Automatic detection equipment for chip and detection method thereof

Abstract

The invention relates to the technical field of chip detection, in particular to automatic detection equipment for a chip and a detection method thereof.The automatic detection equipment comprises a chip detection equipment body, the chip detection equipment body comprises a detection table and detection equipment, and the detection table of the chip detection equipment body is rotationally connected with a rotating table; and a placing seat is fixedly connected to the outer wall of the top of the rotating table, a mounting seat is arranged in the placing seat, and a centering mechanism is arranged on the mounting seat. The downward pressing seat drives the chip body to perform angle adjustment, so that the two sides of the chip body are conveniently detected, the situation that scratches are not detected to affect the attractive appearance and selling of the chip body is prevented, meanwhile, the front and back surfaces of pins on the two sides of the chip body are conveniently detected, the situation that damage is not detected to affect use of the pins is avoided, and the service life of the pins is prolonged. Therefore, the integrity of chip body detection is correspondingly improved, and the chip body can be detected more comprehensively.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, specifically relating to an automated testing device and method for chips. Background Technology

[0002] Automated testing equipment for chips is a high-tech device that integrates precision optical imaging, high-speed signal processing, and intelligent algorithms. It can perform non-contact or micro-contact testing on chips according to preset programs, automatically completing a series of complex tests from appearance defect identification and pin coplanarity testing to internal circuit function verification. It not only greatly improves the testing speed and accuracy, but also records data in real time and generates analysis reports. It is a key link in modern chip manufacturing to ensure product quality and improve production efficiency.

[0003] However, traditional devices still have the following problems when in use: Patent application publication number CN113399304B discloses a chip testing device. The loading and unloading buffer mechanism is located within the gripping area of ​​the identification and grasping mechanism, and the loading and unloading buffer mechanism has a loading area and a dispensing area. A tray transfer mechanism is used to move the tray from the loading area of ​​the loading and unloading buffer mechanism to the dispensing area. The chip testing device provided by this invention can replace manual labor to achieve efficient material handling, and is faster than manual operation, thus improving chip testing efficiency.

[0004] In the existing technology, when performing appearance inspection on a chip, it is usually only possible to inspect one side, and it is inconvenient to flip the chip. As a result, scratches on the back of the chip cannot be detected, thus affecting the appearance of the chip. Therefore, we need an automated testing device and method for chips to solve the problem of chips being difficult to flip during appearance testing, and to enable the chips to be flipped. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this invention is to provide an automated testing device and method for chips, which has the advantage of chip flipping.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automated testing device for chips, comprising a chip testing device body, the chip testing device body including a testing stage and a testing device, a rotating platform rotatably connected to the testing stage of the chip testing device body, a placement seat fixedly connected to the outer wall of the top of the rotating platform, an installation seat disposed inside the placement seat, a centering mechanism disposed on the installation seat, the centering mechanism being used to adjust the position of the chip body when it is placed inside the placement seat, a flipping mechanism disposed inside the placement seat, the flipping mechanism being used to flip the chip body during testing, the flipping mechanism including a motor, two motors respectively located on the outer walls of the two sides of the placement seat, the centering mechanism including an inclined plate and an adjusting roller, the outer wall of the top of the installation seat being fixedly connected to the outer wall of the bottom of the inclined plate.

[0007] Preferably, the outer wall of the top of the mounting base is provided with a rotating groove, the inner wall of the rotating groove is rotatably connected to an adjusting roller, a magnetic block one is fixedly connected inside the adjusting roller, and a magnetic block two is fixedly connected to the inner wall of the rotating groove. The magnetic block two and the magnetic block one are mutually repulsive.

[0008] Preferably, the output end of the motor is fixedly connected to a main shaft, one end of the main shaft is in movable contact with a connecting shaft, the outer wall of one end of the connecting shaft is fixedly connected to a lower pressure seat, and the inner wall of the mounting seat is fixedly connected to the outer wall of the lower pressure seat.

[0009] Preferably, a toothed rotating plate is fixedly connected to the outer wall of the connecting shaft, a miniature telescopic rod is fixedly connected to the outer wall of one side of the toothed rotating plate, a tightening ring is fixedly connected to the output end of the miniature telescopic rod, the inner wall of the tightening ring is slidably connected to the outer wall of the connecting shaft, a shape memory plate is fixedly connected to the outer wall of one end of the connecting shaft, an anti-slip pad is provided on the inner wall of the shape memory plate, the shape memory plate is in movable contact with the outer wall of the main shaft, and a push rod is fixedly connected to the outer wall of one side of the tightening ring.

[0010] Preferably, a support plate is rotatably connected inside the toothed rotating plate. The inner wall of the support plate is rotatably connected to the outer wall of the connecting shaft. The outer wall of the bottom of the support plate is fixedly connected to the outer wall of the top of the fixing frame. The outer wall of the bottom of the fixing frame is fixedly connected to the lower part of the inner wall of the placement seat. An electric telescopic rod is fixedly connected to the lower part of the inside of the fixing frame. An insert rod is fixedly connected to the output end of the electric telescopic rod. The outer wall of the insert rod is in movable contact with the inside of the fixing frame. The outer wall of the top of the insert rod is movably inserted into the outer wall of the bottom of the toothed rotating plate.

[0011] Preferably, the outer wall of the main shaft is provided with a sliding groove, and a gear one is slidably connected inside the sliding groove. A gear two is meshed with the outer wall of the gear one. A screw rod is fixedly connected to the axis of the gear two. The outer wall of the screw rod is rotatably connected to the interior of the lower pressure seat. One side of the outer wall of the lower pressure seat is an inclined surface. An inclined groove is provided on the inclined surface of the lower pressure seat. A pressure rod is slidably connected inside the inclined groove. An adjusting block is movably contacted inside the pressure rod. The interior of the adjusting block is threadedly connected to the outer wall of the screw rod. One side of the outer wall of the gear one is movably contacted with the push rod.

[0012] Preferably, a pressure plate is rotatably connected to the inner wall of the lower pressure seat, and a return spring is movably contacted on the outer wall of the bottom of the pressure plate. The outer wall of the bottom of the return spring is fixedly connected to the outer wall of the lower pressure seat. A square groove with two outer walls connected is provided on the pressure plate. The interior of the square groove is slidably connected to the outer wall of the pressure rod. A rubber pad is fixedly connected to the outer wall of the bottom of the pressure plate. A pressure sensor is provided on the pressure plate.

[0013] Preferably, the mounting base has mounting slots on both sides inside, the inner wall of the mounting slot is fixedly connected to a hinge, the outer wall of one end of the hinge is fixedly connected to a light-transmitting shell, the inner wall of the mounting slot is fixedly connected to a light source assembly at the position between the two hinges, and the outer walls of the upper and lower sides of the light-transmitting shell are fixedly connected to light guide plates.

[0014] Preferably, a second motor is fixedly connected inside the mounting groove, a rotating rod is fixedly connected to the output end of the second motor, a support rod is fixedly connected to the outer wall of one end of the light-transmitting shell, the outer wall of one end of the support rod is rotatably connected to the inner wall of the mounting groove, and a fan blade is fixedly connected to the outer wall of one end of the rotating rod through the interior of the light-transmitting shell.

[0015] A tension detection production process for a dyeing and printing sizing machine is based on a tension detection system for the dyeing and printing sizing machine. This tension detection production process includes the following steps: S1: Chip body placement and initial positioning: Place the chip body in the placement seat, use the inclined plate to make the chip body slide down, use the magnetic blocks to push the adjusting roller to rotate, and use the inclined plate to center the chip body and prevent it from shifting. S2: Securely clamp the chip body: Place the chip body on the lower pressure seat, start the forward and reverse motors on both sides of the placement seat, and through gear and screw rod transmission, make the adjusting block push the pressure rod, drive the pressure plate to press down, the rubber pad contacts the chip body, and the pressure sensor detects the clamping force; S3: Flexible adjustment of detection angle: Start the electric telescopic rod one to release the toothed rotating plate, start the motor one to make the connecting shaft drive the lower pressure seat to rotate, flip the chip body, start the electric telescopic rod two to adjust the angle of the light guide plate and change the angle of light illumination; S4: Light Enhancement Defect Recognition: Turn on the light source component in the mounting slot. The light emitted by the component shines on the chip body through the light-transmitting shell, making minor defects such as scratches on the chip body surface more obvious and improving the accuracy of defect recognition. S5: Heat dissipation ensures detection quality: Starting motor two drives the fan blades to rotate, increasing the airflow inside the light-transmitting shell, preventing the heat generated by the light source components from causing the light-transmitting shell to heat up, and preventing heat transfer from damaging the chip body.

[0016] Compared with the prior art, the beneficial effects of the present invention are: The downward pressure seat allows for angle adjustment of the chip body, facilitating inspection of both sides of the chip body. This prevents scratches from going undetected, affecting the chip's appearance and resale value. It also facilitates inspection of the pins on both sides of the chip body, avoiding undetected damage that could affect pin functionality. Consequently, it increases the completeness of chip body inspection, enabling a more comprehensive test of the chip body. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention.

[0018] Figure 2 This is a top view structural diagram of the rotating platform of the present invention.

[0019] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle.

[0020] Figure 4 This is a schematic diagram of the placement base structure of the present invention.

[0021] Figure 5 This is a schematic diagram of the motor structure of the present invention.

[0022] Figure 6 For the present invention Figure 4 A schematic diagram of the cross-sectional structure from A1 to A2.

[0023] Figure 7 For the present invention Figure 5 Schematic diagram of the cross-sectional structure from B1 to B2.

[0024] Figure 8 This is a schematic diagram of the mounting base structure of the present invention.

[0025] Figure 9 This is a schematic diagram of the adjusting roller structure of the present invention.

[0026] Figure 10 for Figure 8 Enlarged structural diagram at point B.

[0027] Figure 11This is a schematic cross-sectional view of the toothed rotating plate of the present invention.

[0028] Figure 12 This is a schematic diagram of the light-transmitting shell structure of the present invention.

[0029] Figure 13 for Figure 12 Enlarged structural diagram at point C.

[0030] Figure 14 This is a schematic diagram of the fan blade structure of the present invention.

[0031] Figure 15 This is a flowchart.

[0032] In the diagram: 1. Chip testing equipment body; 11. Rotating table; 12. Chip body; 2. Placement seat; 21. Mounting seat; 22. Inclined plate; 23. Adjusting roller; 24. Rotating groove; 25. Magnetic block one; 26. Magnetic block two; 3. Motor one; 31. Main shaft; 4. Pressure plate; 41. Pressure rod; 42. Rubber pad; 43. Adjusting block; 44. Return spring one; 45. Lower pressure seat; 46. Inclined groove; 5. Light-transmitting shell; 51. Light guide plate; 52. Mounting groove; 53. Motor two; 54. Light source assembly; 55. Hinge; 5 6. Rotating rod; 57. Support rod; 6. Gear 1; 61. Gear 2; 62. Screw rod; 63. Slide groove; 7. Fixing frame; 71. Electric telescopic rod 1; 72. Insert rod 1; 73. Tightening ring; 74. Miniature telescopic rod; 75. Toothed rotating plate; 76. Support plate; 77. Connecting shaft; 78. Memory shape plate; 8. Electric telescopic rod 2; 81. Force-bearing frame; 82. Limiting groove; 83. Fixing plate; 84. Insert rod 2; 85. Return spring 2; 86. Fan blade; 87. T-slot; 88. Connecting sleeve; 9. Push rod. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1, please refer to Figures 1 to 15This invention provides a technical solution for an automated testing device for chips: It includes a chip testing device body 1, which includes a testing stage and testing equipment. A rotating stage 11 is rotatably connected to the testing stage of the chip testing device body 1. A placement seat 2 is fixedly connected to the outer wall of the top of the rotating stage 11. A mounting seat 21 is provided inside the placement seat 2. A centering mechanism is provided on the mounting seat 21 to adjust the position of the chip body 12 when it is placed inside the placement seat 2. A flipping mechanism is provided inside the placement seat 2 to flip the chip body 12 during testing. The flipping mechanism includes two motors 3, which are respectively located on the outer walls of both sides of the placement seat 2. The output end of the 3 is fixedly connected to the main shaft 31. One end of the main shaft 31 is in movable contact with the connecting shaft 77. The outer wall of one end of the connecting shaft 77 is fixedly connected to the pressure seat 45. The inner wall of the mounting base 21 is fixedly connected to the outer wall of the pressure seat 45. The outer wall of the connecting shaft 77 is fixedly connected to the toothed rotating plate 75. One side of the outer wall of the toothed rotating plate 75 is fixedly connected to the miniature telescopic rod 74. The output end of the miniature telescopic rod 74 is fixedly connected to the tightening ring 73. The inner wall of the tightening ring 73 is slidably connected to the outer wall of the connecting shaft 77. One end of the outer wall of the connecting shaft 77 is fixedly connected to the memory shape plate 78. The inner wall of the memory shape plate 78 is provided with an anti-slip pad. The memory shape plate 78 is in movable contact with the outer wall of the main shaft 31. One side of the outer wall of the tightening ring 73 is fixedly connected to the push rod 9.

[0035] When the tightening ring 73 moves onto the memory plate 78, the memory plate 78 causes the anti-slip pad to come into close contact with and be fixed to the motor 3. At the same time, when the tightening ring 73 moves, it drives the push rod 9 to push the gear 6. When the gear 6 moves inside the slide groove 63 under force, the meshing connection between the gear 6 and the gear 61 is released, thereby flexibly adjusting the conversion between the clamping mechanism and the flipping mechanism. The lowering base 45 drives the chip body 12 to adjust its angle, which facilitates the inspection of both sides of the chip body 12. This prevents scratches from going undetected and affecting the appearance and sale of the chip body 12. It also facilitates the inspection of the pins on both sides of the chip body 12, avoiding undetected damage that could affect the use of the pins. Consequently, it increases the completeness of the inspection of the chip body 12 and allows for a more comprehensive inspection of the chip body 12.

[0036] In Embodiment 2, based on Embodiment 1, the centering mechanism includes an inclined plate 22 and an adjusting roller 23. The outer wall of the top of the mounting base 21 is fixedly connected to the outer wall of the bottom of the inclined plate 22. A rotating groove 24 is provided on the outer wall of the top of the mounting base 21. The adjusting roller 23 is rotatably connected to the inner wall of the rotating groove 24. A magnetic block 25 is fixedly connected inside the adjusting roller 23. A magnetic block 26 is fixedly connected to the inner wall of the rotating groove 24. The magnetic block 26 and the magnetic block 25 are mutually repulsive.

[0037] By adjusting the roller 23 and the inclined plate 22, the chip body 12 is prevented from shifting inside the placement seat 2. By centering the chip body 12 inside the placement seat 2, the accuracy of the detection equipment in detecting the chip body 12 is improved. This avoids the chip body 12 shifting and not being fully photographed by the detection equipment, thereby reducing the effect of missing detection of the chip body 12.

[0038] In Example 3, based on Example 1, a support plate 76 is rotatably connected inside the toothed rotating plate 75. The inner wall of the support plate 76 is rotatably connected to the outer wall of the connecting shaft 77. The outer wall of the bottom of the support plate 76 is fixedly connected to the outer wall of the top of the fixing frame 7. The outer wall of the bottom of the fixing frame 7 is fixedly connected to the lower part of the inner wall of the placement seat 2. An electric telescopic rod 71 is fixedly connected to the lower part of the inside of the fixing frame 7. An insertion rod 72 is fixedly connected to the output end of the electric telescopic rod 71. The outer wall of the insertion rod 72 is in movable contact with the inside of the fixing frame 7. The outer wall of the top of the insertion rod 72 is movably inserted into the outer wall of the bottom of the toothed rotating plate 75.

[0039] After the chip body 12 is flipped, the electric telescopic rod 71 pushes the insertion rod 72 back into the groove of the toothed rotating plate 75, preventing the chip body 12 from moving when it does not need to be flipped. Correspondingly, by fixing the toothed rotating plate 75, the connecting shaft 77 is prevented from driving the lower pressure seat 45 to rotate, thus increasing the stability of the chip body 12 after adjustment.

[0040] In Example 4, based on Example 1, a groove 63 is provided on the outer wall of the main shaft 31. A gear 6 is slidably connected inside the groove 63. A gear 61 is meshed with the outer wall of the gear 6. A screw rod 62 is fixedly connected to the axis of the gear 61. The outer wall of the screw rod 62 is rotatably connected to the interior of the lower pressure seat 45. One side of the outer wall of the lower pressure seat 45 is inclined. An inclined groove 46 is provided on the inclined surface of the lower pressure seat 45. A pressure rod 41 is slidably connected inside the inclined groove 46. An adjusting block 4 is movably contacted inside the pressure rod 41. 3. The inner wall of the adjusting block 43 is threadedly connected to the outer wall of the screw rod 62. The outer wall of one side of the gear 6 is in contact with the push rod 9. The inner wall of the lower pressure seat 45 is rotatably connected to the pressure plate 4. The outer wall of the bottom of the pressure plate 4 is in contact with the return spring 44. The outer wall of the bottom of the return spring 44 is fixedly connected to the outer wall of the lower pressure seat 45. The pressure plate 4 has a square groove with the outer walls of both sides connected. The inside of the square groove is slidably connected to the outer wall of the pressure rod 41. The outer wall of the bottom of the pressure plate 4 is fixedly connected to the rubber pad 42. The pressure plate 4 is equipped with a pressure sensor.

[0041] The clamping and fixing of the chip body 12 by the pressure plate 4 and the lower pressure seat 45 increases the stability of the chip body 12 during testing, avoids displacement caused by the rotating table 11 driving the chip body 12 to rotate under the testing equipment, further increases the stability of the chip body 12 inside the placement seat 2, and provides a stable foundation for the flipping of the chip body 12, making it easier for the lower pressure seat 45 to drive the chip body 12 to flip.

[0042] In Example 5, based on Example 1, mounting slots 52 are provided on both sides inside the placement base 2. A hinge 55 is fixedly connected to the inner wall of the mounting slot 52. A light-transmitting shell 5 is fixedly connected to the outer wall of one end of the hinge 55. A light source assembly 54 is fixedly connected to the inner wall of the mounting slot 52 at the position between the two hinges 55. A light guide plate 51 is fixedly connected to the outer walls of the upper and lower sides of the light-transmitting shell 5. A second motor 53 is fixedly connected inside the mounting slot 52. A rotating rod 56 is fixedly connected to the output end of the second motor 53. A support rod 57 is fixedly connected to the outer wall of one end of the light-transmitting shell 5. The outer wall of one end of the support rod 57 is rotatably connected to the inner wall of the mounting slot 52. A fan blade 86 is fixedly connected to the outer wall of one end of the rotating rod 56 through the interior of the light-transmitting shell 5.

[0043] The movement of motor 53 causes the rotating rod 56 to drive the fan blade 86 to rotate, thereby increasing the airflow inside the light-transmitting shell 5. This prevents the heat generated by the light source assembly 54 from causing the light-transmitting shell 5 to heat up, further preventing heat transfer to the chip body 12 and reducing heat damage to the chip body 12.

[0044] In Example 6, based on Example 5, a T-shaped groove 87 is provided on the lower part of the inner wall of the mounting groove 52. An electric telescopic rod 8 is fixedly connected to the lower part of the inner wall of the mounting groove 52. A force-bearing frame 81 is fixedly connected to the output end of the electric telescopic rod 8. The outer wall of the bottom of the force-bearing frame 81 is slidably connected to the inside of the T-shaped groove 87. A connecting sleeve 88 is rotatably connected to the outer wall of the rotating rod 56. The outer wall of one end of the connecting sleeve 88 is fixedly connected to the outer wall of the light-transmitting shell 5. A limiting groove 82 is slidably connected to the outer wall of the connecting sleeve 88. A fixing plate 83 is fixedly connected to the outer wall of the rotating rod 56. A return spring 85 is fixedly connected to the outer wall of one side of the limiting groove 82. The outer wall of one end of the return spring 85 is fixedly connected to the outer wall of the light-transmitting shell 5. An insertion rod 84 is fixedly connected to the outer wall of the other side of the limiting groove 82. An insertion hole is provided on the fixing plate 83. The outer wall of the insertion rod 84 is movably inserted into the inside of the insertion hole. The outer wall of the limiting groove 82 is movably inserted into the outer wall of the force-bearing frame 81.

[0045] By changing the angle at which the light source component 54 shines on the chip body 12, different angles of light shining on the chip body 12 will cause the defects on the surface of the chip body 12 to present different contrasts of light and shadow effects. Through the light guiding effect of the light guide plate 51, the incident angle of light can be changed, so that the originally difficult-to-detect minute defects, shallow scratches, small protrusions or depressions can produce obvious changes in optical characteristics at a specific angle, thus being captured more clearly by the detection equipment, improving the sensitivity and accuracy of defect identification.

[0046] Example 7: A tension detection production process for a dyeing and printing sizing machine, implemented based on any one of the tension detection systems for dyeing and printing sizing machines described in Examples 1 to 6. This tension detection production process includes the following steps: S1: Chip body 12 placement and initial positioning: Place the chip body 12 in the placement seat 2, and use the inclined plate 22 to make the chip body 12 slide down. Use the magnetic blocks to push the adjusting roller 23 to rotate, and use the inclined plate 22 to center the chip body 12 and prevent it from shifting. This prevents the chip body 12 from shifting within the placement seat 2, reducing the possibility of incomplete imaging by the detection equipment due to improper positioning of the chip body 12, which could lead to missed detection of defects in the chip body 12.

[0047] S2: Securely clamp the chip body 12: Place the chip body 12 on the lower pressure seat 45, start the forward and reverse motors 3 on both sides of the placement seat 2, and through the gear and screw rod 62, make the adjusting block 43 push the pressure rod 41, which drives the pressure plate 4 to press down, the rubber pad 42 contacts the chip body 12, and the pressure sensor detects the clamping force. This stable clamping prevents the chip body 12 from shifting during the testing process, especially when the rotating stage 11 drives the chip body 12 to rotate below the testing equipment, thus ensuring the stability of the testing.

[0048] S3: Flexible adjustment of detection angle: Start the electric telescopic rod 71 to release the toothed rotating plate 75 from the fixation, start the motor 3 to make the connecting shaft 77 drive the lower pressure seat 45 to rotate, and flip the chip body 12. Flipping the chip body 12 facilitates the detection of the pins on both sides of the chip body 12, avoiding any undetected damage, ensuring that the pins can be used normally, and increasing the completeness of the detection of the chip body 12.

[0049] S4: Light-enhanced defect identification: The light source component 54 inside the mounting slot 52 is turned on, and the light emitted by it shines through the light-transmitting shell 5 onto the chip body 12, making minor defects such as scratches on the surface of the chip body 12 more obvious and improving the accuracy of defect identification. Sufficient and appropriate lighting allows the testing equipment to more clearly distinguish the surface of the chip body 12, reducing missed and false detections caused by insufficient or uneven lighting, and ensuring the reliability of the test results.

[0050] S5: Heat dissipation ensures detection quality: Start motor 2 53 drives fan blade 86 to rotate, increasing the airflow inside the light-transmitting shell 5, preventing the light-transmitting shell from heating up due to the heat generated by the light source component 54, and preventing heat transfer from damaging the chip body 12.

[0051] A good heat dissipation environment helps extend the service life of equipment such as the light source component 54, ensures stable operation of the equipment during long-term testing, reduces failures and testing interruptions caused by overheating, and improves testing efficiency.

[0052] The working principle and usage process of this invention are as follows: During operation, the chip body 12 is first placed inside the placement seat 2. Due to the inclined plate 22 on the upper side of the mounting base 21, one side of the inclined plate 22 is inclined, allowing the chip body 12 to slide down through the inclined surface of the inclined plate 22. This adjusts the position of the chip body 12 inside the placement seat 2. Then, through the repulsive action between magnetic block 1 25 and magnetic block 26, the adjusting roller 23 is pushed to rotate towards the downward pressure seat 45. When the chip body 12 shifts and falls onto the adjusting roller 23, the chip body 12 is adjusted... The rotation of the roller 23 pushes the chip body 12 to the center position. When the chip body 12 falls off the adjusting roller 23, the rotation of the adjusting roller 23 can no longer move the chip body 12. Through the cooperation of the adjusting roller 23 and the inclined plate 22, the chip body 12 is prevented from shifting inside the placement seat 2. By centering the chip body 12 inside the placement seat 2, the accuracy of the detection equipment for the chip body 12 is improved, and the chip body 12 is not completely shifted and cannot be photographed by the detection equipment. Accordingly, the effect of missing detection of the chip body 12 is reduced.

[0053] In this invention, the chip body 12 is placed on the lower pressure seat 45, and a soft pad is provided on the lower pressure seat 45 to prevent damage to the chip body 12 during clamping. Simultaneously, motors 3 on both sides of the placement seat 2 are activated. The movement of motors 3 causes the main shaft 31 to drive gear 6 to rotate. Due to the meshing connection between gear 6 and gear 61, the rotation of gear 6 causes gear 61 to drive the screw rod 62 to rotate. Due to the threaded connection between the screw rod 62 and the adjusting block 43, when the screw rod 62 drives the adjusting block 43, the adjusting block 43 pushes the pressure rod 41 to slide inside the inclined groove 46. Since the inclined groove 46 is inclined, when the adjusting block 43 pushes the pressure rod 41 towards the bottom of the inclined groove 46, the pressure rod 41 pulls the pressure plate 4 towards... The downward movement causes the rubber pad 42 on the pressure plate 4 to contact the chip body 12. The pressure sensor on the pressure plate 4 then detects the clamping force applied to the chip body 12 in real time and transmits the signal to the controller on the chip testing equipment body 1. This allows the operator to observe the clamping force of the pressure plate 4 and prevent excessive clamping force from damaging the chip body 12. The clamping and fixing of the chip body 12 by the pressure plate 4 and the lower pressure seat 45 increases the stability of the chip body 12 during testing and prevents the chip body 12 from shifting when the rotating table 11 rotates it under the testing equipment. This further increases the stability of the chip body 12 inside the placement seat 2 and provides a stable foundation for the flipping of the chip body 12, making it easier for the lower pressure seat 45 to flip the chip body 12.

[0054] It should be noted that motor 3 rotates in both directions.

[0055] In this invention, the rubber pad 42 drives the pressure rod 41 to move in the opposite direction, which, through the setting of the reset spring 44, pushes the pressure plate 4 to rotate upward, thereby contacting the clamping of the chip body 12 by the pressure plate 4, making it easier to remove the chip body 12 later. Furthermore, since the reset spring 44 is in movable contact with the pressure plate 4, it prevents the direction of movement of the reset spring 44 from changing with the tilt angle of the pressure plate 4 when pushing the pressure plate 4 upward, thus increasing the wear of the reset spring 44. Correspondingly, the reset spring 44 does not change its own movement trajectory when pushing the pressure plate 4, further increasing the service life of the reset spring 44.

[0056] In this invention, by activating the micro telescopic rod 74, the movement of the micro telescopic rod 74 pushes the tightening ring 73 to slide onto the memory plate 78. Since the diameter of the tightening ring 73 is smaller than the diameter of the opening of the memory plate 78, when the tightening ring 73 moves onto the memory plate 78, the memory plate 78 causes the anti-slip pad to make tight contact and fix with the motor 3. At the same time, when the tightening ring 73 moves, it drives the push rod 9 to push the gear 6. When the gear 6 moves inside the slide groove 63 under force, the meshing connection between the gear 6 and the gear 61 is released, thereby flexibly adjusting the conversion between the clamping mechanism and the flipping mechanism.

[0057] In this invention, by activating the electric telescopic rod 71 below the fixing frame 7, the movement of the electric telescopic rod 71 can drive the insertion rod 72 to leave the groove on the outer wall of the toothed rotating plate 75. The insertion rod 72 contacts the toothed rotating plate 75, thus fixing the chip body 12 and flipping it. After the chip body 12 is flipped, the electric telescopic rod 71 pushes the insertion rod 72 back into the groove of the toothed rotating plate 75, preventing the chip body 12 from moving when it is not needed to be flipped. Correspondingly, by fixing the toothed rotating plate 75, the connecting shaft 77 is prevented from driving the lower pressure seat 45 to rotate, increasing the stability of the chip body 12 after adjustment.

[0058] In this invention, after releasing the fixing of the toothed rotating plate 75 by the insertion rod 72, starting the motor 3 will cause the main shaft 31 to drive the connecting shaft 77 to rotate. Due to the fixed connection between the connecting shaft 77 and the lower pressure seat 45, when the connecting shaft 77 rotates, the lower pressure seat 45 can drive the chip body 12 to adjust its angle. This facilitates the inspection of both sides of the chip body 12, preventing scratches from going undetected and affecting the appearance and sale of the chip body 12. It also facilitates the inspection of the pins on both sides of the chip body 12, avoiding undetected damage that could affect the use of the pins. Accordingly, it increases the completeness of the inspection of the chip body 12, allowing for a more comprehensive inspection of the chip body 12.

[0059] In this invention, the light source component 54 installed inside the mounting slot 52 emits light that shines on the chip body 12 through the light-transmitting shell 5, increasing the brightness of the chip body 12. This makes minor defects such as scratches, cracks, stains, and oxidation spots on the surface of the chip body 12 more obvious, thereby improving the accuracy of defect identification and reducing missed and false detections.

[0060] In this invention, by starting the second motor 53, the movement of the second motor 53 can drive the rotating rod 56 to rotate the fan blade 86, thereby increasing the airflow inside the light-transmitting shell 5, preventing the heat generated by the light source component 54 from causing the light-transmitting shell 5 to heat up, further preventing heat transfer to the chip body 12, and reducing heat damage to the chip body 12.

[0061] In this invention, the electric telescopic rod 8 is activated. The movement of the electric telescopic rod 8 causes the force-bearing frame 81 to slide inside the T-groove 87, thus disengaging the T-groove 87 from the outer wall of the limiting groove 82 and releasing the T-groove 87 from the limiting groove 82. At this time, the force of the return spring 85 pushes the limiting groove 82 to move on the connecting sleeve 88. When the limiting groove 82 causes the insertion rod 84 to contact the fixing plate 83, the rotating rod 56 drives the fixing plate 83 to rotate. When the insertion hole on the fixing plate 83 aligns with the insertion rod 84, the return spring 85 pushes the insertion rod 84 into the insertion hole. Simultaneously, the rotating rod 56 rotates, causing the fixing plate 83 to rotate, thus... The fixed plate 83 drives the connecting sleeve 88 to rotate. Due to the fixed connection between the connecting sleeve 88 and the light-transmitting shell 5, the light-transmitting shell 5 is adjusted at the same time as the connecting sleeve 88 rotates, thereby driving the light guide plate 51 to adjust its angle. This changes the angle at which the light source assembly 54 shines on the chip body 12. Light shining on the chip body 12 at different angles will cause the defects on the surface of the chip body 12 to present different contrasts and shadow effects. By changing the incident angle of light through the light guiding effect of the light guide plate 51, the originally hard-to-detect minute defects, such as shallow scratches, small protrusions or depressions, can produce obvious changes in optical characteristics at specific angles, so that they can be captured more clearly by the detection equipment, thereby improving the sensitivity and accuracy of defect identification.

[0062] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated inspection apparatus for wafers, comprising a wafer inspection apparatus body (1) comprising an inspection table and an inspection apparatus, characterized in that: The detection equipment body (1) is rotatably connected with a rotating table (11) on the detection table, an outer wall at the top of the rotating table (11) is fixedly connected with a placing seat (2), the placing seat (2) is internally provided with a mounting seat (21), the mounting seat (21) is provided with a centering mechanism, the centering mechanism is used for adjusting the position of the chip body (12) when the chip body (12) is placed in the placing seat (2), and the placing seat (2) is internally provided with a turnover mechanism, the turnover mechanism is used for turning over the chip body (12) during detection. The turnover mechanism comprises two electric machines (3), and the two electric machines (3) are respectively arranged on the outer walls on the two sides of the placing seat (2). The centering mechanism comprises an inclined plate (22) and an adjusting roller (23), and the outer wall at the top of the mounting seat (21) is fixedly connected with the outer wall at the bottom of the inclined plate (22).

2. The automated inspection apparatus for chips according to claim 1, wherein: An outer wall at the top of the mounting seat (21) is provided with a rotating groove (24), the adjusting roller (23) is rotatably connected with the inner wall of the rotating groove (24), the inner wall of the adjusting roller (23) is fixedly connected with a magnetic block (25), the inner wall of the rotating groove (24) is fixedly connected with a magnetic block (26), and the magnetic block (26) and the magnetic block (25) repel each other.

3. The automated inspection apparatus for chips according to claim 1, wherein: The output end of the electric machine (3) is fixedly connected with a main shaft (31), one end of the main shaft (31) is movably connected with a connecting shaft (77), the outer wall of one end of the connecting shaft (77) is fixedly connected with a pressing seat (45), and the inner wall of the mounting seat (21) is fixedly connected with the outer wall of the pressing seat (45).

4. The automated inspection apparatus for chips according to claim 3, wherein: The outer wall of the connecting shaft (77) is fixedly connected with a toothed rotating plate (75), one side of the outer wall of the toothed rotating plate (75) is fixedly connected with a micro telescopic rod (74), the output end of the micro telescopic rod (74) is fixedly connected with a tightening ring (73), the inner wall of the tightening ring (73) is slidably connected with the outer wall of the connecting shaft (77), the outer wall of one end of the connecting shaft (77) is fixedly connected with a memory-shaped plate (78), the inner wall of the memory-shaped plate (78) is provided with an antiskid pad, the memory-shaped plate (78) movably contacts with the outer wall of the main shaft (31), and one side of the outer wall of the tightening ring (73) is fixedly connected with a push rod (9).

5. The automated inspection apparatus for chips according to claim 4, wherein: The inner wall of the toothed rotating plate (75) is rotatably connected with a supporting plate (76), the inner wall of the supporting plate (76) is rotatably connected with the outer wall of the connecting shaft (77), the outer wall at the bottom of the supporting plate (76) is fixedly connected with the outer wall at the top of a fixing frame (7), the outer wall at the bottom of the fixing frame (7) is fixedly connected with the inner wall of the placing seat (2) below, a first electric telescopic rod (71) is fixedly connected to the inner wall below of the fixing frame (7), the output end of the first electric telescopic rod (71) is fixedly connected with a first inserting rod (72), the outer wall of the first inserting rod (72) movably contacts with the inner wall of the fixing frame (7), and the outer wall at the top of the first inserting rod (72) movably inserts the outer wall at the bottom of the toothed rotating plate (75).

6. The automated inspection apparatus for chips according to claim 3, wherein: The outer wall of the main shaft (31) is provided with a sliding groove (63), the inside of the sliding groove (63) is slidably connected with a gear one (6), the outer wall of the gear one (6) is meshedly connected with a gear two (61), the position of the shaft center of the gear two (61) is fixedly connected with a screw rod (62), the outer wall of the screw rod (62) is rotatably connected with the inside of the lower pressing seat (45), the outer wall of the one side of the lower pressing seat (45) is a slope, the slope of the lower pressing seat (45) is provided with an inclined groove (46), the inside of the inclined groove (46) is slidably connected with a pressure rod (41), the inside of the pressure rod (41) movably contacts an adjusting block (43), the inside of the adjusting block (43) is threadedly connected with the outer wall of the screw rod (62), and the outer wall of the one side of the gear one (6) movably contacts a push rod (9).

7. The automated inspection apparatus for chips according to claim 6, wherein: The inner wall of the lower pressing seat (45) is rotatably connected with a pressing plate (4), the outer wall of the bottom of the pressing plate (4) movably contacts a return spring one (44), the outer wall of the bottom of the return spring one (44) is fixedly connected with the outer wall of the lower pressing seat (45), the upper of the pressing plate (4) is provided with a square groove with the outer walls of the two sides being communicated, the inside of the square groove is slidably connected with the outer wall of the pressure rod (41), the outer wall of the bottom of the pressing plate (4) is fixedly connected with a rubber pad (42), and the pressing plate (4) is provided with a pressure sensor.

8. The automated inspection apparatus for chips according to claim 1, wherein: The inside of the placing seat (2) is provided with installation grooves (52) on the two sides, the inner wall of the installation groove (52) is fixedly connected with a hinge (55), the outer wall of the one end of the hinge (55) is fixedly connected with a light-transmitting shell (5), the inner wall of the installation groove (52) is fixedly connected with a light source assembly (54) at the position between the two hinges (55), and the outer walls of the upper and lower two sides of the light-transmitting shell (5) are fixedly connected with light guide plates (51).

9. The automated inspection apparatus for chips according to claim 8, wherein: The inside of the installation groove (52) is fixedly connected with a motor two (53), the output end of the motor two (53) is fixedly connected with a rotating rod (56), the outer wall of the one end of the light-transmitting shell (5) is fixedly connected with a supporting rod (57), the outer wall of the one end of the supporting rod (57) is rotatably connected with the inner wall of the installation groove (52), and the outer wall of the one end of the rotating rod (56) is rotatably penetrated into the inside of the light-transmitting shell (5) and is fixedly connected with a fan blade (86).

10. A tension detection production process of a printing and sizing machine, which is realized based on the tension detection system of the printing and sizing machine according to any one of claims 1-9, characterized in that: The tension detection production process of the printing and dyeing slurry yarn machine comprises the following steps: S1: chip body (12) is placed and preliminarily positioned: the chip body (12) is placed in the placing seat (2), the chip body (12) is made to slide downward by the slope of the inclined plate (22), the adjusting roller (23) is driven to rotate by the magnetic block repulsion, and the chip body (12) is centered by the inclined plate (22) to prevent deviation; S2: the chip body (12) is stably clamped: the chip body (12) is placed in the lower pressing seat (45), the two sides of the placing seat (2) are started, the adjusting block (43) drives the pressure rod (41) to drive the pressing plate (4) to press down through the gear and the screw rod (62), the rubber pad (42) contacts the chip body (12), and the clamping force is detected by the pressure sensor. S3: Flexible adjustment of detection angle: start the electric telescopic rod one (71) to release the fixing of the toothed rotating plate (75), start the motor one (3) to make the connecting shaft (77) drive the lower pressing seat (45) to rotate, and flip the chip body (12); S4: Light enhancement defect identification: turn on the light source assembly (54) in the installation slot (52), the light emitted by the light source assembly (54) transmits through the light-transmitting shell (5) and shines on the chip body (12), so that the micro defects such as scratches on the surface of the chip body (12) are more obvious, and the defect identification accuracy is improved; S5: Heat dissipation ensures detection quality: start the motor two (53) to drive the fan blade (86) to rotate, increase the air flowability inside the light-transmitting shell (5), avoid the heat generated by the work of the light source assembly (54) to make the light-transmitting shell heat up, and prevent the heat from damaging the chip body (12).

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