A thin film capacitor structure

Abstract

The application discloses a thin film capacitor structure and relates to the technical field of capacitors, which can meet service life, working performance, heat dissipation effect and safety performance, and can also consider heat dissipation performance and small size. In the capacitor structure, the connecting plate comprises an upper horizontal section, a lower horizontal section and a vertical section connected to the right end of the upper horizontal section and the left end of the lower horizontal section; a plurality of connecting plates are arranged in sequence from left to right, the upper surface of the lower horizontal section of one of the two adjacent connecting plates is used for being fixed with the lower surface of a capacitor core, the lower surface of the upper horizontal section of the other connecting plate is used for being fixed with the upper surface of the capacitor core, the first conductive layer of the upper horizontal section of each connecting plate is connected, and the second conductive layer of the lower horizontal section of each connecting plate is connected; wherein, in the plurality of connecting plates, the second conductive layer of the lower horizontal section of the same connecting plate is provided with a first electrode lead end, and the first conductive layer of the upper horizontal section is provided with a second electrode lead end.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and more specifically to a thin-film capacitor structure. Background Technology

[0002] Film capacitors are widely used in power electronics, new energy, and rail transportation due to their high voltage resistance, low loss, and excellent high-frequency characteristics. They primarily perform key functions such as filtering, energy storage, and DC blocking in circuits. As these fields increasingly demand higher reliability, longer service life, and higher operating efficiency, the performance and reliability of film capacitors have become one of the core factors affecting the stability of the entire circuit system.

[0003] Currently, most existing film capacitors employ a single, large-capacity cell structure, achieving the target capacitance by increasing the plate area of ​​a single capacitor or the number of stacked layers. However, in practical applications, this type of single, large-capacity film capacitor exhibits significant shortcomings in terms of lifespan, performance, heat dissipation, and safety, making it difficult to meet the high reliability requirements of high-end applications. Summary of the Invention

[0004] This invention provides a thin-film capacitor structure that can balance heat dissipation performance and small size while meeting requirements for service life, working performance, heat dissipation effect and safety performance.

[0005] To address the above problems, embodiments of the present invention disclose a thin-film capacitor structure, comprising:

[0006] The first electrode lead end, the second electrode lead end, and multiple connecting plates;

[0007] The connecting plate consists of a first conductive layer, an insulating layer, and a second conductive layer arranged sequentially from top to bottom. The insulating layer is used to isolate the first conductive layer and the second conductive layer. The connecting plate includes an upper horizontal section, a lower horizontal section, and a vertical section connecting the right end of the upper horizontal section and the left end of the lower horizontal section.

[0008] Multiple connecting plates are arranged sequentially from left to right. In two adjacent connecting plates, the upper surface of the lower horizontal section of one connecting plate is used to fix the lower surface of the capacitor core, and the lower surface of the upper horizontal section of the other connecting plate is used to fix the upper surface of the capacitor core. The first conductive layers of the upper horizontal sections of each connecting plate are connected, and the second conductive layers of the lower horizontal sections of each connecting plate are connected.

[0009] Among the multiple connecting plates, a first electrode lead is provided on the second conductive layer of the lower horizontal section of the same connecting plate, and a second electrode lead is provided on the first conductive layer of the upper horizontal section.

[0010] In some embodiments of the present invention, the first electrode lead is a positive electrode lead and the second electrode lead is a negative electrode lead; or, the first electrode lead is a negative electrode lead and the second electrode lead is a positive electrode lead.

[0011] In some embodiments of the present invention, the capacitor core is wound, and the upper and lower surfaces of the capacitor core are two end faces of the capacitor core that are arranged opposite to each other.

[0012] In some embodiments of the present invention, the capacitor core is a stacked type, and the upper surface and lower surface of the capacitor core are two sides of the capacitor core that are arranged opposite to each other.

[0013] In some embodiments of the present invention, in two adjacent connecting plates, the upper surface of the first conductive layer of the upper horizontal section of one connecting plate has a first thinning portion, the first thinning portion is connected to the first conductive layer of the vertical section of the connecting plate, and the first conductive layer of the upper horizontal section of the other connecting plate extends to the first thinning portion and matches the first thinning portion and is fixed by welding.

[0014] Furthermore, in two adjacent connecting plates, the lower surface of the second conductive layer of the lower horizontal section of one connecting plate has a second thinning portion, which is connected to the second conductive layer of the vertical section of the connecting plate. The second conductive layer of the lower horizontal section of the other connecting plate extends to the second thinning portion and matches the second thinning portion and is fixed by welding.

[0015] In some embodiments of the present invention, in two adjacent connecting plates, there is a gap between the second conductive layer of one connecting plate and the first conductive layer of the other connecting plate.

[0016] In some embodiments of the present invention, the thin-film capacitor structure is a centrosymmetric structure.

[0017] In some embodiments of the present invention, there are multiple first electrode leads and multiple second electrode leads. The multiple first electrode leads are distributed on the second conductive layer of the lower horizontal section of the multiple connecting plates, and the multiple second electrode leads are distributed on the first conductive layer of the upper horizontal section of the multiple connecting plates.

[0018] In some embodiments of the present invention, the gap between two adjacent connecting plates and the capacitor core is filled with a first potting compound, and the outer surfaces of multiple connecting plates are wrapped with a second potting compound, with the first electrode lead end and the second electrode lead end exposed outside the second potting compound.

[0019] In some embodiments of the present invention, the material of the first potting compound may be the same as or different from the material of the second potting compound.

[0020] The embodiments of the present invention have the following advantages:

[0021] For the same capacitance, compared to achieving this capacitance through a single large-capacity film capacitor, this embodiment of the invention uses multiple connecting plates to connect multiple capacitor cores in parallel to achieve the same capacitance. This not only effectively reduces the equivalent series resistance and equivalent series inductance, but also disperses the total ripple current in the circuit. The current borne by each capacitor core is significantly reduced, resulting in a marked decrease in internal heat generation. This avoids problems such as dielectric aging and thermal stress accumulation caused by excessive temperature, significantly extending the capacitor's lifespan. Furthermore, the multiple capacitor cores constitute a redundant design. Even if one capacitor core fails (such as dielectric breakdown or lead breakage), the other capacitor cores can continue to operate, preventing direct circuit interruption. This reduces safety risks such as overcurrent and short circuits and improves the system's fault tolerance.

[0022] By using multiple connecting plates to connect multiple capacitor cores in parallel, the capacitor structure of this invention makes the connection path between capacitor cores more direct and compact, realizes modular integrated design, reduces the size of the capacitor, and can balance heat dissipation performance and small size while meeting the requirements of service life, working performance, heat dissipation effect and safety performance. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of a thin-film capacitor structure provided in an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the connecting plate provided in an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of a thin-film capacitor structure including a potting body provided in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the current flow direction of a capacitor structure provided in a specific application of the present invention. Figure 1 ;

[0028] Figure 5 This is a schematic diagram of the current flow direction of a capacitor structure provided in a specific application of the present invention. Figure 2 .

[0029] Explanation of reference numerals in the attached figures:

[0030] A - First electrode lead end, B - Second electrode lead end, 200 - Connecting plate, 201 - First conductive layer, 202 - Insulating layer, 203 - Second conductive layer, 204 - First thinning part, 205 - Second thinning part, 300 - Gap, 400 - First potting body, 500 - Second potting body. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The inventors discovered that single large-capacity film capacitors have significant defects in terms of service life, working performance, heat dissipation, and safety performance in practical applications. Specifically:

[0033] (1) Limited service life: A single large-capacity film capacitor needs to withstand all the ripple current in the circuit, which leads to concentrated internal heat generation and a significant increase in operating temperature. The service life of film capacitors is closely related to the operating temperature. Generally, for every 10°C increase in temperature, its service life is often halved. With long-term use, it is easy to cause performance degradation or even failure due to dielectric aging and thermal stress accumulation.

[0034] (2) Insufficient performance: The equivalent series resistance (ESR) and equivalent series inductance (ESL) of a single large-capacity film capacitor are relatively large. Especially under high-frequency conditions, high ESR will lead to increased energy loss, and high ESL will limit its response speed, making it difficult to meet the circuit's requirements for high-frequency filtering and fast charging and discharging, thus affecting the overall system's operating efficiency.

[0035] (3) Difficulty in heat dissipation: A single large-capacity film capacitor has a large volume and a small surface area to volume ratio (specific surface area). The heat is concentrated and not easily dissipated, which further aggravates the problem of temperature rise, forming a vicious cycle of "heating-performance degradation-more severe heat generation".

[0036] (4) Low safety redundancy: A single large-capacity film capacitor is a single structural unit. Once it fails (such as dielectric breakdown, lead wire breakage, etc.), it will directly lead to circuit interruption, or even cause safety risks such as overcurrent and short circuit. Moreover, the lack of redundancy design makes it difficult to guarantee the fault tolerance of the system.

[0037] To address these issues, the industry has attempted to improve the performance of single large-capacity film capacitors by optimizing film materials and improving potting processes. However, due to inherent defects in the individual structure, there is limited room for improvement in terms of lifespan, heat dissipation, and safety, making it difficult to meet the high reliability requirements of high-end applications for film capacitors.

[0038] In view of this, embodiments of the present invention provide a thin-film capacitor structure, see reference. Figure 1 The thin-film capacitor structure includes: a first electrode lead A, a second electrode lead B, and multiple connecting plates 200200; each connecting plate 200 consists of a first conductive layer 201, an insulating layer 202, and a second conductive layer 203 arranged sequentially from top to bottom, the insulating layer 202 being used to isolate the first conductive layer 201 and the second conductive layer 203; each connecting plate 200 includes an upper horizontal section, a lower horizontal section, and a vertical section connecting the right end of the upper horizontal section and the left end of the lower horizontal section; the multiple connecting plates 200 are arranged sequentially from left to right, and in two adjacent connecting plates 200, their... The upper surface of the lower horizontal section of one connecting plate 200 is used to fix it to the lower surface of the capacitor core, and the lower surface of the upper horizontal section of the other connecting plate 200 is used to fix it to the upper surface of the capacitor core. The first conductive layers 201 of the upper horizontal sections of each connecting plate 200 are connected, and the second conductive layers 203 of the lower horizontal sections of each connecting plate 200 are connected. Among the multiple connecting plates 200, a first electrode lead is provided on the second conductive layer 203 of the lower horizontal section of the same connecting plate 200, and a second electrode lead is provided on the first conductive layer 201 of the upper horizontal section.

[0039] In this embodiment of the invention, the first electrode lead A and the second electrode lead B are key interface components connecting the thin-film capacitor to the external circuit. They are typically made of a metal with good conductivity, such as copper or aluminum, and are used to realize current input and output. One of the first electrode lead A and the second electrode lead B is the positive lead, and the other is the negative lead. In a specific embodiment, optionally, the first electrode lead A is the positive lead and the second electrode lead B is the negative lead. Alternatively, optionally, the first electrode lead A is the negative lead and the second electrode lead B is the positive lead.

[0040] In this embodiment of the invention, the internal structure of the connecting plate 200 is a composite structure, as shown in the reference. Figure 2The system comprises a first conductive layer 201, an insulating layer 202, and a second conductive layer 203 arranged sequentially from top to bottom. The first conductive layer 201 and the second conductive layer 203 are conductive layers, typically made of metals with excellent conductivity. The insulating layer 202 can be made of a material with excellent insulating properties, used to isolate the first conductive layer 201 and the second conductive layer 203 and prevent short circuits. This invention does not limit the material of the insulating layer 202, as long as it effectively isolates the first conductive layer 201 and the second conductive layer 203.

[0041] The first conductive layer 201, the second conductive layer 203, and the metal portion of this conductive layer structure are made of the same material as the first electrode lead A and the second electrode lead B, ensuring stable conductivity of the entire thin-film capacitor structure. During current transmission, the first conductive layer 201 and the second conductive layer 203 can rapidly conduct current, reducing losses during transmission. In terms of heat dissipation, the first conductive layer 201 and the second conductive layer 203 can quickly diffuse and dissipate the heat transferred from the connecting plates 200 to the external environment, improving the overall heat dissipation efficiency of the capacitor.

[0042] The external structure of the connecting plate 200 consists of three parts: an upper horizontal section, a lower horizontal section, and a vertical section. The vertical section connects the right end of the upper horizontal section and the left end of the lower horizontal section, forming a Z-shaped structure. Multiple connecting plates 200 are arranged sequentially from left to right. Between adjacent connecting plates 200, there is a gap 300 between the second conductive layer 203 of one connecting plate 200 and the first conductive layer 201 of the other connecting plate 200, meaning they do not directly contact each other, ensuring the normal operation of the parallel circuit of multiple capacitor cores. Optionally, this gap 300 is 3-5 mm.

[0043] In the thin-film capacitor structure of this invention embodiment, such as Figure 1As shown, the upper surface of the lower horizontal section of the leftmost connecting plate 200 is fixed to the lower surface of the capacitor core by welding, that is, the upper surface of the first conductive layer of the lower horizontal section of the leftmost connecting plate 200 is fixed to the lower surface of the capacitor core. Counting from left to right, the lower surface of the upper horizontal section of the second connecting plate 200 is fixed to the upper surface of the capacitor core by welding, that is, the second conductive layer 203 of the upper horizontal section of the second connecting plate 200 is fixed to the upper surface of the capacitor core. Since the first conductive layers 201 of the upper horizontal sections of each connecting plate are connected, and the second conductive layers 203 of the lower horizontal sections of each connecting plate are connected, and in the multiple connecting plates 200, the second conductive layer 203 of the lower horizontal section of the same connecting plate 200 is provided with a first electrode lead A, and the first conductive layer 201 of the upper horizontal section is provided with a second electrode lead B, thus realizing the connection between each capacitor core and the first electrode lead A and the second electrode lead B, forming a structure in which multiple capacitor cores are connected in parallel between the first electrode lead A and the second electrode lead B.

[0044] For the same capacitance, compared to achieving this capacitance through a single large-capacity film capacitor, the embodiments of the present invention use multiple capacitor cores connected in parallel to achieve the capacitance, effectively reducing the equivalent series resistance (ESR) and equivalent series inductance (ESL). Under high-frequency operating conditions, the film capacitor structure provided by the embodiments of the present invention reduces energy loss and accelerates response speed, meeting the circuit's requirements for high-frequency filtering and rapid charging and discharging, and improving the overall system operating efficiency.

[0045] For the same capacitance, compared to achieving this capacitance through a single large-capacity film capacitor, this invention uses multiple capacitor cores connected in parallel. This disperses the total ripple current in the circuit, significantly reducing the current carried by each capacitor core and noticeably reducing internal heat generation. This avoids problems such as dielectric aging and thermal stress accumulation caused by excessive temperature, significantly extending the capacitor's lifespan. Furthermore, the multiple capacitor cores constitute a redundant design. Even if one capacitor core fails (e.g., dielectric breakdown, lead breakage), the other capacitor cores can continue to operate, preventing direct circuit interruption. This reduces safety risks such as overcurrent and short circuits and improves the system's fault tolerance.

[0046] The capacitor structure of this invention makes the connection path between capacitor cores more direct and compact, achieving modular integrated design and reducing the size of the capacitor. It is worth noting that because adjacent connecting plates 200 alternately connect the upper and lower surfaces of the capacitor cores, and the insulating layer of the connecting plate 200 can isolate the first conductive layer 201 and the second conductive layer 203, the current path of each capacitor core is independent, ensuring electrical isolation and electromagnetic interference, and preventing short circuits. Simultaneously, multiple connecting plates 200 are staggered between multiple capacitor cores, forming a heat dissipation path. The first conductive layer 201 and the second conductive layer 203 of each connecting plate 200 also act as part of the heat dissipation path, effectively dissipating heat even from the capacitor core located at the very center of the capacitor structure, which helps extend the capacitor's lifespan and maintain a relatively stable capacitance.

[0047] Preferably, the thin-film capacitor structure provided in this embodiment of the invention is a centrosymmetric structure. In the centrosymmetric structure, the first electrode lead A and the second electrode lead B can also be used as positive or negative leads respectively without distinguishing polarity.

[0048] The capacitor structure provided by this invention can have only two electrode terminals (i.e., the first electrode lead A and the second electrode lead B), which helps to improve the sealing performance of the capacitor after potting. For example, in the thin-film capacitor structure, the first conductive layer 201 of the upper horizontal section of the leftmost connecting plate 200 is connected to the second electrode lead B, and the second conductive layer 203 of the lower horizontal section is connected to the first electrode lead A.

[0049] Of course, in some fields, such as electric vehicle batteries, the number of capacitor cores connected in parallel in a thin-film capacitor structure may be relatively large. Therefore, there are multiple first electrode leads A and multiple second electrode leads B. Multiple first electrode leads A are distributed on the second conductive layer 203 of the lower horizontal section of the multiple connecting plates 200, and multiple second electrode leads B are distributed on the first conductive layer 201 of the upper horizontal section of the multiple connecting plates 200. This structural arrangement not only helps the capacitor core dissipate heat through the leads but also helps improve the stability of the capacitor structure's connection to the external circuit. For example, as... Figure 3 As shown, three first electrode lead ends A are evenly distributed on the second conductive layer 203 of the lower horizontal section of the four connecting plates 200, and three second electrode lead ends B are evenly distributed on the first conductive layer 201 of the upper horizontal section of the four connecting plates 200.

[0050] In this invention, the first conductive layers of the upper horizontal segments of adjacent connecting plates 200 are connected to form a first conductive path. This can be achieved in various ways, such as using conductive adhesive to fix the first conductive layers of the upper horizontal segments of adjacent connecting plates 200 together. To balance connection stability and reduce capacitor size, further reference is made. Figure 1 orFigure 3 or Figure 4 or Figure 5 In some embodiments of the present invention, the following optional solutions are provided: In two adjacent connecting plates 200, a first thinning portion 204 is provided on the upper surface of the first conductive layer 201 of the upper horizontal segment of one connecting plate 200, the first thinning portion 204 is connected to the first conductive layer 201 of the vertical segment of the connecting plate 200, and the first conductive layer 201 of the upper horizontal segment of the other connecting plate 200 extends to the first thinning portion and matches with the first thinning portion 204 and is fixed by welding; and in two adjacent connecting plates 200, a second thinning portion 205 is provided on the lower surface of the second conductive layer 203 of the lower horizontal segment of one connecting plate 200, the second thinning portion 205 is connected to the second conductive layer 203 of the vertical segment of the connecting plate 200, and the second conductive layer 203 of the lower horizontal segment of the other connecting plate 200 extends to the second thinning portion 205 and matches with the second thinning portion 205 and is fixed by welding. The first thinning portion 204 can be understood as thinning a portion of the upper surface of the first conductive layer 201 of the horizontal section of the connecting plate 200, that is, the thickness of the first conductive layer 201 of the first thinning portion 204 is less than the thickness of other areas of the first conductive layer 201. The first thinning portion 204 is connected to the first conductive layer 201 of the vertical section. The first conductive layer 201 of the upper horizontal section of the other connecting plate 200 extends toward the end with the first thinning portion 204 to the first thinning portion 204, and the thickness of the extended portion can match the first thinning portion 204 and be fixed by welding. Similarly, the second thinning portion 205 can be understood as thinning a portion of the lower surface of the second conductive layer 203 of the lower horizontal section of the connecting plate 200. That is, the thickness of the second conductive layer 203 in the second thinning portion 205 is less than the thickness of other areas of the second conductive layer 203. The second thinning portion 205 is connected to the second conductive layer 203 of the vertical section. The second conductive layer 203 of the lower horizontal section of another connecting plate 200 extends towards the end with the second thinning portion 205 to the second thinning portion 205, and the thickness of the extended portion can match that of the second thinning portion 205 and be fixed by welding. The connection method provided by this embodiment enables the upper horizontal sections of adjacent connecting plates 200 to form a good conductive connection, ensuring a reliable connection between adjacent connecting plates 200.

[0051] In some specific embodiments, optionally, the length of the upper horizontal segment of the leftmost connecting plate 200 can be shorter than the length of the upper horizontal segments of the other connecting plates 200 in the capacitor structure; the length of the lower horizontal segment of the rightmost connecting plate 200 can be shorter than the length of the lower horizontal segments of the other connecting plates 200 in the capacitor structure. Since the upper horizontal segments of the leftmost connecting plate 200 and the lower horizontal segments of the rightmost connecting plate 200 do not participate in direct contact with the capacitor core, their dimensions can be designed to be shorter, thereby saving the overall size of the film capacitor structure.

[0052] The thin-film capacitor structure provided by this invention also includes a potting structure for encapsulating the connecting plate 200, the first electrode lead A, the second electrode lead B, and multiple capacitor cores. This potting structure effectively improves the insulation between internal components and circuits, enhancing operational stability. In some embodiments of this invention, the potting structure can be implemented using the following structure, see reference. Figure 3 , Figure 4 and Figure 5 That is, the gap between two adjacent connecting plates 200 and the capacitor core is filled with a first potting compound 400, and the outer surface of multiple connecting plates 200 is wrapped with a second potting compound 500. The first electrode lead A and the second electrode lead B are exposed outside the second potting compound 500 (this feature, Figure 3 , Figure 4 and Figure 5 (Not shown).

[0053] In practical operation, after multiple capacitor cores are fixed to the corresponding connecting plates 200 to form a capacitor structure connected in parallel to the first electrode lead A and the second electrode lead B, a first potting compound 400 can be filled into the surface of each capacitor core and the gaps formed between the capacitor core and the connecting plate 200. After the first potting compound 400 has cured, a second potting compound 500 is then wrapped around the outer surface of the connecting plate 200 to seal the entire internal structure and form a whole.

[0054] Since the first potting compound 400 directly fills the gap between the adjacent connecting plate 200 and the capacitor core, it can eliminate the weak points in insulation caused by the internal air gap 300 and avoid partial discharge under high voltage. The second potting compound 500 wraps the outer surface, further blocking the intrusion of conductive media (such as dust and moisture) in the external environment. In addition, the first potting compound 400 can isolate the internal components from direct contact with moisture and corrosive gases, especially for the metal electrodes and solder joints of the capacitor core, preventing oxidation and corrosion.

[0055] Furthermore, in some embodiments, the material of the first potting compound 400 is the same as the material of the second potting compound 500. When the first potting compound 400 and the second potting compound 500 are made of the same material, their physicochemical properties are consistent, and their thermal expansion and contraction characteristics are the same during the curing process and during use, which can reduce stress caused by material differences.

[0056] Furthermore, in some other embodiments, the material of the first potting compound 400 is different from that of the second potting compound 500. In this embodiment, suitable materials can be selected according to the different functional requirements of the first potting compound 400 and the second potting compound 500. For example, if the first potting compound 400 requires better thermal conductivity, a material with high thermal conductivity can be selected; if the second potting compound 500 requires better weather resistance and protective performance, a material with corresponding properties can be selected. Optionally, the internal first potting compound 400 can be made of a material with high thermal conductivity (such as epoxy resin with added ceramic particles), which can directly conduct the heat generated by the capacitor core and connecting plate 200 to the first substrate 100 and the outside. The second potting compound 500 can be made of a weather-resistant material (such as silicone rubber potting compound), which can resist ultraviolet rays, high and low temperature alternation and chemical reagent corrosion, so that the capacitor can adapt to harsh environments such as outdoor and industrial humid heat.

[0057] In some specific applications of the capacitor structure of the present invention, the capacitor core can be wound, and the upper and lower surfaces of the capacitor core are two end faces of the capacitor core that are arranged opposite to each other.

[0058] A wound capacitor core is a capacitor core structure formed by winding electrode films and dielectric films layer by layer. The end faces refer to the two circular or elliptical end planes formed during the winding process of the wound capacitor core, and these two end faces are positioned opposite each other. The upper and lower surfaces of the wound capacitor core are two oppositely positioned end faces, and these two end faces are fixedly connected to the lower surface of the upper horizontal segment and the upper surface of the lower horizontal segment of the adjacent connecting plate 200, respectively.

[0059] Taking the first electrode lead A as the negative lead and the second electrode lead B as the positive lead as an example. Figure 4 As shown, during current transmission, the current flows from the second electrode lead end B to the first conductive layer 201 of the upper horizontal section of a connecting plate 200, and then flows sequentially through the first conductive layer 201 of the vertical section and the first conductive layer 201 of the lower horizontal section of the connecting plate 200 into one end face of the wound capacitor core. After passing through the electrode film and dielectric film inside the capacitor core, the current flows out from the other end face to the second conductive layer 203 of the upper horizontal section of another connecting plate 200, and then sequentially through the second conductive layer 203 of the vertical section and the second conductive layer 203 of the lower horizontal section of the connecting plate 200 to the first electrode lead end A, thereby realizing the charging and discharging function of the capacitor core.

[0060] Taking the first electrode lead A as the positive lead and the second electrode lead B as the negative lead as an example. Figure 5 As shown, during current transmission, current flows in from the first electrode lead end A, and then flows sequentially through the second conductive layer 203 of the lower horizontal section, the second conductive layer 203 of the vertical section, and the second conductive layer 203 of the upper horizontal section of a connecting plate 200 into one end face of the wound capacitor core. After passing through the electrode film and dielectric film inside the capacitor core, it flows out from the other end face to the first conductive layer 201 of the lower horizontal section of another connecting plate 200, and then sequentially through the first conductive layer 201 of the vertical section and the first conductive layer 201 of the upper horizontal section of the connecting plate 200, thus flowing to the second electrode lead end B, realizing the charging and discharging function of the capacitor core.

[0061] In other specific applications of the capacitor structure of the present invention (not shown in the figure), the capacitor core is of the stacked type, and the upper surface and lower surface of the capacitor core are two sides of the capacitor core that are arranged opposite to each other.

[0062] The stacked capacitor core is a capacitor core structure formed by stacking and pressing electrode films and dielectric films layer by layer. The sides refer to two opposing planes formed during the stacking process of the stacked capacitor core; these two sides have a large area and are parallel to each other. It can be understood that if the stacking direction of the films inside the capacitor core is vertical, then the two sides are horizontal or front-back directions of the capacitor core. For example, if the films inside the capacitor core are stacked from top to bottom to form a rectangular structure, then the two sides are the left or right side of this rectangular structure. These two sides are fixedly connected to the lower surface of the upper horizontal section and the upper surface of the lower horizontal section of the adjacent connecting plate 200, respectively. Current flows from the lower surface of the upper horizontal section of the connecting plate 200 into one side of the stacked capacitor core, and after charging and discharging through the stacked electrode films and dielectric films inside the core, it flows out from the other side to the upper surface of the lower horizontal section of the connecting plate 200, completing the current transmission. Other related descriptions can be found in the previous wound-type embodiment, and will not be repeated here.

[0063] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0064] It should also be noted that, in this document, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0065] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand this application, and the content of this specification should not be construed as a limitation of this application. Furthermore, for those skilled in the art, there will be different forms of changes in the specific implementation methods and application scope based on this application. It is neither necessary nor possible to exhaustively list all implementation methods here, and obvious changes or modifications derived therefrom are still within the protection scope of this application.

Claims

1. A thin-film capacitor structure, characterized in that, include: The first electrode lead end, the second electrode lead end, and multiple connecting plates; The connecting plate is composed of a first conductive layer, an insulating layer, and a second conductive layer arranged sequentially from top to bottom. The insulating layer is used to isolate the first conductive layer and the second conductive layer. The connecting plate includes an upper horizontal section, a lower horizontal section, and a vertical section connecting the right end of the upper horizontal section and the left end of the lower horizontal section. The plurality of connecting plates are arranged sequentially from left to right. In two adjacent connecting plates, the upper surface of the lower horizontal section of one connecting plate is used to fix the lower surface of the capacitor core, and the lower surface of the upper horizontal section of the other connecting plate is used to fix the upper surface of the capacitor core. The first conductive layers of the upper horizontal sections of each connecting plate are connected, and the second conductive layers of the lower horizontal sections of each connecting plate are connected. Among the plurality of connecting plates, the first electrode lead end is provided on the second conductive layer of the lower horizontal section of the same connecting plate, and the second electrode lead end is provided on the first conductive layer of the upper horizontal section. In two adjacent connecting plates, the upper surface of the first conductive layer of the upper horizontal section of one connecting plate has a first thinning part, which is connected to the first conductive layer of the vertical section of the connecting plate. The first conductive layer of the upper horizontal section of the other connecting plate extends to the first thinning part and matches the first thinning part and is fixed by welding. Furthermore, in two adjacent connecting plates, the lower surface of the second conductive layer of the lower horizontal section of one connecting plate has a second thinning portion, which is connected to the second conductive layer of the vertical section of the connecting plate. The second conductive layer of the lower horizontal section of the other connecting plate extends to the second thinning portion and matches the second thinning portion and is fixed by welding.

2. The thin-film capacitor structure according to claim 1, characterized in that, The first electrode lead is the positive electrode lead, and the second electrode lead is the negative electrode lead; or, the first electrode lead is the negative electrode lead, and the second electrode lead is the positive electrode lead.

3. The thin-film capacitor structure according to claim 1, characterized in that, The capacitor core is a wound type, and the upper and lower surfaces of the capacitor core are two end faces that are opposite to each other.

4. The thin-film capacitor structure according to claim 1, characterized in that, The capacitor core is a stacked type, and the upper and lower surfaces of the capacitor core are two opposite sides of the capacitor core.

5. The thin-film capacitor structure according to claim 1, characterized in that, In two adjacent connecting plates, there is a gap between the second conductive layer of one connecting plate and the first conductive layer of the other connecting plate.

6. The thin-film capacitor structure according to claim 1, characterized in that, The thin-film capacitor has a centrosymmetric structure.

7. The thin-film capacitor structure according to claim 6, characterized in that, There are multiple first electrode leads and multiple second electrode leads. The multiple first electrode leads are distributed on the second conductive layer of the lower horizontal segment of the multiple connecting plates, and the multiple second electrode leads are distributed on the first conductive layer of the upper horizontal segment of the multiple connecting plates.

8. The thin-film capacitor structure according to claim 1, characterized in that, The gap between two adjacent connecting plates and the capacitor core is filled with a first potting compound, and the outer surface of the plurality of connecting plates is wrapped with a second potting compound. The first electrode lead end and the second electrode lead end are exposed outside the second potting compound.

9. The thin-film capacitor structure according to claim 8, characterized in that, The material of the first potting compound may be the same as or different from the material of the second potting compound.

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