Resin molding device and method for manufacturing resin molded article

Abstract

In order to reduce wear caused by sliding of a molding die in a resin molding device in which a molding die is slid in a sliding direction intersecting a mold locking direction, this resin molding device is provided with: a mold locking mechanism (10) that locks a molding die (51) and a molding die (52) via base members (2-4); a forming die sliding mechanism (20) that slides the forming die (51) and the forming die (52) between a mold locking position (Q) at which the mold is locked and a protruding position (R) that is positioned further outward than the base members (2-4) in a sliding direction that intersects the mold locking direction; and an interval changing mechanism 30 that changes the interval between the facing surfaces of the base members 2-4 and the forming die 51 and the forming die 52 when the forming die 51 and the forming die 52 are slid between the mold locking position Q and the protruding position R by the forming die sliding mechanism 20.

Description

Technical Field

[0001] This invention relates to a resin molding apparatus and a method for manufacturing resin molded articles. Background Technology

[0002] Conventionally, as shown in Patent Document 1, in compression molding apparatuses, it is considered that a fixed mold (lower mold) supported on a fixed platform can move between a mold clamping position and an outgoing position outside the mold. Specifically, the structure is as follows: a guide plate with guide rails and guide grooves is provided on the fixed platform, and a sliding plate supporting the fixed mold (lower mold) slides along the guide rails and guide grooves of the guide plate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-165134 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, when the fixed mold (lower mold) is moved between the mold clamping position and the exit position outside the mold, wear will occur on the sliding surfaces of the sliding plate and the guide plate.

[0008] Therefore, the present invention was made to solve the aforementioned problem, and its main objective is to reduce wear caused by the sliding of the molding die in a resin molding apparatus in which the molding die slides along a sliding direction intersecting the clamping direction.

[0009] Technical means to solve the problem

[0010] That is, the resin molding apparatus of the present invention is characterized by comprising: a mold-locking mechanism for locking a molding die via a base member; a molding die sliding mechanism for sliding the molding die between a locked position and a protruding position located further outward than the base member in a sliding direction intersecting the mold-locking direction; and an interval changing mechanism for changing the interval between the opposing surfaces of the base member and the molding die when the molding die is slid between the locked position and the protruding position via the molding die sliding mechanism.

[0011] The effects of the invention

[0012] According to the present invention configured in this way, in a resin molding apparatus in which the molding die slides along a sliding direction intersecting the clamping direction, wear caused by the sliding of the molding die can be reduced. Attached Figure Description

[0013] [ Figure 1[Illustration 1] is a plan view schematically showing the structure of the resin molding apparatus according to the first embodiment of the present invention.

[0014] [ Figure 2 [ ] is a schematic front view showing the structure of the resin molding apparatus of the first embodiment.

[0015] [ Figure 3 [ ] is a side view schematically showing the structure of the resin molding apparatus of the first embodiment.

[0016] [ Figure 4 [Illustrated diagram] is a schematic representation of the structure of the molding die according to the first embodiment.

[0017] [ Figure 5 [Illustration 1] is an enlarged cross-sectional view schematically showing the peripheral structure of the sidewall member of the first embodiment.

[0018] [ Figure 6 [ ] is an enlarged view schematically showing the boom mechanism of the first embodiment.

[0019] [ Figure 7 [Illustration 1] is an enlarged cross-sectional view schematically showing the peripheral structure of the elastic member in the first embodiment.

[0020] [ Figure 8 [Illustration 1] is a cross-sectional view schematically showing the operation of the elastic member of the first embodiment.

[0021] [ Figure 9 [ ] is a side view that mainly shows the forming mold sliding mechanism and the interval changing mechanism of the first embodiment.

[0022] [ Figure 10 (a) is a plan view mainly showing the forming mold sliding mechanism of the upper mold in the first embodiment, and (b) is a plan view mainly showing the forming mold sliding mechanism of the lower mold.

[0023] [ Figure 11 [] is a side view showing the state in the first embodiment where the upper mold is moved to the protruding position.

[0024] [ Figure 12 [ ] is a side view showing the state in the first embodiment where the lower mold is moved to the protruding position.

[0025] [ Figure 13 (a) is a side view schematically showing the change in the spacing of the upper mold and the base member in the first embodiment, and (b) is a side view schematically showing the change in the spacing of the lower mold and the base member.

[0026] [ Figure 14 [ ] is a flowchart of the method for manufacturing a resin molded article according to the first embodiment.

[0027] [ Figure 15 [ ] is a flowchart illustrating the operation of the substrate conveying mechanism and the sliding action of the upper mold in the first embodiment.

[0028] [ Figure 16 [ ] is a schematic diagram showing the various states of the operation of the substrate conveying mechanism and the sliding operation of the upper mold in the first embodiment.

[0029] [ Figure 17 [ ] is a flowchart illustrating the operation of the resin material conveying mechanism and the sliding action of the lower mold in the first embodiment.

[0030] [ Figure 18 [ ] is a schematic diagram showing the various states of the operation of the resin material conveying mechanism and the sliding operation of the lower mold in the first embodiment.

[0031] [ Figure 19 [ ] is a schematic front view showing the structure of the resin molding apparatus according to the second embodiment.

[0032] [ Figure 20 [ ] is a side view schematically showing the structure of the resin molding apparatus of the second embodiment.

[0033] [ Figure 21 [A] is a schematic side view, cross-sectional view, and front view of the peripheral structure of the elastic member in a modified embodiment.

[0034] [ Figure 22 [ ] is a front view schematically showing the structure of a resin molding apparatus according to a modified embodiment. Detailed Implementation

[0035] The following examples will further illustrate the technology of the present invention. However, the present invention is not limited to the following technical aspects.

[0036] The resin molding apparatus of the present invention (Technical 1) is characterized by comprising: a mold-locking mechanism for locking a molding die via a base member; a molding die sliding mechanism for sliding the molding die between a locked position and a protruding position located further outward than the base member in a sliding direction intersecting the mold-locking direction; and an interval changing mechanism for changing the interval between the opposing surfaces of the base member and the molding die when the molding die is slid between the locked position and the protruding position via the molding die sliding mechanism.

[0037] In the case of the resin molding apparatus, when the molding die slides between the locked position and the protruding position via the molding die sliding mechanism, the distance between the opposing surfaces of the base member and the molding die changes, thus allowing the opposing surfaces of the base member and the molding die to be separated during sliding. As a result, wear caused by the sliding of the molding die can be reduced. Furthermore, by moving the molding die to the protruding position, an object can be transported to the molding die at the protruding position. As a result, the height of the resin molding apparatus can be reduced without increasing the distance between the molding dies during mold opening.

[0038] Ideally, in addition to the structure of technology 1, the resin molding apparatus of technology 2 of the present invention has an upper mold and a lower mold, a molding mold sliding mechanism corresponding to the upper mold and the lower mold respectively, and an interval changing mechanism corresponding to the upper mold and the lower mold respectively.

[0039] If the structure described above is used, the upper and lower dies can be moved independently to the protruding positions, allowing for the separate transport of objects to the upper and lower dies. Furthermore, it reduces wear caused by the sliding of the upper and lower dies during transport.

[0040] Ideally, in addition to the structure of technology 1 or technology 2, the resin molding apparatus of technology 3 of the present invention is configured such that the molding die sliding mechanism and the interval changing mechanism are constructed using a common drive actuator.

[0041] If the structure described above is adopted, the structure of the resin molding device with the molding die sliding mechanism and the interval changing mechanism can be simplified.

[0042] As a specific embodiment using a common drive actuator to construct the molding die sliding mechanism and the spacing changing mechanism, ideally, in addition to the structure of technology 1 or technology 2, the resin molding apparatus of technology 4 of the present invention includes the molding die sliding mechanism comprising: a support frame for supporting the molding die; and a drive actuator for moving the support frame along the sliding direction, wherein the spacing changing mechanism includes a cam mechanism disposed between the molding die and the base member, wherein the cam mechanism changes the spacing between the opposing surfaces of the molding die and the base member as the drive actuator moves the support frame.

[0043] If the structure is as described, the cam mechanism of the interval changing mechanism can be operated by the drive actuator of the forming mold sliding mechanism.

[0044] Ideally, in addition to any of the structures in techniques 1 to 4, the resin molding apparatus of technique 5 of the present invention has the interval changing mechanism such that the opposing surfaces of the molding die and the base member do not contact each other at the mold-locking position and are separated by a gap, and the mold is locked by the mold-locking mechanism, so that the opposing surfaces of the molding die and the base member contact each other.

[0045] If the structure described above is used, wear caused by sliding between the mold-locking position and the protruding position can be further reduced.

[0046] Ideally, in addition to any of the structures in techniques 1 to 5, the resin molding apparatus of technique 6 of the present invention has a positioning part in which the molding die sliding mechanism contacts the molding die moving toward the locking position and positions the molding die at the locking position.

[0047] If the structure is as described above, the molding die is positioned to the locking position by the positioning part, thus improving the reproducibility of the locking position and thereby improving the quality of the resin molded product.

[0048] In addition to any of the structures described in techniques 1 to 6, the resin molding apparatus of technique 7 of the present invention also includes a structure in which the base member has: a fixed platform; a movable platform capable of being raised and lowered by a mold-locking mechanism; and an intermediate plate disposed between the fixed platform and the movable platform; and the molding die has an upper mold and a lower mold, respectively disposed between the fixed platform and the intermediate plate, and between the intermediate plate and the movable platform. That is, the molding die has a structure having multiple sets of upper and lower molds.

[0049] Furthermore, ideally, the resin molding apparatus of this technology 7 further includes: a pair of sidewall members disposed on the sides of the movable platform and the intermediate plate; a lifting and sliding mechanism for the intermediate plate to slide in the vertical direction relative to the pair of sidewall members; and a lifting linkage mechanism for the lifting and lowering of the intermediate plate to be linked to the lifting and lowering of the movable platform, the lifting linkage mechanism having: a boom mechanism, one end of which is fixed relative to the sidewall members, and the other end of which moves together with the movable platform and extends and retracts by the lifting and lowering of the movable platform; and a connecting mechanism connecting the cross link portion of the boom mechanism and the intermediate plate.

[0050] If the structure described above is adopted, the number of molding dies can be increased, thereby improving the productivity of resin molded products. Moreover, since multiple intermediate plates are linked to the lifting of the movable platform via a boom mechanism, even if a structure is adopted in which molding dies are set between multiple intermediate plates, it is still possible to prevent the enlargement of individual components and suppress the enlargement of the overall device, and high-rigidity components are not required.

[0051] Ideally, the resin molding apparatus of technique 8 of the present invention, in addition to any of the structures of techniques 1 to 7, further includes: a conveying mechanism for conveying the object to be conveyed by the molding die located at the protruding position.

[0052] Ideally, in addition to the structure of the present invention 8, the resin molding apparatus of the present invention 9 includes a conveying mechanism comprising: a molding object conveying mechanism for conveying the molding object to the molding die located at the protruding position; and a resin material conveying mechanism for conveying resin material to the molding die located at the protruding position.

[0053] Ideally, in addition to the structure of the present invention 9, the resin molding apparatus of the present invention 10 includes a molding object conveying mechanism comprising: a molding object supply unit for supplying the molding object to the molding die located at the protruding position; and a molding object receiving unit for receiving the resin-molded molding object from the molding die located at the protruding position.

[0054] Ideally, in addition to the structure of technology 9 or technology 10, the resin molding apparatus of technology 11 of the present invention includes a resin material conveying mechanism comprising: a resin material supply unit for supplying the resin material to the molding die located at the protruding position; and a film recycling unit for recycling the used demolding film from the molding die located at the protruding position.

[0055] Furthermore, the method for manufacturing resin molded articles described below is also an aspect of the present invention, which uses any one of the resin molding apparatuses of technology 1 to technology 11 to manufacture resin molded articles. The method for manufacturing resin molded articles includes: a conveying step, conveying a molded object to the molding mold located at the protruding position; a resin molding step, locking the molding mold located at the locking position to resin mold the molded object; and a removal step, removing the resin-molded molded object from the molding mold located at the protruding position.

[0056] <1. First Embodiment of the Invention>

[0057] Hereinafter, a first embodiment of the resin molding apparatus of the present invention will be described with reference to the accompanying drawings.

[0058] Furthermore, in all the following diagrams, for ease of understanding, appropriate omissions or exaggerations have been used to depict the elements schematically. Identical components are labeled with the same symbols, and explanations are appropriately omitted.

[0059] <1-1. Overall Structure of the Resin Molding Device>

[0060] The resin molding apparatus 100 of the first embodiment is an apparatus for manufacturing a resin molded article P by using resin molding of resin material J to seal an electronic component Wx fixed to a substrate W which is the object to be molded with resin.

[0061] Here, the substrate W can be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. In addition, the substrate W can also be a carrier without wiring. Furthermore, the resin material J can be, for example, powdered resin (including granular resin), liquid resin, etc. Moreover, the electronic component Wx can be, for example, an electronic component such as a semiconductor chip, a resistor, a capacitor, or an electronic component in which at least one of these electronic components is sealed with resin.

[0062] The resin molding apparatus 100, as described above Figure 1 As shown, the module includes a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C as constituent elements. Each constituent element (modules A to C) is detachable and replaceable relative to its constituent element.

[0063] The substrate supply / storage module A includes: a substrate receiving section 11 for receiving the substrate W before molding from the outside; a substrate storage section 12 for storing the molded substrate W (resin molded product P); a substrate conveying mechanism 13 for conveying the substrate W before molding and the resin molded product P; and a transfer mechanism 14, such as a transfer robot, for conveying and transferring the substrate W before molding and the resin molded product P relative to the substrate conveying mechanism 13.

[0064] The substrate transport mechanism 13 transports the pre-molding substrate W from the substrate supply / receiving module A to the resin molding module B. In the resin molding module B, the pre-molding substrate W is supplied to molding molds 5a and 5b. After resin molding of the pre-molding substrate W, the substrate transport mechanism 13 receives the resin-molded finished substrate W, i.e., the resin-molded product P, from molding molds 5a and 5b in the resin molding module B and transports it to the substrate supply / receiving module A. Furthermore, the transfer mechanism 14 transfers the pre-molding substrate W from the substrate receiving section 11 to the substrate transport mechanism 13, and transfers the resin-molded product P from the substrate transport mechanism 13 to the substrate receiving section 12.

[0065] Each resin molding module B has a first mold, namely an upper mold 51, for holding the substrate W, and a second mold, namely a lower mold 52, for forming a mold cavity 52C. By locking these molds, the electronic component Wx fixed to the substrate W is resin-sealed using resin molding of resin material J. Furthermore, the specific structure of the resin molding module B will be described later.

[0066] The resin material supply module C includes a moving platform 15, a resin material receiving section 16 placed on the moving platform 15, a resin material feeding mechanism 17 for metering resin material J and feeding it into the resin material receiving section 16, and a resin material conveying mechanism 18 for conveying the resin material receiving section 16 to supply resin material J to the mold cavity 52C of the lower mold 52. Here, the resin material receiving section 16 is constructed using a holding frame that holds the release film F, and the resin material J is fed onto the release film F held in the holding frame by the resin material feeding mechanism 17.

[0067] The mobile platform 15 moves within the resin material supply module C between the resin feeding position of the resin material feeding mechanism 17 and the conveying position for handing over the resin material receiving section 16 to the resin material conveying mechanism 18. Furthermore, the resin material conveying mechanism 18 conveys the resin material receiving section 16 containing resin material J from the resin material supply module C to the resin molding module B, and in the resin molding module B, supplies the release film F and resin material J to the molding molds 5a and 5b. Subsequently, the resin material conveying mechanism 18 conveys the resin material receiving section 16, after supplying resin material J, from the resin molding module B back to the resin material supply module C.

[0068] <1-2. Specific Structure of Resin Molding Module B>

[0069] Resin molding module B, such as Figure 2 as well as Figure 3 As shown, it includes: a fixed platform 2; a movable platform 3, which can be raised and lowered by a locking mechanism 10; an intermediate plate 4, disposed between the fixed platform 2 and the movable platform 3; a first forming mold 5a and a second forming mold 5b, respectively disposed between the fixed platform 2 and the intermediate plate 4 and between the intermediate plate 4 and the movable platform 3, and including an upper mold 51 and a lower mold 52; a pair of side wall members 61 and 62, disposed on the sides of the movable platform 3 and the intermediate plate 4 (here, the left and right sides); a lifting and sliding mechanism 7, which allows the intermediate plate 4 to slide in the vertical direction relative to the pair of side wall members 61 and 62; and a lifting linkage mechanism 8, which links the lifting of the intermediate plate 4 with the lifting of the movable platform 3.

[0070] On the lower surface of the fixed platform 2, an upper mold 51 for the first forming mold 5a is provided directly or via other components. Furthermore, a pair of side wall members 61 and 62 are connected to the left and right sides of the fixed platform 2. Alternatively, the pair of side wall members 61 and 62 may be integrally formed with the fixed platform 2. In this embodiment, the fixed platform 2 has a generally rectangular flat plate shape when viewed from above.

[0071] On the upper surface of the movable platform 3, a lower mold 52 of the second forming mold 5b is provided directly or via other components. Furthermore, the movable platform 3 is moved vertically and horizontally by a locking mechanism 10 located below it. In addition, the movable platform 3 of this embodiment has a generally rectangular flat plate shape when viewed from above. Moreover, a fixing member 31 is connected to the movable platform 3, and the lower end (lower connecting rod portion 813) of the boom mechanism 81 (described later) is fixed to the fixing member 31.

[0072] The mold-locking mechanism 10 in this embodiment uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear motion to raise and lower the movable platform. However, it can also be a linkage mechanism that uses a crank-connecting rod or similar linkage to transmit the power source of the servo motor or the like to the movable platform.

[0073] On the upper surface of the intermediate plate 4, a lower mold 52 of the first forming mold 5a is provided directly or via other components. Furthermore, on the lower surface of the intermediate plate 4, an upper mold 51 of the second forming mold 5b is provided directly or via other components. In addition, the intermediate plate 4 of this embodiment has a generally rectangular flat plate shape when viewed from above.

[0074] Here, refer to Figure 4 Let's explain the first forming mold 5a and the second forming mold 5b.

[0075] The upper mold 51 of each forming mold 5a and 5b adsorbs and holds the back side of the substrate W. A suction port (not shown) is formed on the lower surface of the upper mold 51, and a suction flow path (not shown) connected to the suction port is formed inside the upper mold 51. The suction flow path is connected to an external suction device (not shown).

[0076] Furthermore, the lower mold 52 of each molding die 5a and 5b has a mold cavity 52C, which houses the electronic component Wx and resin material J fixed to the substrate W. Specifically, the lower mold 52 has a bottom surface member 521 forming the bottom surface of the mold cavity 52C, and a side surface member 522 surrounding the bottom surface member 521. The mold cavity 52C is formed by the upper surface of the bottom surface member 521 and the inner peripheral surface of the side surface member 522. Moreover, the side surface member 522 is disposed so as to be movable up and down relative to the bottom surface member 521. Specifically, the side surface member 522 is supported by a plurality of elastic members 524 such as a coil spring relative to the bottom plate 523 of the lower mold 52. Furthermore, in order to improve the demolding properties of the resin molded article P, the lower mold 52 of this embodiment is covered by a demolding film F. Moreover, an exhaust channel (not shown) may be provided on the upper surface of the side surface member 522 (the contact surface between the side surface member 522 and the substrate W) to exhaust air or gas. In addition, a sealed structure 50 is provided around the upper mold 51 and the lower mold 52. Figure 2 as well as Figure 5(Not shown in the figure), the sealed structure 50 includes sidewalls for evacuating the area around the molding die 5a and molding die 5b during resin molding, as well as sealing components such as O-rings.

[0077] A pair of sidewall members 61, 62 Figure 2 as well as Figure 3 As shown, the fixed platform 2 is fixed at a predetermined height relative to the base 101 and slidably supports the intermediate plate 4. Here, the upper ends of each side wall member 61, 62 are connected to the fixed platform 2, and the lower ends of each side wall member 61, 62 are connected to the base 101. Furthermore, in this embodiment, each side wall member 61, 62 is a longitudinally elongated flat plate extending in the vertical direction.

[0078] The lifting and sliding mechanism 7 causes the intermediate plate 4 to move linearly in the vertical direction relative to a pair of side wall members 61, 62. Specifically, the lifting and sliding mechanism 7 has a linear moving track 71 extending in a straight line and a linear moving block 72 sliding on the linear moving track 71.

[0079] In this embodiment, flat side panels 41 are connected to the left and right sides of the middle plate 4. A linear moving block 72 is provided on the side panel 41, and a linear moving track 71 is provided on the inner surface of the side wall member 61 and the side wall member 62 along the vertical direction.

[0080] In detail, such as Figure 5 As shown, two linear motion tracks 71 are arranged side-by-side on the inner surfaces of each side wall component 61, 62. Corresponding to the two linear motion tracks 71, two rows of linear motion blocks 72 are provided on each side panel 41. Here, each row of linear motion blocks 72 on each side panel 41 contains two linear motion blocks 72 (see reference). Figure 2 That is, a total of four linear moving blocks 72 are provided on each side panel 41.

[0081] In detail, such as Figure 2 as well as Figure 5 As shown, two linear motion tracks 71 are provided on the inner surfaces of each side wall member 61, 62. Here, the two linear motion tracks 71 extend in the vertical direction. Furthermore, the two linear motion tracks 71 are arranged in the front-back direction. On the other hand, linear motion blocks 72 are provided on each side panel 41. Here, the linear motion blocks 72 are arranged in two parallel rows in the front-back direction in each side panel 41, corresponding to the two linear motion tracks 71. Two linear motion blocks 72 are arranged in each row in each side panel 41 in the vertical direction. That is, a total of four linear motion blocks 72 are provided on each side panel 41. Furthermore, the linear motion blocks 72 may also be provided in, for example,... Figure 2The portion covered by the connecting structural member 822 described later is configured with a total of six additional members relative to each side panel 41.

[0082] Lifting linkage mechanism 8 Figure 2 , Figure 3 , Figure 5 to 7 As shown, the lifting and lowering of the intermediate plate 4 is linked to the lifting and lowering of the movable platform 3, thereby synchronizing the locking and opening of the first forming mold 5a and the second forming mold 5b. That is, the lifting linkage mechanism 8 can set the locking speed of the first forming mold 5a and the locking speed of the second forming mold 5b to be the same, and can lock the molds simultaneously.

[0083] Specifically, the lifting linkage mechanism 8 includes: a boom mechanism 81, which extends and retracts through the lifting of the movable platform 3; and a connecting mechanism 82, which connects the cross link portion 811 of the boom mechanism 81 and the intermediate plate 4.

[0084] boom mechanism 81 Figure 2 As shown, it is located on the left and right outer sides of a pair of side wall members 61 and 62. That is, the movable platform 3 and the intermediate plate 4 are raised and lowered in linkage through the left and right boom mechanisms 81. In addition, the left and right boom mechanisms 81 have the same structure.

[0085] Specifically, each boom mechanism 81, such as Figure 3 as well as Figure 6 As shown, it includes a cross link portion 811, an upper link portion 812, and a lower link portion 813. The cross link portion 811 causes the first link 81a and the second link 81b to cross each other at their central portions and is rotatably connected to the cross portion via a rotation shaft 81c. Furthermore, the upper link portion 812 rotatably connects the lower ends of the third link 81d and the fourth link 81e to the upper ends of the first link 81a and the second link 81b via a rotation shaft 81f, and rotatably connects the upper ends of the third link 81d and the fourth link 81e to each other via a rotation shaft 81g. Furthermore, the lower connecting rod portion 813 rotatably connects the upper ends of the fifth connecting rod 81h and the sixth connecting rod 81i to the lower ends of the first connecting rod 81a and the second connecting rod 81b via a rotating shaft 81j, and rotatably connects the lower ends of the fifth connecting rod 81h and the sixth connecting rod 81i to each other via a rotating shaft 81k.

[0086] Furthermore, the upper end of the boom mechanism 81 (upper connecting rod portion 812) is fixed to the upper ends of the side wall members 61 and 62, and the lower end of the boom mechanism 81 (lower connecting rod portion 813) is fixed to the fixing member 31, which moves together with the movable platform 3. Therefore, the lower end of the boom mechanism 81 (lower connecting rod portion 813) is connected to the movable platform 3 via the fixing member 31 and moves along with the movement of the movable platform 3. In this embodiment, as...Figure 6 As shown, the rotation shaft 81c of the cross link 811, the rotation shaft 81g of the upper link 812, and the rotation shaft 81k of the lower link 813 of the boom mechanism 81 are arranged in the vertical direction, and are positioned at the center of the side wall member 61 and the side wall member 62 in the width direction when viewed from the side.

[0087] Connecting mechanism 82, etc. Figure 2 , Figure 3 , Figure 5 as well as Figure 7 As shown, the cross link portion 811 of the boom mechanism 81 and the intermediate plate 4 are connected. Specifically, the connecting mechanism 82 has a connecting member 821 connected to the cross link portion 811, a connecting member 822 connecting the connecting member 821 to the intermediate plate 4, and elastic members 823a and 823b separating the connecting member 821 and the connecting member 822. Furthermore, the left and right connecting mechanisms 82 have the same structure.

[0088] Connecting component 821, for example Figure 3 , Figure 5 as well as Figure 6 As shown, the connecting member 821 is connected to the cross link 811 without obstructing the extension and retraction of the boom mechanism 81. Specifically, the connecting member 821 is a rectangular strip, with its central portion connected to the rotation axis 81c of the cross link 811. The connecting member 821 extends in the front-rear direction (horizontal direction).

[0089] The connecting member 822 connects the connecting member 821 to the intermediate plate 4. In this embodiment, the side panels 41 (refer to) are respectively connected to the sides (left and right sides) of the intermediate plate 4. Figure 2 The connecting member 822 extends outwards from the front and rear of the side wall members 61 and 62 (see reference). Figure 5 ).

[0090] The elastic members 823a and 823b are used to absorb deviations such as the thickness of the substrate W, and are provided between the connecting member 822 and the connecting member 821. Moreover, the elastic members 823a and 823b are provided on the outside of the side wall members 61 and 62.

[0091] Specifically, elastic members 823a and 823b, such as Figure 2 , Figure 3 , Figure 5 as well as Figure 7As shown, it has: an upper elastic member 823a, which absorbs the upward displacement of the intermediate plate 4 relative to the connecting member 821; and a lower elastic member 823b, which absorbs the downward displacement of the intermediate plate 4 relative to the connecting member 821. These elastic members 823a and 823b are as follows... Figure 7 As shown, displacement absorbing mechanisms 83a and 83b are configured in the connecting structural member 822.

[0092] Displacement absorbing mechanisms 83a and 83b are respectively provided on the upper and lower sides of the connecting member 821 in the connecting member 822. The upper displacement absorbing mechanism 83a includes: an upper contact portion 831 that contacts the upper surface of the connecting member 821; an upper elastic member 823a that applies force to the upper contact portion 831 towards the upper surface of the connecting member 821; and an upper support portion 832 that can move upwards to support the upper contact portion 831. The lower displacement absorbing mechanism 83b includes: a lower contact portion 833 that contacts the lower surface of the connecting member 821; a lower elastic member 823b that applies force to the lower contact portion 833 towards the lower surface of the connecting member 821; and a lower support portion 834 that can move downwards to support the lower contact portion 833. The upper support portion 832 and the lower support portion 834 are fixed relative to the connecting member 822.

[0093] Here, an upper stop 831a is formed at the upper contact portion 831. The upper stop 831a protrudes outwards in a manner that allows it to contact the upper surface of the upper support portion 832, thereby restricting downward movement. At the lower contact portion 833, a lower stop 833a is formed. The lower stop 833a protrudes outwards in a manner that allows it to contact the lower surface of the lower support portion 834, thereby restricting upward movement.

[0094] Furthermore, the connecting member 822 has: an upper protrusion 822a, which protrudes above the upper end surface of the upper contact portion 831 in such a way that they form opposing surfaces; and a lower protrusion 822b, which protrudes below the lower end surface of the lower contact portion 833 in such a way that they form opposing surfaces. In addition, a gap is provided between the upper end surface of the upper contact portion 831 and the lower surface of the upper protrusion 822a of the connecting member 822 (the opposing surfaces of the upper end surfaces of the upper contact portion 831) to a degree that prevents contact due to the operation of the displacement absorbing mechanisms 83a and 83b, which will be described later. Similarly, a gap is also provided between the lower end surface of the lower contact portion 833 and the upper surface of the lower protrusion 822b of the connecting member 822 (the opposing surfaces of the lower end surfaces of the lower contact portion 833) to a degree that prevents contact due to the operation of the displacement absorbing mechanisms 83a and 83b.

[0095] Next, the basic operations of displacement absorption mechanisms 83a and 83b will be explained.

[0096] In the initial state of displacement absorbing mechanism 83a and displacement absorbing mechanism 83b (refer to...) Figure 7 In the initial state of the displacement absorbing mechanism 83a and the displacement absorbing mechanism 83b, the elastic member 823b is in a state where its upper end contacts the lower surface of the upper protrusion 822a of the connecting member 822 (the opposing surfaces of the upper end faces of the upper contact portion 831), and its lower end contacts the upper surface of the upper stop block 831a of the upper contact portion 831 without extending or retracting. Moreover, in the initial state of the displacement absorbing mechanism 83a and the displacement absorbing mechanism 83b, the elastic member 823b is in a state where its upper end contacts the lower surface of the lower stop block 833a of the lower contact portion 833, and its lower end contacts the upper surface of the lower protrusion 822b of the connecting member 822 (the opposing surfaces of the lower end faces of the lower contact portion 833) without extending or retracting.

[0097] Furthermore, when the intermediate plate 4 is displaced downward relative to the connecting member 821, as... Figure 8 As shown in (a), the connecting member 822 connected to the intermediate plate 4 is displaced downward relative to the connecting member 821. Therefore, with the connecting member 821 and the upper contact portion 831 stationary, the upper support portion 832 and the upper protrusion 822a of the connecting member 822 are also displaced downward relative to each other, causing the upper elastic member 823a to contract. In other words, the connecting member 821 and the upper contact portion 831 move upward relative to the upper protrusion 822a of the connecting member 822, causing the upper elastic member 823a to contract. Thus, the downward relative displacement of the intermediate plate 4 relative to the connecting member 821 is absorbed.

[0098] On the other hand, when the intermediate plate 4 is displaced upward relative to the connecting member 821, such as Figure 8 As shown in (b), the connecting member 822 connected to the intermediate plate 4 is displaced upward relative to the connecting member 821. Therefore, with the connecting member 821 and the lower contact portion 833 stationary, the lower support portion 834 and the lower protrusion 822b of the connecting member 822 are also displaced upward relative to each other, causing the lower elastic member 823b to contract. In other words, the connecting member 821 and the lower contact portion 833 move downward relative to the lower protrusion 822b of the connecting member 822, causing the lower elastic member 823b to contract. Thus, the upward relative displacement of the intermediate plate 4 relative to the connecting member 821 is absorbed.

[0099] Furthermore, in the resin molding apparatus 100 of this embodiment, such as Figure 2 , Figure 5 as well as Figure 7As shown, it also includes a guide mechanism 84 disposed between the connecting member 821 and the connecting structural member 822. The guide mechanism 84 guides the movement of the connecting member 821 and the connecting structural member 822 when they move relative to each other.

[0100] The guiding mechanism 84 guides the vertical movement of the connecting member 821 and is located between the facing surfaces of the connecting member 821 and the connecting structure 822. Specifically, the guiding mechanism 84 has a linear movement track 841 provided on one of the connecting member 821 or the connecting structure 822, and a linear movement block 842 provided on the other of the connecting member 821 or the connecting structure 822. In this embodiment, the connecting structure 822 is provided with the linear movement track 841, and the connecting member 821 is provided with the linear movement block 842.

[0101] <1-3. Specific Structure of Resin Molding Device 100>

[0102] Furthermore, the resin molding apparatus 100 of this embodiment is as follows: Figure 9 to 13 As shown, it also includes: a forming mold sliding mechanism 20, which allows the forming molds 5a and 5b, after being opened, to slide along a sliding direction intersecting the clamping direction; and a spacing changing mechanism 30, which changes the spacing between the base member and the opposing surfaces (facing each other in the clamping direction) of the forming molds 5a and 5b when the forming mold sliding mechanism 20 slides over them. Furthermore, in Figure 1 to 4 , Figure 6 The diagrams of the forming mold sliding mechanism 20 and the interval changing mechanism 30 are omitted.

[0103] Here, the clamping direction is the vertical direction, and the sliding direction is the front-back direction (orthogonal to the vertical and left-right directions). Furthermore, the base components in this embodiment are a fixed platform 2, a movable platform 3, and an intermediate plate 4.

[0104] Forming mold sliding mechanism 20 Figure 9 to 12 As shown, forming molds 5a and 5b are respectively provided for the upper mold 51 and the lower mold 52. Furthermore, the forming mold sliding mechanism 20 allows the upper mold 51 and the lower mold 52 to slide between the locked position Q and the protruding position R located further outward than the base members 2 to 4 in the sliding direction.

[0105] Specifically, the forming mold sliding mechanism 20 includes: a support frame 201 that supports the upper mold 51 or the lower mold 52; a guide part 202 that guides the movement of the support frame 201 along the sliding direction relative to the base member 2 to the base member 4; and a drive actuator 203 that moves the support frame 201 along the sliding direction.

[0106] Supporting framework 201Figure 9 to 12 As shown, the upper mold support frame 201a supports the upper mold 51, and the lower mold support frame 201b supports the lower mold 52. Each support frame 201a and 201b is as follows... Figure 10 As shown, it has a rectangular frame shape when viewed from above, and is a structure that supports the upper mold 51 or the lower mold 52 in its opening.

[0107] Furthermore, the upper mold support frame 201a movably supports the upper mold 51 in the mold-locking direction, and has a stop portion 204 for mounting the edge of the upper mold 51. The stop portion 204 is provided corresponding to the four corners of the upper mold 51 (see reference). Figure 10 Furthermore, the lower mold support frame 201b movably supports the lower mold 52 in the mold-locking direction, and has elastic bodies 205 supporting the edges of the lower mold 52. The elastic bodies 205 are provided corresponding to the four corners of the lower mold 52 (see reference). Figure 10 The lower mold 52 is supported by a contact portion 206 that contacts the lower mold 52. Furthermore, the contact portion 206 is provided on the lower mold support frame 201b in a way that allows it to move up and down.

[0108] Guidance Unit 202 Figure 9 to 12 As shown, a fixed member 40, which is fixed relative to the base members 2 to 4, and a support frame 201 are provided. Specifically, the guide part 202 is constructed using a linear motion guide member, and has: a linear motion track 202a, which is provided on one of the fixed member 40 or the support frame 201 and extends in a straight line along the sliding direction; and a movable linear motion block 202b, which is provided on the other of the fixed member 40 or the support frame 201 and slides on the linear motion track 202a.

[0109] Drive actuator 203 Figure 9 to 12 As shown, each support frame 201 is provided to move along the guide portion 202. The upper mold 51 and lower mold 52 move between the locking position Q and the protruding position R via the drive actuator 203. The drive actuator 203 of this embodiment includes a rack 203a provided on the support frame 201, a pinion 203b meshing with the rack 203a, and a motor 203c, such as a servo motor, that rotates the pinion 203b. Furthermore, the drive actuator 203 is not limited to a structure using the rack and pinion; it may also use a ball screw mechanism or a cylinder, etc.

[0110] In this embodiment, the upper mold 51 of the first forming mold 5a, which is disposed on the lower surface of the fixed platform 2, is slidable via an upper mold support frame 201a through a fixing member 40 fixed relative to the fixed platform 2. The lower mold 52 of the first forming mold 5a, which is disposed on the upper surface of the intermediate plate 4, is slidable via a lower mold support frame 201b through a fixing member 40 fixed relative to the intermediate plate 4. Furthermore, the upper mold 51 of the second forming mold 5b, which is disposed on the lower surface of the intermediate plate 4, is slidable via an upper mold support frame 201a through a fixing member 40 fixed relative to the intermediate plate 4. That is, the lower mold support frame 201b of the lower mold 52 of the first forming mold 5a and the upper mold support frame 201a of the upper mold 51 of the second forming mold 5b are configured to slide via a common fixing member 40. Furthermore, the lower mold 52 of the second forming mold 5b, which is provided on the upper surface of the movable platform 3, has a structure that slides through the lower mold support frame 201b via the fixing member 40 fixed relative to the movable platform 3.

[0111] Moreover, the forming die sliding mechanism 20, such as Figure 9 , Figure 11 to 13 As shown, a positioning part 207 is provided, which contacts the sides of the upper mold 51 and lower mold 52 that have moved to the mold-locking position Q, thereby positioning the upper mold 51 and lower mold 52 to the mold-locking position Q. The positioning part 207 positions the upper mold 51 and lower mold 52 in the horizontal direction (front-back direction and left-right direction) relative to the base members 2 to 4.

[0112] In addition, the forming mold sliding mechanism 20 may also be configured such that it does not have the positioning part 207, and in addition to the positioning part 207, the upper mold 51 and the lower mold 52 are positioned to the mold locking position Q by means of the position control of the drive actuator 203.

[0113] Interval change mechanism 30 Figure 9 to 13 As shown, similar to the forming mold sliding mechanism 20, forming molds 5a and 5b are respectively provided for the upper mold 51 and the lower mold 52. Furthermore, the spacing changing mechanism 30 changes the spacing between the facing surfaces of the base members 2 to 4 and the upper mold 51 and the lower mold 52 when the upper mold 51 and the lower mold 52 slide between the mold locking position Q and the protruding position R via the forming mold sliding mechanism 20.

[0114] The spacing adjustment mechanism 30, corresponding to the upper mold 51 of the first forming mold 5a, changes the spacing between the lower surface of the mounting upper mold 51 in the fixed platform 2 and the upper surface of the upper mold 51 of the first forming mold 5a mounted on the fixed platform 2. The spacing adjustment mechanism 30, corresponding to the lower mold 52 of the first forming mold 5a, changes the spacing between the upper surface of the mounting lower mold 52 in the intermediate plate 4 and the lower surface of the lower mold 52 of the first forming mold 5a mounted on the intermediate plate 4. The spacing adjustment mechanism 30, corresponding to the upper mold 51 of the second forming mold 5b, changes the spacing between the lower surface of the mounting upper mold 51 in the intermediate plate 4 and the upper surface of the upper mold 51 of the second forming mold 5b mounted on the intermediate plate 4. The spacing adjustment mechanism 30, corresponding to the lower mold 52 of the second forming mold 5b, changes the spacing between the upper surface of the mounting lower mold 52 in the movable platform 3 and the lower surface of the lower mold 52 of the second forming mold 5b mounted on the movable platform 3.

[0115] Specifically, the spacing adjustment mechanism 30 is configured using the drive actuator 203 of the forming die sliding mechanism 20. Furthermore, the spacing adjustment mechanism 30 has a cam mechanism 301 disposed between the upper die 51 and the lower die 52 and the base members 2 to 4. In the spacing adjustment mechanism 30, as the drive actuator 203 moves the support frame 201, the cam mechanism 301 changes the spacing between the facing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4.

[0116] The cam mechanism 301 of this embodiment includes: a first cam portion 302 having contact surfaces provided on the upper mold 51 and the lower mold 52; and a second cam portion 303 fixed relative to the base members 2 to 4, contacting the contact surfaces of the first cam portion 302. Here, the contact surfaces are as follows... Figure 9 As shown in the "structure of the first cam portion", it has: an inclined surface 302a for reducing or increasing the distance between the facing surfaces of the upper die 51 and lower die 52 and the base members 2 to 4; and a flat surface 302b for maintaining the reduced distance. Furthermore, the first cam portion 302 is provided in two locations on each side of the upper die 51 and lower die 52, and the second cam portion 303 is provided in two locations on each side of the base members 2 to 4, corresponding to the first cam portion 302. In addition, the second cam portion 303 may include a roller member, a rotating body (bearing), or a bushing, etc.

[0117] <1-3-1. Mechanism for the alteration of the spacing between the upper mold 51 and base components 2 and 4>

[0118] Specifically, the cam mechanism 301 corresponding to the upper mold support frame 201a is a structure that lifts the upper mold 51, which is placed on the upper mold support frame 201a, from the stop portion 204. The inclined surface 302a of the first cam portion 302 is as follows:Figure 9 As shown in “Structure of the first cam part (a)”, the downward-facing surface is the surface with an upward slope from the protruding position R toward the mold-locking position Q.

[0119] With the aforementioned structure, when the upper mold 51 slides from the protruding position R toward the mold-locking position Q, as... Figure 13 As shown in (a), the inclined surface 302a of the first cam portion 302 contacts and straddles the corresponding second cam portion 303, and the upper mold 51 is lifted from the stop portion 204. The upper surface of the upper mold 51 approaches the lower surfaces of the base member 2 and the base member 4, and the distance between them decreases. Furthermore, in the mold-locking position Q, the flat surface 302b of the first cam portion 302 contacts the second cam portion 303.

[0120] On the other hand, when the upper mold 51 slides from the locking position Q toward the protruding position R, the first cam portion 302 of the upper mold 51 moves away from the corresponding second cam portion 303, and the upper mold 51 moves under its own weight and is placed on the stop portion 204. The upper surface of the upper mold 51 moves away from the lower surface of the base member 2 and the base member 4, and the interval between them becomes larger.

[0121] <1-3-2. Mechanism for the alteration of the spacing between the lower mold 52 and base components 3 and 4>

[0122] Specifically, the cam mechanism 301 corresponding to the lower mold support frame 201b is a structure that presses the lower mold 52, which is supported on the lower mold support frame 201b by the elastic body 205 and the contact portion 206, into the side of the elastic body 205 (base member 2 to base member 4). The inclined surface 302a of the first cam portion 302 is as follows: Figure 9 As shown in “Structure of the first cam part (b)”, the upward-facing surface is a surface with a downward slope from the protruding position R toward the mold-locking position Q.

[0123] With the aforementioned structure, when the lower mold 52 slides from the protruding position R towards the mold-locking position Q, as... Figure 13 As shown in (b), the inclined surface 302a of the first cam portion 302 of the lower mold 52 contacts the corresponding second cam portion 303, and the lower mold 52 is pressed into the side of the elastic body 205. The lower surface of the lower mold 52 is close to the upper surfaces of the base member 3 and the base member 4, and the interval between them becomes smaller. In addition, in the mold-locking position Q, the flat surface 302b of the first cam portion 302 contacts the second cam portion 303.

[0124] On the other hand, when the lower mold 52 slides from the locking position Q toward the protruding position R, the first cam portion 302 of the lower mold 52 moves away from the corresponding second cam portion 303, and the lower mold 52 moves upward by the force applied from the elastic body 205, and the lower surface of the lower mold 52 moves away from the upper surface of the base member 3 and the base member 4, and the interval between them becomes larger.

[0125] Here, the cam mechanism 301 of the interval changing mechanism 30 ensures that the opposing surfaces of the upper mold 51 and lower mold 52 and the base members 2 to 4 are not in contact at the mold-locking position Q, but are separated by a small gap. Furthermore, the mold-locking mechanism 10 locks the forming molds 5a and 5b, bringing the opposing surfaces of the upper mold 51 and lower mold 52 into contact with the base members 2 to 4. At this time, because the upper mold 51 and lower mold 52 are closely connected to the base members 2 to 4, the first cam portion 302 and the second cam portion 303 of the upper mold 51 and lower mold 52 are separated, preventing the cam mechanism 301 from breaking due to mold locking. Alternatively, the cam mechanism 301 can also be configured to bring the opposing surfaces of the upper mold 51 and lower mold 52 into contact with the base members 2 to 4 at the mold-locking position Q.

[0126] <1-4. Specific Structure of Conveying Mechanism 13 and Conveying Mechanism 18>

[0127] Next, the specific structures of the substrate conveying mechanism 13 and the resin material conveying mechanism 18 of this embodiment will be described.

[0128] The substrate conveying mechanism 13 conveys the substrate W and the resin molded article P, which are the objects to be conveyed, to the upper mold 51 located at the protruding position R. The substrate conveying mechanism 13, as described above... Figure 11 As shown, the substrate W and resin molded article P are moved to a transport position X1 where the substrate transport mechanism 13 is located below the upper mold 51 at the protruding position R, for transporting the substrate W and resin molded article P. Here, the transport position X1 refers to the position where the substrate transport mechanism 13 is located below the upper mold 51 at the protruding position R, for transporting and transferring the substrate W and resin molded article P. Furthermore, when the substrate W and resin molded article P are transported to the upper mold 51 by the substrate transport mechanism 13, the lower mold 52 is in the mold-locking position Q, which does not obstruct the transport of the substrate W and resin molded article P relative to the upper mold 51. Moreover, the substrate transport mechanism 13 is configured to move in the left-right direction between the transport position X1 and the retracted position (not shown). Here, the transport position X1 can also be expressed as the transfer position where the substrate W, the object to be transported, is transferred between the molding die (upper mold 51) at the protruding position R and the substrate transport mechanism 13.

[0129] Specifically, the substrate conveying mechanism 13, such as Figure 1 As shown, the device includes: a substrate supply section 131 for supplying a substrate W to an upper mold 51 located at a protruding position R; and a substrate receiving section 132 for receiving a resin molded article P from the upper mold 51 located at the protruding position R. The substrate supply section 131 and the substrate receiving section 132 are provided corresponding to each upper mold 51, and these are arranged horizontally in the left-right direction.

[0130] Furthermore, the substrate conveying mechanism 13 moves left and right at the conveying position X1, continuously performing the receiving operation of the substrate receiving section 132 and the supply operation of the substrate supply section 131. When the substrate receiving section 132 is performing the receiving operation, the substrate receiving section 132 is located below the upper mold 51 in the protruding position R. When the substrate supply section 131 is performing the supply operation, the substrate supply section 131 is located below the upper mold 51 in the protruding position R.

[0131] The resin material conveying mechanism 18 conveys the resin material J and the release film F, which are the objects to be conveyed, to the lower mold 52 located at the protruding position R. The resin material conveying mechanism 18, as... Figure 12 As shown, the material is moved to a transport position X2 for transporting resin material J and release film F to the lower mold 52 located at the protruding position R. Here, the transport position X2 refers to the position where the resin material transport mechanism 18 is located above the lower mold 52 at the protruding position R, for transporting and transferring resin material J and release film F. Furthermore, when the resin material transport mechanism 18 transports resin material J and release film F to the lower mold 52, the upper mold 51 is in the locking position Q, which does not obstruct the transport of resin material J and release film F relative to the lower mold 52. Moreover, the resin material transport mechanism 18 is configured to move in the left-right direction between the transport position X2 and the retracted position (not shown). Here, the transport position X2 can also be expressed as the junction position where the resin material J, the object to be transported, is transferred between the molding die (lower mold 52) located at the protruding position R and the resin material transport mechanism 18.

[0132] Specifically, the resin material conveying mechanism 18, etc. Figure 1 As shown, the device includes: a resin material supply unit 181 that supplies resin material J and a release film F before use to the lower mold 52 located at the protruding position R; and a film recycling unit 182 that recycles the used release film F from the lower mold 52 located at the protruding position R. The resin material supply unit 181 and the film recycling unit 182 are provided corresponding to each lower mold 52, and these are arranged horizontally in the left-right direction.

[0133] Furthermore, the resin material conveying mechanism 18 moves left and right at the conveying position X2, continuously performing the recycling operation of the film recycling section 182 and the supply operation of the resin material supply section 181. When the film recycling section 182 is performing the recycling operation, the film recycling section 182 is located above the lower mold 52 in the protruding position R. When the resin material supply section 181 is performing the supply operation, the resin material supply section 181 is located above the lower mold 52 in the protruding position R.

[0134] <1-5. An example of the operation of the resin molding apparatus 100>

[0135] Next, refer toFigure 1 , Figure 2 , Figure 4 as well as Figure 8 Here is an example of how the resin molding apparatus 100 operates. The operations shown below are performed, for example, by controlling each part of the resin molding apparatus 100 through a control unit COM provided in the substrate supply / storage module A. Furthermore, the control unit COM is a dedicated or general-purpose computer equipped with a central processing unit (CPU), internal memory, input / output interface, analog-to-digital (AD) converter, etc.

[0136] <1-5-1. Overall Movement>

[0137] First, the forming molds 5a and 5b are opened via the lifting linkage mechanism 8 (refer to...). Figure 2 Under ) through Figure 1 The substrate supply / storage module A shown transports and holds the substrate W in the upper mold 51 of each molding die 5a, 5b. Furthermore, the resin material supply module C stores the release film F and resin material J into the cavity 52C of the lower mold 52 of each molding die 5a, 5b. Thus, the substrate W, which is the object to be molded, along with the release film F and resin material J, are supplied to each molding die 5a, 5b.

[0138] Next, the movable platform 3 is raised by the clamping mechanism 10. As the movable platform 3 rises, the boom mechanism 81 retracts, and the intermediate plate 4, connected to the rotation shaft 81c of the cross linkage 811 of the boom mechanism 81, rises. Here, as the movable platform 3 rises, the areas surrounding the forming molds 5a and 5b are... Figure 5 The sealed structure 50 shown is sealed, and a vacuum pump (not shown) is used to evacuate the area around the forming mold 5a and forming mold 5b.

[0139] Furthermore, the upper surface of the lower mold 52 of each forming mold 5a and 5b (specifically, the upper surface of the side member 522, or the release film F if present) contacts the substrate W held and held in the upper mold 51. At this time, since the lower mold 52 in the first forming mold 5a and the second forming mold 5b contacts the upper mold 51 at different times, the upper elastic member 823a or the lower elastic member 823b deforms before the elastic member 524 of the lower mold 52. That is, the spring constant of the upper elastic member 823a and the lower elastic member 823b is less than the spring constant of the elastic member 524 of the lower mold 52.

[0140] For example, when the lower mold 52 on the intermediate plate 4 (the lower mold 52 of the first forming mold 5a) contacts the substrate W held by the corresponding upper mold 51 before the lower mold 52 on the movable platform 3 (the lower mold 52 of the second forming mold 5b), the intermediate plate 4 displaces downward relative to the connecting member 821, and the upper elastic member 823a contracts (see reference). Figure 8 (a)).

[0141] On the other hand, when the lower mold 52 (lower mold 52 of the second forming mold 5b) on the movable platform 3 contacts the substrate W held by the corresponding upper mold 51 before the lower mold 52 (lower mold 52 of the first forming mold 5a) on the intermediate plate 4, the intermediate plate 4 moves upward relative to the connecting member 821, and the lower elastic member 823b contracts (see reference). Figure 8 (b)).

[0142] By doing so, the difference in the timing of the lower mold 52 contacting the upper mold 51 in the first molding die 5a and the second molding die 5b is eliminated, and a mold-locking operation is performed. Moreover, the upper elastic member 823a and the lower elastic member 823b absorb not only the thickness deviation of the substrate W, but also, for example, the deviation in the amount of resin material J housed in the mold cavity 52C, the deviation in the volume of the electronic component Wx fixed to the substrate W, etc.

[0143] Subsequently, the clamping mechanism 10 raises the movable platform 3 further, thereby completing the clamping of the first molding die 5a and the second molding die 5b. Resin molding is completed by maintaining this state for a predetermined time (e.g., the curing time of the resin material J). Thus, the lifting linkage mechanism 8 clamps each molding die 5a and 5b, and resin molding is performed. Subsequently, when the clamping mechanism 10 lowers the movable platform 3, each molding die 5a and 5b is opened. Then, the resin molded product P is stored in the substrate storage section 12 (see reference 12) via the substrate supply / storage module A. Figure 1 Thus, the lifting linkage mechanism 8 is used to open each molding mold 5a and 5b, and the molding object, namely the substrate W (resin molded product P) formed by resin molding, is taken out from each molding mold 5a and 5b and stored in the substrate storage part 12, thereby manufacturing the resin molded product P.

[0144] <1-5-2. Details of the transport process before (and after) the resin molding process>

[0145] Next, refer to Figure 11 to 14 The details of the transport process before (or after) the resin molding process will be explained.

[0146] (Resin molded article receiving steps: S1 (refer to)) Figure 14 ))

[0147] In the state where each forming mold 5a and 5b has been opened (refer to...) Figure 2 Below, such as Figure 11 As shown, the upper molds 51 of each molding die 5a and 5b are moved simultaneously from the locking position Q to the protruding position R via the molding die sliding mechanism 20 (first upper mold sliding process). Furthermore, the substrate conveying mechanism 13 moves to the conveying position X1. In addition, during the first upper mold sliding process, as... Figure 13 As shown in (a), the spacing between the facing surfaces of the base member 2, the base member 4 and the upper mold 51 increases through the spacing change mechanism 30. Furthermore, the substrate receiving portion 132 of the substrate conveying mechanism 13 receives the resin molded article P together with the upper mold 51 located at the protruding position R.

[0148] (Substrate supply step before forming: S2 (refer to)) Figure 14 ))

[0149] Next, the substrate supply section 131 of the substrate transport mechanism 13 supplies the substrate W before molding to the upper mold 51 located at the protruding position R and holds it (substrate transport step). Subsequently, the upper mold 51 holding the substrate W before molding is moved from the protruding position R to the mold locking position Q by the molding mold sliding mechanism 20 (second upper mold sliding step). Furthermore, the substrate transport mechanism 13 moves to the retracted position. In addition, in the second upper mold sliding step, as... Figure 13 As shown in (a), the spacing between the opposing surfaces of the base member 2, the base member 4 and the upper mold 51 decreases through the spacing change mechanism 30.

[0150] (Used film recycling steps: S3 (refer to)) Figure 14 ))

[0151] like Figure 12 As shown, the lower molds 52 of each molding die 5a and 5b are moved simultaneously from the locking position Q to the protruding position R via the molding die sliding mechanism 20 (first lower mold sliding step). Furthermore, the resin material conveying mechanism 18 is moved to the conveying position X2. In addition, during the first lower mold sliding step, as... Figure 13 As shown in (b), the spacing between the facing surfaces of the base member 3, base member 4 and lower mold 52 increases through the spacing change mechanism 30. Furthermore, the film recovery section 182 of the resin material conveying mechanism 18 recovers the used demolding film F together with the lower mold 52 located at the protruding position R.

[0152] (Resin material supply step: S4 (refer to)) Figure 14 ))

[0153] Next, the resin material supply section 181 of the resin material conveying mechanism 18 supplies the release film F and resin material J to the lower mold 52 before use (resin material conveying process). Subsequently, via the molding die sliding mechanism 20, the lower mold 52, with the release film F and resin material J supplied, moves together from the protruding position R to the locking position Q (second lower mold sliding process). Furthermore, the resin material conveying mechanism 18 moves to the retracted position. In addition, during the second lower mold sliding process, as... Figure 13 As shown in (b), the spacing between the opposing surfaces of the base member 3, the base member 4 and the lower mold 52 decreases through the spacing change mechanism 30.

[0154] Subsequently, the next resin molding process is carried out. Furthermore, the resin molded product P received by the substrate conveying mechanism 13 is stored in the substrate storage section 12 (see reference). Figure 1 Furthermore, the used release film F, recovered by the resin material conveying mechanism 18, is discarded into a waste bin (not shown).

[0155] <1-5-3. Sliding motion of upper mold 51 and moving motion of substrate conveying mechanism 13>

[0156] In this embodiment, the first sliding action of the substrate conveying mechanism 13 toward the conveying position X1 for transferring the substrate W to the upper mold 51 located at the protruding position R is performed before the first sliding action of the upper mold 51 toward the protruding position R by the forming mold sliding mechanism 20, or the first sliding action is performed in a manner that overlaps with at least a portion of the first sliding action.

[0157] The phrase "performing the first sliding action in a manner that overlaps with at least a portion of the first moving action" means that the first moving action and the first sliding action are performed simultaneously for at least a portion of the time, or that there is a period during which the first moving action and the first sliding action are performed simultaneously.

[0158] Specifically, such as Figure 15 (a) First action pattern and Figure 16 As shown, the first sliding action can be considered after the first moving action is completed. That is, after the substrate conveying mechanism 13 moves to the conveying position X1 (refer to...). Figure 16 (a) The forming mold sliding mechanism 20 begins to slide the upper mold 51, causing it to move to the protruding position R (see reference). Figure 16 (b) Furthermore, the resin molded article P is taken from the upper mold 51 located at the protruding position R via the substrate receiving part 132 of the substrate conveying mechanism 13 (see reference). Figure 16 (c)). Furthermore, the substrate supply section 131 of the substrate conveying mechanism 13 supplies the pre-forming substrate W to the upper mold 51 located at the protruding position R (see reference). Figure 16(d)). After the substrate W is supplied from the substrate conveying mechanism 13 to the upper mold 51 before molding, the molding die sliding mechanism 20 begins to slide the upper mold 51 to move it to the mold locking position Q (see reference). Figure 16 (e)). After the upper mold 51 moves to the locking position Q, the substrate conveying mechanism 13 retracts from the conveying position X1 to the retracted position. By pre-moving the substrate conveying mechanism 13 to the conveying position X1, the time the upper mold 51 stays in the protruding position R can be shortened, thereby preventing the temperature of the upper mold 51 from dropping, and also preventing contamination (e.g., attachment or mixing of foreign matter) of the upper mold 51 or the resin molded article P.

[0159] Furthermore, it is also possible to consider having the first moving action and the first sliding action completed simultaneously or within a specified time. In this case, such as... Figure 16 (b) In the second operating mode, the time it takes for the substrate conveying mechanism 13 to move from the retracted position to the conveying position X1 is calculated. This moving time can also be calculated in advance and stored in a memory. Furthermore, the moving time for the upper mold 51 to move from the locking position Q to the protruding position R is calculated in advance. And, the sliding action of the upper mold 51 is performed based on the time it takes for the substrate conveying mechanism 13 to reach the conveying position X1. Thus, the upper mold 51 reaches the protruding position R at the same time as the substrate conveying mechanism 13 reaches the conveying position X1. Moreover, after the substrate W is supplied from the substrate conveying mechanism 13, the sliding action of the upper mold 51 from the protruding position R towards the locking position Q and the movement of the substrate conveying mechanism 13 from the conveying position X1 towards the retracted position begin simultaneously or at a predetermined time. In this way, the first moving action of the substrate conveying mechanism 13 and the first sliding action of the upper mold 51 are completed simultaneously or within a predetermined time, thereby shortening the cycle time of the resin molding apparatus 100 and improving the productivity of the resin molding apparatus 100.

[0160] In addition, as a configuration where the first sliding action is performed in a manner that overlaps with at least a portion of the first moving action, the sliding movement of the upper mold 51 may begin before the substrate conveying mechanism 13 reaches the conveying position X1, so that the substrate conveying mechanism 13 reaches the conveying position X1 before the upper mold 51 reaches the protruding position R. That is, the substrate conveying mechanism 13 may reach the conveying position X1 during the period when the upper mold 51 moves from the locking position Q toward the protruding position R. Even with this configuration, the time the upper mold 51 remains at the protruding position R can be shortened, thereby preventing the temperature of the upper mold 51 from dropping, and also preventing contamination of the upper mold 51 or the resin molded article P (e.g., attachment or mixing of foreign matter).

[0161] Alternatively, the upper mold 51 can begin sliding before the substrate conveying mechanism 13 reaches the conveying position X1, so that the substrate conveying mechanism 13 reaches the conveying position X1 after the upper mold 51 has reached the protruding position R.

[0162] <1-5-4. Sliding motion of lower mold 52 and moving motion of resin material conveying mechanism 18>

[0163] The second sliding action of the lower mold 52 toward the protruding position R, performed by the molding die sliding mechanism 20, begins first, and the resin material conveying mechanism 18 moves toward the conveying position X2, which is the transfer position for the lower mold 52 located at the protruding position R, to transfer the demolding film F and the resin material J. Alternatively, the second sliding action may be performed in a manner that overlaps with at least a portion of the second moving action.

[0164] The phrase "performing the second sliding action in a manner that overlaps with at least a portion of the second moving action" means that the second moving action and the second sliding action are performed simultaneously for at least a portion of the time, or that there is a period during which the second moving action and the second sliding action are performed simultaneously.

[0165] Specifically, such as Figure 15 (a) First action pattern and Figure 17 As shown, a second sliding action can be considered after the second moving action is completed. That is, after the resin material conveying mechanism 18 moves to the conveying position X2 (refer to...). Figure 18 (a) The forming die sliding mechanism 20 begins to slide the lower die 52, causing it to move to the protruding position R (see reference). Figure 18 (b) Furthermore, the used demolding film F is recovered from the lower mold 52 located at the protruding position R via the film recovery section 182 of the resin material conveying mechanism 18 (see reference). Figure 18 (c) Furthermore, the resin material supply section 181 of the resin material conveying mechanism 18 supplies the lower mold 52, located at the protruding position R, with a release film F and resin material J (see reference). Figure 18 (d)). After the release film F and resin material J are supplied to the lower mold 52 from the resin material conveying mechanism 18, the molding die sliding mechanism 20 begins to slide the lower mold 52 to move it to the mold-locking position Q (see reference). Figure 18 (e)). After the lower mold 52 moves to the locking position Q, the resin material conveying mechanism 18 retracts from the conveying position X2 to the retracted position. By pre-moving the resin material conveying mechanism 18 to the conveying position X2, the time the lower mold 52 stays in the protruding position R can be shortened, thereby preventing the temperature of the lower mold 52 from dropping, and also preventing contamination of the lower mold 52 (e.g., the attachment or mixing of foreign matter).

[0166] Furthermore, it is also possible to consider having the second movement and the second sliding movement complete simultaneously or within a specified time. In this case, such as... Figure 18(b) In the second operating mode, the time for the resin material conveying mechanism 18 to move from the retracted position to the conveying position X2 is calculated. This moving time can also be calculated in advance and stored in a memory. Furthermore, the moving time for the lower mold 52 to move from the locking position Q to the protruding position R is calculated in advance. And, the sliding action of the lower mold 52 is performed based on the time it takes for the resin material conveying mechanism 18 to reach the conveying position X2. Thus, the lower mold 52 reaches the protruding position R simultaneously with the resin material conveying mechanism 18 reaching the conveying position X2. Moreover, after the release film F and resin material J are supplied from the resin material conveying mechanism 18, the sliding action of the lower mold 52 from the protruding position R towards the locking position Q and the action of the resin material conveying mechanism 18 from the conveying position X2 towards the retracted position begin simultaneously or at a predetermined time. In this way, the second moving action of the resin material conveying mechanism 18 and the second sliding action of the lower mold 52 are completed simultaneously or within a predetermined time, thereby shortening the cycle time of the resin molding apparatus 100 and improving the productivity of the resin molding apparatus 100.

[0167] In addition, as a form in which the second sliding action is performed in a manner that overlaps with at least a portion of the second moving action, the sliding movement of the lower mold 52 may begin before the resin material conveying mechanism 18 reaches the conveying position X2, so that the resin material conveying mechanism 18 reaches the conveying position X2 before the lower mold 52 reaches the protruding position R. That is, the resin material conveying mechanism 18 may reach the conveying position X2 during the period when the lower mold 52 moves from the locking position Q toward the protruding position R. Even with the above structure, the time that the lower mold 52 stays at the protruding position R can be shortened, thereby preventing the temperature of the lower mold 52 from dropping, and also preventing contamination of the lower mold 52 (e.g., the adhesion or mixing of foreign matter).

[0168] Alternatively, the lower mold 52 can begin sliding before the resin material conveying mechanism 18 reaches the conveying position X2, so that the resin material conveying mechanism 18 reaches the conveying position X2 after the lower mold 52 has reached the protruding position R.

[0169] <1-6. Effects of the First Embodiment>

[0170] According to the resin molding apparatus 100 of this embodiment, the substrate conveying mechanism 13 begins a first movement toward the conveying position X1, which is the position for conveying the substrate W and the resin molded article P to the upper mold 51 located at the protruding position R, before the first sliding movement toward the protruding position R performed by the molding die sliding mechanism 20. Alternatively, the first sliding movement is performed in a manner that overlaps with at least a portion of the first movement, thereby shortening the time the upper mold 51 remains at the protruding position R. As a result, the temperature drop of the upper mold 51 located at the protruding position R can be prevented, thereby facilitating the temperature maintenance of the upper mold 51. Furthermore, contamination of the upper mold 51 can be reduced, or the cycle time can be shortened. Therefore, the resin molded article P can be manufactured while satisfying conditions such as temperature maintenance of the upper mold 51, reduction of contamination of the upper mold 51, or shortening of the cycle time.

[0171] Furthermore, the second sliding action of the resin material conveying mechanism 18 towards the conveying position X2, which conveys the demolding film F and resin material J to the lower mold 52 located at the protruding position R, begins before the second sliding action of the molding die sliding mechanism 20 towards the protruding position R. Alternatively, the second sliding action is performed in a manner that overlaps with at least a portion of the second sliding action, thus shortening the time the lower mold 52 remains at the protruding position R. As a result, the temperature drop of the lower mold 52 located at the protruding position R can be prevented, thereby facilitating temperature maintenance of the lower mold 52. Moreover, contamination of the lower mold 52 can be reduced, or cycle time can be shortened. Therefore, resin molded articles P can be manufactured while simultaneously satisfying conditions such as temperature maintenance of the lower mold 52, reduction of contamination of the lower mold 52, or shortening of cycle time.

[0172] Furthermore, when the molding molds 5a and 5b slide between the locking position Q and the protruding position R via the molding mold sliding mechanism 20, the distance between the facing surfaces of the base members 2-4 and the molding molds 5a and 5b is changed, thus allowing the facing surfaces of the base members 2-4 and the molding molds 5a and 5b to be separated during sliding. As a result, wear caused by the sliding of the molding molds 5a and 5b can be reduced. Moreover, by moving the molding molds 5a and 5b to the protruding position R, the objects to be transported (pre-molding substrate W, resin molded article P, release film F, and resin material J) can be conveyed to the molding molds 5a and 5b at the protruding position R. As a result, the distance between the molding molds 5a and 5b at mold opening does not need to be increased, and the resin molding apparatus 100 can be made shorter.

[0173] The connecting mechanism 82 of the cross link portion 811 of the boom mechanism 81 and the intermediate plate 4 has a connecting member 821 connected to the cross link portion 811, a connecting member 822 connecting the connecting member 821 to the intermediate plate 4, and elastic members 823a and 823b separating the connecting member 821 and the connecting member 822. Therefore, it can absorb the deviation of the thickness of the substrate W in each forming mold 5a and 5b.

[0174] For example, even if there is a deviation between the thickness of the substrate W before molding held by the upper mold 51 of the first molding die 5a and the thickness of the substrate W before molding held by the upper mold 51 of the second molding die 5b, the deviation in thickness of the substrate W before molding can be absorbed and mold-locking can be performed by elastic deformation of the elastic members 823a and 823b. As a result, in the resin molding apparatus 100 that performs mold-locking on multiple molding dies 5a and 5b, the mold-locking of multiple molding dies 5a and 5b can be synchronized, and the deviation in thickness of the substrate W before molding in each molding die 5a and 5b can be absorbed to perform resin molding.

[0175] Furthermore, since the lifting mechanism 81 is used to link the lifting of the movable platform 3 with the lifting of the intermediate plate 4, the enlargement of each component can be prevented, and the enlargement of the overall device can also be suppressed, thus eliminating the need for high-rigidity components.

[0176] <2. Second Embodiment of the Invention>

[0177] Next, the second embodiment of the present invention will be described. Furthermore, the parts that differ from the first embodiment will be described below, and the same symbols will be used to denote the same components.

[0178] The resin molding apparatus 100 of the second embodiment differs from the first embodiment (which uses one intermediate plate 4 and has two sets of molding dies) in that it uses multiple intermediate plates 4 and has multiple sets of molding dies. For example, it may also be configured as follows: a structure using two intermediate plates 4 and having three sets of molding dies, a structure using three intermediate plates 4 and having four sets of molding dies, a structure using four intermediate plates 4 and having five sets of molding dies, and a structure using five or more intermediate plates 4 and having six or more sets of molding dies.

[0179] Specifically, the resin molding apparatus 100, such as Figure 17 As shown, multiple intermediate plates 4 are arranged vertically between the fixed platform 2 and the movable platform 3. Furthermore, forming molds 5b and 5c, each containing an upper mold 51 and a lower mold 52, are respectively provided between the multiple intermediate plates 4. Figure 19 The diagram shows the structure from the fixed platform 2 up to the three intermediate plates 4, with the lower part omitted.

[0180] As in the first embodiment, multiple intermediate plates 4 are respectively connected to multiple cross linkages 811 of the boom mechanism 81 via a connecting mechanism 82. Thus, the multiple intermediate plates 4 move up and down in conjunction with the lifting and lowering of the movable platform 3.

[0181] Here, the boom mechanism 81 is as follows Figure 19 As shown, the system includes a plurality of cross links 811, an upper link 812, and a lower link 813, corresponding to a plurality of intermediate plates 4. The plurality of cross links 811 are connected in series. Specifically, in adjacent cross links 811, the upper end of the first link 81a of one cross link 811 is rotatably connected to the upper end of the second link 81b of another cross link 811 via a rotation shaft 81l, and the upper end of the second link 81b of one cross link 811 is rotatably connected to the upper end of the first link 81a of another cross link 811 via a rotation shaft 81m. Furthermore, the structures of the upper link 812 and the lower link 813 are the same as in the first embodiment.

[0182] Furthermore, the side panels 41, which are respectively connected to the multiple intermediate plates 4, are arranged offset in the horizontal direction in a manner that does not interfere with each other. Specifically, as Figure 20 As shown, the side panels 41 of the middle plates 4, which are adjacent to each other in the vertical direction, are arranged to be offset from each other in the left and right (horizontal direction).

[0183] For example, the side panel 41a of the first intermediate plate 4 from the top is located on the inner side, and the side panel 41b of the second intermediate plate 4 from the top is located on the outer side. Furthermore, the side panel 41b of the second intermediate plate 4 from the top is located on the outer side, and the side panel 41c of the third intermediate plate 4 from the top is located on the inner side. Here, on the side panel 41b of the second intermediate plate 4 from the top, a through hole or cutout (not shown) is formed throughout the movement range of the linear moving block 842, in a manner that does not obstruct the movement of the linear moving block 842 disposed on the inner side panels 41a and 41c (the first and third from the top).

[0184] <2-1. Effects of the Second Embodiment>

[0185] In addition to the effects of the first embodiment, the resin molding apparatus 100 according to this embodiment can use three or more molding dies 5a to 5c to perform resin molding, thereby improving the productivity of the resin molded product P. Moreover, since the side panels 41 of the plurality of intermediate plates 4 are arranged offset in the horizontal direction in a manner that does not interfere with each other, the height dimension of the resin molding apparatus 100 can be suppressed.

[0186] <3. Other variations and implementations>

[0187] Furthermore, the present invention is not limited to the embodiments described herein.

[0188] For example, in Figure 19 and Figure 2 In the structure, a base component may also be provided between the fixed platform 2 and the upper mold 51 of the forming mold 5a, between the intermediate plate 4 and the lower mold 52 of the forming mold 5a, between the intermediate plate 4 and the upper mold 51 of the forming mold 5b, or between the movable platform 3 and the lower mold 52 of the forming mold 5b.

[0189] Furthermore, in the aforementioned embodiment, the connecting member 822 extends outwards from the front and rear of the side wall member 61 and the side wall member 62, but it can also be as follows: Figure 3 As shown, the structure is configured such that the connecting member 822 and the connecting member 821 are connected via the through portion 6H formed in the side wall member 61 and the side wall member 62.

[0190] Specifically, in sidewall members 61 and 62, a through-hole 6H is formed at the portion corresponding to the cross link portion 811. Here, the through-hole 6H is formed in a manner that takes into account the amount of movement of the intermediate plate 4 and does not interfere with the movement of the connecting member 822. Furthermore, the connecting member 822 is connected to the side panel 41 of the intermediate plate 4 and extends to the outside of sidewall members 61 and 62 via the through-hole 6H, supporting elastic members 823a and 823b (displacement absorption mechanisms 83a and 83b) on the outside of sidewall members 61 and 62. The connecting member 822 is connected to the connecting member 821 via the elastic members 823a and 823b (displacement absorption mechanisms 83a and 83b).

[0191] Furthermore, a guide mechanism 84 is provided between the connecting member 821 and the connecting structure member 822. Specifically, the guide mechanism 84 has a linear movement track 841 provided on one of the connecting member 821 or the connecting structure member 822, and a linear movement block 842 provided on the other of the connecting member 821 or the connecting structure member 822.

[0192] The multiple forming molds used in the first and second embodiments can be either identical or different. Here, "multiple forming molds being different" can mean that the upper molds are different or the lower molds are different.

[0193] In the embodiment described above, the linear movement track 71 of the lifting and sliding mechanism 7 is provided on the side wall member 61 and the side wall member 62, and the linear movement block 72 is provided on the side panel 41. Alternatively, the linear movement track 71 of the lifting and sliding mechanism 7 can be provided on the side panel 41, and the linear movement block 72 can be provided on the side wall member 61 and the side wall member 62.

[0194] In the embodiment described, a lifting linkage mechanism 81 is used to link multiple forming molds 5a and 5b. However, other lifting linkage mechanisms 8, such as lever mechanisms (Japanese Patent Application Laid-Open No. 2019-77144) or rack and pinion mechanisms (Japanese Patent Application Laid-Open No. 2010-094931), may also be used.

[0195] For example, a lifting linkage mechanism using a lever mechanism, such as 8 Figure 21 As shown in (a), the arm 60 has an end 60 that rotates around a fulcrum 60a. A movable platform 3 and an intermediate plate 4 are connected to different positions of the arm 60 via connecting members 70a and 70b. When the movable platform 3 is driven by the mold-locking mechanism 10, the arm 60 rotates around the fulcrum 60a, and the intermediate plate 4 connected to the arm 60 moves up and down in conjunction with the movable platform 3.

[0196] Furthermore, the lifting linkage mechanism using a rack and pinion mechanism, such as 8 Figure 22 Figure 22 As shown in (b), the device has a pair of racks 80a and 80b and a pinion 80c meshing with these racks 80a and 80b. One rack 80a is located on side wall member 61 and side wall member 62, and the other rack 80b is located on the movable platform 3. Furthermore, a pinion 80c meshing with these racks 80a and 80b is provided on the intermediate plate 4. By using a motor (not shown) to rotate the pinion 80c clockwise or counterclockwise, the movable platform 3 and the intermediate plate 4 move in a vertical direction in tandem.

[0197] The forming mold of the described embodiment has multiple sets of upper molds 51 and lower molds 52, but it may also have a structure with only one set of upper molds 51 and lower molds 52. In this case, the base components are a fixed platform 2 and a movable platform 3. Furthermore, the upper mold 51 slides relative to the fixed platform 2 in a sliding direction intersecting the mold-locking direction via the forming mold sliding mechanism 20. Moreover, the lower mold 52 slides relative to the movable platform 3 in a sliding direction intersecting the mold-locking direction via the forming mold sliding mechanism 20.

[0198] In addition, the present invention is not limited to the described embodiments, and various modifications can be made without departing from its spirit.

[0199] Industrial availability

[0200] According to the present invention, in a resin molding apparatus in which the molding die slides along a sliding direction intersecting the clamping direction, wear caused by the sliding of the molding die can be reduced.

[0201] Explanation of icon numbers

[0202] 100: Resin molding device

[0203] W: Shaped object

[0204] P: Resin molded article (the object to be molded by resin molding)

[0205] J: Resin materials

[0206] F: Release film

[0207] 2: Fixed platform (base component)

[0208] 3: Movable platform (base component)

[0209] 4: Intermediate plate (base component)

[0210] 5a, 5b, 5c: Forming molds

[0211] 51: Upper mold

[0212] 52: Lower mold

[0213] 61, 62: A pair of sidewall members

[0214] 7: Lifting and sliding mechanism

[0215] 81: Boom Mechanism

[0216] 82: Connecting mechanism

[0217] 10: Mold clamping mechanism

[0218] 13: Substrate conveying mechanism (forming object conveying mechanism)

[0219] X1: Transport position

[0220] 131: Substrate Supply Department (Making Object Supply Department)

[0221] 132: Substrate receiving section (molded object receiving section)

[0222] 18: Resin material conveying mechanism

[0223] X2: Transport position

[0224] 181: Resin Material Supply Department

[0225] 182: Thin Film Recycling Department

[0226] 20: Forming mold sliding mechanism

[0227] 201 (201a, 201b): Supporting Frame

[0228] Q: Clamping position

[0229] R: Prominent Position

[0230] 203: Drive actuator

[0231] 207: Positioning Department

[0232] 30: Interval Change Mechanism

[0233] 301: Cam mechanism

Claims

1. A resin molding apparatus, comprising: The mold-locking mechanism locks the forming mold via the base component; The forming mold sliding mechanism allows the forming mold to slide between a locked position and a protruding position located further outward than the base member in a sliding direction intersecting the locking direction. as well as The interval changing mechanism changes the interval between the opposing surfaces of the base member and the forming mold when the forming mold slides between the locking position and the protruding position via the forming mold sliding mechanism.

2. The resin molding apparatus according to claim 1, wherein the molding die has an upper die and a lower die. The forming mold sliding mechanism is provided corresponding to the upper mold and the lower mold respectively. The interval changing mechanism is provided respectively for the upper mold and the lower mold.

3. The resin molding apparatus according to claim 1 or 2, wherein the molding die sliding mechanism and the interval changing mechanism are configured using a common drive actuator.

4. The resin molding apparatus according to claim 1 or 2, wherein the molding die sliding mechanism comprises: Support frame, supporting the forming mold; and Drive the actuator to move the support frame along the sliding direction. The interval changing mechanism has a cam mechanism disposed between the forming mold and the base member. As the drive actuator moves the support frame, the cam mechanism changes the distance between the facing surfaces of the forming mold and the base component.

5. The resin molding apparatus according to any one of claims 1 to 4, wherein the spacing adjustment mechanism causes the opposing surfaces of the molding die and the base member to be separated by a gap at the mold-locking position. The mold is locked by the mold-locking mechanism, and the forming mold and the base component are in contact with each other's facing surfaces.

6. The resin molding apparatus according to any one of claims 1 to 5, wherein the molding die sliding mechanism has a positioning part that contacts the molding die moving toward the locking position to position the molding die at the locking position.

7. The resin molding apparatus according to any one of claims 1 to 6, wherein the base member comprises: Fixed platform; The movable platform can be raised and lowered via the mold-locking mechanism; and An intermediate plate is disposed between the fixed platform and the movable platform. The forming mold has an upper mold and a lower mold, which are respectively disposed between the fixed platform and the intermediate plate, and between the intermediate plate and the movable platform. The resin molding apparatus further includes: A pair of sidewall members are disposed on the sides of the movable platform and the intermediate plate; A lifting and sliding mechanism allows the middle plate to slide relative to the pair of sidewall members in the vertical direction. as well as A lifting linkage mechanism links the lifting of the intermediate plate with the lifting of the movable platform. The lifting linkage mechanism has the following features: The boom mechanism has one end fixed relative to the side wall member and the other end moving together with the movable platform, extending and retracting by raising and lowering the movable platform; as well as A connecting mechanism that connects the cross linkage of the boom mechanism and the intermediate plate.

8. The resin molding apparatus according to any one of claims 1 to 7, further comprising: The conveying mechanism conveys the object to be conveyed by the forming mold located at the protruding position.

9. The resin molding apparatus according to claim 8, wherein the conveying mechanism comprises: A forming object conveying mechanism for conveying the forming object to the forming mold located at the protruding position; and A resin material conveying mechanism conveys resin material to the molding die located at the protruding position.

10. The resin molding apparatus according to claim 9, wherein the object conveying mechanism comprises: The object supply unit supplies the object to be molded to the mold located at the protruding position; and The molding object receiving part receives the resin-molded object from the molding mold located at the protruding position.

11. The resin molding apparatus according to claim 9 or 10, wherein the resin material conveying mechanism comprises: A resin material supply unit supplies resin material to the molding die located at the protruding position; and The film recycling unit recycles the used demolded film from the forming mold located at the protruding position.

12. A method for manufacturing a resin molded article, comprising using a resin molding apparatus as described in any one of claims 1 to 11 to manufacture the resin molded article, the method comprising: The conveying process involves conveying the object to be formed to the forming mold located at the protruding position; In the resin molding process, the molding die located at the mold-locking position is locked to perform resin molding on the object to be molded. as well as The removal process involves taking the resin-molded object out of the molding die located at the protruding position.

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