Full-color quantum dot color conversion layer, preparation method thereof and display device

Abstract

The invention relates to a full-color quantum dot conversion layer, a preparation method thereof and a display device. The full-color quantum dot conversion layer comprises black glass, a transition layer, a heat dissipation layer, a through hole and quantum dot color conversion materials filled in the through hole, wherein the quantum dot color conversion materials respectively comprise red light quantum dots, green light quantum dots, blue light quantum dots or blue light absorbents. The through holes penetrate through all the layers, accurate filling positions are provided for the quantum dot color conversion material, the size can be adjusted and controlled, and the material preparation difficulty is lowered. The transition layer improves the adaptability of the black glass and the heat dissipation layer, and the heat dissipation layer dissipates heat quickly. In addition, the packaging layer is further arranged, the quantum dots are protected, the structural stability is improved, and multiple additives are added into the quantum dot color conversion material to improve the performance. The preparation method comprises the steps of providing black glass, forming the transition layer and the heat dissipation layer, punching, preparing and filling the quantum dot color conversion material and the like. The display device comprises a blue light chip array and the full-color quantum dot conversion layer, and full-color display is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a full-color quantum dot color conversion layer, a preparation method thereof and a display device. BACKGROUND

[0002] In emerging display technologies, Mini / Micro-LED technology is considered as a strong contender for the next generation of display technology due to its self-luminescent characteristics, high brightness output, low power consumption, and long service life. However, Mini / Micro-LED technology still faces many challenges to achieve full-color display. Currently, traditional full-color schemes mainly fall into two categories. One is to use three-color LED chips to directly emit light, but this scheme has many problems in practical application. For example, the difficulty of mass transfer technology is extremely great, not only the transfer efficiency is low, but also the yield is difficult to guarantee, which directly leads to high production cost. In addition, there are differences in aging rates of different color chips, and with the increase of use time, this difference will gradually intensify, thereby affecting the color consistency and stability of the display picture. The other scheme is to combine fluorescent powder for color conversion, which has a relatively narrow color gamut and cannot meet the needs of consumers for high color saturation, and the light-emitting efficiency is also low, which limits the brightness and energy-saving effect of the display device.

[0003] Quantum dot materials have attracted much attention due to their unique luminescent characteristics, with advantages such as narrow emission spectrum, precise control of luminescent color, and high quantum yield, providing a possible solution to the full-color problem of Mini / Micro-LED technology. The application of quantum dot materials in Mini / Micro-LED display technology can achieve wide color gamut and high efficiency full-color display. Although quantum dot materials have shown application potential in the display field, there are still many problems to be solved in the traditional preparation method of full-color quantum dot color conversion layer.

[0004] In terms of substrate materials, the selection is limited, and it is difficult to meet the performance requirements of hardness, flatness, and light absorption at the same time. Currently, quantum dot color conversion layers are usually prepared on plastic or glass substrates. Although plastic substrates have certain flexibility and cost advantages, their thermal stability is poor and they are prone to deformation in high-temperature environments, which affects the display effect and the reliability of the device. While glass substrates have high hardness, there is a risk of thermal mismatch between the glass substrate and the driving circuit layer. Due to the difference in the thermal expansion coefficients of glass and the driving circuit layer material, when the temperature changes, both will deform to varying degrees, resulting in gaps and defects between the layers, which in turn affects the uniformity and stability of the display picture.

[0005] Existing fabrication processes also have many shortcomings. The fabrication process is complex, making it difficult to achieve efficient and uniform filling of quantum dot color conversion materials. Moreover, different colored quantum dot materials have specific requirements for thickness and properties, and existing fabrication processes cannot meet these individual needs, resulting in the quantum dot color conversion layer's performance not reaching its optimal state.

[0006] Therefore, a high-resolution full-color quantum dot color conversion layer and its preparation method are developed to overcome the above-mentioned defects in the existing technology and meet the market demand for high-performance full-color quantum dot color conversion layers. Summary of the Invention

[0007] The purpose of this application is to provide a high-resolution full-color quantum dot conversion layer, its fabrication method, and a display device, solving problems such as complex fabrication processes, optical crosstalk and light leakage, thermal mismatch, and poor stability and dispersion of quantum dot materials in existing technologies. This improves display performance, stability, and production efficiency, meeting the demands of high-performance Mini / Micro LED display technology. The full-color quantum dot conversion layer is achieved through the following technical solution: Black glass; A transition layer is formed on the bottom side of the black glass; A heat dissipation layer is formed on the side of the transition layer opposite to the black glass; Multiple through holes, which pass through the black glass, the transition layer and the heat dissipation layer, and are filled with quantum dot color conversion material; The quantum dot color conversion material includes red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers.

[0008] In one embodiment, an encapsulation layer is also included, formed on the side of the black glass opposite the transition layer.

[0009] In one embodiment, the quantum dot color conversion material further includes scattering particles, dispersants, antioxidants, and light stabilizers.

[0010] In one embodiment, the heat dissipation layer is formed of a ceramic material.

[0011] This application also provides a method for preparing a full-color quantum dot conversion layer, including: Provide black glass; A transition layer is formed on one side of the black glass; A heat dissipation layer is formed on the side of the transition layer opposite to the black glass; A through-hole is formed that penetrates the black glass, the transition layer, and the heat dissipation layer; Different types of quantum dot color conversion materials are prepared, and the quantum dot color conversion materials are filled into the through holes and then cured. Among them, different types of quantum dot color conversion materials include red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers.

[0012] In one embodiment, the process further includes grinding and polishing the black glass.

[0013] In one embodiment, the preparation of quantum dot color conversion material specifically includes treating quantum dots and adding the treated quantum dots and additives to a solvent.

[0014] In one embodiment, the process further includes forming a reflective structure after curing, the reflective structure being formed on the light-emitting surface of the through-hole.

[0015] In one embodiment, an encapsulation layer is further formed on the light-emitting surface.

[0016] This application further provides a display device, including a blue light chip array and the aforementioned full-color quantum dot conversion layer disposed on the blue light chip array.

[0017] Compared with the prior art, this application has the following beneficial effects: This application uses black glass as a substrate and forms a transition layer and a heat dissipation layer, effectively improving the compatibility between the black glass and the heat dissipation layer. This allows the heat dissipation layer to form a uniform film and adhere well, avoiding performance degradation of the quantum dot color conversion material caused by heat dissipation layer issues. The heat dissipation layer can quickly dissipate the heat generated during the operation of the quantum dot color conversion layer, reducing the risk of device damage due to thermal stress, improving stability and reliability, and extending service life.

[0018] Black glass possesses high hardness, high flatness, and excellent light absorption properties. This application utilizes these properties to effectively absorb and block excess light between pixels, preventing light propagation and significantly reducing crosstalk and light leakage. This results in a clearer display with more vibrant and accurate colors. The optimized method for preparing the full-color quantum dot conversion layer achieves efficient and uniform filling of the quantum dot color conversion material. Red, green, and blue quantum dots are precisely filled into the vias at corresponding pixel positions using inkjet printing or direct photolithography, improving filling uniformity, reducing material waste, and lowering production costs.

[0019] In summary, the high-resolution full-color quantum dot conversion layer, its preparation method, and the display device of this application effectively solve the problems existing in the prior art through optimized technical solutions, and have advantages in terms of performance, stability, and preparation process. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the structure after the transition layer and heat dissipation layer are formed in one embodiment of this application; Figure 2 This is a schematic diagram of the structure after a through hole is formed in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of a full-color quantum dot conversion layer filled with quantum dot color conversion material in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of a display device including a full-color quantum dot conversion layer in one embodiment of this application.

[0021] Explanation of reference numerals in the attached figures: 100, black glass; 200, transition layer; 300, heat dissipation layer; 400, through-hole; 500, quantum dot color conversion material; 510, red light conversion material; 520, green light conversion material; 530, blue light conversion material; 600, encapsulation layer; 700, blue light chip array; 710, blue light chip. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0023] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] Among emerging display technologies, Mini / Micro-LED technology boasts advantages such as self-emission, high brightness, low power consumption, and long lifespan, making it a strong contender for next-generation display technology. However, achieving full-color display with Mini / Micro-LED technology still faces several challenges. Traditional full-color solutions, such as direct emission from three-color LED chips, suffer from difficulties in mass transfer, high costs, and inconsistent aging rates among different color chips. Solutions combining phosphor conversion, on the other hand, suffer from narrow color gamut and low efficiency. Applying quantum dot materials to display technology holds promise for achieving wide color gamut and high-efficiency full-color displays, meeting consumers' demands for a high-quality visual experience. Currently, traditional methods for preparing full-color quantum dot color conversion layers have numerous problems, such as limitations in substrate material selection, poor stability of quantum dot materials, and complex fabrication processes. These issues hinder the development and application of quantum dot display technology. To overcome the shortcomings of existing technologies and promote the further development of quantum dot display technology, this application proposes a novel full-color quantum dot color conversion layer, its preparation method, and a display device incorporating the conversion layer. This aims to solve problems existing in the prior art, such as thermal mismatch, optical crosstalk and light leakage, poor stability and dispersion of quantum dot materials, and complex preparation processes, thereby supporting the development of high-performance Mini / Micro-LED display technology. The specific structure, preparation method, and display device incorporating the full-color quantum dot color conversion layer of this application will be described in detail below. Please refer to... Figures 1 to 3 In a preferred embodiment of this application, the full-color quantum dot conversion layer includes: Black glass 100; A transition layer 200 is formed on the bottom side of the black glass 100; A heat dissipation layer 300 is formed on the side of the transition layer 200 opposite to the black glass 100; Multiple through holes 400 pass through the black glass 100, the transition layer 200 and the heat dissipation layer 300, and the through holes 400 are filled with quantum dot color conversion material 500; The quantum dot color conversion material 500 includes red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers.

[0026] Black Glass 100, serving as the base material for the entire full-color quantum dot conversion layer, possesses high hardness, providing robust support and ensuring the structural stability of the conversion layer. Simultaneously, its high flatness ensures uniform light emission, reducing light scattering and loss caused by surface unevenness, thus improving light utilization and display quality. Its excellent light absorption characteristics allow Black Glass 100 to effectively absorb excess light, preventing crosstalk and light leakage between pixels, and enhancing display contrast and color purity.

[0027] The transition layer 200 is formed on the bottom side of the black glass 100. Because the black glass 100 and the subsequent heat dissipation layer 300 differ in material properties, direct bonding may lead to problems such as loose interfacial bonding and stress concentration, thus affecting the performance and stability of the entire conversion layer. The transition layer 200 improves the compatibility between the black glass 100 and the heat dissipation layer 300. By optimizing the physical and chemical properties of the interface, it enables the heat dissipation layer 300 to form a uniform film and adhere well to the black glass 100, avoiding performance degradation of the quantum dot color conversion material 500 caused by problems with the heat dissipation layer 300.

[0028] A heat dissipation layer 300 is formed on the side of the transition layer 200 opposite to the black glass 100, and this side can directly contact the chip array. During the operation of the display device, the blue light chip array 700 generates a large amount of heat. If this heat cannot be dissipated effectively and in a timely manner, the chip temperature will rise, affecting the chip's performance and lifespan. It will also adversely affect the quantum dot color conversion layer, reducing the luminous efficiency and stability of the quantum dots. The heat dissipation layer 300 in this application is made of a material with high heat dissipation performance, which can quickly conduct and dissipate the heat generated by the chip array, effectively reducing the chip's operating temperature and ensuring that the chip and quantum dot color conversion layer operate stably within a suitable temperature range, thereby improving reliability and lifespan.

[0029] The through-hole 400 penetrates the black glass 100, the transition layer 200, and the heat dissipation layer 300, forming a vertically continuous channel structure. The step of forming the through-hole 400 in the black glass 100 can be performed independently, providing precise positioning for the filling of the quantum dot color conversion material 500. Different types of quantum dots can be accurately filled into the corresponding designed pixel positions. By controlling the size, shape, and distribution of the through-hole 400, it can be ensured that each pixel meets the design requirements during the through-hole 400 formation step, eliminating the need for testing after the entire LED display device is formed.

[0030] The quantum dot color conversion material 500 filled in the through-hole 400 is the core component of the full-color quantum dot conversion layer, enabling color conversion. This material contains red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers. By filling the through-hole 400 with the corresponding quantum dots to form the quantum dot color conversion material 500, the display effect can be controlled. When blue light emitted from the blue light chip 710 shines on the quantum dot color conversion material 500, the red quantum dots absorb some of the blue light and emit red light, the green quantum dots absorb some of the blue light and emit green light, while the blue quantum dots can directly transmit some of the blue light or emit blue light of a specific wavelength after appropriate processing. The blue light absorber can be used to adjust the intensity and spectral distribution of blue light, optimizing the display effect. By rationally combining different types and proportions of quantum dots and blue light absorbers, full-color display can be achieved, meeting the needs of various display applications.

[0031] Furthermore, the through-hole 400 features diverse size designs and can be processed into different sizes according to actual needs. Since the absorption and response characteristics of quantum dot color conversion materials 500 of different sizes differ to excitation light, this can be controlled by changing the size of the through-hole 400. This eliminates the need for extremely strict control over parameters such as the particle size and concentration of the quantum dot material, significantly reducing the difficulty of material preparation and application. Traditional methods require very precise control of the concentration of quantum dot materials to ensure consistent luminescence intensity in different regions. However, in the design of this application, through-holes 400 of different sizes can be filled with different concentrations or types of quantum dot color conversion material 500 according to actual needs, eliminating the need for strict uniform control of the material. This simplifies the material preparation process, reduces display inhomogeneity problems caused by improper concentration control, and improves production efficiency and product yield. In practical applications, display devices may be used with blue light chips 710 of different types or performance. The excitation light intensity emitted by these chips may vary. The full-color quantum dot conversion layer of this application, through the design of vias 400 of different sizes, can better adapt to the characteristics of different light sources and achieve good matching with different light sources without large-scale adjustment of quantum dot materials.

[0032] In the full-color quantum dot conversion layer structure of this application, an encapsulation layer 600 is further provided. This encapsulation layer 600 is formed on the side of the black glass 100 relative to the transition layer 200, i.e., the light-emitting side. It serves a conventional protective function, also possesses encapsulation capabilities, and can simultaneously encapsulate the top reflection structure, making it suitable for display devices forming a reflective cavity structure. Quantum dot materials are extremely sensitive to external environmental factors such as water, oxygen, light, and heat. These factors can easily lead to oxidation and aggregation of quantum dots, thereby affecting their luminescent performance and stability. The presence of the encapsulation layer 600 effectively isolates external moisture and oxygen, preventing them from penetrating into the quantum dot color conversion material 500 and protecting the quantum dots from corrosion.

[0033] The encapsulation layer 600 buffers external mechanical stress, reduces damage to the quantum dot material, and improves the mechanical reliability and durability of the display device. It also encapsulates the top reflective structure subsequently used to form the reflective cavity structure. The top reflective structure reflects the light emitted by the quantum dots back to its original direction, while the encapsulation layer 600 ensures the sealing and integrity of the reflective cavity. The reflective cavity structure effectively improves the wavelength concentration of light, thereby ensuring accurate color display. Integrating the encapsulation functions of the encapsulation layer 600 and the top reflective structure together avoids the complexity of separately setting up the encapsulation layer 600 and the reflective structure, simplifying the overall structure of the display device.

[0034] In the full-color quantum dot conversion layer disclosed in this application, scattering particles, dispersants, antioxidants, and light stabilizers are additionally added to the quantum dot color conversion material 500. These additives work synergistically with the quantum dots to improve light extraction efficiency. The addition of scattering particles effectively alters the propagation path of light within the quantum dot color conversion material 500, enabling a more uniform distribution of light within it. The dispersant prevents quantum dot aggregation, inhibiting the mutual agglomeration of quantum dots and ensuring uniform dispersion of quantum dots within the color conversion material. Uniformly dispersed quantum dots can better interact with the surrounding matrix material, improving the overall stability of the quantum dot color conversion material 500. The dispersant improves the compatibility between quantum dots and the matrix material, while the addition of antioxidants protects the quantum dots from oxidation.

[0035] In the full-color quantum dot conversion layer structure design of this application, the heat dissipation layer 300 is made of ceramic material. Ceramic material can provide efficient heat dissipation for the display device. However, in order to further optimize the bonding effect between the heat dissipation layer 300 and the chip array, and ensure good thermal conductivity and mechanical stability between the two, a second transition layer 200 is specially set on the other side of the heat dissipation layer 300 near the chip array, which helps to improve the heat dissipation efficiency and reliability of the entire display device. Ceramic materials generally have high thermal conductivity, which can quickly conduct away the heat generated by the chip array. During the operation of the display device, the chip array will continuously generate heat. If heat cannot be dissipated in time, the chip temperature will rise, thereby affecting its performance and lifespan. The high thermal conductivity of the ceramic heat dissipation layer 300 can quickly transfer heat from the chip array to the surrounding environment, effectively reducing the chip's operating temperature and ensuring that the chip operates stably within a suitable temperature range. In addition, ceramic material is a good insulator. In the display device, there are various electronic components and circuits around the chip array. The insulating properties of the ceramic heat dissipation layer 300 can effectively prevent current leakage and short circuits.

[0036] The second transition layer 200 can further improve the interface bonding, enabling the heat dissipation layer 300 and the chip array to better contact and bond with each other, reduce the interface thermal resistance, and improve the thermal conduction efficiency. Since the thermal expansion coefficients of the heat dissipation layer 300 and the chip array may be different, the second transition layer 200 can further reduce the damage of thermal stress to the heat dissipation layer 300 and the chip array, and improve the thermal stability and mechanical strength of the entire structure.

[0037] Please see Figures 1 to 3 This application also provides a method for preparing a full-color quantum dot conversion layer, comprising: Provide 100g of black glass; A transition layer 200 is formed on one side of the black glass 100; A heat dissipation layer 300 is formed on the side of the transition layer 200 opposite to the black glass 100; A through hole 400 is formed, which penetrates the black glass 100, the transition layer 200 and the heat dissipation layer 300; Different types of quantum dot color conversion materials 500 are prepared, and the quantum dot color conversion materials 500 are filled into the through holes 400 and the quantum dot color conversion materials 500 are cured. Among them, different types of quantum dot color conversion materials 500 include red quantum dots, green quantum dots, blue quantum dots or blue light absorbers.

[0038] First, a piece of black glass 100 is prepared as the base substrate. Black glass 100 has excellent optical properties, effectively absorbing stray light and reducing its impact on the display effect. Next, a transition layer 200 is formed on one side of the black glass 100 using a specific deposition process (such as physical vapor deposition, chemical vapor deposition, or sol-gel method). The main function of the transition layer 200 is to improve the interfacial bonding performance between the black glass 100 and the subsequent heat dissipation layer 300, reduce interfacial thermal resistance, and also provide a certain stress buffering effect, avoiding interface defects caused by differences in the thermal expansion coefficients of different materials.

[0039] Then, on the side of the transition layer 200 opposite to the black glass 100, a heat dissipation layer 300 is formed using a suitable material preparation method (such as coating, printing, etc.). The heat dissipation layer 300 uses a material with high thermal conductivity (such as ceramic material, etc.) which can quickly conduct away the heat generated by the chip.

[0040] Subsequently, using high-precision processing technologies such as laser drilling and mechanical drilling, through holes 400 are formed that penetrate the black glass 100, the transition layer 200, and the heat dissipation layer 300. The size and distribution of the through holes 400 can be designed according to actual needs to meet the filling requirements of different quantum dot color conversion materials 500, while achieving effective control of the excitation light.

[0041] Different types of quantum dot color conversion materials 500 were prepared simultaneously. Based on display requirements, color conversion materials containing red, green, and blue quantum dots, as well as a blue light absorber, were prepared. Red and green quantum dots can convert excitation light into specific wavelengths of red and green light, which, together with the unconverted blue light, achieve full-color display. The blue light absorber is used to adjust the intensity and distribution of blue light, further optimizing the display effect. The prepared quantum dot color conversion materials 500 were filled into through-holes 400 using precise filling processes such as dispensing and inkjet printing. Appropriate curing conditions (such as thermosetting and photocuring) were then used to cure the quantum dot color conversion materials 500, forming a stable structure within the through-holes 400. A red light conversion material 510 is formed by filling a quantum dot color conversion material 500 containing red light quantum dots into a through hole 400; a green light conversion material 520 is formed by filling a quantum dot color conversion material 500 containing green light quantum dots into a through hole 400; and a blue light conversion material 530 is formed by filling a quantum dot color conversion material 500 containing blue light quantum dots or a blue light absorber into a through hole 400.

[0042] Black Glass 100 effectively absorbs stray light, reducing its interference with the quantum dot luminescence process and improving the contrast and color purity of the displayed image. It also possesses excellent mechanical strength and chemical stability, providing support for the quantum dot conversion layer. Furthermore, the chemical stability of Black Glass 100 prevents it from reacting with surrounding materials, ensuring the stable performance of the quantum dot conversion layer.

[0043] The transition layer 200 improves the interfacial bonding performance between the black glass 100 and the heat dissipation layer 300, acting as a stress buffer to absorb and disperse some thermal stress, reducing the damage caused by thermal stress to the black glass 100 and the heat dissipation layer 300, and improving the mechanical stability and reliability of the entire structure. The heat dissipation layer 300 uses a high thermal conductivity material, enabling it to quickly conduct the heat generated by the chip away, ensuring a uniform distribution of heat throughout the structure and preventing localized overheating.

[0044] The through-hole 400 design, penetrating the black glass 100, transition layer 200, and heat dissipation layer 300, allows for precise control of its size and distribution according to actual needs, thereby achieving effective regulation of the excitation light. Through-holes 400 of different sizes can be filled with different types or concentrations of quantum dot color conversion material 500, resulting in varying absorption and conversion efficiencies of the excitation light in different areas, thus regulating the display of different brightness and colors. This excitation light regulation method offers flexibility and precision, meeting various complex display requirements. By preparing a color conversion material containing red, green, and blue quantum dots and filling it into the through-hole 400, full-color display can be achieved. Appropriate curing conditions are used to cure the quantum dot color conversion material 500, forming a stable structure within the through-hole 400.

[0045] In a further technical solution, in order to control the size of the filling material, instead of directly forming through-holes 400, blind holes are first formed, that is, the bottom of the hole has a certain thickness. After the filling material is filled and cured, the two ends are etched to remove the remaining material of the original stack and part of the filling material, thereby controlling the size of the filling material. After completion, the two ends of the material in the hole are filled with the base material of the color conversion material that does not contain quantum dots or absorbers, forming a flat surface. By controlling the thickness of the filling material, the content of the material in each hole can be precisely controlled, thereby achieving more precise color control and eliminating the differences between different holes.

[0046] The fabrication process of the full-color quantum dot conversion layer also includes grinding and polishing the black glass 100. Specifically, after selecting the black glass 100, a coarse grinding process is first used, utilizing abrasive particles of a specific size to interact with the surface of the black glass 100, removing any macroscopic defects, burrs, and rough, uneven areas that may exist on the surface of the black glass 100. Subsequently, the process gradually transitions to a fine grinding stage, using abrasive materials with even finer particles to further reduce the roughness of the black glass 100 surface, making it smoother and more even. Finally, polishing is performed through the synergistic effect of polishing fluid and polishing pad. Grinding and polishing steps can be included before and after drilling, but it is preferred to perform these steps after drilling. After grinding and polishing, the surface of the black glass 100 is cleaner, reducing the residue of impurities and debris, ensuring the quality and performance of the quantum dot color conversion layer.

[0047] In the preparation of the full-color quantum dot conversion layer, the preparation of quantum dot color conversion material 500 is a key step, which specifically includes the treatment of quantum dots. The relevant treatments include modifying the quantum dot material through ligand exchange, oxide coating, phase inversion dispersion and other means to give it good stability, dispersibility and processing performance, as well as adding the treated quantum dots together with additives into a suitable solvent.

[0048] For quantum dot processing, surface modification techniques are employed first. By introducing specific ligand molecules onto the surface of quantum dots, these ligand molecules can chemically bond with the atoms or ions on the quantum dot surface, thereby altering the chemical properties and physical state of the quantum dot surface. For example, modifying quantum dots with ligand molecules containing functional groups such as carboxyl and amino groups can not only improve the dispersibility of quantum dots in solvents but also enhance the interaction between quantum dots and other materials, laying the foundation for subsequent performance optimization of quantum dot color conversion material 500.

[0049] After quantum dot processing, the processed quantum dots are added to a solvent along with various additives, including scattering particles, dispersants, antioxidants, and light stabilizers. Scattering particles are added to optimize the optical path; these particles are typically made of materials with high refractive index and uniform particle size distribution, such as silica and titanium dioxide. Dispersants ensure uniform dispersion of the quantum dots and scattering particles in the solvent. Antioxidants are added to prevent oxidation of the quantum dots during preparation and use. Light stabilizers enhance the light stability of the quantum dot color conversion material 500.

[0050] After completing the curing step of the quantum dot color conversion material 500, a further process step of forming a reflective mirror structure is added. Specifically, physical vapor deposition methods such as electron beam evaporation and magnetron sputtering are used to construct a reflective mirror structure on the light-emitting surface of the through-hole 400. This reflective mirror structure typically uses a metal material with high reflectivity, such as silver (Ag) or aluminum (Al). By precisely controlling deposition parameters, such as deposition rate, deposition time, and gas flow rate, it is ensured that the reflective mirror structure uniformly and densely covers the light-emitting surface of the through-hole 400, forming an optical interface with specific reflective properties.

[0051] During the quantum dot color conversion process, some light rays can undergo multiple reflections and scatterings within the through-hole 400. Without a reflector structure, this light might be absorbed by the walls of the through-hole 400 or other materials, resulting in light loss. After a reflector structure is formed on the light-emitting surface of the through-hole 400, it can reflect the light that might otherwise be absorbed back into the through-hole 400, allowing more light to be absorbed and converted by the quantum dot. The reflector structure can also control the direction of light propagation, making the light more concentrated and concentrated as it exits from the light-emitting surface of the through-hole 400, thus improving light utilization.

[0052] After completing the fabrication of quantum dot color conversion-related structures (such as filling the via 400 with quantum dot material and constructing the mirror structure), a further process step to form the encapsulation layer 600 is introduced. Specifically, thin-film deposition techniques, such as atomic layer deposition (ALD), chemical vapor deposition (CVD), or high-precision coating processes, such as spin coating and spray coating, are used to form an encapsulation layer 600 on the light-emitting surface. By controlling process parameters, such as deposition temperature, gas flow rate, coating speed, and thickness, it is ensured that the encapsulation layer 600 uniformly, densely, and without defects covers the light-emitting surface, forming a protective barrier. Using a material with high light transmittance as the encapsulation layer 600 minimizes light absorption and scattering. The encapsulation layer 600 can uniformly cover the light-emitting surface, reducing differences in light propagation caused by unevenness or local defects on the light-emitting surface. This helps ensure that light emitted from different areas has similar intensity and color distribution, improving the color uniformity of the display device and making the overall display image more consistent. Simultaneously, it effectively isolates external moisture and oxygen, preventing them from penetrating into the quantum dot color conversion layer.

[0053] Please see Figure 4 This application further provides a display device, including a blue light chip array 700 and the aforementioned full-color quantum dot conversion layer disposed on the blue light chip array 700.

[0054] Specifically, the blue light chip array 700 is composed of multiple high-brightness, high-efficiency blue light-emitting diode (LED) chips arranged in a specific pattern. These blue light chips 710 are manufactured using semiconductor processes, exhibiting uniform light emission characteristics, low power consumption, and a long lifespan. Each blue light chip 710 can stably emit high-intensity blue light, providing a sufficient and stable excitation source for the full-color quantum dot conversion layer.

[0055] The full-color quantum dot conversion layer is fabricated on the blue LED chip array 700 through processes such as surface modification of quantum dots, uniform mixing with various additives, curing, and the construction of a reflector structure and encapsulation layer 600, as described above. This full-color quantum dot conversion layer can convert the blue light emitted by the corresponding blue LED chip 710 into red, green, and blue primary color light, respectively. By controlling the luminous intensity and ratio of different blue LED chips 710, full-color display is achieved.

[0056] By selecting quantum dot materials and regulating their luminescent properties, as well as optimizing the design of the full-color quantum dot conversion layer, the emission wavelength and intensity of each color can be precisely controlled. This allows the display device to accurately reproduce various colors, presenting them in their most realistic state and improving the accuracy of color reproduction. The blue LED chip 710 has high luminous efficiency, capable of efficiently converting electrical energy into light energy. The full-color quantum dot conversion layer also exhibits low energy loss during the light conversion process, resulting in low power consumption for the entire display device. Compared to traditional display technologies, the display device using this application can reduce energy consumption.

[0057] By directly placing the full-color quantum dot conversion layer on top of the blue light chip array 700, a compact display structure can be formed, reducing the thickness and volume of the display device, making it thinner and lighter, and easier to integrate into various electronic devices, thus meeting the demand for thinner and lighter electronic devices.

[0058] As described above, this application provides a full-color quantum dot conversion layer and its fabrication method, as well as a display device based on the full-color quantum dot conversion layer. The full-color quantum dot conversion layer uses black glass as a substrate. Its high hardness, high flatness, and good light absorption characteristics prevent light crosstalk and light leakage, improving contrast and color purity. A transition layer is provided on the bottom side of the black glass to improve the compatibility between the black glass and the subsequent heat dissipation layer, avoiding problems such as loose interface bonding and stress concentration, ensuring uniform film formation and good adhesion of the heat dissipation layer. The heat dissipation layer is made of a high-heat-dissipation material (such as ceramic) and is located on the side of the transition layer opposite to the black glass. It can directly contact the chip array, quickly conducting and dissipating the heat generated by the chip array, reducing the chip operating temperature, and ensuring stable operation of the chip and the quantum dot color conversion layer.

[0059] In the full-color quantum dot conversion layer, multiple through-holes are formed penetrating the black glass, transition layer, and heat dissipation layer. The size, shape, and distribution of these through-holes can be designed as needed, providing spaces for the quantum dot color conversion material to fill. The quantum dot color conversion material filling these through-holes is the core of the full-color quantum dot conversion layer's color conversion capability. It includes red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers. By rationally combining different types and proportions of quantum dots or blue light absorbers, full-color display can be achieved. The through-holes have diverse size designs, allowing for the control of the quantum dot color conversion material's absorption and response characteristics to excitation light according to actual needs.

[0060] The method for preparing a full-color quantum dot conversion layer includes: providing black glass and forming a transition layer on one side; forming a heat dissipation layer on the side of the transition layer opposite to the black glass; forming through-holes penetrating the black glass, the transition layer, and the heat dissipation layer; preparing different types of quantum dot color conversion materials, filling them into the through-holes, and curing them. The preparation process also includes grinding and polishing the black glass, and treating the quantum dots with ligand exchange, oxide coating, and phase inversion dispersion to give them good stability, dispersibility, and processing performance. The treated quantum dots are then added to a suitable solvent along with additives. After the curing step, a process step of forming a reflective mirror structure can be included to construct the reflective mirror structure on the light-emitting surface of the through-hole, improving light utilization. Finally, a process step of forming an encapsulation layer is introduced, using thin-film deposition technology or high-precision coating technology to form an encapsulation layer on the light-emitting surface, effectively isolating external environmental factors and ensuring the color uniformity of the display device.

[0061] This application also provides a display device, including a blue light chip array and the aforementioned full-color quantum dot conversion layer disposed thereon. The blue light chip array is composed of multiple high-brightness, high-efficiency blue light-emitting diode chips arranged in a specific pattern, manufactured using semiconductor technology, and possesses uniform light emission characteristics, low power consumption, and a long lifespan, providing a sufficient and stable excitation light source for the full-color quantum dot conversion layer. The full-color quantum dot conversion layer, after processing, is disposed on top of the blue light chip array, capable of converting the blue light emitted by the blue light chips into red, green, and blue primary color light. By controlling the luminous intensity and ratio of different blue light chips, full-color display is achieved.

[0062] The full-color quantum dot conversion layer and its preparation method described in this application, as well as the display device based on the conversion layer, have advantages in terms of color performance, brightness, contrast, power consumption, lifespan, structural compactness, and design flexibility.

[0063] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A full-color quantum dot conversion layer, characterized in that, include: Black glass; A transition layer is formed on the bottom side of the black glass; A heat dissipation layer is formed on the side of the transition layer opposite to the black glass; Multiple through holes, which pass through the black glass, the transition layer and the heat dissipation layer, and are filled with quantum dot color conversion material; The quantum dot color conversion material includes red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers.

2. The full-color quantum dot conversion layer according to claim 1, characterized in that, It also includes an encapsulation layer formed on the side of the black glass opposite to the transition layer.

3. The full-color quantum dot conversion layer according to claim 1, characterized in that, The quantum dot color conversion material also includes scattering particles, dispersants, antioxidants, and light stabilizers.

4. The full-color quantum dot conversion layer according to claim 3, characterized in that, The heat dissipation layer is formed of ceramic material.

5. A method for preparing a full-color quantum dot conversion layer, characterized in that, include: Provide black glass; A transition layer is formed on one side of the black glass; A heat dissipation layer is formed on the side of the transition layer opposite to the black glass; A through-hole is formed that penetrates the black glass, the transition layer, and the heat dissipation layer; Different types of quantum dot color conversion materials are prepared, and the quantum dot color conversion materials are filled into the through holes and then cured. Among them, different types of quantum dot color conversion materials include red quantum dots, green quantum dots, blue quantum dots, or blue light absorbers.

6. The method for preparing a full-color quantum dot conversion layer according to claim 5, characterized in that, It also includes the steps of grinding and polishing the black glass.

7. The method for preparing a full-color quantum dot conversion layer according to claim 5, characterized in that, The preparation of quantum dot color conversion materials specifically includes treating quantum dots and adding the treated quantum dots and additives to a solvent.

8. The method for preparing a full-color quantum dot conversion layer according to claim 5, characterized in that, It also includes forming a reflective mirror structure after curing, the reflective mirror structure being formed on the light-emitting surface of the through hole.

9. The method for preparing a full-color quantum dot conversion layer according to claim 8, characterized in that, It also includes forming an encapsulation layer, which is formed on the light-emitting surface.

10. A display device, characterized in that, It includes a blue light chip array and a full-color quantum dot conversion layer as described in any one of claims 1-4 disposed on the blue light chip array.

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