Process cooling water system, temperature control method and equipment

Abstract

The invention relates to a process cooling water system and a temperature control method and equipment. By designing a heat exchange block, a water diversion block and a cooling block, the heat exchange block preheats input normal-temperature cooling water into second-temperature water by using first-temperature water flowing out of the water diversion block; the water diversion block enables the second temperature water to flow into target equipment and receives the first temperature water formed by heating; and the cooling block receives the first temperature water, cools a specified position in the target equipment, and returns the first temperature water to the water distribution block. The atomic layer deposition equipment comprises the cooling system, a reaction cavity and an upper cover plate, wherein a heating disc, a sealing element and a base are arranged in the cavity. The water diversion block is used for sequentially conveying second-temperature water obtained by preheating to the reaction cavity and the upper cover plate, and finally, the first-temperature water formed by heating is conveyed into the cooling block to cool the sealing element. By reconstructing a cooling water path and utilizing waste heat recovery and stepped heating, stable and accurate temperature control based on a low-power heating rod and normal-temperature cooling water is realized.

Description

Technical Field

[0001] This application relates primarily to the field of semiconductor process technology, and in particular to a process cooling water system, temperature control method, and equipment. Background Technology

[0002] Atomic layer deposition (ALD) is an extremely temperature-sensitive process, and its reaction is easily affected by ambient temperature. Therefore, the cavity and top cover plate need to maintain stable temperature control. Current technology typically uses a water heater to supply 75°C hot water into pre-designed channels in the cavity and top cover plate for temperature control. However, due to the limited structural space of the cavity and top cover plate, the internal channels cannot be designed with complex structures, resulting in uneven heating and significant temperature fluctuations. Furthermore, the water heater itself is costly. To address these issues, an alternative solution attempts to eliminate the water heater and instead use a "heating rod + ambient temperature cooling water" temperature control scheme. By rationally selecting the type and quantity of heating rods and distributing them evenly, combined with adjusting the flow rate of ambient temperature water, the solution optimizes cost and stability while ensuring effective temperature control.

[0003] However, this alternative solution still faces key technical challenges: On the one hand, the set temperature of the cavity and the top cover (75°C) is much higher than that of the ambient temperature cooling water (20°C). If ambient temperature cooling water is directly introduced, existing heating rods with a power of less than 1000W cannot quickly raise the temperature of the cavity and the top cover as a whole (especially the water inlet area) to the set value. Even if a high-power heating rod is used, it is necessary to maintain 100% power output for a long time, resulting in a low system safety margin. On the other hand, the working temperature of the machine heating plate exceeds 200°C, and the O-ring seal at its sealing point needs to be cooled and protected by water. After eliminating the hot water machine, introducing ambient temperature cooling water will significantly enhance the cooling effect of the center of the inner ring of the heating plate, thereby increasing the temperature difference between the inner and outer rings of the heating plate, which will ultimately have an adverse effect on the thickness and uniformity of the process film. Summary of the Invention

[0004] One objective of this application is to provide a process cooling water system, temperature control method, and equipment to solve the problems in the prior art where the heating rod power cannot quickly heat the cavity to the target temperature after adding room temperature cooling water, and the radial temperature difference of the heating plate increases.

[0005] According to one aspect of this application, a process cooling water system is provided, comprising:

[0006] A heat exchange block, a water distribution block, and a cooling block are provided, wherein the water distribution block is connected to the heat exchange block and the cooling block, respectively.

[0007] The heat exchange block is used to preheat the input cooling water with the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block.

[0008] The water distribution block is used to direct the water at the second temperature into the target device and to receive the cooling water heated to the first temperature by the target device.

[0009] The cooling block receives cooling water heated to a first temperature for cooling a designated location within the target device, and returns the cooling water at the first temperature to the water distribution block.

[0010] Optionally, the system further includes cooling water pipes for sequentially connecting the heat exchange block, the water distribution block, the target device, and the cooling block to form a series cooling water circuit.

[0011] Optionally, the target device has at least one heating rod, and the water distribution block is used to flow the second temperature water through the heating rod to heat it to the first temperature.

[0012] Optionally, the cooling water pipeline includes a heat exchange block pipeline, which includes a first pipeline and a second pipeline;

[0013] The first pipe is used to receive the input cooling water and output the water at the first temperature after heat exchange is completed.

[0014] The second pipe is used to deliver water at a second temperature to the water distribution block and to receive water at a first temperature flowing out of the water distribution block.

[0015] Optionally, the cooling water pipeline includes a water distribution block pipeline, and the water distribution block pipeline includes a third pipeline and a fourth pipeline;

[0016] The third pipe is used to deliver water at a second temperature to the target device and to receive water at a first temperature flowing out of the target device;

[0017] The fourth pipe is used to deliver water at the first temperature to the cooling block and to receive water at the first temperature flowing out of the cooling block.

[0018] Optionally, the fourth pipe includes a fourth outlet and a fourth inlet;

[0019] The water distribution block transmits water at the first temperature to the cooling block through the fourth water outlet;

[0020] The cooling block uses water at a first temperature to cool a designated location within the target device via internal cooling water pipes.

[0021] After cooling is complete, the water at the first temperature is introduced into the water distribution block through the fourth water inlet, and finally returned to the heat exchange block.

[0022] According to another aspect of this application, a method for controlling the temperature of process cooling water is provided, the method comprising:

[0023] The input cooling water is preheated using the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block;

[0024] The second temperature water flows into the target device, and the target device receives the cooling water heated to the first temperature;

[0025] Water at a first temperature is fed into the cooling block to cool a designated location within the target device, and the cooling water at the first temperature is returned to the water distribution block.

[0026] According to another aspect of this application, a computer-readable medium is also provided, on which a computer program is stored, which, when executed by a processor, implements the steps of the above-described method.

[0027] According to another aspect of this application, an atomic layer deposition apparatus is also provided, the apparatus comprising:

[0028] The reaction chamber, the top cover plate, and the process cooling water system as described in any of the above;

[0029] The reaction chamber includes a heating plate, a sealing element, and a base. The sealing element is located between the heating plate and the base and is used to seal the connection between the heating plate and the base.

[0030] The heat exchange block is used to preheat the input cooling water with the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block.

[0031] The water distribution block is used to allow water at the second temperature to flow into the reaction chamber and the upper cover plate, and to receive cooling water heated to the first temperature;

[0032] The cooling block receives cooling water heated to a first temperature for cooling the seal and returns the cooling water at the first temperature to the water distribution block.

[0033] Compared with existing technologies, this application reconstructs the cooling water circuit of the thermal atomic layer deposition equipment by introducing heat exchange blocks and water distribution blocks, and realizes stable and precise temperature control based on low-power heating rods and room temperature cooling water by utilizing waste heat recovery and cascade heating. Attached Figure Description

[0034] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings, wherein:

[0035] Figure 1A schematic diagram of a process cooling water system according to one aspect of this application is shown.

[0036] Figure 2 A schematic diagram of an atomic layer deposition apparatus according to yet another aspect of this application is shown.

[0037] Figure 3 This diagram shows a structural schematic of a heat exchange block in one embodiment of the present application;

[0038] Figure 4 This diagram shows a structural schematic of a water distribution block in one embodiment of the present application;

[0039] Figure 5 A flowchart illustrating a method for controlling the temperature of process cooling water according to another aspect of this application is shown.

[0040] The same or similar reference numerals in the accompanying drawings represent the same or similar parts. Detailed Implementation

[0041] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0042] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein, and therefore this application is not limited to the specific embodiments disclosed below.

[0043] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] Furthermore, the terms “up,” “down,” “left,” “right,” “top,” “bottom,” “horizontal,” and “vertical” used in the following description should be understood as the orientations shown in the paragraph and related figures. This relative terminology is for illustrative purposes only and does not imply that the described device must be manufactured or operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] It is understood that although terms such as “first,” “second,” “third,” etc., may be used here to describe various pipes, channels, components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers, and / or parts.

[0046] Figure 1 The diagram illustrates a process cooling water system according to one aspect of this application. The system includes a heat exchange block 10, a water distribution block 20, and a cooling block 30. The water distribution block 20 is connected to both the heat exchange block 10 and the cooling block 30. The heat exchange block 10 preheats incoming cooling water using water at a first temperature flowing from the water distribution block 20 to obtain water at a second temperature. The first temperature water flows from the cooling block 30 into the water distribution block 20. The water distribution block 20 directs the second temperature water into a target device 40 and receives cooling water heated to the first temperature by the target device 40. The cooling block 30 receives the heated cooling water and uses it to cool a designated location within the target device 40, and returns the first temperature cooling water to the water distribution block 20.

[0047] Among the first temperature water, the second temperature water, and the input cooling water, the input cooling water has the lowest temperature, such as ambient temperature cooling water (20°C); the second temperature water is water that has been preheated from the input cooling water, such as cooling water that has undergone heat exchange (45~50°C); and the first temperature water is the cooling water with the highest temperature, such as cooling water heated to 70~75°C by the target equipment 40. In this process cooling water system, the water distribution block 20 is connected to the heat exchange block 10 on one side and the cooling block 30 on the other side, and is also connected to the target equipment 40. It is responsible for receiving, distributing, and returning the water flow. On the one hand, the water distribution block 20 can use its own heat to compensate for the heat lost by the cooling water during transmission in the water pipes; on the other hand, it can increase the temperature of the inlet of the cooling block 30.

[0048] Specifically, the cooling water entering the heat exchange block 10 comes from the plant end, such as from the machine's water tank. The incoming cooling water flows into the heat exchange block 10, awaiting preheating. The water distribution block 20 sends high-temperature return water from the cooling block 30 into the heat exchange block 10, where heat exchange occurs. The incoming ambient temperature cooling water is initially heated, preheating to a second temperature. The water distribution block 20 receives the second temperature water output from the heat exchange block 10 and delivers it to the target device 40 for cooling and heat absorption. Simultaneously, the target device 40 further heats the second temperature water, raising its temperature to a first temperature. The water distribution block 20 receives the first temperature water from the target device and sends it to the cooling block 30. The cooling block 30 uses the first temperature water to cool a designated location (such as a specific cooling area) of the target device 40. After cooling, the first temperature water flows back to the water distribution block 20. The water distribution block 20 then returns the first temperature water, i.e., the high-temperature return water, to the heat exchange block 10 to preheat newly incoming ambient temperature cooling water, thus forming a cooling water recycling cycle.

[0049] In one embodiment of this application, the system further includes a cooling water pipe for sequentially connecting the heat exchange block 10, the water distribution block 20, the target device 40, and the cooling block 30 to form a series cooling water circuit.

[0050] The heat exchange block 10, the water distribution block 20, the target equipment 40, and the cooling block 30 are connected in sequence through cooling water pipes, so that cooling water flows and is transmitted in the pipes, forming a series cooling water loop to realize the recycling of cooling water.

[0051] In one embodiment of this application, the cooling water pipe includes a heat exchange block pipe, which includes a first pipe 501 and a second pipe 502; the first pipe 501 is used to receive the input cooling water and output water at a first temperature after heat exchange; the second pipe 502 is used to output water at a second temperature to the water distribution block 20 and receive the water at the first temperature flowing out of the water distribution block 20.

[0052] Continue to refer to Figure 1 The heat exchange pipeline includes a first pipeline 501 and a second pipeline 502. The first pipeline 501 receives input cooling water from the plant end (e.g., a machine water box). Within the heat exchange block 10, the input cooling water undergoes heat exchange using water at a first temperature, preheating it to water at a second temperature. The preheated water is then returned to the plant end via the first pipeline 501. The second pipeline 502 connects the heat exchange block 10 and the water distribution block 20, transmitting the second-temperature water output from the heat exchange block 10 into the water distribution block 20 for further distribution. Simultaneously, the second pipeline 502 also receives the first-temperature water flowing out of the water distribution block 20, which originates from the cooling block 30 and flows into the water distribution block 20.

[0053] In one embodiment of this application, the cooling water pipe 50 includes a water distribution block pipe, which includes a third pipe 503 and a fourth pipe 504; the third pipe 503 is used to transmit water at a second temperature to the target device 40 and receive water at a first temperature flowing out of the target device 40; the fourth pipe 504 is used to transmit water at a first temperature to the cooling block 30 and receive water at a first temperature flowing out of the cooling block 30.

[0054] Continue to refer to Figure 1 The water distribution block pipeline includes a third pipe 503 and a fourth pipe 504. The third pipe 503 connects the water distribution block 20 to the target device 40, distributing the second-temperature water in the water distribution block to the target device 40. The second-temperature water is heated to a first temperature in the target device 40, and the first-temperature water flows back to the water distribution block 20 through the third pipe 503. The fourth pipe 504 connects the water distribution block 20 to the cooling block 30, transferring the first-temperature water received from the target device from the water distribution block 20 to the cooling block 30 for cooling specific locations on the target device 40. The cooled first-temperature water then flows back to the water distribution block 20 through the fourth pipe 504.

[0055] Figure 2 The diagram illustrates a structural schematic of an atomic layer deposition apparatus according to another aspect of this application. The apparatus includes: a reaction chamber 401, an upper cover plate 402, and a process cooling water system. The reaction chamber 401 includes a heating plate 4011, a seal (not shown), and a base 4012. The seal is located between the heating plate 4011 and the base 4012 and is used to seal the connection between the heating plate 4011 and the base 4012. A heat exchange block 10 is used to preheat incoming cooling water using first-temperature water flowing from the water distribution block 20 to obtain second-temperature water, wherein the first-temperature water flows from the cooling block 30 into the water distribution block 20. The water distribution block 20 is used to allow the second-temperature water to flow into the reaction chamber 401 and the upper cover plate 402, and to receive the cooling water heated to the first temperature. The cooling block 30 receives the cooling water heated to the first temperature, uses it to cool the seal, and returns the first-temperature cooling water to the water distribution block 20.

[0056] exist Figure 2In the illustrated embodiment, the target device 40 is an atomic layer deposition (ALD) apparatus in semiconductor processing, including a reaction chamber 401 and a top cover 402. A heating plate 4011 is disposed within the reaction chamber 401, and a seal is located between the heating plate 4011 and the chamber base 4012. Within the ALD reaction chamber, the heating plate directly supports and heats the wafer at very high temperatures (e.g., >200°C). The heating plate is embedded in or mounted on the chamber base, and the connection between the two is sealed by a seal to maintain a high vacuum or high purity within the chamber. However, seals (e.g., O-rings) typically cannot withstand temperatures above 200°C for extended periods, rapidly aging, hardening, and losing elasticity, leading to vacuum leakage. The cooling block 30 receives water at a first temperature (e.g., 70~75°C) to cool the seal, removing heat through the cooling water and thus reducing the actual operating temperature of the seal to within its tolerable range.

[0057] In the process cooling water system of this atomic layer deposition equipment, heat exchange block 10 uses water at a first temperature to exchange heat with the input cooling water from the plant end (such as the machine water box), raising the temperature of the input cooling water to a second temperature. The water at the first temperature flows from cooling block 30 into water distribution block 20. The first pipe 501 of the heat exchange block pipeline also includes pipes 5011 and 5012. Figure 3 In the illustrated embodiment, interface P11 is connected to pipe 5011 for receiving input cooling water into heat exchange block 10; interface P12 is connected to pipe 5012 for transmitting the first-temperature water after heat exchange back to the plant terminal. The second pipe 502 of the heat exchange block also includes pipes 5021 and 5022, which are referred to further... Figure 3 Interface P21 is connected to pipe 5021 to receive water of the first temperature flowing out of water distribution block 20, so as to realize heat exchange inside the heat exchange block; interface P22 is connected to pipe 5022 to introduce preheated water of the second temperature into water distribution block 20.

[0058] Water distribution block 20 sequentially introduces water at the second temperature into the reaction chamber 401 and the upper cover plate 402. During this process, the water at the second temperature is heated to the first temperature and then reintroduced into water distribution block 20. Finally, water distribution block 20 introduces water at the first temperature into cooling block 30. Cooling block 30 uses the water at the first temperature to cool the seals and then returns the water at the first temperature to water distribution block 20 for recycling.

[0059] The third pipe 503 of the water distribution block pipe also includes pipe 5031 and pipe 5032, wherein pipe 5031 and pipe 5032 are each a pair of pipes, which are connected to the reaction chamber 401 and the upper cover plate 402 respectively.

[0060] exist Figure 4In the illustrated embodiment, interfaces P31a and P31b are connected to a pair of pipes of pipe 5031, and interfaces P32a and P32b are connected to a pair of pipes of pipe 5032, thereby allowing the second-temperature water flowing out of the water distribution block 20 to be sequentially introduced into the reaction chamber 401 and the upper cover plate 402. The second-temperature water is heated to a first temperature in the reaction chamber 401 and the upper cover plate 402, and then returned to the water distribution block via the third pipe 503. When the reaction chamber 401 consists of two or more separate reaction chambers, there can be two or more pairs of interfaces P31a and P31b, thereby enabling the transmission of cooling water between each individual reaction chamber.

[0061] In one embodiment of this application, the target device has at least one heating rod, and the water distribution block is used to flow the second temperature water through the heating rod to heat it to the first temperature.

[0062] Following the above embodiment, at least one heating rod is provided in the reaction chamber 401 and the upper cover plate 402. The heating rods can be evenly distributed to heat the second temperature water flowing through the heating rods to the first temperature. By setting different numbers and different powers of heating rods, different first temperature values ​​can be designed.

[0063] In one embodiment of this application, the fourth pipe 504 includes a fourth outlet 5041 and a fourth inlet 5042; the water distribution block 20 transmits water at the first temperature to the cooling block 30 through the fourth outlet 5041; the cooling block 30 uses the first temperature water to cool a designated location within the target device 40 through its internal cooling water pipes; after cooling is completed, the first temperature water is transmitted to the water distribution block 20 through the fourth inlet 5042, and finally returned to the heat exchange block 10.

[0064] Continue to refer to Figure 2 The fourth pipe 504 of the water distribution block 20 includes a fourth outlet 5041 and a fourth inlet 5042. The water distribution block 20 receives the first-temperature water flowing out from the upper cover plate 402 and transmits it to the cooling block 30 through the fourth outlet 5041. The cooling block 30 uses the first-temperature water to cool the seals (such as O-rings) located between the heating plate 4011 and the base 4012 through internal cooling water pipes, thereby reducing the actual operating temperature of the seals to within their tolerable range and extending their service life. The cooling block 30 then returns the cooled first-temperature water to the water distribution block 20 through the fourth inlet 5042, so that the water distribution block 20 can return the first-temperature water to the heat exchange block 10 for reuse of the heat from the first-temperature water.

[0065] Continue to refer to Figure 4The water distribution block 20 also includes interfaces P41a and P41b, which are connected to the fourth water outlet 5041 and the fourth water inlet 5042, respectively, so that cooling water can be transferred between the water distribution block 20 and the cooling block 30. When there are two or more cooling blocks 30, there can be two or more pairs of interfaces P41a and P41b, so as to realize the transfer of cooling water between each individual cooling block. Figure 4 The component between interface P41a and interface P41b can be a fixed mounting component used to fix the water distribution block 20 at a designated position in the atomic layer deposition equipment.

[0066] The water distribution block 20 also includes interfaces P21a and P21b, which are connected to pipes 5021 and 5022 respectively. That is, interface P21a of the water distribution block 20 and interface P21 of the heat exchange block 10 are two interfaces at both ends of pipe 5021, and interface P21b of the water distribution block 20 and interface P22 of the heat exchange block 10 are two interfaces at both ends of pipe 5022, thereby realizing the transmission of cooling water between the heat exchange block 10 and the water distribution block 20.

[0067] Figure 5 A flowchart illustrating a method for controlling the temperature of process cooling water according to another aspect of this application is shown. The method includes steps S11, S12, and S13. The method utilizes the process cooling water system described in the above embodiments. This system includes a heat exchange block, a water distribution block, and a cooling block, with the water distribution block connected to both the heat exchange block and the cooling block.

[0068] Step S11: The input cooling water is preheated using the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block.

[0069] The heat exchange block is designed after the cooling water inlet (e.g., the machine water box) and before the target equipment (e.g., the reaction chamber). The inlet and outlet water flows through this component, where heat exchange is achieved internally. The heated return water is used to heat the ambient temperature inlet water, allowing the ambient temperature water to rise to a range (45~50℃) that is easy to heat to the set temperature before entering the chamber and other areas. At this point, using a heating rod of about 1000W at the water inlet of the chamber and other areas can reach the set temperature with appropriate power output. Thus, the temperature of the water inlet of the chamber and other components is significantly increased under good safety margin. Moreover, when using a high-power heating rod, the temperature can reach the set temperature, and the output power of the heating rod is 50~80%.

[0070] Step S12: The second temperature water flows into the target device, and the cooling water heated to the first temperature by the target device is received.

[0071] After heat exchange, the cooling water temperature reaches 45-50℃. However, because the cooling block (e.g., water-cooled block) itself does not have a heating element, the temperature of the water flowing through it cannot reach the 75℃ of the water heater, and the temperature of the inner and outer rings of the heating plate still cannot achieve the effect of heating the water. In addition, there is also temperature loss in the pipes during the flow of heated water. Therefore, a water distribution block is added after the heat exchange block, integrating multiple water paths into one. The water first passes through the cavity and the top cover plate, where the 45-50℃ cooling water is further heated to 70-75℃ before finally flowing into the water-cooled block of the heating plate.

[0072] Step S13: Water at the first temperature is fed into the cooling block to cool a designated location within the target device, and the cooling water at the first temperature is returned to the water distribution block.

[0073] Finally, cooling water heated to 70-75°C is fed into the water-cooling block to cool designated locations within the target equipment, such as seals in the reaction chamber. At this point, the water flowing into the water-cooling block is no longer preheated water at 45-50°C, but rather hot water that has already flowed through the chamber and top cover and been heated to 70-75°C. This reduces the temperature loss of the cooling water, and simultaneously raises the water temperature flowing into the water-cooling block from 45-50°C to 70-75°C, also increasing the return water temperature and pushing up the temperature of the ambient temperature inlet water, creating a positive feedback loop.

[0074] Table 1 below shows the actual temperature of each component (cavity, top cover, water-cooled block) and the output power of the heating rod under different temperature control schemes.

[0075]

[0076] Table 1

[0077] According to the results in Table 1, Scheme 1 is the traditional scheme with a water heater. The water heater directly pumps 75°C hot water into the internal cooling water channels of the cavity, top cover, and water-cooled block for temperature control, and the three temperature-controlled areas remain stable at the set 75°C. However, the water heater is relatively expensive, resulting in high operating costs. Scheme 2 eliminates the water heater and only adds heating rods inside the cavity and top cover. In this scheme, 20-30°C room temperature water is directly supplied to the cooling water channels, and the newly installed heating rods are used entirely to heat the cooling water. However, the temperatures of the cavity, top cover, and water-cooled block are far from the set values, and all heating rods operate at 100% full power, but the strong heat dissipation from the room temperature cooling water still cannot be overcome.

[0078] Option 3 adds a heat exchange block to the existing heating rod. High-temperature return water preheats the ambient temperature incoming water (to 45-50°C) before the heating rod is used. This significantly improves the temperature in each zone compared to Option 2, bringing it closer to the set value. The heating rod power is reduced from 100% to 90%, and the preheating of the ambient temperature cooling water by the heat exchange block reduces the heating burden on the heating rod. However, the temperature does not fully reach the set value; the water temperature flowing into the water-cooled block is still too low due to preheating alone, resulting in excessive cooling of the heating plate by the water-cooled block and unresolved issues such as large radial temperature differences in the heating plate.

[0079] Option 4, proposed in this application, adds a water distribution block to Option 3. The multiple water flow paths are replaced with a single, series-connected flow, proceeding sequentially from low to high temperature according to requirements. Preheated water first flows through the cavity and top cover, being heated to 70-75°C, before finally flowing into the water-cooling block. This option increases the temperature of room-temperature water flowing through the heating plate and water-cooling block, reducing the problem of temperature drop at the center of the heating plate when the water heater is not in use. It also further increases the return water temperature, compensating for heat loss during flow and similarly increasing the inlet water temperature. At this point, all areas reach the set temperature, and the heating element power is significantly reduced, allowing the system to operate comfortably and safely. The inlet water temperature of the water-cooling block reaches 75°C, consistent with the original water heater design. At this point, the cooling intensity of the water-cooling block on the edge of the heating plate is restored to an ideal state.

[0080] The proposed solution redesigns the cooling water flow path in the atomic layer deposition equipment by adding heat exchange blocks and water distribution blocks. The heat exchange blocks perform "waste heat recovery," using high-temperature return water to initially raise the ambient temperature inlet water to 45-50°C. The water distribution blocks then introduce the preheated water into the cavity and top cover, where it is heated to the target temperature by evenly distributed heating rods. Finally, cooling water heated to 70-75°C is introduced into the water-cooling block. This solves the problems of insufficient heating rod power to quickly heat the cavity to the target temperature and increased radial temperature difference of the heating plate after adding ambient temperature cooling water.

[0081] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0082] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0083] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

Claims

1. A process cooling water system, characterized in that, include: A heat exchange block, a water distribution block, and a cooling block are provided, wherein the water distribution block is connected to the heat exchange block and the cooling block, respectively. The heat exchange block is used to preheat the input cooling water with the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block. The water distribution block is used to direct the water at the second temperature into the target device and to receive the cooling water heated to the first temperature by the target device. The cooling block receives cooling water heated to a first temperature for cooling a designated location within the target device, and returns the cooling water at the first temperature to the water distribution block.

2. The system according to claim 1, characterized in that, The system also includes cooling water pipes for sequentially connecting the heat exchange block, the water distribution block, the target equipment, and the cooling block to form a series cooling water circuit.

3. The system according to claim 1, characterized in that, The target device has at least one heating rod, and the water distribution block is used to flow the second temperature water through the heating rod to heat it to the first temperature.

4. The system according to claim 2, characterized in that, The cooling water pipeline includes a heat exchange block pipeline, which includes a first pipeline and a second pipeline. The first pipe is used to receive the input cooling water and output the water at the first temperature after heat exchange is completed. The second pipe is used to deliver water at a second temperature to the water distribution block and to receive water at a first temperature flowing out of the water distribution block.

5. The system according to claim 2, characterized in that, The cooling water pipeline includes a water distribution block pipeline, and the water distribution block pipeline includes a third pipeline and a fourth pipeline; The third pipe is used to deliver water at a second temperature to the target device and to receive water at a first temperature flowing out of the target device; The fourth pipe is used to deliver water at the first temperature to the cooling block and to receive water at the first temperature flowing out of the cooling block.

6. The system according to claim 5, characterized in that, The fourth pipeline includes a fourth outlet and a fourth inlet; The water distribution block transmits water at the first temperature to the cooling block through the fourth water outlet; The cooling block uses water at a first temperature to cool a designated location within the target device via internal cooling water pipes. After cooling is complete, the water at the first temperature is introduced into the water distribution block through the fourth water inlet, and finally returned to the heat exchange block.

7. A method for temperature control using a process cooling water system as described in any one of claims 1 to 6, characterized in that, The method includes: The input cooling water is preheated using the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block; The second temperature water flows into the target device, and the target device receives the cooling water heated to the first temperature; Water at a first temperature is fed into the cooling block to cool a designated location within the target device, and the cooling water at the first temperature is returned to the water distribution block.

8. A computer-readable medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in claim 7.

9. An atomic layer deposition apparatus, characterized in that, The device includes: The reaction chamber, the upper cover plate, and the process cooling water system as described in any one of claims 1 to 6; The reaction chamber includes a heating plate, a sealing element, and a base. The sealing element is located between the heating plate and the base and is used to seal the connection between the heating plate and the base. The heat exchange block is used to preheat the input cooling water with the first temperature water flowing out from the water distribution block to obtain the second temperature water, wherein the first temperature water flows from the cooling block into the water distribution block. The water distribution block is used to allow water at the second temperature to flow into the reaction chamber and the upper cover plate, and to receive cooling water heated to the first temperature; The cooling block receives cooling water heated to a first temperature for cooling the seal and returns the cooling water at the first temperature to the water distribution block.

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