Oscillation device, crystal circuit test method, medium, and program

Abstract

The invention provides an oscillation starting device, a crystal circuit testing method, a medium and a program. Relates to the technical field of testing. The oscillation starting device is used for inducing oscillation starting of a passive crystal circuit to be tested. The oscillation starting device comprises an MCIO connector, a first connector, a second connector, a power supply unit and USB equipment. Each data transmission pin in the MCIO connector is connected with each data pin in the first connector in a one-to-one correspondence manner; the target pin of the first connector is correspondingly connected with the function pin of the second connector; wherein the target pin can meet the transmission requirement of an information transmission pin in the USB equipment; the second connector is connected with an information transmission pin and a grounding pin in the USB equipment; the power supply unit is connected with a power supply pin in the USB equipment, and the power supply unit is used for supplying power to the USB equipment. According to the invention, an efficient and rapid crystal circuit test effect is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of testing, in particular to a vibration starting device, a crystal circuit testing method, a medium and a program. BACKGROUND

[0002] In the development stage of the mainboard, the development cycles of the devices and equipment related to the USB HUB are not synchronized, and it is difficult to effectively test the performance of the USB HUB part on the mainboard during the development of the mainboard.

[0003] In the related art, the devices and equipment related to the USB HUB on the mainboard can be tested after the development of the devices and equipment related to the USB HUB is completed, so as to verify the effectiveness of the crystal circuit. There is a problem of long test time, which affects the overall progress and efficiency of the development of the mainboard.

[0004] Therefore, there is an urgent need for an efficient and fast crystal circuit testing scheme. SUMMARY

[0005] The present application provides a vibration starting device, a crystal circuit testing method, a medium and a program, so as to achieve efficient and fast crystal circuit testing effect.

[0006] In a first aspect, the present application provides a vibration starting device for inducing the vibration of a passive crystal circuit to be tested, the device comprising: an MCIO connector, a first connector, a second connector, a power supply unit and a USB device.

[0007] Each data transmission pin in the MCIO connector is connected one by one with each data pin in the first connector.

[0008] The target pin of the first connector is connected with the function pin of the second connector; wherein the target pin can meet the transmission requirement of the information transmission pin in the USB device.

[0009] The second connector is connected with the information transmission pin and the ground pin in the USB device.

[0010] The power supply unit is connected with the power supply pin in the USB device, and the power supply unit is used for supplying power to the USB device.

[0011] In a possible implementation, the target pin of the first connector is connected with the function pin of the second connector through a Dupont line.

[0012] In a possible implementation, the second connector is a 3PIN connector.

[0013] In one possible implementation, the MCIO connector is connected to the passive crystal circuit under test via a USB hub.

[0014] In one possible implementation, the MCIO connector is connected to the MCIO interface within the USB hub.

[0015] In one possible implementation, the first connector is a 2×10 connector.

[0016] Secondly, this application provides a method for testing crystal circuits, including:

[0017] A connection between the USB HUB and the test tool is established through the MCIO interface in the USB HUB and the MCIO connector in the oscillation device, thereby inducing the crystal circuit under test to oscillate. The oscillation device is made according to any one of claims 1-6. The motherboard under test has a USB HUB and a crystal circuit under test connected to the USB HUB.

[0018] After the crystal circuit under test starts oscillating, the corresponding crystal circuit test is performed on the crystal circuit under test through the test equipment to obtain the test results of the crystal circuit under test.

[0019] Thirdly, this application provides a crystal circuit testing device, comprising:

[0020] An oscillation module is used to establish a connection between the USB HUB and the test tool through the MCIO interface in the USB HUB and the MCIO connector in the oscillation device, thereby inducing the oscillation of the crystal circuit under test. The oscillation device is made according to any one of claims 1-6. The motherboard under test has a USB HUB and a crystal circuit under test connected to the USB HUB.

[0021] The test module is used to perform corresponding crystal circuit tests on the crystal circuit under test after the crystal circuit under test starts oscillating, and obtain the test results of the crystal circuit under test.

[0022] Fourthly, this application provides an electronic device, including: a memory and a processor;

[0023] The memory stores the instructions that the computer executes;

[0024] The processor executes computer execution instructions stored in memory, causing the processor to perform the second aspect and / or various possible implementations of the second aspect as described above.

[0025] Fifthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the second aspect and / or various possible embodiments of the second aspect as described above.

[0026] In a sixth aspect, the present application provides a computer program product comprising a computer program which, when executed by a processor, implements the second aspect and / or various possible implementation manners of the second aspect.

[0027] The oscillation device, the crystal circuit test method, the medium and the program provided by the present application can supply power for the USB device through the power supply unit, and can ensure that the oscillation device can induce the to-be-tested passive crystal circuit to oscillate by connecting the MCIO connector, the first connector, the second connector and the USB device, so that the test of the crystal circuit can be realized in the development stage of the mainboard. Each data transmission pin in the MCIO connector is connected with each data pin in the first connector one by one in a one-to-one correspondence; the target pin of the first connector is connected with the function pin of the second connector in a corresponding manner, and the second connector is connected with the information transmission pin and the grounding pin in the USB device; the test interruption or the data loss caused by the pin connection error or instability is avoided, and the stable and efficient data transmission between the USB device and the MCIO connector is ensured. In summary, the oscillation device can induce the to-be-tested passive crystal circuit to oscillate, and the test of the crystal circuit can be realized in the development stage of the mainboard. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments consistent with the present application and, together with the description, further serve to explain the principles of the present application.

[0029] Figure 1 A structure diagram of a crystal circuit provided by an embodiment of the present application is shown in the following figure.

[0030] Figure 2 A structure diagram of an oscillation device provided by an embodiment of the present application is shown in the following figure.

[0031] Figure 3 A flowchart of a crystal circuit test method provided by an embodiment of the present application is shown in the following figure.

[0032] Figure 4 A structure diagram of a crystal circuit test device provided by an embodiment of the present application is shown in the following figure.

[0033] Figure 5 A structure diagram of an electronic device provided by an embodiment of the present application is shown in the following figure.

[0034] The above figures have shown the specific embodiments of the present application, and more detailed descriptions will be given in the following. These figures and the written description are not intended to limit the scope of the concept of the present application by any means, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0035] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The following description is presented in connection with the drawings and is made in terms of the exemplary embodiments. Unless otherwise indicated, the same or similar reference numerals are used to refer to the same or similar elements throughout the drawings and the description. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0036] In the field of mainboard development, the USB HUB as the core component to realize multi-port expansion, its performance directly affects the compatibility and stability of the mainboard. In engineering practice, there is a significant difference between the development cycle of the USB HUB device and the matching equipment, which leads to multiple technical challenges in the test and verification link.

[0037] In the related art, after the development of the device and equipment related to the USB HUB on the mainboard is completed, the test of the crystal circuit connected by the USB HUB is carried out to verify the effectiveness of the passive crystal circuit. There is a problem of long test time. Further, if the passive crystal circuit is found to be abnormal after the passive crystal circuit test, the mainboard layout needs to be modified or the components need to be replaced, which causes the design iteration cycle to be prolonged, affecting the progress and efficiency of the mainboard development.

[0038] The starting device provided by the embodiment of the present application supplies power to the USB device through the power supply unit, and ensures that the starting device can induce the to-be-tested passive crystal circuit to start by connecting the MCIO connector, the first connector, the second connector and the USB device. The test of the crystal circuit is realized in the development stage of the mainboard. Each data transmission pin in the MCIO connector is connected one by one with each data pin in the first connector; the target pin of the first connector is connected with the function pin of the second connector, and the second connector is connected with the information transmission pin and the ground pin in the USB device; the test interruption or data loss caused by pin connection error or instability is avoided, and stable and efficient data transmission between the USB device and the MCIO connector is ensured. In summary, the starting device can induce the to-be-tested passive crystal circuit to start, and the crystal circuit test is carried out in the development stage of the mainboard.

[0039] Figure 1 A structure diagram of a crystal circuit is provided for the embodiment of the present application. As shown in Figure 1 The crystal circuit 10 includes a crystal oscillator module 12 and four pins connected to the crystal oscillator module: pin 111, pin 112, pin 113 and pin 114. Among them:

[0040] The USB hub includes "USB_HUB2_CLK X1" and "USB_HUB2_CLK X2" pins. Pin 111 of the crystal circuit 10 is connected to "USB_HUB2_CLK X1" in the USB hub and is used to transmit the clock signal generated by the crystal oscillator module to the USB hub through "USB_HUB2_CLK X1". Pin 113 of the crystal circuit 10 is connected to "USB_HUB2_CLK X2" in the USB hub and is used to receive the clock signal from the USB hub through "USB_HUB2_CLK X2"; pins 114 and 112 are not connected to other devices.

[0041] Optionally, the crystal oscillator module 12 has a nominal frequency of 12 MHz, and / or the model number of the crystal oscillator module 12 is: HQ11300886000.

[0042] Optionally, pin 111 is also connected to a grounding capacitor 132, and / or pin 113 is also connected to a grounding capacitor 131.

[0043] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0044] Figure 2 This is a schematic diagram of the structure of the vibration starting device provided in an embodiment of this application. Figure 2 As shown, the oscillation device is used to induce oscillation of the passive crystal circuit under test. The oscillation device 20 includes: an MCIO connector 21, a first connector 22, a second connector 23, a power supply unit 24, and a USB device 25. Each data transmission pin in the MCIO connector 21 is connected to each data pin in the first connector 22. The target pin of the first connector 22 is connected to the function pin of the second connector 23. The target pin can meet the transmission requirements of the information transmission pin in the USB device 25. The second connector 23 is connected to the information transmission pin and the ground pin in the USB device 25. The power supply unit 24 is connected to the power supply pin in the USB device 25 and is used to supply power to the USB device 25.

[0045] The MCIO connector 21 can serve as a high-speed signal input on the motherboard side. It can be connected to each data pin in the first connector 22 one by one through differential signal lines to realize full-duplex communication between the MCIO connector 21 and the first connector 22.

[0046] By physically connecting the second connector 23 with the information transmission pin of the USB device 25, it is ensured that data can be transmitted between the second connector 23 and the USB device 25. The ground pin in the USB device 25 can provide a stable reference potential for the USB device 25, ensuring the integrity of the data signal when transmitting. By physically connecting the ground pin of the second connector 23 with the ground pin of the USB device 25, it is ensured that the continuity and reliability of the USB device 25 ground is ensured.

[0047] When the USB device 25 is not simultaneously, the target pin of the first connector 22 can be determined according to the transmission requirements of the information transmission pin in the USB device 25, and by connecting the target pin of the first connector 22 with the functional pin of the second connector 23, bidirectional communication between the USB device 25 and the first connector 22 is achieved. Avoiding data transmission errors and other problems caused by pin errors, thereby ensuring stable and efficient connection and data interaction between the USB device 25 and the first connector 22. At the same time, by determining the target pin of the first connector 22 according to the transmission requirements of the information transmission pin in the USB device 25, stable communication between the USB device 25 and the first connector 22 can be achieved in different scenarios of the type of USB device 25, expanding the application scenarios of the oscillator device 20, adapting to more test scenarios when using the oscillator device 20 to test the passive crystal circuit under test, and enhancing the versatility and flexibility of the oscillator device 20.

[0048] When determining the target pin of the first connector 22, the type of the USB device 25 is first obtained, and the transmission requirements of the information transmission pin of the USB device 25 are determined according to the type of the USB device 25. The information transmission pin is a pin in the USB device 25 used for data transmission, which can transmit data between the USB device 25 and other devices. Among the pins of the first connector 22, the pin that meets the transmission requirements of the information transmission pin of the USB device 25 is selected as the target pin. Exemplarily, the transmission requirements include data transmission speed, power requirement and control signal. Exemplarily, if the information transmission pin of the USB device 25 is the D+ pin and the D- pin, then the D+ pin and the D- pin in the first connector 22 are selected as the target pin.

[0049] The power supply pin in the USB device 25 provides power to the USB device 25, allowing the USB device 25 to work normally. The power supply unit 24 provides stable power to the USB device 25 by connecting with the power supply pin in the USB device 25, ensuring that the USB device 25 can work normally. Optionally, the power supply unit 24 can also provide overcurrent protection and short circuit protection for the USB device 25.

[0050] Optionally, the power supply voltage of the power supply unit 24 is 5V.

[0051] For example, each data transmission pin in the MCIO connector 21 is connected with a corresponding data pin in the first connector 22.

[0052] Table 1 is a pin diagram of the MCIO connector. The MCIO connector is a 2x37 dual-row pin. As shown in Table 1, the data transmission pins in the MCIO connector 21 include pin A8, pin A9, pin A10, pin A11, pin A12, pin A26, pin A27, pin A28, pin A29, pin A30, pin B8, pin B9, pin B10, pin B11, pin B12, pin B26, pin B27, pin B28, pin B29 and pin B30.

[0053] The data transmission pins in the MCIO connector 21 are evenly divided into four groups. The first group of data transmission pins includes pin A8, pin A9, pin A10, pin A11 and pin A12; the second group of data transmission pins includes pin A26, pin A27, pin A28, pin A29 and pin A30; the third group of data transmission pins includes pin B8, pin B9, pin B10, pin B11 and pin B12; and the fourth group of data transmission pins includes pin B26, pin B27, pin B28, pin B29 and pin B30.

[0054] Table 1 is a pin diagram of the MCIO connector. The MCIO connector is a 2x37 dual-row pin. As shown in Table 1, the data transmission pins in the MCIO connector 21 include pin A8, pin A9, pin A10, pin A11, pin A12, pin A26, pin A27, pin A28, pin A29, pin A30, pin B8, pin B9, pin B10, pin B11, pin B12, pin B26, pin B27, pin B28, pin B29 and pin B30.

[0055]

[0056] Further, the first connector 22 is a 2x10 connector.

[0057] The 2x10 connector has a large number of pins and a relatively regular layout, and can be conveniently connected with the MCIO connector 21 and the second connector 23. By using the 2x10 connector as the first connector 22, the combination of the MCIO connector 21 and the second connector 23 module can be achieved, which facilitates the monitoring and analysis of the transmitted signals. When using a vibration device to test a crystal circuit, the performance of the crystal circuit can be further analyzed by monitoring the data of the first connector 22.

[0058] The pins in the first connector 22 are numbered respectively, and the pins in the first connector 22 include pins C8, C9, C10, C11, C12, C26, C27, C28, C29, C30, D8, D9, D10, D11, D12, D26, D27, D28, D29 and D30.

[0059] The pins in the first connector 22 are evenly divided into four groups, and the first group of pins includes pins C8, C9, C10, C11 and C12; the second group of pins includes pins C26, C27, C28, C29 and C30; the third group of pins includes pins D8, D9, D10, D11 and D12; and the fourth group of pins includes pins D26, D27, D28, D29 and D30.

[0060] Then, the first group of data transmission pins are connected to the first group of pins one by one respectively; the second group of data transmission pins are connected to the second group of pins one by one respectively; the third group of data transmission pins are connected to the third group of pins one by one respectively; and the fourth group of data transmission pins are connected to the fourth group of pins one by one respectively.

[0061] Specifically, the first group of data transmission pins are connected to the first group of pins one by one respectively, including connecting pin A8 to pin C8, connecting pin A9 to pin C9, connecting pin A10 to pin C10, connecting pin A11 to pin C11, and connecting pin A12 to pin C12. The second group of data transmission pins are connected to the second group of pins one by one respectively, including connecting pin A26 to pin C26, connecting pin A27 to pin C27, connecting pin A28 to pin C28, connecting pin A29 to pin C29, and connecting pin A30 to pin C30. The third group of data transmission pins are connected to the third group of pins one by one respectively, including connecting pin B8 to pin D8, connecting pin B9 to pin D9, connecting pin B10 to pin D10, connecting pin B11 to pin D11, and connecting pin B12 to pin D12. The fourth group of data transmission pins are connected to the fourth group of pins one by one respectively, including connecting pin B26 to pin D26, connecting pin B27 to pin D27, connecting pin B28 to pin D28, connecting pin B29 to pin D29, and connecting pin B30 to pin D30.

[0062] The oscillation device provided by the embodiment of the application is powered by the power supply unit for the USB device, the oscillation device can induce the oscillation of the passive crystal circuit to be tested by connecting the MCIO connector, the first connector, the second connector and the USB device, and the crystal circuit can be tested in the development stage of the mainboard. Each data transmission pin in the MCIO connector is connected to each data pin in the first connector one by one, the target pin of the first connector is connected to the function pin of the second connector, and the second connector is connected to the information transmission pin and the grounding pin in the USB device, so that the data transmission between the USB device and the MCIO connector can be stable and efficient, and the test interruption or data loss caused by the pin connection error or instability can be avoided. In summary, the oscillation device can induce the oscillation of the passive crystal circuit to be tested, and the crystal circuit can be tested in the development stage of the mainboard.

[0063] Optionally, the target pin of the first connector 22 is connected to the function pin of the second connector 23 through the Dupont wire.

[0064] The Dupont wire is a common electronic connection wire, and the target pin of the first connector 22 and the function pin of the second connector 23 are connected through the Dupont wire, so that the electrical connection can be realized quickly, flexibly and reliably.

[0065] Optionally, the second connector 23 is a 3PIN connector.

[0066] The 3PIN connector is a connector with three pins. The 3PIN connector is usually used for simple electrical connection, and the 3PIN connector includes a grounding pin and two control signal pins. The 3PIN connector is used as the second connector 23, so that the second connector 23 can meet the circuit connection requirement of the oscillation device 20, and the oscillation device 20 is simple in structure and easy to use.

[0067] Optionally, the MCIO connector 21 is connected to the passive crystal circuit to be tested through the USB HUB.

[0068] The MCIO connector 21 is connected to the USB HUB, the connection between the oscillation device 20 and the USB HUB is realized, the USB device 25 in the oscillation device 20 can be accurately recognized by the USB HUB when there is no power-on card in the USB HUB, and the USB HUB is connected to the passive crystal circuit to be tested, so that the MCIO connector 21 can effectively communicate with the passive crystal circuit to be tested.

[0069] Further, the MCIO connector is connected to the MCIO interface in the USB HUB.

[0070] The MCIO connector is connected with the corresponding MCIO interface inside the USB HUB through a physical interface, so as to ensure correct transmission of signals between the MCIO connector and the USB HUB.

[0071] Figure 3 A flowchart of a crystal circuit test method provided by an embodiment of the present application is shown in FIG. 1. Figure 3 The method includes

[0072] S301, a connection between the USB HUB and the test tool is established through the MCIO interface inside the USB HUB of the to-be-tested mainboard and the MCIO connector inside the oscillation device, so as to induce the to-be-tested crystal circuit to oscillate.

[0073] In this step, the oscillation device is made according to the oscillation device in the above embodiment and / or any possible implementation manner in the above embodiment. The to-be-tested mainboard is deployed with the USB HUB and the to-be-tested crystal circuit connected with the USB HUB.

[0074] First, a connection between the USB HUB and the oscillation device is established through the MCIO interface inside the connected USB HUB of the to-be-tested mainboard and the MCIO connector inside the oscillation device, so that the USB HUB in the to-be-tested mainboard can correctly identify the USB device in the oscillation device, thereby inducing the to-be-tested crystal circuit connected with the USB HUB to oscillate.

[0075] S302, after the to-be-tested crystal circuit oscillates, the test device performs corresponding crystal circuit test on the to-be-tested crystal circuit, and obtains a test result of the to-be-tested crystal circuit.

[0076] After the to-be-tested crystal circuit connected with the USB HUB successfully oscillates under the induction of the oscillation device, the test device performs crystal circuit test on the to-be-tested crystal circuit. The test device performs a preset test procedure through the connection with the USB HUB. When the test device performs the preset test procedure, the test device receives and collects signals from the to-be-tested crystal circuit, and obtains a test result of the to-be-tested crystal circuit. Optionally, the preset test procedure includes frequency measurement, frequency offset measurement, negative resistance measurement, phase measurement, and amplitude measurement of the to-be-tested crystal circuit.

[0077] Figure 4 A structure diagram of a crystal circuit test device provided by an embodiment of the present application is shown in FIG. 2. Figure 4 As shown in FIG. 2, the crystal circuit test device 40 provided by the embodiment includes:

[0078] The starting module 401 is configured to establish the connection between the USB HUB and the test tool through the MCIO interface in the USB HUB and the MCIO connector in the starting device, and induce the starting of the to-be-tested crystal circuit, wherein the starting device is made according to the starting device in the above embodiment and any possible implementation manner; the USB HUB and the to-be-tested crystal circuit connected with the USB HUB are arranged on the to-be-tested mainboard.

[0079] The test module 402 is configured to execute the corresponding crystal circuit test on the to-be-tested crystal circuit through the test equipment after the starting of the to-be-tested crystal circuit, and obtain the test result of the to-be-tested crystal circuit.

[0080] The crystal circuit test device provided in the embodiment can execute the method provided in the method embodiment, and has similar implementation principles and technical effects, which will not be repeated here.

[0081] Figure 5 The electronic device provided in the embodiment is shown in a structural schematic diagram. As shown in the figure, the electronic device 50 provided in the embodiment includes at least one processor 501 and a memory 502. Optionally, the device 50 further includes a communication component 503. The processor 501, the memory 502 and the communication component 503 are connected through a bus 504. Figure 5

[0082] In the specific implementation process, the at least one processor 501 executes the computer execution instructions stored in the memory 502, so that the at least one processor 501 executes the method described above.

[0083] The specific implementation process of the processor 501 can refer to the method embodiment, which has similar implementation principles and technical effects, and will not be repeated here.

[0084] In the above embodiment, it should be understood that the processor can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the application can be directly embodied as the execution of the hardware processor, or the execution of the combination of the hardware and software modules in the processor.

[0085] ​The memory can include a Random Access Memory (RAM) and can also include a Non-volatile Memory (NVM), such as at least one disk memory.

[0086] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus can be divided into an address bus, a data bus, a control bus, and the like. For ease of representation, the bus in the drawings of the embodiments of the present application is not limited to only one bus or one type of bus.

[0087] The embodiments of the present application also provide a computer program product, comprising a computer program, which, when executed by a processor, implements the above method.

[0088] The embodiments of the present application also provide a computer readable storage medium, which stores computer execution instructions, and when the computer execution instructions are executed, any of the above methods is implemented.

[0089] The above readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random-Access Memory (SRAM), Electrically-Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-only Memory (EPROM), Programmable Read-only Memory (PROM), Read-Only Memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special purpose computer.

[0090] An example readable storage medium is coupled to the processor such that the processor can read information from the readable storage medium and can write information to the readable storage medium. Of course, the readable storage medium can also be a part of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (ASIC). Of course, the processor and the readable storage medium can also exist as discrete components in the device.

[0091] The division of units is only a logical functional division, and in actual implementation, there can be another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0092] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, can be located in one place, or can be distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0093] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0094] If the functions are realized in the form of software functional units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program code storage media.

[0095] Those skilled in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction related hardware. The foregoing program can be stored in a computer readable storage medium. The program executes to perform the steps of the above-mentioned method embodiments; and the foregoing storage medium includes various media capable of storing program codes, such as ROM, RAM, magnetic disk, or optical disk.

[0096] Finally, it should be noted that other embodiments of the present application will readily occur to those skilled in the art upon consideration of the specification and practice of the present application disclosed herein. The present application is intended to include all such variations as fall within the general scope of the application, and includes the generic principles disclosed and the best mode known to the inventors to be currently practiced as well as variations thereof, without departing from the scope of the present application as defined by the claims. The specification and examples give the best application of the present application as known to at least one of the inventors at the time of the filing of this application. It is to be understood that since numerous modifications and changes will readily occur to those skilled in the art, the application is not to be limited to the exact construction and operation as illustrated and described. Accordingly, all such variations are intended to be included within the scope of the present application as defined in the claims. The application is to be limited only by the claims.

Claims

1. An oscillation starting device characterized by comprising: The starting device is used for inducing the starting of the passive crystal circuit to be tested, and the device comprises an MCIO connector, a first connector, a second connector, a power supply unit and a USB device. Each data transmission pin in the MCIO connector is connected to a corresponding data pin in the first connector. The target pin of the first connector is connected to the function pin of the second connector. The second connector is connected to the information transmission pin and the ground pin in the USB device. The power supply unit is connected to the power supply pin in the USB device, and the power supply unit is used for supplying power to the USB device.

2. The oscillation starting device according to claim 1, characterized in that The target pin of the first connector is connected to the function pin of the second connector through a DuPont line.

3. The oscillation starting device according to claim 1, wherein The second connector is a 3PIN connector.

4. The oscillation starting device according to claim 1, wherein The MCIO connector is connected to the passive crystal circuit to be tested through a USB HUB.

5. The oscillation starting device according to claim 4, wherein The MCIO connector is connected to the MCIO interface in the USB HUB.

6. The oscillation starting device according to claim 1, wherein The first connector is a 2*10 connector.

7. A method of testing a crystal circuit, characterized by, The method comprises the following steps: The connection between the USB HUB and the test tool is established through the MCIO interface in the USB HUB on the mainboard to be tested and the MCIO connector in the starting device, and the starting of the crystal circuit to be tested is induced, wherein the starting device is made of the starting device according to any one of claims 1-6; the USB HUB and the crystal circuit to be tested connected with the USB HUB are arranged on the mainboard to be tested; After the starting of the crystal circuit to be tested, the corresponding crystal circuit test is performed on the crystal circuit to be tested through the test device, and the test result of the crystal circuit to be tested is obtained.

8. A crystal circuit testing apparatus characterized by comprising: The method comprises the following steps: The starting module is used for establishing the connection between the USB HUB and the test tool through the MCIO interface in the USB HUB on the mainboard to be tested and the MCIO connector in the starting device, and inducing the starting of the crystal circuit to be tested, wherein the starting device is made of the starting device according to any one of claims 1-6; the USB HUB and the crystal circuit to be tested connected with the USB HUB are arranged on the mainboard to be tested; The test module is used for performing the corresponding crystal circuit test on the crystal circuit to be tested through the test device after the starting of the crystal circuit to be tested, and obtaining the test result of the crystal circuit to be tested.

9. An electronic device, comprising: The method comprises the following steps: A memory and a processor; The memory stores computer execution instructions; The processor executes the computer execution instructions stored in the memory, so that the processor executes the method of claim 7.

10. A computer readable storage medium characterized by, The computer readable storage medium stores computer execution instructions, and the computer execution instructions are used for realizing the method of claim 7 when executed.

11. A computer program product, characterised in that, The computer program is used for realizing the method of claim 7 when executed.

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