Wafer polishing and grinding apparatus and grinding method thereof

Abstract

The application relates to the technical field of grinding and polishing, and particularly discloses a wafer polishing and grinding device and a grinding method thereof. The stacking station arranged on the mounting table can realize orderly storage of the grinding and polishing pad to be replaced, and the basic layout of the grinding and polishing table and the grinding and polishing head is matched, a transfer mechanism, a suction mechanism and a pasting mechanism are integrated on the mounting seat, so that the device has the capability of automatically replacing the grinding and polishing pad. The suction mechanism accurately grabs the grinding and polishing pad on the stacking station through one of the transfer parts of the transfer mechanism, and meanwhile, the grinding and polishing head moves away from the working area along another transfer part; the pasting mechanism drives the grinding and polishing pad to be precisely bonded with the grinding and polishing table, thereby completely eliminating the positioning deviation and time loss caused by manual operation and greatly shortening the replacement time of the grinding and polishing pad.

Description

Technical Field

[0001] This application relates to the field of grinding and polishing technology, and in particular to a wafer polishing and grinding equipment and its grinding method. Background Technology

[0002] As the core substrate in semiconductor manufacturing, the surface flatness and smoothness of wafers directly affect the processing accuracy and device performance of integrated circuits. Chemical mechanical polishing (CMP) technology, through the synergistic effect of mechanical grinding and chemical etching, can achieve nanoscale planarization and subsurface damage control on wafer surfaces, and has become an indispensable key process in advanced manufacturing processes.

[0003] A typical wafer polishing and grinding system consists of four core components: a horizontally rotating polishing table, a porous polyurethane polishing pad fixed to the surface of the polishing table, a continuously supplied chemical polishing slurry, and a polishing head that vacuum-adsorbs the wafer. Its working principle is as follows: the polishing head presses the wafer onto the surface of the polishing pad. Under set pressure and speed, the polishing table drives the polishing pad to rotate. The polishing slurry forms a hydrodynamic pressure film at the interface, removing surface material through the dual action of abrasive micro-cutting and chemical reaction. During this process, the microporous structure of the polishing pad plays a crucial role in transporting the polishing slurry, removing reaction byproducts, and maintaining frictional stability; its physical state directly affects the polishing quality.

[0004] However, polishing pads, as high-wear components, degrade in performance after 50-70 hours of continuous operation due to surface glazing, micropore blockage, or structural deformation, requiring frequent replacement. The current replacement process relies on manual operation: operators must manually remove the old pad and clean the polishing table substrate, then peel off the protective film on the back of the new pad section by section, while simultaneously pressing the polishing pad radially to remove air bubbles and eliminate wrinkles. This process requires precise alignment of the pad with the table surface and ensuring the adhesive strength of the polishing pad surface does not decrease; the adhesive bonding must be completed within 5 minutes, resulting in an extremely low margin for error. Statistics show that a single replacement takes an average of 40 minutes, and the rate of localized air bubbles caused by uneven manual pressing is as high as 15%, leading to premature polishing pad failure and a sharp increase in the risk of wafer scratches, severely restricting the continuous production capacity of the production line. Summary of the Invention

[0005] To address the problems of air bubbles, wrinkles, and insufficient bonding strength caused by operational deviations during manual polishing pad replacement, which in turn lead to deterioration of polishing uniformity, increased risk of wafer scratches, and excessive downtime, this application provides a wafer polishing and grinding device and its grinding method.

[0006] This application provides a wafer polishing and grinding equipment, which adopts the following technical solution:

[0007] A wafer polishing and grinding apparatus includes a mounting platform, a polishing table disposed on the mounting platform, and a polishing head disposed above the polishing table. The mounting platform has a stacking station for placing polishing pads to be replaced. A mounting base is disposed between the polishing table and the stacking station. A transfer mechanism is disposed on the mounting base. The polishing head is mounted on one transfer part of the transfer mechanism. The other transfer part of the transfer mechanism has an adsorption mechanism for adsorbing the polishing pads stacked at the stacking station. The adsorption mechanism has a bonding mechanism for attaching the polishing pads to the polishing table.

[0008] By adopting the above technical solution, the stacking station on the mounting platform can achieve orderly storage of grinding and polishing pads to be replaced. Combined with the basic layout of the grinding and polishing table and grinding and polishing head, a transfer mechanism, an adsorption mechanism, and a bonding mechanism are integrated on the mounting base, enabling the equipment to automatically replace grinding and polishing pads. The adsorption mechanism precisely picks up the grinding and polishing pads from the stacking station through one of the transfer parts of the transfer mechanism, while the grinding and polishing head moves away from the work area with the other transfer part. The bonding mechanism drives the grinding and polishing pads to precisely adhere to the grinding and polishing table, completely eliminating positioning deviations and time losses caused by manual operation, and significantly shortening the replacement time for grinding and polishing pads.

[0009] Optionally, the transfer mechanism includes a transfer frame rotatably mounted on the mounting base and a power component for driving the transfer frame to rotate horizontally. The grinding and polishing head is disposed at one end of the transfer frame, and the adsorption mechanism and the bonding mechanism are disposed at the other end of the transfer frame.

[0010] By adopting the above technical solution, the transfer frame can achieve horizontal rotation under the drive of the power component, so that the grinding and polishing head, the adsorption mechanism, and the bonding mechanism form a spatial linkage. When the transfer frame rotates, the grinding and polishing head carried at one end can be moved out of the grinding and polishing table at the same time, so that the grinding and polishing pad that needs to be replaced on the grinding and polishing table can be removed, thus realizing the disassembly of the old grinding and polishing pad.

[0011] Optionally, the adsorption mechanism includes an adsorption plate, a lifting component, a negative pressure tube, and a negative pressure chamber. The lifting component is mounted on the transfer frame, and the adsorption plate is flexibly mounted on the lifting end of the lifting component. Multiple sets of negative pressure tubes and negative pressure chambers are evenly distributed outwards from the center of the adsorption plate.

[0012] Multiple negative pressure tubes are arranged parallel to the central axis of the adsorption plate in each group, and the negative pressure tubes in each group form concentric circles with different diameters and the same center. One end of each negative pressure tube passes through the side of the adsorption plate away from the lifting component, and the other end of each group of negative pressure tubes is connected to the corresponding negative pressure cavity. Each negative pressure cavity is connected to the external negative pressure system.

[0013] The bonding mechanism is located inside the adsorption plate and is used to drive the grinding and polishing pads adsorbed on the adsorption plate to be bonded to the grinding and polishing table from the center to the edge.

[0014] By adopting the above technical solution, the adsorption disk achieves vertical displacement through a lifting component, and together with a concentric adsorption array composed of multiple sets of negative pressure tubes and negative pressure chambers, a gradient negative pressure field is formed. The bonding mechanism is built into the adsorption disk, and during the bonding process, it drives the grinding and polishing pad to gradually press from the center to the edge, suppressing the generation of air bubbles from the source.

[0015] Optionally, the bonding mechanism includes a push rod, a separating hemisphere, a telescopic component, a flattening component, and a wrinkle-removing component. A sliding groove is provided on the central axis of the adsorption plate for the push rod to slide and install. A receiving groove is provided on the adsorption plate in connection with the sliding groove for the flattening component and the wrinkle-removing component to be accommodated. The receiving groove is located on the side of the sliding groove away from the lifting component and extends through the adsorption plate.

[0016] The telescopic component is located on the side of the adsorption plate near the lifting component, and the telescopic end is coaxially and fixedly connected to the push rod. The separating hemisphere is elastically telescopically located at the end of the push rod away from the telescopic component, and the end away from the push rod is set as a hemispherical surface.

[0017] Both the flattening assembly and the wrinkle-reducing assembly are evenly and spaced out in multiple sets along the circumference of the push rod, and each wrinkle-reducing assembly is located between two adjacent flattening assemblies.

[0018] By adopting the above technical solution, the push rod moves axially along the slide groove under the drive of the telescopic component, pushing the separation hemisphere to elastically lift the central area of ​​the grinding and polishing pad. The flattening component and the anti-wrinkle component are distributed circumferentially around the push rod and are in a retracted and ready state within the receiving groove; when the push rod extends, the two expand synchronously and perform radial movement, realizing the coordinated action of "center point pressing - circumferential extension and flattening - gap anti-wrinkle", ensuring that the grinding and polishing pad is spread out in a concentric circle without wrinkles.

[0019] Optionally, the flattening assembly includes a first elastic telescopic rod, a pressure roller, and a second elastic telescopic rod. One end of the first elastic telescopic rod is rotatably mounted on the peripheral wall of the push rod in the receiving groove, and the pressure roller is rolled on the other end of the first elastic telescopic rod and elastically abuts against the inner wall of the receiving groove.

[0020] One end of the second elastic telescopic rod is rotatably mounted on the side wall of the first elastic telescopic rod, and the other end is rotatably mounted on the peripheral wall of the push rod in the receiving groove, and is used to provide the pressure roller with a force that moves away from the outlet of the receiving groove.

[0021] By adopting the above technical solution, the first elastic telescopic rod and the second elastic telescopic rod form a linkage mechanism, and the second elastic telescopic rod can push the first elastic telescopic rod against the inner wall of the receiving groove. During the extension of the push rod, the end of the first elastic telescopic rod eventually overcomes the elastic force of the second elastic telescopic rod and extends out of the receiving groove, thereby unfolding outward. In conjunction with the outlet end of the receiving groove, the pressure roller presses the surface of the grinding and polishing pad with a certain pressure. At the same time, the rolling installation design of the pressure roller reduces frictional resistance and avoids tearing of the backing adhesive layer.

[0022] Optionally, the anti-puff assembly includes a third elastic telescopic rod, a vibrating roller, a fourth elastic telescopic rod, a vibrating motor, and a battery. One end of the third elastic telescopic rod is rotatably mounted on the peripheral wall of the push rod in the receiving groove, and the vibrating roller is rolled on the other end of the third elastic telescopic rod and elastically abuts against the inner wall of the receiving groove.

[0023] One end of the fourth elastic telescopic rod is rotatably mounted on the side wall of the third elastic telescopic rod, and the other end is rotatably mounted on the peripheral wall of the push rod in the receiving groove, and is used to provide the vibrating roller with a force that moves away from the outlet of the receiving groove;

[0024] Both the vibration motor and the battery are located inside the vibration roller, and the battery and the vibration motor are electrically connected.

[0025] By adopting the above technical solution, the third and fourth elastic telescopic rods are linked to the vibrating roller, and the vibrating motor, powered by a battery, generates high-frequency micro-amplitude vibration. When the vibrating roller contacts the grinding and polishing pad, the vibration energy is transferred to the adhesive interface, causing air bubbles or wrinkles to migrate to the edge; at the same time, the vibration causes the adhesive molecular chains to recombine, further improving the bonding strength.

[0026] Optionally, a mounting cylinder is coaxially fixed inside the vibrating roller, and the vibrating motor and the battery are both installed inside the mounting cylinder. A silicone vibration isolation pad, a honeycomb titanium plate, and a constraint layer damping pad are sequentially and coaxially sleeved and fixed outside the mounting cylinder. The circumferential surface of the vibrating roller is arranged in a porous manner.

[0027] By adopting the above technical solution, the four-layer collaborative filtering design of silicone vibration isolation pads, honeycomb titanium plates, constraint layer damping pads, and the porous rolling surface of the vibrating roller achieves refined control of vibration energy: the silicone vibration isolation pads first absorb the high-frequency harmonics of the motor, converting part of the mechanical energy into heat energy, eliminating the hidden danger of damaging the microporous structure of the polishing pad from the source; the honeycomb titanium plates diffuse vibration energy through the hexagonal cavity structure, avoiding the inherent resonance frequency band of the roller, and significantly attenuating the acceleration amplitude of the dangerous frequency band; the constraint layer damping pads perform viscous energy dissipation for the core working frequency band, significantly attenuating the mid-frequency vibration with a high loss factor, and avoiding uneven pressure on the adhesive layer; finally, the porous rolling surface reduces the non-uniformity of the rolling surface vibration through acoustic impedance gradual matching, achieving amplitude spatial homogenization.

[0028] This progressive energy conversion ensures that the effective output vibration retains only a small amount of delicate energy, thus delicately eliminating wrinkles or bubbles in the polishing pad without damaging it.

[0029] Optionally, two vibration motors are provided inside the mounting cylinder. The two vibration motors are arranged collinearly and their vibration ends are arranged opposite to each other. The battery is installed in the middle of the two vibration motors.

[0030] By adopting the above technical solution, the two vibratory motors are arranged collinearly and in opposite directions, and their excitation forces cancel each other out in the middle of the mounting cylinder, eliminating lateral disturbance forces. The battery is centrally mounted to optimize the counterweight balance, enabling the vibratory roller to maintain a high dynamic balance accuracy during rolling, ensuring the stability of the wrinkle removal or foam removal action.

[0031] Optionally, a wiring groove is provided on the inner wall of the mounting cylinder, the wiring groove extends to the end of the vibrating roller, and the end of the vibrating roller is provided with a charging port. A wire is fixedly laid in the wiring groove, and the wire connects the charging port and the battery.

[0032] By adopting the above technical solution, the charging port is located at the end of the vibrating roller, which can quickly replenish energy when the equipment is in standby mode.

[0033] This application also provides a wafer grinding method, which uses the above-mentioned wafer polishing and grinding equipment for grinding, including the following steps:

[0034] S1: Adjust the height of the grinding and polishing head to separate the grinding and polishing head from the upper surface of the grinding and polishing table, drive the power component to rotate the transfer frame until the grinding and polishing head rotates outside the grinding and polishing table;

[0035] S2: Remove the polishing pad from the polishing table and remove any residual adhesive from it;

[0036] S3: The driving power component drives the transfer frame to rotate until the adsorption plate on the transfer frame is directly facing the grinding and polishing pad on the stacking station.

[0037] S4: Drive the lifting component to lower the adsorption plate, adsorb the grinding and polishing pad onto the surface of the adsorption plate, and drive the lifting component to raise the adsorption plate to the initial height.

[0038] S5: The drive power component drives the transfer frame to rotate until the adsorption plate is directly facing the grinding and polishing table. The drive lift then lowers the adsorption plate to a certain height above the upper surface of the grinding and polishing table. This height can be adjusted by preset.

[0039] S6: Drive the telescopic component to extend, drive the push rod to separate the center of the grinding and polishing pad from the surface of the adsorption plate, and press the center of the grinding and polishing pad to the center of the grinding and polishing table.

[0040] S7: Continue to drive the telescopic component to extend, so that the push rod drives the pressure roller and the vibrating roller to press and adhere the grinding and polishing pad from the center outward and vibrate to eliminate wrinkles. The telescopic component is finally extended until the grinding and polishing pad is completely adhered to the grinding and polishing table.

[0041] S8: Drive the telescopic component to retract, then drive the lifting component to raise the adsorption plate to the initial height, drive the power component to rotate the transfer frame until the grinding and polishing head is directly facing the grinding and polishing table, and finally adjust the height of the grinding and polishing head so that the grinding and polishing head is in contact with the upper surface of the grinding and polishing table.

[0042] In summary, this application includes at least the following beneficial technical effects: The present invention achieves rapid switching between the grinding and polishing head and the grinding and polishing pad through the dual-station rotation design of the transfer frame, completing the station conversion and component reset within a limited installation space, thus significantly reducing equipment idle rate; at the same time, it develops a built-in pressure-elimination integrated mechanism, integrating the flattening component and the anti-wrinkle component inside the adsorption plate, which synchronously unfolds radial operation under the axial drive of the push rod, and performs concentric progressive pressing with the central separation hemisphere as the origin, combined with the high-frequency micro-amplitude excitation of the vibrating roller to destroy the surface tension of the bubbles and drive the molecular chain recombination of the adhesive layer, so that the bonding strength is stronger and the bubble rate approaches zero, realizing rapid replacement of the grinding and polishing pad, greatly reducing replacement time, reducing equipment downtime for replacement, and improving production efficiency. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the overall structure of the polishing and grinding equipment in the embodiments of this application;

[0045] Figure 2 yes Figure 1 A schematic diagram of the structure at the central adsorption disk;

[0046] Figure 3 yes Figure 2 A schematic diagram of the structure from the bottom of the adsorption disk;

[0047] Figure 4 yes Figure 2 Cross-sectional view of the central adsorption disk;

[0048] Figure 5 yes Figure 3 A schematic diagram of the bonding mechanism.

[0049] Figure 6 yes Figure 5 Schematic diagram of the structure of the vibrating roller;

[0050] Figure 7 yes Figure 6 A cross-sectional view of the vibrating roller.

[0051] Reference numerals: 1. Mounting platform; 11. Mounting base; 2. Grinding and polishing table; 21. Liquid outlet head; 22. Dresser; 3. Grinding and polishing head; 4. Transfer mechanism; 41. Transfer frame; 42. Power component; 5. Adsorption mechanism; 51. Adsorption plate; 52. Lifting component; 53. Negative pressure pipe; 54. Negative pressure chamber; 6. Adhesion mechanism; 61. Push rod; 62. Separating hemisphere; 63. Telescopic component; 7. Flattening assembly; 71. First elastic telescopic rod; 72. Pressure roller; 73. Second elastic telescopic rod; 8. Anti-wrinkle assembly; 81. Third elastic telescopic rod; 82. Vibrating roller; 83. Fourth elastic telescopic rod; 84. Vibration motor; 85. Battery; 91. Mounting cylinder; 92. Silicone vibration isolation pad; 93. Honeycomb titanium plate; 94. Constraint layer damping pad. Detailed Implementation

[0052] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail below.

[0053] This application discloses a wafer polishing and grinding device.

[0054] Reference Figure 1 and Figure 2 A wafer polishing and grinding apparatus includes a mounting platform 1, a grinding and polishing table 2 disposed on the mounting platform 1, a grinding and polishing head 3 disposed above the grinding and polishing table 2, a liquid outlet head 21 disposed on the mounting platform 1 for supplying polishing fluid, and a dressing device 22 for leveling and dressing the grinding and polishing pad.

[0055] Reference Figure 1 and Figure 2The mounting table 1 is provided with a stacking station for placing the grinding and polishing pads to be replaced. The grinding and polishing table 2 and the stacking station are provided with a mounting base 11. The mounting base 11 is provided with a transfer mechanism 4. The grinding and polishing head 3 is installed on one of the transfer parts of the transfer mechanism 4. The other transfer part of the transfer mechanism 4 is provided with an adsorption mechanism 5 for adsorbing the grinding and polishing pads stacked at the stacking station. The adsorption mechanism 5 is provided with an adhesion mechanism 6 for attaching the grinding and polishing pads to the grinding and polishing table 2.

[0056] The mounting platform 1 is also equipped with an operating system for controlling the electrical components such as the grinding and polishing head 3, the transfer mechanism 4, the adsorption mechanism 5, and the bonding mechanism 6. The operating system controls the operation of each mechanism in an orderly manner through a program. Its operating principle is common knowledge and will not be elaborated here.

[0057] Reference Figure 1 and Figure 2 The transfer mechanism 4 includes a transfer frame 41 rotatably mounted on the mounting base 11 and a power component 42 for driving the transfer frame 41 to rotate horizontally. The power component 42 is a geared motor, which is rotatably mounted on the mounting base 11 with its output end facing vertically. The transfer frame 41 is fixed to the output end of the geared motor. When the geared motor rotates, it can drive the transfer frame 41 to rotate horizontally.

[0058] The grinding and polishing head 3 is located at one end of the transfer frame 41, and the transfer frame 41 is equipped with a lifting cylinder for driving the grinding and polishing head 3 to rise and fall. The adsorption mechanism 5 and the bonding mechanism 6 are located at the other end of the transfer frame 41.

[0059] Driven by the power component 42, the transfer frame 41 can achieve horizontal rotation, enabling the grinding and polishing head 3 to form a spatial linkage with the adsorption mechanism 5 and the bonding mechanism 6. When the transfer frame 41 rotates, the grinding and polishing head 3 carried at one end can be moved out of the grinding and polishing table 2 simultaneously. At this time, the grinding and polishing pad that needs to be replaced on the grinding and polishing table 2 can be removed, realizing the disassembly of the old grinding and polishing pad.

[0060] Reference Figure 2 , Figure 3 and Figure 4 The adsorption mechanism 5 includes an adsorption plate 51, a lifting component 52, a negative pressure pipe 53, and a negative pressure chamber 54. The lifting component 52 is mounted on the transfer frame 41, and the adsorption plate 51 is lifted and installed on the lifting end of the lifting component 52. The negative pressure pipe 53 and the negative pressure chamber 54 are evenly distributed in multiple sets outward from the center of the adsorption plate 51.

[0061] Multiple negative pressure tubes 53 are arranged parallel to the central axis of the adsorption plate 51, and the negative pressure tubes 53 are arranged in concentric circles with different diameters and the same center. One end of each negative pressure tube 53 passes through the side of the adsorption plate 51 away from the lifting component 52, and the other end of each negative pressure tube 53 is connected to the corresponding negative pressure cavity 54. Each negative pressure cavity 54 is connected to the external negative pressure system.

[0062] The bonding mechanism 6 is located inside the adsorption plate 51 and is used to drive the grinding and polishing pads adsorbed on the adsorption plate 51 to be bonded to the grinding and polishing table 2 from the center to the edge.

[0063] The adsorption plate 51 achieves vertical displacement through the lifting component 52, and together with the concentric adsorption array formed by multiple sets of negative pressure tubes 53 and negative pressure chambers 54, a gradient negative pressure field is formed. The bonding mechanism 6 is built into the adsorption plate 51, and drives the grinding and polishing pad to gradually press from the center to the edge during the bonding process, suppressing the generation of air bubbles from the source.

[0064] Reference Figure 4 and Figure 5 The bonding mechanism 6 includes a push rod 61, a separating hemisphere 62, a telescopic component 63, a flattening component 7, and a wrinkle-reducing component 8. A sliding groove for sliding installation of the push rod 61 is provided on the central axis of the adsorption plate 51. A receiving groove for accommodating the flattening component 7 and the wrinkle-reducing component 8 is provided on the adsorption plate 51 in connection with the sliding groove. The receiving groove is located on the side of the sliding groove away from the lifting component 52 and extends through the adsorption plate 51.

[0065] The telescopic component 63 is located on the side of the adsorption plate 51 near the lifting component 52, and the telescopic end is coaxially and fixedly connected to the push rod 61. The separating hemisphere 62 is elastically telescopically located at the end of the push rod 61 away from the telescopic component 63, and the end away from the push rod 61 is set as a hemispherical surface. In this embodiment, the separating hemisphere 62 is made of a soft material, such as silicone rubber or high-performance polyurethane.

[0066] Both the flattening component 7 and the anti-wrinkle component 8 are evenly and spaced out in multiple sets along the circumference of the push rod 61, and each anti-wrinkle component 8 is located between two adjacent flattening components 7.

[0067] Driven by the telescopic component 63, the push rod 61 moves axially along the groove, pushing the separation hemisphere 62 to elastically lift the central area of ​​the grinding and polishing pad. The flattening component 7 and the anti-wrinkle component 8 are distributed circumferentially around the push rod 61 and are in a retracted and ready state within the receiving groove; when the push rod 61 extends, the two expand synchronously and perform radial movement, realizing the coordinated action of "center point pressing - circumferential extension and flattening - gap anti-wrinkle", ensuring that the grinding and polishing pad is spread out in a concentric circle without wrinkles.

[0068] When the grinding and polishing pad is pressed and adhered from the center to the edge, multiple negative pressure tubes 53 can be controlled to stop the negative pressure suction. For example, the innermost negative pressure tube 53 first disconnects the negative pressure suction of the grinding and polishing pad. Combined with the pressing action of the separation hemisphere 62 and the radial anti-wrinkle action of the flattening component 7 and the anti-wrinkle component 8, a better adhesion effect of the grinding and polishing pad can be achieved.

[0069] Reference Figure 5 The flattening assembly 7 includes a first elastic telescopic rod 71, a pressure roller 72, and a second elastic telescopic rod 73. One end of the first elastic telescopic rod 71 is rotatably mounted on the periphery of the push rod 61 in the receiving groove, and the pressure roller 72 is rolled on the other end of the first elastic telescopic rod 71 and elastically abuts against the inner wall of the receiving groove.

[0070] Both the first elastic telescopic rod 71 and the second elastic telescopic rod 73 are equipped with springs, which can provide elastic force for the first elastic telescopic rod 71 and the second elastic telescopic rod 73 to extend.

[0071] One end of the second elastic telescopic rod 73 is rotatably mounted on the side wall of the first elastic telescopic rod 71, and the other end is rotatably mounted on the periphery of the push rod 61 in the receiving groove, and is used to provide a force for the pressure roller 72 to move away from the outlet of the receiving groove.

[0072] The first elastic telescopic rod 71 and the second elastic telescopic rod 73 form a linkage mechanism. The second elastic telescopic rod 73 can push the first elastic telescopic rod 71 against the inner wall of the receiving groove. During the extension of the push rod 61, the end of the first elastic telescopic rod 71 eventually overcomes the elastic force of the second elastic telescopic rod 73 and extends out of the receiving groove, thus unfolding outward. This, combined with the outlet end of the receiving groove, allows the pressure roller 72 to press the surface of the grinding and polishing pad with a certain pressure. At the same time, the rolling installation design of the pressure roller 72 reduces frictional resistance and avoids tearing of the backing layer.

[0073] Reference Figure 5 , Figure 6 and Figure 7 The anti-puff assembly 8 includes a third elastic telescopic rod 81, a vibrating roller 82, a fourth elastic telescopic rod 83, a vibrating motor 84, and a battery 85. One end of the third elastic telescopic rod 81 is rotatably mounted on the periphery of the push rod 61 in the receiving groove, and the vibrating roller 82 is rolled on the other end of the third elastic telescopic rod 81 and elastically abuts against the inner wall of the receiving groove.

[0074] One end of the fourth elastic telescopic rod 83 is rotatably mounted on the side wall of the third elastic telescopic rod 81, and the other end is rotatably mounted on the periphery of the push rod 61 in the receiving groove, and is used to provide a force for the vibrating roller 82 to move away from the outlet of the receiving groove.

[0075] Multiple limiting guide grooves are provided on the side wall of the receiving groove. The limiting guide grooves can limit the movement of the pressure roller 72 and the rotating roller, and a wear-resistant layer for increasing friction is fixed in the limiting guide groove.

[0076] Both the vibration motor 84 and the battery 85 are located inside the vibration roller 82, and the battery 85 and the vibration motor 84 are electrically connected.

[0077] The third elastic telescopic rod 81 and the fourth elastic telescopic rod 83 are linked to the vibrating roller 82, and the vibrating motor 84 is powered by the storage battery 85 to generate high-frequency micro-amplitude vibration. When the vibrating roller 82 contacts the grinding and polishing pad, the vibration energy is transferred to the adhesive interface, causing air bubbles or wrinkles to migrate to the edge; at the same time, the vibration causes the molecular chains of the adhesive layer to recombine, further improving the bonding strength.

[0078] Furthermore, refer to Figure 6 and Figure 7 The vibrating roller 82 is coaxially fixed with an installation cylinder 91. The vibrating motor 84 and the battery 85 are both installed inside the installation cylinder 91. The installation cylinder 91 is coaxially sleeved and fixed with a silicone vibration isolation pad 92, a honeycomb titanium plate 93 and a constraint layer damping pad 94 in sequence. The circumference of the vibrating roller 82 is a porous surface.

[0079] The four-layer collaborative filtering design of the porous roller surface of silicone vibration isolation pad 92, honeycomb titanium plate 93, constraint layer damping pad 94, and vibrating roller 82 achieves refined control of vibration energy: the silicone vibration isolation pad 92 first absorbs the high-frequency harmonics of the motor, converting part of the mechanical energy into heat energy, eliminating the hidden danger of damaging the microporous structure of the polishing pad from the source; the honeycomb titanium plate 93 diffuses vibration energy through the hexagonal cavity structure, avoiding the inherent resonance frequency band of the roller, and significantly attenuating the acceleration amplitude of the dangerous frequency band; the constraint layer damping pad 94 performs viscous energy dissipation for the core working frequency band, significantly attenuating the mid-frequency vibration with a high loss factor, and avoiding uneven pressure on the adhesive layer; finally, the porous roller surface reduces the non-uniformity of the roller surface vibration through acoustic impedance gradual matching, and achieves amplitude spatial homogenization.

[0080] This progressive energy conversion ensures that the effective output vibration retains only a small amount of delicate energy, thus delicately eliminating wrinkles or bubbles in the polishing pad without damaging it.

[0081] Two vibratory motors 84 are installed inside the mounting cylinder 91. The two vibratory motors 84 are arranged collinearly with their vibrating ends facing away from each other. The battery 85 is installed in the middle of the two vibratory motors 84. The two vibratory motors 84 are arranged collinearly and in opposite directions, and their excitation forces cancel each other out in the middle of the mounting cylinder 91, eliminating lateral disturbance. The battery 85 is centrally installed to optimize the counterweight balance, so that the vibratory roller 82 maintains a high dynamic balance accuracy during rolling, ensuring the stability of the wrinkle removal or foam removal action.

[0082] A wiring groove is provided on the inner wall of the mounting cylinder 91, extending to the end of the vibrating roller 82. A charging port is provided at the end of the vibrating roller 82. Wires are fixedly laid in the wiring groove, and the wires electrically connect the charging port and the storage battery 85. The charging port is located at the end of the vibrating roller 82, allowing for rapid power replenishment when the equipment is in standby mode.

[0083] The implementation principle of a wafer polishing and grinding equipment in this application embodiment is as follows: When the equipment is running, the power component 42 drives the transfer frame 41 to rotate horizontally, so that the polishing head 3 moves away from the polishing table 2 and is positioned in a safe position. At the same time, the adsorption mechanism 5 descends to the stacking position through the lifting component 52, and the concentric circle adsorption array composed of multiple sets of negative pressure tubes 53 grabs the polishing pad with gradient negative pressure.

[0084] After the transfer frame 41 rotates again to precisely align the adsorption plate 51 with the grinding and polishing table 2, the telescopic component 63 pushes the push rod 61 to move axially, separating the hemisphere 62 to lift the center of the grinding and polishing pad and press it onto the base surface of the polishing table. As the push rod 61 continues to extend, the first elastic telescopic rod 71 and the second elastic telescopic rod 73 of the flattening component 7 unfold in conjunction, driving the pressure roller 72 to roll outward from the center with a certain pressure. Simultaneously, the vibrating roller 82 of the anti-wrinkle component 8 rolls under the support of the third elastic telescopic rod 81 and the fourth elastic telescopic rod 83. Its internal vibration motor 84 conducts vibration through the three-layer encapsulation of silicone vibration isolation pad 92, honeycomb titanium plate 93, and constraint layer damping pad 94, causing the bubbles at the adhesive interface to collapse and strengthening molecular cross-linking. Finally, the pressure roller 72 and the vibrating roller 82 work together to complete the whole-surface pressing, and the equipment resets to enter the polishing process.

[0085] This application embodiment also provides a wafer grinding method, which uses the above-mentioned wafer polishing and grinding equipment for grinding, including the following steps:

[0086] S1: Adjust the height of the grinding and polishing head 3 to separate the grinding and polishing head 3 from the upper surface of the grinding and polishing table 2, drive the power component 42 to drive the transfer frame 41 to rotate until the grinding and polishing head 3 rotates outside the grinding and polishing table 2;

[0087] S2: Remove the polishing pad from the polishing table 2 and remove any residual adhesive from the polishing pad;

[0088] S3: Drive the power component 42 to rotate the transfer frame 41 until the adsorption plate 51 on the transfer frame 41 is directly facing the grinding and polishing pad on the stacking station.

[0089] S4: Drive the lifting component 52 to lower the adsorption disk 51, adsorb the grinding and polishing pad onto the surface of the adsorption disk 51, and drive the lifting component 52 to raise the adsorption disk 51 to the initial height.

[0090] S5: Drive the power component 42 to drive the transfer frame 41 to rotate until the adsorption plate 51 is facing the grinding and polishing table 2. Drive the lifting mechanism to lower the adsorption plate 51 to a certain height above the upper surface of the grinding and polishing table 2. This height can be adjusted by preset.

[0091] S6: Drive the telescopic component 63 to extend, drive the push rod 61 to make the separation hemisphere 62 separate the center of the grinding and polishing pad from the surface of the adsorption plate 51, and press the center of the grinding and polishing pad to adhere to the center of the grinding and polishing table 2.

[0092] S7: Continue to drive the telescopic component 63 to extend, so that the push rod 61 drives the pressure roller 72 and the vibrating roller 82 to press and adhere the grinding and polishing pad from the center outward and vibrate to eliminate wrinkles. The telescopic component 63 finally extends until the grinding and polishing pad is completely adhered to the grinding and polishing table 2.

[0093] S8: Drive the telescopic component 63 to retract, then drive the lifting component 52 to raise the adsorption plate 51 to the initial height, drive the power component 42 to rotate the transfer frame 41 until the grinding and polishing head 3 is directly facing the grinding and polishing table 2, and finally adjust the height of the grinding and polishing head 3 so that the grinding and polishing head 3 is in contact with the upper surface of the grinding and polishing table 2.

[0094] The above are all optional embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer polishing and grinding equipment, characterized in that: The device includes a mounting platform (1), a grinding and polishing table (2) mounted on the mounting platform (1), and a grinding and polishing head (3) mounted above the grinding and polishing table (2). The mounting platform (1) is provided with a stacking station for placing grinding and polishing pads to be replaced. A mounting base (11) is provided between the grinding and polishing table (2) and the stacking station. A transfer mechanism (4) is provided on the mounting base (11). The grinding and polishing head (3) is mounted on one of the transfer parts of the transfer mechanism (4). An adsorption mechanism (5) is provided on the other transfer part of the transfer mechanism (4) for adsorbing the grinding and polishing pads stacked on the stacking station. An adhesion mechanism (6) is provided on the adsorption mechanism (5) for attaching the grinding and polishing pads to the grinding and polishing table (2). The bonding mechanism (6) includes a push rod (61), a separating hemisphere (62), a telescopic component (63), a flattening component (7), and a wrinkle-removing component (8). The adsorption mechanism (5) includes an adsorption plate (51) and a lifting component (52). A sliding groove is provided on the central axis of the adsorption plate (51) for the push rod (61) to slide. A receiving groove is provided on the adsorption plate (51) in connection with the sliding groove for the flattening component (7) and the wrinkle-removing component (8) to be accommodated. The telescopic component (63) is located on the side of the adsorption plate (51) near the lifting component (52), and the telescopic end is coaxially fixedly connected to the push rod (61). The separation hemisphere (62) is elastically telescopically located at the end of the push rod (61) away from the telescopic component (63), and the end away from the push rod (61) is set as a hemispherical surface. The flattening assembly (7) and the anti-wrinkle assembly (8) are both arranged in multiple sets evenly and at intervals along the circumference of the push rod (61), and each anti-wrinkle assembly (8) is located between two adjacent flattening assemblies (7). The flattening assembly (7) includes a first elastic telescopic rod (71), a pressure roller (72) and a second elastic telescopic rod (73). One end of the first elastic telescopic rod (71) is rotatably mounted on the periphery of the push rod (61) in the receiving groove. The pressure roller (72) is rolled on the other end of the first elastic telescopic rod (71) and elastically abuts against the inner wall of the receiving groove. The second elastic telescopic rod (73) is used to provide the pressure roller (72) with a force that moves it away from the outlet of the receiving groove. The anti-pleat assembly (8) includes a third elastic telescopic rod (81), a vibrating roller (82), a fourth elastic telescopic rod (83), a vibrating motor (84), and a battery (85). One end of the third elastic telescopic rod (81) is rotatably mounted on the periphery of the push rod (61) in the receiving groove. The vibrating roller (82) is rolled on the other end of the third elastic telescopic rod (81) and elastically abuts against the inner wall of the receiving groove. The fourth elastic telescopic rod (83) is used to provide the vibrating roller (82) with a force that moves it away from the outlet of the receiving groove. The vibrating motor (84) and the battery (85) are both disposed inside the vibrating roller (82).

2. The wafer polishing and grinding equipment according to claim 1, characterized in that: The transfer mechanism (4) includes a transfer frame (41) rotatably mounted on the mounting base (11) and a power component (42) for driving the transfer frame (41) to rotate horizontally. The grinding and polishing head (3) is disposed at one end of the transfer frame (41), and the adsorption mechanism (5) and the bonding mechanism (6) are disposed at the other end of the transfer frame (41).

3. The wafer polishing and grinding equipment according to claim 2, characterized in that: The adsorption mechanism (5) also includes a negative pressure tube (53) and a negative pressure chamber (54). The lifting component (52) is mounted on the transfer frame (41). The adsorption plate (51) is lifted and installed on the lifting end of the lifting component (52). The negative pressure tube (53) and the negative pressure chamber (54) are evenly arranged in multiple sets along the center of the adsorption plate (51). Multiple negative pressure tubes (53) are arranged parallel to the central axis of the adsorption plate (51) in each group, and the negative pressure tubes (53) in each group form concentric circles with different diameters and the same center. One end of each negative pressure tube (53) passes through the side of the adsorption plate (51) away from the lifting component (52), and the other end of each group of negative pressure tubes (53) is connected to the corresponding negative pressure cavity (54). Each negative pressure cavity (54) is connected to the external negative pressure system. The bonding mechanism (6) is located inside the adsorption plate (51) and is used to drive the grinding and polishing pads adsorbed on the adsorption plate (51) to be sequentially bonded to the grinding and polishing table (2) from the center to the edge.

4. The wafer polishing and grinding equipment according to claim 1, characterized in that: An installation cylinder (91) is coaxially fixed inside the vibrating roller (82). The vibrating motor (84) and the battery (85) are both installed inside the installation cylinder (91). A silicone vibration isolation pad (92), a honeycomb titanium plate (93), and a constraint layer damping pad (94) are coaxially and fixedly arranged outside the installation cylinder (91). The circumferential surface of the vibrating roller (82) is arranged with a porous surface.

5. The wafer polishing and grinding equipment according to claim 4, characterized in that: The mounting cylinder (91) contains two vibration motors (84), which are arranged collinearly with their vibration ends facing away from each other. The battery (85) is installed in the middle of the two vibration motors (84).

6. The wafer polishing and grinding equipment according to claim 4, characterized in that: The inner wall of the mounting cylinder (91) is provided with a wiring groove, which extends to the end of the vibrating roller (82). The end of the vibrating roller (82) is provided with a charging port. A wire is fixedly laid in the wiring groove, and the wire connects the charging port and the battery (85) electrically.

7. A wafer grinding method, comprising grinding using a wafer polishing and grinding apparatus as described in any one of claims 1-6, characterized in that: Includes the following steps: S1: Adjust the height of the grinding and polishing head (3) so that the grinding and polishing head (3) is separated from the upper surface of the grinding and polishing table (2), drive the power component (42) to drive the transfer frame (41) to rotate until the grinding and polishing head (3) rotates outside the grinding and polishing table (2); S2: Remove the grinding and polishing pad from the grinding and polishing table (2) and remove any residual adhesive from the grinding and polishing pad; S3: The driving power component (42) drives the transfer frame (41) to rotate until the adsorption plate (51) on the transfer frame (41) is directly facing the grinding and polishing pad on the stacking station; S4: Drive the lifting component (52) to lower the adsorption plate (51) and adsorb the grinding and polishing pad onto the surface of the adsorption plate (51). Drive the lifting component (52) to raise the adsorption plate (51) to the initial height. S5: The driving power component (42) drives the transfer frame (41) to rotate until the adsorption plate (51) is facing the grinding and polishing table (2). The driving lifting component drives the adsorption plate (51) to descend to a certain height above the upper surface of the grinding and polishing table (2). This height is adjusted by preset. S6: Drive the telescopic component (63) to extend, drive the push rod (61) to make the separation hemisphere (62) separate the center of the grinding and polishing pad from the surface of the adsorption plate (51), and press the center of the grinding and polishing pad to the center of the grinding and polishing table (2). S7: Continue to drive the telescopic component (63) to extend, so that the push rod (61) drives the pressure roller (72) and the vibrating roller (82) to press and adhere the grinding and polishing pad from the center outward and vibrate to eliminate wrinkles. The telescopic component (63) eventually extends until the grinding and polishing pad is completely adhered to the grinding and polishing table (2). S8: Drive the telescopic component (63) to retract, then drive the lifting component (52) to raise the adsorption plate (51) to the initial height, drive the power component (42) to rotate the transfer frame (41) until the grinding and polishing head (3) is facing the grinding and polishing table (2), and finally adjust the height of the grinding and polishing head (3) so that the grinding and polishing head (3) is in contact with the upper surface of the grinding and polishing table (2).

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