An automatic bottom tape stripping system for PCB board

Abstract

The application relates to a bottom tape automatic peeling system for a PCB board, which comprises a carrier buffer positioning mechanism, a turnover rotating mechanism, a Y-axis module, a Z-axis clamp jaw tape peeling module, an X-axis uniform speed tape peeling module and a tape collecting roller mechanism. The carrier loaded with steel sheets is sent into the buffer positioning position; the carrier is positioned, the steel sheets are adsorbed and turned over by the turnover rotating mechanism; the Y-axis module sends the steel sheets into the tape peeling mechanism; the Z-axis module lowers to clamp the tape and lifts to start peeling; the X-axis module drives the clamp jaw assembly to uniformly peel off the tape; the peeled tape is automatically collected by the roller mechanism; the steel sheets are reset and sent out by the conveying line. Through the cooperative work of the above modules, simultaneous peeling and centralized recovery of multiple tapes are realized, and the automation level and production efficiency of the SMT process are significantly improved. The application has the advantages of reasonable structure, stable operation, strong adaptability and the like, and is suitable for automatic tape peeling operation of various types of PCB boards.

Description

Technical Field

[0001] This application relates to the field of PCB boards, and more specifically to an automatic bottom tape peeling system for PCB boards. Background Technology

[0002] In SMT (Surface Mount Technology) processes, high-temperature tape is typically used to secure the PCB to a stencil to ensure its stability. After printing and component placement, the tape needs to be removed from the bottom of the PCB. Currently, this tape removal is mainly done manually, requiring operators to use a jig to flip the stencil and then manually peel off the tape. This method has several problems: First, manual operation is inefficient and cannot meet the needs of large-scale production; second, improper operation during tape removal can easily damage the PCB components, leading to a higher product scrap rate; furthermore, the lack of consistency between manual flipping and tape removal makes it difficult to maintain stable product quality control.

[0003] CN207192438U discloses an automatic tape recycling device that collects torn tape using a rotating roller. However, this device does not address the issue of protecting the PCB board during the tape-tearing process, posing a risk of tearing damage.

[0004] A 2015 Japanese patent disclosed a flipping suction cup structure for adsorbing and flipping a steel sheet for bottom operations. However, this structure lacks a precise positioning mechanism for the steel sheet, resulting in positional deviations during tape removal and affecting the tape removal effect.

[0005] A US patent published in 2018 disclosed a multi-axis linkage tape-tearing robotic arm, but its complex structure and high cost make it difficult to promote and apply in small and medium-sized enterprises.

[0006] In summary, existing automatic tape peeling systems generally suffer from problems such as low automation, low tape peeling efficiency, easy damage to PCB boards, complex equipment structure, or high cost, making it difficult to meet the current SMT process's demand for efficient, stable, and low-cost automated tape peeling. Summary of the Invention

[0007] The core invention of this invention is to provide an automatic tape peeling system for the bottom of a PCB board, including a carrier buffer positioning mechanism, a flipping and rotating mechanism, a Y-axis module, a Z-axis gripper tape tearing module, an X-axis uniform speed tape tearing module, and a tape collection roller mechanism. Through the coordinated work of the above modules, the simultaneous tearing and centralized recycling of multiple tapes can be achieved.

[0008] This invention provides an automatic tape peeling system for the bottom of a PCB board, characterized in that it includes: a carrier buffer mechanism, a carrier positioning mechanism, a flipping and rotating mechanism, and a tape tearing mechanism.

[0009] The carrier positioning mechanism is connected to the carrier buffer mechanism and the flipping and rotating mechanism respectively, and the tape-tearing mechanism is connected to the flipping and rotating mechanism. The PCB assembly placed on the carrier buffer mechanism is transferred to the carrier positioning mechanism, and the steel sheet of the PCB assembly is adsorbed by the flipping and rotating mechanism, and the PCB assembly is flipped to the tape-tearing mechanism, which peels off the tape on the PCB assembly.

[0010] In a preferred embodiment of the present invention, the flipping and rotating mechanism includes: a steel sheet suction cup, a rotary motor, a flipping motor, and a flipping support plate; the steel sheet suction cup is used to adsorb the steel sheet of the PCB assembly, the rotary motor is connected to the steel sheet suction cup through a pneumatic quick-change head, and drives the steel sheet suction cup to rotate; the flipping motor is connected to the steel sheet suction cup and is used to drive the steel sheet suction cup to flip.

[0011] In a preferred embodiment of the present invention, the flipping and rotating mechanism further includes a lifting motor and a flipping support plate, wherein the lifting motor is connected to a lifting cylinder.

[0012] In a preferred embodiment of the present invention, the tape-tearing mechanism includes:

[0013] The Y-axis module is used to feed the steel sheet attracted by the flipping and rotating mechanism into the tape-tearing station.

[0014] The Z-axis module is connected to a gripper assembly, which is used for lifting and lowering to allow the gripper assembly to pick up and peel off the tape on the PCB assembly.

[0015] The X-axis module is used to drive the gripper assembly to tear off the tape at a uniform speed.

[0016] Tape collecting rollers are used to automatically collect the removed tape.

[0017] In a preferred embodiment of the present invention, there are multiple gripper assemblies, and they are detachably connected to the X-axis module.

[0018] In a preferred embodiment of the present invention, the tape-tearing mechanism includes a tape pressure bar.

[0019] In a preferred embodiment of the present invention, a control system and multiple sensors are also included for coordinating and controlling the sequence of actions of each working mechanism.

[0020] In a preferred embodiment of the present invention, a CCD vision positioning system is provided between the flipping and rotating mechanism and the Y-axis module to identify the positional deviation between the steel sheet and the tape, and to feed it back to the control system for automatic correction.

[0021] In a preferred embodiment of the present invention, a remote monitoring and maintenance system is also included, which integrates a remote monitoring module to realize remote monitoring and fault diagnosis of equipment operating status through Industrial Internet of Things (IIoT) technology, and supports remote parameter adjustment and equipment maintenance.

[0022] In a preferred embodiment of the present invention, an infrared sensor or image recognition module is installed behind the tape collecting roller to detect in real time whether there is tape residue on the steel sheet. If residue is detected, the system automatically alarms and suspends subsequent processes.

[0023] The automatic bottom tape peeling system for PCB boards of the present invention has the following outstanding technical effects and advantages:

[0024] (1) Improved efficiency: By adopting automated flipping, positioning, tape tearing and tape collection technologies, the tape on the bottom of the PCB board can be removed efficiently and safely.

[0025] (2) Improve product yield and enhance safety and stability.

[0026] (3) Simple and easy to use: It solves the technical problems of low efficiency, high scrap rate and poor operation consistency caused by the need for manual removal of the tape on the bottom of the PCB board in the existing technology.

[0027] (4) Cost reduction: It can significantly improve the automation level and production efficiency of SMT process, thereby reducing labor costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an automatic bottom tape peeling system for PCB boards according to an embodiment of the present invention;

[0029] Figure 2 for Figure 1 Another perspective schematic diagram of an automatic bottom tape peeling system for PCB boards;

[0030] Figure 3 This is a top view of the automatic bottom tape peeling system according to an embodiment of the present invention;

[0031] Figure 4 This is a perspective view of the automatic bottom tape peeling system according to an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the tape-tearing mechanism according to an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of a PCB board assembly according to an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the vehicle positioning mechanism according to an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of the flipping and rotating mechanism structure according to an embodiment of the present invention;

[0036] Figure 9a This is a schematic diagram of the flipping and rotating mechanism structure of an embodiment of the present invention before the PCB assembly falls back;

[0037] Figure 9b for Figure 9a Another perspective illustration;

[0038] Figure 10 This is a schematic diagram of the suction cup flipping component structure in an embodiment of the present invention after the PCB component has fallen back;

[0039] Figure 11 This is a schematic diagram of the electrical module structure according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached drawings: 10-Carrier buffer mechanism, 11-Carrier, 12-First blocking mechanism, 13-Second blocking mechanism, 14-Screw motor top positioning; 20-Carrier positioning mechanism, 21-Fixed positioning carrier column, 22-Secondary positioning carrier, 30-Tilting and rotating mechanism, 31-Steel sheet suction cup, 32-Rotary motor, 33-Tilting motor, 34-Lifting motor, 35-Tilting support plate, 36-Pneumatic quick-change head, 37-Lifting cylinder, 38-Suction nozzle, 39-Linear bearing, 40-Tearing tape mechanism, 41-X-axis module, 42-Y-axis module, 43-Z-axis module, 44-Gripper assembly, 45-Tape collecting roller, 46-Tape pressure bar, 50-PCB assembly, 51-Steel sheet, 52-PCB board, 53-Tape, 61-Pattern. Detailed Implementation

[0041] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Those skilled in the art will understand that this description is exemplary and that the present invention is not limited to these specific embodiments.

[0042] like Figures 1 to 11 As shown, the automatic tape peeling system for the bottom of a PCB board according to an embodiment of the present invention includes: a carrier buffer mechanism 10, a carrier positioning mechanism 20, a flipping and rotating mechanism 30, and a tape-tearing mechanism 40. Figure 6 As shown, the PCB assembly 50 includes a steel sheet 51, a PCB board 52 arrayed on the steel sheet 51, and adhesive tape 53 adhered to the PCB board 52. Figures 1-2 The automatic bottom tape peeling system for PCB boards in this embodiment of the invention can also be equipped with a housing.

[0043] like Figures 3-4As shown, the carrier positioning mechanism 20 is connected to the carrier buffer mechanism 10 and the flipping and rotating mechanism 30, respectively, and the tape-tearing mechanism 40 is connected to the flipping and rotating mechanism 30. The PCB assembly 50 placed on the carrier buffer mechanism 10 is transferred to the carrier positioning mechanism 20, and the flipping and rotating mechanism 30 picks up the steel sheet 51 of the PCB assembly 50 and flips the PCB assembly 50 to the tape-tearing mechanism 40, where the tape-tearing mechanism 40 peels off the tape 53 from the PCB assembly 50. Rollers may be provided on the carrier buffer mechanism 10 and the carrier positioning mechanism 20 respectively.

[0044] Figure 7 This is a schematic diagram of the vehicle positioning mechanism according to an embodiment of the present invention, as shown below. Figure 7 As shown, a carrier 11 can be mounted on the carrier buffer mechanism 10 to carry the product to be transferred. At the bottom of the carrier buffer mechanism 10, a first blocking mechanism 12 and a second blocking mechanism 13 are sequentially arranged in the streamline direction. The first blocking mechanism 12 buffers the carrier, and the second blocking mechanism 13 stops the carrier at a certain position on the streamline. A lead screw motor 14 is also provided at the bottom of the carrier buffer mechanism 10 to keep the carrier in a fixed position on the streamline, thus restricting the carrier's degrees of freedom in the X and Y directions.

[0045] like Figures 8-10 As shown, the flipping and rotating mechanism 30 includes: a steel sheet suction cup 31, a rotary motor 32, a flipping motor 33, and a flipping support plate 35. The steel sheet suction cup 31 is used to adsorb the steel sheet 51 of the PCB assembly 50. Specifically, the negative pressure generated by the vacuum generator lifts the steel sheet. The rotary motor 32 is connected to the steel sheet suction cup 31 through a quick-change air circuit 36 ​​and drives the steel sheet suction cup 31 to rotate. That is, the rotary motor 32 drives the suction cup mechanism to rotate by generating rotational force, avoiding interference between the suction cup mechanism and the frame. The flipping motor 33 is connected to the steel sheet suction cup 31 and converts electrical energy into mechanical energy to drive the steel sheet suction cup 31 to flip, facilitating the subsequent tape-tearing operation 53. Specifically, it can drive the steel sheet suction cup 31 to flip 180°. The steel sheet suction cup 31 is provided with multiple suction nozzles 38. The flipping and rotating mechanism 30 also includes a lifting motor 34 and a flipping support plate 35. The lifting motor 34 is connected to a lifting cylinder 37, which is used as the power source for lifting the suction cup. Figure 9a Figure 9 and Figure 10 These are schematic diagrams showing the product before and after falling back into the secondary positioning carrier. The function of the flipping and rotating mechanism 30 is to use a suction cup to pick up the product and the steel sheet. At this time, the tape is in an untorn state, which is called the state before falling back; after falling back refers to the state after the tape is torn off, when the flipping mechanism puts the steel sheet back into the carrier.

[0046] like Figure 9a , Figure 9bAs shown, the flipping and rotating mechanism 30 also includes a secondary positioning carrier 22, which is used for more precise positioning operations based on the primary positioning. In this embodiment, the lead screw motor 14 is the primary positioning carrier. During the primary positioning, the relative positions of the steel plate suction cup 31 and the carrier 11 may still be deviated. The lead screw motor 14 is positioned on top, and as a secondary positioning, it can play a role in fine positioning.

[0047] Multiple fixed positioning carrier columns 21 can be provided at the bottom of the flipping and rotating mechanism 30 to ensure that the tray 61 is securely fastened to the flipping and rotating mechanism 30. Multiple linear bearings 62 can also be provided at the bottom of the steel sheet suction cup 31 to support and guide the moving parts, ensuring their precise movement in the linear direction, while being able to withstand loads and reduce friction.

[0048] like Figure 5 As shown, the tape-tearing mechanism 40 includes an X-axis module 41, a Y-axis module 42, a Z-axis module 43, a tape collecting roller 45, and a tape pressure bar 46. The tape collecting roller 45 is used to automatically collect the torn tape 53. The X-axis module 41 generates power in the X-axis direction, allowing the gripper assembly 44 to move freely in the X-axis direction; the Y-axis module 42 generates power in the Y-axis direction, allowing the suction cup module to move freely in the Y-axis direction; and the Z-axis module 43 generates power in the Z-axis direction, allowing the gripper assembly 44 to move freely in the Z-axis direction. The tape pressure bar 46 assists in supporting the tape during the tearing process, preventing it from sticking to other workpieces.

[0049] The Y-axis module 42 is used to feed the steel sheet 51 adsorbed by the flipping and rotating mechanism 30 into the tape-tearing station 53, ensuring its alignment accuracy with the gripper assembly 44. The Z-axis module 43 is connected to the gripper assembly 44, which is used to lift and lower so that the gripper assembly 44 can grip and peel the tape 53 on the PCB assembly 50. The gripper assembly 44 can be driven by the Z-axis module 43 to descend, accurately grip one end of the tape 53, and then lift up to complete the initial tearing action. The X-axis module 41 is used to drive the gripper assembly 44 to move along the tape 53 at a constant speed to achieve smooth and uniform removal of the tape 53. Optionally, the X-axis module 41 uses a servo motor to drive a lead screw mechanism to achieve uniform speed movement of the gripper assembly 448, ensuring the stability of the tape-tearing process.

[0050] In an optional embodiment of the present invention, multiple sets of gripper assemblies 44 can be set, each corresponding to a tearing position of multiple adhesive tapes 53. By synchronously controlling multiple Z-axis modules 43 and X-axis modules 41, multiple points can be simultaneously torn off the adhesive tape 53, further improving tearing efficiency and stability. This solution is suitable for tearing adhesive tape 53 from PCB boards 52 where the adhesive tape 53 is densely distributed or long. Optionally, the gripper assembly 44 can be designed as a quick-change gripper assembly 44, that is, the gripper assembly 44 and the X-axis module 41 can be detachably connected. Depending on the width and adhesiveness of the adhesive tape 53 of different PCB board models 52, grippers of different materials or structures, such as silicone grippers, pneumatic suction nozzles 38, etc., can be replaced to enhance the versatility and adaptability of the system.

[0051] The torn tape 53 is automatically collected by the roller assembly to prevent it from scattering and affecting the working environment. The steel sheet 51 after the tape 53 is torn can be flipped back to its original position and then sent out by the conveyor line to complete the entire process. The tape collecting roller 45 includes a driving roller and a driven roller, which uses friction to wind and collect the torn tape 53.

[0052] In an optional embodiment of the present invention, the automatic bottom tape peeling system for PCB boards may further include a control system and multiple sensors for coordinating and controlling the sequence of actions of each working mechanism. Specifically, coordination and control are achieved through a PLC controller or industrial controller, with the sequence of actions of each module linked by sensors and pneumatic components to ensure continuous and precise actions, making it suitable for peeling tape from various PCB board models.

[0053] The overall size of the automatic bottom tape peeling system for PCB boards in this embodiment can be [size missing]. Controlled by PLC, operating mode: ON-Line, operating voltage: 220VAC, 50HZ~60HZ, air pressure: 0.5MP~0.7MP, CT: 24S.

[0054] The workflow of the automatic bottom tape peeling system for PCB boards in this embodiment can include: the carrier flows into the carrier buffer mechanism 10 → the carrier buffer mechanism 10 flows to the carrier positioning mechanism 20 → after the second blocking mechanism blocks the carrier, the streamline photoelectric sensor is in position, and the lead screw motor 14 positions the carrier → the flipping and rotating mechanism 30 flips the carrier to be positioned, the suction cup module picks up the steel sheet through the lifting cylinder, and flips it back to the origin (referring to the starting point as a reference position in the motion control system, used for servo motors and stepper motors). (Positioning control) → Y-axis module 42, carrying steel sheet 51, enters tape tearing mechanism 40 → Z-axis module 43 in tape tearing mechanism 40 lowers gripper assembly 44, X-axis and Z-axis modules move and descend into steel sheet groove, gripping tape 53 and lifting it upward along Z-axis → X-module in tape tearing mechanism 40, carrying gripper assembly 44, uniformly tears tape 53 off steel sheet 51 → Teared tape 53 is collected by tape 53 roller → Steel sheet 51, after tearing tape 53, returns and flips again onto streamlined carrier to flow out.

[0055] In an optional embodiment of the present invention, a CCD vision positioning system may also be provided between the flipping and rotating mechanism 30 and the Y-axis module 42 to identify the positional deviation between the steel sheet 51 and the tape 53, and to feed it back to the control system for automatic correction, thereby improving the positioning accuracy and success rate of tearing the tape 53.

[0056] like Figure 11 As shown, the automatic bottom tape peeling system for PCB boards according to an embodiment of the present invention also includes an electrical module. Figure 11 The upper half is the male component of the electrical module, and the lower half is the female component of the electrical module. The male component of the electrical module is installed on the Z-axis module 43, and the female component of the electrical module is installed on the suction cup. When the suction cup needs to be replaced, the fixture is changed by pressing the button on the touch screen. The electrical module is released, the original suction cup is removed manually, and the new suction cup is placed in the electrical module according to the matching of the male and female components. The locking mechanism is fixed by pressing the button on the touch screen. The locking origin sensor line is connected through the signal module in the electrical module. At the same time, the signal module can also be used for the machine's foolproof motor installed on the Z-axis module 43.

[0057] In an optional embodiment of the present invention, a tape residue detection and alarm mechanism can also be set up. An infrared sensor or image recognition module is set behind the tape collecting roller 45 to detect in real time whether there is tape residue on the steel sheet 51. If residue is detected, the system automatically alarms and suspends subsequent processes to prevent defective products from flowing into subsequent processes.

[0058] In an optional embodiment of the present invention, the automatic bottom tape peeling system for PCB boards further includes a remote monitoring and maintenance system, which integrates a remote monitoring module to realize remote monitoring and fault diagnosis of equipment operating status through industrial Internet of Things (IIoT) technology, supports remote parameter adjustment and equipment maintenance, and improves the intelligent management level of equipment.

[0059] In this embodiment, PLC operation monitoring, touch screen monitoring, address control of touch screen display, and remote access to the program interface for system maintenance can be achieved.

[0060] PLC operation monitoring: The data acquisition system collects real-time data such as status, parameters, and faults of PLC devices through hardware and software. The acquisition system transmits the data to the cloud communication service via VPN. The cloud communication service receives and processes the data and stores it in the data server. The application server then processes the data and displays, analyzes, diagnoses, and manages it through a web interface.

[0061] Touchscreen monitoring: Control the touchscreen display via a specific address.

[0062] System maintenance is performed via a remote access program interface: remote desktop technology is used to establish an interaction channel between the engineer's end and the client through a secure connection protocol, supporting real-time viewing of device status and operation logs.

[0063] The present invention has been described in detail above with reference to the embodiments. Those skilled in the art will understand that the present invention can be modified in various ways. As long as these modifications do not depart from the spirit and purpose of the present invention, they should all fall within the scope of this application. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A bottom tape automatic peeling system for a PCB board, characterized by, The application relates to a PCB component stripping tape mechanism. The PCB component stripping tape mechanism comprises a carrier storage mechanism (10), a carrier positioning mechanism (20), a turnover rotating mechanism (30) and a tape stripping mechanism (40); the carrier positioning mechanism (20) is connected with the carrier storage mechanism (10) and the turnover rotating mechanism (30) respectively, and the tape stripping mechanism (40) is connected with the turnover rotating mechanism (30); a PCB component (50) placed on the carrier storage mechanism (10) is transmitted to the carrier positioning mechanism (20), a steel sheet (51) of the PCB component (50) is adsorbed by the turnover rotating mechanism (30), the PCB component (50) is turned over to the tape stripping mechanism (40), and the tape (53) on the PCB component (50) is stripped by the tape stripping mechanism (40). The turnover rotating mechanism (30) comprises a steel sheet suction cup (31), a rotating motor (32), a turnover motor (33), a lifting motor (34) and a turnover support plate (35); the steel sheet suction cup (31) is used for adsorbing the steel sheet (51) of the PCB component (50), the rotating motor (32) is connected with the steel sheet suction cup (31) through an air path quick-change head (36) and drives the steel sheet suction cup (31) to rotate, the turnover motor (33) is connected with the steel sheet suction cup (31) and is used for driving the steel sheet suction cup (31) to turn over, and the lifting motor (34) is connected with a lifting air cylinder (37). The tape stripping mechanism (40) comprises:

2. The automatic bottom tape peeling system for PCB board according to claim 1, wherein, A Y-axis module (42) is used for sending the steel sheet (51) adsorbed by the turnover rotating mechanism (30) to a tape stripping station; A Z-axis module (43) is connected with a clamping jaw assembly (44) and is used for lifting to make the clamping jaw assembly (44) clamp the tape (53) on the PCB component (50) and strip the tape (53); An X-axis module (41) is used for driving the clamping jaw assembly (44) to uniformly strip the tape (53); A tape collecting roller (45) is used for automatically collecting the stripped tape (53). The clamping jaw assembly (44) is a plurality of and is detachably connected with the X-axis module (41).

3. The automatic bottom tape peeling system for PCB board according to claim 2, wherein, The tape stripping mechanism (40) comprises a tape pressing rod (46).

4. The automatic bottom tape peeling system for PCB board according to claim 2, wherein, A control system and a plurality of sensors are further included and are used for coordinately controlling the action sequence of various working mechanisms.

5. The automatic bottom tape peeling system for PCB board according to any one of claims 1-4, characterized in that, A CCD visual positioning system is arranged between the turnover rotating mechanism (30) and the Y-axis module (42) and is used for identifying the position deviation of the steel sheet (51) and the tape (53) and feeding back to the control system to automatically correct the deviation.

6. The automatic bottom tape peeling system for PCB board according to claim 5, wherein, A remote monitoring and maintenance system is further included, an industrial internet of things IIoT technology is adopted to realize remote monitoring and fault diagnosis on the running state of the equipment, remote parameter adjustment and equipment maintenance are supported.

7. The automatic bottom tape peeling system for PCB board according to claim 5, wherein, An infrared sensor or an image recognition module is arranged behind the tape collecting roller (45) and is used for detecting whether there is residual tape on the steel sheet (51) in real time, if the residual tape is detected, the system automatically alarms and pauses the subsequent process.

8. The automatic bottom tape peeling system for PCB board according to claim 5, wherein, ​

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