A GPU liquid cooling plate

Abstract

The application relates to a GPU liquid cooling plate, and belongs to the technical field of liquid cooling plates. A shell comprises a top wall, a bottom wall and a side wall. An inlet hole and an outlet hole are arranged on the side wall of the cooling plate. The inlet hole and the outlet hole of the cooling plate are coaxially arranged. A partition plate is arranged between the first area and the second area of the cooling plate. Two lateral end faces of the partition plate of the cooling plate are fixedly connected with the side wall, and the other two lateral end faces are in a separated state with the side wall, so that the cooling liquid enters the first area through the gap between the partition plate and the side wall. A loop jet channel microstructure is arranged in the second area of the cooling plate. A surrounding plate is arranged on the partition plate of the cooling plate. The top of the surrounding plate of the cooling plate is fixedly connected with the top wall. The surrounding plate of the cooling plate is in a U shape. The inlet hole of the cooling plate is in communication with the internal space of the surrounding plate. A communication hole is arranged on the partition plate of the cooling plate and located in the space of the surrounding plate. The application has the effect of adapting to the non-uniform high-power heat generation of chips.

Description

Technical Field

[0001] This application relates to the field of liquid cooling plate technology, and in particular to a GPU heat dissipation liquid cooling plate. Background Technology

[0002] As the computing power of chips (especially GPUs) continues to increase, their power density is becoming increasingly higher and more unevenly distributed. Traditional liquid cooling plates mostly use two-dimensional microchannels (made through machining methods such as cutting), which have limited heat dissipation capacity and rigid channel layouts. They are difficult to flexibly and accurately adapt to the non-uniform power density distribution of modern chips, resulting in prominent local hot spots, which have become a bottleneck restricting further improvement in chip performance. Summary of the Invention

[0003] To address the issue of uneven high-power heat generation in chips, this application provides a GPU heat dissipation liquid cooler.

[0004] The GPU heat dissipation liquid cooling plate provided in this application adopts the following technical solution:

[0005] A GPU heat dissipation liquid cooling plate includes a housing, which includes a top wall, a bottom wall, and a side wall. The top wall, bottom wall, and side wall are closed to form a receiving cavity. The bottom wall is pressed against the chip for heat conduction. The side wall has a liquid inlet and a liquid outlet, which are coaxially arranged. The receiving cavity includes a first region and a second region. The first region is located above the second region. The liquid inlet and the liquid outlet are both connected to the first region. A partition is provided between the first region and the second region. Two lateral end faces of the partition are fixedly connected to the side wall, while the other two lateral end faces are separated from the side wall, allowing coolant to enter the first region through the gap between the partition and the side wall. A loop spray channel microstructure is provided in the second region. A retaining plate is provided on the partition. The top of the retaining plate is fixedly connected to the top wall. The retaining plate is U-shaped. The liquid inlet communicates with the internal space of the retaining plate. A connecting hole is provided on the partition, which is located within the space of the retaining plate.

[0006] Optionally, the microstructure of the loop injection channel includes multiple cooling plates, which are spaced apart and fixed at the bottom of the receiving cavity in the second region. The cooling plates are located below the partition, and a cooling channel is left between adjacent cooling plates. The two ends of the cooling plates are fixedly set on the side walls. A vacuum cavity is opened in the cooling plate, which is elongated along the length of the cooling plate.

[0007] Optionally, the width of the vacuum chamber is 0.05mm-0.15mm.

[0008] Optionally, the cooling plate is made of copper sheet as a base and is formed by 3D printing.

[0009] Optionally, the partition is provided with a plurality of support columns, which are used to support the top wall of the shell.

[0010] Optionally, a connecting pipe is provided on the partition plate and located in the second region. The connecting pipe is Z-shaped, with one end connected to the connecting hole and the other end facing the loop injection channel microstructure. The connecting pipe is rotatably mounted on the partition plate and rotates about the axis of the connecting hole. The partition plate also includes a first driving member for driving the connecting pipe to rotate. The middle part of the connecting pipe is a telescopic structure and the partition plate also includes a second driving member for adjusting the length of the connecting pipe.

[0011] Optionally, the first driving component includes a central frame and a first driving rod disposed within the connecting pipe. One end of the first driving rod is fixedly disposed at the center of the central frame, and the other end passes through the top wall of the housing and is located outside the housing. The first driving component also includes a driving crossbar that passes through the first driving rod.

[0012] Optionally, the second driving component includes a second driving rod, which is coaxially arranged with and rotatably disposed within the first driving rod. One end of the second driving rod passes through the first driving rod, and the other end is located inside the vertical tube of the connecting pipe. The second driving component also includes a winding rod, a connecting rope, and a driving spring. The winding rod is disposed on the second driving rod and is used to drive the second driving rod to rotate. The winding rod is located above the driving crossbar. The connecting rope is wound on the second driving rod, and the free end of the connecting rope is fixedly disposed on the inner wall of the other vertical tube of the connecting pipe. The two ends of the driving spring are respectively fixedly disposed on the inner wall of the vertical tube of the connecting pipe, and the driving spring is used to drive the connecting pipe to have an elongation tendency.

[0013] Optionally, the inner cavity of the connecting pipe is provided with a sealing cloth, which is cylindrical and has both ends sealed inside the telescopic section of the connecting pipe and is used to transport coolant.

[0014] Optionally, the top wall of the housing is provided with a countersunk groove, the ends of the first drive rod and the second drive rod are both located in the countersunk groove, the drive crossbar and the second drive rod are both located in the countersunk groove, the countersunk groove is a stepped groove, the first drive rod and the second drive rod are both supported on the bottom wall of the countersunk groove, and a fixing member is also included, the fixing member is used to fix the drive crossbar and the winding rod into the countersunk groove.

[0015] In summary, this application includes at least one of the following beneficial technical effects:

[0016] When the GPU is working, the housing is pressed onto the GPU, and the coolant enters the space surrounded by the enclosure through the inlet hole. The coolant then flows through the inlet hole to the second area. The coolant entering the second area then carries away the heat of the GPU through the loop jet channel microstructure, thereby cooling the GPU. The loop jet channel microstructure is adapted to the metal wafer through semiconductor manufacturing process to build a 3D short loop jet channel microstructure. Through a unit design method, the liquid cooling plate can accurately match the power distribution of the GPU, thereby achieving targeted cooling of the GPU and adapting to the uneven high power heat generation of the chip.

[0017] Semiconductor manufacturing processes (such as deposition, photolithography, etching, etc.) are applied to metal wafers instead of traditional cutting processes. Using these processes, a three-dimensional short-loop jet channel microstructure is constructed. This is different from the traditional long and straight two-dimensional microchannels, which means that the fluid path is shorter and more complex, and more efficient local impact jet cooling can be achieved.

[0018] Through 3D jetting microstructures, heat dissipation efficiency far exceeds that of traditional two-dimensional microchannel cold plates, effectively coping with extremely high and uneven power densities; highly customizable, the modular design allows the cold plate microstructure to precisely correspond to the chip's power distribution map, achieving precise heat dissipation and eliminating local hot spots; scalable and cost-effective: by drawing on mature semiconductor manufacturing processes, this advanced cold plate has the capability for large-scale, highly consistent production, while also possessing good cost control potential. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a GPU heat dissipation liquid cooler according to an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the bottom of a GPU heat dissipation liquid cooler according to an embodiment of this application;

[0021] Figure 3 This is a cross-sectional view of a GPU heat dissipation liquid cooler according to an embodiment of this application;

[0022] Figure 4 This is a vertical cross-sectional view of a GPU heat dissipation liquid cooling plate according to an embodiment of this application;

[0023] Figure 5 yes Figure 4 An enlarged schematic diagram of part A in the middle;

[0024] Figure 6 This is a schematic diagram of the connecting pipe structure of a GPU heat dissipation liquid cooler according to an embodiment of this application;

[0025] Figure 7 yes Figure 6 Enlarged schematic diagram of part B in the middle;

[0026] Figure 8 This is a cross-sectional view of the connecting pipe of a GPU heat dissipation liquid cooler according to an embodiment of this application;

[0027] Figure 9 yes Figure 8 An enlarged schematic diagram of section C.

[0028] Explanation of reference numerals in the attached drawings: 1. Shell; 2. Top wall; 3. Bottom wall; 4. Side wall; 5. Receiving cavity; 6. Liquid inlet; 7. Liquid outlet; 8. First region; 9. Second region; 10. Partition; 11. Enclosing plate; 12. Cooling plate; 13. Cooling channel; 14. Vacuum cavity; 15. Support column; 16. Connecting pipe; 17. First driving component; 171. Central frame; 172. First driving rod; 173. Driving crossbar;

[0029] 18. Second drive component; 181. Second drive rod; 182. Rewinding rod; 183. Connecting rope; 184. Drive spring;

[0030] 19. Sealing cloth; 20. Countersunk groove; 21. Fixing rod; 22. Fixing spring; 23. Fixing groove; 24. Connecting hole. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1 -Appendix Figure 9 This application will be described in further detail.

[0032] This application discloses a GPU heat dissipation liquid cooler. (Refer to...) Figures 1-4 The GPU heatsink includes a housing 1, which includes a top wall 2, a bottom wall 3, and a side wall 4. The top wall 2, bottom wall 3, and side wall 4 are closed to form a receiving cavity 5. The bottom wall 3 is pressed against the chip for heat conduction. The side wall 4 has an inlet hole 6 and an outlet hole 7, which are coaxially arranged. The receiving cavity 5 includes a first region 8 and a second region 9. The first region 8 is located above the second region 9. The inlet hole 6 and the outlet hole 7 are both connected to the first region 8. A partition 10 is provided between the first region 8 and the second region 9. Two side ends of the partition 10 are fixedly connected to the side wall 4, while the other two side ends are separated from the side wall 4, allowing the coolant to enter the first region 8 through the gap between the partition 10 and the side wall 4. A loop injection channel microstructure is provided in the second region 9. A enclosure plate 11 is provided on the partition 10. The top of the enclosure plate 11 is fixedly connected to the top wall 2. The enclosure plate 11 is U-shaped. The liquid inlet 6 communicates with the internal space of the enclosure plate 11. A connecting hole 24 is provided on the partition 10. The connecting hole 24 is located in the space of the enclosure plate 11.

[0033] When the GPU is working, the housing 1 is pressed onto the GPU. Coolant enters the space surrounded by the enclosure plate 11 through the inlet hole 6. The coolant then flows through the inlet hole 6 into the second region 9. The coolant in the second region 9 then carries away the heat of the GPU through the loop jet channel microstructure, thereby cooling the GPU. The loop jet channel microstructure is adapted to the metal wafer through semiconductor manufacturing process to construct a 3D short loop jet channel microstructure. Through a unit design method, the liquid cooling plate can accurately match the power distribution of the GPU, thereby achieving targeted cooling of the GPU and adapting to the uneven high power heat generation of the chip.

[0034] Reference Figure 4 and Figure 5 In this embodiment, the loop jet channel microstructure includes multiple cooling plates 12, which are spaced apart in the second region 9 and fixed to the bottom of the receiving cavity 5. The cooling plates 12 are located below the partition 10, and a cooling channel 13 is left between adjacent cooling plates 12. The two ends of the cooling plates 12 are fixedly mounted on the side wall 4. A vacuum cavity 14 is opened in the cooling plate 12. The vacuum cavity 14 is opened along the length of the cooling plate 12 and is elongated. After the coolant enters the second region 9, the coolant enters the gap between the cooling plates 12 and flows rapidly. The heat generated by the GPU is transferred to the bottom wall 3 of the liquid cooling plate. The heat is transferred to the cooling plate 12 through the bottom wall 3 of the liquid cooling plate. The coolant carrying the heat is discharged through the outlet hole 7.

[0035] Furthermore, based on the modes of heat transfer, there are typically heat conduction, heat convection, and heat radiation. Heat conduction requires direct contact with a medium. Molecules or atoms transfer energy through vibration and collision, making it the primary mode of heat transfer between two closely contacting solids. Heat convection occurs within fluids (liquids or gases), transferring heat through the macroscopic flow of the fluid. Heat radiation uses electromagnetic waves (primarily infrared radiation) to transfer heat, requiring no medium and occurring even in a vacuum. In the specific scenario of this application, the components are cooling plate 12, vacuum chamber 14, and cooling plate 12. Therefore, in this application, vacuum chamber 14 is a vacuum environment, without gas or liquid molecules as a medium, so heat conduction is completely absent. The two cooling plates 12 are separate and have no physical contact, thus blocking heat conduction between the solids. Heat convection, which requires a fluid, is also completely absent in a vacuum environment due to the absence of matter. Thermal radiation: becoming the main method. Thermal radiation is an electromagnetic wave that can propagate perfectly in a vacuum; therefore, a hotter cooling plate 12 will emit infrared radiation in all directions, some of which will pass through the vacuum gap and be absorbed by another cooler cooling plate 12, thereby achieving heat transfer.

[0036] Therefore, in this application, it can be understood that the heat transfer area has been increased. Compared with the shovel structure, the heat dissipation area is the same. The difference is that the flow rate of the above structure is doubled under the same flow rate. Similarly, the total flow rate is doubled under the same flow rate. Therefore, the flow rate is reduced, the pressure drop is reduced, and the flow rate remains unchanged, thereby improving the heat dissipation effect and efficiency of the GPU.

[0037] Reference Figure 4 and Figure 5 In this embodiment of the application, the width of the vacuum cavity 14 is 0.05mm-0.15mm, specifically, the width of the vacuum cavity 14 is 0.1mm.

[0038] Reference Figure 4 and Figure 5 In this embodiment, the cooling plate 12 is made of copper sheet as a base and formed by 3D printing, and the cooling plate 12 is made by 3D jetting metal powder printing.

[0039] Reference Figure 3 and Figure 4 In this embodiment of the application, a plurality of support columns 15 are provided on the partition plate 10. The support columns 15 are used to support the top wall 2 of the shell 1. Under the action of the support columns 15, the interior of the shell 1 is supported, thereby reducing the possibility of deformation of the shell 1 due to installation and improving the installation quality of the liquid cooling plate.

[0040] Reference Figure 6 and Figure 7 To further adapt to the heat dissipation range of GPUs and to different types of GPUs, and to reduce the manufacturing cost of liquid cooling plates, in this embodiment of the application, a connecting pipe 16 is provided on the partition 10 and located in the second region 9. The connecting pipe 16 is Z-shaped, with one end connected to the connecting hole 24 and the other end facing the loop spray channel microstructure. The connecting pipe 16 is rotatably mounted on the partition 10 and rotates about the axis of the connecting hole 24. A first driving member 17 is also included to drive the connecting pipe 16 to rotate. The middle part of the connecting pipe 16 is a telescopic structure, and a second driving member 18 is also included to adjust the length of the connecting pipe 16. For GPUs of different specifications, which have heat dissipation points at different locations, the angle and length of the connecting pipe 16 are adjusted by the first driving member 17 and the second driving member 18 so that the water outlet of the connecting pipe 16 is directly facing the heat dissipation point of the GPU, thereby further improving the heat dissipation effect on the GPU. In addition, for different types of GPUs, only the position of the connecting tube 16 needs to be adjusted, without changing the printing position and printing process of the cooling plate 12, thus reducing the investment cost of the liquid cooling plate.

[0041] Reference Figure 6 and Figure 7In this embodiment, the first driving component 17 includes a central frame 171 and a first driving rod 172 disposed within the connecting pipe 16. One end of the first driving rod 172 is fixedly disposed at the center of the central frame 171, and the other end passes through the top wall 2 of the housing 1 and is located outside the housing 1. The first driving component 17 also includes a driving crossbar 173, which passes through the first driving rod 172. The length direction of the driving crossbar 173 is perpendicular to the length direction of the first driving rod 172. When adjusting the position of the connecting pipe 16, the driving crossbar 173 is rotated, which drives the first driving rod 172 to rotate. The rotation of the first driving rod 172 drives the central frame 171 to rotate, and the rotation of the central frame 171 drives the connecting pipe 16 to rotate, thereby adjusting the position of the water outlet end of the connecting pipe 16. The operation is simple and convenient.

[0042] Reference Figure 8 and Figure 9 In this embodiment, the second driving member 18 includes a second driving rod 181, which is coaxially arranged with and rotatably disposed within the first driving rod 172. One end of the second driving rod 181 passes through the first driving rod 172, and the other end is located within the vertical tube of the connecting pipe 16. The second driving member 18 also includes a winding rod 182, a connecting rope 183, and a driving spring 184. The winding rod 182 is disposed on the second driving rod 181 and is used to drive the second driving rod 181 to rotate. The winding rod 182 is located above the driving crossbar 173. The connecting rope 183 is wound onto the second driving rod 181. The free end of 183 is fixedly installed on the inner wall of the other vertical tube of the connecting tube 16. The two ends of the drive spring 184 are respectively fixedly installed on the inner wall of the vertical tube of the connecting tube 16. The drive spring 184 is used to drive the connecting tube 16 to have an elongation tendency. When adjusting the length of the connecting tube 16, rotate the winding rod 182. The winding rod 182 rotates to wind the connecting rope 183. The winding of the connecting rope 183 drives the connecting tube 16 to retract. When it is necessary to extend the length of the winding tube, rotate the winding rod 182. The winding rod 182 unwinds the connecting rope 183. At this time, under the action of the drive spring 184, the connecting tube 16 is pushed to slide and extend. The operation is simple and convenient.

[0043] Reference Figure 8 and Figure 9 In this embodiment of the application, in order to improve the sealing performance of the connecting pipe 16 and facilitate the delivery of coolant, a sealing cloth 19 is provided in the inner cavity of the connecting pipe 16. The sealing cloth 19 is cylindrical, and both ends of the sealing cloth 19 are respectively sealed in the telescopic section of the connecting pipe 16 and used to deliver coolant. Under the action of the sealing cloth 19, the inner cavity of the telescopic section of the connecting pipe 16 is sealed, which facilitates the delivery of coolant.

[0044] Reference Figure 7 and Figure 9After the angle and length of the connecting pipe 16 are adjusted, in order to facilitate fixing the angle and length of the connecting pipe 16, in this embodiment of the application, a countersunk groove 20 is provided on the top wall 2 of the housing 1. The ends of the first drive rod 172 and the second drive rod 181 are both located in the countersunk groove 20, and the drive crossbar 173 and the second drive rod 181 are both located in the countersunk groove 20. The countersunk groove 20 is a stepped groove with two steps. The first drive rod 172 and the second drive rod 181 are both supported on the bottom wall 3 of the countersunk groove 20. A fixing member is also included to fix the drive crossbar 173 and... The take-up rod 182 is inserted into the countersunk groove 20. The fixing member includes a fixing rod 21 and a fixing spring 22. The fixing rod 21 is slidably disposed at the ends of the drive crossbar 173 and the take-up rod 182. The sliding direction of the fixing rod 21 is parallel to the length direction of the drive crossbar 173 and the take-up rod 182. The fixing spring 22 is disposed in the drive crossbar 173 and the take-up rod 182 and is used to drive the fixing rod 21 to slide out from the ends of the drive crossbar 173 and the take-up rod 182. Furthermore, the fixing member also includes a fixing groove 23 disposed on the side wall 4 of the countersunk groove 20. The fixing rod 21 is slidably engaged in the fixing groove 23.

[0045] After the angle and length of the connecting tube 16 are adjusted, the positions of the drive crossbar 173 and the winding rod 182 are adjusted. At this time, the drive spring 184 drives the fixing rod 21 to slide out from the ends of the drive crossbar 173 and the winding rod 182 and engage with the fixing groove 23, thereby fixing the drive crossbar 173 and the winding rod 182, and fixing the angle and length of the connecting tube 16. The operation is simple and convenient.

[0046] The implementation principle of a GPU heat dissipation liquid cooling plate in this application embodiment is as follows:

[0047] When matching the liquid cooling plate with the GPU, first adjust the angle and length of the connecting tube 16 according to the location of the GPU's heat source. At this time, rotate the first drive rod 172 and the second drive rod 181 to rotate the connecting tube 16 and the winding rod 182. The winding rod 182 rotates to wind or unwind the connecting rope 183. Adjust the position of the water outlet of the connecting tube 16 so that the water outlet of the connecting tube 16 is directly facing the heat source of the GPU. Then, pressurized coolant is injected into the first area 8 through the inlet hole 6. The coolant is injected into the second area 9 through the connecting tube 16. The coolant enters the cooling channel 13 of the cooling plate 12, and carries away the heat generated by the GPU and is discharged through the outlet.

[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A GPU liquid cooling plate, characterized in that: The application relates to a shell (1) which comprises a top wall (2), a bottom wall (3) and a side wall (4), the top wall (2), the bottom wall (3) and the side wall (4) being combined to form a containing cavity (5), the bottom wall (3) being in contact with a chip for heat conduction, liquid inlet holes (6) and liquid outlet holes (7) being arranged on the side wall (4), the liquid inlet holes (6) and the liquid outlet holes (7) being coaxially arranged, the containing cavity (5) comprising a first area (8) and a second area (9), the first area (8) being arranged above the second area (9), the liquid inlet holes (6) and the liquid outlet holes (7) being in communication with the first area (8), a partition plate (10) being arranged between the first area (8) and the second area (9), two lateral end faces of the partition plate (10) being fixedly connected with the side wall (4), and the other two lateral end faces being separated from the side wall (4) so that cooling liquid enters the first area (8) through the gap between the partition plate (10) and the side wall (4), a loop jet channel microstructure being arranged in the second area (9), a surrounding plate (11) being arranged on the partition plate (10), the top of the surrounding plate (11) being fixedly connected with the top wall (2), the surrounding plate (11) being in a U shape, the liquid inlet holes (6) being in communication with the internal space of the surrounding plate (11), and a communication hole (24) being arranged on the partition plate (10) and located in the space of the surrounding plate (11). A connecting pipe (16) is arranged on the partition plate (10) and located in the second area (9), the connecting pipe (16) is in a Z shape, one end of the connecting pipe (16) is in communication with the communication hole (24), and the other end of the connecting pipe (16) faces the loop jet channel microstructure, the connecting pipe (16) is rotationally arranged on the partition plate (10), the connecting pipe (16) rotates around the axis line of the communication hole (24) as the rotation axis line, a first driving element (17) is arranged for driving the rotation of the connecting pipe (16), the middle part of the connecting pipe (16) is a telescopic structure, and a second driving element (18) is arranged for adjusting the length of the connecting pipe (16).

2. The GPU liquid cooling plate of claim 1, wherein: The loop jet channel microstructure comprises a plurality of cooling plates (12), the plurality of cooling plates (12) are arranged in the second area (9) and fixedly arranged on the bottom of the containing cavity (5), the cooling plates (12) are located below the partition plate (10), cooling channels (13) are left between adjacent cooling plates (12), the two ends of the cooling plates (12) are fixedly arranged on the side wall (4), and vacuum cavities (14) are arranged in the cooling plates (12), the vacuum cavities (14) are arranged along the length direction of the cooling plates (12) and are in a strip shape.

3. The GPU liquid cooling plate of claim 2, wherein: The width of the vacuum cavity (14) is 0.05mm-0.15mm.

4. The GPU liquid cooling plate of claim 2, wherein: The cooling plates (12) are formed by taking copper sheets as the base and adopting 3D printing.

5. The GPU liquid cold plate of claim 1, wherein: A plurality of supporting columns (15) are arranged on the partition plate (10), and the supporting columns (15) are used for supporting the top wall (2) of the shell (1).

6. The GPU liquid cold plate of claim 1, wherein: The first driving member (17) comprises a center frame (171) arranged in the connecting pipe (16) and a first driving rod (172), one end of the first driving rod (172) is fixedly arranged at the center of the center frame (171), the other end of the first driving rod (172) penetrates the top wall (2) of the shell (1) and is located outside the shell (1), the first driving member (17) further comprises a driving cross rod (173), the driving cross rod (173) penetrates the first driving rod (172).

7. The GPU liquid cold plate of claim 6, wherein: The second driving member (18) comprises a second driving rod (181), the second driving rod (181) is coaxially arranged with the first driving rod (172) and is rotationally arranged in the first driving rod (172), one end of the second driving rod (181) penetrates the first driving rod (172), the other end of the second driving rod (181) is located in the vertical pipe of the connecting pipe (16), the second driving member (18) further comprises a winding rod (182), a connecting rope (183) and a driving spring (184), the winding rod (182) is arranged on the second driving rod (181) and is used for driving the second driving rod (181) to rotate, the winding rod (182) is located above the driving cross rod (173), the connecting rope (183) is wound on the second driving rod (181), the free end of the connecting rope (183) is fixedly arranged on the inner wall of the other vertical pipe of the connecting pipe (16), the driving spring (184) is fixedly arranged on the inner wall of the vertical pipe of the connecting pipe (16) at two ends respectively, and the driving spring (184) is used for driving the connecting pipe (16) to have an elongation trend.

8. The GPU liquid cold plate of claim 1, wherein: The inner cavity of the connecting pipe (16) is provided with a sealing cloth (19), the sealing cloth (19) is in a cylindrical shape, and the two ends of the sealing cloth (19) are sealingly arranged in the telescopic section of the connecting pipe (16) and are used for conveying cooling liquid.

9. The GPU liquid cold plate of claim 6, wherein: The top wall (2) of the shell (1) is provided with a countersunk groove (20), the ends of the first driving rod (172) and the second driving rod (181) are located in the countersunk groove (20), the driving cross rod (173) and the second driving rod (181) are located in the countersunk groove (20), the countersunk groove (20) is a stepped groove, the first driving rod (172) and the second driving rod (181) are received on the bottom wall (3) of the countersunk groove (20), and the fixed member is further arranged, the fixed member is used for fixing the driving cross rod (173) and the winding rod (182) in the countersunk groove (20).

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