type LED encapsulation bracket.

[0041] Example 2, The difference between this embodiment and Embodiment 1 is that: In step S1, the mold 3 is made of glass and is prepared by compression molding process. Specifically, it includes: selecting high borosilicate glass as raw material, heating the glass raw material to a softened state of 850~900℃, pouring it into a graphite mold with a preset mold 3 and support rod 31 shape, coating the inner surface of the mold with a boron nitride release agent with a thickness of 5~8μm, using a molding pressure of 15~20MPa for 10~15s, and demolding after the glass cools to room temperature to obtain a pre-formed glass mold 3. Then, the edges of the mold 3 and support rod 31 are finely ground with a diamond grinding wheel. After fine grinding, hydrofluoric acid solution is used for etching treatment, with the etching time controlled at 3~5min to remove the fine grinding residue and make the light transmittance of the glass mold 3 ≥92%.

[0042] The molding process of the glass mold 3 utilizes the high softening temperature of high borosilicate glass and the high-temperature resistance of graphite molds to achieve one-time molding of the mold 3, avoiding the glass breakage problem caused by traditional cutting processes. The use of boron nitride release agent ensures smooth demolding of the glass mold 3 and prevents mold adhesion from affecting structural integrity. The combination of fine grinding and hydrofluoric acid etching can improve the surface flatness and light transmittance of the glass mold 3, avoid light scattering caused by surface defects when the LED beads emit light, ensure the luminous efficiency of the beads, and the chemical stability of the glass material can prevent corrosion by sulfides during subsequent use, improving the packaging bracket's resistance to harsh environments.

[0043] Example 3, The difference between this embodiment and Embodiment 1 is that: In step S1, mold 3 is made of plastic and is prepared by injection molding process. Specifically, it includes: selecting polycarbonate or polyphenylene sulfide as plastic raw material, drying the plastic raw material to a moisture content of ≤0.05%, pouring it into the barrel of the injection molding machine, controlling the barrel temperature at 260~280℃, setting the injection mold temperature at 80~100℃, using an injection pressure of 60~80MPa to inject the molten plastic into the mold cavity of the pre-set mold 3 and support rod 31 shape, holding pressure for 15~20s, cooling for 25~30s, opening the mold and removing the part to obtain plastic mold 3. After removing the part, the gate of mold 3 is trimmed with a hot air gun. After trimming, the surface of mold 3 is sterilized by ultraviolet irradiation equipment for 5~8min.

[0044] The injection molding process of the plastic mold 3 avoids air bubbles during injection by drying the raw materials, ensuring the structural density of the mold 3 and support rod 31 and preventing liquid glue from seeping into the mold 3 and affecting the bonding strength. Precise control of the barrel and mold temperature can prevent shrinkage or warping of the plastic mold 3, ensuring that the mold 3 size matches the cup 102 and that the support rod 31 can stably abut against the inner circumference of the cup 102. Gate trimming and ultraviolet sterilization can remove residual structures from the injection molding process, preventing the trimmed gate protrusion from affecting the fit between the mold 3 and the isolation strip 12. At the same time, sterilization can prevent the growth of microorganisms on the surface of the plastic mold 3, preventing the introduction of contaminants during the subsequent LED bead encapsulation. Furthermore, the low cost and lightweight characteristics of the plastic material can reduce the overall production cost of the encapsulation bracket, making it suitable for mass production.

[0045] According to another aspect of the present invention, an LED bead includes a fluorescent layer 6, a molded LED packaging bracket manufactured using any of the above-described manufacturing methods, and a reflective layer 5. White adhesive is applied between the dam 4 and the inner circumferential surface of the cup 102, and the white adhesive is cured to form the reflective layer 5, the surface of the reflective layer 5 being a sloping surface. A chip is assembled inside the dam 4, and fluorescent adhesive is filled inside the cup 102, and the fluorescent adhesive is cured to form the fluorescent layer 6.

[0046] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a mold-type LED packaging bracket, the packaging bracket comprising a plastic bracket (1) and a metal substrate (2), wherein the plastic bracket (1) covers the metal substrate (2) and forms a bowl (102) with a substrate area (20) and an isolation strip (12) at the bottom, characterized in that, The manufacturing method Includes the following steps: S1. According to the size and shape of the bowl (102), a mold (3) is prepared. Several support rods (31) are extended on the outer periphery of the mold (3) to deburr and clean the surface of the mold (3). S2, place the mold (3) inside the bowl (102) so that the mold (3) abuts against the isolation strip (12), and the free ends of several support rods (31) abut against the inner circumferential surface of the bowl (102). A gap (10) of preset thickness is formed between the bottom of the mold (3) and the metal substrate (2). S3, use a dispensing device to fill the gap (10) with liquid adhesive, control the amount and speed of liquid adhesive filling, and prevent liquid adhesive from overflowing the gap (10). S4, the encapsulation bracket filled with liquid glue is placed in a curing oven and cured according to the preset temperature and time parameters, so that the liquid glue forms a dam (4). The dam (4) is used to block the white glue on the side wall of the bowl (102) from flowing into the chip installed in the bowl (102), thus obtaining the mold-type LED encapsulation bracket.

2. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S1, the mold (3) is made of metal and is a U-shaped frame. It is prepared by stamping process, specifically including: selecting copper alloy or aluminum alloy plate with a thickness of 0.1~0.3mm as raw material, first pre-processing a hollow groove matching the support rod (31) on the plate by laser cutting process, then using CNC stamping equipment with an accuracy of ±0.005mm to stamp and form according to the U-shaped frame structure of the mold (3) and the size of the support rod (31), after stamping, using ultrasonic cleaning equipment to remove stamping debris from the surface of the mold (3), and finally polishing the edge of the mold (3) and the free end of the support rod (31) by plasma polishing process to make the surface roughness Ra≤0.2μm.

3. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S1, the mold (3) is made of glass and is prepared by molding process. Specifically, it includes: selecting high borosilicate glass as raw material, heating the glass raw material to a softened state of 850~900℃, pouring it into a graphite mold in the shape of a preset mold (3) and support rod (31), coating the inner surface of the mold with a boron nitride release agent with a thickness of 5~8μm, using a molding pressure of 15~20MPa to maintain for 10~15s, and demolding after the glass cools to room temperature to obtain a preliminary glass mold (3). Then, the edges of the mold (3) and support rod (31) are finely ground with a diamond grinding wheel. After fine grinding, hydrofluoric acid solution is used for etching treatment. The etching time is controlled at 3~5min to remove the fine grinding residue and make the light transmittance of the glass mold (3) ≥92%.

4. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S1, the mold (3) is made of plastic material and is prepared by injection molding process. Specifically, it includes: selecting polycarbonate or polyphenylene sulfide as plastic raw material, drying the plastic raw material to a moisture content of ≤0.05%, pouring it into the barrel of the injection molding machine, controlling the barrel temperature at 260~280℃, setting the injection mold temperature at 80~100℃, using an injection pressure of 60~80MPa to inject the molten plastic into the mold cavity of the preset mold (3) and support rod (31) shape, holding pressure for 15~20s, cooling time for 25~30s, opening the mold and taking out the part to obtain the plastic mold (3), after taking out the part, using a hot air gun to trim the gate of the mold (3), after trimming, using an ultraviolet irradiation device to sterilize the surface of the mold (3) for 5~8min.

5. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, The inner circumferential surface of the bowl (102) is provided with a first positioning groove (11), and the isolation strip (12) is provided with a second positioning groove (120); in step S2, when placing the mold (3), the support rod (31) is embedded in the first positioning groove (11), and the edge of the mold (3) is embedded in the second positioning groove (120).

6. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S3, the diameter of the dispensing needle of the dispensing equipment is 0.2~0.3mm. Before dispensing, the dispensing needle is adjusted to be perpendicular to the upper surface of the mold (3), and the distance between the bottom of the dispensing needle and the upper surface of the mold (3) is controlled at 0.1~0.2mm. The dispensing pressure is set to 0.1~0.15MPa, the dispensing speed is controlled at 5~8mm / s, and the dispensing path moves in a circular and uniform manner along the gap (10) formed between the bottom of the mold (3) and the metal substrate (2). During the dispensing process, the amount of glue dispensed by the dispensing needle is monitored in real time to ensure that the amount of glue dispensed per millimeter of path is stable at 0.05~0.08mg. The liquid adhesive is an anti-vulcanizing adhesive. When filling, it starts from any end of the gap (10) and ends at the adjacent position of the starting end to form a closed loop filling. After the liquid adhesive is filled, a CCD vision inspection device is used to inspect the anti-vulcanizing adhesive in the gap (10) from the top of the bowl (102) and at a 45° angle to identify whether the anti-vulcanizing adhesive is missing, overflowing, or has bubbles, as well as its adhesion to the wall of the gap (10). Products with insufficient anti-vulcanizing adhesive filling, overflowing from the gap (10) and covering the mold (3) or metal substrate (2), internal bubble diameter ≥0.03mm, and adhesion less than 95% are rejected.

7. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S4, the curing process adopts a segmented curing method. The curing temperature of the first segment is 60~70℃ and the curing time is 30~40min; the curing temperature of the second segment is 120~130℃ and the curing time is 60~80min.

8. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, In step S4, after the dam (4) has been cured, the mold (3) can be retained or removed depending on the usage requirements.

9. The method for manufacturing a mold-type LED packaging bracket as described in claim 1, characterized in that, The manufacturing method further includes, before step S1: using injection molding process, coating plastic raw material onto the treated metal substrate (2) to form a plastic support (1) with a bowl (102), wherein a substrate area (20) and an isolation strip (12) protruding from the substrate area (20) are formed at the bottom of the bowl (102).

10. An LED lamp bead, comprising a fluorescent layer (6), characterized in that, It also includes a mold-type LED packaging bracket manufactured using the manufacturing method described in any one of claims 1 to 9, and a reflective layer (5). White glue is applied between the inner circumferential surface of the dam (4) and the bowl (102). The white glue is cured to form a reflective layer (5). The surface of the reflective layer (5) is a sloping surface. A chip is assembled inside the dam (4). Fluorescent glue is filled inside the bowl (102). The fluorescent glue is cured to form a fluorescent layer (6).

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