Preparation method and application of wave-absorbing functional layer

Abstract

The invention belongs to the field of heat dissipation and wave absorption, and discloses a preparation method and application of a wave-absorbing functional layer, and the preparation method comprises the following steps: S1, mixing and dissolving urea, metal ions and deionized water to obtain a mixed solution; s2, the pretreated foamed nickel is immersed in the mixed solution in the step S1, and foamed nickel and high entropy are obtained through a hydrothermal reaction; s3, immersing the foamed nickel at high entropy in the step S2 into a mixed solution of glyoxal and deionized water, and performing hydrothermal reaction to obtain the foamed nickel at oxygen vacancy-rich high entropy; s4, immersing the foamed nickel (at) oxygen vacancy-rich high entropy obtained in the step S3 into a polyethyleneimine (PEI) solution to obtain foamed nickel (at) oxygen vacancy-rich high entropy (at) PEI; and S5, immersing the foamed nickel at oxygen vacancy-rich high-entropy at PEI obtained in the step S4 into an ammonium tetrathiomolybdate solution, and carrying out solvothermal reaction. The wave-absorbing functional layer is made of foamed nickel and oxygen vacancy-rich high-entropy MoS2, has a wave-absorbing function and is of a porous structure.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of heat dissipation and wave absorption, and particularly relates to a preparation method and application of a wave absorption functional layer. BACKGROUND

[0002] In the fields of electronic devices, aerospace and stealth technology, with the rapid development of high-frequency and high-speed electronic devices (such as 5G communication, radar systems and high-power chips), heat dissipation and electromagnetic wave absorption have become two key technical challenges. Traditional technologies are difficult to meet the dual requirements of heat dissipation and wave absorption of modern electronic devices due to functional separation and single structure.

[0003] The current technical solutions usually separate the design of heat dissipation and wave absorption functions. Due to the conflict of physical mechanisms (such as high thermal conductivity of metals but reflection of electromagnetic waves, and poor thermal conductivity of magnetic materials but wave absorption), two independent devices are needed to realize heat dissipation and wave absorption functions, resulting in complex structure, increased volume and weight, which is difficult to meet the needs of modern equipment lightweight and integration.

[0004] Moreover, the heat dissipation structure of the prior art mainly fixes the heat dissipation fins on the surface of the electronic device through threaded connection. After long-term use, a large amount of dust will be deposited on the heat dissipation fins, which is not easy to disassemble and clean. The threaded connection may also extrude the internal space of the electronic device, causing it to malfunction and affecting the normal operation of the electronic device. In addition, traditional binary / trinary spinel oxides (such as Co3O4 and CoFe2O4) have been widely used in the field of wave absorption. However, due to their impedance mismatch and high density, their development in practical applications is limited.

[0005] Therefore, it is necessary to provide a preparation method and application of a wave absorption functional layer to solve the above problems through structure optimization and material design. SUMMARY In view of the deficiencies of the prior art, the present application provides a preparation method and application of a wave absorption functional layer, which aims to solve the problems of complex structure, increased volume and weight caused by the separation of heat dissipation and wave absorption functions of electronic devices, and the problems of not easy to disassemble and easy to extrude the electronic device to cause malfunction caused by the threaded connection of the heat dissipation structure on the surface of the electronic device. In order to improve the wave absorption performance, a new type of high-entropy spinel oxide rich in oxygen vacancies is designed. The introduction of oxygen vacancies can enhance dielectric loss and optimize impedance matching, thereby significantly improving the wave absorption performance of spinel oxide. In addition, due to the unique high-entropy effect, lattice distortion effect, hysteresis diffusion effect and "cocktail" effect of high-entropy materials, they can surpass binary / trinary oxides and exhibit excellent wave absorption performance.

[0006] To achieve the above purpose, the present application provides the following technical solutions: A preparation method of a wave absorption functional layer, comprising the following steps: S1. mixing urea and metal ions to obtain a mixture, and mixing the mixture with deionized water to obtain a mixed solution; S2. vertically immersing the pretreated foam nickel into the mixed solution in step S1 to obtain a foam nickel sample through hydrothermal reaction, and obtaining foam nickel high-entropy through post-processing; S3. adding the foam nickel high-entropy in step S2 into a mixed solution of glyoxal and deionized water to obtain foam nickel high-entropy rich in oxygen vacancies through hydrothermal reaction; S4. soaking the foam nickel high-entropy rich in oxygen vacancies in step S3 in a PEI solution, and obtaining foam nickel high-entropy rich in oxygen vacancies@PEI through cleaning and drying; S5. dissolving ammonium tetrathiomolybdate in N, N dimethylformamide, and soaking the foam nickel high-entropy rich in oxygen vacancies@PEI in step S4 to obtain a wave-absorbing functional layer, i.e., foam nickel high-entropy rich in oxygen vacancies@MoS2, through solvothermal reaction, cleaning and drying.

[0007] Preferably, before step S1, the pretreatment process of the foam nickel is as follows: the foam nickel is subjected to pickling and neutralization until the surface of the foam nickel is neutral.

[0008] Further, the foam nickel is placed in 5M hydrochloric acid for ultrasonic cleaning for 15-25 min, and then washed with deionized water and anhydrous ethanol until neutral.

[0009] Preferably, in step S1, the metal ions are cobalt salt, nickel salt, magnesium salt, manganese salt, zinc salt and iron salt; the molar ratio of the cobalt salt, nickel salt, magnesium salt, manganese salt, zinc salt and iron salt is 1:1:1:1:1:10; and the molar ratio of the metal ions to urea is 1:4-5.

[0010] Preferably, in step S1, the cobalt salt is CoCl2·6H2O, the nickel salt is NiCl2·6H2O, the magnesium salt is MgCl2·6H2O, the manganese salt is MnCl2·4H2O, the zinc salt is ZnCl2, and the iron salt is FeCl3·6H2O.

[0011] Preferably, in step S2, the hydrothermal reaction temperature is 90-95 ℃, and the time is 8-9 h.

[0012] Preferably, after step S2 is completed, i.e., after the hydrothermal reaction is completed, the post-processing process is as follows: cooling to room temperature, washing, drying, heating and annealing to finally obtain foam nickel high-entropy.

[0013] Furthermore, the nickel foam sample was rinsed with deionized water and dried at 60-65 °C. After drying, the sample was annealed in air at a heating rate of 5 °C / min for 3 hours to obtain nickel foam@high entropy.

[0014] Preferably, in step S3, glyoxal is used as a reducing agent to introduce oxygen vacancies. The glyoxal solution is prepared as follows: glyoxal is dissolved in deionized water, and the volume ratio of glyoxal to deionized water is 1:60-65.

[0015] Preferably, in step S3, the nickel foam@high entropy is immersed in glyoxal solution, the hydrothermal reaction temperature is 90-110℃, and the time is 6-8h.

[0016] Preferably, after completing step S3, i.e. after the hydrothermal reaction is completed, the post-processing is as follows: cooling to room temperature, rinsing, and drying to finally obtain nickel foam@rich in oxygen vacancies and high entropy.

[0017] Preferably, in step S4, the nickel foam@oxygen-rich high-entropy is immersed in PEI solution at room temperature for 12-18 hours, then washed with deionized water 1-4 times, and dried at 40-70°C for 6-8 hours.

[0018] Preferably, in step S4, the PEI solution is prepared as follows: PEI is dissolved in deionized water, and the mass-to-volume ratio of PEI to deionized water is 1 g: 180-200 mL.

[0019] Preferably, in step S5, a mixed solution of nickel foam@oxygen-vacancy-rich high-entropy@PEI and ammonium tetrathiomolybdate is reacted at 180-220℃ for 1-1.5 days to obtain nickel foam@oxygen-vacancy-rich high-entropy@MoS2. After washing with deionized water and anhydrous ethanol 1-4 times, it is dried at 40-70℃ for 6-8 hours to obtain the microwave absorbing functional layer.

[0020] Preferably, in step S5, ammonium tetrathiomolybdate is dissolved in... N, N The dimethylformamide process involves mixing ammonium tetrathiomolybdate with... N, N In dimethylformamide, ammonium tetrathiomolybdate was completely dissolved by ultrasonication to obtain a mixed solution of ammonium tetrathiomolybdate. This solution was then magnetically stirred at room temperature to ensure uniform dispersion. N, N -Dimethylformamide; wherein, ammonium tetrathiomolybdate and N, N The mass-to-volume ratio of dimethylformamide is 1 g: 550-600 mL.

[0021] A heat dissipation and wave absorption structure includes a heat dissipation and wave absorption component having a wave absorption functional layer prepared by the above-described preparation method, and further includes, a shell sleeved on the wave-absorbing functional layer, a cooling liquid flow channel formed in the wave-absorbing functional layer, the two end sides of the shell are open and communicate with the cooling liquid flow channel.

[0022] Preferably, the heat-dissipating wave-absorbing structure further comprises, two connecting members each fixed and sealed to the open ends of the shell, and, each of the connecting members comprises, a baffle fixed to the open end of the shell and sealed to the open end of the shell; a drainage groove formed on the baffle and corresponding to the cooling liquid flow channel.

[0023] Preferably, each of the connecting members further comprises, a spring fixed to the top of the baffle and having a spring cavity extending in the same direction as the spring, a connecting block fixedly installed on the top of the spring and having a connecting block cavity extending in the same direction as the connecting block, the connecting block cavity being in communication with the spring cavity, and the end of the spring cavity being open into the drainage groove; the heat-dissipating wave-absorbing structure further comprises, a cooling member in communication with the connecting block cavity through a pipeline.

[0024] Preferably, the cooling member comprises, a support frame fixed to the upper surface of the shell through an adsorption member, a drainage pipe arranged on the support frame, a cooling tank arranged on the support frame, a water pump arranged on the support frame, one end of the drainage pipe being in communication with the cooling tank, the other end of the drainage pipe being connected into a support cavity in the support frame, the other end of the cooling tank being in communication with a first pipeline, the other end of the first pipeline being connected into the support cavity and in communication with the input end of the water pump, the output end of the water pump being in communication with a second pipeline, the other end of the second pipeline being connected into the support cavity in the support frame, and the side wall of the support cavity connected by the drainage pipe corresponding to the side wall of the support cavity connected by the second pipeline; the other end of the second pipeline being connected into the support cavity in the support frame and in communication with the connecting member on one side, the connecting member being in communication with the cooling liquid flow channel, the other end of the cooling liquid flow channel being in communication with the other connecting member and the drainage pipe, so that the water storage tank, the first pipeline, the water pump, the second pipeline, the connecting member, the cooling liquid flow channel, the other connecting member and the drainage pipe form a cooling circulation channel.

[0025] Preferably, a cover plate is fixedly installed above the support frame; The adsorption member comprises, A guide column extends in a vertical upward direction, and a first suction disc is arranged at the top end of the guide column, and a second suction disc is arranged at the bottom end of the guide column, The guide column is sequentially inserted into the heat dissipation wave-absorbing member, the support frame and the cover plate in a vertical upward direction, the first suction disc extends out of the upper surface of the cover plate, and the second suction disc extends out of the lower surface of the heat dissipation wave-absorbing member. The guide column has a gas channel extending in the extending direction of the guide column itself, and the upper and lower ends of the gas channel are respectively open to the first suction disc and the second suction disc.

[0026] Preferably, the heat dissipation wave-absorbing structure further comprises, A sealing member is arranged between the adsorption member and the cover plate, the support frame and the heat dissipation wave-absorbing member respectively.

[0027] Preferably, the sealing member comprises, A plurality of fan-shaped columns are arranged on the upper surface of the heat dissipation wave-absorbing member in a circumferential direction, and gaps are formed between the two adjacent fan-shaped columns, and a vertical installation channel is formed between the two adjacent fan-shaped columns, the installation channel is open in the vertical direction and is located between the heat dissipation wave-absorbing member and the support frame, and the guide column passes through the opening and enters the installation channel, and then enters the lower surface of the heat dissipation wave-absorbing member. A sealing ball is arranged on the first suction disc and blocks the opening of the gas channel on the first suction disc. A circular cover is fixed on the sealing ball and is located on the upper surface of the cover plate and blocks the sealing ball.

[0028] Compared with the prior art, the present application has the following advantages: 1. In the present application, the wave-absorbing functional layer in the heat dissipation wave-absorbing structure is prepared by using foamed nickel as a frame to prepare foamed nickel@oxygen vacancy-rich high-entropy@MoS2. The foamed nickel has a porous structure, which increases the surface area for heat dissipation. However, the prepared foamed nickel@oxygen vacancy-rich high-entropy@MoS2 does not fill the porous structure of the foamed nickel and does not affect the heat dissipation performance. The foamed nickel@oxygen vacancy-rich high-entropy@MoS2 has the function of absorbing electromagnetic waves.

[0029] 2. In the present application, the circulating cooling system is composed of a wave-absorbing functional layer, a drainage groove, a spring cavity in a spring, a connecting block cavity in a connecting block, a drainage pipe, a cooling box and a water pump. Through the circulation of the cooling liquid, efficient heat dissipation is achieved. The cooling liquid flows through the wave-absorbing functional layer to absorb heat, and then flows through the spring with a spiral structure, which not only reduces the flow speed of the cooling liquid, but also increases the contact area between the cooling liquid and the air, optimizes the fluid path and the heat exchange interface. In the case of not relying on additional energy, the overall cooling performance of the system is enhanced, thereby significantly improving the heat release efficiency.

[0030] 3. In this invention, pressing the cooling component compresses the spring and the first suction cup. The spring pushes the heat dissipation and wave-absorbing component downwards, and the first suction cup is pressed tightly onto the surface of the electronic device. The heat dissipation and wave-absorbing component has a groove, the size of which matches the size of the first suction cup after adsorption, to avoid gaps between the wave-absorbing functional layer and the surface of the electronic device. After releasing the cooling component, the second suction cup is tangent to the sealing ball, which obstructs the connection between the vent and the outside air. The spatial position of the cooling component is relatively fixed, while the elastic force of the spring reacts with the wave-absorbing functional layer of the heat dissipation and wave-absorbing component, improving the contact between the wave-absorbing functional layer and the surface of the electronic device. When disassembling, pressing the cooling component separates the second suction cup from the sealing ball, and the first suction cup connects to the outside air through the vent. The first suction cup loses its adsorption properties, and the heat dissipation and wave-absorbing device can be easily installed or disassembled. At the same time, it avoids excessive compression of the internal space of the electronic device by the threaded connection, which could cause malfunctions and affect the normal operation of the electronic device. Attached Figure Description

[0031] Figure 1 This is a scanning electron microscope image of the microwave absorption functional layer in this invention; Figure 2 This is a shielding effectiveness curve of the absorbing functional layer in this invention; Figure 3 This is a three-dimensional structural diagram of the heat dissipation and wave absorption structure in this invention; Figure 4 This is a front view of the heat dissipation and wave absorption structure in this invention; Figure 5 This is a vertical cross-sectional view of the heat dissipation and wave absorption structure in this invention; Figure 6 This is a horizontal cross-sectional view of the heat dissipation and wave absorption component in the heat dissipation and wave absorption structure of the present invention; Figure 7 This is a schematic diagram of the cooling component in the heat dissipation and wave absorption structure of the present invention; Figure 8 This is a horizontal cross-sectional view of the cooling component in the heat dissipation and wave absorption structure of the present invention; Figure 9 This is an exploded view of the heat dissipation and wave absorption structure in this invention; Figure 10 for Figure 9 Enlarged structural diagram of section A; Figure 11 This is a schematic diagram of the spring and connecting block structure in this invention; Figure 12 This is a schematic diagram of the coolant circulation flow in this invention; Figure 13 This is a schematic diagram showing the state of the water pump mounted on the fixed plate in this invention.

[0032] In the figure: heat dissipation wave absorbing component 1; wave absorbing functional layer 101; first channel 102; shell 103; connecting component 2; baffle 201; drainage groove 202; spring 203; connecting block 204; adsorbing component 3; guide column 301; first suction cup 302; second suction cup 303; gas channel 304; cooling component 4; support frame 401; drainage pipe 402; cooling box 403; fan-shaped hole 404; second channel 405; water pump 406; sealing component 5; fixed column 501; fan-shaped column 5011; gap 5012; mounting channel 5013; round cover 502; sealing ball 503; cover plate 6. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, purposes and effects realized by the present application easy to understand, the technical solutions of the present application are specifically described below in conjunction with the drawings. It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation on the present application.

[0034] Embodiment 1 A preparation method of a wave absorbing functional layer, comprising the following steps: S1: placing the foamed nickel in a 5 M HCl (1.823 g of pure hydrochloric acid and 10 mL of deionized water) solution and ultrasonic cleaning for 20 min to remove the NiO layer on the surface, then rinsing with deionized water and anhydrous ethanol several times until neutral; S2: under magnetic stirring, dissolving CoCl2·6H2O (0.2 mmol), NiCl2·6H2O (0.2 mmol), MgCl2·6H2O (0.2 mmol), MnCl2·4H2O (0.2 mmol), ZnCl2 (0.2 mmol), FeCl3·6H2O (2 mmol), and 0.7 g of urea in 35 mL of deionized water, transferring the prepared solution to a 50 mL high-pressure reaction kettle lined with polytetrafluoroethylene, and vertically immersing the pretreated foamed nickel into the reaction solution; S3: placing the foamed nickel in the reaction solution, setting the temperature to 95 ℃, keeping for 8 h, then cooling to room temperature, then rinsing the foamed nickel sample with deionized water, drying the foamed nickel sample at 60 ℃, after drying, heating at a rate of 5 ℃ / min in an air environment, and annealing at 400 ℃ for 3 h to prepare foamed nickel @ Co 0.2 Ni 0.2 Mg 0.2 Mn 0.2 Zn 0.2 Fe2O4 high-entropy oxide (abbreviated as foamed nickel @ high-entropy); S4: Put the 25-35 mm*25-35 mm*0.5-1 mm nickel foam@high-entropy into a mixed solution of glyoxal (0.5 mL) and deionized water (30 mL), and after ultrasonic treatment for 10 min, the mixture was transferred into a 50 mL high-pressure reactor lined with polytetrafluoroethylene, and reacted at 100 ℃ for 6 h, then the nickel foam@oxygen vacancy-rich high-entropy sample was washed with deionized water and ethanol, and the sample was dried at 60 ℃; S5: Dissolve PEI (0.25 g) in 45.74 mL deionized water to obtain nickel foam@oxygen vacancy-rich high-entropy@PEI, and after soaking at room temperature for more than 12 h, the nickel foam@oxygen vacancy-rich high-entropy@PEI was washed with deionized water for 3 times, and dried at 60 ℃ for more than 6 h; S6: Mix ammonium tetrathiomolybdate (0.05 g) in 30 mL N, N dimethylformamide, and after ultrasonic treatment until the ammonium tetrathiomolybdate was completely dissolved, magnetic stirring was carried out at room temperature for 20 min to disperse uniformly, then the nickel foam@oxygen vacancy-rich high-entropy@PEI was vertically placed into a 50 mL high-pressure reactor lined with polytetrafluoroethylene, and after adding the above solution, it was reacted at 200 ℃ for 24 h to obtain nickel foam@oxygen vacancy-rich high-entropy@MoS2, then the prepared nickel foam@oxygen vacancy-rich high-entropy@MoS2 was washed with deionized water and ethanol for 3 times in sequence, and dried at 60 ℃ for more than 6 h to obtain the product. The scanning electron microscope image of the nickel foam@oxygen vacancy-rich high-entropy@MoS2 prepared in the above example is shown in Figure 1 The left image is the initial nickel foam material, which has a porous structure and a smooth surface. The right image is the nickel foam@oxygen vacancy-rich high-entropy@MoS2, which has a complex three-dimensional network structure, and the uneven surface morphology helps to enhance the electromagnetic wave absorption capacity.

[0035] The shielding effectiveness curve is shown in Figure 2As shown in the figure, when -90° < theta < -5° and 5° < theta < 90°, the radar cross section (RCS) values are both less than -10 dB, and the maximum value is close to -80 dB, indicating that the sample has extremely strong shielding effectiveness at multiple angles. Nickel foam@oxygen vacancy-rich high entropy@MoS2 has a strong radar loss ability. On the one hand, the oxygen vacancies rich in the high entropy can induce interfacial polarization and electron relaxation, thereby enhancing dielectric loss and optimizing impedance matching, significantly improving the efficiency of electromagnetic energy conversion into heat energy, and further enhancing the wave absorption performance. On the other hand, nickel foam@oxygen vacancy-rich high entropy@MoS2 is coated in a core-shell structure. In the formed composite material, the nickel foam, oxygen vacancy-rich high entropy, and MoS2 layers can form a tight interface, enabling multiple reflections and interfacial polarization of electromagnetic waves inside the material. The synergistic effect of multiple loss mechanisms can effectively attenuate the electromagnetic wave energy, thereby reducing the radar scattering signal. Moreover, the multi-components in the composite material can also improve the impedance matching degree, making the prepared nickel foam@oxygen vacancy-rich high entropy@MoS2 not only have a high electromagnetic wave absorption efficiency but also have advantages such as a wide effective absorption frequency band and good impedance matching performance.

[0036] Example 2 As Figures 3-13 shown, a heat dissipation and wave absorption structure includes a heat dissipation and wave absorption component 1, on which there is a wave absorption functional layer 101 prepared by the preparation method described in Example 1. Specifically: the wave absorption functional layer 101 in the heat dissipation and wave absorption component 1 uses nickel foam as a framework. The nickel foam has a porous structure that increases the surface area for heat dissipation, and the coolant can freely flow through the nickel foam to带走 heat, making it have good heat dissipation performance. At the same time, using materials such as CoCl2·6H2O (0.2 mmol), NiCl2·6H2O (0.2 mmol), MgCl2·6H2O (0.2 mmol), MnCl2·4H2O (0.2 mmol), ZnCl2(0.2 mmol), FeCl3·6H2O (2 mmol), glyoxal, ammonium tetrathiomolybdate, etc., the nickel foam is prepared into nickel foam@oxygen vacancy-rich high entropy@MoS2 with excellent wave absorption performance. It also includes, a housing 103, which is sleeved outside the wave absorption functional layer 101. Specifically: the surface of the wave absorption functional layer 101 is wrapped by the housing 103. The housing 103 is a thin-walled structure made of a material with good thermal conductivity, such as copper, which effectively conducts the heat generated by the electronic device to the wave absorption functional layer 101, while preventing the coolant from leaking and damaging the electronic device; a coolant flow channel 104 is formed inside the wave absorption functional layer 101. Specifically: the rectangular parallelepiped wave absorption functional layer 101 is provided with 4 coolant flow channels 104 to facilitate the coolant to flow into the inside of the wave absorption functional layer 101 to带走 heat; The two end walls of the shell 103 are open and communicate with the cooling liquid flow channel 104.

[0037] The heat-dissipating wave-absorbing structure further comprises, two connecting members 2, each of which is fixed and seals the open end of the shell 103, and, Each connecting member 2 comprises, a baffle 201 fixed at the open end of the shell 103 and sealing the open end of the shell 103; a drainage groove 202 formed on the baffle 201 and corresponding to the cooling liquid flow channel 104; specifically, the drainage groove 202 corresponds to the cooling liquid flow channel 104 in the wave-absorbing functional layer 101, and the upper surface of the baffle 201 is fixed with the connecting block 204 by welding. Each connecting member 2 further comprises, a spring 203 fixed at the top of the baffle 201 and having a spring cavity extending in the same direction as itself inside, a connecting block 204 fixedly installed at the top of the spring 203 and having a connecting block cavity extending in the same direction as itself inside, the connecting block cavity being in communication with the spring cavity, and the end of the spring cavity being open into the drainage groove 202; specifically, the connecting block 204 is fixedly connected with one end of the spring 203 by welding, the other end of the spring 203 is fixedly installed with the connecting block 204 by welding, and the spring 203 and the connecting block 204 are both hollow structures in communication with the drainage groove 202, the spring 203 serving as a cooling liquid flow channel can increase the contact area between the cooling liquid and the air; The heat-dissipating wave-absorbing structure further comprises, a cooling member 4 in communication with the connecting block cavity through a pipeline; specifically, the two connecting members 2 are fixedly installed at the left and right end faces of the wave-absorbing functional layer 101 respectively, the baffle 201 in the connecting member 2 is provided with four drainage grooves 202, the four drainage grooves 202 correspond to the four cooling liquid flow channels 104 in the wave-absorbing functional layer 101, the upper surface of the baffle 201 is fixedly installed with the connecting block 204 by welding, the connecting block 204 is fixedly installed with four springs 203, the two ends of the spring 203 are fixedly installed with the connecting block 204 respectively, the spring 203 and the connecting block 204 are both hollow structures in communication with the drainage groove 202, the upper surface of the connecting block 204 is fixedly installed with an X-shaped support frame 401 by welding, the spring 203 not only provides the necessary elastic force for the cooling member 4, but also has a spiral structure to increase the contact area with the air, and when the cooling liquid flows inside the spring 203, the flow speed of the cooling liquid is reduced, the contact area between the cooling liquid and the air is increased, and the heat carried by the cooling liquid is released into the air; in addition, the spring 203 and the connecting block 204 also have the functions of supporting the cooling member 4, the cover plate 6 and the sealing member 5 (as shown inFigures 3-5 The cooling member 4 includes,

[0038] The cooling member 4 includes, The support frame 401 is fixed on the upper surface of the shell 103 by the adsorption member 3, The drainage pipe 402 is arranged on the support frame 401, The cooling box 403 is arranged on the support frame 401, The water pump 406 is arranged on the support frame 401, and one end of the drainage pipe 402 is connected with the cooling box 403, and the other end is connected into the support chamber in the support frame 401, the other end of the cooling box 403 is connected with the first pipeline, the other end of the first pipeline enters the support chamber and is connected with the input end of the water pump 406, the output end of the water pump 406 is connected with the second pipeline, the other end of the second pipeline enters the support chamber in the support frame 401, and the side wall where the support chamber connected by the drainage pipe 402 is located corresponds to the side wall where the support chamber connected by the second pipeline is located; specifically, the number of the water pump 406 is two, and the water pump 406 is fixed on the support frame 401 by the fixing plate through bolts (more specifically, each water pump has a water pump fixing lug, which is fixed on the support frame 401 by installing bolts on the water pump fixing lug and the fixing plate, and specifically as Figure 13 shown, and in order to install two water pumps 406 on the same fixing plate, the two water pump fixing lugs on the water pump 406 are diagonally installed on the fixing plate, and the two water pump fixing lugs on the two water pumps are installed on the fixing plate in staggered manner), in addition, the shape of the support frame 401 is “ ” type structure, in addition, the other end of the second pipeline enters the support chamber in the support frame 401 and is connected with one side of the connecting block chamber, the spring chamber is connected with the cooling liquid flow channel 104, the other end of the cooling liquid flow channel 104 is connected with the other connecting block chamber, and then the other spring chamber and the third connecting block chamber are connected with the drainage pipe to form a cooling circulation channel for the cooling box 403 (in addition, it should be noted that the cooling box 403 is respectively provided with a cooling liquid adding port and a cooling liquid outlet port, and the cooling liquid adding port and the cooling liquid outlet port are sealed by an oil tank cover similar to that used for sealing the oil filling port of a car, which is used to add or discharge cooling liquid into the cooling box 403), the first pipeline, the water pump 406, the second pipeline, the connecting block chamber on one of the springs 203, the spring chamber, the connecting block chamber under one of the springs 203, the cooling liquid flow channel, the connecting block chamber under the other spring 203, the other spring chamber, the connecting block chamber on the other spring 203, and the drainage pipe 402.

[0039] The cover plate 6 is fixedly installed on the support frame 401 by welding; The adsorption member 3 includes, a guide column 301 extending in a vertical upward direction, and having a first suction disc 302 at its top end and a second suction disc 303 at its bottom end, The guide column 301 is sequentially inserted into the heat-dissipating wave-absorbing member 1, the support frame 401 and the cover plate 6 in a vertical upward direction, the first suction disc 302 extends out of the upper surface of the cover plate 6, and the second suction disc 303 extends out of the lower surface of the heat-dissipating wave-absorbing member 1; specifically, the heat-dissipating wave-absorbing member 1 has a first channel 102 thereon, which is open along the upper and lower surfaces of the heat-dissipating wave-absorbing member 1 in a vertical direction, the guide column 301 is inserted into the first channel 102 and fixed to the lower surface of the heat-dissipating wave-absorbing member 1 with the second suction disc 303; more specifically, the guide column 301 (made of metal) is movably connected to the first channel 102 and has the same size, the first suction disc 302 is fixedly installed at the lower end of the guide column 301 by epoxy acrylate adhesive, the first suction disc 302 can be adsorbed on the surface of the electronic device by atmospheric pressure, the second suction disc 303 is fixedly installed at the upper end of the guide column 301 by epoxy acrylate adhesive, the guide column 301 is made of metal material, the first suction disc 302 and the second suction disc 303 are made of butadiene-acrylonitrile rubber material, and the epoxy acrylate adhesive can realize high-strength connection between the metal material and the butadiene-acrylonitrile rubber material; in addition, the support frame 401 has a second channel 405 in the middle, which extends in a vertical direction and is open to the upper and lower surfaces of the support frame 401 respectively, for the adsorbing member 3 to pass through.

[0040] The guide column 301 has a gas channel 304 extending in the same direction as the guide column 301, and the upper and lower ends of the gas channel 304 are open to the first suction disc 302 and the second suction disc 303 respectively.

[0041] The heat-dissipating wave-absorbing structure further comprises, The sealing member 5 is used for sealing between the adsorbing member and the cover plate 6, the support frame 401 and the heat-dissipating wave-absorbing member 1 respectively.

[0042] The sealing member 5 comprises, The fixing column 501 is arranged on the upper surface of the heat dissipation wave absorbing member 1 by a plurality of fan-shaped columns 5011, gaps 5012 are formed between the fan-shaped columns 5011, and a vertical mounting channel 5013 is formed in the middle of the fan-shaped columns 5011, the mounting channel 5013 is open in the vertical direction, the guide column 301 between the heat dissipation wave absorbing member 1 and the support frame 401 enters the mounting channel 5013 through the opening, and then enters the lower surface of the heat dissipation wave absorbing member 1, in addition, a plurality of fan-shaped holes 404 are formed in the support frame 401, the fan-shaped holes 404 extend in the vertical direction and are open on the upper and lower surfaces of the support frame 401, and the plurality of fan-shaped holes 404 correspond to the plurality of fan-shaped columns 5011, so that the fan-shaped columns 5011 pass through the fan-shaped holes 404, that is, the fixing column 501 and the fan-shaped hole 404 are movably connected through the gap between the column and the groove. The sealing ball 503 is arranged on the first suction disc 302 and seals the opening of the gas channel 304 on the first suction disc 302, specifically, the surface of the sealing ball 503 is tangent to the arc surface of the second suction disc 303, and has good air tightness. The circular cover 502 is fixed on the sealing ball 503 (as shown in Figure 2 , specifically, the circular cover 502 is fixed on the sealing ball 503 by screws), and is located on the upper surface of the cover plate 6 and seals the sealing ball 503, specifically, the circular cover 503 is a thin-walled hemispherical structure, the circular cover 502 with a thin-walled hemispherical structure is fixed on the fixing column 501 by welding, and the sealing ball 503 is fixed on the inner concave surface of the circular cover 502 by bolts, and the sealing ball 503 is made of soft rubber material.

[0043] When the spring 203 is compressed relative to the upward and downward movement of the heat dissipation wave absorbing member 1 and the sealing member 5, the spring 203 generates an upward force on the first suction disc 302, which reacts on the wave absorbing functional layer 101, so that the wave absorbing functional layer 101 generates a downward force to tightly adhere to the surface of the electronic equipment, improves the heat transfer efficiency of the wave absorbing functional layer 101, and the spring 203 generates an upward force on the second suction disc 303 to make the tangent surface between the second suction disc 303 and the sealing ball 503 more closely matched, and further improves the adhesion of the first suction disc 302 to the wave absorbing functional layer 101.

[0044] In the present application, the adsorption member 3 and the cooling member 4 can move up and down relative to the heat dissipation wave absorbing member 1 under the action of the spring 203, and when installed, the spring 203 and the first suction disc 302 are compressed by pressing the cooling member 4, the spring 203 pushes the heat dissipation wave absorbing member 1 to move downward, the first suction disc 302 is compressed and tightly adheres to the surface of the electronic equipment, and the heat dissipation wave absorbing member 1 is provided with a groove (not shown in the figure), the size of the groove is matched with the first suction disc 302 after adhesion, so as to avoid the gap between the wave absorbing functional layer 101 and the surface of the electronic equipment; After the release of the cooling member 4, the second suction cup 303 is tangent to the sealing ball 503, the sealing ball 503 blocks the connection of the gas channel 304 with the outside air, and the spatial position of the cooling member 4 is relatively fixed, and the elastic force of the spring 203 reacts with the wave-absorbing functional layer 101 of the heat dissipation wave-absorbing member 1, improving the contact between the wave-absorbing functional layer 101 and the surface of the electronic device. When disassembling, press the cooling member 4 to separate the second suction cup 303 from the sealing ball 503, the first suction cup 302 is connected with the outside air through the gas channel 304, the first suction cup 302 loses the adsorption, and the heat dissipation wave-absorbing device can be easily removed, avoiding the threaded connection extruding the internal space of the electronic device to cause failure.

[0045] The wave-absorbing functional layer 101 in the heat dissipation wave-absorbing member 1 uses foamed nickel as the frame, the foamed nickel has a porous structure to increase the heat dissipation surface area, the cooling liquid flows through the wave-absorbing functional layer 101 to transfer the heat in the wave-absorbing functional layer 101 to the cooling liquid, the cooling liquid is cooled by the drainage groove 202, the spring 203, the connecting block 204, the drainage pipe 402 and the cooling box 403, the spiral structure of the spring 203 not only reduces the flow speed of the cooling liquid when the cooling liquid flows from the inside of the spring 203, but also increases the contact area of the cooling liquid with air, improving the efficiency of the cooling liquid releasing heat to the air, and the foamed nickel rich in oxygen vacancy high entropy MoS2 prepared by using CoCl2·6H2O (0.2 mmol), NiCl2·6H2O (0.2 mmol), MgCl2·6H2O (0.2 mmol), MnCl2·4H2O (0.2 mmol), ZnCl2 (0.2 mmol), FeCl3·6H2O (2 mmol), glyoxal, ammonium tetrathiomolybdate, foamed nickel and other materials can effectively absorb electromagnetic waves.

[0046] The above embodiments are preferred cases of the present application and do not limit the protection scope of the present application. Various modifications or changes made by those skilled in the art within the scope of the appended claims without creative labor are still within the protection scope of the present patent.

Claims

1. A method for preparing a wave-absorbing functional layer, characterized in that, The method comprises the following steps: S1. mixing urea and metal ions to obtain a mixture, and mixing the mixture with deionized water to obtain a mixed solution; S2. vertically immersing the pretreated foamed nickel into the mixed solution in step S1 to obtain a foamed nickel sample through hydrothermal reaction, and obtaining foamed nickel high-entropy through post-processing; S3. adding the foamed nickel high-entropy in step S2 into a mixed solution of glyoxal and deionized water to obtain foamed nickel rich in oxygen vacancy high-entropy through hydrothermal reaction; S4. immersing the foamed nickel rich in oxygen vacancy high-entropy in step S3 in a polyethyleneimine (PEI) solution, and obtaining foamed nickel rich in oxygen vacancy high-entropy@PEI through cleaning and drying; S5. Dissolve ammonium tetrathiomolybdate in N, N In dimethylformamide, nickel foam@oxygen-vacancy-rich high-entropy@PEI from step S4 is soaked again, followed by solvothermal reaction, cleaning, and drying to obtain a microwave absorbing functional layer, namely nickel foam@oxygen-vacancy-rich high-entropy@MoS2.

2. The method according to claim 1, wherein: in step S1, the metal ions are cobalt salt, nickel salt, magnesium salt, manganese salt, zinc salt and iron salt; the molar ratio of the cobalt salt, nickel salt, magnesium salt, manganese salt, zinc salt and iron salt is 1:1:1:1:1:10; and the molar ratio of the metal ions to urea is 1:4-5.

3. The method according to claim 1, wherein: in step S4, the foamed nickel rich in oxygen vacancy high-entropy is immersed in the PEI solution at room temperature for 12-18 h, and then cleaned with deionized water for 1-4 times and dried at 40-70 ℃ for 6-8 h.

4. The method according to claim 1, wherein: in step S5, the foamed nickel rich in oxygen vacancy high-entropy@PEI is mixed with an ammonium tetrathiomolybdate solution and reacted at 180-220 ℃ for 1-1.5 d to obtain foamed nickel rich in oxygen vacancy high-entropy@MoS2, which is then cleaned with deionized water and anhydrous ethanol for 1-4 times and dried at 40-70 ℃ for 6-8 h to obtain the wave-absorbing functional layer.

5. A heat-dissipating wave-absorbing structure comprising a heat-dissipating wave-absorbing component having a wave-absorbing functional layer prepared by the method of any one of claims 1-4, and further comprising: a shell sleeved on the wave-absorbing functional layer, a cooling liquid channel formed in the wave-absorbing functional layer, and both ends of the shell being open and communicating with the cooling liquid channel.

6. The heat-dissipating wave-absorbing structure according to claim 5, wherein: the heat-dissipating wave-absorbing structure further comprises: two connecting components each fixedly and sealingly connecting the two open ends of the shell, and each connecting component comprises: a baffle fixedly and sealingly connected to the open end of the shell, and a drainage groove formed on the baffle and corresponding to the cooling liquid channel.

7. The heat-dissipating wave-absorbing structure according to claim 6, wherein: each connecting component further comprises: a spring fixedly connected to the top of the baffle and having a spring cavity extending in the same direction as the spring, and a connecting block fixedly connected to the top of the spring and having a connecting block cavity extending in the same direction as the connecting block, the connecting block cavity and the spring cavity being in communication, and the end of the spring cavity being open to the drainage groove. The heat-dissipating wave-absorbing structure further comprises, a cooling member in communication with the connecting block cavity through a pipeline.

8. The heat-dissipating wave-absorbing structure according to claim 7, wherein: the cooling member comprises, a support frame fixed to the upper surface of the shell through the adsorption member, a drainage pipe arranged on the support frame, a cooling tank arranged on the support frame, a water pump arranged on the support frame, and one end of the drainage pipe is in communication with the cooling tank, and the other end is connected into the support cavity in the support frame, the other end of the cooling tank is in communication with the first pipeline, the other end of the first pipeline enters the support cavity and is in communication with the input end of the water pump, the output end of the water pump is in communication with the second pipeline, the other end of the second pipeline enters the support cavity in the support frame, and the side wall of the support cavity connected by the drainage pipe corresponds to the side wall of the support cavity connected by the second pipeline; the other end of the second pipeline is in communication with the connecting member on one side after entering the support cavity in the support frame, the connecting member is in communication with the cooling liquid flow channel, the other end of the cooling liquid flow channel is in communication with the other connecting member, and the other connecting member is in communication with the drainage pipe, so as to form a cooling circulation channel of the water storage tank, the first pipeline, the water pump, the second pipeline, the connecting member, the cooling liquid flow channel, the other connecting member and the drainage pipe.

9. The heat-dissipating wave-absorbing structure according to claim 8, characterized in that: a cover plate is fixedly installed above the support frame; the adsorption member comprises, a guide column extending in a vertical upward direction, and having a first suction cup at the top end and a second suction cup at the bottom end, the guide column is sequentially inserted into the heat-dissipating wave-absorbing member, the support frame and the cover plate in a vertical upward direction, the first suction cup extends out of the upper surface of the cover plate, and the second suction cup extends out of the lower surface of the heat-dissipating wave-absorbing member; the guide column has a gas passage extending in the direction of the guide column itself, and the upper and lower ends of the gas passage are respectively open to the first suction cup and the second suction cup.

10. The heat-dissipating wave-absorbing structure according to claim 9, characterized in that: the heat-dissipating wave-absorbing structure further comprises, a sealing member for sealing between the adsorption member and the cover plate, the support frame and the heat-dissipating wave-absorbing member, respectively.

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