An intermediate cleaning machine wafer carrier transfer device

Abstract

This application relates to a wafer carrier transfer device for an intermediate cleaning machine, belonging to the technical field of wafer cleaning equipment. It includes a frame and an acid pickling tank and a water washing tank arranged sequentially on the frame. It also includes a transition component within the acid pickling tank and a transfer component within the water washing tank. A first transition port is provided on the side wall of the water washing tank near the acid pickling tank, and a second transition port is provided on the side wall of the acid pickling tank near the water washing tank. The first and second transition ports are arranged opposite each other, and both are equipped with automatically opening and closing sealed doors. The transition component includes a transition clamping rod slidably disposed in a sliding groove and a first power component for sliding and lifting the transition clamping rod. This application effectively reduces acid residue in the gap between the wafer and the transfer carrier, while simultaneously reducing the water washing solution replacement cycle in the water washing tank, thereby improving the surface quality of the wafer.

Description

Technical Field

[0001] This application relates to the technical field of wafer carrier switching, and in particular to a wafer carrier transfer device for an intermediate cleaning machine. Background Technology

[0002] In semiconductor manufacturing, many process steps require frequent testing and monitoring. For example, after powering on / off or maintaining etching machines, thin-film deposition equipment, and lithography machines, some wafers need to be run to test the equipment's process status. When developing new processes or adjusting existing process formulations, repeated experiments are necessary. Using reclaimed wafers for these experiments reduces R&D costs. Using reclaimed wafers for testing and monitoring these processes ensures production line stability and product yield. Directly using expensive new silicon wafers for testing is extremely costly, while reclaimed wafers provide a perfect low-cost solution for this type of process step.

[0003] When recycled wafers need to be reused after use, they need to undergo steps such as acid washing, film removal, grinding, and polishing. In the middle of these steps, the wafers need to be cleaned to remove chemical residues and reduce the impact on subsequent processes.

[0004] Wafer carriers are generally divided into two types: one is a completely enclosed rectangular transport carrier (FOSB), and the other is a rectangular transfer carrier (CASETTE) specifically designed for cleaning machines, which is wider at the top and narrower at the bottom, with openings at both ends. Both the transfer carrier and the wafer carrier have loading slots for loading each wafer. To facilitate wafer placement, the opening width of the loading slot near the transport carrier / transfer carrier opening is greater than the width of the bottom wall of the loading slot. The transfer carrier is used to transport and clean the wafers within the cleaning machine, where they are stably cleaned by the liquid rinsing in the water washing tank and acid washing tank. To maintain the cleanliness of the wafers, the transport carrier must not enter the cleaning machine. The transfer carrier only circulates within the cleaning machine. To reduce the contamination of the water washing tank by acid from the pickling tank, the transport carrier needs to be separated from the cleaned wafers after pickling. However, in existing cleaning equipment, the transport carrier and wafers are often not separated to simplify the process. This operation requires periodic replacement and cleaning of the liquid in the water washing tank. Furthermore, this method leaves pickling liquid in the gap between the wafer and the transport carrier, affecting the surface quality of the wafers afterward. Therefore, improvements are needed. Summary of the Invention

[0005] In order to reduce acid residue in the gap between the wafer and the transfer carrier, while shortening the water washing solution replacement cycle in the washing tank and improving the surface quality of the wafer, this application provides a wafer carrier transfer device for an intermediate cleaning machine.

[0006] The intermediate cleaning machine wafer carrier transfer device provided in this application adopts the following technical solution:

[0007] A wafer carrier transfer device for an intermediate cleaning machine includes a frame and an acid pickling tank and a water washing tank arranged sequentially on the frame. It also includes a transition component in the acid pickling tank and a transfer component in the water washing tank. The water washing tank has a first transition port on its side wall near the acid pickling tank, and the acid pickling tank has a second transition port on its side wall near the water washing tank. The first transition port and the second transition port are arranged opposite each other, and both the first transition port and the second transition port are provided with automatically opening and closing sealed doors.

[0008] The side wall of the pickling tank is provided with a sliding groove, which includes a first sliding groove arranged along the extension direction of the pickling tank and a second sliding groove arranged along the height direction of the pickling tank.

[0009] The transition assembly includes a transition clamping rod slidably disposed within the sliding groove and a first power component for sliding and lifting the transition clamping rod. The transition clamping rod includes two sets of opposing first clamping rods, which move closer together and abut against the bottom side of the lug of the transfer vehicle.

[0010] The transfer assembly includes a transfer clamping rod that is lifted and slidably mounted on the frame, and a second power component that drives the transfer clamping rod to slide. The transfer clamping rod includes two opposing second clamping rods, each of which has a clamping groove. The clamping groove corresponds one-to-one with each wafer in the transfer carrier. The washing tank is also provided with an alignment component for making the clamping grooves and the transfer carrier completely aligned.

[0011] By adopting the above technical solution, when cleaning the wafer, the wafer is first immersed in the pickling tank by a transfer carrier, and the transfer carrier is transported in the adjacent pickling tank by a set transition clamping rod. The surface of the wafer is then pickled and cleaned by hydrofluoric acid flushing in the pickling tank to remove the film on the surface of the regenerated wafer or to remove surface residues from the regenerated wafer grinding process.

[0012] Since intermediate cleaning machines often have multiple sets of pickling tanks and washing tanks, and the cleaning process of regenerated wafers involves first pickling the surface of the regenerated wafers through multiple sets of pickling tanks, and then washing the surface of the regenerated wafers with water to remove residual hydrofluoric acid, thereby reducing acid stains on the surface of the regenerated wafers. In the pickling tank closest to the washing tank, the regenerated wafers need to be separated from the transport carriers to wash the regenerated wafers with water, while reducing the overlapping parts between the regenerated wafers and the transport carriers, thereby reducing acid residue.

[0013] When it is necessary to separate the regenerated wafer from the transport carrier, the power unit first drives the transition clamping rod to clamp the ear plate of the transport carrier, and transports the transport carrier containing the regenerated wafer from one pickling tank to the last pickling tank. When the transition clamping rod drives the transport carrier to descend, the synchronous component pushes the regenerated wafer in the transport carrier out through the opening end of the transport carrier, realizing the separation of the regenerated wafer from the transport carrier. At the same time, the synchronous component makes the clamping groove on the transport clamping rod aligned with the regenerated wafer, so that the second power unit drives the two second clamping rods to move closer to each other, clamping the side of the regenerated wafer slightly below the center, thus facilitating the removal of the regenerated wafer from the pickling tank.

[0014] The synchronization components ensure that the regenerated wafer ejected from the transport carrier is always aligned with the clamping slot of the second clamping rod, thus facilitating subsequent water washing operations.

[0015] Optionally, the opposing component includes an abutment block disposed in the pickling tank and an opposing member disposed on the abutment block. The abutment block corresponds to the opening at the bottom of the transfer vehicle, and the abutment block has a receiving groove. Multiple receiving grooves are arranged at intervals along the length direction of the abutment block, and the multiple receiving grooves correspond one-to-one with multiple transfer grooves on the transfer vehicle. The opening width of the receiving groove corresponds to the width of the wider side of the loading groove opening, and the receiving groove is arranged in an arc shape.

[0016] By adopting the above technical solution, the set abutment block ejects the regenerated wafer from the transfer carrier, and the regenerated wafer is accommodated by the receiving groove opened on the abutment block, thereby reducing the collision between regenerated wafers.

[0017] Meanwhile, the receiving tank is designed in an arc shape to reduce acid residue in the tank, thereby reducing acid adhesion to the surface of the regenerated wafer. The opening width of the receiving tank is set to match the maximum opening of the transfer tank. When the abutment block pushes the regenerated wafer out of the transfer carrier, the regenerated wafer detaches from the opening of the loading tank. At this time, the regenerated wafer corresponds to the widest opening of the loading tank. Under the scouring of the acid in the pickling tank, the regenerated wafer will shake to the maximum extent. Since the opening width of the receiving tank corresponds to the widest width of the loading tank, the receiving tank is sufficient to load, accommodate, and eject the regenerated wafer that is shaking to the maximum extent at this time.

[0018] Optionally, the opposing component includes a limiting membrane rotatably disposed on the abutting block, the limiting membrane being movably protruding from the receiving groove, the receiving groove having a buffer block on the opposite side wall of the limiting membrane, the buffer block and the limiting membrane clamping the wafer, and multiple limiting membranes being evenly spaced along the height direction of the abutting block, and the abutting block also having an adjusting component for sequentially adjusting the multiple limiting membranes along the height direction;

[0019] When the transition clamping rod drives the transfer carrier to descend, it causes the limiting membrane to press against the carrier sequentially from the lowest side to the highest side.

[0020] By adopting the above technical solution, during the process of the abutment block pushing the regenerated wafer from the bottom to the top, the acid in the pickling tank continuously washes the bottom of the regenerated wafer. As the transport carrier descends, the washing area of ​​the acid and the regenerated wafer gradually increases, resulting in a gradual increase in the swaying amplitude of the regenerated wafer and an increased probability of collision between regenerated wafers. Therefore, by pushing out the limiting films sequentially during the assailing block's ascent, the regenerated wafer is gradually pressed against from the bottom, slowly reducing the swaying of the regenerated wafer. At the same time, by setting the limiting films to press against the wafer sequentially, the chipping caused by excessive acid resistance when pressing against the regenerated wafer simultaneously is reduced, thus minimizing the impact on the quality of the regenerated wafer and its influence on adjacent regenerated wafers.

[0021] By using sequentially tightening limiting films, starting from the bottom side, the regenerated wafer is less likely to collide with the opposite side walls of the receiving tank. By slowly pressing the regenerated wafer to the center of the receiving tank, it is easier to ensure that the regenerated wafer is in the exact center of the clamping tank when the subsequent transfer clamping rod rotates and approaches the regenerated wafer. This achieves stable transfer and clamping of the regenerated wafer, facilitating subsequent water washing operations and minimizing the residue of acid on the surface of the regenerated wafer.

[0022] Meanwhile, the setting of the limiting film greatly reduces the frictional damage caused by the bonding of the limiting film and the regenerated wafer, thereby improving the surface quality of the regenerated wafer.

[0023] Optionally, the clamping block is provided with a limiting cavity, which is connected to the opening of the limiting membrane. The adjusting member includes an adjusting block slidably disposed in the limiting cavity. The adjusting block is in contact with the inner wall of the limiting cavity. When the adjusting block slides toward the limiting membrane, it squeezes the air in the limiting cavity to the limiting membrane, causing the limiting membrane to protrude from the surface of the receiving groove. Multiple sets of adjusting blocks are provided, and each set of adjusting blocks corresponds to a set of limiting membranes.

[0024] By adopting the above technical solution, when the transition clamping rod drives the transfer carrier to descend, the adjustment block slides towards the abutment block as the transfer carrier descends, thereby causing the adjustment block to squeeze the limiting cavity, squeezing the air in the limiting cavity to the position of the limiting film, realizing the squeezing expansion of the limiting film, and realizing the clamping of the regenerated wafer by the limiting film.

[0025] Meanwhile, by setting multiple sets of adjustment blocks, multiple sets of limiting films are adjusted separately, thereby achieving separate correction of the bottom outer edge of the regenerated wafer, thus achieving stable correction of all regenerated wafers.

[0026] Optionally, a positioning block is slidably disposed inside the abutting block. The end side of the positioning block located inside the abutting block is inclined, and the inclined side of the positioning block is movably fitted and pressed against the adjusting block. The positioning block is elastically disposed on the abutting block, and the initial position of the positioning block is located in the middle of the abutting block.

[0027] By adopting the above technical solution, the slidable positioning block slides towards the abutment block during the descent of the transfer carrier. The inclined side of the positioning block abuts against the sliding adjustment block, thereby realizing the sliding drive of the adjustment block, causing the limiting film to protrude from the receiving groove and realize the correction of the regenerated wafer.

[0028] Furthermore, the initial position of the positioning block is set to the middle position. At this time, the positioning block that is driven first will press against the adjustment block in the middle position to adjust it, thereby realizing the first correction of the bottom side of the regenerated wafer.

[0029] Optionally, each receiving slot has two sets of positioning blocks, and the two sets of positioning blocks are symmetrically arranged on opposite sides of each receiving slot. A limiting block is slidably arranged on the abutment block. The limiting block is connected to the positioning block. One side of the limiting block protrudes from the abutment block, and the end of the limiting block protruding from the abutment block is inclined. The inclined side of the limiting block is in contact with the inner wall of the transfer vehicle, and the limiting block is completely located within the abutment block.

[0030] By adopting the above technical solution, the positioning block is set in two sets. At the same time, through the two sets of relatively symmetrically arranged limiting blocks, during the descent of the transfer vehicle, the limiting block slides towards the inner side of the limiting block, thereby realizing the synchronous sliding of the limiting block and the positioning block, realizing the adjustment of the adjusting block, and realizing the protrusion adjustment of the limiting membrane.

[0031] Meanwhile, by setting two sets of symmetrically arranged limit blocks, the unilateral force exerted on the transfer carrier by the limit block on one side of the abutment block when a single block is set is reduced. Through symmetrical arrangement, the forces on the transfer carrier are relatively balanced, thereby improving the stability of the regenerated wafers in the transfer carrier.

[0032] Optionally, the transfer clamping rod, the transition clamping rod, the limiting block and the positioning block provided on the clamping block are all made of inert materials that do not react with acid.

[0033] By adopting the above technical solution, since the pickling tank is usually filled with either hydrofluoric acid or amino acids, the abutment block and the components installed inside the abutment block are made of inert material, which improves the service life of the abutment block and the components installed inside the abutment block, while reducing the maintenance cycle.

[0034] Optionally, the opening width of the clamping grooves on the two second clamping rods on the side closer to each other is greater than the width of the two clamping grooves on the side farther from each other, and the clamping grooves smoothly transition from the side with the wider opening to the side with the narrower opening.

[0035] By adopting the above technical solution, the clamping groove is also set in the form of a wide opening that narrows. When the regenerated wafer is transferred by the transfer clamping rod, the acid on the surface of the regenerated wafer can drip from the wider opening of the clamping groove, thereby further reducing the pollution of the water washing tank caused by the acid entering the water washing tank.

[0036] In summary, this application includes at least one of the following beneficial technical effects:

[0037] 1. By setting up transfer clamping rods, transition clamping rods and facing components, when it is necessary to transfer the acid-washed regenerated wafers to the water washing tank, in order to reduce the maintenance cycle of the water washing tank, reduce the adhesion of acid, and reduce the problem of the transfer carrier entering the water washing tank, the transition clamping rods transfer the regenerated wafers in the transfer carrier.

[0038] 2. By setting an abutment block, opening a clamping groove on the abutment block, and setting a limiting membrane on the inner side wall of the clamping groove, when the abutment block ejects the regenerated wafer, the limiting membrane aligns and corrects the regenerated wafer, thereby facilitating the subsequent clamping and removal of the regenerated wafer by the transition clamping rod, and realizing the separation of the regenerated wafer from the transport carrier.

[0039] 3. By using the limiting block, positioning block, and adjusting block set on the abutment block, when the transfer carrier is driven down by the transition clamping rod, the limiting film is pushed out by the sliding limiting block, positioning block, and adjusting block, and the regenerated wafer is aligned and corrected from the bottom to the top in sequence. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the connection structure within the pickling tank and washing tank in the embodiments of this application;

[0042] Figure 3 This is a schematic diagram of the connection structure of the transfer components and the transition components;

[0043] Figure 4 This is a schematic diagram of the connection structure of the hidden transfer vehicle's rear transfer components and transition components;

[0044] Figure 5 This is a schematic diagram of the connection structure of the abutment block;

[0045] Figure 6 This is a schematic diagram of the internal connection structure of the abutment block.

[0046] Reference numerals: 1. Frame; 11. Washing tank; 12. Pickling tank; 13. First transition port; 14. Second transition port; 15. Sealed hatch; 17. First sliding groove; 18. Second sliding groove; 19. Transfer carrier; 191. Transfer trough; 2. Transition assembly; 21. Transition clamping rod; 22. First power component; 23. First clamping rod; 3. Transfer assembly; 31. Transfer clamping rod; 32. Second power component; 33. Second clamping rod; 34. Clamping groove; 4. Alignment assembly; 41. Abutment block; 42. Alignment component; 421. Limiting membrane; 43. Receiving groove; 431. Adjusting block; 432. Limiting cavity; 434. Adjusting spring; 44. Positioning block; 441. Positioning spring; 45. Limiting block. Detailed Implementation

[0047] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0048] This application discloses a wafer carrier transfer device for an intermediate cleaning machine. (Refer to...) Figure 1 and Figure 2 A wafer carrier transfer device for an intermediate cleaning machine includes a frame 1, which is horizontally arranged. Along the extending direction of the frame 1, there are sequentially arranged pickling tanks 12 and water washing tanks 11. Multiple sets of pickling tanks 12 and water washing tanks 11 are provided, with the multiple sets of water washing tanks 11 arranged adjacent to each other. A first transition port 13 and a second transition port 14 are provided between the two pickling tanks 12 closest to each water washing tank 11. Sealed doors 15 are slidably installed at both the first transition port 13 and the second transition port 14. Door 15 can be used to seal and open the first transition port 13 and the second transition port 14. At the same time, a transition component 2 is provided in the adjacent pickling tank 12. The transition component 2 is used to transport the transfer carrier 19 loaded with regenerated wafers. A sliding groove is provided on the side wall of the pickling tank 12 on the frame 1. The sliding groove includes a first sliding groove 17 arranged along the extension direction of the pickling tank 12 and a second sliding groove 18 arranged along the height direction of the washing tank 11. The first sliding groove 17 and the second sliding groove 18 are connected and arranged.

[0049] A transition component 2 is provided inside the washing pool 11, as shown in the reference. Figure 3 and Figure 4The transition component 2 includes a transition clamping rod 21 slidably disposed in the sliding groove and a first power component 22 for sliding and lifting driving of the transition clamping rod 21. The sliding direction of the transition clamping rod 21 is consistent with the extension direction of the first sliding groove 17 and the second sliding groove 18. The transition clamping rod 21 includes two first clamping rods 23 arranged opposite to each other. The two first clamping rods 23 rotate to move closer and further apart. At the same time, the two first clamping rods 23 move to clamp the ears of the transfer carrier 19, thereby driving the transfer carrier 19 loaded with regenerated wafers to be transported in the pickling tank 12.

[0050] Meanwhile, the frame 1 is provided with a first power component 22 for rotating and sliding adjustment of the transition clamping rod 21. The first power component 22 is a rotary cylinder with a slide rail. In this application, the transition clamping rod 21 and the rotary cylinder with a slide rail are both prior art, so the structure will not be described in detail.

[0051] Reference Figure 3 and Figure 4 The transfer assembly 3 includes a transfer clamping rod 31 that is lifted and slidably mounted on the frame 1. The transfer clamping rod 31 is used to transport the pickling tank 12 closest to the washing tank 11 and multiple washing tanks 11. The transfer clamping rod 31 includes two opposing second clamping rods 33. The two second clamping rods 33 are movably rotated and brought closer together. At the same time, the frame 1 is provided with a second power member 32 that drives the rotation and lifting and sliding of the two second clamping rods 33. In this application, the arrangement of the second power member 32 and the second clamping rod 33 is the same as that of the first power member 22 and the first clamping rod 23, so it will not be described in detail.

[0052] Meanwhile, a clamping groove 34 is provided on the second clamping rod 33. The opening width of the clamping groove 34 on the side closer to each other on the two second clamping rods 33 is greater than the width of the side farther away from each other on the two clamping grooves 34. The clamping groove 34 smoothly transitions from the side with a wider opening to the side with a narrower opening. The two second clamping rods 33 clamp the lower half of the regenerated wafer, thereby separating the regenerated wafer and the transfer carrier 19 in the last pickling tank 12. The last pickling tank 12 is also provided with a facing component 4 for the regenerated wafer in the transfer carrier 19 to face the clamping groove 34.

[0053] Reference Figure 5 and Figure 6 The positive component 4 includes an abutment block 41 fixed in the pickling tank 12 and a positive component 42 disposed on the abutment block 41. The size of the abutment block 41 is consistent with the size of the bottom opening of the transfer carrier 19. Thus, when the transition clamping rod 21 drives the transfer carrier 19 to descend, the abutment block 41 presses against the regenerated wafer in the transfer carrier 19, pushing the regenerated wafer out of the transfer carrier 19, thereby realizing the separation of the regenerated wafer from the transfer carrier 19.

[0054] Meanwhile, a receiving groove 43 is provided on the abutment block 41, and the receiving groove 43 corresponds one-to-one with the transfer groove 191 on the transfer carrier 19. Since the transfer groove 191 is designed to facilitate the loading of the regenerated wafer, it has a wider opening and a narrower inner bottom wall. Therefore, the width of the receiving groove 43 is consistent with the width of the widest side of the transfer groove 191. At the same time, the opposing part 42 includes a limiting film 421 provided on the inner side wall of the receiving groove 43. The limiting film 421 is movably protruding from the receiving groove 43 and is used to clamp the regenerated wafer.

[0055] It should be noted that the liquid flow direction in the pickling tank 12 and the washing tank 11 is consistent with the extension direction of the pickling tank 12 and the washing tank 11. Therefore, when the regenerated wafer is separated from the transfer carrier 19, the scouring of the liquid will cause the regenerated wafer to shake, resulting in a collision between the wafers. Therefore, in order to solve this problem, the regenerated wafer is aligned and corrected by setting a limiting film 421.

[0056] Since the regenerated wafer needs to be removed and transferred by the transfer clamping rod 31 after calibration, the difficulty of separating the regenerated wafer from the abutment block 41 needs to be taken into account. Therefore, the top side of the abutment block 41 is set in an arc shape, and the receiving groove 43 is also set in an arc shape.

[0057] The abutment block 41 is provided with multiple sets of limiting membranes 421. The multiple sets of limiting membranes 421 are evenly distributed along the arc side of the receiving groove 43. The abutment block 41 is also provided with an adjusting member for sequentially adjusting the multiple limiting membranes 421 along the height direction.

[0058] The limiting membranes 421 in each receiving slot 43 are arranged opposite each other, and when the transition clamping rod 21 drives the transfer carrier 19 to descend, it drives the limiting membranes 421 to be tightened sequentially from the bottom side to the top side.

[0059] The abutting block has limiting holes. Multiple limiting membranes 421 at the same height within multiple receiving grooves 43 belong to the same group. The abutting block 41 has multiple sets of limiting cavities 432, each corresponding to one of the multiple limiting membranes 421. The abutting block 41 is equipped with adjusting members for adjusting the limiting membranes 421. Figure 3 and Figure 4 The adjusting component includes an adjusting block 431 that is slidably disposed in the limiting cavity 432. The sliding direction of the adjusting block 431 is consistent with the height direction of the abutment block 41. Thus, when the adjusting block 431 slides towards the top, the air in the limiting cavity 432 is squeezed to the limiting membrane 421, causing the limiting membrane 421 to expand and clamp the regenerated wafer, so that the regenerated wafer is stably located in the center position in the receiving groove 43. At the same time, an adjusting spring 434 is fixedly connected to the side of the adjusting block 431 near the limiting cavity 432.

[0060] Meanwhile, in order to achieve sliding adjustment of the adjusting block 431, a positioning block 44 is also slidably arranged inside the abutting block 41. The positioning block 44 is aligned with the extension direction of the pickling tank 12 and the washing tank 11. The end side of the positioning block 44 inside the abutting block is inclined. The inclined side of the positioning block 44 is in movably and tightly abutting the adjusting block 431. The positioning block 44 is elastically arranged inside the abutting block. The initial position of the positioning block 44 is located in the middle of the abutting block.

[0061] During the descent of the transfer vehicle 19, in order to achieve sliding adjustment of the positioning block 44, a limiting block 45 is slidably provided inside the abutment block 41. The limiting block 45 is arranged to protrude from the outer peripheral wall of the abutment block 41, and the limiting block 45 is inclined on the side outside the abutment block 41.

[0062] The inclined side of the limiting block 45 is in contact with the inner wall of the transfer carrier 19, and the limiting block 45 is completely located within the abutment block. The limiting block 45 is fixedly connected to the positioning block 44, and a positioning spring 441 is fixedly connected to one end of the positioning block 44 located within the abutment block 41. The positioning spring 441 is fixedly connected to the abutment block 41. Thus, during the descent of the transfer carrier 19, the inner wall of the transfer carrier 19 abuts against the inclined side of the limiting block 45, causing the limiting block 45 to slide into the abutment block 41, which in turn causes the positioning block 44 to slide into the abutment block 41. Thus, starting from the middle, the limiting membrane 421 at the bottom is adjusted. During the sliding of the positioning block 44, the limiting membranes 421 near the side are adjusted in sequence.

[0063] In order to reduce the problem of unbalanced force applied by the abutment block 41 to the transfer carrier 19 during the descent of the transfer carrier 19, two sets of positioning blocks 44 and limiting blocks 45 are provided. The two sets of positioning blocks 44 are symmetrically arranged on opposite sides of each receiving slot 43 along the length direction of the abutment block 41.

[0064] By reducing the force exerted on one side of the transfer carrier 19 by the limiting block 45 on one side of the abutment block 41 when a single setting is used, the forces on the transfer carrier 19 are relatively balanced by symmetrical setting, thereby improving the stability of the regenerated wafer in the transfer carrier 19.

[0065] When applied in practice, considering the impact of the acidic environment on the circuit system, all adjustments in the pickling tank 12 are made in the form of mechanical adjustment, and the abutment block 41, adjustment block 431 and positioning block 44 are all made of inert materials that do not react with acid. In this application, the inert material can be any one of PP, HDPE, Tritan, PC, ABC and PVC.

[0066] The implementation principle of the intermediate cleaning machine wafer carrier transfer device in this application embodiment is as follows: When it is necessary to perform acid cleaning or water washing on the regenerated wafer, the transfer carrier 19 loaded with the regenerated wafer is transported by the transition clamping rod 21, and the transfer carrier 19 is completely submerged in the acid cleaning tank 12 to perform acid cleaning on the surface of the regenerated wafer. In the last acid cleaning tank 12 near the water washing tank 11, after the transfer carrier 19 is transported into the acid cleaning tank 12 by the transition clamping rod 21, it is connected by the abutment block 41. The regenerated wafer is separated from the transport carrier 19 until it is completely separated from the transport carrier 19. The regenerated wafer is then accommodated and clamped by the receiving groove 43 on the abutment block 41. As the transport carrier 19 descends, the abutment limit block 45 slides and drives the positioning block 44 to slide, which in turn abuts the limit film 421 in the receiving groove 43. This achieves centering and correction of the regenerated wafer from the bottom to the top, which facilitates the subsequent removal of the regenerated wafer by the transport clamping rod 31.

[0067] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An intermediate cleaning machine wafer carrier transfer device, comprising a frame (1) and arranged in sequence on the frame (1) an acid washing pool (12) and a water washing pool (11), characterized in that: It also includes a transition component (2) disposed in the pickling tank (12) and a transfer component (3) disposed in the washing tank (11). The washing tank (11) has a first transition port (13) on its side wall near the pickling tank (12), and the pickling tank (12) has a second transition port (14) on its side wall near the washing tank (11). The first transition port (13) and the second transition port (14) are arranged opposite each other, and both the first transition port (13) and the second transition port (14) are provided with automatically opening and closing sealed doors (15). The side wall of the pickling tank (12) is provided with a sliding groove, which includes a first sliding groove (17) arranged along the extension direction of the pickling tank (12) and the washing tank (11) and a second sliding groove (18) arranged along the height direction of the pickling tank (12). The transition assembly (2) includes a transition clamping rod (21) slidably disposed in the sliding groove and a first power component (22) for sliding and lifting drive of the transition clamping rod (21). The transition clamping rod (21) includes two sets of first clamping rods (23) arranged opposite to each other. The two sets of first clamping rods (23) move closer together, and the first clamping rods (23) are in contact with the bottom side of the lug of the transfer carrier (19). The transfer assembly (3) includes a transfer clamping rod (31) that is lifted and slidably disposed on the frame (1) and a second power component (32) that drives the transfer clamping rod (31) to slide. The transfer clamping rod (31) includes two opposing second clamping rods (33), each of which has a clamping groove (34). The clamping groove (34) corresponds one-to-one with each wafer in the transfer carrier (19). The washing tank (11) is also provided with an alignment component (4) for making the clamping groove (34) and the wafer in the transfer carrier (19) completely aligned.

2. The intermediate cleaning machine wafer carrier transfer device according to claim 1, characterized in that: The opposing component (4) includes an abutment block (41) disposed in the pickling tank (12) and an opposing component (42) disposed on the abutment block (41). The abutment block (41) corresponds to the opening at the bottom of the transfer vehicle (19), and the abutment block (41) is provided with a receiving groove (43). Multiple receiving grooves (43) are arranged at intervals along the length of the abutment block (41), and multiple receiving grooves (43) correspond one-to-one with multiple transfer grooves (191) on the transfer vehicle (19). The opening width of the receiving groove (43) corresponds to the width of the wider side of the loading groove opening, and the receiving groove (43) is arranged in an arc shape.

3. The intermediate cleaning machine wafer carrier transfer device according to claim 2, characterized in that: The opposing component (42) includes a limiting membrane (421) rotatably disposed on the abutment block (41). The limiting membrane (421) is movably protruding from the receiving groove (43). The receiving groove (43) is provided with a buffer block on the opposite side wall of the limiting membrane (421). The buffer block and the limiting membrane (421) clamp the wafer. At the same time, multiple limiting membranes (421) are evenly distributed at intervals along the height direction of the abutment block (41). The abutment block is also provided with an adjusting component for sequentially adjusting the multiple limiting membranes (421) along the height direction. When the transition clamping rod (21) drives the transfer carrier (19) to descend, it causes the limiting membrane (421) to press against the lowest side to the highest side in sequence.

4. The intermediate cleaning machine wafer carrier transfer device according to claim 3, characterized in that: The abutting block is provided with a limiting cavity (432), which is connected to the opening of the limiting membrane (421). The adjusting member includes an adjusting block (431) that is slidably disposed in the limiting cavity (432). The adjusting block (431) is in contact with the inner wall of the limiting cavity (432). When the adjusting block (431) slides toward the limiting membrane (421), it squeezes the air in the limiting cavity (432) to the limiting membrane (421), so that the limiting membrane (421) protrudes from the surface of the receiving groove (43). There are multiple sets of adjusting blocks (431), and the multiple sets of adjusting blocks (431) correspond one-to-one with the multiple sets of limiting membranes (421).

5. The intermediate cleaning machine wafer carrier transfer device according to claim 4, characterized in that: A positioning block (44) is slidably disposed inside the abutting block. The end side of the positioning block (44) inside the abutting block is inclined, and the inclined side of the positioning block (44) is movably fitted and pressed against the adjusting block (431). The positioning block (44) is elastically disposed on the abutting block, and the initial position of the positioning block (44) is located in the middle of the abutting block.

6. The wafer carrier transfer device for an intermediate cleaning machine according to claim 5, characterized in that: Each receiving slot (43) has two sets of corresponding positioning blocks (44), and the two sets of positioning blocks (44) are symmetrically arranged on opposite sides of each receiving slot (43). A limiting block (45) is slidably arranged on the abutment block. The limiting block (45) is connected to the positioning block (44). One side of the limiting block (45) protrudes from the abutment block, and the end of the limiting block (45) protruding from the abutment block is inclined. The inclined side of the limiting block (45) is in contact with the inner wall of the transfer carrier (19), and the limiting block (45) is completely located inside the abutment block.

7. The intermediate cleaning machine wafer carrier transfer device according to claim 6, characterized in that: The transfer clamping rod (31), the transition clamping rod (21), the limiting block (45) and the positioning block (44) provided on the abutting block are all made of inert materials that do not react with acid.

8. The intermediate cleaning machine wafer carrier transfer device according to claim 7, characterized in that: The opening width of the clamping grooves (34) on the two second clamping rods (33) on the side closer to each other is greater than the width of the two clamping grooves (34) on the side farther away from each other, and the clamping grooves (34) smoothly transition from the side with wider opening to the side with narrower width.

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