A core piece pre-stacking system and a core piece pre-stacking control method

Abstract

The application discloses a core piece pre-stacking system and a core piece pre-stacking control method, and relates to the field of transformer production.The core piece pre-stacking system comprises a two-way displacement mechanism installed on the bearing surface of a centering platform and controlled by a controller to move the core piece so that the center position of the core piece coincides with the center position of the centering platform, and a first grabbing mechanism controlled to translate the moved core piece carried on the bearing surface of the centering platform to a pre-stacking platform.The application moves the core piece based on the two-way displacement mechanism so that the center position of the core piece coincides with the center position of the centering platform, and the centering platform and the pre-stacking platform are arranged in parallel and have the same shape and size, so that the center positions of the core pieces on the pre-stacking platform all coincide after being translated by the first grabbing mechanism, and then in the subsequent core production process, the stacked core pieces on the pre-stacking platform are assembled with other core pieces that have been completed to improve the production efficiency of the core and the transformer.

Description

Technical Field

[0001] This application relates to the field of transformer manufacturing technology, and in particular to a pre-stacking system and control method for iron chip pre-stacking. Background Technology

[0002] The iron core is the core component of the transformer's magnetic circuit system. To reduce eddy current losses, most existing iron cores are manufactured by manually stacking iron laminations, where different sized iron laminations located at the core column and yoke positions are stacked layer by layer in sequence.

[0003] However, because transformers require a large number of iron cores, such as large transformers with a capacity greater than 8000kVA which require thousands of iron cores, the existing manual stacking method of iron core production suffers from low production efficiency. Summary of the Invention

[0004] In view of the above problems, this application provides a pre-stacking system and control method for iron cores to improve iron core production efficiency. The specific solution is as follows:

[0005] The first aspect of this application provides a pre-stacking system for iron chips, comprising:

[0006] A centering platform and a pre-stacking platform of the same shape and size, as well as a first gripping mechanism and a controller;

[0007] The centering platform is equipped with a two-way displacement mechanism on its bearing surface, which is used to move the iron chip placed on the bearing surface.

[0008] The first gripping mechanism is positioned between the centering platform and the pre-overlay platform, which are arranged in parallel.

[0009] The controller is electrically connected to the centering platform and the first gripping mechanism respectively. The controller is used to control the two-way displacement mechanism of the centering platform to move the iron chip so that the center position of the iron chip coincides with the center position of the centering platform. It is also used to control the first gripping mechanism to translate the moved iron chip carried by the bearing surface to the pre-stacked platform.

[0010] In one possible implementation, the first grasping mechanism includes:

[0011] A vacuum adsorption device, wherein the vacuum adsorption device is electrically connected to the controller.

[0012] In one possible implementation, the vacuum adsorption device includes:

[0013] Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor;

[0014] The grating-type height detection sensor is mounted on the side surface of the bracket and is used to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface.

[0015] Each of the vacuum suction cups is mounted longitudinally on the contact surface of the bracket, and the contact surface is parallel to the bearing surface;

[0016] The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through an air guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump.

[0017] The controller is connected to the grating height detection sensor, each of the vacuum regulating valves and the vacuum pump respectively. The controller is also used to determine the opening degree of the vacuum regulating valve based on the thickness of the iron chip collected by the grating height detection sensor, and to control the start and stop of the vacuum pump.

[0018] In one possible implementation, the bidirectional displacement mechanism includes:

[0019] The device includes a ranging sensor, a first displacement device in a first direction, and a second displacement device in a second direction, wherein both the first and second directions are parallel to the bearing surface, and the first direction is perpendicular to the second direction.

[0020] The controller is electrically connected to the ranging sensor, the first displacement device, and the second displacement device respectively. The controller is also used to control the first displacement device and the second displacement device to move the iron chip in the first direction and the second direction according to the boundary distance between the iron chip and the bearing surface collected by the ranging sensor, so that the center position of the iron chip coincides with the center position of the centering platform. The boundary distance is the distance between each side of the iron chip and the side of the bearing surface closest to the side.

[0021] In one possible implementation, the iron chip pre-stacking system further includes:

[0022] The second gripping mechanism includes the same vacuum adsorption device as the first gripping mechanism;

[0023] The controller is also electrically connected to the controller, and the controller is also used to control the second gripping mechanism to place the iron chip on the bearing surface.

[0024] In one possible implementation, the iron chip pre-stacking system further includes:

[0025] The sheet metal rack includes multiple storage areas of different sizes, which are used to store the iron chips of the appropriate size.

[0026] A second aspect of this application provides a pre-stacking control method for iron chips, applied to a controller in the pre-stacking system for iron chips described in the first aspect and any embodiment of the first aspect. The pre-stacking control method for iron chips includes:

[0027] The two-way displacement mechanism mounted on the bearing surface of the centering platform moves the iron chip so that the center position of the iron chip coincides with the center position of the centering platform.

[0028] The first gripping mechanism, which is positioned between the centering platform and the pre-stacking platform arranged in parallel, moves the iron chip, which has been moved and is supported by the bearing surface, to the pre-stacking platform, which has the same shape and size as the centering platform.

[0029] In one possible implementation, the bidirectional displacement mechanism includes:

[0030] The device includes a ranging sensor, a first displacement device in a first direction, and a second displacement device in a second direction, wherein both the first and second directions are parallel to the bearing surface, and the first direction is perpendicular to the second direction.

[0031] The controller is electrically connected to the ranging sensor, the first displacement device, and the second displacement device, respectively.

[0032] The two-way displacement mechanism installed on the bearing surface of the centering platform moves the iron chip so that the center position of the iron chip coincides with the center position of the centering platform. This includes: controlling the first displacement device and the second displacement device to move the iron chip in the first direction and the second direction according to the boundary distance between the iron chip and the bearing surface collected by the ranging sensor, so that the center position of the iron chip coincides with the center position of the centering platform. The boundary distance is the distance between each side of the iron chip and the side of the bearing surface closest to that side.

[0033] In one possible implementation, the first gripping mechanism, positioned between the parallel-arranged centering platform and the pre-stacking platform, translates the moved iron chip carried on the bearing surface to the pre-stacking platform, including:

[0034] The coordinates of the center position of the centering platform are determined as the gripping position coordinates of the first gripping mechanism, and the coordinates of the center position of the pre-stacked platform are determined as the release position coordinates of the first gripping mechanism.

[0035] A translation path is generated based on the gripping position coordinates and the release position coordinates, and the first gripping mechanism is controlled based on the translation path to translate the moved iron chip carried by the bearing surface from the centering platform to the pre-stack platform.

[0036] In one possible implementation, the first gripping mechanism includes a vacuum adsorption device, the vacuum adsorption device comprising:

[0037] Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor;

[0038] The grating-type height detection sensor is mounted on the side surface of the bracket and is used to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface.

[0039] Each of the vacuum suction cups is mounted longitudinally on the contact surface of the bracket, and the contact surface is parallel to the bearing surface;

[0040] The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through an air guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump.

[0041] The controller is connected to the grating-type height detection sensor, each of the vacuum regulating valves, and the vacuum pump, respectively.

[0042] The iron chip pre-stacking control method further includes:

[0043] Based on the thickness of the iron chip collected by the grating height detection sensor, the opening degree of the vacuum regulating valve is determined, and the vacuum pump is started and stopped.

[0044] By means of the above technical solution, this application provides a pre-stacking system and control method for iron core chips. By configuring a controller to be connected to the centering platform and the first gripping mechanism respectively, the controller controls the two-way displacement mechanism of the centering platform to move the iron core so that the center position of the iron core chip coincides with the center position of the centering platform. By configuring the first gripping mechanism to translate the moved iron core chip to the pre-stacking platform, since the centering platform and the pre-stacking platform have the same shape and size and are arranged in parallel, the center positions of each iron core chip translated to the pre-stacking platform by the first gripping mechanism coincide. Then, in the subsequent iron core production process, the stacked iron core chips carried by the pre-stacking platform are spliced ​​and assembled with other stacked iron core chips, thereby improving the iron core production efficiency. Attached Figure Description

[0045] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0046] Figure 1 This application provides a schematic diagram of the structure of a pre-stacked iron chip system.

[0047] Figure 2 A schematic diagram of the splicing of a first-layer iron chip provided in this application;

[0048] Figure 3 A schematic diagram of the splicing of a second-layer iron chip provided in this application;

[0049] Figure 4 A pre-stacked schematic diagram provided for this application;

[0050] Figure 5 A side view schematic diagram of a multi-axis robotic arm provided for this application;

[0051] Figure 6 This application provides a side view of a sliding rail type lifting device;

[0052] Figure 7 An effect diagram of a pre-stacked lower yoke provided in this application;

[0053] Figure 8 An effect diagram of a pre-stacked upper yoke provided in this application;

[0054] Figure 9 An illustration of a pre-stacked side pillar and core pillar provided in this application;

[0055] Figure 10 Three-view drawings of a vacuum adsorption device provided in this application;

[0056] Figure 11 A schematic diagram illustrating a deployment method for a ranging sensor provided in this application;

[0057] Figure 12 A schematic diagram of a push rod type bidirectional displacement mechanism provided in this application;

[0058] Figure 13 This application provides a structural schematic diagram of a balance wheel-type bidirectional displacement mechanism;

[0059] Figure 14 This application provides a schematic diagram of the structure of a pre-stacked iron chip system.

[0060] Figure 15A flowchart of a pre-stacked control method for iron chips provided in this application;

[0061] Figure 16 This is a schematic diagram of the structure of an electronic device provided in this application. Detailed Implementation

[0062] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0063] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0064] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0065] The first aspect of this application provides a pre-stacked iron chip system, such as... Figure 1 As shown, the iron chip pre-stacking system includes:

[0066] A centering platform 101 and a pre-stacking platform 102 of the same shape and size, as well as a first gripping mechanism 103 and a controller 104;

[0067] A two-way displacement mechanism 105 is installed on the bearing surface of the centering platform 101. The two-way displacement mechanism 105 is used to move the iron chip placed on the bearing surface.

[0068] The first gripping mechanism 103 is positioned between the parallel centering platform 101 and the pre-overlay platform 102;

[0069] The controller 104 is electrically connected to the centering platform 101 and the first gripping mechanism 103 respectively. The controller 104 is used to control the two-way displacement mechanism 105 of the centering platform 101 to move the iron chip so that the center position of the iron chip coincides with the center position of the centering platform 101. It is also used to control the first gripping mechanism 103 to translate the moved iron chip carried on the bearing surface to the pre-stacking platform 102.

[0070] It should be noted that, in practical application scenarios, to facilitate understanding of the pre-stacked iron chips, one possible implementation of this application is described here:

[0071] Taking a single-phase three-limb iron core as an example, such as Figure 2 The diagram shows the assembly of the first layer of iron chips. This layer consists of seven iron chips of different shapes and sizes: Aa, Ab, Af, Ag, Ah, Ak, and Q. Aa and Ab are the iron chips at the yoke (where the coil is not wound), while Af, Ag, Ah, Ak, and Q are the iron chips at the core pillar (where the coil is wound). Figure 3 As shown in the diagram, the composition of the second layer of iron chips is the same as that of the first layer, differing only in the placement of Af, Ag, Ah, Ak, and Q. Existing manual stacking methods require manual alternation between the first and second layers of iron chips. Since each layer requires the assembly of nine iron chips of seven different shapes and sizes, and their positions need to be adjusted according to different layers, this directly leads to low core production efficiency and reduces transformer production efficiency. The pre-stacking method in this application focuses on the location of the iron chips (at the yoke or core post), stacking iron chips of different shapes and sizes at the same location. Taking Af and Ag at the optimal side core post as an example, the pre-stacking diagram is shown below. Figure 4 As shown, by adopting a pre-stacking method, the number of iron core chips to be spliced ​​in a single operation is reduced, the operation process is simplified, and the production efficiency of iron cores is improved.

[0072] It should be noted that in practical applications, during the process of controlling the first gripping mechanism 103 to translate the moved iron chip carried on the bearing surface to the pre-stacking platform 102, it is necessary to ensure that the relative position of the iron chip and the centering platform is completely consistent with the relative position of the iron chip and the pre-stacking platform. Therefore, the aforementioned first gripping mechanism 103 can be a multi-axis robotic arm with gripping function, or a sliding rail lifting device with gripping function.

[0073] In one possible implementation, the side view diagram of the above-mentioned multi-axis robotic arm can be as follows: Figure 5 As shown, the A-axis of the multi-axis robotic arm is used to drive the robotic arm to rotate in a plane direction parallel to the mounting plane of the A-axis; the B-axis, C-axis, and D-axis are used to drive the robotic arm to rotate in a plane direction perpendicular to the mounting plane of the A-axis; and the E-axis is used to drive the gripping component to rotate in a plane direction parallel to the mounting plane of the A-axis.

[0074] In one possible implementation, the side view diagram of the above-mentioned sliding rail lifting device can be as follows: Figure 6As shown, the slide rail 601 is installed above the centering platform 101 and the pre-stacking platform 102, and parallel to the bearing surface of the centering platform 101 and the pre-stacking platform 102. The movable base 602 is fitted with the slide rail 601 to drive the telescopic structure 603 to move along the slide rail direction. The telescopic structure 604 is used to drive the gripping component to move in a direction perpendicular to the bearing surface. The gripping component 604 is used to grip the iron chip.

[0075] It should be noted that, in practical applications, the aforementioned two-way displacement mechanism 105 can be installed on the bearing surface to drive the iron chips to move within the two-dimensional plane coordinate system of the bearing surface. Since the center positions (i.e., the centroids of the iron chips) of iron chips with different shapes and sizes differ, if iron chips of different shapes and sizes are pre-stacked without a reference object, there is a risk of increased stacking errors preventing proper splicing. Therefore, this application sets up a centering platform 101 and a pre-stacking platform 102 of the same shape and size in parallel, configures the aforementioned two-way displacement mechanism 105 to move the iron chips so that the center position of the iron chips coincides with the center position of the centering platform 101, and configures the first gripping mechanism 103 to translate the moved iron chips carried on the bearing surface to the pre-stacking platform 102, thereby aligning the center position of the iron chips translated to the pre-stacking platform 102 with the center position of the pre-stacking platform 102. This, in turn, ensures that after multiple translations, the center positions of all iron chips carried on the pre-stacking platform 102 coincide, improving stacking accuracy and facilitating subsequent iron chip splicing and assembly, thus increasing the efficiency of iron core production.

[0076] It should be noted that in practical applications, the large mass and volume of the stacked iron chips make subsequent transportation difficult. Therefore, during the process of the first gripping mechanism 103 moving the iron chips to the pre-stacking platform 102, a stacking thickness threshold can be set based on the weight of the iron chips, and the iron chip thickness can be monitored. When the iron chip thickness exceeds the stacking thickness threshold, pre-stacking is stopped. The above monitoring process can be configured with various strategies, specifically:

[0077] Lower yoke pre-stacking strategy: When the current pre-stacking object is the iron chip at the lower yoke, a stacking thickness threshold of 400mm is set. If the iron chip thickness is not greater than the stacking thickness threshold, the iron chip at the lower yoke can be completely pre-stackinged, and the stacking effect is as follows: Figure 7 As shown, if the thickness of the iron chip is greater than the stacking thickness threshold, it can be pre-stacked in two parts, upper and lower, with the stacking effect as shown. Figure 8 As shown;

[0078] Upper yoke pre-stacking strategy: Since the iron chips at the upper yoke are pre-stacking from the middle to both sides, and the weight of the pre-stacking platform 102 (usually 8 tons) needs to be considered, the aforementioned stacking thickness threshold needs to be configured to 300mm, and the stacking shape should be bowl-shaped. The stacking effect is as follows: Figure 9 As shown.

[0079] Pre-stacking method for edge posts and core posts: There are two types of sheet metal chips located at the edge posts: Af and Ag. Af and Ag are pre-stacked according to the stacking sequence. The sheet metal chips located at the core posts have types Ah, Ak, and Q. During pre-stacking, the wide and narrow sections of the same core post should be pre-stacked into a dovetail shape according to the stacking sequence shown in the drawing. The thickness of each sheet should not exceed 350mm. The stacking effect is as follows: Figure 9 As shown.

[0080] This application configures a controller to be connected to the centering platform and the first gripping mechanism respectively. The controller controls the two-way displacement mechanism of the centering platform to move the iron core so that the center position of the iron core coincides with the center position of the centering platform. The first gripping mechanism then moves the moved iron core to the pre-stacking platform. Since the centering platform and the pre-stacking platform have the same shape and size and are set in parallel, the center positions of all iron cores moved to the pre-stacking platform by the first gripping mechanism coincide. In the subsequent iron core production process, the stacked iron cores carried by the pre-stacking platform are spliced ​​and assembled with other stacked iron cores, thereby improving the iron core production efficiency.

[0081] In one possible implementation, the first grasping mechanism 103 includes:

[0082] The vacuum adsorption device is electrically connected to the controller 104.

[0083] It should be noted that in practical applications, to avoid eddy current losses caused by electrical connections between iron chips, the surface of the iron chips is usually covered with insulating varnish. However, in the existing manual stacking production process, factors such as operator hand contamination and bending can cause localized varnish peeling, affecting the insulation effect of the iron chips, and consequently leading to eddy current losses in the assembled iron core that do not meet design requirements. The vacuum adsorption device uses a vacuum pump to extract air from the flexible adsorption component and the contact material to create a negative pressure within the flexible adsorption component. Since the flexible adsorption component does not damage the insulating varnish layer on the surface of the iron chip, and multiple sets of flexible adsorption components can be configured to balance the force on the iron chip, preventing bending, this application, by configuring the first gripping mechanism 103 to include a vacuum adsorption device, avoids damage to the insulating varnish on the surface of the iron chip compared to the prior art, thus improving the pre-stacking reliability of the iron chips. In one possible implementation, the vacuum adsorption device includes:

[0084] Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor;

[0085] A grating-type height sensor is mounted on the side surface of the bracket to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface.

[0086] Each vacuum suction cup is mounted longitudinally on the contact surface of the bracket, with the contact surface parallel to the bearing surface;

[0087] The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through a guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump.

[0088] The controller 104 is connected to the grating height detection sensor, each vacuum regulating valve and the vacuum pump respectively. The controller 104 is also used to determine the opening degree of the vacuum regulating valve based on the iron chip thickness collected by the grating height detection sensor and to control the start and stop of the vacuum pump.

[0089] It should be noted that, in practical applications, the aforementioned grating height detection sensor is an optical grating transducer used to measure the thickness of the iron chip. Since the thickness of the iron chip is typically 0.35mm to 0.5mm, the mass of iron chips of different thicknesses varies, resulting in differences in the required suction force of the suction cups. Furthermore, due to the difference in thickness between the two types of iron chips of different masses during the pre-stacking process, this application uses the aforementioned grating height detection sensor to collect the iron chip thickness and controls the opening of the vacuum regulating valves connected to each vacuum suction cup based on the iron chip thickness. This adjusts the suction force of the different vacuum suction cups, thereby improving the reliability of the vacuum adsorption device's adsorption of the iron chip.

[0090] In one possible implementation, the three views of the above-described vacuum adsorption device can be as follows: Figure 10 As shown. The vacuum adsorption device includes a vacuum pump 701, a support 702, vacuum suction cups 703, vacuum regulating valves 704, and a grating-type height detection sensor 705. When the grating-type height detection sensor 705 detects that the thickness of the iron chip is lower than the previously acquired thickness, the vacuum regulating valves 704 corresponding to the four vacuum suction cups located in the middle of the support can be configured to open to the maximum, and the vacuum pump can be started. When the grating-type height detection sensor 705 detects that the thickness of the iron chip is higher than the previously acquired thickness, each vacuum regulating valve 704 can be configured to open to the maximum, and the vacuum pump can be started.

[0091] In one possible implementation, the bidirectional displacement mechanism 105 includes:

[0092] The range sensor, the first displacement device in the first direction, and the second displacement device in the second direction are both parallel to the bearing surface, and the first direction is perpendicular to the second direction.

[0093] The controller 104 is electrically connected to the ranging sensor, the first displacement device, and the second displacement device. The controller 104 is also used to control the first displacement device and the second displacement device to move the iron chip in the first direction and the second direction according to the boundary distance between the iron chip and the bearing surface collected by the ranging sensor, so that the center position of the iron chip coincides with the center position of the centering platform 101. The boundary distance is the distance between each side of the iron chip and the edge of the bearing surface that is closest to the edge.

[0094] It should be noted that, in practical applications, the aforementioned ranging sensor may include multiple infrared ranging probes, each positioned at the center point of one side of the bearing surface, to measure the edge of the iron chip closest to that edge. If the distances measured by two opposing infrared ranging probes are equal, it indicates that the center position of the iron chip coincides with the center position of the centering platform 101. Its deployment method can be as follows: Figure 11 As shown, infrared ranging probes 801 and 803 are arranged opposite each other at the midpoint of a set of opposite sides of the bearing surface of the centering platform 101, and infrared ranging probes 802 and 804 are arranged opposite each other at the midpoint of another set of opposite sides of the bearing surface of the centering platform 101. The ray corner of each infrared ranging probe is the center position of the centering platform 101.

[0095] It should be noted that, in practical applications, the first displacement device described above can be a pusher-type or a balance wheel-type displacement device. The second displacement device described above can also be a pusher-type or a balance wheel-type displacement device. The types of the first and second displacement devices described above can be the same or different. For example... Figure 12 The diagram shows a schematic of a two-way displacement mechanism of the push rod type. The push rod type displacement device uses push rods deployed on each side of the bearing surface to push the flat surfaces (901, 902, 903, and 904) to move, thereby causing the flat surfaces to push the iron-pair chip 905 to move on the bearing surface. Figure 13 The diagram shows a two-way displacement mechanism of the balance wheel type. The balance wheel type displacement device can use the transverse balance wheel 1001 and the longitudinal balance wheel 1002 deployed on the bearing surface to drive the trapezoidal iron chip to the center position of the centering platform 101 through the reciprocating rotation of the transverse balance wheel 1001 and the longitudinal balance wheel 1002.

[0096] In one possible implementation, the iron chip pre-stacking system provided by the first aspect of this application and any implementation thereof further includes:

[0097] The second gripping mechanism includes the same vacuum adsorption device as the first gripping mechanism 103;

[0098] Controller 104 is also electrically connected to controller 104, and controller 104 is also used to control the second gripping mechanism to place the iron chip on the bearing surface.

[0099] In one possible implementation, the iron chip pre-stacking system provided by the first aspect of this application and any implementation thereof further includes:

[0100] The sheet rack includes multiple storage areas of different sizes, which are used to store sized iron chips.

[0101] It should be noted that in practical application scenarios, this application improves the automation efficiency of the iron chip pre-stacking system provided by the first aspect and any implementation of the first aspect by configuring the plate rack to store iron chips of different sizes in partitions, thereby improving the automation efficiency of the iron chip pre-stacking system provided by the second gripping mechanism, without the need for manual intervention, thus avoiding the risk of bumps or contamination caused by manual handling.

[0102] To facilitate understanding of the iron chip pre-stacking system provided by the first aspect and any implementation thereof of this application, an example of a possible implementation of this application is described below:

[0103] like Figure 14 The diagram shows a schematic of a pre-stacking system for iron chips, comprising: a centering platform 101 and a pre-stacking platform 102 of identical shape and size; a first gripping mechanism 103; a controller 104; a two-phase displacement mechanism 105 mounted on the centering platform 101; a second gripping mechanism 106; and a board rack 107. The first gripping mechanism 103, the two-phase displacement mechanism 105, and the second gripping mechanism 106 are all electrically connected to the controller 104. The controller 104 controls the second gripping mechanism 106 to grip iron chips from the board rack 107 and place them on the bearing surface of the centering platform 101. The controller 104 also controls the two-phase displacement mechanism 105 to move the iron chips placed on the bearing surface so that the center position of the iron chips coincides with the center position of the centering platform 101. The controller 104 further controls the first gripping mechanism 103 to translate the moved iron chips to the pre-stacking platform 102, wherein the pre-stacking platform 102 and the centering platform 101 have the same shape and size and are arranged parallel to each other.

[0104] It should be noted that in real-world application scenarios,

[0105] The second aspect of this application provides a pre-stacking control method for iron chips, applied to the controller in the pre-stacking system of iron chips according to the first aspect and any embodiment of the first aspect, such as... Figure 15 As shown, the iron chip pre-stacking control method includes:

[0106] S1501, Control the two-way displacement mechanism installed on the bearing surface of the centering platform to move the iron chip so that the center position of the iron chip coincides with the center position of the centering platform;

[0107] S1502, The first gripping mechanism, which is arranged between the centering platform and the pre-stacking platform, moves the moved iron chip carried on the bearing surface to the pre-stacking platform. The pre-stacking platform has the same shape and size as the centering platform.

[0108] In one possible implementation, the bidirectional displacement mechanism includes:

[0109] The range sensor, the first displacement device in the first direction, and the second displacement device in the second direction are both parallel to the bearing surface, and the first direction is perpendicular to the second direction.

[0110] The controller is electrically connected to the ranging sensor, the first displacement device, and the second displacement device, respectively.

[0111] The method of controlling the two-way displacement mechanism mounted on the bearing surface of the centering platform to move the iron chip so that the center position of the iron chip coincides with the center position of the centering platform includes: according to the boundary distance between the iron chip and the bearing surface collected by the distance measuring sensor, controlling the first displacement device and the second displacement device to drive the iron chip to move in the first direction and the second direction so that the center position of the iron chip coincides with the center position of the centering platform. The boundary distance is the distance between each side of the iron chip and the side of the bearing surface that is closest to the side.

[0112] In one possible implementation, controlling a first gripping mechanism positioned between a parallel centering platform and a pre-stacking platform to translate the moved iron chip carried on the bearing surface to the pre-stacking platform includes:

[0113] The coordinates of the center position of the centering platform are determined as the gripping position coordinates of the first gripping mechanism, and the coordinates of the center position of the pre-overlay platform are determined as the release position coordinates of the first gripping mechanism.

[0114] A translation path is generated based on the gripping and releasing position coordinates, and the first gripping mechanism is controlled based on the translation path to translate the moved iron chip carried by the bearing surface from the centering platform to the pre-stacking platform.

[0115] In one possible implementation, the first gripping mechanism includes a vacuum adsorption device, which comprises:

[0116] Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor;

[0117] A grating-type height sensor is mounted on the side surface of the bracket to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface.

[0118] Each vacuum suction cup is mounted longitudinally on the contact surface of the bracket, with the contact surface parallel to the bearing surface;

[0119] The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through a guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump.

[0120] The controller is connected to the grating-type height detection sensor, each vacuum regulating valve, and the vacuum pump.

[0121] The iron chip pre-stacking control method also includes:

[0122] The opening degree of the vacuum regulating valve is determined based on the thickness of the iron chip collected by the grating height detection sensor, and the start and stop of the vacuum pump are controlled.

[0123] This application also provides an electronic device in its embodiments. (See reference...) Figure 16 The diagram illustrates a structural schematic suitable for implementing the electronic device in the embodiments of this application. The electronic device in the embodiments of this application may include, but is not limited to, fixed terminals such as mobile phones, laptops, PDAs (personal digital assistants), PADs (tablet computers), desktop computers, etc. Figure 16 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0124] like Figure 16 As shown, the electronic device may include a processing unit (e.g., a central processing unit, a graphics processing unit, etc.) 1601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1602 or a program loaded from a storage device 1608 into a random access memory (RAM) 1603. When the electronic device is powered on, the RAM 1603 also stores various programs and data required for the operation of the electronic device. The processing unit 1601, ROM 1602, and RAM 1603 are interconnected via a bus 1604. An input / output (I / O) interface 1605 is also connected to the bus 1604.

[0125] Typically, the following devices can be connected to the I / O interface 1605: input devices 1606 including, for example, a touchscreen, touchpad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; output devices 1607 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 1608 including, for example, memory card, hard disk, etc.; and communication devices 1609. Communication device 1609 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 16 Electronic devices with various devices are shown, but it should be understood that it is not required to implement or have all of the devices shown. More or fewer devices may be implemented or have alternatively.

[0126] It should also be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. In addition, in the device embodiment drawings provided in this application, the connection relationship between modules indicates that they have a communication connection, which can be implemented as one or more communication buses or signal lines.

[0127] Through the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware, or it can be implemented by special-purpose hardware including application-specific integrated circuits, special-purpose CPUs, special-purpose memory, special-purpose components, etc. Generally, any function performed by a computer program can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be diverse, such as analog circuits, digital circuits, or special-purpose circuits. However, for this application, software program implementation is more often the preferred implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, training equipment, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0128] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0129] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, training device, or data center to another website, computer, training device, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state drives (SSDs)).

Claims

1. A pre-stacking system for iron chips, characterized in that, include: A centering platform and a pre-stacking platform of the same shape and size, as well as a first gripping mechanism and a controller; The centering platform is equipped with a two-way displacement mechanism on its bearing surface, which is used to move the iron chip placed on the bearing surface. The first gripping mechanism is positioned between the centering platform and the pre-overlay platform, which are arranged in parallel. The controller is electrically connected to the centering platform and the first gripping mechanism respectively. The controller is used to control the two-way displacement mechanism of the centering platform to move the iron chip so that the center position of the iron chip coincides with the center position of the centering platform. It is also used to control the first gripping mechanism to translate the moved iron chip carried by the bearing surface to the pre-stacked platform.

2. The iron chip pre-stacking system according to claim 1, characterized in that, The first grasping mechanism includes: A vacuum adsorption device, wherein the vacuum adsorption device is electrically connected to the controller.

3. The iron chip pre-stacking system according to claim 2, characterized in that, The vacuum adsorption device includes: Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor; The grating-type height detection sensor is mounted on the side surface of the bracket and is used to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface. Each of the vacuum suction cups is mounted longitudinally on the contact surface of the bracket, and the contact surface is parallel to the bearing surface; The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through an air guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump. The controller is connected to the grating height detection sensor, each of the vacuum regulating valves and the vacuum pump respectively. The controller is also used to determine the opening degree of the vacuum regulating valve based on the thickness of the iron chip collected by the grating height detection sensor, and to control the start and stop of the vacuum pump.

4. The iron chip pre-stacking system according to claim 1, characterized in that, The bidirectional displacement mechanism includes: The device includes a ranging sensor, a first displacement device in a first direction, and a second displacement device in a second direction, wherein both the first and second directions are parallel to the bearing surface, and the first direction is perpendicular to the second direction. The controller is electrically connected to the ranging sensor, the first displacement device, and the second displacement device respectively. The controller is also used to control the first displacement device and the second displacement device to move the iron chip in the first direction and the second direction according to the boundary distance between the iron chip and the bearing surface collected by the ranging sensor, so that the center position of the iron chip coincides with the center position of the centering platform. The boundary distance is the distance between each side of the iron chip and the side of the bearing surface closest to the side.

5. The iron chip pre-stacking system according to claim 3, characterized in that, The iron chip pre-stacking system further includes: The second gripping mechanism includes the same vacuum adsorption device as the first gripping mechanism; The controller is also electrically connected to the second gripping mechanism, and the controller is also used to control the second gripping mechanism to place the iron chip on the bearing surface.

6. The iron chip pre-stacking system according to any one of claims 1 to 5, characterized in that, The iron chip pre-stacking system further includes: The sheet metal rack includes multiple storage areas of different sizes, which are used to store the iron chips of the appropriate size.

7. A method for controlling the pre-stacking of iron chips, characterized in that, A controller applied in a pre-stacking system for iron chips as described in any one of claims 1 to 6, the pre-stacking control method for iron chips comprising: The two-way displacement mechanism mounted on the bearing surface of the centering platform moves the iron chip so that the center position of the iron chip coincides with the center position of the centering platform; The first gripping mechanism, which is positioned between the centering platform and the pre-stacking platform arranged in parallel, moves the iron chip, which has been moved and is supported by the bearing surface, to the pre-stacking platform, which has the same shape and size as the centering platform.

8. The iron chip pre-stacking control method according to claim 7, characterized in that, The bidirectional displacement mechanism includes: The device includes a ranging sensor, a first displacement device in a first direction, and a second displacement device in a second direction, wherein both the first and second directions are parallel to the bearing surface, and the first direction is perpendicular to the second direction. The controller is electrically connected to the ranging sensor, the first displacement device, and the second displacement device, respectively. The two-way displacement mechanism installed on the bearing surface of the centering platform moves the iron chip so that the center position of the iron chip coincides with the center position of the centering platform. This includes: controlling the first displacement device and the second displacement device to move the iron chip in the first direction and the second direction according to the boundary distance between the iron chip and the bearing surface collected by the ranging sensor, so that the center position of the iron chip coincides with the center position of the centering platform. The boundary distance is the distance between each side of the iron chip and the side of the bearing surface closest to that side.

9. The iron chip pre-stacking control method according to claim 7, characterized in that, The first gripping mechanism, positioned between the parallel-arranged centering platform and pre-stacking platform, translates the moved iron chip carried on the bearing surface to the pre-stacking platform, including: The coordinates of the center position of the centering platform are determined as the gripping position coordinates of the first gripping mechanism, and the coordinates of the center position of the pre-stacked platform are determined as the release position coordinates of the first gripping mechanism. A translation path is generated based on the gripping position coordinates and the release position coordinates, and the first gripping mechanism is controlled based on the translation path to translate the moved iron chip carried by the bearing surface from the centering platform to the pre-stack platform.

10. The iron chip pre-stacking control method according to claim 7, characterized in that, The first gripping mechanism includes a vacuum adsorption device, which includes: Vacuum pump, at least one bracket, multiple vacuum suction cups, multiple vacuum regulating valves, and grating-type height detection sensor; The grating-type height detection sensor is mounted on the side surface of the bracket and is used to measure the thickness of the iron chip. The side surface is perpendicular to the bearing surface. Each of the vacuum suction cups is mounted longitudinally on the contact surface of the bracket, and the contact surface is parallel to the bearing surface; The exhaust port of the vacuum suction cup is connected to one end of the vacuum regulating valve through an air guide pipe, and the other end of the vacuum regulating valve is connected to the air inlet of the vacuum pump. The controller is connected to the grating-type height detection sensor, each of the vacuum regulating valves, and the vacuum pump, respectively. The iron chip pre-stacking control method further includes: Based on the thickness of the iron chip collected by the grating height detection sensor, the opening degree of the vacuum regulating valve is determined, and the vacuum pump is started and stopped.

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