Laser processing position correction method and laser processing apparatus

Abstract

The application relates to the technical field of laser processing, in particular to a laser processing position correction method and a laser processing device. The laser processing position correction method comprises the following steps: selecting any to-be-processed area on a workpiece, moving a processing platform so that the to-be-processed area corresponds to a preset scanning range of a laser processing device; acquiring position information of the processing platform, determining a processing position deviation of the to-be-processed area according to the position information, wherein the processing position deviation is a deviation of an actual processing position of the to-be-processed area relative to a preset processing position; and adjusting the preset scanning range of the laser processing device to an actual scanning range corresponding to the actual processing position according to the processing position deviation. The application is beneficial to improving the processing precision of the workpiece, reducing the processing cost, and improving the processing efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and more specifically, to a laser processing position correction method and laser processing equipment. Background Technology

[0002] Laser processing equipment, due to its advantages of high efficiency, high precision, and wide applicability to various materials, has been widely used in cutting, marking, welding, and micro-machining. In such equipment, the stability of the platform's motion directly affects the accuracy of the processing trajectory and the final processing quality. With the increasing demands for processing precision and speed, current platform control schemes have certain limitations. For example, current calibration of the processing position typically utilizes a vision inspection system to identify the workpiece's position and capture target points, then adjusts the position of the processing platform to align and correct the processing area. However, this type of calibration method is relatively complex in terms of system response speed and operation, and has low calibration efficiency, making it difficult to meet the demands of high-speed, high-precision processing.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this application is to provide a laser processing position correction method and laser processing equipment, aiming to solve the technical problems of low calibration efficiency and slow response speed in the platform control scheme of related technologies.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] This application provides a laser processing position correction method, including:

[0007] Select any area to be processed on the workpiece, and move the processing platform so that the area to be processed corresponds to the preset scanning range of the laser processing device;

[0008] The location information of the processing platform is obtained, and the processing position deviation of the area to be processed is determined based on the location information. The processing position deviation is the deviation of the actual processing position of the area to be processed relative to the preset processing position.

[0009] Based on the processing position deviation, the preset scanning range of the laser processing device is adjusted to the actual scanning range corresponding to the actual processing position.

[0010] In some implementations, the location information includes at least one of a first sub-information and a second sub-information;

[0011] The first sub-information includes multiple first coordinate values ​​of the processing platform in a first direction;

[0012] The second sub-information includes multiple second coordinate values ​​of the processing platform in the second direction;

[0013] The first direction and the second direction are not parallel.

[0014] In some implementations, the mobile processing platform aligns the area to be processed with the preset scanning range of the laser processing device, including driving the processing platform to move along a first direction and / or a second direction so that the area to be processed aligns with the preset scanning range of the laser processing device;

[0015] The processing position deviation includes at least one of the following: a first deviation caused by the movement of the processing platform along a first direction and a second deviation caused by the movement of the processing platform along a second direction.

[0016] In some implementations, the first deviation includes: a first deflection angle and a first offset distance, wherein the first deflection angle is the deflection angle of the area to be processed relative to the second direction, and the first offset distance is the offset distance of the area to be processed due to the first deflection angle, wherein the first deviation is obtained through multiple first coordinate values;

[0017] The second deviation includes: a second deflection angle and a second offset distance. The second deflection angle is the deflection angle of the area to be processed relative to the first direction, and the second offset distance is the offset distance of the area to be processed due to the second deflection angle. The second deviation is obtained through multiple second coordinate values.

[0018] In some implementations, a first positioning point and a second positioning point for detecting the position of the processing platform are provided along the second direction; a third positioning point and a fourth positioning point are provided along the first direction, and the third positioning point and the fourth positioning point are respectively kept relatively fixed to the processing platform;

[0019] First deflection angle The following conditions must be met:

[0020] ;

[0021] First offset distance The following conditions must be met:

[0022] ;

[0023] in, This is the absolute value of the deviation between the theoretical and actual values ​​of the first coordinates of the second positioning point. The distance between the first positioning point and the second positioning point is [the distance between the two points]. The distance between the positioning center of the area to be processed and the first positioning point;

[0024] Second deflection angle The following conditions must be met:

[0025] ;

[0026] Second offset distance The following conditions must be met:

[0027] ;

[0028] in, The absolute value of the deviation between the theoretical and actual values ​​of the second coordinates of the fourth positioning point. The distance between the third positioning point and the fourth positioning point. The distance between the positioning center of the area to be processed and the third positioning point.

[0029] In some implementations, adjusting the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position based on the processing position deviation includes: displacement correction and angle correction, wherein...

[0030] The displacement correction includes: aligning the positioning center of the preset scanning range with a circle centered at the first positioning point... Move the first offset distance on a circle with radius . And / or, the positioning center of the preset scanning range is located with the third positioning point as the center. Move a second offset distance on a circle with a radius of 1. ;

[0031] The angle correction includes: deflecting the preset scanning range around its own central axis by a first deflection angle. and / or deflect the second deflection angle .

[0032] In some implementations, the laser processing position correction method further includes:

[0033] After the laser processing device finishes processing one of the areas to be processed, the processing platform is moved to another area to be processed, and the position information is reacquired to determine the processing position deviation. The position of the actual scanning range of the laser processing device is then adjusted to compensate for the processing position deviation.

[0034] This application provides a laser processing position correction method, applied to a laser processing equipment, the laser processing equipment including: a processing platform, a moving device, a position detection component, a laser processing device, and a controller;

[0035] The processing platform is used to support the workpiece;

[0036] The moving device is used to drive the processing platform to move so that the area to be processed of the workpiece corresponds to the preset scanning range of the laser processing device;

[0037] The position detection component is used to acquire the position information of the processing platform;

[0038] The controller is communicatively coupled to the position detection component, and the controller is configured to acquire the machining position deviation, wherein the machining position deviation is calculated based on the position information;

[0039] The controller is also communicatively coupled to the laser processing device and is configured to adjust the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position based on the processing position deviation.

[0040] The laser processing apparatus is configured to process the area to be processed according to the actual scanning range.

[0041] In some implementations, the mobile device includes a first mobile mechanism and a second mobile mechanism;

[0042] The processing platform is driven to move along a first direction by the first moving mechanism and / or along a second direction by the second moving mechanism, so that the area to be processed corresponds to the preset scanning range of the laser processing device, wherein the first direction and the second direction are perpendicular to each other;

[0043] The processing position deviation includes at least one of the following: a first deviation caused by the movement of the processing device along the first direction and a second deviation caused by the movement of the processing platform along the second direction.

[0044] In some implementations, the position detection component includes a plurality of first position detection devices and a plurality of second position detection devices;

[0045] The first position detection device detects multiple first coordinate values ​​in the first direction when the processing platform is located at the processing position, and the multiple first coordinate values ​​are used to determine the first deviation;

[0046] The second position detection device is used to detect the second coordinate value of the processing platform in the second direction when the processing platform is located in the processing position, and multiple second coordinate values ​​are used to determine the first deviation.

[0047] In some implementations, the first position detection device is configured as at least one of an optical scale, a magnetic scale, and an encoder;

[0048] The second position detection device is configured as at least one of an optical grating ruler, a magnetic grating ruler, and an encoder.

[0049] In some implementations, the laser processing apparatus is configured to include a beam scanning assembly, which includes at least one of a galvanometer, a rotating mirror, a galvanometer scanner, and an AOD for controlling the deflection direction of the laser beam.

[0050] Adjusting the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position includes: adjusting the position of the deflection range of the beam scanning component so that the position of the preset scanning range of the laser processing device is aligned with the actual scanning range.

[0051] This application provides a laser processing device, which is the laser processing device in the laser processing position correction method described in any of the above implementations; or, the laser processing device is used to perform the laser processing position correction method described in any of the above implementations.

[0052] The main advantages of the laser processing position correction method and laser processing equipment provided in this application are:

[0053] This application uses a moving processing platform to align the area to be processed with the preset scanning range of the laser processing device. First, it acquires the position information of the processing platform and calculates the processing position deviation of the area to be processed to identify positioning deviations caused by unstable movement or accumulated errors of the processing platform. Then, it dynamically adjusts the scanning range of the laser processing device to compensate for the processing position deviation, ensuring that the laser beam or laser pulse emitted by the laser processing device is always aligned with the area to be processed, thereby improving the processing accuracy of the workpiece. Furthermore, compared with related technologies, this application's method of dynamically adjusting the laser processing device to compensate for processing position deviations caused by the moving processing platform is relatively simple. This improves response speed and adjustment accuracy, reduces processing costs, and avoids the time-consuming operation of frequently adjusting the processing platform position using servo motors, thus improving processing efficiency. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1 This is a schematic flowchart of the laser processing position correction method provided in the embodiments of this application;

[0056] Figure 2 This is a schematic diagram of the logic flow of the laser processing position correction method provided in the embodiments of this application;

[0057] Figure 3 This is a perspective view of a partial structure of the laser processing equipment provided in the embodiments of this application;

[0058] Figure 4 This is a simplified structural diagram of the base and processing platform in cooperation as provided in the embodiments of this application;

[0059] Figure 5 This is a schematic diagram of the structure of the processing platform when it is deflected relative to the second direction in an embodiment of this application;

[0060] Figure 6 This is a schematic diagram of the structure of the processing platform when it is deflected relative to the first direction in an embodiment of this application;

[0061] Figure 7 This is a schematic diagram of the structure when the workpiece is positioned on the processing platform according to an embodiment of this application;

[0062] Figure 8 This is a structural diagram illustrating the positional relationship between the preset processing positions and the actual processing positions of multiple areas to be processed in a workpiece provided in this application embodiment;

[0063] Figure 9 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application;

[0064] Figure 10 yes Figure 9 A magnified schematic diagram of the local structure at point E;

[0065] Figure 11 This is a front view of the laser processing equipment provided in the embodiments of this application;

[0066] Figure 12 yes Figure 11 A magnified schematic diagram of the local structure at point F;

[0067] Figure 13 yes Figure 11A magnified schematic diagram of the local structure at point G;

[0068] Figure 14 This is a right view of the laser processing equipment provided in the embodiments of this application;

[0069] Figure 15 yes Figure 14 A magnified schematic diagram of the local structure at point H;

[0070] Figure 16 yes Figure 14 A magnified schematic diagram of the local structure at point J;

[0071] Figure 17 This is a top view of the laser processing equipment provided in the embodiments of this application.

[0072] Explanation of key figure labels:

[0073] 101. Base; 102. Machining platform; 103. First grating ruler; 1031. First reading head; 1032. First scale grating; 106. Second grating ruler; 1061. Second reading head; 1062. Second scale grating; 109. Third grating ruler; 1091. Third reading head; 1092. Third scale grating; 112. Fourth grating ruler; 1121. Fourth reading head; 1122. Fourth scale grating; 115. Laser processing device; 116. Beam scanning assembly; 117. Scanning area; 119. First linear guide rail; 120. Second linear guide rail; 121. Machine tool;

[0074] 200. Workpiece; 201. Area to be processed. Detailed Implementation

[0075] In related technologies, a single optical grating ruler or other position detection element is combined with a servo motor in each direction of motion of the motion platform to achieve positioning and control of the platform. However, with the increasing demands for machining accuracy and speed, the platform control scheme combining a single optical grating ruler and a servo motor has certain limitations in terms of cumulative error control.

[0076] Therefore, this application provides a laser processing position correction method and a laser processing device to solve the problems in the related technology.

[0077] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0078] Combination Figures 1 to 3As shown in the embodiments of this application, the laser processing position correction method may include at least some or all of the following steps.

[0079] Step S100: Select any processing area 201 on the workpiece 200, and move the processing platform 102 so that the processing area corresponds to the preset scanning range of the laser processing device. The workpiece 200 can have one or more processing areas 201. When there are multiple processing areas 201, they need to be sorted to facilitate processing each area individually. Alternatively, one or more areas can be selected for processing. After selecting the processing area 201, the movement of the processing platform 102 is controlled to move it to the processing position, thus moving the processing area within the preset scanning range of the laser processing device. It is understood that moving the processing platform 102 to correspond the processing area to the preset range of the laser processing device can include moving only the position of the processing platform 102, or moving both the processing platform 102 and the laser processing device. When the mobile processing platform 102 aligns the area to be processed with the preset scanning range of the laser processing device, the position of the area to be processed on the workpiece 200 is the actual processing position, which may deviate from the preset processing position of the area to be processed.

[0080] Step S200: Obtain the position information of the processing platform 102, and determine the processing position deviation of the area to be processed 201 based on the position information. The processing position deviation is the deviation of the actual processing position of the area to be processed 201 relative to the preset processing position. It can be understood that, ideally, the actual processing position of the area to be processed has no deviation from the preset processing position, and the processing area corresponds perfectly to the preset scanning range of the laser processing device. However, due to the unavoidable positional deviation between the actual processing position of the area to be processed and the preset processing position during the movement of the processing platform 102, a deviation exists between the actual processing position of the area to be processed and the preset scanning range of the laser processing device. Obtaining the position information of the processing platform 102 can be done when the area to be processed of the workpiece 200 is in the actual processing position, by obtaining the position information corresponding to the processing platform 102 where the workpiece 200 is located (in conjunction with...). Figure 7 and Figure 9 (As shown).

[0081] Workpiece 200 is a substrate that requires processing using a laser beam or laser pulse. Workpiece 200 can be a circuit board, which can be a printed circuit board (PCB), flexible printed circuit board (FPC), rigid-flex board, high-density interconnect (HDI), integrated circuit substrate, metal substrate, glass substrate, ceramic substrate, etc. Furthermore, depending on its function and structure, circuit boards can be divided into single-layer circuit boards and multi-layer circuit structures. The processing area 201 is the area on workpiece 200 that requires laser processing (such as drilling, cutting, marking, welding, etc.).

[0082] The workpiece 200 is fixed on the processing platform 102, allowing it to move synchronously with the platform. When the platform is in the processing position, the area 201 to be processed on the workpiece 200 moves to the area that the beam scanning component 116 of the laser processing device 115 can scan, thus enabling the laser processing device 115 to process the area 201. Since the workpiece is fixed on the processing platform, the relative positional relationship between them remains unchanged. Therefore, the positional deviation of the processing area 201 on the workpiece can be obtained by acquiring the positional deviation of the processing platform. Furthermore, since the position of the processing platform 102 may deviate each time it moves to a new processing position, causing the actual processing position of the area 201 to be processed on the workpiece 200 to deviate from the preset processing position, it is necessary to calibrate the correspondence between the laser processing device 115 and the area 201 to be processed on the workpiece 200 before processing the area 201, in order to improve the processing accuracy. Step S100, obtaining position information, is preparation for this calibration.

[0083] Step S300: Based on the processing position deviation, adjust the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position. This ensures that the laser beam or laser pulse emitted by the laser processing device 115 is always aligned with the processing area 201. This method of correcting the position of the scanning range of the laser processing device 115 significantly improves the accuracy of the processing trajectory and enhances the efficiency and precision of laser processing position correction. For example, adjusting the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position can be achieved by adjusting the scanning position of the beam scanning component 116 of the laser processing device 115, thereby compensating for the processing position deviation. The high-speed and high-precision response of the beam scanning component 116 allows for rapid deviation compensation, shortening calibration time, improving processing efficiency, and reducing reliance on high-precision mechanical structures (servo motors) mounted on the processing platform. The beam scanning component 116 is a key component in the laser processing apparatus 115 used to control the emission direction of the laser beam or laser pulse toward the workpiece 200. It can quickly adjust the processing position of the laser beam or laser pulse on the workpiece 200 and precisely control the scanning path of the laser beam or laser pulse in two-dimensional or three-dimensional space. Its response speed is usually in the range of microseconds to milliseconds. Therefore, after a processing position deviation occurs in the processing area 201, the position and deflection angle of the scanning range of the beam scanning component 116 can be finely adjusted. For example, the position or deflection angle of the optical devices (such as lenses, mirrors, etc.) that make up the beam scanning component 116 can be adjusted so that the actual scanning range of the laser processing apparatus corresponds to the actual processing position of the processing area, thereby compensating for the processing position deviation.

[0084] The laser processing position correction method provided in this application first obtains the position information of the processing platform 102 and calculates the processing position deviation of the processing area 201 when processing the area to be processed, so as to identify the positioning deviation caused by the instability of the movement of the processing platform 102 or the cumulative error. Then, the laser processing device 115 is dynamically adjusted to compensate for the processing position deviation, so as to ensure that the laser beam or laser pulse emitted by the laser processing device 115 is always aligned with the processing area 201, thereby improving the processing accuracy of the workpiece 200. In addition, compared with related technologies, the adjustment method of dynamically adjusting the scanning range of the laser processing device 115 to compensate for the processing position deviation is relatively simple. This can improve the response speed and adjustment accuracy, and is conducive to reducing processing costs. It also avoids the time-consuming operation of frequently adjusting the position of the processing platform using servo motors for processing position correction, thereby improving processing efficiency.

[0085] In some embodiments, during step S100, when the processing platform 102 moves, a deviation occurs between the actual processing position and the preset processing position of the processing platform 102. This causes a deviation in the position of the workpiece 200, which in turn causes a deviation between the actual processing position and the preset processing position of the area to be processed 201. Therefore, after step S100, step S200 is executed. Based on the position information after each movement of the processing platform 102, the processing position deviation of the area to be processed 201 can be calculated. This allows for targeted compensation of the deviation, avoiding the processing trajectory deviation caused by error accumulation in related technologies. The preset processing position of the area to be processed 201 can refer to the theoretical position of the area to be processed 201 when the processing platform 102 has not experienced a positional deviation. The actual processing position of the area to be processed 201 can refer to the actual position of the area to be processed 201 after the processing platform 102 experiences a positional deviation during actual movement due to factors such as mechanical errors, vibration, thermal deformation, or accumulated errors. The processing position deviation can be represented by distance and / or angle in a two-dimensional or three-dimensional coordinate system.

[0086] In some embodiments, in step S100, moving the processing platform 102 to align the processing area 201 with the preset scanning range of the laser processing device 115 includes driving the processing platform 102 to move along a first direction and / or a second direction to align the processing area 201 with the preset scanning range of the laser processing device 115. For example, the processing platform 102 can move along two directions, which can be the first direction and the second direction. The processing platform 102 can move only along the first direction without displacement in the second direction; the processing platform 102 can also move only along the second direction without displacement in the first direction. The processing platform 102 can also move along both the first and second directions, thus generating displacement in both directions. For ease of description, in this embodiment, the first direction is defined as the Y-axis direction (YY direction), and the second direction is defined as the X-axis direction (XX direction). The first and second directions are not parallel; for example, they are perpendicular.

[0087] In some embodiments, in step S200, the processing position deviation includes at least one of a first deviation caused by the movement of the processing platform 102 along a first direction and a second deviation caused by the movement of the processing platform 102 along a second direction. This deviation causes a processing position deviation in the area to be processed 201. Therefore, by obtaining this deviation, a compensation basis can be provided for step S300, which is beneficial to improving processing accuracy and correction efficiency.

[0088] In some embodiments, the laser processing position correction method further includes:

[0089] Step S400: The laser processing device 115 processes the area 201 to be processed. After executing S300, that is, after adjusting the scanning position of the beam scanning component 116 of the laser processing device 115 to compensate for the processing position deviation, the laser processing device 115 can emit a laser beam or laser pulse to process the area 201 to be processed, thereby achieving at least one of high-precision drilling, cutting, marking or welding.

[0090] See Figure 2 As shown, in some embodiments, the laser processing position correction method further includes: after the laser processing device 115 has finished processing an area 201 to be processed, moving the processing platform 102 to another processing position, re-acquiring position information to determine the processing position deviation, and adjusting the position of the actual scanning range of the laser processing device to compensate for the processing position deviation.

[0091] For example, when processing the area 201 to be processed on the workpiece 200, the area 201 to be processed is first selected, and then the processing platform 102 is moved to the processing position. It is determined whether the processing platform 102 moves along the first direction. When the processing platform 102 moves along the first direction, the first deviation of the processing platform 102 is calculated. Then it is determined whether the processing platform 102 moves along the second direction. When the processing platform 102 moves along the second direction, the second deviation of the processing platform 102 is calculated. Based on the processing position deviation of the area 201 to be processed, the compensation amount of the beam scanning component 116 is calculated and processed by the beam scanning component 116. The compensation amount adjusts the scanning position and / or angle of the beam scanning component 116 so that its scanning area 117 corresponds to the area to be processed 201. After the scanning area 117 corresponds to the area to be processed 201, the laser processing device 115 performs laser processing on the area to be processed 201. After the laser processing device 115 finishes laser processing the area to be processed 201, it also needs to determine whether the workpiece 200 has been processed based on the processing information. If it is determined that the workpiece 200 has not been processed, then the above steps S100 to S500 are repeated. The laser processing device 115 ends processing after the determination line indicates that the workpiece 200 has been processed. Since the processing position deviation is compensated by the beam scanning component 116 before laser processing each area to be processed 201, the processing accuracy can be ensured. When selecting the processing area 201, it can be done manually one by one, or all the processing areas 201 can be sorted before processing begins, and then the processing order can be provided to the controller of the laser processing equipment. After processing one processing area is completed, the controller will automatically select another processing area.

[0092] In some embodiments, the position information includes at least one of first sub-information and second sub-information; the first sub-information includes multiple first coordinate values ​​of the processing platform 102 located at the processing position in a first direction; the second sub-information includes multiple second coordinate values ​​of the processing platform 102 located at the processing position in a second direction. A method for obtaining multiple first coordinate values ​​includes: obtaining multiple first coordinate values ​​by means of multiple first position detection devices disposed in the first direction, wherein each first position detection device obtains one first coordinate value; a method for obtaining multiple second coordinate values ​​includes: obtaining multiple second coordinate values ​​by means of multiple second position detection devices disposed in the second direction, wherein each second position detection device obtains one second coordinate value. For the processing platform 102, when it is located at the processing position, the multiple first coordinate values ​​obtained by measurement may be the same or different; similarly, the multiple second coordinate values ​​obtained by measurement may be the same or different. For example, the first coordinate value is the Y-axis coordinate, and the second coordinate value is the X-axis coordinate; the number of first position detection devices is two, and the number of second position detection devices is two. Two first position detection devices are symmetrically arranged about an axis of symmetry parallel to a first direction, meaning the line connecting the two first detection devices is parallel to a second direction. This allows the two first position detection devices to detect the actual machining position of the machining platform 102 in the first direction. Similarly, two second position detection devices are symmetrically arranged about an axis of symmetry parallel to a second direction, meaning the line connecting the two second detection devices is parallel to the first direction. Likewise, the two second position detection devices can detect the actual machining position of the machining platform 102 in the second direction. Since there are two first position detection devices and two second position detection devices, there are two first coordinate values ​​and two second coordinate values.

[0093] In this embodiment, whether the processing platform 102 has deflected relative to the second direction can be determined by comparing two first coordinate values. If the two first coordinate values ​​are the same, the processing platform 102 has not deflected relative to the second direction. If the two first coordinate values ​​are different, the processing platform 102 has deflected relative to the second direction. When calculating the deflection angle of the processing platform 102 relative to the second direction, one of the first detection devices can be used as the reference point, and the other first detection device can be used as the deflection point. Since the processing platform 102 has deflected relative to the second direction, the processing area 201 on the workpiece 200 has also deflected relative to the second direction.

[0094] In this embodiment, whether the processing platform 102 has deflected relative to the first direction can be determined by comparing two second coordinate values. If the two second coordinate values ​​are the same, the processing platform 102 has not deflected relative to the first direction. If the two second coordinate values ​​are different, the processing platform 102 has deflected relative to the first direction. When calculating the deflection angle of the processing platform 102 relative to the first direction, one of the second detection devices can be used as the reference point, and the other second detection device can be used as the deflection point. Since the processing platform 102 has deflected relative to the first direction, the processing area 201 on the workpiece 200 has also deflected relative to the first direction.

[0095] It should be noted that, in the initial state, the two first coordinate values ​​detected by the two first position detection devices are the same, but due to the movement of the processing platform 102, the two first coordinate values ​​may be different; similarly, in the initial state, the two second coordinate values ​​detected by the two second position detection devices are the same, but due to the movement of the processing platform 102, the two second coordinate values ​​may be different.

[0096] In some embodiments, the first position detection device includes at least one of an optical encoder, a magnetic encoder, and an encoder; the second position detection device includes at least one of an optical encoder, a magnetic encoder, and an encoder. The optical encoder can achieve nanometer-level resolution, the magnetic encoder is suitable for complex environments, and the encoder provides reliable incremental or absolute position feedback. Thus, high-precision measurement ensures that the position error of the processing platform 102 is extremely small, thereby supporting high-precision processing requirements for micrometer-level apertures and linewidths / spacings. Exemplarily, both the first and second position detection devices are optical encoders.

[0097] It should be noted that in some other possible embodiments, the position detection device (first position detection device, second position detection device) may include only a magnetic scale, or only an encoder, or include both an optical scale and a magnetic scale, or both an optical scale and an encoder, or both a magnetic scale and an encoder, or simultaneously an optical scale, a magnetic scale, and an encoder. When (first position detection device, second position detection device) includes two or more of the following: an optical scale, a magnetic scale, and an encoder, this facilitates cross-verification of position information and improves positioning accuracy.

[0098] In some embodiments, the processing position deviation includes at least one of a first deviation and a second deviation; the first deviation includes a first deflection angle and a first offset distance, wherein the first deflection angle is the deflection angle of the processing area 201 relative to a second direction, and the first offset distance is the offset distance of the processing area 201 caused by the first deflection angle, wherein the first deviation is obtained through multiple first coordinate values; the second deviation includes a second deflection angle and a second offset distance, wherein the second deflection angle is the deflection angle of the processing area 201 relative to a first direction, and the second offset distance is the offset distance of the processing area 201 caused by the second deflection angle, wherein the second deviation is obtained through multiple second coordinate values. The offset distance can be calculated using an arc length formula, wherein the angle in the arc length formula is the deflection angle, and the radius is the distance between the center of the processing area 201 and the deflection center (i.e., the reference point). For example, the first offset distance can be the offset distance of the geometric center of the processing area 201 caused by the first deflection angle; the second offset distance can be the offset distance of the geometric center of the processing area 201 caused by the second deflection angle.

[0099] In some embodiments, a first positioning point and a second positioning point for detecting the position of the machining platform 102 are provided along the second direction (X-axis direction); a third positioning point and a fourth positioning point are provided along the first direction (Y-axis direction), and the third positioning point and the fourth positioning point are respectively fixed relative to the machining platform 102.

[0100] First deflection angle The following conditions must be met:

[0101] ;

[0102] First offset distance The following conditions must be met:

[0103] ;

[0104] in, This is the absolute value of the deviation between the theoretical and actual values ​​of the first coordinates of the second positioning point. This is the distance between the first positioning point and the second positioning point. The distance between the positioning center of the area to be processed and the first positioning point;

[0105] Second deflection angle The following conditions must be met:

[0106] ;

[0107] Second offset distance The following conditions must be met:

[0108] ;

[0109] in, This is the absolute value of the deviation between the theoretical and actual values ​​of the second coordinates of the fourth positioning point. This is the distance between the third and fourth positioning points. This is the distance between the positioning center of the area to be processed and the third positioning point. It should be noted that the area to be processed can be a rectangular area, and its positioning center is the center of that rectangular area.

[0110] In some embodiments, in step S300, the method of adjusting the preset scanning range of the laser processing device to the actual scanning range corresponding to the actual processing position according to the processing position deviation includes: displacement correction and angle correction, wherein the displacement correction includes: adjusting the positioning center of the preset scanning range to a circle centered on a first positioning point. Move the first offset distance on a circle with radius . And / or, the positioning center of the preset scanning range is located with the third positioning point as the center. Move a second offset distance on a circle with a radius of 1. Angle correction includes: deflecting the preset scanning range around its own central axis by a first deflection angle. and / or deflect the second deflection angle In this way, after determining the processing deviation, the preset scanning range can be adjusted to the actual scanning range corresponding to the actual processing position using the beam scanning component, thereby quickly achieving correction of the laser processing position. For example, the beam scanning component may include two central axes, an X-axis and a Y-axis, allowing a second deflection angle to be achieved around the X-axis and / or Y-axis. and / or the first deflection angle .

[0111] In some embodiments, the processing platform 102 is slidably disposed on the base 101, which is movable along a first direction. The processing platform 102 moves along a second direction on the base 101. Since the processing platform 102 is located on the base 101, when the base 101 moves along the first direction, the processing platform 102 can also move along the first direction, thus enabling the processing platform 102 to move along the first and / or second directions. A first position detection device can be used to detect the actual position of the base 101 in the first direction. When the base 101 deflects relative to the second direction, the processing platform 102 deflects relative to the second direction. The actual position of the base 101 in the first direction is the actual position of the processing platform 102 in the first direction. A second detection device is used to detect the actual position of the processing platform 102 in the second direction. For example, when the first position detection device is a grating ruler, to facilitate the distinction between the reading heads of the two first position detection devices respectively located at the first positioning point and the second positioning point, i.e., the reading heads of the grating ruler, the reading heads of the two first position detection devices are defined as the first reading head 1031 and the second reading head 1061, respectively. The position of the first positioning point is the position of the first reading head 1031, and the position of the second positioning point is the position of the second reading head 1061. When the second position detection device is a grating ruler, to facilitate the distinction between the reading heads of the two second position detection devices respectively located at the third positioning point and the fourth positioning point, i.e., the reading heads of the grating ruler, the reading heads of the two second position detection devices are defined as the third reading head 1091 and the fourth reading head 1121, respectively; the third positioning point is the third reading head 1091; and the fourth positioning point is the fourth reading head 1121. The first reading head 1031 and the second reading head 1061 are fixed to the base 101; the third reading head 1091 and the fourth reading head 1121 are fixed to the processing platform 102, so that the first positioning point and the second positioning point are located on the base 101, while the third positioning point and the fourth positioning point are located on the processing platform 102. Two first position detection devices are symmetrically arranged about an axis of symmetry parallel to a first direction, i.e., the first reading head 1031 and the second reading head 1061 are symmetrically arranged about an axis of symmetry parallel to a first direction. For example, the first position detection device can be located below the base 101. When the first position detection device is a grating ruler, the first scale grating 1032 and the second scale grating 1062 are respectively fixed on the guide rails of the corresponding first linear slide rail 119. Two second position detection devices are symmetrically arranged about an axis of symmetry parallel to a second direction, i.e., the third reading head 1091 and the fourth reading head 1121 are symmetrically arranged about an axis of symmetry parallel to a second direction. For example, the second position detection device can be located below the processing platform 102. When the second position detection device is a grating ruler, the third scale grating 1092 and the fourth scale grating 1122 are respectively fixed on the guide rails of the corresponding second linear slide rail 120.The first reading head 1031 and the second reading head 1061 can be located at the midpoint of the length of the base 101 in the first direction, and the line connecting the first reading head 1031 and the second reading head 1061 is the center line of the base 101 parallel to the second direction; the third reading head 1091 and the fourth reading head 1121 can be located at the midpoint of the length of the processing platform 102 in the second direction, and the line connecting the third reading head 1091 and the fourth reading head 1121 is the center line of the base 101 parallel to the first direction.

[0112] The following is combined with Figures 4 to 5 The calculation formulas for the first deflection angle and the first offset distance in the embodiments of this application are illustrated in detail with examples.

[0113] Combination Figure 4 and Figure 5 As shown, in some embodiments, when the processing platform 102 moves only in the first direction, the processing platform 102 and the base 101 remain relatively stationary, while the base 101 moves in the first direction; the processing position deviation only includes the first deviation. When the processing platform 102 moves to a processing position, the first reading head 1031 is used as the reference point, and the position of the first reading head 1031 is taken as the point. The second reading head 1061 is the deflection point; the first reading head 1031 can detect one first coordinate value, and the second reading head 1061 can detect another first coordinate value. When the two first coordinate values ​​are not equal, it indicates that the base 101 is deflected around the point. The deflection relative to the second direction also causes the machining platform 102 on the base 101 to deflect relative to the second direction. Since the workpiece 200 is located on the machining platform 102, the workpiece 200 also deflects relative to the second direction.

[0114] Combination Figure 4 and Figure 5 As shown, the first coordinate value detected by the first reading head 1031 is the point. The coordinate values ​​in the first direction; the theoretical position of the second reading head 1061 is point [missing information]. , i.e., point The theoretical position of the second positioning point, point With point The line connecting the two points is parallel to the second direction, and the actual position of the second reading head 1061 is point 1. ,point The actual location of the second positioning point; the first coordinate value detected by the second reading head 1061 is the point. The coordinate values ​​in the first direction. The theoretical position of the second reading head 1061 is the position of the machining platform 102 when no deflection occurs, while the actual position of the second reading head 1061 is the position of the machining platform 102 when deflection occurs. The theoretical position of the second reading head 1061, i.e., point... The coordinate value in the first direction is the first coordinate value detected by the first reading head 1031.

[0115] Combination Figure 4 and Figure 5 As shown, when the processing platform 102 deflects, the positions of the second reading head 1061, the third reading head 1091, and the fourth reading head 1121 are indicated by points. The circle is centered, and a deflection occurs. The theoretical position of the third reading head 1091 is point [missing information]. The actual position of the third reading head 1091 is point . The theoretical position of the fourth reading head 1121 is point 1. The actual position of the fourth reading head 1121 is point With points and points Distance between With radius, point Draw a circle with the center as the point; and points In the circle Up; due to the deflection angle (i.e. The value is relatively small, therefore the point is... and points The distance between them can be approximated by the point. and points The arc length of the arc between; and the point and points Distance between The absolute value of the difference between the first coordinate value detected by the second reading head 1061 and the first coordinate value detected by the first reading head 1031 can be used to obtain the absolute value of the deviation between the theoretical and actual values ​​of the first coordinate value of the second positioning point. and points The center of the circle corresponding to the arc between them is also a point. According to the definition of rotation, and equal, That is, the first deflection angle. Due to the point and points Distance between The value is known, and the distance between the first reading head 1031 and the second reading head 1061 is... Since the value is a known fixed value, the first deflection angle can be obtained according to the arc length formula. The following conditions must be met: Then, the point can be obtained using the arc length formula. With point Distance between The following conditions must be met:

[0116] ;

[0117] This allows us to obtain the offset distance of the third reading head 1091 caused by the first deflection angle. Since the workpiece 200 is on the machining platform 102, the workpiece 200 also deflects, and the deflection angle of the workpiece 200 relative to the second direction is also the first deflection angle. This yields the deflection angle of each processing area 201 relative to the second direction, i.e., the first deflection angle. The calculation formula is as follows: Since the distance relationship between the geometric center of each processing area 201 and the third reading head 1091, which serves as the reference point, is determined, the coordinates of the geometric center (i.e., the positioning center) of each processing area 201 can be determined. Furthermore, based on the deflection angle of each processing area 201 relative to the second direction, i.e., the first deflection angle... Then, the first offset distance corresponding to each processing area 201 can be obtained.

[0118] It should be noted that in some other possible embodiments, since the distance relationship between the geometric center (i.e., the positioning center) of each processing area 201 and the third reading head 1091, which serves as a reference point, is determined, the coordinates of the geometric center of each processing area 201 can be determined. Combined with the distance formula, the coordinates of the geometric center and the reference point of each processing area 201 can then be obtained. Distance between Thus, the first offset distance corresponding to each processing area 201 can be obtained by using the formulas for the first deflection angle and arc length.

[0119] The following is combined with Figure 4 and Figure 6 The calculation formulas for the second deflection angle and the second offset distance in the embodiments of this application are illustrated in detail with examples.

[0120] Combination Figure 4 and Figure 6 As shown, in some embodiments, when the machining platform 102 moves only in the second direction, the base 101 remains stationary, and the machining platform 102 moves on the base 101. The machining position deviation only includes the second deviation. When the machining platform 102 moves to a machining position, the position of the third reading head 1091 is taken as the reference point. The third reading head 1091 can detect one second coordinate value, and the fourth reading head 1121 can detect another second coordinate value. When the two second coordinates are not equal, it indicates that the processing platform 102 has deviated from the target point. Since workpiece 200 is located on machining platform 102, it also deflects relative to the first direction. The second coordinate value detected by the third reading head 1091 is the coordinate value of point A in the second direction, and the theoretical position of the fourth reading head 1121 is point A. , i.e., point The theoretical position of the fourth positioning point, point and The line connecting the two points is parallel to the first direction, and the actual position of the fourth reading head 1121 is point 1. , i.e., point The actual position of the fourth positioning point; the second coordinate value detected by the fourth reading head 1121 is the point. The coordinate values ​​in the second direction. The theoretical position of the fourth reading head 1121 is the position of the machining platform 102 when no deflection occurs, while the actual position of the fourth reading head 1121 is the position of the machining platform 102 when deflection occurs. The theoretical position of the fourth reading head 1121, i.e., point... The coordinate value in the second direction is the second coordinate value detected by the third reading head 1091. (Point) and points Distance between For known fixed values, with points and points Distance between With radius, point Draw a circle with the center as the center. ,point and points In the circle superior, That is, the second deflection angle. Because the deflection angle is small, point and points Distance between The absolute value of the difference between the second coordinate value detected by the third reading head 1091 and the second coordinate value detected by the fourth reading head 1121 can be used to obtain the absolute value of the deviation between the theoretical and actual values ​​of the second coordinate value of the fourth positioning point; since the deflection angle is small, the point... and points The distance between them can be approximated by the point. and points The arc length of the arc between the points and points The center of the circle corresponding to the arc between them is point . Therefore, according to the arc length formula, the second deflection angle can be obtained. The above conditions must be met: Since workpiece 200 is on machining platform 102, workpiece 200 also deflects, and the deflection angle of workpiece 200 relative to the first direction is also the second deflection angle. This yields the deflection angle of each processing area 201 relative to the first direction, i.e., the second deflection angle. The calculation formula is as follows. The distance relationship between the geometric center (i.e., the positioning center) of each processing area 201 and the reference point of the third reading head 1091 is determined. Thus, the second offset distance corresponding to each processing area 201 can be obtained through the formula of the second deflection angle and arc length. It can be understood that at the position of the third reading head 1091 (i.e., point...) When ) is the positioning center of a region to be processed, The value is 0 when the processing platform 102 moves only in the second direction. The second offset distance is also 0. It should be noted that the deflection angle calculated above in this embodiment is expressed in degrees.

[0121] Combination Figure 7 and Figure 8 As shown, for example, when the workpiece 200 is square, after the workpiece 200 is positioned on the processing platform 102, the distances between the two adjacent sides of the workpiece 200 and the position of the third reading head 1091 can be determined. The distance between the third reading head 1091 and the long side of the workpiece 200 is... The distance between the third reading head 1091 and the long side of the workpiece 200 is Thus, the position of each processing area 201 on the workpiece 200 is also determined. When the processing platform 102 moves only in the second direction and the base 101 remains stationary, if the processing platform 102 deflects by a second deflection angle relative to the second direction, and the processing platform 102 moves on the base 101, Therefore, the center of each processing area 201 on the workpiece 200 also needs to be correspondingly located at the position of the third reading head 1091. The center of the circle deflects, and the deflection angle is also the second deflection angle. Combining Figure 7 , Figure 9 and Figure 10 As shown, when the size of the processed pattern on the workpiece 200 is larger than the area of ​​the scanning area 117 of the beam scanning assembly 116, the beam scanning assembly 116 cannot cover the entire pattern in one scan. Therefore, the processed pattern is usually divided into several scanning sub-regions, and then processed one by one. Each scanning sub-region is an independent processing area 201 on the workpiece 200. Figure 7 and Figure 8 As shown, it illustrates seven areas 201 to be processed in workpiece 200, where points... ,point ,point ,point These represent the centers of the four processing areas 201, respectively. ,point ,point The positions of the third reading head 1091 (i.e., points) are respectively The distance is , , The offset distance of the center of each processing area 201 also varies with the point. The distance between them increases and increases accordingly, where point The offset distance is 0, point The offset distance can be determined by the second deflection angle. and Calculated. Point The offset distance can be determined by the second deflection angle. and The calculation is as follows. It should be noted that, in this embodiment of the application, the position of the third reading head 1091 (i.e., point...) () is the positioning center of a region to be processed.

[0122] When the machining platform 102 moves in both the first direction and the second direction (i.e., the base 101 moves in the first direction while the machining platform 102 moves on the base 101), the machining position deviation includes both the first deviation and the second deviation. The first deflection angle and the first offset distance in the first deviation can still be calculated using the above formula. The second deflection angle and the second offset distance in the second deviation can also be calculated using the above formula.

[0123] In one example, when the machining platform 102 moves in both the first direction and the second direction, taking the third reading head 1091 as an example, the first deflection angle of the third reading head 1091 caused by the deflection of the machining platform 102 relative to the second direction is calculated, i.e. and the first offset distance, i.e. Since the third reading head 1091 serves as the reference point when the machining platform 102 deflects relative to the first direction, the second deflection angle of the third reading head 1091 caused by the deflection of the machining platform 102 relative to the first direction is... This allows us to determine the total offset distance of the third reading head 1091 when the processing platform 102 moves in the first direction and the second direction. The total deflection angle of the third reading head 1091 is .

[0124] In another example, when the machining platform 102 moves in both the first direction and the second direction, taking the fourth reading head 1121 as an example, the first deflection angle of the fourth reading head 1121 caused by the deflection of the machining platform 102 relative to the second direction is first calculated, i.e. And the first offset distance. Then calculate the second deflection angle of the fourth reading head 1121 caused by the deflection of the processing platform 102 relative to the first direction, that is And the second offset distance; in this way, the actual position offset (deflection angle and offset distance) of the fourth reading head 1121 relative to the theoretical position can be determined when the processing platform 102 moves in the first direction and the second direction. As can be seen from the above example, when the processing platform 102 moves in both the first direction and the second direction, the movement of the processing platform can be decomposed. Then, the deflection of the processing platform relative to the first direction, which causes the deflection of the area to be processed, the first deflection angle and the first offset distance can be calculated. Then, the deflection of the processing platform relative to the second direction, which causes the deflection of the area to be processed, the second deflection angle and the second offset distance can be calculated.

[0125] It should be noted that in some other possible embodiments, when the processing platform 102 moves in both the first direction and the second direction, for each processing area 201, the second deviation can be calculated first, and then the first deviation can be calculated.

[0126] In some embodiments, for step S300, after reading data through the first reading head 1031, the second reading head 1061, the third reading head 1091, and the fourth reading head 1121, the first deviation and / or the second deviation are calculated according to the above formula. After calculating the adjustment amount of the beam scanning component 116, the scanning position of the beam scanning component 116 is adjusted to compensate for the processing position deviation. This design can ensure that the laser beam or laser pulse emitted by the laser processing device 115 is always aligned with the processing area 201 without adjusting the position of the processing platform 102, thereby improving the processing accuracy of the workpiece 200.

[0127] See Figure 9As shown in the illustration, this application provides a laser processing device, including: a processing platform 102, a moving device, a position detection component, a laser processing device 115, and a controller. The processing platform 102 is used to carry a workpiece; the moving device is used to drive the processing platform 102 to move so that the area to be processed of the workpiece corresponds to the preset scanning range of the laser processing device; the position detection component is used to acquire the position information of the processing platform 102; the controller is used to determine the processing position deviation of the area to be processed 201 based on the position information, the processing position deviation being the deviation between the actual processing position of the area to be processed 201 and the preset processing position; the controller is communicatively coupled to the position detection component and configured to acquire the processing position deviation, wherein the processing position deviation is calculated based on the position information. The controller is also communicatively coupled to the laser processing device 115 and configured to adjust the preset scanning range of the laser processing device 115 to the actual scanning range corresponding to the actual processing position based on the processing position deviation; the laser processing device 115 is configured to process the area to be processed 201 according to the actual scanning range. The above-described laser processing device has the same technical effects as the laser processing position correction method provided in the foregoing embodiments, and will not be repeated here.

[0128] In some embodiments, the controller may include: a central processing unit (CPU), a field programmable gate array (FPGA), a programmable logic array (PLA), a microcontroller unit (MCU), or other programmable logic devices; it should be noted that the processing position deviation of the processing area 201 can be calculated by the controller, or it can be calculated by other electronic components or electronic devices outside the controller.

[0129] Combination Figure 9 and Figure 17As shown, in some embodiments, the moving device includes a first moving mechanism and a second moving mechanism. The first moving mechanism is used to move the processing platform 102 along a first direction, and the second moving mechanism is used to move the processing platform 102 along a second direction; the first direction and the second direction are perpendicular to each other. For example, the laser processing equipment also includes a machine tool 121 and a base 101. The first moving mechanism includes a first linear slide rail 119, and the second moving mechanism includes a second linear slide rail 120. The processing platform 102 is slidably connected to the second linear slide rail 120. For example, a slider can be fixed to the bottom or side of the processing platform 102, and the slider can be slidably mounted on the second linear slide rail 120 to enable the processing platform 102 to move relative to the second linear slide rail 120. The base 101 is slidably connected to the first linear slide rail 119. For example, a slider can be fixed to the bottom or side of the base 101, and the slider can be slidably mounted on the first linear slide rail 119 to enable the base 101 to move relative to the first linear slide rail 119. The number of first linear guide rails 119 can be multiple, including two, three, or four. The number of second linear guide rails 120 can also be multiple, including two, three, or four. The guide rails of the multiple first linear guide rails 119 are arranged parallel to each other, and the guide rails of the multiple second linear guide rails 120 are also arranged parallel to each other. Both the first linear guide rails 119 and the second linear guide rails 120 can be electric linear guide rails. The controller is used to control the movement of the processing platform 102 along the first linear guide rails 119 and / or the second linear guide rails 120 according to processing requirements.

[0130] For ease of description, in the embodiments of this application, the first direction is defined as the YY direction; the second direction is defined as the XX direction.

[0131] In some embodiments, the position detection component includes a plurality of first position detection devices and a plurality of second position detection devices; the first position detection devices are used to detect a first coordinate value in a first direction when the processing platform 102 is located in the processing position; the second position detection devices are used to detect a second coordinate value in a second direction when the processing platform 102 is located in the processing position. The first position detection devices include at least one of an optical encoder, a magnetic encoder, and an encoder; the second position detection devices include at least one of an optical encoder, a magnetic encoder, and an encoder.

[0132] In some embodiments, the first position detection device and the second position detection device can be grating rulers. The length direction of the grating ruler in the first direction can be parallel to the length direction of the first linear slide rail 119, and multiple grating rulers in the first direction are spaced apart along the second direction; the length direction of the grating ruler in the second direction can be parallel to the length direction of the second linear slide rail 120, and multiple grating rulers in the second direction are spaced apart along the first direction. Thus, the laser processing position correction method in this embodiment uses gratings to replace the visual inspection system (such as a CCD vision system) in related technologies to quickly obtain the position deviation of the processing platform, thereby facilitating rapid calibration of the processing platform; and during the calibration process, the position of the processing platform does not need to be adjusted, thus eliminating the operational complexity caused by adjusting the processing platform.

[0133] Combination Figures 11 to 16 As shown, for example, two grating rulers are provided in the first direction, and two grating rulers are provided in the second direction. To facilitate the distinction between the grating rulers in the first direction and the grating rulers in the second direction, the two grating rulers in the first direction are defined as first grating ruler 103 and second grating ruler 106, and the two grating rulers in the second direction are defined as third grating ruler 109 and fourth grating ruler 112. The reading head and scale grating of the first grating ruler 103 are first reading head 1031 and first scale grating 1032, respectively; the reading head and scale grating of the second grating ruler 106 are second reading head 1061 and second scale grating 1062, respectively; the reading head and scale grating of the third grating ruler 109 are third reading head 1091 and third scale grating 1092, respectively; and the reading head and scale grating of the fourth grating ruler 112 are fourth reading head 1121 and fourth scale grating 1122, respectively. The first reading head 1031 and the second reading head 1061 are respectively fixed on the base 101, and the first scale grating 1032 and the second scale grating 1062 are respectively fixed on the machine tool 121; the third reading head 1091 and the fourth reading head 1121 are respectively fixed on the processing platform 102, and the third scale grating 1092 and the fourth scale grating 1122 are respectively fixed on the base 101.

[0134] In some embodiments, the laser processing apparatus 115 further includes a laser and a beam scanning assembly 116. The laser is used to emit a laser beam or laser pulse; the beam scanning assembly 116 is used to control the deflection and scanning trajectory of the laser beam or laser pulse, and the beam scanning assembly 116 includes at least one of a galvanometer, a galvanometer scanner, a rotating mirror, or an AOD (Alternating Distance Optimizer). A controller is also communicatively connected to the laser processing apparatus 115 to achieve processing control of the laser processing apparatus 115. The laser processing apparatus 115 can be mounted on the machine tool 121 via a moving mechanism, enabling the laser processing apparatus 115 to move along at least one of a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are mutually perpendicular. Movement of the laser processing apparatus 115 in the first direction and / or the second direction can be used to adjust the horizontal position of the scanning area of ​​the beam scanning assembly 116. Movement in the third direction can be used to achieve optimal focusing of the laser focal point on the surface of the workpiece, thereby changing the depth of focus or focal position of the laser processing apparatus. The moving mechanism may include a linear slide rail, with the laser processing apparatus located on the slider of the linear slide rail. The guide rail of the linear slide rail is fixed to a crossbeam or support above the machine tool 121, where the third direction is the ZZ direction. Exemplarily, the number of beam scanning assemblies can be one or more, and multiple beam scanning assemblies can be sequentially spaced along the second direction. The spacing between two adjacent beam scanning assemblies in the second direction can be a fixed or adjustable value. When compensating for processing position deviations by adjusting the scanning position of the beam scanning assembly 116 of the laser processing apparatus 115, the deflection angle of the lenses of the multiple beam scanning assemblies 116 is the same. In this way, multiple beam scanning components 116 can be responsible for scanning different areas, achieving continuous and seamless processing, improving processing efficiency, and meeting complex or parallel processing needs.

[0135] In summary, the laser processing position correction method and laser processing equipment provided in this application embodiment can detect the position information of the processing platform 102 through multiple first position detection devices and multiple second position detection devices, and determine the offset error of the processing platform 102 by calculation, thereby obtaining the processing position deviation of the processing area 201 to be processed. Then, the offset scanning of the beam scanning component 116 is used to compensate for the processing position deviation, thereby ensuring processing accuracy and improving processing efficiency.

[0136] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0137] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0138] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0139] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0140] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0141] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0142] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0143] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A laser processing position correction method characterized by, The method comprises: selecting any to-be-processed area on a workpiece, and moving a processing platform so that the to-be-processed area corresponds to a preset scanning range of a laser processing device, wherein the workpiece has a plurality of to-be-processed areas, and the moving of the processing platform comprises driving the processing platform to move in a first direction and / or a second direction, the second direction is provided with a first positioning point and a second positioning point for detecting the position of the processing platform, and the first direction is provided with a third positioning point and a fourth positioning point for detecting the position of the processing platform, the third positioning point and the fourth positioning point are respectively kept relatively fixed with the processing platform; obtaining position information of the processing platform, and determining a processing position deviation of the to-be-processed area according to the position information, wherein the processing position deviation is a deviation of an actual processing position of the to-be-processed area relative to a preset processing position, and the processing position deviation comprises at least one of a first deviation caused by the movement of the processing platform in the first direction and a second deviation caused by the movement of the processing platform in the second direction, the first deviation comprises a first deflection angle and a first offset distance, the first deflection angle is a deflection angle of the to-be-processed area relative to the second direction, and the first offset distance is an offset distance of the to-be-processed area caused by the first deflection angle, and the second deviation comprises a second deflection angle and a second offset distance, the second deflection angle is a deflection angle of the to-be-processed area relative to the first direction, and the second offset distance is an offset distance of the to-be-processed area caused by the second deflection angle; According to the machining position deviation, a preset scanning range of the laser machining device is adjusted to an actual scanning range corresponding to the actual machining position, which includes displacement correction and angle correction, wherein the displacement correction includes: moving a positioning center of the preset scanning range on a circumference with a first positioning point as a center, a first offset distance , and / or moving the positioning center of the preset scanning range on a circumference with a third positioning point as a center, a second offset distance , and the angle correction includes: deflecting the preset scanning range by the first deflection angle around a center axis of the preset scanning range and / or by the second deflection angle , is a distance between the positioning center of the region to be machined and the first positioning point, is a distance between the positioning center of the region to be machined and the third positioning point. The method further comprises: after the laser processing device completes processing of one to-be-processed area, moving the processing platform to another to-be-processed area, and re-obtaining the position information to determine the processing position deviation, and adjusting the position of the actual scanning range of the laser processing device to compensate for the processing position deviation.

2. The laser processing position correction method according to claim 1, wherein The position information comprises at least one of first sub-information and second sub-information; The first sub-information comprises a plurality of first coordinate values of the processing platform in the first direction; The second sub-information comprises a plurality of second coordinate values of the processing platform in the second direction; The first direction and the second direction are arranged non-parallelly.

3. The laser processing position correction method according to claim 2, wherein The first deviation is obtained through the plurality of first coordinate values; The second deviation is obtained through the plurality of second coordinate values.

4. The laser processing position correction method of claim 3, characterized in that: the first deflection angle satisfies the following conditions: ； The first offset distance satisfies the following condition: ； wherein is an absolute value of a deviation between a theoretical value and an actual value of a first coordinate value of the second positioning point, is a distance between the first positioning point and the second positioning point; the second deflection angle satisfies the following conditions: ； Second offset distance satisfies the following condition: ； wherein, is an absolute value of a deviation of a theoretical value from an actual value of a second coordinate value of the fourth positioning point, is a distance between the third positioning point and the fourth positioning point.

5. A laser processing position correction method characterized by, applied to a laser processing device, the laser processing device comprising a processing platform, a moving device, a position detection assembly, a laser processing device, and a controller; the processing platform is used to carry a workpiece; The moving device is configured to drive the machining platform to move along a first direction and / or a second direction so that the region to be machined of the workpiece corresponds to a preset scanning range of the laser machining device, wherein the region to be machined on the workpiece is multiple, and a first positioning point and a second positioning point for detecting the position of the machining platform are arranged along the second direction; a third positioning point and a fourth positioning point for detecting the position of the machining platform are arranged along the first direction, and the third positioning point and the fourth positioning point are respectively kept relatively fixed with the machining platform; The position detection assembly is configured to obtain the position information of the machining platform; The controller is communicatively coupled to the position detection assembly, and the controller is configured to obtain a machining position deviation, wherein the machining position deviation is calculated according to the position information, and the machining position deviation includes at least one of a first deviation caused by the movement of the machining platform along the first direction and a second deviation caused by the movement of the machining platform along the second direction, the first deviation includes a first deflection angle and a first offset distance, the first deflection angle is a deflection angle of the region to be machined relative to the second direction, and the first offset distance is an offset distance of the region to be machined caused by the first deflection angle, and the second deviation includes a second deflection angle and a second offset distance, the second deflection angle is a deflection angle of the region to be machined relative to the first direction, and the second offset distance is an offset distance of the region to be machined caused by the second deflection angle; The controller is also communicatively coupled to the laser processing device and configured to adjust a preset scanning range of the laser processing device to an actual scanning range corresponding to an actual processing position according to the processing position deviation, including: displacement correction and angle correction, wherein the displacement correction includes: moving a positioning center of the preset scanning range on a circumference with a first positioning point as a center, by a first offset distance , and / or moving the positioning center of the preset scanning range on a circumference with a third positioning point as a center, by a second offset distance ; the angle correction includes: deflecting the preset scanning range by the first deflection angle about a center axis of the preset scanning range and / or by the second deflection angle , , and / or the second deflection angle is a distance between the positioning center of the region to be processed and the third positioning point. The laser machining device is configured to machine the region to be machined according to the actual scanning range; After the laser machining device completes machining on one of the regions to be machined, the machining platform is moved to another of the regions to be machined, and the position information is re-obtained to determine the machining position deviation, and the position of the actual scanning range of the laser machining device is adjusted to compensate for the machining position deviation.

6. The laser machining position correction method of claim 5, wherein: The moving device includes a first moving mechanism and a second moving mechanism; The machining platform is driven to move along a first direction by the first moving mechanism and / or along a second direction by the second moving mechanism so that the region to be machined corresponds to a preset scanning range of the laser machining device, wherein the first direction is perpendicular to the second direction; The machining position deviation includes at least one of a first deviation caused by the movement of the machining device along the first direction and a second deviation caused by the movement of the machining platform along the second direction.

7. The laser machining position correction method of claim 6, wherein: The position detection assembly includes a plurality of first position detection devices and a plurality of second position detection devices; A plurality of first coordinate values of the machining platform in the first direction when located at the machining position are detected by the first position detection devices, and the plurality of first coordinate values are used to determine the first deviation. A second coordinate value in the second direction when the machining platform is located at the machining position is detected by the second position detection device, and a plurality of second coordinate values are used to determine a first deviation. 8.The laser machining position correction method of claim 7, wherein the first position detection device is at least one of a grating ruler, a magnetic grating ruler, and an encoder. The second position detection device is at least one of a grating ruler, a magnetic grating ruler, and an encoder. 9.The laser machining position correction method of claim 5, wherein the laser machining device is configured to include a beam scanning assembly, the beam scanning assembly including at least one of a galvanometer, a rotating mirror, a galvanometer scanner, and an AOD for controlling a deflection direction of a laser beam. The adjusting of the preset scanning range of the laser machining device to the actual scanning range corresponding to the actual machining position includes adjusting a position of a deflection range of the beam scanning assembly to make the position of the preset scanning range of the laser machining device to the actual scanning range. The laser machining device is the laser machining device in the laser machining position correction method of any one of claims 5-9; or, the laser machining device is used to execute the laser machining position correction method of any one of claims 1-4. ​ 10. A laser processing apparatus characterized by comprising: ​

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